® OPA445 OPA 445 OPA 445 For most current data sheet and other product information, visit www.burr-brown.com High Voltage FET-Input OPERATIONAL AMPLIFIER FEATURES APPLICATIONS ● WIDE-POWER SUPPLY RANGE: ±10V to ±45V ● HIGH SLEW RATE: 15V/µs ● TEST EQUIPMENT ● HIGH-VOLTAGE REGULATORS ● POWER AMPLIFIERS ● DATA ACQUISITION ● LOW INPUT BIAS CURRENT: 10pA ● STANDARD-PINOUT TO-99, DIP, AND SURFACE-MOUNT PACKAGES ● SIGNAL CONDITIONING ● AUDIO ● PIEZO DRIVERS DESCRIPTION The OPA445 is a monolithic operational amplifier capable of operation from power supplies up to ±45V and output currents of 15mA. It is useful in a wide variety of applications requiring high output voltage or large common-mode voltage swings. The OPA445’s high slew rate provides wide powerbandwidth response, which is often required for highvoltage applications. FET input circuitry allows the use of high-impedance feedback networks, thus mini- mizing their output loading effects. Laser trimming of the input circuitry yields low input offset voltage and drift. The OPA445 is available in standard pin-out TO-99, DIP-8, and SO-8 surface-mount packages. It is fully specified from –25°C to +85°C and operates from –55°C to +125°C. A SPICE macromodel is available for design analysis. NC Offset Trim –In 8 7 V+ 1 2 +In 6 3 4 Output 5 Offset Trim V– Offset Trim 1 8 NC –In 2 7 V+ +In 3 6 Output V– 4 5 Offset Trim 8-Pin DIP, SO-8 Case is connected to V– TO-99 International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 Twx: 910-952-1111 • Internet: http://www.burr-brown.com/ • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 © SBOS156 1987 Burr-Brown Corporation PDS-754H Printed in U.S.A. March, 2000 SPECIFICATIONS At TA = +25°C, VS = ±40V, and RL = 5kΩ, unless otherwise specified. Boldface limits apply over the specified temperature range, TA = –25°C to +85°C. VS = ±40V. OPA445BM PARAMETER CONDITIONS OFFSET VOLTAGE Input Offset Voltage vs Temperature vs Power Supply VOS VOS /dT PSRR INPUT BIAS CURRENT(1) Input Bias Current IB Over Specified Temperature Range Input Offset Current IOS Over Specified Temperature Range NOISE Input Voltage Noise Density, f = 1kHz Current Noise Density, f = 1kHz MIN INPUT VOLTAGE RANGE Common-Mode Voltage Range VCM Common-Mode Rejection CMRR Over Specified Temperature Range ±1 ±3 4 ±10 VCM = 0V ±10 VCM = 0V ±4 MIN TYP MAX UNITS ±5 100 ±1.5 ✻ ✻ ✻ mV µV/°C µV/V ±50 ✻ ±20 ±5 ✻ ±100 ±20 ±40 ±10 pA nA pA nA ±10 ✻ ✻ 15 6 VS = ±40V VCM = –35V to +35V (V–)+5 80 80 INPUT IMPEDANCE Differential Common-Mode (V+)–5 95 ✻ ✻ ✻ 1013 || 1 1014 || 3 OPEN-LOOP GAIN, DC Open-Loop Voltage Gain AOL Over Specified Temperature Range FREQUENCY RESPONSE Gain Bandwidth Product Slew Rate Full Power Bandwidth Rise Time Overshoot Total Harmonic Distortion + Noise MAX VCM = 0, IO = 0 TA = –25°C to +85°C VS = ±10V to ±45V en in OPA445AP, AU TYP GBW SR THD+N OUTPUT Voltage Output VO Over Specified Temperature Range Current Output IO Output Resistance, Open Loop RO Short Circuit Current ISC Capacitive Load Drive CLOAD POWER SUPPLY Specified Operating Range Operating Voltage Range Quiescent Current TEMPERATURE RANGE Specification Range Operating Range Storage Range Thermal Resistance TO-99 8-Pin DIP SO-8 Surface-Mount VO = –35V to +35V 100 97 VO = 70Vp-p VO = 70Vp-p VO = ±200mV G = +1, ZL = 5kΩ || 50pF f = 1kHz, VO = 3.5Vr ms, G = 1 f = 1kHz, VO = 10Vr ms, G = 1 5 23 ✻ ✻ (V+)–5 (V+)–5 ±10 IO = 0 ±40 ±4.2 –25 –55 –65 ✻ ✻ V dB dB ✻ ✻ Ω || pF Ω || pF ✻ dB dB ✻ ✻ ✻ ✻ ✻ ✻ ✻ MHz V/µs kHz ns % % % ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ 220 ±26 See Typical Curve(2) VS IQ 2 15 70 100 35 0.0002 0.00008 (V–)+5 (V–)+5 ±15 VO = ±28V dc ✻ ✻ 110 nV/√Hz fA/√Hz ✻ ±45 ±4.7 ✻ +85 +125 +125 ✻ ✻ –55 ✻ θJA 200 100 150 V V mA Ω mA ✻ ✻ V V mA ✻ ✻ +125 °C °C °C °C/W °C/W °C/W ✻ Specifications same as OPA445BM. NOTE: (1) High-speed test at TJ = +25°C. (2) See “Small-Signal Overshoot vs Load Capacitance” in the Typical Performance Curves section. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. ® OPA445 2 ABSOLUTE MAXIMUM RATINGS(1) ELECTROSTATIC DISCHARGE SENSITIVITY Power Supply ..................................................................................... ±50V Differential Input Voltage ................................................................... ±80V Input Voltage Range ................................................................... |±VS| –3V Storage Temperature Range: M ..................................... –65°C to +150°C P, U ................................. –55°C to +125°C Operating Temperature Range ....................................... –55°C to +125°C Lead Temperature (soldering, 10s) ............................................... +300°C Output Short-Circuit to Ground (TJ < +125°C) ......................... Continuous Junction Temperature: M ................................................................. 175°C P,U .............................................................. 150°C This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. PACKAGE /ORDERING INFORMATION PRODUCT PACKAGE PACKAGE DRAWING NUMBER OPA445AP OPA445AU OPA445AU OPA445BM 8-Pin DIP SO-8 Surface-Mount " 8-Pin TO-99 006 182 " 001 SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER(1) TRANSPORT MEDIA –25°C to +85°C –25°C to +85°C " –25°C to +85°C OPA445AP OPA445AU " OPA445BM OPA445AP OPA445AU OPA445AU/2K5 OPA445BM Rails Rails Tape and Reel Rails NOTE: (1) Products followed by a slash (/) are only available in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “OPA445AU/2K5” will get a single 2500 piece Tape and Reel. ® 3 OPA445 TYPICAL PERFORMANCE CURVES At TA = +25°C, VS = ±40V, unless otherwise noted. OPEN-LOOP GAIN AND SUPPLY CURRENT vs SUPPLY VOLTAGE OPEN-LOOP GAIN AND PHASE vs FREQUENCY 125 140 –45 θ –90 60 40 –135 Gain –185 10 100 1k 10k 100k 1M AVOL 105 3.5 3.0 95 10 20 30 40 50 Frequency (Hz) Supply Voltage (±VS) GAIN BANDWIDTH AND SLEW RATE vs TEMPERATURE GAIN BANDWIDTH AND SLEW RATE vs SUPPLY VOLTAGE 16 19 2.2 15 13 2.0 GBW 12 1.8 Slew Rate (V/µs) 14 2.2 Gain Bandwidth (MHz) SR GBW 17 2.0 15 1.8 SR 11 1.6 10 1.4 –50 –25 0 25 50 75 100 13 1.6 125 10 20 30 40 Ambient Temperature (°C) Supply Voltage (±VS) INPUT BIAS CURRENT vs TEMPERATURE INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE 100nA 40 10nA 35 50 30 Bias Current (pA) 1nA 100pA 10pA 1pA 25 20 15 –IB +IB 10 0.1pA 5 0.01pA 0 –50 –25 0 25 50 75 100 –50 –40 –30 –20 –10 125 ® OPA445 0 10 20 Common-Mode Voltage (V) Temperature (°C) 4 30 40 50 Slew Rate (V/µs) 2.4 –75 4.0 IQ 110 10M 2.6 –75 115 100 0 Gain Bandwidth (MHz) Voltage Gain (dB) 80 Phase (Degrees) Voltage Gain (dB) 100 20 Input Bias Current 120 Supply Current (mA) 120 4.5 TYPICAL PERFORMANCE CURVES (Cont.) At TA = +25°C, VS = ±40V, unless otherwise noted. COMMON-MODE REJECTION vs FREQUENCY POWER SUPPLY REJECTION vs FREQUENCY 100 Common-Mode Rejection (dB) Power Supply Rejection (dB) 120 100 +PSRR 80 60 –PSRR 40 20 0 90 80 70 60 50 40 10 100 1k 10k 100k 1M 10M 10 100M 100 1k 10k 1M 100k 10M Frequency (Hz) Frequency (Hz) OPEN-LOOP GAIN vs TEMPERATURE POWER SUPPLY REJECTION AND COMMON-MODE REJECTION vs TEMPERATURE 130 120 PSRR, CMRR (dB) Voltage Gain (dB) 120 110 100 PSRR 110 100 CMRR 90 80 90 –75 –50 –25 0 25 50 75 100 70 –75 125 –25 0 25 50 75 100 Ambient Temperature (°C) INPUT VOLTAGE NOISE SPECTRAL DENSITY TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 125 0.1 100 0.01 THD+Noise (%) Voltage Noise (nV/ Hz) –50 Ambient Temperature (°C) 10 VO = 3.5Vrms G = 10 0.001 VO = 3.5Vrms VO = 10Vrms G=1 0.0001 VO = 10Vrms 1 0.00001 10 100 1k 10k 20 100k 100 1k 10k 20k Frequency (Hz) Frequency (Hz) ® 5 OPA445 TYPICAL PERFORMANCE CURVES (Cont.) At TA = +25°C, VS = ±40V, unless otherwise noted. OUTPUT VOLTAGE SWING vs TEMPERATURE (V+) (V+) –2 (V+) –1 Output Voltage Swing (V) (V+) –4 (V+) –6 Sourcing Current (V+) –8 (V+) –10 (V–) +10 (V–) +8 (V–) +6 Sinking Current (V–) +4 Positive Swing (V+) –2 (V+) –3 (V+) –4 (V–) +4 (V–) +3 Negative Swing (V–) +2 (V–) +1 (V–) +2 (V–) (V–) 0 ±5 ±10 ±15 ±20 ±25 ±30 –75 –50 –25 Output Current (mA) 0 25 50 75 100 125 Temperature (°C) SUPPLY CURRENT vs TEMPERATURE OUTPUT CURRENT vs TEMPERATURE 35 5 30 Output Current (mA) Supply Current (mA) Short-Circuit Current 4 3 25 20 15 Output Current 10 VO = ±35V 5 0 2 –75 –50 –25 0 25 50 75 100 –50 125 –25 0 25 75 50 100 125 Temperature (°C) Ambient Temperature (°C) MAXIMUM OUTPUT VOLTAGE SWING vs FREQUENCY MAXIMUM POWER DISSIPATION vs TEMPERATURE 0.8 90 Maximum output without slew-rate induced distortion. 80 70 No Heat Sink 0.7 Plastic DIP 0.6 Dissipation (W) Output Voltage (Vp-p) Output Voltage Swing (V) OUTPUT VOLTAGE SWING vs OUTPUT CURRENT (V+) 60 50 40 30 0.4 0.1 10 SO-8 0.3 0.2 20 TO-99 0.5 TJ (max) TO-99: 150°C DIP, SO: 125°C 0 0 1k 10k 100k –50 1M 0 25 50 Temperature (°C) Frequency (Hz) ® OPA445 –25 6 75 100 125 TYPICAL PERFORMANCE CURVES (Cont.) At TA = +25°C, VS = ±40V, unless otherwise noted. OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION OFFSET VOLTAGE PRODUCTION DISTRIBUTION 25 20 14 12 10 8 6 4 Typical production distribution of packaged units. 20 15 10 5 2 0 –5 –4.5 –4 –3.5 –3 –2.5 –2 –1.5 –1 –0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 0 Offset Voltage (mV) Offset Voltage Drift (µV/°C) SMALL-SIGNAL STEP RESPONSE G = 1, CL = 100pF LARGE-SIGNAL STEP RESPONSE G = 1, CL = 100pF 10V/div 50mV/div 2.5µs/div 500ns/div SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE 60 50 Overshoot (%) Percent of Amplifiers (%) 16 Percent of Amplifiers (%) Typical production distribution of packaged units. 18 40 G = –1 30 G = +1 20 G = –2 10 0 10pF G = 10 100pF 1nF 10nF Load Capacitance ® 7 OPA445 APPLICATION INFORMATION Figure 1 shows the OPA445 connected as a basic noninverting amplifier. The OPA445 can be used in virtually any op amp configuration. Use offset adjust pins only to null offset voltage of op amp—see text. V+ 7 2 Power supply terminals should be bypassed with 0.1µF capacitors, or greater, near the power supply pins. Be sure that the capacitors are appropriately rated for the power supply voltage used. 6 OPA445 1 3 5 10mV Typical Trim Range 4 (1) NOTE: (1) 10kΩ to 1MΩ Trim Potentiometer (100kΩ recommended). V– V+ 0.1µF G = 1+ R1 R2 R1 R2 FIGURE 2. Offset Voltage Trim. output transistor is equal to the product of the output current and the voltage across the conducting transistor, VS – VO. The Safe Operating Area (SOA curve, Figures 3, 4, and 5) shows the permissible range of voltage and current. The curves shown represent devices soldered to a circuit board with no heat sink. Increasing printed circuit trace area or the use of a heat sink (TO-99 package) can significantly reduce thermal resistance (θ), resulting in increased output current for a given output voltage (see “Heat Sink” text). VO OPA445 VIN ZL 0.1µF V– FIGURE 1. Offset Voltage Trim. The safe output current decreases as VS – VO increases. Output short-circuits are a very demanding case for SOA. A short-circuit to ground forces the full power supply voltage (V+ or V–) across the conducting transistor and produces a typical output current of 25mA. With ±40V power supplies, this creates an internal dissipation of 1W. This exceeds the maximum rating and is not recommended. If operation in this region is unavoidable, a heat sink is required. For further insight on SOA, consult Application Bulletin AB-039. POWER SUPPLIES The OPA445 may be operated from power supplies up to ±45V or a total of 90V with excellent performance. Most behavior remains unchanged throughout the full operating voltage range. Parameters which vary significantly with operating voltage are shown in the typical performance curves. Some applications do not require equal positive and negative output voltage swing. Power supply voltages do not need to be equal. The OPA445 can operate with as little as 20V between the supplies and with up to 90V between the supplies. For example, the positive supply could be set to 80V with the negative supply at –10V, or vice-versa. SAFE OPERATING AREA 100 OFFSET VOLTAGE TRIM The OPA445 provides offset voltage trim connections on pins 1 and 5. Offset voltage can be adjusted by connecting a potentiometer as shown in Figure 2. This adjustment should be used only to null the offset of the op amp, not to adjust system offset or offset produced by the signal source. Nulling system offset could degrade the offset voltage drift behavior of the op amp. While it is not possible to predict the exact change in drift, the effect is usually small. Output Current (mA) TA = 25°C 10 TA = 85°C TA = 120°C 1 TA + (|VS| – |VO|) IO θJA ≤ TJ (max) θJA = 100°C/W TJ (max) = 125°C 0.1 1 SAFE OPERATING AREA Stress on the output transistors is determined both by the output current and by the output voltage across the conducting output transistors, VS – VO. The power dissipated by the 5 10 20 |VS| – |VO| (V) FIGURE 3. 8-Pin DIP Safe Operating Area. ® OPA445 2 8 50 100 HEAT SINKING SAFE OPERATING AREA Power dissipated in the OPA445 will cause the junction temperature to rise. For reliable operation junction temperature should be limited to 125°C, maximum (150°C for TO-99 package). Some applications will require a heat sink to assure that the maximum operating junction temperature is not exceeded. In addition, the junction temperature should be kept as low as possible for increased reliability. Junction temperature can be determined according to the following equation: TJ = TA + PD θJA Output Current (mA) 100 TA = 25°C 10 TA = 85°C TA = 120°C 1 TA + (|VS| – |VO|) IO θJA ≤ TJ (max) θJA = 150°C/W TJ (max) = 125°C 0.1 1 2 5 10 20 50 Package thermal resistance, θJA, is affected by mounting techniques and environments. Poor air circulation and use of sockets can significantly increase thermal resistance. Best thermal performance is achieved by soldering the op amp into a circuit board with wide printed circuit traces to allow greater conduction through the op amp leads. Simple clip-on heat sinks (such as Thermalloy 2257) can reduce the thermal resistance of the TO-99 metal package by as much as 50°C/W. For additional information on determining heat sink requirements, consult Applications Bulletin AB-038. 100 |VS| – |VO| (V) FIGURE 4. SO-8 Safe Operating Area. SAFE OPERATING AREA Output Current (mA) 100 TA = 25°C 10 TA = 125°C CAPACITIVE LOADS The dynamic characteristics of the OPA445 have been optimized for commonly encountered gains, loads, and operating conditions. The combination of low closed-loop gain and capacitive load will decrease the phase margin and may lead to gain peaking or oscillations. Figure 6 shows a circuit which preserves phase margin with capacitive load. The circuit does not suffer a voltage drop due to load current, however, input impedance is reduced at high frequencies. Consult Application Bulletin AB-028 for details of analysis techniques and application circuits. TA = 85°C TA + (|VS| – |VO|) IO θJA ≤ TJ (max) θJA = 200°C/W (No Heat Sink*) TJ (max) = 150°C *Simple clip-on heatsinks can reduce θ by as much as 50°C/W. 1 0.1 1 2 5 10 20 50 100 |VS| – |VO| (V) FIGURE 5. TO-99 Safe Operating Area. POWER DISSIPATION Power dissipation depends on power supply, signal, and load conditions. For dc signals, power dissipation is equal to the product of the output current times the voltage across the conducting output transistor, PD = IL (VS – VO). Power dissipation can be minimized by using the lowest possible power supply voltage necessary to assure the required output voltage swing. R1 R2 2kΩ 2kΩ RC 20Ω G=1+ R2 R1 CC 0.22µF OPA445 VO VIN For resistive loads, the maximum power dissipation occurs at a dc output voltage of one-half the power supply voltage. Dissipation with ac signals is lower. Application Bulletin AB-039 explains how to calculate or measure dissipation with unusual loads or signals. RC = CC = The OPA445 can supply output currents of 15mA and larger. This would present no problem for a standard op amp operating from ±15V supplies. With high supply voltages, however, internal power dissipation of the op amp can be quite large. Operation from a single power supply (or unbalanced power supplies) can produce even larger power dissipation since a large voltage is impressed across the conducting output transistor. Applications with large power dissipation may require a heat sink. CL 5000pF R2 2CL X 1010 – (1 + R2 /R1) CL X 103 RC NOTE: Design equations and component values are approximate. User adjustment is required for optimum performance. FIGURE 6. Driving Large Capacitive Loads. ® 9 OPA445 INCREASING OUTPUT CURRENT In those applications where the 15mA of output current is not sufficient to drive the required load, output current can be increased by connecting two or more OPA445s in parallel as shown in Figure 7. Amplifier A1 is the “master” amplifier and may be configured in virtually an op amp circuit. Amplifier A2, the “slave”, is configured as a unity gain buffer. Alternatively, external output transistors can be used to boost output current. The circuit in Figure 8 is capable of supplying output currents up to 1A. R1 “MASTER” OPA445 RS(1) 10Ω OPA445 “SLAVE” RL NOTE: (1) RS resistors minimize the circulating current that will always flow between the two devices due to VOS errors. FIGURE 7. Parallel Amplifiers Increase Output Current Capability. R2 +45V TIP29C CF R4 0.2Ω R3(1) 100Ω VO OPA445 VIN R4 0.2Ω TIP30C –45V NOTE: (1) Provides current limit for OPA445 and allows the amplifier to drive the load when the output is between 0.7V and –0.7V. FIGURE 8. External Output Transistors Boost Output Current up to 1 Amp. ® OPA445 RS(1) 10Ω VIN INPUT PROTECTION The inputs of conventional FET-input op amps should be protected against destructive currents that can flow when input FET gate-to-substrate isolation diodes are forwardbiased. This can occur if the input voltage exceeds the power supplies or there is an input voltage with VS = 0V. Protection is easily accomplished with a resistor in series with the input. Care should be taken because the resistance in series with the input capacitance may affect stability. Many input signals are inherently current-limited, therefore, a limiting resistor may not be required. R1 R2 10 LOAD TYPICAL APPLICATIONS R1 100kΩ R2 10kΩ V1 +60V +40V 0.1µF 25kΩ OPA445 0-2mA R5 100Ω –40V DAC80-CBI-I OPA445 V2 R3 100kΩ VO = 0 to +50V at 10mA Protects DAC During Slewing R4 9.9kΩ 0.1µF Load IL IL = [(V2 – V1)/R5] (R2 /R1) = (V2 – V1)/1kΩ –12V Compliance Voltage Range = ±35V NOTE: R1 = R3 and R2 = R4 + R5 FIGURE 10. Programmable Voltage Source. FIGURE 9. Voltage-to-Current Converter. R1 1kΩ R3 10kΩ R2 9kΩ R4 10kΩ +45V +45V 160V OPA445 VIN ±4V OPA445 “SLAVE” Piezo(1) Crystal “MASTER” –45V –45V NOTE: (1) For transducers with large capacitance the stabilization technique described in Figure 6 may be necessary. Be certain that the “Master” amplifier is stable before stabilizing the “Slave” amplifier. FIGURE 11. Bridge Circuit Doubles Voltage for Piezo Crystals. ® 11 OPA445 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 2000, Texas Instruments Incorporated