LMX321AxK Rev. A RELIABILITY REPORT FOR LMX321AxK PLASTIC ENCAPSULATED DEVICES May 26, 2002 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Written by Reviewed by Jim Pedicord Quality Assurance Reliability Lab Manager Bryan J. Preeshl Quality Assurance Executive Director Conclusion The LMX321 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments I. Device Description A. General The LMX321 is a single, low-cost, low-voltage, pin-to-pin compatible upgrade to the LMV321 general-purpose op amp. This device offers Rail-to-Rail® outputs and an input common-mode range that extends below ground. This op amp draws only 105µA of quiescent current per amplifier, operates from a single +2.3V to +7V supply, and drives 2k resistive loads to within 40mV of either rail. The LMX321 is unity-gain stable with a 1.3MHz gain-bandwidth product capable of driving capacitive loads up to 400pF. The combination of low voltage, low cost, and small package size makes this amplifier ideal for portable/battery-powered equipment. The LMX321 single op amp is available in ultra-small 5-pin SC70 and space-saving 5-pin SOT23 packages. B. Absolute Maximum Ratings Item Supply Voltage (V CC to VEE) Differential Input Voltage (VIN+ - VIN-) OUT_ to VEE Short-Circuit Duration (OUT_ shorted to VCC or VEE) Continuous Power Dissapation (TA = +700C) Storage Temp. Junction Temperature Lead Temp. (10 sec.) Power Dissipation 5 Lead SOT23 5 Lead SC70 Derates above +70°C 5 Lead SOT-23 5 Lead SC70 Rating -0.3V to +8V VEE to VCC -0.3V to (VCC + 0.3V) Continuous -65°C to +150°C +150°C +300°C 571mW 247mW 7.1mW/°C 3.1mW/°C II. Manufacturing Information A. Description/Function: Single, General Purpose, Low-Voltage, Rail-to-Rail Op Amp B. Process: CB20 (High Speed Complementary Bipolar Process) C. Number of Device Transistors: 88 D. Fabrication Location: Oregon, USA E. Assembly Location: Philippines, Malaysia or Thailand F. Date of Initial Production: July, 2001 III. Packaging Information A. Package Type: 5 Lead SOT-23 5-Lead SC70 B. Lead Frame: Copper Alloy 42 C. Lead Finish: Solder Plate Solder Plate D. Die Attach: Silver-filled Epoxy Silver-filled Epoxy E. Bondwire: Gold (1 mil dia.) Gold (1 mil dia.) F. Mold Material: Epoxy with silica filler Epoxy with silica filler G. Assembly Diagram: Buildsheet # 05-2501-0167 Buildsheet # 05-2501-0168 H. Flammability Rating: Class UL94-V0 Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1 IV. Die Information A. Dimensions: 31 x 30 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Gold D. Backside Metallization: None E. Minimum Metal Width: 2 microns (as drawn) F. Minimum Metal Spacing: 2 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord Bryan Preeshl Kenneth Huening (Reliability Lab Manager) (Executive Director) (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate (λ) is calculated as follows: λ= 1 = MTTF 1.83 (Chi square value for MTTF upper limit) 192 x 4389 x 79 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV λ = 13.76 x 10-9 λ = 13.76 F.I.T. (60% confidence level @ 25°C) This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In Schematic (Spec. # 06-5662) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test monitors. This data is published in the Product Reliability Report (RR-1L). B. Moisture Resistance Tests Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard 85°C/85%RH testing is done per generic device/package family once a quarter. C. E.S.D. and Latch-Up Testing The OX63 die type has been found to have all pins able to withstand a transient pulse of ±25000V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of ±250mA. Table 1 Reliability Evaluation Test Results LMX321AxK TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135°C Biased Time = 192 hrs. FAILURE IDENTIFICATION PACKAGE DC Parameters & functionality SAMPLE SIZE NUMBER OF FAILURES 79 0 77 99 0 0 0 Moisture Testing (Note 2) Pressure Pot Ta = 121°C P = 15 psi. RH= 100% Time = 168hrs. DC Parameters & functionality SC70 SOT23 85/85 Ta = 85°C RH = 85% Biased Time = 1000hrs. DC Parameters & functionality 77 DC Parameters 77 Mechanical Stress (Note 2) Temperature Cycle -65°C/150°C 1000 Cycles Method 1010 Note 1: Life Test Data may represent plastic D.I.P. qualification lots for the package. Note 2: Generic package/process data 0 Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ Terminal A (Each pin individually connected to terminal A with the other floating) Terminal B (The common combination of all like-named pins connected to terminal B) 1. All pins except VPS1 3/ All VPS1 pins 2. All input and output pins All other input-output pins 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 Pin combinations to be tested. a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1 , or VCC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open. TERMINAL C R1 R2 S1 TERMINAL A REGULATED HIGH VOLTAGE SUPPLY S2 C1 DUT SOCKET SHORT TERMINAL B TERMINAL D Mil Std 883D Method 3015.7 Notice 8 R = 1.5kΩ Ω C = 100pf CURRENT PROBE (NOTE 6) ONCE PER BOARD ONCE PER SOCKET 10 K 10 OHMS +5V 1.0 uA 0.1uF 1 6 2 5 2K 3 6 - SOT 4 18 K 10 K DEVICES: MAX 4464/4470/4400/4401/4480/4481/ 4490/4291/4465/4466/4335/4336/4245/LMX321/4231 MAX CURRENT: MAX4481/MAX4291/LMX321= 800uA / MAX4464/4470/ 4480/4465/4466= 400uA / MAX4400/4401/4245=1.2mA / MAX4490=2.5mA MAX4435/4436/4231/4230=3.4mA DOCUMENT I.D. 06-5662 REVISION E DRAWN BY: TODD BEJSOVEC MAXIM TITLE: BI Circuit (MAX4464/4470/4465/4466/4400/4401/4480/4481/4490/4291/4335/4336/4245/LMX321/ 4231/4230) PAGE 2 OF 3