AD AD9484BCPZRL7-500

8-Bit, 500 MSPS,
1.8 V Analog-to-Digital Converter
AD9484
FEATURES
FUNCTIONAL BLOCK DIAGRAM
VREF
PWDN
AGND
AVDD
AD9484
REFERENCE
CML
VIN+
VIN–
DRVDD
DRGND
TRACK-AND-HOLD
ADC
CORE
CLK+
CLK–
8
OUTPUT
STAGING
LVDS
CLOCK
MANAGEMENT
8
D7± TO D0±
OR+
OR–
SERIAL PORT
DCO+
DCO–
SCLK/DFS
SDIO
CSB
09615-001
SNR = 47 dBFS at fIN up to 250 MHz at 500 MSPS
ENOB of 7.5 bits at fIN up to 250 MHz at 500 MSPS (−1.0 dBFS)
SFDR = 79 dBc at fIN up to 250 MHz at 500 MSPS (−1.0 dBFS)
Integrated input buffer
Excellent linearity
DNL = ±0.1 LSB typical
INL = ±0.1 LSB typical
LVDS at 500 MSPS (ANSI-644 levels)
1 GHz full power analog bandwidth
On-chip reference, no external decoupling required
Low power dissipation
670 mW at 500 MSPS—LVDS SDR output
Programmable (nominal) input voltage range
1.18 V p-p to 1.6 V p-p, 1.5 V p-p nominal
1.8 V analog and digital supply operation
Selectable output data format (offset binary, twos
complement, Gray code)
Clock duty cycle stabilizer
Integrated data capture clock
Figure 1.
APPLICATIONS
Wireless and wired broadband communications
Cable reverse path
Communications test equipment
Low cost digital oscilloscopes
Satellite subsystems
Power amplifier linearization
GENERAL DESCRIPTION
The AD9484 is an 8-bit, monolithic, sampling analog-to-digital
converter (ADC) optimized for high performance, low power,
and ease of use. The part operates at up to a 500 MSPS conversion rate and is optimized for outstanding dynamic performance
in wideband carrier and broadband systems. All necessary
functions, including a sample-and-hold and voltage reference,
are included on the chip to provide a complete signal conversion
solution. The VREF pin can be used to monitor the internal
reference or provide an external voltage reference (external
reference mode must be enabled through the SPI port).
The ADC requires a 1.8 V analog voltage supply and a differential clock for full performance operation. The digital outputs are
LVDS (ANSI-644) compatible and support twos complement,
offset binary format, or Gray code. A data clock output is available
for proper output data timing.
Fabricated on an advanced BiCMOS process, the AD9484 is available in a 56-lead LFCSP, and is specified over the industrial
temperature range (−40°C to +85°C). This product is protected
by a U.S. patent.
PRODUCT HIGHLIGHTS
1.
2.
3.
High Performance.
Maintains 47 dBFS SNR at 500 MSPS with a 250 MHz input.
Ease of Use.
LVDS output data and output clock signal allow interface
to current FPGA technology. The on-chip reference and
sample-and-hold provide flexibility in system design. Use
of a single 1.8 V supply simplifies system power supply design.
Serial Port Control.
Standard serial port interface supports various product
functions, such as data formatting, power-down, gain
adjust, and output test pattern generation.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2011 Analog Devices, Inc. All rights reserved.
AD9484
TABLE OF CONTENTS
Features .............................................................................................. 1 Theory of Operation ...................................................................... 14 Applications ....................................................................................... 1 Analog Input and Voltage Reference ....................................... 14 Functional Block Diagram .............................................................. 1 Clock Input Considerations ...................................................... 15 General Description ......................................................................... 1 Power Dissipation and Power-Down Mode ........................... 16 Product Highlights ........................................................................... 1 Digital Outputs ........................................................................... 16 Revision History ............................................................................... 2 Timing ......................................................................................... 17 Specifications..................................................................................... 3 VREF ............................................................................................ 17 DC Specifications ......................................................................... 3 AD9484 Configuration Using the SPI ..................................... 18 AC Specifications.......................................................................... 4 Hardware Interface..................................................................... 18 Digital Specifications ................................................................... 5 Configuration Without the SPI ................................................ 18 Switching Specifications .............................................................. 6 Memory Map .................................................................................. 20 Absolute Maximum Ratings............................................................ 7 Reading the Memory Map Table .............................................. 20 Thermal Resistance ...................................................................... 7 Reserved Locations .................................................................... 20 ESD Caution .................................................................................. 7 Default Values ............................................................................. 20 Pin Configuration and Function Descriptions ............................. 8 Logic Levels ................................................................................. 20 Typical Performance Characteristics ........................................... 10 Outline Dimensions ....................................................................... 23 Equivalent Circuits ......................................................................... 13 Ordering Guide .......................................................................... 23 REVISION HISTORY
6/11—Rev. 0 to Rev. A
Change to General Description Section ........................................ 1
Change to Aperture Time Parameter in Table 4 ........................... 6
Change to Figure 34 ....................................................................... 16
Changes to Register 17 and Register 18 in Table 12 .................. 20
3/11—Revision 0: Initial Version
Rev. A | Page 2 of 24
AD9484
SPECIFICATIONS
DC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, TMIN = −40°C, TMAX = +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted.
Table 1.
Parameter 1
RESOLUTION
ACCURACY
No Missing Codes
Offset Error
Gain Error
Differential Nonlinearity (DNL)
Integral Nonlinearity (INL)
INTERNAL REFERENCE
VREF
TEMPERATURE DRIFT
Offset Error
Gain Error
ANALOG INPUTS (VIN+, VIN−)
Differential Input Voltage Range 2
Input Common-Mode Voltage
Input Resistance (Differential)
Input Capacitance (Differential)
POWER SUPPLY
AVDD
DRVDD
Supply Currents
IAVDD 3
IDRVDD3/SDR Mode 4
Power Dissipation
SDR Mode4
Standby Mode
Power-Down Mode
Temp
Full
25°C
Full
25°C
Full
25°C
Full
25°C
Full
Full
Min
Typ
8
Max
Guaranteed
0
−3.0
+0.15
mV
mV
% FS
% FS
LSB
LSB
LSB
LSB
0.78
V
+3.0
1.0
−5.0
+7.0
±0.13
−0.25
+0.25
±0.1
−0.15
0.71
Full
Full
0.75
Unit
Bits
18
0.07
μV/°C
%/°C
Full
Full
Full
Full
1.18
1.5
1.7
1
1.3
1.6
V p-p
V
kΩ
pF
Full
Full
1.75
1.75
1.8
1.8
1.9
1.9
V
V
Full
Full
283
89
300
100
mA
mA
Full
Full
Full
670
40
2.5
720
50
7
mW
mW
mW
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
The input range is programmable through the SPI, and the range specified reflects the nominal values of each setting. See the Memory Map section.
IAVDD and IDRVDD are measured with a −1 dBFS, 10.3 MHz sine input at a rated sample rate.
4
Single data rate mode; this is the default mode of the AD9484.
2
3
Rev. A | Page 3 of 24
AD9484
AC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, TMIN = −40°C, TMAX = +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted.
Table 2.
Parameter 1, 2
SNR
fIN = 30.3 MHz
fIN = 70.3 MHz
fIN = 100.3 MHz
Temp
25°C
25°C
25°C
Full
25°C
25°C
fIN = 250.3 MHz
fIN = 450.3 MHz
SINAD
fIN = 30.3 MHz
fIN = 70.3 MHz
fIN = 100.3 MHz
25°C
25°C
25°C
Full
25°C
25°C
fIN = 250.3 MHz
fIN = 450.3 MHz
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 30.3 MHz
fIN = 70.3 MHz
fIN = 100.3 MHz
fIN = 250.3 MHz
fIN = 450.3 MHz
WORST HARMONIC (SECOND or THIRD)
fIN = 30.3 MHz
fIN = 70.3 MHz
fIN = 100.3 MHz
fIN = 250.3 MHz
fIN = 450.3 MHz
SFDR
fIN = 30.3 MHz
fIN = 70.3 MHz
fIN = 100.3 MHz
fIN = 250.3 MHz
fIN = 450.3 MHz
WORST OTHER HARMONIC (SFDR EXCLUDING SECOND and THIRD)
fIN = 30.3 MHz
fIN = 70.3 MHz
fIN = 100.3 MHz
fIN = 250.3 MHz
fIN = 450.3 MHz
TWO-TONE IMD
fIN1 = 119.5 MHz, fIN2 = 122.5 MHz
ANALOG INPUT BANDWIDTH
Full Power
1
2
Min
Typ
Max
47.0
47.0
47.0
Unit
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
46.5
47.0
46.9
47.0
47.0
47.0
47.0
46.9
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
25°C
25°C
25°C
25°C
25°C
7.5
7.5
7.5
7.5
7.5
Bits
Bits
Bits
Bits
Bits
25°C
25°C
25°C
Full
25°C
25°C
−87
−86
−87
dBc
dBc
dBc
dBc
dBc
dBc
25°C
25°C
25°C
Full
25°C
25°C
82
81
82
46.4
−75
83
70
dBc
dBc
dBc
dBc
dBc
dBc
75
79
70
25°C
25°C
25°C
Full
25°C
25°C
−82
−81
−82
79
77
dBc
dBc
dBc
dBc
dBc
dBc
25°C
−77
dBc
25°C
1
GHz
−75
All ac specifications tested by driving CLK+ and CLK− differentially.
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
Rev. A | Page 4 of 24
AD9484
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, TMIN = −40°C, TMAX = +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted.
Table 3.
Parameter 1
CLOCK INPUTS
Logic Compliance
Internal Common-Mode Bias
Differential Input Voltage
High Level Input (VIH)
Low Level Input (VIL)
High Level Input Current (IIH)
Low Level Input Current (IIL)
Input Resistance (Differential)
Input Capacitance
LOGIC INPUTS
Logic 1 Voltage
Logic 0 Voltage
Logic 1 Input Current (SDIO, CSB)
Logic 0 Input Current (SDIO, CSB)
Logic 1 Input Current (SCLK, PDWN)
Logic 0 Input Current (SCLK, PDWN)
Input Capacitance
LOGIC OUTPUTS 2
VOD Differential Output Voltage
VOS Output Offset Voltage
Output Coding
1
2
Temp
Min
Full
Full
Typ
Max
CMOS/LVDS/LVPECL
0.9
Full
Full
Full
Full
Full
Full
0.2
−1.8
−10
−10
8
Full
Full
Full
Full
Full
Full
Full
0.8 × DRVDD
Full
Full
247
1.125
10
4
1.8
−0.2
+10
+10
12
0.2 × DRVDD
0
−60
50
0
4
454
1.375
Unit
V
V p-p
V p-p
μA
μA
kΩ
pF
V
V
μA
μA
μA
μA
pF
mV
V
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
LVDS RTERMINATION = 100 Ω.
Rev. A | Page 5 of 24
AD9484
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, TMIN = −40°C, TMAX = +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted.
Table 4.
Parameter
Maximum Conversion Rate
Minimum Conversion Rate
CLK+ Pulse Width High (tCH) 1
CLK+ Pulse Width Low (tCL)1
Output (LVDS—SDR)1
Data Propagation Delay (tPD)
Rise Time (tR) (20% to 80%)
Fall Time (tF) (20% to 80%)
DCO Propagation Delay (tCPD)
Data to DCO Skew (tSKEW)
Latency
Aperture Time (tA)
Aperture Uncertainty (Jitter, tJ)
1
Temp
Full
Full
Full
Full
Min
500
Typ
50
11
11
0.9
0.9
Full
25°C
25°C
Full
Full
Full
25°C
25°C
Max
0.85
0.15
0.15
0.6
−0.07
+0.07
15
0.85
80
Unit
MSPS
MSPS
ns
ns
ns
ns
ns
ns
ns
Clock cycles
ns
fs rms
See Figure 2.
Timing Diagram
N–1
tA
N+4
N+5
N
N+3
VIN+, VIN–
N+1
tCH
tCL
N+2
1/fS
CLK+
CLK–
tCPD
DCO+
DCO–
tSKEW
tPD
N – 15
N – 14
Dx–
Figure 2. Timing Diagram
Rev. A | Page 6 of 24
N – 13
N – 12
N – 11
09615-002
Dx+
AD9484
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Electrical
AVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
D0+/D0− through D7+/D7−
to DRGND
DCO+, DCO− to DRGND
OR+, OR− to DRGND
CLK+ to AGND
CLK− to AGND
VIN+ to AGND
VIN− to AGND
SDIO/DCS to DRGND
PDWN to AGND
CSB to AGND
SCLK/DFS to AGND
CML to AGND
VREF to AGND
Environmental
Storage Temperature Range
Operating Temperature Range
Lead Temperature
(Soldering, 10 sec)
Junction Temperature
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−65°C to +125°C
−40°C to +85°C
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Table 6.
Package Type
56-Lead LFCSP_VQ (CP-56-5)
θJA
23.7
θJC
1.7
Unit
°C/W
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θJA.
ESD CAUTION
150°C
Rev. A | Page 7 of 24
AD9484
56
55
54
53
52
51
50
49
48
47
46
45
44
43
DNC
DNC
DNC
DNC
DNC
DNC
DCO+
DCO–
DRGND
DRVDD
AVDD
CLK–
CLK+
AVDD
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PIN 1
INDICATOR
AD9484
TOP VIEW
(Not to Scale)
PIN 0 (EXPOSED PADDLE) = AGND
42
41
40
39
38
37
36
35
34
33
32
31
30
29
AVDD
AVDD
CML
AVDD
AVDD
AVDD
VIN–
VIN+
AVDD
AVDD
AVDD
VREF
AVDD
PWDN
NOTES
1. DNC = DO NOT CONNECT. DO NOT CONNECT TO THIS PIN.
2. AGND AND DRGND SHOULD BE TIED TO A COMMON
QUIET GROUND PLANE.
3. THE EXPOSED PADDLE MUST BE SOLDERED TO
A GROUND PLANE.
09615-003
D5–
D5+
D6–
D6+
D7–
D7+
OR–
OR+
DRGND
DRVDD
SDIO
SCLK/DFS
CSB
DNC
15
16
17
18
19
20
21
22
23
24
25
26
27
28
DNC
DNC
D0–
D0+
D1–
D1+
DRVDD
DRGND
D2–
D2+
D3–
D3+
D4–
D4+
Figure 3. Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
0
30, 32 to 34, 37 to 39,
41 to 43, 46
7, 24, 47
8, 23, 48
35
36
40
Mnemonic
AGND 1
AVDD
Description
Analog Ground. The exposed paddle must be soldered to a ground plane.
1.8 V Analog Supply.
DRVDD
DRGND1
VIN+
VIN−
CML
44
45
31
1, 2, 28, 51 to 56
25
26
27
29
49
50
3
4
5
6
9
10
11
12
13
CLK+
CLK−
VREF
DNC
SDIO
SCLK/DFS
CSB
PWDN
DCO−
DCO+
D0−
D0+
D1−
D1+
D2−
D2+
D3−
D3+
D4−
1.8 V Digital Output Supply.
Digital Output Ground.
Analog Input—True.
Analog Input—Complement.
Common-Mode Output. Enabled through the SPI, this pin provides a reference for the
optimized internal bias voltage for VIN+/VIN−.
Clock Input—True.
Clock Input—Complement.
Voltage Reference Internal/Input/Output. Nominally 0.75 V.
Do Not Connect. Do not connect to this pin. This pin should be left floating.
Serial Port Interface (SPI) Data Input/Output.
Serial Port Interface Clock (Serial Port Mode)/Data Format Select (External Pin Mode).
Serial Port Chip Select (Active Low).
Chip Power-Down.
Data Clock Output—Complement.
Data Clock Output—True.
D0 Complement Output (LSB).
D0 True Output (LSB).
D1 Complement Output.
D1 True Output.
D2 Complement Output.
D2 True Output.
D3 Complement Output.
D3 True Output.
D4 Complement Output.
Rev. A | Page 8 of 24
AD9484
Pin No.
14
15
16
17
18
19
20
21
22
1
Mnemonic
D4+
D5−
D5+
D6−
D6+
D7−
D7+
OR−
OR+
Description
D4 True Output.
D5 Complement Output.
D5 True Output.
D6 Complement Output.
D6 True Output.
D7 Complement Output (MSB).
D7 True Output (MSB).
Overrange Complement Output.
Overrange True Output.
Tie AGND and DRGND to a common quiet ground plane.
Rev. A | Page 9 of 24
AD9484
TYPICAL PERFORMANCE CHARACTERISTICS
AVDD = 1.8 V, DRVDD = 1.8 V, rated sample rate, TA = 25°C, 1.5 V p-p differential input, AIN = −1 dBFS, unless otherwise noted.
0
0
–10
AMPLITUDE (dBFS)
–40
–50
–60
–70
–40
–50
–60
–70
–80
–90
–90
0
20
40
60
80
100 120 140 160 180 200 220 240
FREQUENCY (MHz)
–100
0
20
40
60
80
100 120 140 160 180 200 220 240
FREQUENCY (MHz)
Figure 4. 64k Point Single-Tone FFT; 500 MSPS, 30.3 MHz
Figure 7. 64k Point Single-Tone FFT; 500 MSPS, 270.3 MHz
0
0
500MSPS
100.3MHz AT –1.0dBFS
SNR: 46.0dB
ENOB: 7.5 BITS
SFDR: 83dBc
–10
–20
–20
AMPLITUDE (dBFS)
–30
–40
–50
–60
–70
–30
–40
–50
–60
–70
–90
–100
0
20
40
60
80
100 120 140 160 180 200 220 240
FREQUENCY (MHz)
09615-107
–90
Figure 5. 64k Point Single-Tone FFT; 500 MSPS, 100.3 MHz
0
20
40
60
80
100 120 140 160 180 200 220 240
FREQUENCY (MHz)
Figure 8. 64k Point Single-Tone FFT; 500 MSPS, 450.3 MHz
85
0
500MSPS
140.3MHz AT –1.0dBFS
SNR: 46.0dB
ENOB: 7.5 BITS
SFDR: 82dBc
–10
–20
SFDR (dBc), TA = +25°C
80
75
SFDR (dBc), TA = +85°C
SNR/SFDR (dB)
–30
09615-110
–80
–100
–40
–50
–60
–70
70
SFDR (dBc), TA = –40°C
65
60
55
SNR (dBFS), TA = –40°C
SNR (dBFS), TA = +25°C
SNR (dBFS), TA = +85°C
50
–80
20
40
60
80
100 120 140 160 180 200 220 240
FREQUENCY (MHz)
Figure 6. 64k Point Single-Tone FFT; 500 MSPS, 140.3 MHz
40
09615-108
0
0
100
200
300
400
ANALOG INPUT FREQUECY (MHz)
500
09615-111
45
–90
–100
500MSPS
450.3MHz AT –1.0dBFS
SNR: 45.9dB
ENOB: 7.5 BITS
SFDR: 70dBc
–10
–80
AMPLITUDE (dBFS)
–30
–80
–100
AMPLITUDE (dBFS)
–20
–30
09615-106
AMPLITUDE (dBFS)
–20
500MSPS
270.3MHz AT –1.0dBFS
SNR: 46.0dB
ENOB: 7.5 BITS
SFDR: 79dBc
–10
09615-109
500MSPS
30.3MHz AT –1.0dBFS
SNR: 46.0dB
ENOB: 7.5 BITS
SFDR: 82dBc
Figure 9. Single-Tone SNR/SFDR vs. Input Frequency (fIN) and Temperature;
500 MSPS
Rev. A | Page 10 of 24
AD9484
85
0.10
SFDR (dBc), 30.3MHz
0.08
80
75
0.06
SFDR (dBc), 100.3MHz
0.04
DNL (LSB)
65
60
55
–0.06
45
–0.08
50
100
150
200 250 300 350 400
SAMPLE RATE (MSPS)
450
500
–0.10
09615-112
40
0
–0.02
–0.04
SNR (dBFS), 30.3MHz
SNR (dBFS), 100.3MHz
50
0.02
550
0
64
Figure 10. SNR/SFDR vs. Sample Rate; 30.3 MHz, 100.3 MHz
128
OUTPUT CODE
192
09615-115
SNR/SFDR (dB)
70
256
Figure 13. DNL, 500 MSPS
4.0
100
0.29 LSB rms
90
SFDR (dBFS)
3.5
80
3.0
NUMBER OF HITS (M)
SFDR (dBc)
60
SNR (dBFS)
50
40
30
2.0
1.5
1.0
SNR (dB)
20
2.5
–45
–40
–35
–30
–25
–20
–15
–10
–5
0
AMPLITUDE (dB)
0
09615-211
0
–50
N–3
–10
0.06
–20
0.04
–30
AMPLITUDE (dBFS)
0
0.08
0.02
0
–0.02
–0.04
256
N+3
Figure 12. INL, 500 MSPS
500MSPS
119.5MHz AT –7.0dBFS
122.5MHz AT –7.0dBFS
SFDR: 77dBc
–70
–90
192
N+2
–60
–80
128
OUTPUT CODE
N+1
–50
–0.08
64
N
BINS
–40
–0.06
09615-114
INL (LSB)
0.10
0
N–1
Figure 14. Grounded Input Histogram, 500 MSPS
Figure 11. SNR/SFDR vs. Input Amplitude; 500 MSPS,140.3 MHz
–0.10
N–2
09615-116
0.5
10
–100
0
20
40
60
80
100 120 140 160 180 200 220 240
FREQUENCY (MHz)
Figure 15. 64k Point, Two-Tone FFT; 500 MSPS,
119.2 MHz, 122.5 MHz
Rev. A | Page 11 of 24
09615-215
SNR/SFDR (dB)
70
AD9484
80
100
IMD3 (dBFS)
90
75
70
80
SFDR (dBc)
SFDR (dBFS)
65
SFDR (dB)
60
50
40
SFDR (dBc)
20
40
10
35
–70
–60
–50
–40
–30
–20
–10
0
30
500
09615-118
–80
SFDR (dBc)
80
SNR/SFDR (dB)
70
60
SNR (dBFS)
1.6
1.7
1.8
1.9
2.0
VCM (V)
09615-119
40
30
1.5
Figure 17. SNR/SFDR vs. Common-Mode Voltage; 500 MSPS,
AIN = 140.3 MHz
350
700
IAVDD
500
200
400
300
150
POWER (mW)
600
200
100
0
SAMPLE RATE (MSPS)
09615-120
50
IDRVDD
50
75
100
125
150
175
200
225
250
275
300
325
350
375
400
425
450
475
500
525
550
CURRENT (mA)
800
TOTAL POWER
600
700
800
900
1000
Figure 19. SNR/SFDR at 500 MSPS; AIN Sweep at −1.0 dBFS
90
50
SNR (dBFS)
FREQUENCY (MHz)
Figure 16. Two-Tone SFDR vs. Input Amplitude; 500 MSPS,
119.5 MHz, 122.5 MHz
100
50
45
AMPLITUDE (dBFS)
250
55
30
0
–90
300
60
Figure 18. Current and Power vs. Sample Rate, AIN = 30.3 MHz
Rev. A | Page 12 of 24
09615-121
SNR/SFDR (dB)
70
AD9484
EQUIVALENT CIRCUITS
AVDD
DRVDD
AVDD
AVDD
0.9V
15kΩ
CLK+
DRVDD
15kΩ
CLK–
30kΩ
DRVDD
350Ω
09615-009
09615-006
CSB
Figure 20. Clock Inputs
Figure 24. Equivalent CSB Input Circuit
VBOOST
AVDD
DRVDD
CML
V+
V–
Dx–
AVDD
Dx+
V–
V+
09615-010
VIN+
AIN+
500Ω
AVDD
SPI
CONTROLLED
DC
Figure 25. LVDS Outputs (Dx+, Dx−, OR+, OR−, DCO+, DCO−)
500Ω
AVDD
VIN+
AIN–
20kΩ
(00)
09615-007
(01)
VREF
(10)
Figure 21. Analog Input DC Equivalent Circuit (VCML = ~1.7 V)
NOT USED
(11)
DRVDD
DRVDD
SCLK/DFS
350Ω
09615-011
SPI CTRL VREF SELECT
00 = INTERNAL VREF
01 = IMPORT VREF
10 = EXPORT VREF
11 = NOT USED
Figure 26. Equivalent VREF Input/Output Circuit
09615-008
30kΩ
DRVDD
DRVDD
Figure 22. Equivalent SCLK/DFS, PDWN Input Circuit
30kΩ
350Ω
VIN+
SDIO
CTRL
Figure 23. Analog Input AC EquivalentCircuit
Figure 27. Equivalent SDIO Input Circuit
Rev. A | Page 13 of 24
09615-012
VIN–
1kΩ
09615-025
1.3pF
AD9484
THEORY OF OPERATION
The input stage contains a differential SHA that can be ac- or
dc-coupled in differential or single-ended mode. The output
staging block aligns the data, carries out the error correction,
and passes the data to the output buffers. The output buffers
are powered from a separate supply, allowing adjustment of the
output voltage swing. During power-down, the output buffers
enter a high impedance state.
ANALOG INPUT AND VOLTAGE REFERENCE
The analog input to the AD9484 is a differential buffer. For best
dynamic performance, match the source impedances driving
VIN+ and VIN− such that common-mode settling errors are
symmetrical. The analog input is optimized to provide superior
wideband performance and requires that the analog inputs be
driven differentially. SNR and SINAD performance degrades
significantly if the analog input is driven with a single-ended
signal.
Optimum performance is achieved while driving the AD9484
in a differential input configuration. For baseband applications,
the AD8138 differential driver provides excellent performance
and a flexible interface to the ADC. The output common-mode
voltage of the AD8138 is easily set to AVDD/2 + 0.5 V, and the
driver can be configured in a Sallen-Key filter topology to provide band limiting of the input signal.
1V p-p
499Ω
523Ω
AVDD
VIN+
33Ω
499Ω
AD8138
20pF
0.1µF
AD9484
VIN–
33Ω
CML
499Ω
Figure 28. Differential Input Configuration Using the AD8138
At input frequencies in the second Nyquist zone and above, the
performance of most amplifiers may not be adequate to achieve
the true performance of the AD9484. This is especially true in
IF undersampling applications where frequencies in the 70 MHz
to 100 MHz range are being sampled. For these applications,
differential transformer coupling is the recommended input
configuration. The signal characteristics must be considered
when selecting a transformer. Most RF transformers saturate at
frequencies below a few megahertz (MHz), and excessive signal
power can cause core saturation, which leads to distortion.
In any configuration, the value of the shunt capacitor, C (see
Figure 30), is dependent on the input frequency and may need
to be reduced or removed.
A wideband transformer, such as Mini-Circuits® ADT1-1WT,
can provide the differential analog inputs for applications that
require a single-ended-to-differential conversion. Both analog
inputs are self-biased by an on-chip reference to a nominal 1.7 V.
An internal differential voltage reference creates positive and
negative reference voltages that define the 1.5 V p-p fixed span
of the ADC core. This internal voltage reference can be adjusted
by means of SPI control. See the AD9484 Configuration Using
the SPI section for more details.
49.9Ω
09615-013
Each stage of the pipeline, excluding the last, consists of a low
resolution flash ADC connected to a switched capacitor DAC
and interstage residue amplifier (MDAC). The residue amplifier
magnifies the difference between the reconstructed DAC output
and the flash input for the next stage in the pipeline. One bit of
redundancy is used in each stage to facilitate digital correction
of flash errors. The last stage simply consists of a flash ADC.
Differential Input Configurations
15Ω
1.5V p-p
50Ω
2pF
VIN+
AD9484
VIN–
15Ω
0.1µF
09615-014
The AD9484 architecture consists of a front-end sample-andhold amplifier (SHA) followed by a pipelined switched capacitor
ADC. The quantized outputs from each stage are combined into
a final 8-bit result in the digital correction logic. The pipelined
architecture permits the first stage to operate on a new input
sample, whereas the remaining stages operate on preceding
samples. Sampling occurs on the rising edge of the clock.
Figure 29. Differential Transformer—Coupled Configuration
As an alternative to using a transformer-coupled input at frequencies in the second Nyquist zone, the AD8352 differential driver
can be used (see Figure 30).
Rev. A | Page 14 of 24
AD9484
VCC
0.1µF
0.1µF
0Ω 16
8, 13
1
ANALOG INPUT
11
0.1µF
R
2
VIN+
200Ω
RD
AD8352
RG
3
200Ω
0.1µF
AD9484
C
R
VIN– CML
4
ANALOG INPUT
5
14
0.1µF 0Ω
10
0.1µF
0.1µF
09615-015
CD
Figure 30. Differential Input Configuration Using the AD8352
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
CLOCK
INPUT
50Ω1
0.1µF
0.1µF
CLK+
CLK
0.1µF
100Ω
PECL DRIVER
0.1µF
CLK
240Ω
50Ω1
ADC
AD9484
CLK–
240Ω
09615-017
CLOCK
INPUT
150Ω RESISTORS ARE OPTIONAL.
Figure 31. Differential PECL Sample Clock
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
CLOCK
INPUT
50Ω1
0.1µF
0.1µF
CLK+
CLK
0.1µF
100Ω
LVDS DRIVER
0.1µF
CLK
ADC
AD9484
CLK–
50Ω1
09615-018
CLOCK
INPUT
150Ω RESISTORS ARE OPTIONAL.
Figure 32. Differential LVDS Sample Clock
CLOCK INPUT CONSIDERATIONS
Figure 33 shows one preferred method for clocking the AD9484.
The low jitter clock source is converted from single-ended to
differential using an RF transformer. The back-to-back Schottky
diodes across the secondary transformer limit clock excursions
into the AD9484 to approximately 0.8 V p-p differential. This
helps prevent the large voltage swings of the clock from feeding
through to other portions of the AD9484 and preserves the fast
rise and fall times of the signal, which are critical to low jitter
performance.
0.1µF
CLOCK
INPUT
50Ω
MINI-CIRCUITS
ADT1–1WT, 1:1Z
0.1µF
XFMR
CLK+
ADC
100Ω
0.1µF
AD9484
CLK–
0.1µF
SCHOTTKY
DIODES:
HSM2812
09615-016
For optimum performance, drive the AD9484 sample clock
inputs (CLK+ and CLK−) with a differential signal. This signal
is typically ac-coupled into the CLK+ and CLK− pins via a
transformer or capacitors. These pins are biased at ~0.9 V
internally and require no additional bias. If the clock signal is
dc-coupled, then the common-mode voltage should remain
within a range of 0.9 V.
Figure 33. Transformer-Coupled Differential Clock
If a low jitter clock is available, another option is to ac couple a
differential PECL signal to the sample clock input pins, as
shown in Figure 31. The AD9510/AD9511/AD9512/AD9513/
AD9514/AD9515 family of clock drivers offers excellent jitter
performance.
In some applications, it may be acceptable to drive the sample
clock inputs with a single-ended 1.8 V CMOS signal. In such
applications, drive the CLK+ pin directly from a CMOS gate,
and bypass the CLK− pin to ground with a 0.1 μF capacitor in
parallel with a 39 kΩ resistor (see Figure 34).
Rev. A | Page 15 of 24
AD9484
130
VCC
CLOCK
INPUT
50Ω1
1kΩ
AD951x
CMOS DRIVER
OPTIONAL
0.1µF
100Ω
110
CLK+
ADC
AD9484
1kΩ
CLK–
RESISTOR IS OPTIONAL.
09615-024
0.1µF
150Ω
RMS CLOCK JITTER REQUIREMENT
120
SNR (dB)
0.1µF
Figure 34. Single-Ended 1.8 V CMOS Input Clock (Up to 200 MHz)
100
16 BITS
90
14 BITS
80
12 BITS
70
10 BITS
60
0.125ps
0.25ps
0.5ps
1.0ps
2.0ps
8 BITS
50
Typical high speed ADCs use both clock edges to generate a
variety of internal timing signals. As a result, these ADCs may
be sensitive to clock duty cycle. A 5% tolerance is commonly
required on the clock duty cycle to maintain dynamic performance
characteristics. The AD9484 contains a duty cycle stabilizer (DCS)
that retimes the nonsampling edge, providing an internal clock
signal with a nominal 50% duty cycle. This allows a wide range
of clock input duty cycles without affecting the performance of
the AD9484. When the DCS is on, noise and distortion performance are nearly flat for a wide range of duty cycles.
40
POWER DISSIPATION AND POWER-DOWN MODE
The duty cycle stabilizer uses a delay-locked loop (DLL) to
create the nonsampling edge. As a result, any changes to the
sampling frequency require approximately 15 clock cycles
to allow the DLL to acquire and lock to the new rate.
By asserting PDWN (Pin 29) high, the AD9484 is placed in
standby mode or full power-down mode, as determined by the
contents of Serial Port Register 08. Reasserting the PDWN pin
low returns the AD9484 to its normal operational mode.
Clock Jitter Considerations
An additional standby mode is supported by means of varying
the clock input. When the clock rate falls below 50 MHz, the
AD9484 assumes a standby state. In this case, the biasing network
and internal reference remain on, but digital circuitry is powered
down. Upon reactivating the clock, the AD9484 resumes normal
operation after allowing for the pipeline latency.
High speed, high resolution ADCs are sensitive to the quality of the
clock input. The degradation in SNR at a given input frequency
(fA) due only to aperture jitter (tJ) can be calculated by
SNR Degradation = 20 × log10(1/2 × π × fA × tJ)
In this equation, the rms aperture jitter represents the root mean
square of all jitter sources, including the clock input, analog input
signal, and ADC aperture jitter specifications. IF undersampling
applications are particularly sensitive to jitter (see Figure 35).
Treat the clock input as an analog signal in cases where aperture
jitter may affect the dynamic range of the AD9484. Separate the
power supplies for clock drivers from the ADC output driver
supplies to avoid modulating the clock signal with digital noise.
Low jitter, crystal-controlled oscillators make the best clock
sources. If the clock is generated from another type of source
(by gating, dividing, or other methods), it should be retimed by
the original clock at the last step.
Refer to the AN-501 Application Note and the AN-756
Application Note for more in-depth information about jitter
performance as it relates to ADCs (visit www.analog.com).
30
1
10
100
ANALOG INPUT FREQUENCY (MHz)
1000
09615-019
Clock Duty Cycle Considerations
Figure 35. Ideal SNR vs. Input Frequency and Jitter
As shown in Figure 18, the power dissipated by the AD9484 is
proportional to its sample rate. The digital power dissipation
does not vary much because it is determined primarily by the
DRVDD supply and bias current of the LVDS output drivers.
DIGITAL OUTPUTS
Digital Outputs and Timing
The AD9484 differential outputs conform to the ANSI-644
LVDS standard on default power-up. This can be changed to a
low power, reduced signal option similar to the IEEE 1596.3
standard using the SPI. This LVDS standard can further reduce
the overall power dissipation of the device, which reduces the
power by ~39 mW. See the Memory Map section for more information. The LVDS driver current is derived on chip and sets
the output current at each output equal to a nominal 3.5 mA.
A 100 Ω differential termination resistor placed at the LVDS
receiver inputs results in a nominal 350 mV swing at the receiver.
The AD9484 LVDS outputs facilitate interfacing with LVDS
receivers in custom ASICs and FPGAs that have LVDS capability
for superior switching performance in noisy environments.
Single point-to-point net topologies are recommended with a
100 Ω termination resistor placed as close to the receiver as
possible. No far-end receiver termination or poor differential
trace routing may result in timing errors. It is recommended
that the trace length be no longer than 24 inches and that the
Rev. A | Page 16 of 24
AD9484
Output Data Rate and Pinout Configuration
differential output traces be kept close together and at equal
lengths.
An example of the LVDS output using the ANSI standard (default)
data eye and a time interval error (TIE) jitter histogram with
trace lengths less than 24 inches on regular FR-4 material is
shown in Figure 36. Figure 37 shows an example of when the
trace lengths exceed 24 inches on regular FR-4 material. Notice
that the TIE jitter histogram reflects the decrease of the data eye
opening as the edge deviates from the ideal position. It is up to
the user to determine if the waveforms meet the timing budget
of the design when the trace lengths exceed 24 inches.
14
12
400
TIE JITTER HISTOGRAM (Hits)
300
200
100
0
–100
–200
–300
–400
10
8
Out-of-Range (OR)
An out-of-range condition exists when the analog input voltage
is beyond the input range of the ADC. OR+ and OR− (OR±)
are digital outputs that are updated along with the data output
corresponding to the particular sampled input voltage. Thus,
OR± has the same pipeline latency as the digital data. OR± is
low when the analog input voltage is within the analog input
range and high when the analog input voltage exceeds the input
range, as shown in Figure 38. OR± remains high until the analog
input returns to within the input range and another conversion
is completed. By logically AND’ing OR± with the MSB and its
complement, overrange high or underrange low conditions can
be detected.
6
OR± DATA OUTPUTS
1
1111 1111
0
1111 1111
0
1111 1110
4
–FS + 1/2 LSB
2
0
0
1
–2
–1
0
1
2
0
–40
3
–20
0
20
09615-020
–500
–3
40
TIME (ps)
TIME (ns)
12
400
10
TIE JITTER HISTOGRAM (Hits)
200
0
–200
–2
–1
0
1
TIME (ns)
2
3
8
Minimize the length of the output data lines and loads placed
on them to reduce transients within the AD9484. These transients can degrade the dynamic performance of the converter.
The AD9484 also provides a data clock output (DCO) intended
for capturing the data in an external register. The data outputs
are valid on the rising edge of DCO.
6
4
0
–100
Figure 38. OR± Relation to Input Voltage and Output Data
The AD9484 provides latched data outputs with a pipeline delay
of 15 clock cycles. Data outputs are available one propagation
delay (tPD) after the rising edge of the clock signal.
2
–400
+FS
+FS – 1/2 LSB
TIMING
0
TIME (ps)
100
09615-021
EYE DIAGRAM: VOLTAGE (mV)
600
0000 0001
0000 0000
0000 0000
–FS
–FS – 1/2 LSB
Figure 36. Data Eye for LVDS Outputs in ANSI Mode with Trace Lengths Less
Than 24 Inches on Standard FR-4
–600
–3
+FS – 1 LSB
OR±
09615-022
EYE DIAGRAM: VOLTAGE (mV)
500
The output data of the AD9484 can be configured to drive
12 pairs of LVDS outputs at the same rate as the input clock
signal (SDR mode).
Figure 37. Data Eye for LVDS Outputs in ANSI Mode with Trace Lengths
Greater Than 24 Inches on Standard FR-4
The format of the output data is offset binary by default. An
example of the output coding format can be found in Table 11.
If it is desired to change the output data format to twos complement, see the AD9484 Configuration Using the SPI section.
An output clock signal is provided to assist in capturing data
from the AD9484. The DCO is used to clock the output data
and is equal to the sampling clock (CLK) rate. In single data
rate mode (SDR), data is clocked out of the AD9484 and must
be captured on the rising edge of the DCO. See the timing
diagram shown in Figure 2 for more information.
The lowest conversion rate of the AD9484 is 50 MSPS. At clock
rates below 1 MSPS, the AD9484 assumes the standby mode.
VREF
The AD9484 VREF pin (Pin 31) allows the user to monitor the
on-board voltage reference, or provide an external reference
(requires configuration through the SPI). The three optional
settings are internal VREF (pin is connected to 20 kΩ to ground),
export VREF, and import VREF. Do not attach a bypass capacitor
to this pin. VREF is internally compensated and additional
loading may impact performance.
Rev. A | Page 17 of 24
AD9484
command. This allows the serial data input/output (SDIO) pin
to change direction from an input to an output.
AD9484 CONFIGURATION USING THE SPI
The AD9484 SPI allows the user to configure the converter for
specific functions or operations through a structured register
space inside the ADC. This gives the user added flexibility to
customize device operation depending on the application.
Addresses are accessed (programmed or readback) serially in
1-byte words. Each byte can be further divided into fields,
which are documented in the Memory Map section.
Data can be sent in MSB or in LSB first mode. MSB first is
default on power-up and can be changed by changing the
configuration register. For more information about this feature
and others, see the AN-877 Application Note, Interfacing to
High Speed ADCs via SPI at www.analog.com.
HARDWARE INTERFACE
There are three pins that define the serial port interface (SPI) to
this particular ADC. They are the SCLK/DFS, SDIO and CSB
pins. The SCLK/DFS (serial clock) is used to synchronize the
read and write data presented the ADC. The SDIO (serial data
input/output) is a dual-purpose pin that allows data to be sent
to and read from the internal ADC memory map registers. The
CSB is an active low control that enables or disables the read
and write cycles (see Table 8).
The pins described in Table 8 comprise the physical interface
between the programming device of the user and the serial port
of the AD9484. The SCLK pin and the CSB pin function as
inputs when using the SPI interface. The SDIO pin is bidirectional, functioning as an input during the write phase and as an
output during readback.
This interface is flexible enough to be controlled by either
PROMs or PIC® microcontrollers as well. This provides the user
with an alternate method to program the ADC other than a SPI
controller.
Table 8. Serial Port Pins
Mnemonic
SCLK
SDIO
CSB
Function
SCLK (serial clock) is the serial shift clock in.
SCLK is used to synchronize serial interface
reads and writes.
SDIO (serial data input/output) is a dual-purpose
pin. The typical role for this pin is an input and
output depending on the instruction being sent
and the relative position in the timing frame.
CSB (chip select) is an active low control that
gates the read and write cycles.
If the user chooses not to use the SPI interface, some pins serve
a dual function and are associated with a specific function when
strapped externally to AVDD or ground during device poweron. The Configuration Without the SPI section describes the
strappable functions supported on the AD9484.
CONFIGURATION WITHOUT THE SPI
In applications that do not interface to the SPI control registers,
the SCLK/DFS pin can alternately serve as a standalone CMOScompatible control pin. Connect the CSB pin to AVDD, which
disables the serial port interface.
The falling edge of the CSB, in conjunction with the rising edge
of the SCLK, determines the start of the framing. An example of
the serial timing and its definitions can be found in Figure 39
and Table 10.
Table 9. Mode Selection
During an instruction phase, a 16-bit instruction is transmitted.
Data then follows the instruction phase and is determined by
the W0 and W1 bits, which is one or more bytes of data. All
data is composed of 8-bit words. The first bit of each individual
byte of serial data indicates whether this is a read or write
tDS
tS
tHIGH
Mnemonic
SCLK/DFS
External
Voltage
AVDD
AGND
Configuration
Twos complement enabled
Offset binary enabled
tCLK
tDH
tH
tLOW
CSB
SCLK DON’T CARE
R/W
W1
W0
A12
A11
A10
A9
A8
A7
D5
Figure 39. Serial Port Interface Timing Diagram
Rev. A | Page 18 of 24
D4
D3
D2
D1
D0
DON’T CARE
09615-023
SDIO DON’T CARE
DON’T CARE
AD9484
Table 10. Serial Timing Definitions
Parameter
tDS
tDH
tCLK
tS
tH
tHIGH
tLOW
tEN_SDIO
Minimum (ns)
5
2
40
5
2
16
16
1
tDIS_SDIO
5
Description
Setup time between the data and the rising edge of SCLK
Hold time between the data and the rising edge of SCLK
Period of the clock
Setup time between CSB and SCLK
Hold time between CSB and SCLK
Minimum period that SCLK should be in a logic high state
Minimum period that SCLK should be in a logic low state
Minimum time for the SDIO pin to switch from an input to an output relative to the SCLK falling
edge (not shown in Figure 39)
Minimum time for the SDIO pin to switch from an output to an input relative to the SCLK rising
edge (not shown in Figure 39)
Table 11. Output Data Format
Input (V)
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
Condition (V)
< −0.75 − 0.5 LSB
= −0.75
=0
= 0.75
> 0.75 + 0.5 LSB
Offset Binary Output Mode, D7± to D0±
0000 0000
0000 0000
1000 0000
1111 1111
1111 1111
Rev. A | Page 19 of 24
Twos Complement Mode, D7± to D0±
1000 0000
1000 0000
0000 0000
0111 1111
0111 1111
OR±
1
0
0
0
1
AD9484
MEMORY MAP
READING THE MEMORY MAP TABLE
RESERVED LOCATIONS
Each row in the memory map table (see Table 12) has eight
address locations. The memory map is roughly divided into
three sections: chip configuration register map (Address 0x00 to
Address 0x02), transfer register map (Address 0xFF), and ADC
functions register map (Address 0x08 to Address 0x2A).
Undefined memory locations should not be written to other
than with the default values suggested in this data sheet. Addresses
that have values marked as 0 should be considered reserved and
have a 0 written into their registers during power-up.
The Addr. (Hex) column of the memory map indicates the register
address in hexadecimal, and the Default Value (Hex) column
shows the default hexadecimal value that is already written into
the register. The Bit 7 (MSB) column is the start of the default
hexadecimal value given. For example, Hexadecimal Address
0x2A, OVR_CONFIG, has a hexadecimal default value of 0x01.
This means Bit 7 = 0, Bit 6 = 0, Bit 5 = 0, Bit 4 = 0, Bit 3 = 0,
Bit 2 = 0, Bit 1 = 0, and Bit 0 = 1, or 0000 0001 in binary. The
default value enables the OR± output. Overwriting this default so
that Bit 0 = 0 disables the OR± output. For more information on
this and other functions, consult the AN-877 Application Note,
Interfacing to High-Speed ADCs via SPI® user manual at
www.analog.com.
Coming out of reset, critical registers are preloaded with default
values. These values are indicated in Table 12. Other registers
do not have default values and retain the previous value when
exiting reset.
DEFAULT VALUES
LOGIC LEVELS
An explanation of various registers follows: “Bit is set” is
synonymous with “bit is set to Logic 1” or “writing Logic 1 for
the bit.” Similarly, “clear a bit” is synonymous with “bit is set to
Logic 0” or “writing Logic 0 for the bit.”
Table 12. Memory Map Register
Addr.
(Hex) Register Name
Chip Configuration Registers
00
CHIP_PORT_CONFIG
01
CHIP_ID
02
CHIP_GRADE
Bit 7
(MSB)
0
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
LSB
first
Soft
reset
1
1
Soft
reset
LSB
first
Bit 0
(LSB)
Default
Value
(Hex)
0
0x18
8-bit chip ID, Bits[7:0] = 0x6C
0
0
0
Speed grade:
00 = 500 MSPS
Transfer Register
FF
DEVICE_UPDATE
0
0
0
0
0
ADC Functions Registers
08
Modes
0
0
PDWN:
0 = full
(default)
1=
standby
0
0
Rev. A | Page 20 of 24
Read
only
Default Notes/
Comments
The nibbles
should be
mirrored by the
user so that LSB
or MSB first
mode registers
correctly,
regardless of
shift mode.
Default is a
unique chip ID,
different for
each device.
This is a readonly register.
Child ID used to
differentiate
graded devices.
X1
X1
X1
Read
only
0
0
SW
transfer
0x00
Synchronously
transfers data
from the master
shift register to
the slave.
Internal power-down mode:
000 = normal (power-up,
default)
001 = full power-down
010 = standby
011 = normal (power-up)
Note that external PDWN pin
overrides this setting
0x00
Determines
various generic
modes of chip
operation.
X
AD9484
Addr.
(Hex)
10
Register Name
Offset
0D
TEST_IO
(For user-defined
mode only, set
Bits[3:0] = 1000)
00 = Pattern 1 only
01 = toggle P1/P2
10 = toggle
P1/0000
11 = toggle P1/P2/
0000
Reset
PN23
gen:
1 = on
0 = off
(default)
Reset
PN9
gen:
1 = on
0 = off
(default)
0F
AIN_CONFIG
0
0
0
0
14
OUTPUT_MODE
0
0
0
15
OUTPUT_ADJUST
0
0
0
Output
enable:
0=
enable
(default)
1=
disable
0
16
OUTPUT_PHASE
0
0
0
17
FLEX_OUTPUT_DELAY
Output
clock
polarity
1=
inverted
0=
normal
(default)
0
0
0
0
Bit 7
(MSB)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
8-bit device offset adjustment [7:0]
0111 111 = +127 codes
0000 0000 = 0 codes
1000 0000 = −128 codes
Bit 1
Bit 0
(LSB)
Output test mode:
0000 = off (default)
0001 = midscale short
0010 = +FS short
0011 = −FS short
0100 = checker board output
0101 = PN23 sequence
0110 = PN9
0111 = one/zero word toggle
1000 = user defined
1001 = unused
1010 = unused
1011 = unused
1100 = unused
(Format determined by OUTPUT_MODE)
0
0
0
Analog
input
disable:
1 = on
0 = off
(default)
Data format select:
0
Output
00 = offset binary
invert:
(default)
1 = on
01 = twos
0 = off
complement
(default)
10 = Gray code
LVDS
course
adjust:
0=
3.5 mA
(default)
1=
2.0 mA
0
Rev. A | Page 21 of 24
0
LVDS fine adjust:
001 = 3.50 mA
010 = 3.25 mA
011 = 3.00 mA
100 = 2.75 mA
101 = 2.50 mA
110 = 2.25 mA
111 = 2.00 mA
0
0
Output clock delay:
0000 = 0
0001 = −1/10
0010 = −2/10
0011 = −3/10
0100 = reserved
0101 = +5/10
0110 = +4/10
0111 = +3/10
1000 = +2/10
1001 = +1/10
Default
Value
(Hex)
0x00
0x00
Default Notes/
Comments
Device offset
trim: codes are
relative to the
output
resolution.
When set, the
test data is
placed on the
output pins in
place of normal
data.
Set pattern
values:
P1 = Reg 0x19,
Reg 0x1A
P2 = Reg 0x1B,
Reg 0x1C
0x00
0x00
0
0x00
0
0x00
0x00
Shown as
fractional value
of sampling
clock period
that is
subtracted or
added to initial
tSKEW, see
Figure 2.
AD9484
Addr.
(Hex)
18
Register Name
FLEX_VREF
19
USER_PATT1_LSB
1A
USER_PATT1_MSB
1B
USER_PATT2_LSB
1C
USER_PATT2_MSB
2A
2C
1
Bit 7
(MSB)
Bit 6
VREF select
00 = internal VREF
(20 kΩ pull-down)
01 = import VREF
(0.59 V to 0.8 V on
VREF pin)
10 = export VREF
(from internal
reference)
11 = not used
Bit 5
0
Bit 4
Bit 3
Bit 2
Bit 1
Input voltage range setting:
11100 = 1.60
11101 = 1.58
11110 = 1.55
11111 = 1.52
00000 = 1.50
00001 = 1.47
00010 = 1.44
00011 = 1.42
00100 = 1.39
00101 = 1.36
00110 = 1.34
00111 = 1.31
01000 = 1.28
01001 = 1.26
01010 = 1.23
01011= 1.20
01011= 1.18
Bit 0
(LSB)
B7
B6
B5
B4
B3
B2
B1
B0
B7
B6
B5
B4
B3
B2
B1
B0
B7
B6
B5
B4
B3
B2
B1
B0
B7
B6
B5
B4
B3
B2
B1
B0
OVR_CONFIG
0
0
0
0
0
0
0
Input coupling
0
0
0
0
0
DC
coupling
enable
0
OR±
enable:
1 = on
(default)
0 = off
0
X = don’t care.
Rev. A | Page 22 of 24
Default
Value
(Hex)
0x00
0x00
0x00
0x00
0x00
Default Notes/
Comments
User-defined
pattern, 1 LSB.
User-defined
pattern, 1 MSB.
User-defined
pattern, 2 LSBs.
User-defined
pattern, 2 MSBs.
0x01
0x00
Default is
ac coupling.
AD9484
OUTLINE DIMENSIONS
8.10
8.00 SQ
7.90
0.30
0.23
0.18
0.60 MAX
0.60
MAX
43
56
42
PIN 1
INDICATOR
7.85
7.75 SQ
7.65
PIN 1
INDICATOR
1
0.50
BSC
EXPOSED
PAD
5.25
5.10 SQ
4.95
14
29
1.00
0.85
0.80
12° MAX
0.80 MAX
0.65 TYP
28
15
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.20 REF
0.08
SEATING
PLANE
0.25 MIN
6.50 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2
081809-B
TOP VIEW
0.50
0.40
0.30
Figure 40. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
8 mm × 8 mm Body, Very Thin Quad
(CP-56-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
AD9484BCPZ-500
AD9484BCPZRL7-500
AD9484-500EBZ
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
Z = RoHS Compliant Part.
Rev. A | Page 23 of 24
Package Option
CP-56-5
CP-56-5
AD9484
NOTES
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09615-0-6/11(A)
Rev. A | Page 24 of 24