05157 LC0404FC3.3C thru LC0404FC24C . . . engineered solutions for the transient environment™ BIDIRECTIONAL LOW CAPACITANCE FLIP CHIP APPLICATIONS ✔ Cellular Phones ✔ Handheld Electronics ✔ Personal Digital Assistants (PDAs) ✔ Notebook Computers ✔ SMART Cards IEC COMPATIBILITY (EN61000-4) 0404 ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns (Single Chip Shown) FEATURES ✔ ESD Protection > 25 kilovolts ✔ Available in Six Voltage Types Ranging From 3.3V to 24V ✔ 200 Watts Peak Pulse Power Dissipation per Line (8/20µs) ✔ Low Clamping Voltage ✔ LOW CAPACITANCE ✔ LOW STANDBY CURRENT MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0404 ✔ Weight 0.73 milligrams (Approximate) ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) CIRCUIT DIAGRAM 05157.R2 11/02 1 www.protekdevices.com LC0404FC3.3C thru LC0404FC24C DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 200 Watts Operating Temperature TJ -55°C to 150°C °C TSTG -55°C to 150°C °C PARAMETER Storage Temperature ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (See Note 1) LC0404FC3.3C LC0404FC05C LC0404FC08C LC0404FC12C LC0404FC15C LC0404FC24C RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) VWM VOLTS @ 1mA V(BR) VOLTS @ IP = 1A VC VOLTS 3.3 5.9 8.0 12.0 15.0 24.0 4.0 6.0 8.0 13.3 16.7 26.7 7.0 11.0 13.2 19.8 25.4 37.2 MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE @8/20µs VC @ IPP @VWM ID µA 0V @ 1 MHz C pF 12.5V @ 16A 13V @ 15A 18V @ 11A 26.9V @ 7.4A 34.5V @ 5.8A 50.6V @ 4A 75 10 1 1 1 1 70 35 32 30 25 20 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Electrical characteristics for 3V, 8V, 12V, 15V and 24V devices are preliminary. FIGURE 1 PEAK PULSE POWER VS PULSE TIME 120 IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 10,000 1,000 200W, 8/20µs Waveform 100 10 0.01 05157.R2 11/02 FIGURE 2 PULSE WAVE FORM tf 100 Peak Value IPP 80 e-t TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs 60 40 td = t I /2 PP 20 0 1 10 100 td - Pulse Duration - µs 1,000 10,000 2 0 5 10 15 t - Time - µs 20 25 www.protekdevices.com 30 LC0404FC3.3C thru LC0404FC24C GRAPHS FIGURE 3 POWER DERATING CURVE 100 Peak Pulse Power 8/20µs 80 % Of Rated Power FIGURE 4 REFLOW SOLDER PROFILE 225°C 5-10 sec 60 200°C Instantaneous to 200°C 40 1-2 Minutes to 150°C 20 1-2 Minutes to 25°C 100°C Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - °C 150 Pre-Heat Time Soldering Time Cool Down Time Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material. FIGURE 5 OVERSHOOT & CLAMPING VOLTAGE FOR LC0404FC05C 40 5 Volts per Division 30 20 10 0 ESD Test Pulse - 12 kilovolt, 1/30ns (waveshape) FIGURE 6 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0404FC05C VC - Clamping Voltage - Volts 14 12 10 8 6 4 2 0 0 5 10 15 20 IPP - Peak Pulse Current - Amps 05157.R2 11/02 3 www.protekdevices.com LC0404FC3.3C thru LC0404FC24C PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE 0404 SIDE PACKAGE DIMENSIONS DIM MILLIMETERS INCHES A 0.56 NOM 0.022 NOM B 0.86 NOM 0.034 NOM C 1.0 ± 0.02 0.039 ± 0.001 G B TOP C A Picture Not Available E F H END I E 0.15 SQ 0.006 SQ F 1.0 ± 0.0254 0.039 ± 0.001 G 0.15 NOM 0.006 NOM H 0.127 MAX 0.005 MAX I D MOUNTING PAD LAYOUT - Option 1 A C DIM Millimeters A C D E F G H I DIE SOLDER BUMP 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 Inches 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020 0.003 MIN 0.406 NOM 0.016 NOM NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). TAPE & REEL ORIENTATION E NOTE: Preferred: Using 0.1mm (0.004”) stencil. G H PAD DIMENSIONS 0.076 MIN I Dual Die - 0404 F NOTE: 1. Top view of tape. Solder bumps are face down in tape package. SOLDER PADS SOLDER PRINT 0.010” - 0.012” DIA. SOLDER MASK 06022 Rev 3 - 11/02 TAPE & REEL ORDERING INFORMATION: Surface mount product is taped and reeled in accordance with EIA-481. Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., LC0404FC05C-T75-1). Paper Tape: 7 Inch Reels - 10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., LC0404FC05C-T710-2). 05157.R2 11/02 4 www.protekdevices.com LC0404FC3.3C thru LC0404FC24C PACKAGE OUTLINE & DIMENSIONS MOUNTING PAD LAYOUT - Option 2 PAD DIMENSIONS A COPPER CONTACTS 0.009” [0.23] DIA. Millimeters Inches A F 0.51 0.15 SQ 0.020 0.006 SQ G H 0.71 0.99 0.028 0.039 I 0.51 0.020 NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Preferred: Using 0.1mm (0.004”) G H DIE SOLDER BUMP DIM I F stencil. SOLDER PRINT 0.014” - [0.36] DIA. SOLDER MASK 06022 Rev 3 - 11/02 COPYRIGHT © ProTek Devices 2003 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. 05157.R2 11/02 5 ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com www.protekdevices.com