Agilent HCPL-270L/ 070L/273L/073L Low Input Current High Gain LVTTL/LVCMOS Compatible 3.3 V Optocouplers Data Sheet Features • Low power consumption • High current transfer ratio • Low input current requirements – 0.5 mA Description These high gain series couplers use a Light Emitting Diode and an integrated high gain photodetector to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage result in LVTTL compatible saturation voltages and high speed operation. Where desired, the VCC and VO terminals may be tied together to achieve conventional photo- darlington operation. A base access terminal allows a gain bandwidth adjustment to be made. These optocouplers are for use in LVTTL/LVCMOS or other low power applications. A 400% minimum current transfer ratio is guaranteed over 0 to +70˚C operating range for only 0.5 mA of LED current. • LVTTL/LVCMOS compatible output • Performance guaranteed over temperature 0˚C to +70˚C • Base access allows gain bandwidth adjustment • High output current – 60 mA • Safety approval, UL, VDE, CSA (pending) Applications • Ground isolate most logic families – LVTTL/LVCMOS • Low input current line receiver Functional Diagram • High voltage insulation • EIA RS-232C line receiver HCPL-270L/070L NC 1 • Telephone ring detector HCPL-273L/073L 8 VCC ANODE 1 1 8 VCC ANODE 2 7 VB CATHODE 1 2 7 VO1 CATHODE 3 6 VO CATHODE 2 3 6 VO2 NC 4 5 GND • 117 V AC line voltage status indicator – low input power dissipation • Low power systems – ground isolation 5 GND ANODE 2 4 SHIELD TRUTH TABLE LED VO ON LOW OFF HIGH A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. The HCPL-070L and HCPL-073L are surface mount devices packaged in an industry standard SOIC-8 footprint. The SOIC-8 does not require "through holes" in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. Ordering Information Specify Part Number followed by Option Number (if desired). Example: HCPL-270L #XXX 060 = VDE 0884 VIORM = 630 Vpeak Option 500 = Tape and Reel Packaging Option Option data sheets available. Contact your Agilent sales representative or authorized distributor for information. Selection Guide 8-Pin DIP (300 Mil) Single Channel Dual Channel Package HCPLPackage HCPL270L 273L Small Outline SO-8 Single Channel Dual Channel Package HCPLPackage HCPL070L 073L Minimum Input ON Current (IF) 0.5 mA 1.6 mA Minimum CTR 400% 300% Schematic 1 I CC I F1 + 8 VCC VF1 VCC 8 – 2 ANODE I O1 VO1 2 ICC 7 IF 3 + I F2 – I O2 VF CATHODE – 6 VF2 IO 3 6 VO VO2 + 4 5 SHIELD 2 5 SHIELD IB 7 VB HCPL-270L/HCPL-070L GND GND USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED BETWEEN PINS 5 AND 8 IS RECOMMENDED HCPL-273L/HCPL-073L Package Outline Drawings 8-Pin DIP Package 7.62 ± 0.25 (0.300 ± 0.010) 9.65 ± 0.25 (0.380 ± 0.010) TYPE NUMBER 8 7 6 5 OPTION CODE* 6.35 ± 0.25 (0.250 ± 0.010) DATE CODE A XXXXZ YYWW RU 1 1.19 (0.047) MAX. 2 3 4 UL RECOGNITION 1.78 (0.070) MAX. 5° TYP. 4.70 (0.185) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 0.51 (0.020) MIN. 2.92 (0.115) MIN. 1.080 ± 0.320 (0.043 ± 0.013) 3 0.65 (0.025) MAX. 2.54 ± 0.25 (0.100 ± 0.010) DIMENSIONS IN MILLIMETERS AND (INCHES). *MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 OPTION NUMBERS 300 AND 500 NOT MARKED. Small Outline SO-8 Package 8 7 6 5 5.994 ± 0.203 (0.236 ± 0.008) XXX YWW 3.937 ± 0.127 (0.155 ± 0.005) TYPE NUMBER (LAST 3 DIGITS) DATE CODE PIN ONE 1 2 3 4 0.406 ± 0.076 (0.016 ± 0.003) 1.270 BSG (0.050) * 5.080 ± 0.127 (0.200 ± 0.005) 7° 3.175 ± 0.127 (0.125 ± 0.005) 45° X 0.432 (0.017) 0 ~ 7° 0.228 ± 0.025 (0.009 ± 0.001) 1.524 (0.060) 0.203 ± 0.102 (0.008 ± 0.004) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 5.207 ± 0.254 (0.205 ± 0.010) 0.305 MIN. (0.012) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. TEMPERATURE – °C Solder Reflow Temperature Profile (Surface Mount Option Parts) 260 240 220 200 180 160 140 120 100 80 ∆T = 145°C, 1°C/SEC ∆T = 115°C, 0.3°C/SEC UL Approval (pending) under UL 1577, Component Recognition Program, File E55361. 60 40 20 0 Regulatory Information The devices contained in this data sheet are pending by the following organizations: 0 1 ∆T = 100°C, 1.5°C/SEC CSA 2 Approval (pending) under CSA Component Acceptance Notice #5, File CA 88324. 3 4 5 6 7 8 9 10 11 12 TIME – MINUTES (NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS HIGHLY RECOMMENDED.) VDE Approval (pending) according to VDE 0884/06.92. 4 Insulation and Safety Related Specifications Parameter Minimum External Air Gap (External Clearance) Minimum External Tracking (External Creepage) Minimum Internal Plastic Gap (Internal Clearance) Minimum Internal Tracking (Internal Creepage) Tracking Resistance (Comparative Tracking Index) Isolation Group Symbol L (101) 8-Pin DIP (300 Mil) Value 7.1 SO-8 Value 4.9 Units mm L (102) 7.4 4.8 mm 0.08 0.08 mm NA NA mm 200 200 Volts IIIa IIIa CTI Conditions Measured from input terminals to output terminals, shortest distance through air. Measured from input terminals to output terminals, shortest distance path along body. Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Measured from input terminals to output terminals, along internal cavity. DIN IEC 112/VDE 0303 Part 1. Material Group (DIN VDE 0110, 1/89, Table 1). VDE 0884 Insulation Related Characteristics Description Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤ 300 V rms for rated mains voltage ≤ 450 V rms Climatic Classification Pollution Degree (DIN VDE 0110/1.89) Maximum Working Insulation Voltage Input to Output Test Voltage, Method b* VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec, Partial Discharge < 5 pC Input to Output Test Voltage, Method a* VPR = 1.5 x VIORM, Type and Sample Test, tP = 60 sec, Partial Discharge < 5 pC Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 11, Thermal Derating curve.) Case Temperature Current (Input Current IF, P S = 0) Output Power Insulation Resistance at TS, V IO = 500 V Symbol Characteristic Units VIORM I-IV I-III 55/100/21 2 630 Vpeak VPR 1181 Vpeak VPR 945 Vpeak VIOTM 6000 Vpeak TS IS,INPUT PS,OUTPUT RS 175 400 600 ≥ 109 ˚C mA mW Ω *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, (VDE 0884), for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. 5 Absolute Maximum Ratings (No Derating Required up to +85˚C) Parameter Storage Temperature Operating Temperature Average Forward Input Current Peak Forward Input Current (50% Duty Cycle, 1 ms Pulse Width) Peak Transient Input Current (< 1 µs Pulse Width, 300 pps) Reverse Input Voltage Input Power Dissipation Output Current (Pin 6) Emitter Base Reverse Voltage (Pin 5-7) Supply Voltage and Output Voltage Output Power Dissipation Total Power Dissipation Lead Solder Temperature (for Through Hole Devices) Reflow Temperature Profile (for SOIC-8 and Option #300) Symbol TS TA IF(AVG) IF(PEAK) IF(TRAN) 6 Symbol VCC IF(ON) VF(OFF) TA Min. 2.7 0.5 0 0 Max. 125 85 20 40 Units ˚C ˚C mA mA 1.0 A VR 5 V PI 35 mW IO 60 mA VEB 0.5 V VCC –0.5 7 V PO 100 mW PT 135 mW 260˚C for 10 sec., 1.6 mm below seating plane. See Package Outline Drawings section. Recommended Operating Conditions Parameter Power Supply Voltage Forward Input Current (ON) Forward Input Voltage (OFF) Operating Temperature Min. –55 –40 Max. 3.3 12.0 0.8 70 Units V mA V ˚C Electrical Specifications 0˚C ≤ TA ≤ +70˚C, 2.7 V ≤ VCC ≤ 3.3 V, 0.5 mA ≤ IF(ON) ≤ 12 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise specified. All typicals at TA = 25˚C. (See Note 8.) Device Parameter Sym. HCPLCurrent Transfer CTR Ratio Logic Low VOL Output Voltage Logic High Output Current Logic Low Supply Current Logic High Supply Current Input Forward Voltage Input Reverse Breakdown Voltage Input Capacitance Min. Typ.* Max. Units 400 1300 5000 % VCC = 3.3 V VO = 0.4 V VCC = 3.3 V Fig. Note 1, 2 2 0.05 0.3 V 0.05 0.4 V IOH 5 25 µA IF = 1.6 mA, IO = 8 mA IF = 5.0 mA, IO = 15 mA VO = V CC = 3.3 V ICCL 270L/070L 0.0015 0.15 mA VCC = 3.3 V IF1 = IF2 = 1.6 mA VO1 = VO2 = Open 273L/073L 270L/070L 0.0015 0.3 0.002 1 mA µA VCC = 3.3 V IF1 = IF2 = 0 mA VO1 = VO2 = Open 273L/073L 0.002 2 1.5 1.7 µA V TA = 25˚C IF = 1.6 mA V IR = 10 µA, TA = 25˚C 2 pF f = 1 MHz, VF = 0 2 ICCH VF BVR CIN 5.0 60 *All typical values at TA = 25˚C and VCC = 3.3 V, unless otherwise noted. 7 Test Conditions IF = 0.5 mA IF = 0 mA 2 3, 4 Switching Specifications (AC) Over Recommended Operating Conditions (TA = 0˚C to +70˚C), VCC = 3.3 V, unless otherwise specified. (See Note 8.) Parameter Propagation Delay Time to Logic Low at Output Propagation Delay Time to Logic High at Output Common Mode Transient Immunity at Logic High Level Output Common Mode Transient Immunity at Logic Low Level Output Sym. tPHL Device HCPL- Min. Typ.* Max. Units µs 30 tPLH 90 µs Fig. Note 5 2 IF = 0.5 mA Rl = 4.7 kΩ TA = 25˚C 5 2 IF = 0.5 mA, RL = 4.7 kΩ |CMH| 1000 10000 V/µs IF = 0 mA, TA = 25˚C, Rl = 2.2 kΩ |VCM | = 10 Vp-p 6 2, 6, 7 |CML| 1000 10000 V/µs IF = 1.6 mA, TA = 25˚C, Rl = 2.2 kΩ |VCM | = 10 Vp-p 6 2, 6, 7 *All typical values at TA = 25˚C and VCC = 3.3 V, unless otherwise noted. 8 Test Conditions TA = 25˚C Package Characteristics Parameter Sym. Input-Output VISO Momentary Withstand Voltage** Resistance RI-O (Input-Output) Capacitance CI-O (Input-Output) Input-Input II-I Insulation Leakage Current Input-Input RI-I Insulation Leakage Current Capacitance CI-I (Input-Input) Device HCPL- Min. 2500 Typ.* Max. Units V rms Test Conditions RH ≤ 50%, t = 1 min., TA = 25˚C 1012 Ω 0.6 pF VI-O = 500 Vdc RH ≤ 45% f = 1 MHz µA 0.005 2730 2731 0730 0731 RH ≤ 45% VI-I = 500 Vdc Fig. Note 4, 9 4 11 5 1011 Ω 5 0.03 pF 5 0.25 *All typical values at TA = 25˚C, unless otherwise noted. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification or Agilent Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage." Notes: 1. Pin 5 should be the most negative voltage at the detector side. 2. Each channel. 3. DC CURRENT TRANSFER RATIO (CTR) is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100%. 4. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together. 5. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. 6. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e., V O > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). 7. In applications where dV/dt may exceed 50,000 V/µs (such as static discharge) a series resistor, R CC, should be included to protect the detector IC from destructively high surge currents. The recommended value is RCC = 110 Ω. 8. Use of a 0.1 µF bypass capacitor connected between pins 5 and 8 adjacent to the device is recommended. 9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 3000 V rms for 1 second (leakage detection current limit, II-O < 5 µA). 10. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage detection current limit, II-O < 5 µA). 11. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together. 12. Derate linearly above 65˚C free-air temperature at a rate of 2.3 mW/˚C for the SO-8 package. 9 25°C 1600 70°C -40°C 1200 800 400 VCC = 3.3 V VO = 0.4 V 0 0.1 1.0 10 IF – FORWARD CURRENT – mA Figure 1. Current transfer ratio vs. forward current. VF – FORWARD VOLTAGE – V 1.6 IF = 1.6 mA 1.5 1.4 1.3 1.2 -60 -40 -20 0 20 40 60 80 100 TA – TEMPERATURE – °C Figure 4. Forward voltage vs. temperature. 10 100 IF – FORWARD CURRENT – mA 70°C IO – OUTPUT CURRENT – mA CTR – CURRENT TRANSFER RATIO – % 1000 85°C 2000 10 TA = 85° C 1.0 0.1 0.01 0.01 TA = 70° C TA = 25° C TA = 0° C TA = -40° C 0.1 1 10 IF – INPUT DIODE FORWARD CURRENT – mA Figure 2. Output current vs. input diode forward current. 100 IF + VF – 10 1.0 TA = 85°C TA = 70°C 0.1 TA = 25°C 0.01 0.001 1.1 TA = 0°C TA = -40°C 1.2 1.3 1.4 1.5 VF – FORWARD VOLTAGE – V Figure 3. Input diode forward current vs. forward voltage. 1.6 IF PULSE GEN. ZO = 50 Ω t r = 5 ns 0 3.3 V VO (SATURATED RESPONSE) 50% IF 10% DUTY CYCLE I/f < 100 µs 50% 1 8 2 7 3 6 3.3 V RL VO VOL t PHL t PLH 0.1 µF I F MONITOR 5 4 CL = 15 pF* RM VO 3.3 V 90% (NON-SATURATED RESPONSE) 10% * INCLUDES PROBE AND FIXTURE CAPACITANCE 90% 10% tf tr Figure 5. Switching test circuit. VCM 10 V 0 V 10% IF tr, tf = 16 ns 90% 90% tr VO 8 RCC (SEE NOTE 6) +3.3 V 2 7 RL 3 6 4 5 B 10% tf A 3.3 V VFF SWITCH AT A: IF = 0 mA VO 1 VCM VOL SWITCH AT B: IF = 1.6 mA + – PULSE GEN. Figure 6. Test circuit for transient immunity and typical waveforms. 11 VO www.semiconductor.agilent.com Data subject to change. Copyright © 2000 Agilent Technologies 5988-0282EN (10/00) WWW.ALLDATASHEET.COM Copyright © Each Manufacturing Company. All Datasheets cannot be modified without permission. This datasheet has been download from : www.AllDataSheet.com 100% Free DataSheet Search Site. Free Download. No Register. Fast Search System. www.AllDataSheet.com