12-Bit, 170 MSPS/210 MSPS/250 MSPS, 1.8 V Analog-to-Digital Converter AD9634 FEATURES FUNCTIONAL BLOCK DIAGRAM AVDD VIN+ PIPELINE 12-BIT ADC VIN– VCM AGND DRVDD 12 D0±/D1± PARALLEL DDR LVDS AND DRIVERS AD9634 REFERENCE . . . D10±/D11± DCO± OR± 1-TO-8 CLOCK DIVIDER SERIAL PORT SCLK SDIO CSB CLK+ CLK– 09996-001 SNR = 69.7 dBFS at 185 MHz AIN and 250 MSPS SFDR = 87 dBc at 185 MHz AIN and 250 MSPS −150.6 dBFS/Hz input noise at 185 MHz, −1 dBFS AIN and 250 MSPS Total power consumption: 360 mW at 250 MSPS 1.8 V supply voltages LVDS (ANSI-644 levels) outputs Integer 1-to-8 input clock divider (625 MHz maximum input) Sample rates of up to 250 MSPS IF sampling frequencies of up to 350 MHz Internal ADC voltage reference Flexible analog input range 1.4 V p-p to 2.0 V p-p (1.75 V p-p nominal) ADC clock duty cycle stabilizer Serial port control Energy-saving power-down modes User-configurable, built-in self test (BIST) capability Figure 1. APPLICATIONS Communications Diversity radio systems Multimode digital receivers (3G) TD-SCDMA, WiMAX, W-CDMA, CDMA2000, GSM, EDGE, LTE I/Q demodulation systems Smart antenna systems General-purpose software radios Ultrasound equipment Broadband data applications GENERAL DESCRIPTION The AD9634 is a 12-bit, analog-to-digital converter (ADC) with sampling speeds of up to 250 MSPS. The AD9634 is designed to support communications applications where low cost, small size, wide bandwidth, and versatility are desired. The ADC core features a multistage, differential pipelined architecture with integrated output error correction logic. The ADC features wide bandwidth inputs that can support a variety of user-selectable input ranges. An integrated voltage reference eases design considerations. A duty cycle stabilizer (DCS) is provided to compensate for variations in the ADC clock duty cycle, allowing the converter to maintain excellent performance. The ADC output data are routed directly to the external 12-bit LVDS output port. Programming for setup and control is accomplished using a 3-wire, SPI-compatible serial interface. The AD9634 is available in a 32-lead LFCSP and is specified over the industrial temperature range of −40°C to +85°C. This product is protected by a U.S. patent. PRODUCT HIGHLIGHTS 1. Integrated 12-bit, 170 MSPS/210 MSPS/250 MSPS ADC. 2. Fast overrange and threshold detect. 3. Proprietary differential input maintains excellent SNR performance for input frequencies of up to 350 MHz. 4. 3-pin, 1.8 V SPI port for register programming and readback. 5. Pin compatibility with the AD9642, allowing a simple migration up to 14 bits, and with the AD6672. Flexible power-down options allow significant power savings, when desired. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved. AD9634 TABLE OF CONTENTS Features .............................................................................................. 1 ADC Architecture ...................................................................... 19 Applications....................................................................................... 1 Analog Input Considerations ................................................... 19 Functional Block Diagram .............................................................. 1 Voltage Reference ....................................................................... 21 General Description ......................................................................... 1 Clock Input Considerations...................................................... 21 Product Highlights ........................................................................... 1 Power Dissipation and Standby Mode .................................... 23 Revision History ............................................................................... 2 Digital Outputs ........................................................................... 23 Specifications..................................................................................... 3 ADC Overrange (OR)................................................................ 23 ADC DC Specifications................................................................. 3 Serial Port Interface (SPI).............................................................. 24 ADC AC Specifications ................................................................. 4 Configuration Using the SPI..................................................... 24 Digital Specifications ................................................................... 6 Hardware Interface..................................................................... 24 Switching Specifications ................................................................ 7 SPI Accessible Features.............................................................. 25 Timing Specifications .................................................................. 8 Memory Map .................................................................................. 26 Absolute Maximum Ratings............................................................ 9 Reading the Memory Map Register Table............................... 26 Thermal Characteristics .............................................................. 9 Memory Map Register Table..................................................... 27 ESD Caution.................................................................................. 9 Applications Information .............................................................. 29 Pin Configuration and Function Descriptions........................... 10 Design Guidelines ...................................................................... 29 Typical Performance Characteristics ........................................... 12 Outline Dimensions ....................................................................... 30 Equivalent Circuits ......................................................................... 18 Ordering Guide .......................................................................... 30 Theory of Operation ...................................................................... 19 REVISION HISTORY 7/11—Revision 0: Initial Version Rev. 0 | Page 2 of 32 AD9634 SPECIFICATIONS ADC DC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.75 V p-p full scale input range, DCS enabled, unless otherwise noted. Table 1. Parameter RESOLUTION ACCURACY No Missing Codes Offset Error Gain Error Differential Nonlinearity (DNL) Integral Nonlinearity (INL) 1 TEMPERATURE DRIFT Offset Error Gain Error INPUT REFERRED NOISE VREF = 1.0 V ANALOG INPUT Input Span Input Capacitance 2 Input Resistance 3 Input Common-Mode Voltage POWER SUPPLIES Supply Voltage AVDD DRVDD Supply Current IAVDD1 IDRVDD1 POWER CONSUMPTION Sine Wave Input (DRVDD = 1.8 V) Standby Power 4 Power-Down Power Temperature Full Min 12 Full Full Full Full 25°C Full 25°C AD9634-170 Typ Max Min 12 Guaranteed ±11 +2/−11 ±0.4 ±0.22 ±0.4 ±0.2 AD9634-210 Typ Max Min 12 Guaranteed ±11 +1/−8 ±0.4 ±0.22 ±0.4 ±0.2 AD9634-250 Typ Max Guaranteed ±11 +3/−7 ±0.4 ±0.22 ±0.6 ±0.27 Unit Bits mV %FSR LSB LSB LSB LSB Full Full ±7 ±55 ±7 ±58 ±7 ±75 ppm/°C ppm/°C 25°C 0.531 0.391 0.407 LSB rms Full Full Full Full 1.75 2.5 20 0.9 1.75 2.5 20 0.9 1.75 2.5 20 0.9 V p-p pF kΩ V Full Full 1.7 1.7 1.8 1.8 1.9 1.9 Full Full 123 50 Full Full Full 311 50 5 1.8 1.8 1.9 1.9 134 54 129 56 340 333 50 5 1 1.7 1.7 Measured with a low input frequency, full-scale sine wave. Input capacitance refers to the effective capacitance between one differential input pin and its complement. 3 Input resistance refers to the effective resistance between one differential input pin and its complement. 4 Standby power is measured with a dc input and the CLK pin inactive (that is, set to AVDD or AGND). 2 Rev. 0 | Page 3 of 32 1.7 1.7 1.8 1.8 1.9 1.9 V V 139 60 136 64 145 68 mA mA 360 360 50 5 385 mW mW mW AD9634 ADC AC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.75 V p-p full-scale input range, unless otherwise noted. Table 2. Parameter 1 SIGNAL-TO-NOISE RATIO (SNR) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz SIGNAL-TO-NOISE AND DISTORTION (SINAD) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz EFFECTIVE NUMBER OF BITS (ENOB) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz WORST SECOND OR THIRD HARMONIC fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz SPURIOUS-FREE DYNAMIC RANGE (SFDR) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz WORST OTHER (HARMONIC OR SPUR) fIN = 30 MHz fIN = 90 MHz fIN = 140 MHz fIN = 185 MHz fIN = 220 MHz AD9634-170 Min Typ Max AD9634-210 Min Typ Max AD9634-250 Min Typ Max 70.3 70.1 70.2 70.1 70.1 70.0 69.9 69.5 70.0 69.6 69.9 69.7 69.2 69.2 69.3 69.4 69.2 69.2 69.1 69.2 69.0 68.9 68.5 69.1 68.7 69.0 68.7 68.3 68.3 68.4 dBFS dBFS dBFS dBFS dBFS dBFS dBFS 25°C 25°C 25°C 25°C 25°C 11.2 11.2 11.1 11.1 11.0 11.2 11.2 11.2 11.1 11.0 11.2 11.2 11.2 11.1 11.1 Bits Bits Bits Bits Bits 25°C 25°C Full 25°C 25°C Full 25°C −96 −95 −96 −92 −90 −89 dBc dBc dBc dBc dBc dBc dBc 25°C 25°C Full 25°C 25°C Full 25°C Temperature 25°C 25°C Full 25°C 25°C Full 25°C 25°C 25°C Full 25°C 25°C Full 25°C 25°C 25°C Full 25°C 25°C Full 25°C 69.1 dBFS dBFS dBFS dBFS dBFS dBFS dBFS 68.8 67.8 68.1 67.8 66.7 −83 −80 −97 −86 −94 −95 −91 −87 −84 −84 −93 96 95 96 92 90 89 97 86 94 95 91 87 84 84 93 −98 −97 −96 −95 −95 −95 −80 83 dBc dBc dBc dBc dBc dBc dBc 80 80 −87 −83 −98 −95 −97 −95 −96 −94 −96 −95 −94 −81 Rev. 0 | Page 4 of 32 Unit dBc dBc dBc dBc dBc dBc dBc AD9634 Parameter 1 TWO-TONE SFDR fIN = 184.1 MHz, 187.1 MHz (−7 dBFS) FULL POWER BANDWIDTH 2 NOISE BANDWIDTH 3 Temperature 25°C 25°C 25°C AD9634-170 Min Typ Max AD9634-210 Min Typ Max AD9634-250 Min Typ Max Unit 87 350 1000 89 350 1000 88 350 1000 dBc MHz MHz 1 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions. Full power bandwidth is the bandwidth of operation where typical ADC performance can be achieved. 3 Noise bandwidth is the −3 dB bandwidth for the ADC inputs across which noise may enter the ADC and is not attenuated internally. 2 Rev. 0 | Page 5 of 32 AD9634 DIGITAL SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, unless otherwise noted. Table 3. Parameter DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−) Logic Compliance Internal Common-Mode Bias Differential Input Voltage Input Voltage Range Input Common-Mode Range High Level Input Current Low Level Input Current Input Capacitance Input Resistance LOGIC INPUT (CSB) 1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUT (SCLK) 2 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUTS (SDIO)1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance DIGITAL OUTPUTS LVDS Data and OR Outputs (OR+, OR−) Differential Output Voltage (VOD), ANSI Mode Output Offset Voltage (VOS), ANSI Mode Differential Output Voltage (VOD), Reduced Swing Mode Output Offset Voltage (VOS), Reduced Swing Mode 1 2 Temperature Min Full Full Full Full Full Full Full Full CMOS/LVDS/LVPECL 0.9 0.3 3.6 AGND AVDD 0.9 1.4 10 22 −22 −10 4 12 15 18 Full Full Full Full Full Full 1.22 0 50 −5 Full Full Full Full Full Full 1.22 0 45 −5 Full Full Full Full Full Full 1.22 0 45 −5 Full Full Full Full 250 1.15 150 1.15 Pull-up. Pull-down. Rev. 0 | Page 6 of 32 Typ Max V V p-p V V μA μA pF kΩ 2.1 0.6 71 +5 V V μA μA kΩ pF 2.1 0.6 70 +5 V V μA μA kΩ pF 2.1 0.6 70 +5 V V μA μA kΩ pF 450 1.35 280 1.35 mV V mV V 26 2 26 2 26 5 350 1.25 200 1.25 Unit AD9634 SWITCHING SPECIFICATIONS Table 4. Parameter CLOCK INPUT PARAMETERS 1 Input Clock Rate Conversion Rate 2 DCS Enabled DCS Disabled CLK Period, Divide-by-1 Mode (tCLK) CLK Pulse Width High (tCH) Divide-by-1 Mode, DCS Enabled Divide-by-1 Mode, DCS Disabled Divide-by-2 Mode Through Divide-by-8 Mode Aperture Delay (tA) Aperture Uncertainty (Jitter, tJ) DATA OUTPUT PARAMETERS1 Data Propagation Delay (tPD) DCO Propagation Delay (tDCO) DCO to Data Skew (tSKEW) Pipeline Delay (Latency) Wake-Up Time (from Standby) Wake-Up Time (from Power-Down) Out-of-Range Recovery Time 1 2 AD9634-170 Min Typ Max Temperature Full AD9634-210 Min Typ Max 625 Full Full Full 40 10 5.8 Full Full Full 2.61 2.76 0.8 Full Full 2.9 2.9 625 170 170 40 10 4.8 3.19 3.05 2.16 2.28 0.8 2.4 2.4 1.0 0.1 Full Full Full Full Full Full Full 4.1 4.7 0.3 4.7 5.3 0.5 10 10 100 3 AD9634-250 Min Typ Max 210 210 40 10 4 2.64 2.52 1.8 1.9 0.8 1.0 0.1 5.2 5.8 0.7 4.1 4.7 0.3 4.7 5.3 0.5 10 10 100 3 2.0 2.0 625 MHz 250 250 MSPS MSPS ns 2.2 2.1 ns ns ns 1.0 0.1 5.2 5.8 0.7 4.1 4.7 0.3 4.7 5.3 0.5 10 10 100 3 Unit ns ps rms 5.2 5.8 0.7 ns ns ns Cycles μs μs Cycles See Figure 2. Conversion rate is the clock rate after the divider. Timing Diagram N–1 N+4 tA N+5 N N+3 VIN N+1 tCH N+2 tCLK CLK+ CLK– tDCO DCO– DCO+ tSKEW D0±/D1± (LSB) D0 N – 10 D1 N – 10 D0 N–9 D1 N–9 D0 N–8 D1 N–8 D0 N–7 D1 N–7 D0 N–6 D10±/D11± (MSB) D10 N – 10 D11 N – 10 D10 N–9 D11 N–9 D10 N–8 D11 N–8 D10 N–7 D11 N–7 D10 N–6 EVEN/ODD Figure 2. Even/Odd LVDS Mode Data Output Timing Rev. 0 | Page 7 of 32 09996-002 tPD AD9634 TIMING SPECIFICATIONS Table 5. Parameter SPI TIMING REQUIREMENTS tDS tDH tCLK tS tH tHIGH tLOW tEN_SDIO tDIS_SDIO Test Conditions/Comments See Figure 58 for the SPI timing diagram Setup time between the data and the rising edge of SCLK Hold time between the data and the rising edge of SCLK Period of the SCLK Setup time between CSB and SCLK Hold time between CSB and SCLK Minimum period that SCLK should be in a logic high state Minimum period that SCLK should be in a logic low state Time required for the SDIO pin to switch from an input to an output relative to the SCLK falling edge (not shown in Figure 58) Time required for the SDIO pin to switch from an output to an input relative to the SCLK rising edge (not shown in Figure 58) Rev. 0 | Page 8 of 32 Min Typ Max Unit 2 2 40 2 2 10 10 10 ns ns ns ns ns ns ns ns 10 ns AD9634 ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS Table 6. Parameter Electrical AVDD to AGND DRVDD to AGND VIN+, VIN− to AGND CLK+, CLK− to AGND VCM to AGND CSB to AGND SCLK to AGND SDIO to AGND D0±/D1± through D10±/D11± to AGND DCO+/DCO− to AGND OR+/OR− to AGND Environmental Operating Temperature Range (Ambient) Maximum Junction Temperature Under Bias Storage Temperature Range (Ambient) Rating −0.3 V to +2.0 V −0.3 V to +2.0 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2V −0.3 V to AVDD + 0.2 V −0.3 V to DRVDD + 0.3 V −0.3 V to DRVDD + 0.3 V −0.3 V to DRVDD + 0.3 V −0.3 V to DRVDD + 0.3 V −0.3 V to DRVDD + 0.3 V −0.3 V to DRVDD + 0.3 V −40°C to +85°C The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 7. Thermal Resistance Package Type 32-Lead LFCSP 5 mm × 5 mm (CP-32-12) Airflow Velocity (m/sec) 0 1.0 2.0 θJA1, 2 37.1 32.4 29.1 θJC1, 3 3.1 θJB1, 4 20.7 Unit °C/W °C/W °C/W 1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board. Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per MIL-Std 883, Method 1012.1. 4 Per JEDEC JESD51-8 (still air). 2 Typical θJA is specified for a 4-layer PCB with solid ground plane. As shown in Table 7, airflow increases heat dissipation, which reduces θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces the θJA. 150°C −65°C to +125°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION Rev. 0 | Page 9 of 32 AD9634 32 AVDD 31 AVDD 30 VIN+ 29 VIN– 28 AVDD 27 AVDD 26 VCM 25 DNC PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 2 3 4 5 6 7 8 AD9634 TOP VIEW (Not to Scale) 24 CSB 23 SCLK 22 SDIO 21 DCO+ 20 DCO– 19 D10+/D11+ (MSB) 18 D10–/D11– (MSB) 17 DRVDD NOTES 1. DNC = DO NOT CONNECT. DO NOT CONNECT TO THIS PIN. 2. THE EXPOSED THERMAL PADDLE ON THE BOTTOM OF THE PACKAGE PROVIDES THE ANALOG GROUND FOR THE PART. THIS EXPOSED PADDLE MUST BE CONNECTED TO GROUND FOR PROPER OPERATION. 09996-003 D2–/D3– D2+/D3+ D4–/D5– D4+/D5+ D6–/D7– D6+/D7+ D8–/D9– D8+/D9+ 9 10 11 12 13 14 15 16 CLK+ CLK– AVDD OR– OR+ D0–/D1– (LSB) D0+/D1+ (LSB) DRVDD Figure 3. Pin Configuration Table 8. Pin Function Descriptions Pin No. ADC Power Supplies 8, 17 3, 27, 28, 31, 32 0 Mnemonic Type Description DRVDD AVDD AGND, Exposed Paddle Supply Supply Ground Digital Output Driver Supply (1.8 V Nominal). Analog Power Supply (1.8 V Nominal). Analog Ground. The exposed thermal paddle on the bottom of the package provides the analog ground for the part. This exposed paddle must be connected to ground for proper operation. Do No Connect. Do not connect to this pin. 25 ADC Analog 30 29 26 DNC VIN+ VIN− VCM Input Input Output 1 2 Digital Outputs 5 4 7 6 10 9 12 11 14 13 16 15 19 18 21 20 CLK+ CLK− Input Input Differential Analog Input Pin (+). Differential Analog Input Pin (−). Common-Mode Level Bias Output for Analog Inputs. This pin should be decoupled to ground using a 0.1 μF capacitor. ADC Clock Input—True. ADC Clock Input—Complement. OR+ OR− D0+/D1+ (LSB) D0−/D1− (LSB) D2+/D3+ D2−/D3− D4+/D5+ D4−/D5− D6+/D7+ D6−/D7− D8+/D9+ D8−/D9− D10+/D11+ (MSB) D10−/ D11− (MSB) DCO+ DCO− Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Overrange—True. Overrange—Complement. DDR LVDS Output Data 0/Data 1—True (LSB). DDR LVDS Output Data 0/Data 1—Complement (LSB). DDR LVDS Output Data 2/Data 3—True. DDR LVDS Output Data 2/Data 3—Complement. DDR LVDS Output Data 4/Data 5—True. DDR LVDS Output Data 4/Data 5—Complement. DDR LVDS Output Data 6/Data 7—True. DDR LVDS Output Data 6/Data 7—Complement. DDR LVDS Output Data 8/Data 9—True. DDR LVDS Output Data 8/Data 9—Complement. DDR LVDS Output Data 10/Data 11—True (MSB). DDR LVDS Output Data 10/Data 11—Complement (MSB). LVDS Data Clock Output—True. LVDS Data Clock Output—Complement. Rev. 0 | Page 10 of 32 AD9634 Pin No. SPI Control 23 22 24 Mnemonic Type Description SCLK SDIO CSB Input Input/Output Input SPI Serial Clock. SPI Serial Data I/O. SPI Chip Select (Active Low). Rev. 0 | Page 11 of 32 AD9634 TYPICAL PERFORMANCE CHARACTERISTICS AVDD = 1.8 V, DRVDD = 1.8 V, sample rate = maximum sample rate per speed grade, DCS enabled, 1.75 V p-p differential input, VIN = −1.0 dBFS, 32k sample, TA = 25°C, unless otherwise noted. 0 0 –40 –60 SECOND HARMONIC THIRD HARMONIC –80 –100 –60 THIRD HARMONIC SECOND HARMONIC –80 –100 10 20 30 40 50 60 70 80 FREQUENCY (MHz) –140 0 50 60 70 80 SFDR (dBFS) 100 SNR/SFDR (dBc and dBFS) SECOND HARMONIC 40 120 –40 –60 30 Figure 7. AD9634-170 Single-Tone FFT with fIN = 305.1 MHz 170MSPS 185.1MHz @ –1.0dBFS SNR = 68.5dB (69.5dBFS) SFDR = 86dBc –20 20 FREQUENCY (MHz) Figure 4. AD9634-170 Single-Tone FFT with fIN = 90.1 MHz 0 10 09996-107 0 09996-004 –140 THIRD HARMONIC –80 –100 80 SNR (dBFS) 60 SFDR (dBc) 40 SNR (dBc) 0 10 20 30 40 50 60 70 80 FREQUENCY (MHz) 0 –100 09996-005 –140 –70 –60 –50 –40 –30 –20 –10 0 Figure 8. AD9634-170 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 90.1 MHz, fS = 170 MSPS 100 170MSPS 220.1MHz @ –1.0dBFS SNR = 68.2dB (69.2dBFS) SFDR = 84dBc 95 SFDR (dBc) SNR/SFDR (dBc and dBFS) –20 –80 INPUT AMPLITUDE (dBFS) Figure 5. AD9634-170 Single-Tone FFT with fIN = 185.1 MHz 0 –90 09996-007 20 –120 –40 –60 THIRD HARMONIC SECOND HARMONIC –80 –100 90 85 80 75 70 SNR (dBFS) –120 –140 0 10 20 30 40 50 60 70 80 FREQUENCY (MHz) 09996-006 65 60 60 90 120 150 180 210 240 270 300 330 INPUT FREQUENCY (MHz) Figure 9. AD9634-170 Single-Tone SNR/SFDR vs. Input Frequency (fIN), fS = 170 MSPS Figure 6. AD9634-170 Single-Tone FFT with fIN = 220.1 MHz Rev. 0 | Page 12 of 32 09996-008 AMPLITUDE (dBFS) –40 –120 –120 AMPLITUDE (dBFS) 170MSPS 305.1MHz @ –1.0dBFS SNR = 67.2dB (68.2dBFS) SFDR = 86dBc –20 AMPLITUDE (dBFS) AMPLITUDE (dBFS) 170MSPS 90.1MHz @ –1.0dBFS –20 SNR = 69.1dB (70.1dBFS) SFDR = 93dBc AD9634 0 0 –20 SFDR (dBc) AMPLITUDE (dBFS) SFDR/IMD3 (dBc and dBFS) 170MSPS 184.12MHz @ –7.0dBFS 187.12MHz @ –7.0dBFS SFDR = 85dBc (92dBFS) –20 –40 IMD3 (dBc) –60 –80 SFDR (dBFS) –100 –40 –60 –80 –100 –120 INPUT AMPLITUDE (dBFS) –140 09996-009 –120 –90.0 –81.7 –73.4 –65.1 –56.8 –48.5 –40.2 –31.9 –23.6 –15.3 –7.0 Figure 10. AD9634-170 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 89.12 MHz, fIN2 = 92.12 MHz, fS = 170 MSPS 0 10 20 30 40 50 60 70 80 FREQUENCY (MHz) 09996-012 IMD3 (dBFS) Figure 13. AD9634-170 Two Tone FFT with fIN1 = 184.12 MHz, fIN2 = 187.12 MHz 0 100 –20 95 SFDR (dBc) SNR/SFDR (dBFS and dBc) SFDR/IMD3 (dBc and dBFS) SFDR –40 IMD3 (dBc) –60 –80 SFDR (dBFS) 90 85 80 75 –100 SNR 70 09996-010 INPUT AMPLITUDE (dBFS) 65 40 60 70 80 90 100 110 120 130 140 150 160 170 SAMPLE RATE (MSPS) Figure 11. AD9634-170 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 184.12 MHz, fIN2 = 187.12 MHz, fS = 170 MSPS Figure 14. AD9634-170 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 90 MHz 0 170MSPS 89.12MHz @ –7.0dBFS –20 92.12MHz @ –7.0dBFS SFDR = 89dBc (96dBFS) 14000 –40 10000 0.531 LSB rms 16,384 TOTAL HITS 12000 NUMBER OF HITS –60 –80 –100 8000 6000 4000 –120 –140 0 10 20 30 40 50 FREQUENCY (MHz) 60 70 80 09996-011 2000 Figure 12. AD9634-170 Two-Tone FFT with fIN1 = 89.12 MHz, fIN2 = 92.12 MHz Rev. 0 | Page 13 of 32 0 N–1 N N+1 OUTPUT CODE Figure 15. AD9634-170 Grounded Input Histogram, fS = 170 MSPS 09996-014 AMPLITUDE (dBFS) 50 09996-013 IMD3 (dBFS) –120 –90.0 –81.7 –73.4 –65.1 –56.8 –48.5 –40.2 –31.9 –23.6 –15.3 –7.0 AD9634 0 0 –40 –60 SECOND HARMONIC –80 –40 THIRD HARMONIC –100 –60 THIRD HARMONIC –100 15 30 45 60 75 90 105 FREQUENCY (MHz) –140 09996-015 0 0 15 30 45 60 75 90 105 FREQUENCY (MHz) Figure 16. AD9634-210 Single-Tone FFT with fIN = 90.1 MHz Figure 19. AD9634-210 Single-Tone FFT with fIN = 305.1 MHz 0 120 210MSPS 185.1MHz @ –1.0dBFS SNR = 68.6dB (69.6dBFS) SFDR = 93dBc SFDR (dBFS) 100 SNR/SFDR (dBc and dBFS) –20 –40 –60 SECOND HARMONIC 09996-100 –120 –140 THIRD HARMONIC –80 –100 80 SNR (dBFS) 60 SFDR (dBc) 40 SNR (dBc) 0 15 30 45 60 75 90 105 FREQUENCY (MHz) –60 –50 –40 –30 –20 –10 0 SFDR (dBc) 95 SECOND HARMONIC –60 THIRD HARMONIC –80 –70 100 SNR/SFDR (dBc and dBFS) –40 –80 INPUT AMPLITUDE (dBFS) 210MSPS 220.1MHz @ –1.0dBFS SNR = 68.3dB (69.3dBFS) SFDR = 84dBc –20 –90 Figure 20. AD9634-210 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 90.1 MHz, fS = 210 MSPS Figure 17. AD9634-210 Single-Tone FFT with fIN = 185.1 MHz 0 0 –100 09996-016 –140 09996-018 20 –120 –100 –120 90 85 80 75 SNR (dBFS) 70 –140 0 15 30 45 60 75 90 105 FREQUENCY (MHz) 09996-017 65 60 60 90 120 150 180 210 240 270 300 330 INPUT FREQUENCY (MHz) Figure 21. AD9634-210 Single-Tone SNR/SFDR vs. Input Frequency (fIN), fS = 210 MSPS Figure 18. AD9634-210 Single-Tone FFT with fIN = 220.1 MHz Rev. 0 | Page 14 of 32 09996-019 AMPLITUDE (dBFS) SECOND HARMONIC –80 –120 AMPLITUDE (dBFS) 210MSPS 305.1MHz @ –1.0dBFS SNR = 67.6dB (68.6dBFS) SFDR = 83dBc –20 AMPLITUDE (dBFS) AMPLITUDE (dBFS) 210MSPS 90.1MHz @ –1.0dBFS –20 SNR = 69.1dB (70.1dBFS) SFDR = 92dBc AD9634 0 0 –20 –20 SFDR (dBc) AMPLITUDE (dBFS) SFDR/IMD3 (dBc and dBFS) 210MSPS 184.12MHz @ –7.0dBFS 187.12MHz @ –7.0dBFS SFDR = 89dBc (96dBFS) –40 IMD3 (dBc) –60 –80 SFDR (dBFS) –100 –40 –60 –80 –100 –120 INPUT AMPLITUDE (dBFS) –140 09996-020 –120 –90.0 –81.7 –73.4 –65.1 –56.8 –48.5 –40.2 –31.9 –23.6 –15.3 –7.0 Figure 22. AD9634-210 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 89.12 MHz, fIN2 = 92.12 MHz, fS = 210 MSPS 0 15 30 45 60 75 90 105 FREQUENCY (MHz) 09996-023 IMD3 (dBFS) Figure 25. AD9634-210 Two Tone FFT with fIN1 = 184.12 MHz, fIN2 = 187.12 MHz 0 100 –20 95 SFDR (dBc) SNR/SFDR (dBFS and dBc) SFDR/IMD3 (dBc and dBFS) SFDR –40 IMD3 (dBc) –60 –80 SFDR (dBFS) –100 90 85 80 75 SNR 70 09996-021 INPUT AMPLITUDE (dBFS) 65 Figure 23. AD9634-210 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 184.12 MHz, fIN2 = 187.12 MHz, fS = 210 MSPS 40 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 SAMPLE RATE (MSPS) Figure 26. AD9634-210 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 90 MHz 0 16000 210MSPS 89.12MHz @ –7.0dBFS –20 92.12MHz @ –7.0dBFS SFDR = 88dBc (95dBFS) 14000 0.391 LSB rms 16,384 TOTAL HITS 12000 –40 NUMBER OF HITS –60 –80 –100 10000 8000 6000 4000 –120 –140 0 15 30 45 60 FREQUENCY (MHz) 75 90 105 09996-022 2000 Figure 24. AD9634-210 Two-Tone FFT with fIN1 = 89.12 MHz, fIN2 = 92.12 MHz Rev. 0 | Page 15 of 32 0 N–1 N N+1 OUTPUT CODE Figure 27. AD9634-210 Grounded Input Histogram, fS = 210 MSPS 09996-025 AMPLITUDE (dBFS) 50 09996-024 IMD3 (dBFS) –120 –90.0 –81.7 –73.4 –65.1 –56.8 –48.5 –40.2 –31.9 –23.6 –15.3 –7.0 AD9634 0 0 –40 –60 SECOND HARMONIC THIRD HARMONIC –40 –80 –100 –60 SECOND HARMONIC –100 25 50 75 100 125 FREQUENCY (MHz) –140 09996-026 0 0 25 50 75 100 125 FREQUENCY (MHz) Figure 28. AD9634-250 Single-Tone FFT with fIN = 90.1 MHz Figure 31. AD9634-250 Single-Tone FFT with fIN = 305.1 MHz 0 120 250MSPS 185.1MHz @ –1.0dBFS SNR = 68.7dB (69.7dBFS) SFDR = 87dBc SFDR (dBFS) 100 SNR/SFDR (dBc and dBFS) –20 09996-101 –120 –140 –40 –60 THIRD HARMONIC SECOND HARMONIC –80 –100 80 SNR (dBFS) 60 SFDR (dBc) 40 SNR (dBc) 0 25 50 75 100 125 FREQUENCY (MHz) –60 –50 –40 –30 –20 –10 0 95 SFDR (dBc) SNR/SFDR (dBc and dBFS) SECOND HARMONIC –70 100 –40 –60 –80 INPUT AMPLITUDE (dBFS) 250MSPS 220.1MHz @ –1.0dBFS SNR = 68.3dB (69.3dBFS) SFDR = 91dBc –20 –90 Figure 32. AD9634-250 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 90.1 MHz, fS = 250 MSPS Figure 29. AD9634-250 Single-Tone FFT with fIN = 185.1 MHz 0 0 –100 09996-027 –140 09996-029 20 –120 THIRD HARMONIC –80 –100 90 85 80 75 70 SNR (dBFS) –120 –140 0 25 50 75 100 125 FREQUENCY (MHz) 09996-028 65 60 60 90 120 150 180 210 240 270 300 330 INPUT FREQUENCY (MHz) Figure 33. AD9634-250 Single-Tone SNR/SFDR vs. Input Frequency (fIN), fS = 250 MSPS Figure 30. AD9634-250 Single-Tone FFT with fIN = 220.1 MHz Rev. 0 | Page 16 of 32 09996-030 AMPLITUDE (dBFS) THIRD HARMONIC –80 –120 AMPLITUDE (dBFS) 250MSPS 305.1MHz @ –1.0dBFS SNR = 67.4dB (68.4dBFS) SFDR = 82dBc –20 AMPLITUDE (dBFS) AMPLITUDE (dBFS) 250MSPS 90.1MHz @ –1.0dBFS –20 SNR = 69.0dB (70.0dBFS) SFDR = 89dBc AD9634 0 0 –20 –20 SFDR (dBc) AMPLITUDE (dBFS) SFDR/IMD3 (dBc and dBFS) 250MSPS 184.12MHz @ –7.0dBFS 187.12MHz @ –7.0dBFS SFDR = 88dBc (95dBFS) –40 IMD3 (dBc) –60 –80 SFDR (dBFS) –100 –40 –60 –80 –100 –120 INPUT AMPLITUDE (dBFS) –140 09996-031 –120 –90.0 –81.7 –73.4 –65.1 –56.8 –48.5 –40.2 –31.9 –23.6 –15.3 –7.0 Figure 34. AD9634-250 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 89.12 MHz, fIN2 = 92.12 MHz, fS = 250 MSPS 0 25 50 75 100 125 FREQUENCY (MHz) 09996-034 IMD3 (dBFS) Figure 37. AD9634-250 Two Tone FFT with fIN1 = 184.12 MHz, fIN2 = 187.12 MHz 0 100 –20 95 SFDR (dBc) SNR/SFDR (dBFS and dBc) SFDR/IMD3 (dBc and dBFS) SFDR –40 IMD3 (dBc) –60 –80 SFDR (dBFS) 90 85 80 75 –100 SNR 70 09996-032 INPUT AMPLITUDE (dBFS) 65 40 16000 14000 120 140 160 180 200 220 240 260 0.407 LSB rms 16,384 TOTAL HITS 12000 –40 NUMBER OF HITS AMPLITUDE (dBFS) 100 Figure 38. AD9634-250 Single-Tone SNR/SFDR vs. Sample Rate (fS) with fIN = 90 MHz 250MSPS 89.12MHz @ –7.0dBFS 92.12MHz @ –7.0dBFS SFDR = 88dBc (95dBFS) –20 80 SAMPLE RATE (MSPS) Figure 35. AD9634-250 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 184.12 MHz, fIN2 = 187.12 MHz, fS = 250 MSPS 0 60 09996-035 IMD3 (dBFS) –120 –90.0 –81.7 –73.4 –65.1 –56.8 –48.5 –40.2 –31.9 –23.6 –15.3 –7.0 –60 –80 –100 10000 8000 6000 4000 –120 0 25 50 75 FREQUENCY (MHz) 100 125 Figure 36. AD9634-250 Two-Tone FFT with fIN1 = 89.12 MHz, fIN2 = 92.12 MHz Rev. 0 | Page 17 of 32 0 N–1 N N+1 OUTPUT CODE Figure 39. AD9634-250 Grounded Input Histogram, fS = 250 MSPS 09996-036 –140 09996-033 2000 AD9634 EQUIVALENT CIRCUITS DRVDD AVDD VIN 350Ω SDIO 09996-040 09996-037 26kΩ Figure 43. Equivalent SDIO Circuit Figure 40. Equivalent Analog Input Circuit AVDD AVDD AVDD 0.9V 26kΩ CLK– 09996-038 CLK+ 350Ω SCLK 15kΩ 09996-041 15kΩ Figure 44. Equivalent SCLK Input Circuit Figure 41. Equivalent Clock lnput Circuit DRVDD AVDD 26kΩ V+ DATAOUT– 350Ω DATAOUT+ V+ 09996-042 09996-039 V– CSB V– Figure 45. Equivalent CSB Input Circuit Figure 42. Equivalent LVDS Output Circuit Rev. 0 | Page 18 of 32 AD9634 THEORY OF OPERATION Programming and control of the AD9634 are accomplished using a 3-pin, SPI-compatible serial interface. ADC ARCHITECTURE The AD9634 architecture consists of a front-end sample-andhold circuit, followed by a pipelined, switched-capacitor ADC. The quantized outputs from each stage are combined into a final 12-bit result in the digital correction logic. The pipelined architecture permits the first stage to operate on a new input sample and the remaining stages to operate on the preceding samples. Sampling occurs on the rising edge of the clock. Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched-capacitor digitalto-analog converter (DAC) and an interstage residue amplifier (MDAC). The MDAC magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage simply consists of a flash ADC. The input stage contains a differential sampling circuit that can be ac- or dc-coupled in differential or single-ended modes. The output staging block aligns the data, corrects errors, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing digital output noise to be separated from the analog core. During power-down, the output buffers go into a high impedance state. ANALOG INPUT CONSIDERATIONS The analog input to the AD9634 is a differential switched-capacitor circuit that has been designed to attain optimum performance when processing a differential input signal. The clock signal alternatively switches the input between sample mode and hold mode (see the configuration shown in Figure 46). When the input is switched into sample mode, the signal source must be capable of charging the sampling capacitors and settling within ½ clock cycle. In intermediate frequency (IF) undersampling applications, reduce the shunt capacitors. In combination with the driving source impedance, the shunt capacitors limit the input bandwidth. Refer to the AN-742 Application Note, Frequency Domain Response of Switched-Capacitor ADCs; the AN-827 Application Note, A Resonant Approach to Interfacing Amplifiers to SwitchedCapacitor ADCs; and the Analog Dialogue article, “TransformerCoupled Front-End for Wideband A/D Converters” for more information on this subject. BIAS S S CFB CS VIN+ CPAR1 CPAR2 H S S CS VIN– CPAR1 CPAR2 S S CFB BIAS 09996-043 The AD9634 can sample any fS/2 frequency segment from dc to 250 MHz using appropriate low-pass or band-pass filtering at the ADC inputs with little loss in ADC performance. Figure 46. Switched-Capacitor Input For best dynamic performance, match the source impedances driving VIN+ and VIN− and differentially balance the inputs. Input Common Mode The analog inputs of the AD9634 are not internally dc biased. In ac-coupled applications, the user must provide this bias externally. Setting the device so that VCM = 0.5 × AVDD (or 0.9 V) is recommended for optimum performance. An on-board commonmode voltage reference is included in the design and is available from the VCM pin. Using the VCM output to set the input common mode is recommended. Optimum performance is achieved when the common-mode voltage of the analog input is set by the VCM pin voltage (typically 0.5 × AVDD). The VCM pin must be decoupled to ground by a 0.1 μF capacitor, as described in the Applications Information section. Place this decoupling capacitor close to the pin to minimize the series resistance and inductance between the part and this capacitor. A small resistor in series with each input can help reduce the peak transient current required from the output stage of the driving source. A shunt capacitor can be placed across the inputs to provide dynamic charging currents. This passive network creates a low-pass filter at the ADC input; therefore, the precise values are dependent on the application. Rev. 0 | Page 19 of 32 AD9634 Differential Input Configurations C2 Optimum performance can be achieved when driving the AD9634 in a differential input configuration. For baseband applications, the AD8138, ADA4937-1, and ADA4930-1 differential drivers provide excellent performance and a flexible interface to the ADC. R3 33Ω 15Ω VIN– 0.1µF ADA4930-1 33Ω 15Ω 0.1µF At input frequencies in the second Nyquist zone and above, the noise performance of most amplifiers is not adequate to achieve the true SNR performance of the AD9634. For applications where SNR is a key parameter, differential double balun coupling is the recommended input configuration (see Figure 49). In this configuration, the input is ac-coupled and the VCM voltage is provided to each input through a 33 Ω resistor. These resistors compensate for losses in the input baluns to provide a 50 Ω impedance to the driver. VCM 09996-044 15pF 200Ω VCM The signal characteristics must be considered when selecting a transformer. Most RF transformers saturate at frequencies below a few megahertz. Excessive signal power can also cause core saturation, which leads to distortion. AVDD VIN+ R3 VIN– Figure 48. Differential Transformer-Coupled Configuration ADC 120Ω ADC R2 C2 5pF 0.1µF C1 R1 15pF 90Ω 49.9Ω 0.1µF Figure 47. Differential Input Configuration Using the ADA4930-1 For baseband applications where SNR is a key parameter, differential transformer coupling is the recommended input configuration. An example is shown in Figure 48. To bias the analog input, connect the VCM voltage to the center tap of the secondary winding of the transformer. In the double balun and transformer configurations, the value of the input capacitors and resistors is dependent on the input frequency and source impedance. Based on these parameters the value of the input resistors and capacitors may need to be adjusted, or some components may need to be removed. Table 9 displays recommended values to set the RC network for different input frequency ranges. However, these values are dependent on the input signal and bandwidth and should be used only as a starting guide. Note that the values given in Table 9 are for the R1, R2, R3, C1, and C2 components shown in Figure 49. Table 9. Example RC Network R1 Series (Ω) 33 15 C1 Differential (pF) 8.2 3.9 R2 Series (Ω) 0 0 C2 Shunt (pF) 15 8.2 R3 Shunt (Ω) 49.9 49.9 C2 R3 R1 0.1µF 0.1µF 2V p-p R2 VIN+ 33Ω PA S S P 0.1µF 33Ω 0.1µF C1 R1 ADC R2 R3 C2 Figure 49. Differential Double Balun Input Configuration Rev. 0 | Page 20 of 32 VIN– VCM 0.1µF 09996-046 Frequency Range (MHz) 0 to 100 100 to 300 09996-045 2V p-p 200Ω 76.8Ω VIN+ R1 The output common-mode voltage of the ADA4930-1 is easily set with the VCM pin of the AD9634 (see Figure 47), and the driver can be configured in a Sallen-Key filter topology to provide band limiting of the input signal. VIN R2 AD9634 1000pF 180nH 220nH 1µH 165Ω VPOS AD8375 301Ω 5.1pF 1nF 1µH 3.9pF 165Ω 15pF VCM 1nF 2.5kΩ║2pF AD9634 68nH 180nH 220nH 09996-047 1000pF NOTES 1. ALL INDUCTORS ARE COILCRAFT 0603CS COMPONENTS WITH THE EXCEPTION OF THE 1µH CHOKE INDUCTORS (0603LS). 2. FILTER VALUES SHOWN ARE FOR A 20MHz BANDWIDTH FILTER CENTERED AT 140MHz. Figure 50. Differential Input Configuration Using the AD8375 VOLTAGE REFERENCE A stable and accurate voltage reference is built into the AD9634. The full-scale input range can be adjusted by varying the reference voltage via SPI. The input span of the ADC tracks reference voltage changes linearly. The RF balun configuration is recommended for clock frequencies between 125 MHz and 625 MHz, and the RF transformer is recommended for clock frequencies from 10 MHz to 200 MHz. The back-to-back Schottky diodes across the secondary windings of the transformer limit clock excursions into the AD9634 to approximately 0.8 V p-p differential. This limit helps prevent the large voltage swings of the clock from feeding through to other portions of the AD9634, while preserving the fast rise and fall times of the signal, which are critical for low jitter performance. 390pF CLOCK INPUT CLOCK INPUT CONSIDERATIONS For optimum performance, the AD9634 sample clock inputs, CLK+ and CLK−, should be clocked with a differential signal. The signal is typically ac-coupled into the CLK+ and CLK− pins by means of a transformer or a passive component configuration. These pins are biased internally (see Figure 51) and require no external bias. If the inputs are floated, the CLK− pin is pulled low to prevent spurious clocking. Mini-Circuits® ADT1-1WT, 1:1Z 390pF XFMR CLK+ 100Ω 50Ω 390pF CLK– SCHOTTKY DIODES: HSMS2822 Figure 52. Transformer Coupled Differential Clock (Up to 200 MHz) AVDD CLOCK INPUT 390pF 25Ω ADC 390pF CLK+ 0.9V 390pF 1nF CLK– 09996-057 CLK– SCHOTTKY DIODES: HSMS2822 25Ω 4pF 09996-048 Figure 53. Balun-Coupled Differential Clock (Up to 625 MHz) Figure 51. Equivalent Clock Input Circuit Clock Input Options The AD9634 has a very flexible clock input structure. Clock input can be a CMOS, LVDS, LVPECL, or sine wave signal. Regardless of the type of signal being used, clock source jitter is of the most concern, as described in the Jitter Considerations section. Figure 52 and Figure 53 show two preferable methods for clocking the AD9634 (at clock rates of up to 625 MHz). A low jitter clock source is converted from a single-ended signal to a differential signal using an RF balun or RF transformer. If a low jitter clock source is not available, another option is to ac couple a differential PECL signal to the sample clock input pins as shown in Figure 54. The AD9510, AD9511,AD9512, AD9513, AD9514, AD9515, AD9516, AD9517, AD9518, AD9520, AD9522, AD9523, AD9524, ADCLK905, ADCLK907, and ADCLK925 clock drivers offer excellent jitter performance. 0.1µF CLOCK INPUT CLOCK INPUT 0.1µF CLK+ AD95xx, ADCLKxxx 0.1µF PECL DRIVER 50kΩ 240Ω 100Ω ADC 0.1µF CLK– 50kΩ 240Ω Figure 54. Differential PECL Sample Clock (Up to 625 MHz) Rev. 0 | Page 21 of 32 09996-051 CLK+ 4pF ADC 09996-056 An alternative to using a transformer-coupled input at frequencies in the second Nyquist zone is to use an amplifier with variable gain. The AD8375 digital variable gain amplifier (DVGA) provides good performance for driving the AD9634. Figure 50 shows an example of the AD8375 driving the AD9634 through a band-pass antialiasing filter. AD9634 Jitter Considerations A third option is to ac couple a differential LVDS signal to the sample clock input pins, as shown in Figure 55. The AD9510, AD9511,AD9512, AD9513, AD9514, AD9515, AD9516, AD9517, AD9518, AD9520, AD9522, AD9523, AD9524 clock drivers offer excellent jitter performance. 0.1µF SNRHF = −10 log[(2π × fIN × tJRMS)2 + 10 ( −SNRLF /10) ] 0.1µF CLOCK INPUT CLK+ AD95xx 0.1µF LVDS DRIVER 100Ω ADC 0.1µF CLK– 50kΩ 09996-052 CLOCK INPUT High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR at a given input frequency (fIN) due to jitter (tJ) can be calculated by 50kΩ In the equation, the rms aperture jitter represents the rootmean-square of all jitter sources, which include the clock input, the analog input signal, and the ADC aperture jitter specification. IF undersampling applications are particularly sensitive to jitter, as shown in Figure 56. 80 Figure 55. Differential LVDS Sample Clock (Up to 625 MHz) 75 Input Clock Divider 70 SNR (dBFS) The AD9634 contains an input clock divider with the ability to divide the input clock by integer values between 1 and 8. For divide ratios other than 1, the DCS is enabled by default on power-up. 65 60 Typical high speed ADCs use both clock edges to generate a variety of internal timing signals and, as a result, may be sensitive to clock duty cycle. Commonly, a ±5% tolerance is required on the clock duty cycle to maintain dynamic performance characteristics. 0.05ps 0.2ps 0.5ps 1ps 1.5ps MEASURED 55 50 1 10 100 1000 INPUT FREQUENCY (MHz) The AD9634 contains a DCS that retimes the nonsampling (falling) edge, providing an internal clock signal with a nominal 50% duty cycle. This allows the user to provide a wide range of clock input duty cycles without affecting the performance of the AD9634. Jitter on the rising edge of the input clock is still of paramount concern and is not reduced by the duty cycle stabilizer. The duty cycle control loop does not function for clock rates less than 40 MHz nominally. The loop has a time constant associated with it that must be considered when the clock rate may change dynamically. A wait time of 1.5 μs to 5 μs is required after a dynamic clock frequency increase or decrease before the DCS loop is relocked to the input signal. During the time that the loop is not locked, the DCS loop is bypassed, and internal device timing is dependent on the duty cycle of the input clock signal. In such applications, it may be appropriate to disable the duty cycle stabilizer. In all other applications, enabling the DCS circuit is recommended to maximize ac performance. 09996-054 Clock Duty Cycle Figure 56. AD9634-250 SNR vs. Input Frequency and Jitter In cases where aperture jitter may affect the dynamic range of the AD9634, treat the clock input as an analog signal. In addition, use separate power supplies for the clock drivers and the ADC output driver to avoid modulating the clock signal with digital noise. Low jitter, crystal controlled oscillators provide the best clock sources. If the clock is generated from another type of source (by gating, dividing, or another method), it should be retimed by the original clock during the last step. Refer to AN-501 Application Note, Aperture Uncertainty and ADC System Performance, and AN-756 Application Note, Sampled Systems and the Effects of Clock Phase Noise and Jitter, for more information about jitter performance as it relates to ADCs. Rev. 0 | Page 22 of 32 AD9634 POWER DISSIPATION AND STANDBY MODE As shown in Figure 57, the power dissipated by the AD9634 is proportional to its sample rate. The data in Figure 57 was taken using the same operating conditions as those used for the Typical Performance Characteristics section. 0.25 0.4 0.20 DIGITAL OUTPUTS 0.15 0.2 IAVDD 0.10 0.1 SUPPLY CURRENT (A) TOTAL POWER (W) 0.3 TOTAL POWER The AD9634 output drivers can be configured for either ANSI LVDS or reduced swing LVDS using a 1.8 V DRVDD supply. As detailed in the AN-877 Application Note, Interfacing to High Speed ADCs via SPI, the data format can be selected for offset binary, twos complement, or gray code when using the SPI control. 0.05 IDRVDD 40 55 70 0 85 100 115 130 145 160 175 190 205 220 235 250 ENCODE FREQUENCY (MSPS) Digital Output Enable Function (OEB) 09996-053 0 When using the SPI port interface, the user can place the ADC in power-down mode or standby mode. Standby mode allows the user to keep the internal reference circuitry powered when faster wake-up times are required. To put the part into standby mode, set the internal power-down mode bits (Bits[1:0]) in the power modes register (Address 0x08) to 10. See the Memory Map section and AN-877 Application Note, Interfacing to High Speed ADCs via SPI for additional details. Figure 57. AD9634-250 Power and Current vs. Sample Rate By setting the internal power-down mode bits (Bits[1:0]) in the power modes register (Address 0x08) to 01, the AD9634 is placed in power-down mode. In this state, the ADC typically dissipates 5 mW. During power-down, the output drivers are placed in a high impedance state. Low power dissipation in power-down mode is achieved by shutting down the reference, reference buffer, biasing networks, and clock. Internal capacitors are discharged when entering powerdown mode and then must be recharged when returning to normal operation. As a result, wake-up time is related to the time spent in power-down mode, and shorter power-down cycles result in proportionally shorter wake-up times. The AD9634 has a flexible three-state ability for the digital output pins. The three-state mode is enabled using the SPI interface. The data outputs can be three-stated by using the output enable bar bit (Bit 4) in Register 0x14. This OEB function is not intended for rapid access to the data bus. Timing The AD9634 provides latched data with a pipeline delay of 10 input sample clock cycles. Data outputs are available one propagation delay (tPD) after the rising edge of the clock signal. Minimize the length of the output data lines as well as the loads placed on these lines to reduce transients within the AD9634. These transients may degrade converter dynamic performance. The lowest typical conversion rate of the AD9634 is 40 MSPS. At clock rates below 40 MSPS, dynamic performance can degrade. Data Clock Output (DCO) The AD9634 also provides the data clock output (DCO) intended for capturing the data in an external register. Figure 2 shows timing diagram of the AD9634 output modes. ADC OVERRANGE (OR) The ADC overrange indicator is asserted when an overrange is detected on the input of the ADC. The overrange condition is determined at the output of the ADC pipeline and, therefore, is subject to a latency of 10 ADC clock cycles. An overrange at the input is indicated by this bit 10 clock cycles after it occurs. Table 10. Output Data Format Input (V) VIN+ − VIN− VIN+ − VIN− VIN+ − VIN− VIN+ − VIN− VIN+ − VIN− VIN+ − VIN−, Input Span = 1.75 V p-p (V) < −0.875 = −0.875 =0 = +0.875 > +0.875 Offset Binary Output Mode 0000 0000 0000 0000 0000 0000 1000 0000 0000 1111 1111 1111 1111 1111 1111 Rev. 0 | Page 23 of 32 Twos Complement Mode (Default) 1000 0000 0000 1000 0000 0000 0000 0000 0000 0111 1111 1111 0111 1111 1111 OR 1 0 0 0 1 AD9634 SERIAL PORT INTERFACE (SPI) The AD9634 serial port interface (SPI) allows the user to configure the converter for specific functions or operations through a structured register space provided inside the ADC. The SPI offers added flexibility and customization, depending on the application. Addresses are accessed via the serial port and can be written to or read from via the port. Memory is organized into bytes that can be further divided into fields. These fields are documented in the Memory Map section. For detailed operational information, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. CONFIGURATION USING THE SPI Three pins define the SPI of this ADC: the SCLK pin, the SDIO pin, and the CSB pin (see Table 11). The SCLK (serial clock) pin is used to synchronize the read and write data presented from and to the ADC. The SDIO (serial data input/output) pin is a dual-purpose pin that allows data to be sent and read from the internal ADC memory map registers. The CSB (chip select bar) pin is an active-low control that enables or disables the read and write cycles. Table 11. Serial Port Interface Pins Pin SCLK SDIO CSB Function Serial clock. The serial shift clock input, which is used to synchronize serial interface reads and writes. Serial data input/output. A dual-purpose pin that typically serves as an input or an output, depending on the instruction being sent and the relative position in the timing frame. Chip select bar. An active-low control that gates the read and write cycles. The falling edge of CSB, in conjunction with the rising edge of SCLK, determines the start of the framing. An example of the serial timing and its definitions can be found in Figure 58 and Table 5. Other modes involving the CSB are available. The CSB can be held low indefinitely, which permanently enables the device; this is called streaming. The CSB can stall high between bytes to allow for additional external timing. When CSB is tied high, SPI functions are placed in a high impedance mode. This mode turns on any SPI pin secondary functions. All data is composed of 8-bit words. The first bit of each individual byte of serial data indicates whether a read or write command is issued. This allows the serial data input/output (SDIO) pin to change direction from an input to an output. In addition to word length, the instruction phase determines whether the serial frame is a read or write operation, allowing the serial port to be used both to program the chip and to read the contents of the on-chip memory. If the instruction is a readback operation, performing a readback causes the serial data input/ output (SDIO) pin to change direction from an input to an output at the appropriate point in the serial frame. Data can be sent in MSB-first mode or in LSB-first mode. MSBfirst mode is the default on power-up and can be changed via the SPI port configuration register. For more information about this and other features, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. HARDWARE INTERFACE The pins described in Table 11 comprise the physical interface between the user programming device and the serial port of the AD9634. The SCLK pin and the CSB pin function as inputs when using the SPI interface. The SDIO pin is bidirectional, functioning as an input during write phases and as an output during readback. The SPI interface is flexible enough to be controlled by either FPGAs or microcontrollers. One method for SPI configuration is described in detail in the AN-812 Application Note, Microcontroller-Based Serial Port Interface (SPI) Boot Circuit. The SPI port should not be active during periods when the full dynamic performance of the converter is required. Because the SCLK signal, the CSB signal, and the SDIO signal are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD9634 to prevent these signals from transitioning at the converter inputs during critical sampling periods. During an instruction phase, a 16-bit instruction is transmitted. Data follows the instruction phase, and its length is determined by the W0 and W1 bits. Rev. 0 | Page 24 of 32 AD9634 SPI ACCESSIBLE FEATURES Table 12. Features Accessible Using the SPI Table 12 provides a brief description of the general features that are accessible via the SPI. These features are described in detail in AN-877 Application Note, Interfacing to High Speed ADCs via SPI. Feature Name Mode Clock Offset Test I/O Output Mode Output Phase Output Delay VREF Digital Processing tHIGH tDS tS tDH Description Allows the user to set either power-down mode or standby mode Allows the user to access the DCS via the SPI Allows the user to digitally adjust the converter offset Allows the user to set test modes to have known data on output bits Allows the user to set up outputs Allows the user to set the output clock polarity Allows the user to vary the DCO delay Allows the user to set the reference voltage Allows the user to enable the synchronization features tCLK tH tLOW CSB SCLK DON’T CARE R/W W1 W0 A12 A11 A10 A9 A8 A7 D5 D4 D3 D2 D1 D0 DON’T CARE 09996-055 SDIO DON’T CARE DON’T CARE Figure 58. Serial Port Interface Timing Diagram Rev. 0 | Page 25 of 32 AD9634 MEMORY MAP READING THE MEMORY MAP REGISTER TABLE Default Values Each row in the memory map register table has eight bit locations. The memory map is roughly divided into three sections: the chip configuration registers (Address 0x00 to Address 0x02), the transfer register (Address 0xFF), and the ADC functions registers (Address 0x08 to Address 0x25), including setup, control, and test. After the AD9634 is reset, critical registers are loaded with default values. The default values for the registers are given in the memory map register table (see Table 13). Logic Levels An explanation of logic level terminology follows: The memory map register table (Table 13) documents the default hexadecimal value for each hexadecimal address shown. The Bit 7 (MSB) column is the start of the default hexadecimal value given. For example, Address 0x14, the output mode register, has a hexadecimal default value of 0x01. This means that Bit 0 = 1 and the remaining bits are 0s. This setting is the default output format value, which is twos complement. For more information on this function and others, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. This document details the functions controlled by Register 0x00 to Register 0x25. Open Locations • • “Bit is set” is synonymous with “bit is set to Logic 1” or “writing Logic 1 for the bit.” “Clear a bit” is synonymous with “bit is set to Logic 0” or “writing Logic 0 for the bit.” Transfer Register Map Address 0x08 to Address 0x20 are shadowed. Writes to these addresses do not affect part operation until a transfer command is issued by writing 0x01 to Address 0xFF, setting the transfer bit. This allows these registers to be updated internally and simultaneously when the transfer bit is set. The internal update takes place when the transfer bit is set, and then the bit autoclears. All address and bit locations that are not included in Table 13 are not currently supported for this device. Write 0s to unused bits of a valid address location. Writing to these locations is required only when part of an address location is open (for example, Address 0x18). If the entire address location is open (for example, Address 0x13), do not write to this address location. Rev. 0 | Page 26 of 32 AD9634 MEMORY MAP REGISTER TABLE All address and bit locations that are not included in Table 13 are not currently supported for this device. Table 13. Memory Map Registers Addr Register Bit 7 (Hex) Name (MSB) Chip Configuration Registers 0x00 0 SPI port configuration 0x01 0x02 Chip ID Chip grade Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB) LSB first Soft reset 1 1 Soft reset LSB first 0 Open Open Open Transfer 8-bit chip ID[7:0], AD9634 = 0x87 (default) Speed grade ID; Open Open 00 = 250 MSPS 01 = 210 MSPS 11 = 170 MSPS Open Open Transfer Register 0xFF Transfer Open Open Open Open Open Open ADC Function Registers 0x08 Power modes Open Open Open Open Open Open 0x09 Global clock Open Open Open Open Open Open 0x0B Clock divide Open Open 0x0D Test mode Test mode 0 = continuous/ repeat pattern 1 = single pattern then zeros Open Input clock divider phase adjust 000 = no delay 001 = 1 input clock cycle 010 = 2 input clock cycles 011 = 3 input clock cycles 100 = 4 input clock cycles 101 = 5 input clock cycles 110 = 6 input clock cycles 111 = 7 input clock cycles Reset PN long gen Reset PN short gen Rev. 0 | Page 27 of 32 Default Value (Hex) Default Notes/ Comments 0x18 Nibbles are mirrored so that LSBfirst mode or MSB-first mode is set correctly, regardless of shift mode. Read only. Speed grade ID used to differentiate devices; read only. 0x87 Internal power-down mode 00 = normal operation 01 = full power-down 10 = standby 11 = reserved Open Duty cycle stabilizer (default) Clock divide ratio 000 = divide by 1 001 = divide by 2 010 = divide by 3 011 = divide by 4 100 = divide by 5 101 = divide by 6 110 = divide by 7 111 = divide by 8 Output test mode 0000 = off (default) 0001 = midscale short 0010 = positive FS 0011 = negative FS 0100 = alternating checkerboard 0101 = PN long sequence 0110 = PN short sequence 0111 = one/zero word toggle 1000 = user test mode 1001 to 1110 = unused 1111 = ramp output 0x00 Synchronously transfers data from the master shift register to the slave. 0x00 Determines various generic modes of chip operation. 0x01 0x00 0x00 Clock divide values other than 000 automatically cause the duty cycle stabilizer to become active. When this register is set, the test data is placed on the output pins in place of normal data. AD9634 Addr (Hex) 0x0E Register Name BIST enable Bit 7 (MSB) Open Bit 6 Open 0x10 Offset adjust Open Open 0x14 Output mode Open Open Open Bit 2 Bit 1 Open Reset BIST sequence Offset adjust in LSBs from +31 to −32 (twos complement format) Open Output Output Output format enable bar invert 00 = offset binary 0 = on 0 = normal 01 = twos complement (default) (default) (default) 1 = off 1= 10 = gray code inverted 11 = reserved 0x15 Output adjust Open Open Open Open 0x16 Clock phase control DCO output delay Invert DCO clock Enable DCO clock delay Open Open Open Open Open 0x18 Input span select Open 0x19 User Test Pattern 1 LSB User Test Pattern 1 MSB User Test Pattern 2 LSB User Test Pattern 2 MSB User Test Pattern 3 LSB User Test Pattern 3 MSB User Test Pattern 4 LSB User Test Pattern 4 MSB BIST signature LSB BIST signature MSB 0x17 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x20 0x24 0x25 Open Bit 5 Open Open Bit 4 Open Bit 3 Open Bit 0 (LSB) BIST enable LVDS output drive current adjust 0000 = 3.72 mA output drive current 0001 = 3.5 mA output drive current (default) 0010 = 3.30 mA output drive current 0011 = 2.96 mA output drive current 0100 = 2.82 mA output drive current 0101 = 2.57 mA output drive current 0110 = 2.27 mA output drive current 0111 = 2.0 mA output drive current (reduced range) 1000 to 1111 = reserved Open Open Open Open Default Value (Hex) 0x00 Default Notes/ Comments 0x00 0x01 Configures the outputs and the format of the data. 0x01 0x00 DCO clock delay [delay = (3100 ps × register value/31 + 100)] 00000 = 100 ps 00001 = 200 ps 00010 = 300 ps … 11110 = 3100 ps 11111 = 3200 ps Full-scale input voltage selection 01111 = 2.087 V p-p … 00001 = 1.772 V p-p 00000 = 1.75 V p-p (default) 11111 = 1.727 V p-p … 10000 = 1.383 V p-p User Test Pattern 1[7:0] 0x00 User Test Pattern 1[15:8] 0x00 User Test Pattern 2[7:0] 0x00 User Test Pattern 2[15:8] 0x00 User Test Pattern 3[7:0] 0x00 User Test Pattern 3[15:8] 0x00 User Test Pattern 4[7:0] 0x00 User Test Pattern 4[15:8] 0x00 BIST signature[7:0] 0x00 Read only. BIST signature[15:8] 0x00 Read only. Rev. 0 | Page 28 of 32 0x00 Full-scale input adjustment in 0.022 V steps. 0x00 AD9634 APPLICATIONS INFORMATION DESIGN GUIDELINES Before starting system-level design and layout of the AD9634, it is recommended that the designer become familiar with these guidelines, which describe the special circuit connections and layout requirements needed for certain pins. Power and Ground Recommendations When connecting power to the AD9634, it is recommended that two separate 1.8 V supplies be used: use one supply for analog (AVDD) and a separate supply for digital outputs (DRVDD). The designer can employ several different decoupling capacitors to cover both high and low frequencies. Locate these capacitors close to the point of entry at the PC board level and close to the pins of the part with minimal trace length. A single PCB ground plane should be sufficient when using the AD9634. With proper decoupling and smart partitioning of the PCB analog, digital, and clock sections, optimum performance can be easily achieved. Exposed Paddle Thermal Heat Slug Recommendations It is mandatory that the exposed paddle on the underside of the ADC be connected to analog ground (AGND) to achieve the best electrical and thermal performance. A continuous, exposed (no solder mask) copper plane on the PCB should be connected to the AD9634 exposed paddle, Pin 0. The copper plane should have several vias to achieve the lowest possible resistive thermal path for heat dissipation to flow through the bottom of the PCB. These vias should be filled or plugged with nonconductive epoxy. To maximize the coverage and adhesion between the ADC and the PCB, overlay a silkscreen to partition the continuous plane on the PCB into several uniform sections. This provides several tie points between the ADC and the PCB during the reflow process. Using one continuous plane with no partitions guarantees only one tie point between the ADC and the PCB. See the evaluation board for a PCB layout example. For detailed information about the packaging and PCB layout of chip scale packages, refer to the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). VCM Decouple the VCM pin to ground with a 0.1 μF capacitor, as shown in Figure 48. SPI Port The SPI port should not be active during periods when the full dynamic performance of the converter is required. Because the SCLK, CSB, and SDIO signals are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD9634 to keep these signals from transitioning at the converter input pins during critical sampling periods. Rev. 0 | Page 29 of 32 AD9634 OUTLINE DIMENSIONS 0.30 0.25 0.18 32 25 1 24 0.50 BSC *3.75 3.60 SQ 3.55 EXPOSED PAD 8 17 TOP VIEW 0.80 0.75 0.70 0.50 0.40 0.30 16 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF SEATING PLANE PIN 1 INDICATOR 9 BOTTOM VIEW 0.25 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. *COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5 WITH EXCEPTION TO EXPOSED PAD DIMENSION. 08-16-2010-B PIN 1 INDICATOR 5.10 5.00 SQ 4.90 Figure 59. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 5 mm × 5 mm Body, Very Very Thin Quad (CP-32-12) Dimensions shown in millimeters ORDERING GUIDE Model 1 AD9634BCPZ-250 AD9634BCPZRL7-250 AD9634BCPZ-210 AD9634BCPZRL7-210 AD9634BCPZ-170 AD9634BCPZRL7-170 AD9634-170EBZ AD9634-210EBZ AD9634-250EBZ 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] Evaluation Board with AD9634 and Software Evaluation Board with AD9634 and Software Evaluation Board with AD9634 and Software Z = RoHS Compliant Part. Rev. 0 | Page 30 of 32 Package Option CP-32-12 CP-32-12 CP-32-12 CP-32-12 CP-32-12 CP-32-12 AD9634 NOTES Rev. 0 | Page 31 of 32 AD9634 NOTES ©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09996-0-7/11(0) Rev. 0 | Page 32 of 32