LTC3701 2-Phase, Low Input Voltage, Dual Step-Down DC/DC Controller U FEATURES ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ DESCRIPTIO The LTC®3701 is a 2-phase dual constant frequency current mode step-down DC/DC controller providing excellent load and line regulation. Power loss and noise due to ESR of the input capacitor are minimized by operating the two controller output stages out-of-phase. Out-of-Phase Controllers Reduce Required Input Capacitance True PLL for Frequency Locking or Frequency Adjustment Operating Frequency Range: 300kHz to 750kHz Wide VIN Range: 2.5V to 10V Constant Frequency Current Mode Architecture Low Dropout: 100% Duty Cycle Power Good Output Voltage Monitor Internal Soft-Start Circuitry Selectable Burst Mode®/Pulse Skipping Operation at Light Loads Output Overvoltage Protection Low Quiescent Current: 460µA 0.8V ±2% Voltage Reference Small 16-Lead Narrow SSOP Package The LTC3701 provides a 0.8V ±2% voltage reference and consumes only 460µA of quiescent current. To further maximize the life of a battery source, the external P-channel MOSFET is turned on continuously in dropout (100% duty cycle). Switching frequency is internally set at 550kHz, allowing the use of small inductors and capacitors. For noise sensitive applications, the LTC3701 can be externally synchronized using its phase-locked loop. The frequency can also be externally set from 300kHz to 750kHz by applying a voltage to the PLLLPF pin. Burst Mode operation is inhibited during synchronization or when the EXTCLK/MODE pin is pulled low to reduce noise and RF interference. U APPLICATIO S ■ ■ ■ ■ ■ One or Two Lithium-Ion Powered Applications Notebook and Handheld Computers Personal Digital Assistants Portable Instruments Distributed DC Power Systems The LTC3701 contains independent internal soft-start circuitry for each controller. Other features include a power good output voltage monitor and output overvoltage and short-circuit protection. The LTC3701 is available in a small footprint 16-lead narrow SSOP package. , LTC and LT are registered trademarks of Linear Technology Corporation. Burst Mode is a registered trademark of Linear Technology Corporation. U TYPICAL APPLICATIO VIN 2.5V TO 9.8V Efficiency vs Load Current 100 169k 80.6k 100k 10k 220pF SENSE1 – VFB1 SENSE1 + 16 15 VIN 14 ITH/RUN1 PGATE1 13 4 LTC3701 SGND PGND 12 6 ITH/RUN2 PGATE2 11 5 PGOOD VFB2 10 7 PLLLPF EXTCLK/MODE 9 8 SENSE2 + SENSE2 – 0.03Ω M1 2 10k 220pF L1 4.7µH D1 + 47µF D2 M2 0.03Ω D1, D2: IR10BQ015 L1, L2: LQN6C-4R7 M1, M2: FDC638P VOUT1 2.5V 2A 10µF 47µF L2 4.7µH 3701 F01a Figure 1. High Efficiency 2-Phase 550kHz Dual Step-Down Converter VOUT2 1.8V 2A VIN = 4.2V VIN = 3.3V 90 EFFICIENCY (%) 78.7k 3 + 1 80 VIN = 6V VIN = 8.4V 70 60 50 VOUT = 2.5V 40 1 100 1000 10 LOAD CURRENT (mA) 10000 3701 F01b 3701fa 1 LTC3701 W W W AXI U U ABSOLUTE RATI GS U U W PACKAGE/ORDER I FOR ATIO (Note 1) Input Supply Voltage (VIN)........................ – 0.3V to 10V SENSE1 –, SENSE2 –, PGATE1, PGATE2, PLLLPF, SENSE1+, SENSE2 +, EXTCLK/MODE Voltages .............. – 0.3V to (VIN + 0.3V) VFB1, VFB2, ITH/RUN1, ITH/RUN2 Voltages .................................. – 0.3V to 2.4V PGOOD Voltage ........................................ – 0.3V to 10V PGATE1, PGATE2 Peak Output Current (<10µs) ....... 1A Operating Ambient Temperature Range (Note 2) ...................................................–40°C to 85°C Storage Ambient Temperature Range ... – 65°C to 150°C Junction Temperature (Note 3) ............................ 125°C Lead Temperature (Soldering, 10 sec).................. 300°C ORDER PART NUMBER TOP VIEW SENSE1– 1 16 SENSE1+ ITH/RUN1 2 15 VIN VFB1 3 14 PGATE1 SGND 4 13 PGND VFB2 5 12 PGATE2 ITH/RUN2 6 11 PGOOD PLLLPF 7 10 EXTCLK/MODE SENSE2 – 8 9 LTC3701EGN GN PART MARKING SENSE2 + 3701 GN PACKAGE 16-LEAD PLASTIC SSOP TJMAX = 150°C, θJA = 140°C/W Consult LTC Marketing for parts specified with wider operating temperature ranges. ELECTRICAL CHARACTERISTICS The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are TA = 25°C. VIN = 4.2V unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS 460 305 9 18 780 470 28 30 µA µA µA µA 1.55 1.70 2.00 2.12 2.50 2.55 V V Main Control Loops Input DC Supply Current Normal Operation Sleep Mode Shutdown UVLO (Note 4) 2.5V < VIN < 9.8V 2.5V < VIN < 9.8V 2.5V < VIN < 9.8V, ITH/RUN1 = ITH/RUN2 = 0V VIN < UVLO Threshold Undervoltage Lockout Threshold VIN Falling VIN Rising ● Shutdown Threshold at ITH/RUN1, 2 0.2 0.35 0.5 V 0.25 0.5 0.85 µA 0.784 0.774 0.8 0.8 0.816 0.826 V V 2.5V < VIN < 9.8V (Note 5) 0.05 0.20 mV/V Output Voltage Load Regulation ITH/RUN = 0.9V (Note 5) ITH/RUN = 1.6V 0.2 – 0.2 0.8 – 0.8 % % VFB1, 2 Input Current (Note 5) 10 50 nA Output Overvoltage Protect Threshold Measured at VFB 0.88 0.930 V Start-Up Current Source on ITH/RUN1, 2 VITH/RUN1, 2 = 0V Regulated Feedback Voltage 0°C to 70°C (Note 5), ITH/RUN = 1.3V –40°C to 85°C (Note 5) Output Voltage Line Regulation ● ● 0.835 Output Overvoltage Protect Hysteresis 20 mV Gate Drive 1, 2 Rise Time CL = 3000pF 40 ns Gate Drive 1, 2 Fall Time CL = 3000pF 40 ns Maximum Current Sense Voltage (SENSE + – SENSE–) (Note 6) Soft-Start Current Sense Voltage Step Time to Maximum Sense Voltage 95 120 30 2048 145 mV mV Cycles 3701fa 2 LTC3701 ELECTRICAL CHARACTERISTICS The ● denotes specifications which apply over the full operating temperature range, otherwise specifications are TA = 25°C. VIN = 4.2V unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS VPLLLPF = 1.2V or Floating VPLLLPF = 0V VPLLLPF ≥ 2.4V 500 230 690 550 280 775 600 320 890 kHz kHz kHz Oscillator and Phase-Locked Loop Oscillator Frequency Phase Detector Output Current Sinking Sourcing µA µA fEXTCLK/MODE < fOSC fEXTCLK/MODE > fOSC –5 5 PGOOD Voltage Low IPGOOD = 500µA 70 150 mV PGOOD Trip Level VFB with Respect to Set Output Voltage VFB Ramping Positive VFB Ramping Negative –8 8 –2.5 15 % % PGOOD Output Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Note 2: The LTC3701E is guaranteed to meet performance specifications from 0°C to 70°C. Specifications over the –40°C to 85°C operating temperature range are assured by design, characterization and correlation with statistical process controls. Note 3: TJ is calculated from the ambient temperature TA and power dissipation PD according to the following formula: TJ = TA + (PD • θJA°C/W) –15 2.5 Note 4: Dynamic supply current is higher due to gate charge being delivered at the switching frequency. Note 5: The LTC3701 is tested in a feedback loop that servos ITH/RUN to a specified voltage and measures the resultant VFB voltage. Note 6: Peak current sense voltage is reduced dependent on duty cycle to a percentage of value as given in Figure 2. U W TYPICAL PERFOR A CE CHARACTERISTICS Shutdown Threshold vs Temperature 0.810 VIN = 4.2V ITH/RUN VOLTAGE (V) REFERENCE VOLTAGE (V) 0.805 0.800 0.795 0.790 0.785 0.780 0.775 20 40 60 –60 –40 –20 0 TEMPERATURE (°C) 80 100 3701 G01 0.50 0.48 VIN = 4.2V 0.46 0.44 0.42 0.40 0.38 0.36 0.34 0.32 0.30 0.28 0.26 0.24 0.22 0.20 20 40 60 –60 –40 –20 0 TEMPERATURE (°C) Oscillator Frequency vs Temperature 1000 900 800 FREQUENCY (kHz) Reference Voltage vs Temperature VIN = 4.2V PLLLPF = 2.4V 700 600 PLLLPF = FLOAT 500 400 300 PLLLPF = 0V 200 100 80 100 3701 G02 0 –60 –40 –20 0 20 40 60 TEMPERATURE (°C) 80 100 3701 G03 3701fa 3 LTC3701 U W TYPICAL PERFOR A CE CHARACTERISTICS Undervoltage Lockout Trip Voltage (Falling) vs Temperature Undervoltage Lockout Trip Voltage (Rising) vs Temperature Maximum Current Sense Threshold vs Temperature MAXIMUM CURRENT SENSE THRESHOLD (mV) 2.20 2.15 2.18 2.16 INPUT VOLTAGE (V) INPUT VOLTAGE (V) 2.10 2.05 2.00 1.95 2.14 2.12 2.10 2.08 2.06 2.04 1.90 2.02 1.85 –60 –40 –20 0 20 40 60 TEMPERATURE (°C) 80 100 2.00 –60 –40 –20 0 20 40 60 TEMPERATURE (°C) 80 3701 G04 115 110 105 100 20 40 60 –60 –40 –20 0 TEMPERATURE (°C) 3701 G06 100 FIGURE 1 CIRCUIT EXTCLK/MODE = GND 90 VOUT = 2.5V 400 EFFICIENCY (%) PULSE SKIPPING MODE OPERATION (EXTCLK/MODE = 0V) 500 BURST MODE OPERATION (EXTCLK/MODE = VIN) 300 FIGURE 1 CIRCUIT 200 LOAD CURRENT = 0A 100 70 VIN = 6V 60 40 3 4 VIN = 4.2V 50 SHUTDOWN (ITH/RUN1,2 = 0V) 2 9 5 7 8 6 INPUT VOLTAGE (V) 10 11 1 100 100O 10 LOAD CURRENT (mA) 1OOOO 3701 G08 PGOOD RON vs Input Voltage 500 VIN = 3.3V VIN = 8.4V 80 3701 G07 2-Phase Operation IPGOOD = 500µA 450 SW1 5V/DIV 400 PGOOD RDS(ON) (Ω) 80 100 Efficiency vs Load Current (Pulse Skipping Mode) 600 INPUT CURRENT (µA) 120 3701 G05 Input and Shutdown Currents vs Input Voltage 0 100 125 350 SW2 5V/DIV 300 INPUT CURRENT 1A/DIV 250 200 150 FIGURE 1 CIRCUIT 100 500ns/DIV 50 0 0 1 2 3 4 5 6 7 INPUT VOLTAGE (V) 8 9 10 3701 G09 3701fa 4 LTC3701 U U U PI FU CTIO S SENSE1–, SENSE2– (Pins 1, 8): The (–) Inputs to the Differential Current Comparators. ITH/RUN1, ITH/RUN2 (Pins 2, 6): These pins each serve two functions. Each pin serves as the error amplifier compensation point as well as the run control input for the respective controller. Forcing one pin below 0.35V causes the functions associated with that controller to be shut down. Forcing both ITH/RUN pins below 0.35V causes the device to be shut down. Nominal operating voltage range on these pins is from 0.7V to 1.9V. VFB1, VFB2 (Pins 3, 5): Each receives the remotely sensed feedback voltage for each controller from an external resistive divider across the output. SGND (Pin 4): Signal Ground. PLLLPF (Pin 7): Serves as the lowpass filter point for the PLL and as the voltage control input to the internal oscillator. Normally, a series RC is connected between this pin and ground when synchronizing to an external clock. Nominal voltage range is from 0V to 2.4V. Frequency can be set by forcing this pin with a voltage. Tying this pin to GND selects 300kHz. Tying to VIN or a voltage ≥ 2.4V selects 750kHz. Floating this pin selects 550kHz operation. SENSE2+ (PVIN2), SENSE1+ (PVIN1) (Pins 9, 16): The (+) Inputs to the Differential Current Comparators. These pins also power the gate drivers. EXTCLK/MODE (Pin 10): External Clock Input. Applying a clock to this pin causes the internal oscillator to phaselock to the external clock (nominal lock frequency range between 300kHz and 750kHz). This also disables Burst Mode operation but allows pulse-skipping at low load currents. Forcing this pin high enables Burst Mode operation. Forcing this pin low enables pulse-skipping mode. In these cases, the frequency of the internal oscillator is set by the voltage on the PLLLPF pin. If the PLLLPF voltage is not set externally, the frequency internally defaults to 550kHz. PGOOD (Pin 11): Power Good Output Voltage Monitor Open-Drain Logic Output. This pin is pulled to ground when the voltage on either feedback pin (VFB1, VFB2) is not within ±8% of its nominal set point. PGOOD is pulled low when channel 1 or both channels are shut down. When channel 2 is shut down and channel 1 enabled, the PGOOD output indicates the state of VFB1 only. PGATE2, PGATE1 (Pins 12, 14): Gate Drivers for the External P-Channel MOSFETs. These pins swing from 0 to SENSE+ (PVIN). PGND (Pin 13): Ground Pin for Gate Drivers. VIN (Pin 15): Chip Signal Power Supply Input. This pin powers the entire chip except for the gate drivers. 3701fa 5 LTC3701 W FU CTIO AL DIAGRA U U RSENSE1 L1 M1 VOUT VIN CIN SENSE1 + 15 VIN COUT D1 16 1 SENSE1 – SLOPE1 – CLK1 S ICMP VOLTAGE REFERENCE VREF 0.8V Q R + OV1 UV EXTCLK/MODE PLLLPF SCP – BURSTDIS PHASE DETECTOR 0.3V + – 0.5µA VFB1 R1 + – SLOPE COMP SLOPE1 VIN VREF 0.8V ITH/RUN1 SLOPE2 0.35V SHDN1 PGOOD1 PGOOD CLK1 100Ω 4 SGND 2 RC + VIN 11 3 EAMP CLK1 VOLTAGE CONTROLLED CLK2 OSCILLATOR CC 0.880V + SC1 10k RC 13 R2 CLOCK DETECT 7 – SLEEP1 0.3V BURSTDIS 14 OVP – SHDN1 SHDN2 10 PGND + UVSD 0.15V BURST DEFEAT PGATE1 + VIN UNDERVOLTAGE LOCKOUT PVIN1 SWITCHING LOGIC AND BLANKING CIRCUIT SOFT-START ITH CLAMP CC – SHDN1 PGOOD2 SHDN2 PGOOD1 OV1 + 0.74V – DUPLICATE FOR SECOND CHANNEL 3701 BD 3701fa 6 LTC3701 U OPERATIO (Refer to Functional Diagram) Main Control Loop The LTC3701 uses a constant frequency, current mode architecture with the two controller channels operating 180 degrees out of phase. During normal operation, each external P-channel power MOSFET is turned on when the clock for that channel sets the RS latch, and turned off when the current comparator (ICMP) resets the latch. The peak inductor current at which ICMP resets the RS latch is controlled by the voltage on the ITH/RUN pin, which is the output of each error amplifier, EAMP. The VFB pin receives the voltage feedback signal, which is compared to the internal reference voltage by the EAMP. When the load current increases, it causes a slight decrease in VFB relative to the 0.8V reference, which in turn, causes the ITH/ RUN voltage to increase until the average inductor current matches the new load current. Each main control loop is shut down by pulling the respective ITH/RUN pin low. When both ITH/RUN1 and ITH/ RUN2 are low, all LTC3701 controller functions are shut down. Releasing ITH/RUN allows an internal 0.5µA current source to charge up the external compensation network. When the ITH/RUN pin reaches 0.35V, the main control loop is enabled with the ITH/RUN voltage then pulled up to its zero current level of approximately 0.7V. After the loop is enabled, an internal soft-start begins. During this softstart time of 2048 clock cycles, the ITH/RUN voltage is clamped such that the maximum peak current sense voltage (VSENSE + – VSENSE –) is held to approximately 0%, 25%, 50% and 75%, respectively, of its maximum value of 120mV for four equally timed intervals. After soft-start is completed, full current operation is allowed. As the external compensation network continues to charge, the corresponding output current trip level follows, allowing normal operation. Comparator OVP guards against transient output voltage overshoots greater than 10% by turning off the external P-channel power MOSFET and keeping it off until the fault is removed. Burst Mode Operation VIN or to a voltage of at least 2V. To disable Burst Mode operation and enable PWM pulse skipping mode, connect the EXTCLK/MODE pin to ground. In this mode, the efficiency is lower at light loads. However, pulse skipping mode has the advantages of lower output ripple and less interference to audio circuitry. When a controller is in Burst Mode operation, the peak current of the inductor is set as if VITH/RUN = 1V, even though the voltage at the ITH/RUN pin is at a lower value. If the inductor’s average current is greater than the load requirement, the voltage at the ITH/RUN pin will drop. When the ITH/RUN voltage goes below 0.85V, the sleep signal goes high, turning off the external MOSFET. The sleep signal goes low when the ITH/RUN voltage goes above 0.925V and that controller channel resumes normal operation. The next oscillator cycle will turn the external MOSFET on and the switching cycle repeats. Frequency Synchronization A phase-locked loop (PLL) is available on the LTC3701 to allow the internal oscillator to be synchronized to an external clock source connected to the EXTCLK/MODE pin. The output of the phase detector at the PLLLPF pin operates over a 0V to 2.4V range corresponding to approximately 300kHz to 750kHz. When locked, the PLL aligns the turn-on of the external MOSFET of controller channel 1 to the rising edge of the synchronizing signal. The turn-on of the external MOSFET of controller channel 2 is 180 degrees out of phase with the rising edge of the external clock source. When the LTC3701 is clocked by an external source, Burst Mode operation is disabled and the LTC3701 operates in PWM pulse skipping mode. In this mode, when the output load is very low, the current comparator ICMP may remain tripped for several cycles and force the external MOSFET to stay off for the same number of cycles. Increasing the output load slightly allows constant frequency PWM operation to resume. This mode exhibits low output ripple as well as low audio noise and reduced RF interference while providing reasonable low current efficiency. The LTC3701 can be enabled to enter Burst Mode operation at low load currents by tying the EXTCLK/MODE pin to 3701fa 7 LTC3701 U OPERATIO (Refer to Functional Diagram) Dropout Operation Slope Compensation and Peak Inductor Current When the input supply voltage decreases towards the output voltage, the rate of change of the inductor current during the ON cycle decreases. This reduction means that the external P-channel MOSFET will remain on for more than one oscillator cycle if the inductor current has not ramped up to the threshold set by EAMP on the ITH/RUN pin. Further reduction in input supply voltage will eventually cause the P-channel MOSFET to be turned on 100%, i.e., DC. The output voltage will then be determined by the input voltage minus the voltage drop across the MOSFET, the sense resistor and the inductor. The inductor’s peak current is determined by: IPK = VITH/RUN – 0.7 V 10 • RSENSE when the LTC3701 is operating below 20% duty cycle. However, once the duty cycle exceeds 20%, slope compensation begins and effectively reduces the peak inductor current. The amount of reduction is given by the curve in Figure 2. 110 100 Undervoltage Lockout Short-Circuit Protection When an output is shorted to ground (VFB < 0.3V), the switching frequency of that channel is reduced to 1/5 of the normal operating frequency. The other controller channel is unaffected and maintains normal operation. This lower frequency allows the inductor current to safely discharge, thereby preventing current runaway. The switching frequency will return to its normal value when the feedback voltage rises above 0.3V. During the first 64 cycles (nonzero-current cycles) of soft-start, however, the controller operates at its full frequency. Output Overvoltage Protection As a further protection, the overvoltage comparator in the LTC3701 will turn the external MOSFET off when the feedback voltage has risen 10% above the reference voltage of 0.8V. This comparator has a typical hysteresis of 20mV. 80 SF = I/IMAX (%) To prevent operation of the P-channel MOSFET below safe input voltage levels, an undervoltage lockout is incorporated into the LTC3701. When the input supply voltage drops below 2V, the P-channel MOSFET and all circuitry are turned off except the undervoltage block, which draws only several microamperes. 90 70 60 50 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 100 DUTY CYCLE (%) 3701 F02 Figure 2. Maximum Peak Current vs Duty Cycle Power Good (PGOOD) Pin A window comparator monitors both output voltages and the open-drain PGOOD output is pulled low when the divided down output voltages are not within ±8% of the reference voltage of 0.8V. PGOOD is pulled low when channel 1 or both channels are shut down. When channel␣ 2 is shut down and channel 1 enabled, the PGOOD output indicates the state of channel 1 only. 2-Phase Operation The LTC3701 dual switching controller offers the considerable benefits of using 2-phase operation. Circuit benefits include lower input filtering requirements, reduced electromagnetic interference (EMI) and increased efficiency associated with 2-phase operation. 3701fa 8 LTC3701 U OPERATIO (Refer to Functional Diagram) Why the need for 2-phase operation? Until recently, constant frequency dual switching regulators operated both channels in phase (i.e., single phase operation). This means that both topside MOSFETs are turned on at the same time, causing current pulses of up to twice the amplitude of those from a single regulator to be drawn from the input capacitor. These large amplitude pulses increase the total RMS current flowing into the input capacitor, requiring the use of more expensive input capacitors, and increasing both EMI and losses in the input capacitor and input power supply. With 2-phase operation, the two channels of the LTC3701 are operated 180 degrees out of phase. This effectively interleaves the current pulses coming from the switches, greatly reducing the overlap time where they add together. The result is a significant reduction in the total RMS input current, which in turn allows for use of less expensive input capacitors, reduces shielding requirements for EMI and improves real world operating efficiency. Figure 3 shows example waveforms for a single switching regulator channel versus a 2-phase LTC3701 system with Single Phase Dual Controller 2-Phase Dual Controller both channels switching. A single phase dual regulator system with both sides switching would exhibit twice the single side numbers. In this example, 2-phase operation reduced the RMS input current from 1.79ARMS to 0.91ARMS. While this is an impressive reduction in itself, remember that power losses are proportional to IRMS2, meaning that actual power wasted is reduced by a factor of 3.86. The reduced input ripple current also means that less power is lost in the input power path, which could include batteries, switches, trace/connector resistances, and protection circuitry. Improvements in both conducted and radiated EMI also directly accrue as a result of the reduced RMS input current and voltage. Of course, the improvement afforded by 2-phase operation is a function of the dual switching regulator’s relative duty cycles, which in turn are dependent upon the input voltage VIN. Figure 4 shows how the RMS input current varies for 1-phase and 2-phase operation for 2.5V and 1.8V regulators over a wide input voltage range. It can be readily seen that the advantages of 2-phase operation are not limited to a narrow operating range, but in fact extend over a wide region. A good rule of thumb for most applications is that 2-phase operation will reduce the input capacitor requirement to that for just one channel operating at maximum current and 50% duty cycle. SW1 (V) 2.0 SW2 (V) INPUT CAPACITOR RMS CURRENT 1.8 IL1 IL2 SINGLE PHASE DUAL CONTROLER 1.6 1.4 2-PHASE DUAL CONTROLER 1.2 1.0 0.8 0.6 0.4 VOUT1 = 2.5V/2A VOUT2 = 1.8V/2A 0.2 0 2 IIN 3 4 8 6 5 7 INPUT VOLTAGE (V) 9 10 3701 F04 3701 F03 Figure 3. Example Waveforms for a Single Switching Regulator Channel vs 2-Phase LTC3701 System with Both Channels Switching Figure 4. RMS Input Current Comparison 3701fa 9 LTC3701 U W U U APPLICATIO S I FOR ATIO The basic LTC3701 application circuit is shown in Figure␣ 1. External component selection is driven by the load requirement and begins with the selection of L and RSENSE. Next, the power MOSFET M1 and the output diode D1 are selected. Finally CIN (C1) and COUT (C2) are chosen. RSENSE Selection for Output Current RSENSE is chosen based on the required output current. Since the current comparator monitors the voltage developed across RSENSE, the threshold of the comparator determines the inductor’s peak current. The output current that the LTC3701 can provide is given by: IOUT 0.095 IRIPPLE = – RSENSE 2 where IRIPPLE is the inductor peak-to-peak ripple current (see Inductor Value Calculation). A reasonable starting point for setting ripple current is IRIPPLE = (0.4)(IOUT). Rearranging the above equation yields: RSENSE = 1 for Duty Cycle < 20% 12.7 • IOUT However, for operation above 20% duty cycle, slope compensation has to be taken into consideration to select the appropriate value of RSENSE to provide the required amount of current. Using Figure 2, the value of RSENSE is: RSENSE = SF (12.7)(IOUT )(100) smaller inductor for the same amount of inductor ripple current. However, this is at the expense of efficiency due to an increase in MOSFET gate charge and switching losses. The inductance value also has a direct effect on ripple current. The ripple current, IRIPPLE, decreases with higher inductance or frequency. The inductor’s peak-to-peak ripple current is: IRIPPLE = VIN – VOUT VOUT + VD f • L VIN + VD where f is the operating frequency and VD is the forward voltage drop of the external Schottky diode. Accepting larger values of IRIPPLE allows the use of low inductances, but results in higher output voltage ripple and greater core losses. A reasonable starting point for setting ripple current is IRIPPLE = 0.4(IOUT(MAX)). The maximum IRIPPLE occurs at the maximum input voltage. With Burst Mode operation selected on the LTC3701, the ripple current is normally set such that the inductor current is continuous during the burst periods. Therefore, the peak-to-peak ripple current must not exceed: IRIPPLE ≤ (0.03)/RSENSE This implies a minimum inductance of: LMIN = VIN – VOUT VOUT + VD 0.03 VIN + VD f RSENSE (Use VIN = VIN(MAX) ) For noise sensitive applications, a 1nF capacitor placed between the SENSE+ and SENSE– pins very close to the chip is suggested. A smaller value than LMIN could be used in the circuit, however, the inductor current will not be continuous during burst periods. Inductor Value Calculation Inductor Core Selection The inductor selection will depend on the operating frequency of the LTC3701. The internal nominal frequency is 550kHz, but can be externally synchronized or set from approximately 300kHz to 750kHz. Once the value of L is known, the type of inductor must be selected. High efficiency converters generally cannot afford the core loss found in low cost powdered iron cores, forcing the use of more expensive ferrite, molypermalloy or Kool Mµ® cores. Actual core loss is independent of core The operating frequency and inductor selection are interrelated in that higher frequencies permit the use of a Kool Mµ is a registered trademark of Magnetics, Inc. 3701fa 10 LTC3701 U W U U APPLICATIO S I FOR ATIO size for a fixed inductor value, but is very dependent on the inductance selected. As inductance increases, core losses go down. Unfortunately, increased inductance requires more turns of wire and therefore copper losses will increase. Ferrite designs have very low core losses and are preferred at high switching frequencies, so design goals can concentrate on copper loss and preventing saturation. Ferrite core material saturates “hard,” which means that inductance collapses abruptly when the peak design current is exceeded. This results in an abrupt increase in inductor ripple current and consequent output voltage ripple. Do not allow the core to saturate! Molypermalloy (from Magnetics, Inc.) is a very good, low loss core material for toroids, but is more expensive than ferrite. A reasonable compromise from the same manufacturer is Kool Mµ. Toroids are very space efficient, especially when several layers of wire can be used, while inductors wound on bobbins are generally easier to surface mount. However, new designs for surface mount that do not increase the height significantly are available from Coiltronics, Coilcraft, Dale and Sumida. Power MOSFET Selection An external P-channel MOSFET must be selected for use with each channel of the LTC3701. The main selection criteria for the power MOSFET are the threshold voltage VGS(TH), “on” resistance RDS(ON), reverse transfer capacitance CRSS and the total gate charge. Since the LTC3701 is designed for operation down to low input voltages, a sublogic level threshold MOSFET (RDS(ON) guaranteed at VGS = 2.5V) is required for applications that work close to this voltage. When these MOSFETs are used, make sure that the input supply to the LTC3701 is less than the absolute maximum MOSFET VGS rating, typically 8V. The required minimum RDS(ON) of the MOSFET is governed by its allowable power dissipation. For applications that may operate the LTC3701 in dropout, i.e., 100% duty cycle, the required RDS(ON) is given by: RDS(ON)DC=100% = PP (IOUT(MAX) ) (1+ δp) 2 where PP is the allowable power dissipation and δp is the temperature dependency of RDS(ON) . (1 + δp) is generally given for a MOSFET in the form of a normalized RDS(ON) vs temperature curve, but δp = 0.005/°C can be used as an approximation for low voltage MOSFETs. In applications where the maximum duty cycle is less than 100% and the LTC3701 is in continuous mode, the RDS(ON) is governed by: RDS(ON) ≅ PP (DC)IOUT2 (1+ δp) where DC is the maximum operating duty cycle for that channel of the LTC3701. Output Diode Selection The catch diode carries load current during the switch offtime. The average diode current is therefore dependent on the P-channel MOSFET duty cycle. At high input voltages, the diode conducts most of the time. As VIN approaches VOUT, the diode conducts for only a small fraction of the time. The most stressful condition for the diode is when the output is short-circuited. Under this condition, the diode must safely handle IPEAK at close to 100% duty cycle. Therefore, it is important to adequately specify the diode peak current and average power dissipation so as not to exceed the diode’s ratings. Under normal load conditions, the average current conducted by the diode is: V –V ID = IN OUT IOUT VIN + VD The allowable forward voltage drop in the diode is calculated from the maximum short-circuit current as: VF ≈ PD IPEAK where PD is the allowable power dissipation and will be determined by efficiency and/or thermal requirements. A Schottky diode is a good choice for low forward drop and fast switching time. Remember to keep lead length short and observe proper grounding (see Board Layout Checklist) to avoid ringing and increased dissipation. 3701fa 11 LTC3701 U W U U APPLICATIO S I FOR ATIO CIN and COUT Selection The selection of CIN is simplified by the 2-phase architecture and its impact on the worst-case RMS current drawn through the input network (battery/fuse/capacitor). It can be shown that the worst-case capacitor RMS current occurs when only one controller is operating. The controller with the highest (VOUT)(IOUT) product needs to be used in the formula below to determine the maximum RMS capacitor current requirement. Increasing the output current drawn from the other controller will actually decrease the input RMS ripple current from its maximum value. The out-of-phase technique typically reduces the input capacitor’s RMS ripple current by a factor of 30% to 70% when compared to a single phase power supply solution. In continuous mode, the source current of the P-channel MOSFET is a square wave of duty cycle (VOUT + VD)/ (VIN + VD). To prevent large voltage transients, a low ESR capacitor sized for the maximum RMS current of one channel must be used. The maximum RMS capacitor current is given by: CIN Required IRMS ≈ 1/ 2 IMAX VOUT + VD )( VIN – VOUT ) ( VIN + VD [ ] This formula has a maximum at VIN = 2VOUT + VD, where IRMS = IOUT/2. This simple worst-case condition is commonly used for design because even significant deviations do not offer much relief. Note that capacitor manufacturers’ ripple current ratings are often based on only 2000 hours of life. This makes it advisable to further derate the capacitor, or to choose a capacitor rated at a higher temperature than required. Several capacitors may be paralleled to meet size or height requirements in the design. Due to the high operating frequency of the LTC3701, ceramic capacitors can also be used for CIN. Always consult the manufacturer if there is any question. The benefit of the LTC3701 2-phase operation can be calculated by using the equation above for the higher power controller and then calculating the loss that would have resulted if both controller channels switched on at the same time. The total RMS power lost is lower when both controllers are operating due to the reduced overlap of current pulses required through the input capacitor’s ESR. This is why the input capacitor’s requirement calculated above for the worst-case controller is adequate for the dual controller design. Also, the input protection fuse resistance, battery resistance, and PC board trace resistance losses are also reduced due to the reduced peak currents in a 2-phase system. The overall benefit of a multiphase design will only be fully realized when the source impedance of the power supply/battery is included in the efficiency testing. The sources of the P-channel MOSFETs should be placed within 1cm of each other and share a common CIN(s). Separating the sources and CIN may produce undesirable voltage and current resonances at VIN. A small (0.1µF to 1µF) bypass capacitor between the chip VIN pin and ground, placed close to the LTC3701, is also suggested. A 10Ω resistor placed between CIN (C1) and the VIN pin provides further isolation between the two channels. The selection of COUT is driven by the effective series resistance (ESR). Typically, once the ESR requirement is satisfied, the capacitance is adequate for filtering. The output ripple (∆VOUT) is approximated by: 1 ∆VOUT ≈ IRIPPLE ESR + 8fC OUT where f is the operating frequency, COUT is the output capacitance and IRIPPLE is the ripple current in the inductor. The output ripple is highest at maximum input voltage since IRIPPLE increases with input voltage. Low Supply Operation Although the LTC3701 can function down to approximately 2V, the maximum allowable output current is reduced when VIN decreases below 3V. Figure 5 shows the amount of change as the supply is reduced down to 2V. Also shown is the effect of VIN on VREF as VIN goes below 2.3V. Setting Output Voltage The LTC3701 output voltages are each set by an external feedback resistive divider carefully placed across the output capacitor (see Figure 6). The resultant feedback signal is compared with an internal 0.8V reference by the 3701fa 12 LTC3701 U W U U APPLICATIO S I FOR ATIO error amplifier. The regulated output voltage is determined by: R2 VOUT = 0.8 V • 1 + R1 For most applications, an 80k resistor is suggested for R1. To prevent stray pickup, a 100pF capacitor is suggested across R1 close to the LTC3701. NORMALIZED VOLTAGE OR CURRENT (%) 105 100 95 VREF MAXIMUM OUTPUT CURRENT 90 85 80 75 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 INPUT VOLTAGE (V) 3701 F05 Figure 5. Line Regulation of VREF and Maximum Output Current VOUT R2 1/2 LTC3701 VFB 100pF R1 3701 F06 Figure 6. Setting Output Voltage The output of the phase detector is a pair of complementary current sources that charge or discharge the external filter network connected to the PLLLPF pin. The relationship between the voltage on the PLLLPF pin and operating frequency is shown in Figure 7 and specified in the electrical characteristics table. Note that the LTC3701 can only be synchronized to an external clock whose frequency is within the frequency range of the LTC3701’s internal oscillator, which is specified in the electrical characteristics table. A simplified block diagram of the PLL is shown in Figure 8. If the external frequency (VEXTCLK/MODE) is greater than the internal oscillator frequency fOSC, current is sourced continuously, pulling up the PLLLPF pin. When the external frequency is less than fOSC, current is sunk continuously, pulling down the PLLLPF pin. If the external and internal frequencies are the same but exhibit a phase difference, the current sources turn on for an amount of time corresponding to the phase difference. The voltage on the PLLLPF pin is adjusted until the phase and frequency of the external oscillators are identical. At the stable operating point, the phase comparator output is high impedance and the filter capacitor CLP holds the voltage. The loop filter components CLP and RLP smooth out the current pulses from the phase detector and provide a stable input to the voltage controlled oscillator. The filter components RLP and CLP determine how fast the loop acquires lock. Typically, RLP = 10k and CLP is 2200pF to 0.01µF. When not synchronized to an external clock, the 800 Phase-Locked Loop and Frequency Synchronization 700 650 FREQUENCY (kHz) The LTC3701 has a phase-locked loop comprised of an internal voltage-controlled oscillator and phase detector. This allows the turn-on of the external P-channel MOSFET of controller 1 to be locked to the rising edge of an external frequency source. The turn-on of controller 2’s external P-channel MOSFET is thus 180 degrees out of phase to the external clock. The nominal frequency range of the voltage-controlled oscillator is 280kHz to 775kHz. The phase detector is an edge sensitive digital type that provides zero degrees phase shift between the external and internal oscillators. This type of phase detector does not exhibit false lock to harmonics of the external oscillator. 750 600 550 500 450 400 350 300 250 0 0.4 0.8 1.2 1.6 2.0 PLLLPF PIN VOLTAGE (V) 2.4 3701 F07 Figure 7. Relationship Between Oscillator Frequency and Voltage at PLLLPF Pin 3701fa 13 LTC3701 U W U U APPLICATIO S I FOR ATIO internal oscillator frequency may be set by applying a DC voltage to the PLLLPF pin. 550kHz operation can be selected by floating the PLLLPF pin. The PLLLPF pin may be connected to voltages as high as VIN. 2.4V RLP CLP EXTCLK/ MODE EXTERNAL OSCILLATOR PLLLPF DIGITAL PHASE/ FREQUENCY DETECTOR 10k OSCILLATOR 3701 F08 Figure 8. Phase-Locked Loop Block Diagram typically much larger than the DC supply current. In continuous mode, IGATECHG = f • QP. 3) I2R losses are calculated from the DC resistances of the MOSFET, inductor and sense resistor. In continuous mode, the average output current flows through L but is “chopped” between the P-channel MOSFET in series with RSENSE and the output diode. The MOSFET RDS(ON) plus RSENSE multiplied by duty cycle can be summed with the resistance of L to obtain I2R losses. 4) The output diode is a major source of power loss at high currents and is worse at high input voltages. The diode loss is calculated by multiplying the forward voltage times the load current times the diode duty cycle. 5) Transition losses apply to the external MOSFET and increase with higher operating frequencies and input voltages. Transition losses can be estimated from: Transition Loss = 2 (VIN)2IO(MAX)CRSS(f) Efficiency Considerations The efficiency of a switching regulator is equal to the output power divided by the input power times 100%. It is often useful to analyze individual losses to determine what is limiting efficiency and which change would produce the most improvement. Efficiency can be expressed as: Efficiency = 100% – (L1 + L2 + L3 + …) where L1, L2, etc. are the individual losses as a percentage of input power. Although all dissipative elements in the circuit produce losses, five main sources usually account for most of the losses in LTC3701 circuits: 1) LTC3701 DC bias current, 2) MOSFET gate charge current, 3) I2R losses, 4) voltage drop of the output diode and 5) transition losses. 1) The VIN (pin) current is the DC supply current, given in the electrical characteristics, that excludes MOSFET driver currents. VIN current results in a small loss that increases with VIN. 2) MOSFET gate charge current results from switching the gate capacitance of the power MOSFET. Each time a MOSFET gate is switched from low to high to low again, a packet of charge dQ moves from PVIN to ground. The resulting dQ/dt is a current out of PVIN, which is Other losses, including CIN and COUT ESR dissipative losses and inductor core losses, generally account for less than 2% total additional loss. Foldback Current Limiting As described in the Output Diode Selection, the worstcase diode dissipation occurs with a short-circuited output when the diode conducts the current limit value almost continuously. To prevent excessive heating in the diode, foldback current limiting can be added to reduce the current in proportion to the severity of the fault. Foldback current limiting is implemented by adding diodes DFB1 and DFB2 between the output and the ITH/RUN pin as shown in Figure 9. In a hard short (VOUT = 0V), the current will be reduced to approximately 50% of the maximum output current. VOUT 1/2 LTC3701 R2 + DFB1 ITH/RUN VFB R1 DFB2 3701 F09 Figure 9. Foldback Current Limiting 3701fa 14 LTC3701 U W U U APPLICATIO S I FOR ATIO Checking Transient Response The regulator loop response can be checked by looking at the load transient response. Switching regulators take several cycles to respond to a step in load current. When a load step occurs, VOUT immediately shifts by an amount equal to (∆ILOAD)(ESR), where ESR is the effective series resistance of COUT. ∆ILOAD also begins to charge or discharge COUT, which generates a feedback error signal. The regulator loop then returns VOUT to its steady-state value. During this recovery time, VOUT can be monitored for overshoot or ringing. OPTI-LOOP compensation allows the transient response to be optimized over a wide range of output capacitance and ESR values. The ITH series RC-CC filter (see Functional Diagram) sets the dominant pole-zero loop compensation. The ITH external components shown in the Figure 1 circuit will provide an adequate starting point for most applications. The values can be modified slightly (from 0.2 to 5 times their suggested values) to optimize transient response once the final PC layout is done and the particular output capacitor type and value have been determined. The output capacitors need to be decided upon because the various types and values determine the loop feedback factor gain and phase. An output current pulse of 20% to 100% of full load current having a rise time of 1µs to 10µs will produce output voltage and ITH pin waveforms that will give a sense of the overall loop stability. The gain of the loop will be increased by increasing RC, and the bandwidth of the loop will be increased by decreasing CC. The output voltage settling behavior is related to the stability of the closedloop system and will demonstrate the actual overall supply performance. For a detailed explanation of optimizing the compensation components, including a review of control loop theory, refer to Application Note 76. A second, more severe transient is caused by switching in loads with large (>1µF) supply bypass capacitors. The discharged bypass capacitors are effectively put in parallel with COUT, causing a rapid drop in VOUT. No regulator can deliver enough current to prevent this problem if the load switch resistance is low and it is driven quickly. The only solution is to limit the rise time of the switch drive so that the load rise time is limited to approximately (25)(CLOAD). Thus a 10µF capacitor would require a 250µs rise time, limiting the charging current to about 200mA. Minimum On-Time Considerations Minimum on-time, tON(MIN), is the smallest amount of time that the LTC3701 is capable of turning the top MOSFET on and then off. It is determined by internal timing delays and the gate charge required to turn on the top MOSFET. The minimum on-time for the LTC3701 is about 250ns. Low duty cycle and high frequency applications may approach this minimum on-time limit and care should be taken to ensure that: tON(MIN) < VOUT f • VIN If the duty cycle falls below what can be accommodated by the minimum on-time, the LTC3701 will begin to skip cycles. The output voltage will continue to be regulated, but the ripple current and ripple voltage will increase. PC Board Layout Checklist When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the LTC3701. These items are illustrated graphically in the layout diagram of Figure 10. Figure 11 illustrates the current waveforms present in the various branches of the 2-phase regulators. Check the following in your layout: 1) Are the sense resistors and P-channel MOSFETs for the two channels located within 1cm of each other with a common connection at CIN? Do not attempt to split the input decoupling for the two channels as it can cause a large resonant loop. 3701fa 15 LTC3701 U W U U APPLICATIO S I FOR ATIO 2) Are the signal and power grounds kept separate? The LTC3701 signal ground consists of the feedback resistor divider, the ITH/RUN compensation network, and Pin 4. The power ground consists of the (–) terminal of CIN, the (–) terminals of COUT1,2, the anodes of the Schottky diodes, and Pin 13 of the LTC3701. The power ground traces should be kept short, direct, and wide. Connect the anode of the Schottky diodes directly to the input capacitor ground. 3) Do the VFB pins connect directly to the feedback resistors? Put the feedback resistors close to the VFB pins. The traces connecting the top feedback resistors to the corresponding output capacitor should to be Kelvin traces. 4) Are the SENSE– and SENSE+ leads routed together with minimum PC trace spacing? The (optional) filter capacitor between SENSE+ and SENSE– should be as close as possible to the IC. Ensure accurate current sensing with Kelvin connections at the sense resistor. 5) Keep the switching nodes (SW1, SW2) and top gate nodes (PGATE1, PGATE2) away from small-signal nodes, especially the opposite channel’s voltage and current sensing feedback pins. All of these nodes have large and fast moving signals and therefore should be keep on the “output side” of the LTC3701 and occupy minimum PC trace area. From Figure 2, SF = 57%. RSENSE = SF 0.57 = = 0.03Ω 12.7 • IOUT • 100 12.7 • 1.5 In the application, a 0.03Ω resistor is used. The PLLLPF pin will be left floating, so the LTC3701 will operate at its default frequency of 550kHz. For continuous operation in Burst Mode, the required minimum inductor value is: LMIN = 4.2V – 2.5V 2.5V + 0.3V = 2.00µH 0.03V 4.2V + 0.3V 550kHz 0.03Ω For the selection of the external MOSFET, the RDS(ON) must be guaranteed at 2.5V since the LTC3701 has to work down to 2.7V. Let’s assume that the MOSFET dissipation is to be limited to PP = 250mW and its thermal resistance is 50°C/W. Hence, the junction temperature at TA = 25°C will be 37.5°C and δp = 0.005 • (37.5 – 25) = 0.0625. The required RDS(ON) is then given by: RDS(ON) ≈ PP DC • IOUT2 (1 + δp) = 0.11Ω The P-channel MOSFET requirement can be met by an Si3443DV. As a design example for one channel, assume VIN will be operating from a maximum of 4.2V down to a minimum of 2.7V. Load current requirement is a maximum of 1.5A , but most of the time it will be in a standby mode requiring only 2mA. Efficiency at both low and high load currents is important. Burst Mode operation at light loads is desired. Output voltage is 2.5V. The requirement for the Schottky diode is the most stringent when VOUT = 0V, i.e., short circuit. With a 0.03Ω RSENSE resistor, the short-circuit current through the Schottky is 0.1/0.03 = 3.3A. An MBRS340T3 Schottky diode is chosen. With 3.3A flowing through, the diode is rated with a forward voltage of 0.4V. Therefore, the worstcase power dissipated by the diode is 1.32W. The addition of DFB1 and DFB2 (Figure 6) will reduce the diode dissipation to approximately 0.66W V + VD Maximum Duty Cycle = OUT = 93% VIN(MIN) + VD The input capacitor requires an RMS current rating of at least 0.75A at temperature, and COUT will require an ESR of 0.1Ω for optimum efficiency. Design Example 3701fa 16 LTC3701 U W U U APPLICATIO S I FOR ATIO + COUT1 2 3 4 5 6 7 8 SENSE1 – SENSE1 ITH/RUN1 VIN VFB1 SGND + PGATE1 LTC3701 PGND VFB2 PGATE2 ITH/RUN2 PGOOD PLLLPF EXTCLK/MODE SENSE2 – M1 VOUT1 RSENSE1 16 15 D1 14 13 VIN + 12 CIN 11 10 9 SENSE2 + D2 L2 M2 + 1 – + L1 RSENSE2 COUT2 – + VOUT2 BOLD LINES INDICATE HIGH CURRENT PATHS 3701 F10 Figure 10. LTC3701 Layout Diagram RSENSE1 SW1 L1 D1 VOUT1 COUT1 + RL1 VIN RIN CIN + RSENSE2 BOLD LINES INDICATE HIGH, SWITCHING CURRENT LINES. KEEP LINES TO A MINIMUM LENGTH. SW2 L2 D2 VOUT2 COUT2 + RL2 3701 F11 Figure 11. Branch Current Waveforms 3701fa 17 LTC3701 U TYPICAL APPLICATIO S 2-Phase, Synchronizable Dual Output Step-Down DC/DC Converter VIN 2.7V to 9.8V 1 R6 78.7k 2 R10 C6 220pF 10k 3 4 5 R5 10k C4 220pF R8 80k R9 100k 6 7 8 10k SENSE1 – SENSE1 + ITH/RUN1 VIN VFB1 SGND PGATE1 LTC3701 PGND VFB2 PGATE2 ITH/RUN2 PGOOD PLLLPF EXTCLK/MODE SENSE2 – SENSE2 + 16 M1 R1 0.03Ω 15 14 L1 4.7µH D1 VOUT1 2.5V 2A + C1 47µF GND 13 C2 10µF 12 100k 11 D2 VIN L2 4.7µH 10 9 C5 47µF VOUT2 1.8V 2A M2 R2 0.03Ω 10nF + R7 169k 3701 TA02 C1, C5: SANYO 6TPA47M C2: TAIYO YUDEN LMK325BJ106K-T M1, M2: Si3443DV R1, R2: DALE 0.25W D1, D2: IR10BQ015 L1, L2: MURATA LQN6C-4R7 2-Phase, 550kHz Single Output Step-Down DC/DC Converter Optional Output Sequencing Circuit VIN 2.5V TO 9.8V R7 169k VIN 1 R6 78.7k 0.01µF 2 3 15k 3 LT1004-1 1.2V VOUT1 + LT1797 4 – 4 5 1 1N4148 5 FB2 R5 10k 2 C4 220pF 6 7 8 3701 TA05 SENSE1 – SENSE1 + ITH/RUN1 VIN VFB1 SGND PGATE1 LTC3701 PGND VFB2 PGATE2 ITH/RUN2 PGOOD PLLLPF EXTCLK/MODE SENSE2 – 16 M1 R1 0.03Ω 15 14 L1 4.7µH D1 + 13 VOUT 2.5V 4A C1 47µF C2 10µF 12 D2 11 10 L2 4.7µH R2 0.03Ω 9 SENSE2 + M2 C1: SANYO 6TPA47M C2: TAIYO YUDEN LMK325BJ106K-T D1, D2: IR10BQ015 3701 TA03 L1, L2: MURATA LQN6C-4R7 M1, M2: Si3443DV R1, R2: DALE 0.25W Single Cell Li-Ion to 3.3V (Zeta Converter) and 1.8V (Buck Converter) VIN 2.7V to 4.2V R7 249k R8 80.6k R9 100k 1 R10 C6 470pF 47k R5 10k C4 220pF 10k 3 SENSE1 – VFB1 2 SENSE1 + VIN 16 15 14 ITH/RUN1 PGATE1 13 4 LTC3701 SGND PGND 12 6 ITH/RUN2 PGATE2 11 5 PGOOD VFB2 10 7 PLLLPF EXTCLK/MODE 9 8 SENSE2 + SENSE2 – 10nF L1B M1 • • R1 0.025Ω L1A D1 VOUT1 3.3V 1A + C1 C2 22µF GND 100k D2 VIN R2 0.03Ω L2 4.7µH + R6 78.7k C3 10µF C5 47µF VOUT2 1.8V 2A M2 3701 TA06 C1, C5: SANYO 6TPA47M C2: TAIYO YUDEN JMK325BJ226MM C3: TAIYO YUDEN JMK316BJ106ML D1, D2: IR10BQ015 L1A, L1B: COILTRONICS CTX5-2 L2: MURATA LQN6C-4R7 M1, M2: Si3443DV R1, R2: DALE 0.25W 3701fa 18 LTC3701 U TYPICAL APPLICATIO S 2-Phase, Synchronizable Dual Output Step-Down DC/DC Converter with 4A Output Currents 1nF R6 78.7k 1 2 R10 C6 220pF 10k 3 4 5 R8 80k R5 10k C4 220pF R9 100k 6 7 8 10k SENSE1 – SENSE1 + ITH/RUN1 VIN PGATE1 VFB1 SGND LTC3701 PGND VFB2 PGATE2 ITH/RUN2 PGOOD PLLLPF EXTCLK/MODE SENSE2 – SENSE2 + 16 15 R1 0.012Ω VIN 2.7V to 9.8V M1 L1 1.5µH 10Ω 14 13 D1 1µF + C1 47µF GND VOUT1 2.5V 4A C2 10µF 12 11 100k D2 VIN L2 1.5µH 10 9 R2 0.015Ω 10nF + R7 169k C5 47µF VOUT2 1.8V 4A M2 1nF 3701 TA02 D1, D2: IR30BQ015 L1, L2: COILCRAFT DO3316P-152 C1, C5: SANYO 6TPA47M C2: TAIYO YUDEN LMK325BJ106K-T M1, M2: Si9803DY R1, R2: DALE 0.25W U PACKAGE DESCRIPTIO GN Package 16-Lead Plastic SSOP (Narrow .150 Inch) (Reference LTC DWG # 05-08-1641) .189 – .196* (4.801 – 4.978) .045 ±.005 16 15 14 13 12 11 10 9 .254 MIN .009 (0.229) REF .150 – .165 .229 – .244 (5.817 – 6.198) .0165 ± .0015 .150 – .157** (3.810 – 3.988) .0250 TYP RECOMMENDED SOLDER PAD LAYOUT 1 .015 ± .004 × 45° (0.38 ± 0.10) .007 – .0098 (0.178 – 0.249) 2 3 4 5 6 7 .053 – .068 (1.351 – 1.727) 8 .004 – .0098 (0.102 – 0.249) 0° – 8° TYP .016 – .050 (0.406 – 1.270) NOTE: 1. CONTROLLING DIMENSION: INCHES INCHES 2. DIMENSIONS ARE IN (MILLIMETERS) .008 – .012 (0.203 – 0.305) .0250 (0.635) BSC 3. DRAWING NOT TO SCALE *DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE **DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE GN16 (SSOP) 0502 3701fa Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 19 LTC3701 U TYPICAL APPLICATIO Dual Input Voltage Single Output, 2-Phase, 550kHz, Step-Down DC/DC Converter R7 169k 1 SENSE1 – 2 R6 78.7k R8 10k C5 220pF SENSE1 + ITH/RUN1 3 VIN VFB1 4 SGND 5 6 7 PGATE1 LTC3701 PGND VFB2 PGATE2 ITH/RUN2 PGOOD PLLLPF EXTCLK/MODE 8 SENSE2 – SENSE2 + 16 15 14 VIN1 2.5V TO 9.8V VIN1 ≥ VIN2 M1 R1 0.03Ω L1 4.7µH D1 + 13 VOUT 2.5V 2A C1 47µF C2 10µF 12 D2 11 10 9 L2 4.7µH R2 0.03Ω C3 10µF M2 3701 TA04 C1: SANYO 6TPA47M C2, C3: TAIYO YUDEN LMK325BJ106K-T D1, D2: IR10BQ015 VIN2 2.5V TO 9.8V L1, L2: MURATA LQN6C-4R7 M1, M2: Si3443DV R1, R2: DALE 0.25W RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LTC1622 Synchronizable Low Input Voltage Current Mode Step-Down DC/DC Controller VIN 2V to 10V, Burst Mode Operation, 8-Lead MSOP LTC1628/ LTC1628-PG Dual High Efficiency, 2-Phase Synchronous Step Down Controllers Constant Frequency, Standby, 5V and 3.3V LDOs, VIN to 36V, 28-Lead SSOP LTC1629/ LTC1629-PG 20A TO 200A PolyPhaseTM High Efficiency Controllers Expandable Up to 12 Phases, No Heat Sinks, VIN to 36V, 28-Lead SSOP LTC1702A No RSENSETM 2-Phase Dual Synchronous Controller 550kHz, No Sense Resistor, GN24, VIN to 7V LTC1708-PG Dual High Efficiency, 2-Phase Synchronous Step-Down Switching Regulators 1.3V≤ VOUT ≤ 3.5V, Current Mode, 3.5V ≤ VIN ≤ 36V LTC1735 High Efficiency Synchronous Step-Down Controller Burst Mode Operation, 16-Pin Narrow SSOP, Fault Protection, 3.5V ≤ VIN ≤ 36V LTC1767 1.2A IOUT, 1.25MHz, High Efficiency Step-Down DC/DC Converter 90% Efficiency, VIN: 3V to 25V, VOUT = 1.2V, IQ = 1mA, ISD = 6µA, MS8E Package LTC1772 Constant Frequency Current Mode Step-Down DC/DC Controller 2.5V ≤ VIN ≤ 9.8V, IOUT Up to 4A, SOT-23 Package, 550kHz LTC1773 Synchronous Step-Down Controller 2.65V ≤ VIN ≤ 8.5V, IOUT Up to 4A, 10-Lead MSOP LTC1778 No RSENSE Synchronous Step-Down Controller Current Mode Operation Without Sense Resistor, Fast Transient Response, 4V ≤ VIN ≤ 36V LTC1872 Constant Frequency Current Mode Step-Up Controller 2.5V ≤ VIN ≤ 9.8V, SOT-23 Package, 550kHz LTC1929 Constant Frequency Current Mode 2-Phase Synchronous Controller Up to 42A, No Heat Sink, 3.5V ≤ VIN ≤ 36V LTC3411 1.25A (IOUT), 4MHz, Synchronous Step-Down DC/DC Converter 95% Efficiency, VIN: 2.5V to 5.5V, VOUT = 0.8V, IQ = 60µA, ISD = <1µA, MS Package LTC3412 2.5A (IOUT), 4MHz, Synchronous Step-Down DC/DC Converter 95% Efficiency, VIN: 2.5V to 5.5V, VOUT = 0.8V, IQ = 60µA, ISD = <1µA, TSSOP-16E Package LTC3700 Constant Frequency Step-Down Controller with LDO Regulator 2.65≤ VIN␣ ≤␣ 9.8V, 550kHz, 10-Lead SSOP LTC3728/LTC3728L Dual, 550kHz, 2-Phase Synchronous Step-Down Switching Regulator Constant Frequency, VIN to 36V, 5V and 3.3V LDOs, 5mm × 5mm QFN or 28-Lead SSOP PolyPhase and No RSENSE are trademarks of Linear Technology Corporation. 3701fa 20 Linear Technology Corporation LT/TP 0403 1K • PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com LINEAR TECHNOLOGY CORPORATION 2002