Dual Channel, High Speed Optocouplers Technical Data HCPL-2530 HCPL-2531 HCPL-4534 HCPL-0530 HCPL-0531 HCPL-0534 Features Applications Description • 15 kV/µs Minimum Common Mode Transient Immunity at VCM = 1500 V (HCPL-4534/0534) • High Speed: 1 Mb/s • TTL Compatible • Available in 8 Pin DIP, SO-8, and 8 Pin DIP – Gull Wing Surface Mount (Option 020) Packages • High Density Packaging • 3 MHz Bandwidth • Open Collector Outputs • Guaranteed Performance from 0°C to 70°C • Safety Approval UL Recognized – 2500 V rms for 1 minute (5000 V rms for 1 minute for Option 020) per UL1577 CSA Approved • Single Channel Version Available (4502/3, 0452/3) • MIL-STD-1772 Version Available (55XX/65XX/4N55) • Line Receivers – High Common Mode Transient Immunity (>1000 V/µs) and Low Input-Output Capacitance (0.6 pF) • High Speed Logic Ground Isolation – TTL/TTL, TTL/ LTTL, TTL/CMOS, TTL/LSTTL • Replace Pulse Transformers – Save Board Space and Weight • Analog Signal Ground Isolation – Integrated Photon Detector Provides Improved Linearity over Phototransistor Type • Polarity Sensing • Isolated Analog Amplifier – Dual Channel Packaging Enhances Thermal Tracking These dual channel optocouplers contain a pair of light emitting diodes and integrated photodetectors with electrical insulation between input and output. Separate connection for the photodiode bias and output transistor collectors increase the speed up to a hundred times that of a conventional phototransistor coupler by reducing the basecollector capacitance. Functional Diagram ANODE 1 1 8 VCC CATHODE 1 2 7 VO1 CATHODE 2 3 6 VO2 ANODE 2 4 TRUTH TABLE (POSITIVE LOGIC) LED VO ON LOW OFF HIGH 5 GND A 0.1 µF bypass capacitor between pins 5 and 8 is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 2 These dual channel optocouplers are available in an 8 Pin DIP and in an industry standard SO-8 package. The following is a cross reference table listing the 8 Pin DIP part number and the electrically equivalent SO-8 part number. 8 Pin DIP HCPL-2530 HCPL-2531 HCPL-4534 SO-8 Package HCPL-0530 HCPL-0531 HCPL-0534 The SO-8 does not require “through holes” in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. The HCPL-2530/0530 is for use in TTL/CMOS, TTL/LSTTL or wide bandwidth analog applications. Current transfer ratio (CTR) for the HCPL-2530/0530 is 7% minimum at IF = 16 mA. The HCPL-2531/0531 is designed for high speed TTL/TTL applications. A standard 16 mA TTL sink current through the input LED will provide enough output current for 1 TTL load and a 5.6 kΩ pull-up resistor. CTR of the HCPL-2531/0531 is 19% minimum at IF = 16 mA. The HCPL-4534/0534 is an HCPL-2531/0531 with increased common mode transient immunity of 15,000 V/µs minimum at VCM = 1500 V guaranteed. Selection Guide Minimum CMR 8-pin DIP (300 Mil) dV/dt (V/ µs) 1,000 VCM (V) 10 Current Transfer Ratio (%) 7 19 Dual Channel Package HCPL-2530 HCPL-2531 15,000 1,000 1500 10 19 9 HCPL-4534 Single Channel Package* 6N135 6N136 HCPL-4502 HCPL-4503 Small-Outline SO-8 Dual Channel Package HCPL-0530 HCPL-0531 HCPL-0534 *Technical data for these products are on separate Agilent publications. Single Channel Package* HCPL-0500 HCPL-0501 HCPL-0452 HCPL-0453 Widebody (400 Mil) Single Channel Package* HCNW135 HCNW136 HCNW4502 HCNW4503 Hermetic Single and Dual Channel Packages* HCPL-55XX HCPL-65XX 4N55 3 Ordering Information Specify Part Number followed by Option Number (if desired). Example: HCPL-2531#XXX 020 = UL 5000 V rms/1 Minute Option* 300 = Gull Wing Surface Mount Option† 500 = Tape and Reel Packaging Option Option data sheets available. Contact your Agilent sales representative or authorized distributor for information. *For HCPL-2530/1 and HCPL-4534 only. †Gull wing surface mount option applies to through hole parts only. Schematic 1 ICC I F1 + 8 VF1 I O1 – 7 VCC VO1 2 3 I F2 – I O2 6 VF2 VO2 + 4 GND 5 HCPL-4534/0534 SHIELD USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED BETWEEN PINS 5 AND 8 IS RECOMMENDED. 4 Package Outline Drawings 8-Pin DIP Package (HCPL-2530/2531/4534) 7.62 ± 0.25 (0.300 ± 0.010) 9.65 ± 0.25 (0.380 ± 0.010) TYPE NUMBER 8 7 6 5 6.35 ± 0.25 (0.250 ± 0.010) OPTION CODE* DATE CODE A XXXXZ YYWW RU 1 2 3 4 UL RECOGNITION 1.78 (0.070) MAX. 1.19 (0.047) MAX. 5° TYP. 4.70 (0.185) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 0.51 (0.020) MIN. 2.92 (0.115) MIN. 0.65 (0.025) MAX. 1.080 ± 0.320 (0.043 ± 0.013) DIMENSIONS IN MILLIMETERS AND (INCHES). 2.54 ± 0.25 (0.100 ± 0.010) * MARKING CODE LETTER FOR OPTION NUMBERS. "L" = OPTION 020 OPTION NUMBERS 300 AND 500 NOT MARKED. 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2530/2531/4534) PAD LOCATION (FOR REFERENCE ONLY) 9.65 ± 0.25 (0.380 ± 0.010) 8 7 6 1.016 (0.040) 1.194 (0.047) 5 4.826 TYP. (0.190) 6.350 ± 0.25 (0.250 ± 0.010) 1 2 3 9.398 (0.370) 9.906 (0.390) 4 1.194 (0.047) 1.778 (0.070) 1.19 (0.047) MAX. 1.780 (0.070) MAX. 9.65 ± 0.25 (0.380 ± 0.010) 7.62 ± 0.25 (0.300 ± 0.010) 4.19 MAX. (0.165) 1.080 ± 0.320 (0.043 ± 0.013) 0.635 ± 0.130 2.54 (0.025 ± 0.005) (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). 0.381 (0.015) 0.635 (0.025) 0.635 ± 0.25 (0.025 ± 0.010) + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 12° NOM. 5 Small Outline SO-8 Package (HCPL-0530/0531/0534) 8 7 6 5 5.994 ± 0.203 (0.236 ± 0.008) XXX YWW 3.937 ± 0.127 (0.155 ± 0.005) TYPE NUMBER (LAST 3 DIGITS) DATE CODE PIN ONE 1 2 3 4 0.406 ± 0.076 (0.016 ± 0.003) 1.270 BSG (0.050) * 5.080 ± 0.127 (0.200 ± 0.005) 7° 3.175 ± 0.127 (0.125 ± 0.005) 45° X 0.432 (0.017) 0 ~ 7° 0.228 ± 0.025 (0.009 ± 0.001) 1.524 (0.060) 0.203 ± 0.102 (0.008 ± 0.004) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 0.305 MIN. (0.012) 5.207 ± 0.254 (0.205 ± 0.010) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. TEMPERATURE – °C Solder Reflow Temperature Profile (HCPL-0530/0531/0534 and Gull Wing Surface Mount Option Parts) 260 240 220 200 180 160 140 120 100 80 60 40 20 0 ∆T = 145°C, 1°C/SEC ∆T = 115°C, 0.3°C/SEC ∆T = 100°C, 1.5°C/SEC 0 1 2 3 4 5 6 7 8 9 10 11 12 TIME – MINUTES Note: Use of nonchlorine activiated fluxes is highly recommended. Regulatory Information The devices contained in this data sheet have been approved by the following organizations: UL Recognized under UL 1577, Component Recognition Program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. 6 Insulation and Safety Related Specifications Parameter Minimum External Air Gap (External Clearance) Minimum External Tracking (External Creepage) Minimum Internal Plastic Gap (Internal Clearance) Minimum Internal Tracking (Internal Creepage) Tracking Resistance (Comparative Tracking Index) Isolation Group Symbol L(101) 8-Pin DIP (300 Mil) Value 7.1 SO-8 Value 4.9 L(102) 7.4 4.8 0.08 0.08 mm NA NA mm 200 200 Volts IIIa IIIa CTI Units Conditions mm Measured from input terminals to output to to output terminals, shortest distance through air. mm Measured from input terminals to output terminals, shortest distance path along body. Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Measured from input terminals to output terminals, along internal cavity. DIN IEC 112/VDE 0303 Part 1 Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 - surface mount classification is Class A in accordance with CECC 00802. Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature Average Forward Input Current (each channel) Peak Forward Input Current (each channel) (50% duty cycle, 1 ms pulse width) Peak Transient Input Current (each channel) (≤ 1 µs pulse width, 300 pps) Reverse LED Input Voltage (each channel) Input Power Dissipation (each channel) Average Output Current (each channel) Peak Output Current Supply Voltage (Pin 8-5) Output Voltage (Pins 7-5, 6-5) Output Power Dissipation (each channel) Lead Solder Temperature (Through-Hole Parts Only) 1.6 mm below seating plane, 10 seconds Reflow Temperature Profile Symbol TS TA IF(AVG) Device Max. 125 100 25 Units °C °C mA IF(PEAK) 50 mA IF(TRANS) 1 A VR PIN 5 45 8 16 30 20 35 V mW mA mA V V mW IO(AVG) IO(PEAK) VCC VO PO TLS TRP Min. -55 -55 -0.5 -0.5 8 Pin DIP SO-8 and Option 300 260 °C See Package Outline Drawings section Note 13 7 Electrical Specifications (DC) Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified. See note 9. Parameter Sym. Device Current Transfer Ratio CTR HCPL-2530/ 0530 7 VOL 19 18 50 % TA = 25°C 24 50 % TA = 25°C 0.1 0.5 V TA = 25°C IO = 1.1 mA IF = 16 mA, VCC = 4.5 V IO = 0.8 mA V TA = 25°C IO = 3.0 mA HCPL-2530/ 0530 0.5 0.1 0.5 0.5 IF = 16 mA, 1, 2 VCC = 4.5 V 4 VO = 0.5 V 1, 2 IOH 0.003 0.5 1 1 6 1 3 1 IO = 2.4 mA µA 50 TA = 25°C VO = Open IF = 0 mA VCC = 5.5 V TA = 25°C VO = Open VCC = 15.0 V Logic Low Supply Current ICCL 100 400 µA IF = 16 mA, VO = Open, VCC = 15 V Logic High Supply Current ICCH 0.05 4 µA IF = 0 mA, VO = Open, VCC = 15 V VF 1.5 1.7 V TA = 25°C Input Forward Voltage Fig. Note 15 HCPL-2531/ 0531 HCPL-4534/ 0534 Logic High Output Current Test Conditions 5 HCPL-2531/ 0531 HCPL-4534/ 0534 Logic Low Output Voltage Min. Typ.* Max. Units IF = 16 mA 1.8 BVR Temperature Coefficient of Forward Voltage ∆VF ∆TA -1.6 mV/ °C IF = 16 mA Input Capacitance CIN 60 pF f = 1 MHz, VF = 0 V *All typicals at TA = 25°C. 5 V IR =10 µA Input Reverse Breakdown Voltage 1 1 8 Switching Specifications (AC) Over recommended temperature (TA = 0°C to 70°C), VCC = 5 V, IF = 16 mA unless otherwise specified. Device Parameter Sym. HCPLMin. Typ.* Max. Units Test Conditions Fig. Propagation tPHL 2530/0530 0.2 1.5 µs TA = 25°C RL = 4.1 kΩ 5, 9, Delay Time 2.0 11 to Logic Low 2531/0531/ 0.2 0.8 TA = 25°C RL = 1.9 kΩ at Output 4534/0534 1.0 Propagation tPLH 2530/0530 1.3 1.5 µs TA = 25°C RL = 4.1 kΩ 5, 9, Delay Time 2.0 11 High to Logic 2531/0531/ 0.6 0.8 TA = 25°C RL = 1.9 kΩ at Output 4534/0534 1.0 Common |CMH| 2530/0530 1 10 kV/µs RL = 4.1 kΩ IF = 0 mA, 10 Mode Transient 2531/0531 1 10 RL = 1.9 kΩ TA = 25°C, Immunity at 4534/0534 15 30 RL = 1.9 kΩ VCM = 10 Vp-p Logic High Level Output Common |CML| 2530/0530 1 10 kV/µs RL = 4.1 kΩ IF = 0 mA, 10 Mode Transient 2531/0531 1 10 RL = 1.9 kΩ TA = 25°C, Immunity at 4534/0534 15 30 RL = 1.9 kΩ VCM = 10 Vp-p Logic Low Level Output Bandwidth BW 3 MHz RL = 100 kΩ 7, 8 Note 6, 7 6, 7 5, 6, 7 5, 6, 7 *All typicals at TA = 25°C. Package Characteristics Parameter Input-Output Momentary Withstand Voltage** Sym. VISO Device HCPL-2530/ 2531/4534 Option 020 Min. Typ.* Max. 2500 5000 Units V rms Test Conditions RH < 50%, t = 1 min., RH ≤ 45% VI-O = 500 Vdc, t=5s f = 1 MHz, TA = 25°C RH ≤ 45%, t = 5 s, VI-I = 500 Vdc Resistance (Input-Output) RI-O 1012 Ω Capacitance (Input-Output) Input-Input Insulation Leakage Current Resistance (Input-Input) Capacitance (Input-Input) CI-O 0.6 pF II-I 0.005 µA RI-I 1011 Ω 0.03 pF CI-I HCPL-2530/ 2531/4534 HCPL-0530/ 0531/0534 Fig. Note 3, 10 3, 11 3 12 4 4 f = 1 MHz 4 0.25 *All typicals at TA = 25°C. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification or Agilent Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage,” publication number 5963-2203E. 9 IO – OUTPUT CURRENT – mA 35 mA 30 mA 25 mA 5 20 mA 15 mA 10 mA IF = 5 mA 0 0 10 VO – OUTPUT VOLTAGE – V Figure 1. DC and Pulsed Transfer Characteristics. 20 7. 8. 9. VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dVCM /dt on the falling edge of the common mode pulse signal, VCM , to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and the 5.6 kΩ pull-up resistor. The 4.1 kΩ load represents 1 LSTTL unit load of 0.36 mA and the 6.1 kΩ pull-up resistor. The frequency at which the ac output voltage is 3 dB below the low frequency asymptote. Use of a 0.1 µF bypass capacitor connected between pins 5 and 8 is recommended. 10. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 3000 V rms for 1 second (leakage detection current limit, II-O ≤ 5 µA). 11. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second (leakage detection current limit, II-O ≤ 5 µA). 12. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together. 13. Derate linearly above 90°C free-air temperature at a rate of 3.0 mW/ °C for the SOIC-8 package. 1.5 1000 HCPL-2530/0530 HCPL-2531/0531/4534/0534 IF – FORWARD CURRENT – mA 40 mA TA = 25°C 10 VCC = 5.0 V 6. NORMALIZED CURRENT TRANSFER RATIO Notes: 1. Each channel. 2. CURRENT TRANSFER RATIO is defined as the ratio of output collector current, IO, to the forward LED input current, IF , times 100%. 3. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together and pins 5, 6, 7, and 8 shorted together. 4. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. 5. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt on the rising edge of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e., 1.0 0.5 NORMALIZED I F = 16 mA VO = 0.5 V VCC = 5 V TA = 25°C 0.1 0 1 10 100 IF – INPUT CURRENT – mA Figure 2. Current Transfer Ratio vs. Input Current. 100 IF TA = 25°C + VF – 10 1.0 0.1 0.01 0.001 1.1 1.2 1.3 1.4 1.5 1.6 VF – FORWARD VOLTAGE – VOLTS Figure 3. Input Current vs. Forward Voltage. 1.1 t P – PROPAGATION DELAY – ns 2000 1.0 0.9 NORMALIZED IF = 16 mA VO = 0.5 V VCC = 5 V TA = 25°C 0.8 0.7 HCPL-2530/0530 HCPL-2531/0531/4534/0534 0.6 -60 -40 -20 0 20 40 60 80 100 1000 t PLH t PHL 500 0 -60 -20 20 60 100 Figure 4. Current Transfer Ratio vs. Temperature. Figure 5. Propagation Delay vs. Temperature. 0.20 0.10 8 12 16 20 -5 10+2 10+1 10 0 10 -1 10 -2 -50 -25 0 +25 +50 +75 +100 TA = 25°C IF = 16 mA 24 RL = 100 Ω RL = 220 Ω RL = 470 Ω RL = 1 kΩ -10 -15 -20 -25 -30 0.01 0 4 IF = 0 VO = VCC = 5.0 V Figure 6. Logic High Output Current vs. Temperature. NORMALIZED RESPONSE –dB TA = 25°C, RL = 100 Ω, VCC = 5 V 0 10+3 TA – TEMPERATURE – °C 0 0.30 10+4 TA – TEMPERATURE – °C TA – TEMPERATURE – °C ∆ IO ∆ I F – SMALL SIGNAL CURRENT TRANSFER RATIO 1500 I F = 16 mA, VCC = 5.0 V HCPL-2530/0530 (R L = 4.1 kΩ) HCPL-2531/0531/4534/0534 (R L = 1.9 kΩ) IOH – LOGIC HIGH OUTPUT CURRENT – nA NORMALIZED CURRENT TRANSFER RATIO 10 0.1 1.0 10 f – FREQUENCY – MHz IF – QUIESCENT INPUT CURRENT – mA +5 V SET I F Figure 7. Small-Signal Current Transfer Ratio vs. Quiescent Input Current. 20 kΩ AC INPUT 1 8 2 7 3 6 2N3053 0.1 µF 560 Ω 100 Ω +5 V RL VO 0.1 µF 4 1.6 V dc 0.25 Vp-p ac Figure 8. Frequency Response. 5 11 PULSE GEN. ZO = 50 Ω t r = 5 ns IF 0 5V VO 1.5 V IF 8 2 7 3 6 +5 V RL 10% DUTY CYCLE 1/f < 100 µs 1.5 V VOL VO 0.1µF I F MONITOR 5 4 CL = 1.5 pF RM t PLH t PHL 1 Figure 9. Switching Test Circuit. B IF 1 8 2 7 3 6 4 5 +5 V A VCM 0V 10% 90% 90% 10% V FF tf tr VO 5V VO VOL SWITCH AT B: I F = 16 mA VCM + – PULSE GEN. Figure 10. Test Circuit for Transient Immunity and Typical Waveforms. tP – PROPAGATION DELAY – µs 2.0 I F = 10 mA I F = 16 mA VCC = 5.0 V TA = 25 °C 1.0 0.8 0.6 tPLH 0.4 t PHL 0.2 0.1 1 2 3 4 5 VO 0.1 µF SWITCH AT A: I F = 0 mA 3.0 RL 6 7 8 9 10 RL – LOAD RESISTANCE – kΩ Figure 11. Propagation Delay Time vs. Load Resistance. www.semiconductor.agilent.com Data subject to change. Copyright © 1999 Agilent Technologies Obsoletes 5966-1272E 5968-1090E (11/99)