AGILENT HCPL7520

Agilent HCPL-7520
Isolated Linear Sensing IC
Data Sheet
Description
The HCPL-7520 isolated linear
current sensing IC family is
designed for current sensing in
low-power electronic motor
drives. In a typical implementation, motor current flows through
an external resistor and the
resulting analog voltage drop is
sensed by the HCPL-7520. An
output voltage is created on the
other side of the HCPL-7520
optical isolation barrier. This
single-ended output voltage is
proportional to the motor
current. Since common-mode
voltage swings of several hundred
volts in tens of nanoseconds are
common in modern switching
inverter motor drives, the HCPL7520 was designed to ignore very
high common-mode transient
slew rates (of at least 10 kV/µs).
The high CMR capability of the
HCPL-7520 isolation amplifier
provides the precision and
stability needed to accurately
monitor motor current in high
noise motor control environments, providing for smoother
control (less “torque ripple”) in
various types of motor control
applications.
Functional Diagram
IDD1
VDD1
1
VIN+
2
+
VIN–
3
–
GND1
4
IDD2
8
VDD2
+
7
VOUT
–
6
VREF
5
GND2
SHIELD
The product can also be used for
general analog signal isolation
applications. For general
applications, we recommend the
HCPL-7520 (gain tolerance of
±5%). The HCPL-7520 utilizes
sigma delta (Σ-∆) analog-todigital converter technology to
delivery offset and gain accuracy
and stability over time and
temperature. This performance is
delivered in a compact, autoinsert, 8-pin DIP package that
meets worldwide regulatory
safety standards. (A gull-wing
surface mount option #300 is
also available).
Features
• 15 kV/µs common-mode rejection
at Vcm = 1000 V
• Compact, auto-insertable 8-pin
DIP package
• 60 ppm/°C gain drift vs.
temperature
• –0.6 mV input offset voltage
• 8 µV/°C input offset voltage vs.
temperature
• 100 kHz bandwidth
• 0.06% nonlinearity, single-ended
amplifer oon
• Worldwide safety approval:
UL 1577 (3750 Vrms/1 min.) and
CSA (pending), DIN EN 60747-5-2
(Option #060 only pending)
• Advanced sigma-delta (Σ-∆)
A/D converter technology
Applications
• Low-power inverter current
sensing
• Motor phase and rail current
sensing
• Switched mode power supply
signal isolation
• General purpose low-power
current sensing and monitoring
• General purpose analog signal
isolation
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and /or degradation which may be induced by ESD.
Ordering Information
Specify part number followed by option number (if desired).
Example:
HCPL-7520-XXX
No option = Standard DIP package, 50 per tube.
300 = Gull Wing Surface Mount Option, 50 per tube.
500 = Tape and Reel Packaging Option.
060 = DIN EN 60747-5-2 Option.
Package Outline Drawings
HCPL-7520 Standard DIP Package
9.80 ± 0.25
(0.386 ± 0.010)
8
7
6
5
DATE CODE
A 7520
YYWW
1
1.19 (0.047) MAX.
2
3
4
7.62 ± 0.25
(0.300 ± 0.010)
1.78 (0.070) MAX.
6.35 ± 0.25
(0.250 ± 0.010)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
2
5° TYP.
0.20 (0.008)
0.33 (0.013)
HCPL-7520 Gull Wing Surface Mount Option 300 Outline Drawing
PAD LOCATION (FOR REFERENCE ONLY)
9.80 ± 0.25
(0.386 ± 0.010)
8
7
6
1.016 (0.040)
1.194 (0.047)
5
4.826 TYP.
(0.190)
A 7520
6.350 ± 0.25
(0.250 ± 0.010)
YYWW
1
2
3
9.398 (0.370)
9.960 (0.390)
4
0.381 (0.015)
0.635 (0.025)
1.194 (0.047)
1.778 (0.070)
9.65 ± 0.25
(0.380 ± 0.010)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
7.62 ± 0.25
(0.300 ± 0.010)
0.20 (0.008)
0.33 (0.013)
4.19 MAX.
(0.165)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
(0.025 ± 0.005)
2.54
(0.100)
BSC
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
DIMENSIONS IN MILLIMETERS (INCHES).
TOLERANCES (UNLESS OTHERWISE SPECIFIED): xx.xx = 0.01
xx.xxx = 0.005
LEAD COPLANARITY
MAXIMUM: 0.102 (0.004)
Solder Reflow Temperature Profile
300
TEMPERATURE (°C)
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
200
2.5°C ± 0.5°C/SEC.
30
SEC.
160°C
150°C
140°C
SOLDERING
TIME
200°C
30
SEC.
3°C + 1°C/–0.5°C
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
TIME (SECONDS)
3
200
250
Regulatory Information
The HCPL-7520 is pending
approval by the following
organizations:
DIN EN
Pending approval under DIN EN
60747-5-2 with VIORM = 891 VPEAK.
UL
Pending approval under UL 1577,
component recognition program
up to VISO = 3750 VRMS expected
prior to product release. File
E55361.
CSA
Pending approval under CSA
Component Acceptance Notice
#5, File CA 88324 expected prior
to product release.
DIN EN 60747-5-2 Insulation Characteristics[1]
Description
Symbol
Characteristic Unit
Installation classification per DIN EN 0110-1/1997-04, Table 1
for rated mains voltage ≤ 150 Vrms
for rated mains voltage ≤ 300 Vrms
for rated mains voltage ≤ 600 Vrms
I – IV
I – III
I – II
Climatic Classification
55/100/21
Pollution Degree (DIN EN 0110-1/1997-04)
2
Maximum Working Insulation Voltage
VIORM
891
Vpeak
Input to Output Test Voltage, Method b[2]
VIORM x 1.875 = VPR, 100% production test with tm = 1 sec, partial discharge <5 pC
VPR
1670
Vpeak
Input to Output Test Voltage, Method a[2]
VIORM x 1.5 = VPR, type and sample test, tm = 60 sec, partial discharge <5 pC
VPR
1336
Vpeak
Highest Allowable Overvoltage (transient overvoltage tini = 10 sec)
VIOTM
6000
Vpeak
Safety-limiting values – maximum values allowed in the event of a failure.
Case Temperature
Input Current[3]
Output Power[3]
TS
175
IS, INPUT
400
PS, OUTPUT 600
Insulation Resistance at TS, VIO = 500 V
RS
>109
°C
mA
mW
Ω
OUTPUT POWER – PS, INPUT CURRENT – IS
Notes:
1. Insulation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits within the
application. Surface Mount Classifications is Class A in accordance with CECC00802.
2. Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section, (DIN EN
60747-5-2) for a detailed description of Method a and Method b partial discharge test profiles.
3. Refer to the following figure for dependence of PS and IS on ambient temperature.
800
PS (mW)
IS (mA)
700
600
500
400
300
200
100
0
0
25
50
75 100 125 150 175 200
TS – CASE TEMPERATURE – °C
4
Insulation and Safety Related Specifications
Parameter
Symbol
Value
Unit
Conditions
Minimum External Air Gap
(clearance)
L(101)
7.4
mm
Measured from input terminals to output terminals,
shortest distance through air.
Minimum External Tracking
(creepage)
L(102)
8.0
mm
Measured from input terminals to output terminals,
shortest distance path along body.
0.5
mm
Through insulation distance conductor to conductor,
usually the straight line distance thickness between the
emitter and detector.
>175
V
DIN IEC 112 Part 1
Minimum Internal Plastic Gap
(internal clearance)
Tracking Resistance
(comparative tracking index)
CTI
Isolation Group
IIIa
Material Group (DIN EN 0110-1/1997-04)
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
TS
–55
125
°C
Operating Temperature
TA
–40
100
°C
Supply Voltage
VDD1_max, VDD1_max
0
6
V
Steady-State Input Voltage
VIN+, VIN-
–2.0
VDD1 + 0.5-
V
Two Second Transient Input Voltage
VIN+, VIN-
–6.0
VDD1 + 0.5-
V
Output Voltage
VOUT
–0.5
VDD2 + 0.5-
V
Reference Input Voltage
VREF
0.0
VDD2 + 0.5-
V
Reference Input Current
IREF
20-
mA
Lead Solder Temperature
260°C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile
See Package Outline Drawings section
Note
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Operating Temperature
TA
–40
85
°C
Supply Voltage
VDD1, VDD2
4.5
5.5
V
Input Voltage (accurate and linear)
VIN+, VIN-
–200
200
mV
Input Voltage (functional)
VIN+, VIN-
–2.0
2.0
V
Reference Input Voltage
VREF
4.0
VDD2
V
5
Note
Electrical Specifications (DC)
Unless otherwise noted, all typicals and figures are at the nominal operation conditions of VIN+ = 0 V,
VIN- = 0 V, VREF = 4.0 V, VDD1 = VDD2 = 5.0 V and TA = 25°C; all Minimum/Maximum specifications are within the
Recommended Operating Conditions.
Parameter
Symbol
Min.
Typ.
Max.
Units
Test
Conditions
Fig.
Note
Input Offset Voltage
VOS
–6
–1
6
mV
VIN+ = 0 V
6
1
Magnitude of Input Offset
Change vs. Temperature
∆Vos/∆T
8
20
µV/°C
Gain
G
VREF/0.512
+ 5%
V/V
-0.2 V < VIN+ 8
< 0.2 V
TA = 25°C
Magnitude of Gain Change
vs. Temperature
∆G/∆T
60
300
ppm/°C
-0.2 V < VIN+ 9
< 0.2 V
VOUT 200 mV Nonlinearity
NL200
0.06
0.55
%
-0.2 V < VIN+ 10
< 0.2 V
Magnitude of VOUT 200 mV
Nonlinearity Change
vs. Temperature
|dNL200/dT|
0.0004
%/°C
-0.2 V < VIN+ 11
< 0.2 V
VOUT 100 mV Nonlinearity
NL100
0.04
0.4
%
-0.1 V < VIN+
< 0.1 V
Input Supply Current
IDD1
11.7
16
mA
1,2,3
Output Supply Current
IDD2
9.9
16
mA
1,2,3
Reference Voltage Input
Current
IREF
0.26
1
mA
Input Current
IIN+
–0.6
5
µA
Magnitude of Input Bias
Current vs. Termperature
Coefficient
|dIIN/dT|
0.45
nA/°C
Maximum Input Voltage
before VOUT Clipping
|VIN+|MAX
256
mV
Equivalent Input Impedance
RIN
700
kΩ
VOUT Output Impedance
ROUT
15
Ω
Input DC Common-Mode
Rejection Ratio
CMRRIN
63
dB
6
VREF/0.512
– 5%
7
VIN+ = 0 V
2
3,4
3,5
4
5
7
Switching Specifications (AC)
Over recommended operating conditions unless otherwise specified.
Parameter
Symbol Min.
Typ.
Max.
Units
Test Conditions
Fig. Note
VIN to VOUT Signal Delay (50 – 10%)
tPD10
2.2
4
µs
VIN+ = 0 mV to 200 mV step
13
VIN to VOUT Signal Delay (50 – 50%)
tPD50
3.4
5
µs
VIN to VOUT Signal Delay (50 – 90%)
tPD90
5.2
9.9
µs
VOUT Rise Time (10 – 90%)
tR
3.0
7
µs
VOUT Fall Time (10 – 90%)
tF
3.2
7
µs
VOUT Bandwidth (-3 dB)
BW
VIN+ = 200 mVpk-pk
14
VOUT Noise
NOUT
Common Mode Transient
Immunity
CMTI
50
10
100
kHz
31.5
mVrms VIN+ = 0 V
15
kV/µs
TA = 25°C, VCM = 1000 V
15
Package Characteristics
Parameter
Symbol
Min.
Input-Output Momentary
Withstand Voltage
VISO
3750
Input-Output Resistance
RI-O
Input-Output Capacitance
CI-O
Typ.
Max.
Units
Test Conditions
Vrms
TA = 25°C, RH < 50%
>109
Ω
VI-O = 500 V
1.4
pF
Freq = 1 MHz
Fig.
Note
6
Notes:
General Note: Typical values were taken from a sample of nominal units operating at nominal conditions (VDD1 = VDD2 = 5 V, VREF = 4.0 V,
Temperature = 25°C) unless otherwise stated. Nominal plots shown from Figure 1 to 11 represented the drift of these nominal units from their
nominal operating conditions.
1. Input Offset Voltage is defined as the DC Input Voltage required to obtain an output voltage of VREF/2.
2. Gain is defined as the slope of the best-fit line of the output voltage vs. the differential input voltage (VIN+ - VIN-) over the specified input range.
Gain is derived from VREF/512 mV; e.g. VREF = 5.0, gain will be 9.77 V/V.
3. Nonlinearity is defined as half of the peak-to-peak output deviation from the best-fit gain line, expressed as a percentage of the full-scale output
voltage range.
4. NL200 is the nonlinearity specified over an input voltage range of ±200 mV.
5. NL100 is the nonlinearity specified over an input voltage range of ±100 mV.
6. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥4500 Vrms for 1 second (leakage detection
current limit, II-O < 5 µA). This test is performed before the 100% production test for the partial discharge (method b) shown in
DIN EN 60747-5-2 Insulation Characteristic Table, if applicable.
7. CMRR is defined as the ratio of the differential signal gain (signal applied differentially between pins 2 and 3) to the common-mode gain (input
pins tied together and the signal applied to both inputs at the same time), expressed in dB.
7
12
11
10
IDD1
IDD2
4.7
4.9
5.3
5.1
10.5
11.0
10.0
9.5
9.0
8.5
IDD1
8.0
IDD2
7.5
7.0
-40
5.5
0.2
4.0
0
3.5
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
-0.1
0
0.1
0.2
80
1.0
0.5
0
-0.5
-1.0
2.0
1.5
1.0
0.5
-0.2
-0.1
0
0.1
0.2
0.3
20
40
60
80
IDD2
5.0
100
TA – TEMPERATURE – °C
Figure 7. Input offset change vs. temperature.
-0.2
-0.1
0
0.1
0.2
0.3
2.5
2.0
VDD1
1.5
VDD2
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
4.5
4.7
4.9
5.1
5.3
5.5
VDD – SUPPLY VOLTAGE – V
Figure 6. Input offset change vs. supply
voltage.
0.7
0.6
VDD1
0.015
VDD2
0.010
0.005
0
-0.010
4.5
IDD1
6.0
Figure 3. Supply current vs. input voltage.
-0.005
-1.5
0
7.0
VIN – INPUT VOLTAGE – V
0.020
TYPICAL
MAXIMUM
-20
8.0
4.0
-0.3
100
Figure 5. Output voltage vs. input voltage.
2.0
1.5
9.0
VIN – INPUT VOLTAGE – V
∆GAIN – GAIN CHANGE – %
∆VOS – INPUT OFFSET CHANGE – mV
60
2.5
0
-0.3
0.3
Figure 4. Input current vs. input voltage.
8
40
3.0
VIN – INPUT VOLTAGE – V
-2.0
-40
20
Figure 2. Supply current vs. temperature.
VO – OUTPUT VOLTAGE – V
IIN – INPUT CURRENT – µA
Figure 1. Supply current vs. supply voltage.
-0.2
0
10.0
TA – TEMPERATURE – °C
VDD – SUPPLY VOLTAGE – V
-1.4
-0.3
-20
∆GAIN – GAIN CHANGE – %
8
4.5
12.0
∆VOS – INPUT OFFSET CHANGE – µV
9
11.0
IDD – SUPPLY CURRENT – mA
IDD – SUPPLY CURRENT – mA
IDD – SUPPLY CURRENT – mA
13
4.7
4.9
5.1
5.3
VDD – SUPPLY VOLTAGE – V
Figure 8. Gain change vs. supply voltage.
5.5
0.5
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-40
-20
0
20
40
60
80
TA – TEMPERATURE – °C
Figure 9. Gain change vs. temperature.
100
0.09
0.048
NL – NONLINEARITY – %
0.046
0.044
VDD1
0.042
VDD2
0.040
4.5
4.7
4.9
5.1
5.3
0.08
0.07
0.06
0.05
-40
5.5
-20
VDD – SUPPLY VOLTAGE – V
Figure 10. Nonlinearity vs. supply voltage.
40
VDD2
1
0.1 µF
7
2
VOUT
HCPL-7520
6
3
4
60
80
100
6
8
0.1 µF
0.1 µF
20
Figure 11. Nonlinearity vs. temperature.
VDD1
VIN
0
TA – TEMPERATURE – °C
5
VREF
TPD – PROPAGATION DELAY – µs
NL – NONLINEARITY – %
0.050
5
4
3
2
Tp5010
Tp5050
Tp5090
Trise
1
0
-40
-20
0
20
40
80
60
100
TA – TEMPERATURE – °C
Figure 12. Propagation delay test circuit.
Figure 13. Propagation delay vs. temperature.
VDD2
78L05
IN OUT
0.1
µF
1
0.1
µF
0
1
0.1 µF
2
-1
-2
7
3
6
4
5
-3
-4
-5
-6
0.1
PULSE GEN.
1.0
10.0
100.0
Figure 14. Bandwidth.
9
–
+
1000.0
VCM
FREQUENCY – kHz
Figure 15. CMTI test circuit.
VOUT
HCPL-7520
9V
GAIN – dB
8
VREF
Application Information
Power Supplies and Bypassing
The recommended supply
connections are shown in Figure 16.
A floating power supply (which in
many applications could be the
same supply that is used to drive
the high-side power transistor) is
regulated to 5 V using a simple
zener diode (D1); the value of
resistor R4 should be chosen to
supply sufficient current from
the existing floating supply. The
voltage from the current sensing
resistor (Rsense) is applied to the
input of the HCPL-7520 through
an RC anti-aliasing filter (R2 and
C2). Although the application circuit
is relatively simple, a few recommendations should be followed
to ensure optimal performance.
The power supply for the
HCPL -7520 is most often
obtained from the same supply
used to power the power
transistor gate drive circuit. If a
dedicated supply is required, in
many cases it is possible to add
an additional winding on an existing
transformer. Otherwise, some
HV+
sort of simple isolated supply can
be used, such as a line powered
transformer or a high-frequency
DC-DC converter.
An inexpensive 78L05 three-terminal
regulator can also be used to
reduce the floating supply voltage
to 5 V. To help attenuate highfrequency power supply noise or
ripple, a resistor or inductor can be
used in series with the input of the
regulator to form a low-pass
filter with the regulator’s input
bypass capacitor.
+
GATE DRIVE
CIRCUIT
FLOATING
POSITIVE
SUPPLY
-
R4
R2
MOTOR
D1
5.1 V
39 Ω
+ R1 -
1 VDD1
2 VIN+
C2
0.01 µF
3 VIN4 GND1
RSENSE
HV-
Figure 16. Recommended supply and sense resistor connections.
10
C1
0.1 µF
HCPL-7520
As shown in Figure 17, 0.1 µF
bypass capacitors (C1, C2)
should be located as close as
possible to the pins of the
HCPL-7520. The bypass
capacitors are required because
of the high-speed digital nature
of the signals inside the HCPL-7520.
A 0.01 µF bypass capacitor (C2) is
also recommended at the input due
to the switched-capacitor nature
of the input circuit. The input
bypass capacitor also forms part
of the anti-aliasing filter, which is
recommended to prevent high
frequency noise from aliasing down to
lower frequencies and interfering
with the input signal. The input filter
also performs an important
reliability function—it reduces
transient spikes from ESD events
flowing through the current
sensing resistor.
PC Board Layout
The design of the printed circuit
board (PCB) should follow good
layout practices, such as keeping
bypass capacitors close to the
supply pins, keeping output
signals away from input signals,
the use of ground and power
planes, etc. In addition, the
layout of the PCB can also affect
the isolation transient immunity
(CMTI) of the HCPL-7520,
due primarily to stray capacitive
coupling between the input and
the output circuits. To obtain
optimal CMTI performance, the
layout of the PC board should
minimize any stray coupling by
maintaining the maximum
possible distance between the
input and output sides of the
circuit and ensuring that any
ground or power plane on the
PC board does not pass directly
below or extend much wider than
the body of the HCPL-7520.
FLOATING
POSITIVE
SUPPLY
HV+
GATE DRIVE
CIRCUIT
U1
78L05
IN
C1
0.1 µF
OUT
R5
68 Ω
MOTOR
µC
+5 V
C2
0.1 µF
+ R1 -
C3
0.01 µF
1 VDD1
VDD2 8
2 VIN+
VOUT 7
3 VIN-
VREF 6
4 GND1
GND2 5
A/D
C4
C5
HCPL-7520
C6 = 150 pF
C4 = C5 = 0.1 µF
Figure 17. Recommended HCPL-7520 application circuit.
11
VREF
GND
RSENSE
HV-
C6
The first step in selecting a sense
resistor is determining how much
current the resistor will be sensing.
The graph in Figure 18 shows the
RMS current in each phase of a
three-phase induction motor as a
function of average motor output
power (in horsepower, hp) and
motor drive supply voltage. The
maximum value of the sense resistor
is determined by the current
being measured and the maximum
recommended input voltage
of the isolation amplifier. The
maximum sense resistance can be
calculated by taking the maximum
recommended input voltage
and dividing by the peak current
that the sense resistor should see
during normal operation. For
example, if a motor will have a
maximum RMS current of 10 A
and can experience up to 50%
overloads during normal operation,
then the peak current is
21.1 A (=10 x 1.414 x 1.5).
Assuming a maximum input
voltage of 200 mV, the maximum
value of sense resistance in this
case would be about 10 mΩ.
The maximum average power
dissipation in the sense resistor
can also be easily calculated by
12
multiplying the sense resistance
times the square of the maximum
RMS current, which is about 1 W
in the previous example. If the
power dissipation in the sense
resistor is too high, the resistance
can be decreased below the
maximum value to decrease
power dissipation. The minimum
value of the sense resistor is
limited by precision and accuracy
requirements of the design. As
the resistance value is reduced,
the output voltage across the
resistor is also reduced, which
means that the offset and noise,
which are fixed, become a larger
percentage of the signal amplitude.
The selected value of the sense
resistor will fall somewhere
between the minimum and
maximum values, depending on
the particular requirements of
a specific design.
When sensing currents large
enough to cause significant
heating of the sense resistor, the
temperature coefficient (tempco)
of the resistor can introduce
nonlinearity due to the signal
dependent temperature rise of the
resistor. The effect increases as
the resistor-to-ambient thermal
resistance increases. This effect
can be minimized by reducing the
thermal resistance of the current
sensing resistor or by using a
resistor with a lower tempco.
Lowering the thermal resistance
can be accomplished by
repositioning the current sensing
resistor on the PC board, by
using larger PC board traces to
carry away more heat, or by
using a heat sink. For a two-terminal
current sensing resistor, as the
value of resistance decreases, the
resistance of the leads become a
significant percentage of the total
resistance. This has two primary
effects on resistor accuracy.
First, the effective resistance of
the sense resistor can become
dependent on factors such as
how long the leads are, how
they are bent, how far they are
inserted into the board, and how
far solder wicks up the leads
during assembly (these issues
will be discussed in more detail
shortly). Second, the leads are
typically made from a material,
such as copper, which has a
much higher tempco than the
material from which the resistive
element itself is made, resulting
in a higher tempco overall. Both
of these effects are eliminated
when a four-terminal current
sensing resistor is used. A
four-terminal resistor has two
additional terminals that are
Kelvin-connected directly across
the resistive element itself; these
two terminals are used to monitor
the voltage across the resistive
element while the other two
terminals are used to carry the
load current. Because of the
Kelvin connection, any voltage
drops across the leads carrying
the load current should have no
impact on the measured voltage.
MOTOR OUTPUT POWER – HORSEPOWER
Current Sensing Resistors
The current sensing resistor
should have low resistance (to
minimize power dissipation), low
inductance (to minimize di/dt
induced voltage spikes which
could adversely affect operation),
and reasonable tolerance (to
maintain overall circuit accuracy).
Choosing a particular value for
the resistor is usually a compromise
between minimizing power
dissipation and maximizing accuracy.
Smaller sense resistance
decreases power dissipation,
while larger sense resistance
can improve circuit accuracy by
utilizing the full input range of
the HCPL -7520.
40
440
380
220
120
35
30
25
20
15
10
5
0
0
5
10
15
20
25
30
35
MOTOR PHASE CURRENT – A (rms)
Figure 18. Motor output horsepower vs. motor
phase current and supply voltage.
When laying out a PC board for
the current sensing resistors, a
couple of points should be kept
in mind. The Kelvin connections
to the resistor should be brought
together under the body of the
resistor and then run very close
to each other to the input of the
HCPL-7520; this minimizes the
loop area of the connection and
reduces the possibility of stray
magnetic fields from interfering
with the measured signal. If the
sense resistor is not located on the
same PC board as the HCPL-7520
circuit, a tightly twisted pair of
wires can accomplish the same
thing. Also, multiple layers of the
PC board can be used to increase
current carrying capacity.
Numerous plated-through vias
should surround each non-Kelvin
terminal of the sense resistor
to help distribute the current
between the layers of the PC
board. The PC board should use
2 or 4 oz. copper for the layers,
resulting in a current carrying
capacity in excess of 20 A.
Making the current carrying
traces on the PC board fairly
large can also improve the sense
resistor’s power dissipation
capability by acting as a heat sink.
Liberal use of vias where the load
current enters and exits the PC
board is also recommended.
13
Sense Resistor Connections
The recommended method for
connecting the HCPL-7520 to the
current sensing resistor is shown
in Figure 17. VIN+ (pin 2 of the
HPCL-7520) is connected to the
positive terminal of the sense
resistor, while VIN- (pin 3) is
shorted to GND1 (pin 4), with the
powersupply return path
functioning as the sense line to
the negative terminal of the
current sense resistor. This
allows a single pair of wires or
PC board traces to connect the
HCPL-7520 circuit to the sense
resistor. By referencing the input
circuit to the negative side of the
sense resistor, any load current
induced noise transients on the
resistor are seen as a commonmode signal and will not
interfere with the current-sense
signal. This is important because
the large load currents flowing
through the motor drive, along
with the parasitic inductances
inherent in the wiring of the
circuit, can generate both noise
spikes and offsets that are relatively
large compared to the small
voltages that are being measured
across the current sensing resistor.
If the same power supply is used
both for the gate drive circuit
and for the current sensing
circuit, it is very important that
the connection from GND1 of the
HCPL-7520 to the sense resistor
be the only return path for supply
current to the gate drive power supply
in order to eliminate potential ground
loop problems. The only direct
connection between the
HCPL-7520 circuit and the gate
drive circuit should be the positive
power supply line.
FREQUENTLY ASKED QUESTIONS ABOUT THE HCPL-7520
1. THE BASICS
1.1: Why should I use the HCPL-7520 for sensing current when Hall-effect sensors are available which
don’t need an isolated supply voltage?
Available in an auto-insertable, 8-pin DIP package, the HCPL-7520 is smaller than and has better linearity,
offset vs. temperature and Common Mode Rejection (CMR) performance than most Hall-effect sensors.
Additionally, often the required input-side power supply can be derived from the same supply that powers the
gate-drive optocoupler.
2. SENSE RESISTOR AND INPUT FILTER
2.1: Where do I get 10 mΩ resistors? I have never seen one that low.
Although less common than values above 10 Ω, there are quite a few manufacturers of resistors suitable for
measuring currents up to 50 A when combined with the HCPL-7520. Example product information may be
found at Dale’s web site (http://www.vishay.com/vishay/dale) and Isotek’s web site (http://www.isotekcorp.com)
and Iwaki Musen Kenkyusho’s website (http://www.iwakimusen.co.jp) and Micron Electric’s website
(http://www.micron-e.co.jp).
2.2: Should I connect both inputs across the sense resistor instead of grounding VIN- directly to pin 4?
This is not necessary, but it will work. If you do, be sure to use an RC filter on both pin 2 (VIN+) and pin 3
(VIN-) to limit the input voltage at both pads.
2.3: Do I really need an RC filter on the input? What is it for? Are other values of R and C okay?
The input anti-aliasing filter (R=39 Ω, C=0.01 µF) shown in the typical application circuit is recommended
for filtering fast switching voltage transients from the input signal. (This helps to attenuate higher signal
frequencies which could otherwise alias with the input sampling rate and cause higher input offset voltage.)
Some issues to keep in mind using different filter resistors or capacitors are:
1. (Filter resistor:) The equivalent input resistance for HCPL-7520 is around 700 kΩ. It is therefore best to
ensure that the filter resistance is not a significant percentage of this value; otherwise the offset voltage will
be increased through the resistor divider effect. [As an example, if Rfilt = 5.5 kΩ, then VOS = (Vin * 1%)
= 2 mV for a maximum 200 mV input and VOS will vary with respect to Vin.]
2. The input bandwidth is changed as a result of this different R-C filter configuration. In fact this is one of
the main reasons for changing the input-filter R-C time constant.
3. (Filter capacitance:) The input capacitance of the HCPL-7520 is approximately 1.5 pF. For proper
operation the switching input-side sampling capacitors must be charged from a relatively fixed (low
impedance) voltage source. Therefore, if a filter capacitor is used it is best for this capacitor to be a few
orders of magnitude greater than the CINPUT (A value of at least 100 pF works well.)
2.4: How do I ensure that the HCPL-7520 is not destroyed as a result of short circuit conditions which
cause voltage drops across the sense resistor that exceed the ratings of the HCPL-7520’s inputs?
Select the sense resistor so that it will have less than 5 V drop when short circuits occur. The only other
requirement is to shut down the drive before the sense resistor is damaged or its solder joints melt. This
ensures that the input of the HCPL-7520 can not be damaged by sense resistors going open-circuit.
3. ISOLATION AND INSULATION
3.1: How many volts will the HCPL-7520 withstand?
The momentary (1 minute) withstand voltage is 3750 V rms per UL 1577 and CSA Component Acceptance
Notice #5.
4. ACCURACY
4.1: Does the gain change if the internal LED light output degrades with time?
No. The LED is used only to transmit a digital pattern. Agilent has accounted for LED degradation in the
design of the product to ensure long life.
5. MISCELLANEOUS
5.1: How does the HCPL-7520 measure negative signals with only a +5 V supply?
The inputs have a series resistor for protection against large negative inputs. Normal signals are no more
than 200 mV in amplitude. Such signals do not forward bias any junctions sufficiently to interfere with
accurate operation of the switched capacitor input circuit.
14
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Copyright © 2003 Agilent Technologies, Inc.
July 8, 2003
5988-9695EN