[ /Title (CD74 HC374 , CD74 HCT37 4, CD74 HC574 , CD74 HCT57 CD54/74HC374, CD54/74HCT374, CD54/74HC574, CD54/74HCT574 Data sheet acquired from Harris Semiconductor SCHS183B February 1998 - Revised May 2003 High-Speed CMOS Logic Octal D-Type Flip-Flop, 3-State Positive-Edge Triggered Features Description • Buffered Inputs The ’HC374, ’HCT374, ’HC574, and ’HCT574 are octal D-type flip-flops with 3-state outputs and the capability to drive 15 LSTTL loads. The eight edge-triggered flip-flops enter data into their registers on the LOW to HIGH transition of clock (CP). The output enable (OE) controls the 3-state outputs and is independent of the register operation. When OE is HIGH, the outputs are iin the high-impedance state. The 374 and 574 are identical in function and differ only in their pinout arrangements. • Common Three-State Output Enable Control • Three-State Outputs • Bus Line Driving Capability • Typical Propagation Delay (Clock to Q) = 15ns at VCC = 5V, CL = 15pF, TA = 25oC • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads Ordering Information PART NUMBER TEMP. RANGE (oC) PACKAGE • Wide Operating Temperature Range . . . -55oC to 125oC CD54HC374F3A • Balanced Propagation Delay and Transition Times CD54HC574F3A -55 to 125 20 Ld CERDIP CD54HCT374F3A -55 to 125 20 Ld CERDIP • Significant Power Reduction Compared to LSTTL Logic ICs • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH -55 to 125 20 Ld CERDIP CD54HCT574F3A -55 to 125 20 Ld CERDIP CD74HC374E -55 to 125 20 Ld PDIP CD74HC374M -55 to 125 20 Ld SOIC CD74HC374M96 -55 to 125 20 Ld SOIC CD74HC574E -55 to 125 20 Ld PDIP CD74HC574M -55 to 125 20 Ld SOIC CD74HC574M96 -55 to 125 20 Ld SOIC CD74HCT374E -55 to 125 20 Ld PDIP CD74HCT374M -55 to 125 20 Ld SOIC CD74HCT374M96 -55 to 125 20 Ld SOIC CD74HCT574E -55 to 125 20 Ld PDIP CD74HCT574M -55 to 125 20 Ld SOIC CD74HCT574M96 -55 to 125 20 Ld SOIC NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54/74HC374, CD54/74HCT374, CD54/74HC574, CD54/74HCT574 Pinouts CD54HC374, CD54HCT374 (CERDIP) CD74HC374, CD74HCT374 (PDIP, SOIC) TOP VIEW CD54HC574, CD54HCT574 (CERDIP) CD74HC574, CD74HCT574 (PDIP, SOIC) TOP VIEW OE 1 20 VCC OE 1 20 VCC Q0 2 19 Q7 D0 2 19 Q0 D0 3 18 D7 D1 3 18 Q1 D1 4 17 D6 D2 4 17 Q2 Q1 5 16 Q6 D3 5 16 Q3 Q2 6 15 Q5 D4 6 15 Q4 D2 7 14 D5 D5 7 14 Q5 D3 8 13 D4 D6 8 13 Q6 Q3 9 12 Q4 D7 9 12 Q7 GND 10 11 CP GND 10 11 CP Functional Diagram D0 D1 D2 D D CP Q CP Q D3 D CP Q D4 D5 D6 D7 D D D D D CP Q CP Q CP Q CP Q CP Q CP OE Q0 Q1 Q2 Q3 Q4 Q5 TRUTH TABLE INPUTS OUTPUT OE CP Dn Qn L ↑ H H L ↑ L L L L X Q0 H X X Z H = High Level (Steady State) L = Low Level (Steady State) X= Don’t Care ↑= Transition from Low to High Level Q0= The level of Q before the indicated steady-state input conditions were established Z = High Impedance State 2 Q6 Q7 CD54/74HC374, CD54/74HCT374, CD54/74HC574, CD54/74HCT574 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1). . . . . . . . . . . . . . . . . θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) VIH - - 2 1.5 - - 1.5 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V MIN TYP MAX MIN MAX MIN MAX UNITS - 1.5 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current II VCC or GND - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -6 4.5 3.98 - - 3.84 - 3.7 - V -7.8 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 6 4.5 - - 0.26 - 0.33 - 0.4 V 7.8 6 - - 0.26 - 0.33 - 0.4 V - 6 - - ±0.1 - ±1 - ±1 µA 3 CD54/74HC374, CD54/74HCT374, CD54/74HC574, CD54/74HCT574 DC Electrical Specifications (Continued) TEST CONDITIONS PARAMETER Quiescent Device Current 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) ICC VCC or GND 0 6 - - 8 - 80 - 160 µA - 6 - - ±0.5 - ±5.0 - ±10 µA Three- State Leakage VIL or VIH VO = VCC or GND Current MIN TYP MAX MIN MAX MIN MAX UNITS HCT TYPES High Level Input Voltage VIH - - 4.5 to 5.5 2 - - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V High Level Output Voltage CMOS Loads VOH VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V -6 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 6 4.5 - - 0.26 - 0.33 - 0.4 V ±0.1 - ±1 - ±1 µA High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current II VCC and GND 0 5.5 - ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA - 6 - - ±0.5 - ±5.0 - ±10 µA - 4.5 to 5.5 - 100 360 - 450 - 490 µA Three- State Leakage VIL or VIH VO = VCC Current or GND Additional Quiescent Device Current Per Input Pin: 1 Unit Load ∆ICC (Note 2) VCC -2.1 NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table UNIT LOADS INPUT HCT374 HCT574 D0 - D7 0.3 0.4 CP 0.9 0.75 OE 1.3 0.6 NOTE: Unit Load is ∆ICC limit specific in DC Electrical Specifications Table, e.g., 360µA max. at 25oC. 4 CD54/74HC374, CD54/74HCT374, CD54/74HC574, CD54/74HCT574 Prerequisite for Switching Specifications 25oC PARAMETER -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS fMAX 2 6 - - 5 - - 4 - - MHz 4.5 30 - - 25 - - 20 - - MHz 6 35 - - 29 - - 23 - - MHz 2 80 - - 100 - - 120 - - ns 4.5 16 - - 20 - - 24 - - ns 6 14 - - 17 - - 20 - - ns 2 60 - - 75 - - 90 - - ns 4.5 12 - - 15 - - 18 - - ns 6 10 - - 13 - - 15 - - ns 2 5 - - 5 - - 5 - - ns 4.5 5 - - 5 - - 5 - - ns 6 5 - - 5 - - 5 - - ns fMAX 4.5 30 - - 25 - - 20 - - MHz Clock Pulse Width tW 4.5 16 - - 20 - - 24 - - ns Setup Time Data to Clock tSU 4.5 12 - - 15 - - 18 - - ns Hold Time Data to Clock tH 4.5 5 - - 5 - - 5 - - ns HC TYPES Maximum Clock Frequency Clock Pulse Width Setup Time Data to Clock Hold Time Data to Clock tW tSU tH HCT TYPES Maximum Clock Frequency Switching Specifications PARAMETER CL = 50pF, Input tr, tf = 6ns SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF -40oC TO 85oC 25oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 165 - 205 - 250 ns 4.5 - - 33 - 41 - 50 ns CL = 15pF 5 - 15 - - - - - ns CL = 50pF 6 - - 28 - 35 - 43 ns CL = 50pF 2 - - 135 - 170 - 205 ns 4.5 - - 27 - 34 - 41 ns CL = 15pF 5 - 11 - - - - - ns CL = 50pF 6 - - 23 - 29 - 35 ns HC TYPES Propagation Delay Clock to Output Output Disable to Q tPLZ, tPHZ 5 CD54/74HC374, CD54/74HCT374, CD54/74HC574, CD54/74HCT574 Switching Specifications CL = 50pF, Input tr, tf = 6ns (Continued) -40oC TO 85oC 25oC -55oC TO 125oC PARAMETER SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS Output Enable to Q tPZL, tPZH CL = 50pF 2 - - 150 - 190 - 225 ns 4.5 - - 30 - 38 - 45 ns CL = 15pF 5 - 12 - - - - - ns CL = 50pF 6 - - 26 - 33 - 38 ns fMAX CL = 15pF 5 - 60 - - - - - MHz tTHL, tTLH CL = 50pF 2 - - 60 - 75 - 90 ns 4.5 - - 12 - 15 - 18 ns 6 - - 10 - 13 - 15 ns Maximum Clock Frequency Output Transition Time Input Capacitance CI CL = 50pF - 10 - 10 - 10 - 10 pF Three-State Output Capacitance CO - - 20 - 20 - 20 - 20 pF Power Dissipation Capacitance (Notes 3, 4) CPD CL = 15pF 5 - 39 - - - - - pF CL = 50pF 4.5 - - 33 - 41 - 50 ns CL = 15pF 5 - 15 - - - - - ns CL = 50pF 4.5 - - 28 - 35 - 42 ns CL = 15pF 5 - 11 - - - - - ns CL = 50pF 4.5 - - 30 - 38 - 45 ns CL = 15pF 5 - 12 - - - - - ns fMAX CL = 15pF 5 - 60 - - - - - MHz tTLH, tTHL CL = 50pF 4.5 - - 12 - 15 - 18 ns Input Capacitance CI CL = 50pF - 10 - 10 - 10 - 10 pF Three-State Output Capacitance CO - - 20 - 20 - 20 - 20 pF Power Dissipation Capacitance (Notes 3, 4) CPD CL = 15pF 5 - 47 - - - - - pF HCT TYPES Propagation Delay tPHL, tPLH Clock to Output Output Disable to Q Output Enable to Q Maximum Clock Frequency Output Transition Time tPLZ, tPHZ tPZL, tPZH NOTES: 3. CPD is used to determine the dynamic power consumption, per package. 4. PD = CPD VCC2 fi + ∑ VCC2 fO CL where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. 6 CD54/74HC374, CD54/74HCT374, CD54/74HC574, CD54/74HCT574 Test Circuits and Waveforms tWL + tWH = tfCL trCL 50% 10% 10% tf = 6ns tr = 6ns tTLH 90% INVERTING OUTPUT tPHL FIGURE 3. HC TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC trCL tfCL VCC tfCL GND 1.3V 0.3V GND tH(H) tH(L) VCC DATA INPUT 3V 2.7V CLOCK INPUT 50% tH(H) tTLH 1.3V 10% tPLH 10% GND tTHL 90% 50% 10% 90% 3V 2.7V 1.3V 0.3V GND tTHL trCL tWH FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH INPUT INVERTING OUTPUT GND NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. VCC 90% 50% 10% 1.3V 1.3V tWL tf = 6ns tPHL 1.3V 0.3V tWH FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH INPUT 2.7V 0.3V GND tr = 6ns DATA INPUT 50% tH(L) 3V 1.3V 1.3V 1.3V GND tSU(H) tSU(H) tSU(L) tTLH 90% OUTPUT tTHL 90% 50% 10% tTLH 90% 1.3V OUTPUT tREM 3V SET, RESET OR PRESET GND tTHL 1.3V 10% FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS tPHL 1.3V GND IC CL 50pF GND 90% tPLH 50% IC tSU(L) tPHL tPLH I fCL 3V NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tREM VCC SET, RESET OR PRESET tfCL = 6ns CLOCK 50% 50% tWL CLOCK INPUT tWL + tWH = trCL = 6ns VCC 90% CLOCK I fCL CL 50pF FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 7 CD54/74HC374, CD54/74HCT374, CD54/74HC574, CD54/74HCT574 Test Circuits and Waveforms 6ns (Continued) 6ns OUTPUT DISABLE tr VCC 90% 50% 10% OUTPUTS ENABLED OUTPUT HIGH TO OFF 50% OUTPUTS DISABLED FIGURE 7. HC THREE-STATE PROPAGATION DELAY WAVEFORM OTHER INPUTS TIED HIGH OR LOW OUTPUT DISABLE IC WITH THREESTATE OUTPUT GND 1.3V tPZH 90% OUTPUTS ENABLED OUTPUTS ENABLED 0.3 10% tPHZ tPZH 90% 3V tPZL tPLZ OUTPUT LOW TO OFF 50% OUTPUT HIGH TO OFF 6ns GND 10% tPHZ tf 2.7 1.3 tPZL tPLZ OUTPUT LOW TO OFF 6ns OUTPUT DISABLE 1.3V OUTPUTS DISABLED OUTPUTS ENABLED FIGURE 8. HCT THREE-STATE PROPAGATION DELAY WAVEFORM OUTPUT RL = 1kΩ CL 50pF VCC FOR tPLZ AND tPZL GND FOR tPHZ AND tPZH NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL = 1kΩ to VCC, CL = 50pF. FIGURE 9. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT 8 MECHANICAL MPDI002C – JANUARY 1995 – REVISED DECEMBER 20002 N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 16 PINS SHOWN PINS ** 14 16 18 20 A MAX 0.775 (19,69) 0.775 (19,69) 0.920 (23,37) 1.060 (26,92) A MIN 0.745 (18,92) 0.745 (18,92) 0.850 (21,59) 0.940 (23,88) MS-100 VARIATION AA BB AC DIM A 16 9 0.260 (6,60) 0.240 (6,10) 1 C AD 8 0.070 (1,78) 0.045 (1,14) 0.045 (1,14) 0.030 (0,76) D D 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gauge Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.430 (10,92) MAX 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) M 14/18 PIN ONLY 20 pin vendor option D 4040049/E 12/2002 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001, except 18 and 20 pin minimum body lrngth (Dim A). D. The 20 pin end lead shoulder width is a vendor option, either half or full width. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 MECHANICAL DATA MSOI003E – JANUARY 1995 – REVISED SEPTEMBER 2001 DW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 16 PINS SHOWN 0.020 (0,51) 0.014 (0,35) 9 0.050 (1,27) 16 0.010 (0,25) 0.419 (10,65) 0.400 (10,15) 0.010 (0,25) NOM 0.299 (7,59) 0.291 (7,39) Gage Plane 0.010 (0,25) 1 8 0°– 8° 0.050 (1,27) 0.016 (0,40) A Seating Plane 0.104 (2,65) MAX 0.012 (0,30) 0.004 (0,10) PINS ** 0.004 (0,10) 16 18 20 24 28 A MAX 0.410 (10,41) 0.462 (11,73) 0.510 (12,95) 0.610 (15,49) 0.710 (18,03) A MIN 0.400 (10,16) 0.453 (11,51) 0.500 (12,70) 0.600 (15,24) 0.700 (17,78) DIM 4040000/E 08/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). 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