HD74HC73 Dual J-K Flip-Flops (with Clear) Description The flip-flop is edge sensitive to the clock input and change state on the negative going transition of the clock pulse. Each flip-flop has independent, J, K, clock, and clear inputs and Q and Q outputs. Clear is independent of the clock and accomplished by a low level on the input. Features • • • • • High Speed Operation: tpd (Clock to Q) = 18 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 2 µA max (Ta = 25°C) Function Table Inputs Outputs Clear Clock J K Q Q L X X X L H H L L No change H L H L H H H L H L H H H Toggle H L X X No change H H X X No change X X No change H HD74HC73 Pin Arrangement 14 1J 1CK 1 CLR 1CLR 2 1K 3 J Q 13 1Q CK K Q 12 1Q 11 GND VCC 4 2CK 5 K 2CLR 6 J Q 10 2K Q 9 2Q CK CLR 2J 7 8 2Q (Top view) Block Diagram Q CLR J CK CK Q K CK CK CK CK CK 2 CK CK CK CK HD74HC73 DC Characteristics Ta = –40 to +85°C Ta = 25°C Item Symbol VCC (V) Min Typ Max Min Max Unit Input voltage VIH 2.0 1.5 — — 1.5 — V 4.5 3.15 — — 3.15 — 6.0 4.2 — — 4.2 — 2.0 — — 0.5 — 0.5 4.5 — — 1.35 — 1.35 6.0 — — 1.8 — 1.8 2.0 1.9 2.0 — 1.9 — 4.5 4.4 4.5 — 4.4 — 6.0 5.9 6.0 — 5.9 — 4.5 4.18 — — 4.13 — I OH = –4 mA 6.0 5.68 — — 5.63 — I OH = –5.2 mA 2.0 — 0.0 0.1 — 0.1 4.5 — 0.0 0.1 — 0.1 6.0 — 0.0 0.1 — 0.1 4.5 — — 0.26 — 0.33 I OL = 4 mA 6.0 — — 0.26 — 0.33 I OL = 5.2 mA VIL Output voltage VOH VOL Test Conditions V V V Vin = VIH or VIL I OH = –20 µA Vin = VIH or VIL I OL = 20 µA Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND Quiescent supply current I CC 6.0 — — 2.0 20 µA Vin = VCC or GND, Iout = 0 µA — 3 HD74HC73 AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = –40 to +85°C Ta = 25°C Item Symbol VCC (V) Min Typ Max Min Max Unit Maximum clock f max 2.0 — — 6 — 5 MHz 4.5 — — 30 — 24 6.0 — — 35 — 28 Propagation delay t PLH 2.0 — — 150 — 190 time 4.5 — 18 30 — 38 6.0 — — 26 — 33 2.0 — — 140 — 175 4.5 — 18 28 — 35 6.0 — — 24 — 30 2.0 80 — — 100 — 4.5 16 8 — 20 — 6.0 14 — — 17 — 2.0 100 — — 125 — 4.5 20 3 — 25 — 6.0 17 — — 21 — 2.0 5 — — 5 — 4.5 5 –2 — 5 — 6.0 5 — — 5 — 2.0 100 — — 125 — 4.5 20 –3 — 25 — 6.0 17 — — 21 — frequency Pulse width Setup time Hold time Removal time t PHL tw t su th t rem Output rise/fall t TLH 2.0 — — 75 — 95 time t THL 4.5 — 5 15 — 19 6.0 — — 13 — 16 — — 5 10 — 10 Input capacitance 4 Cin ns Test Conditions Clock to Q or Q Clear to Q or Q ns Clock, Clear ns Data to clock ns Clock to data ns Clear to clock ns pF Unit: mm 19.20 20.32 Max 8 6.30 7.40 Max 14 1.30 7 2.54 ± 0.25 0.48 ± 0.10 0.51 Min 2.39 Max 2.54 Min 5.06 Max 1 7.62 + 0.10 0.25 – 0.05 0° – 15° Hitachi Code JEDEC EIAJ Weight (reference value) DP-14 Conforms Conforms 0.97 g Unit: mm 10.06 10.5 Max 8 5.5 14 1 0.10 ± 0.10 1.42 Max 1.27 *0.42 ± 0.08 0.40 ± 0.06 *0.22 ± 0.05 0.20 ± 0.04 2.20 Max 7 + 0.20 7.80 – 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) FP-14DA — Conforms 0.23 g Unit: mm 8.65 9.05 Max 8 1 7 *0.20 ± 0.05 0.635 Max 1.75 Max 3.95 14 + 0.10 6.10 – 0.30 1.08 *0.40 ± 0.06 0.11 0.14 +– 0.04 0° – 8° 1.27 0.67 0.60 +– 0.20 0.15 0.25 M *Pd plating Hitachi Code JEDEC EIAJ Weight (reference value) FP-14DN Conforms Conforms 0.13 g Unit: mm 4.40 5.00 5.30 Max 14 8 1 7 0.65 0.20 ± 0.06 1.0 0.13 M 6.40 ± 0.20 0.10 *Dimension including the plating thickness Base material dimension *0.17 ± 0.05 0.15 ± 0.04 1.10 Max 0.83 Max 0.07 +0.03 –0.04 *0.22+0.08 –0.07 0° – 8° 0.50 ± 0.10 Hitachi Code JEDEC EIAJ Weight (reference value) TTP-14D — — 0.05 g Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. 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