LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com SNLS271I – APRIL 2007 – REVISED APRIL 2013 3 Gbps, HD, SD, DVB-ASI SDI Serializer and Cable Driver With LVDS Interface Check for Samples: LMH0040, LMH0050, LMH0070, LMH0340 FEATURES DESCRIPTION • • • • • • • The LMH0340/0040/0070/0050 SDI Serializers are part of TI’s family of FPGA-Attach SER/DES products supporting 5-bit LVDS interfaces with FPGAs. An FPGA Host will format data with supplied IP such that the output of the LMH0340 is compliant with the requirements of DVB-ASI, SMPTE 259M-C, SMPTE 292M and SMPTE 424M standards. See Table 1 for details on which Standards are supported per device. 1 2 LVDS Interface to Host FPGA No External VCO or Clock Ref Required Integrated Variable Output Cable Driver 3.3V SMBus Configuration Interface Integrated TXCLK PLL Cleans Clock Noise Small 48-Pin WQFN Package Industrial Temperature range: -40°C to 85°C APPLICATIONS • SDI Unterfaces for: – Video Cameras – DVRs – Video Switchers – Video Editing Systems KEY SPECIFICATIONS • • • Output Compliant With SMPTE 424M, SMPTE 292M, SMPTE 259M-C and DVB-ASI (See Table 1) Typical Power Dissipation: 440 mW 30 ps Typical Output Jitter (HD, 3G) The interface between the SER (Serializer) and the FPGA consists of a 5 bit wide LVDS data bus, an LVDS clock and an SMBus interface. The LMH0340/0040/0070 SER devices include an integrated cable driver which is fully compliant with all of the SMPTE specifications listed above. The LMH0050 has a CML output driver that can drive a differential transmission line or interface to a cable driver. The FPGA-Attach SER/DES family is supported by a suite of IP which allows the design engineer to quickly develop video applications using the SER/DES products. The SER is packaged in a physically small 48-pin WQFN package. General Block Diagram SDA SCK SMB_CS LOCK SMBus Control GPIO[2:0] RESET DVB_ASI TX3 TX2 TX1 TX0 Parallel to Serial 5:1 Bypassable 8b10b Encode TX4 TXOUT SMPTE Cable Driver TXCLK LVDS Receivers PLL Clock Generation 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007–2013, Texas Instruments Incorporated LMH0040, LMH0050 LMH0070, LMH0340 SNLS271I – APRIL 2007 – REVISED APRIL 2013 www.ti.com 37 TXCLK+ 38 TXCLK- 39 TX0+ 40 TX0- 41 TX1+ 42 TX1- 43 TX2+ 44 TX2- 45 TX3+ 46 TX3- 47 TX4+ 48 TX4- Connection Diagram VDD3V3 1 36 VDD3V3 RSVH_H 2 35 VDD2V5 GPIO_0 3 34 SMB_CS LMH0340, LMH0070, LMH0040, LMH0050, GPIO_1 4 RSVD_H 5 DVB_ASI 6 33 SCK 32 SDA TOP VIEW (not to scale) 31 LOCK GND 8 48-pin WQFN Package 29 GND GND 9 DAP = GND VDD2V5 7 30 RESET 28 VDDPLL GND 10 27 LF_CP GPIO_2 11 26 LF_REF GND 24 GND 23 GND 22 GND 21 DNC 20 DNC 19 VDD2V5 18 TXOUT- 17 TXOUT+ 16 VDD2V5 15 RSET 14 25 VDD2V5 GND 13 GND 12 Figure 1. Connection Diagram for 48L WQFN Package 2 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com SNLS271I – APRIL 2007 – REVISED APRIL 2013 PIN DESCRIPTIONS Pin Name Type Description TX[4:0]+ TX[4:0]- Input, LVDS LVDS Data Input Pins Five channel wide DDR interface. Internal 100Ω termination. TXCLK+ TXCLK- Input, LVDS LVDS Clock Input Pins DDR Interface. Internal 100Ω termination. TXOUT+ Output, CML Serial Digital Interface Output Pin Non-Inverting Output TXOUT- Output, CML Serial Digital Interface Output Pin Inverting Output SDA I/O, LVCMOS SMBus Data I/O Pin SCK Input, LVCMOS SMBus Clock Input Pin SMB_CS Input, LVCMOS SMBus Chip Select Input Pin Device is selected when High. LVDS Input Interface Serial Output Interface SMBus Interface Control and Configuration Pins RESET Input, LVCMOS Reset Input Pin H = normal mode L = device in RESET LOCK Output, LVCMOS PLL LOCK Status Output H = unlock condition L = Device is Locked DVB_ASI Input, LVCMOS DVB_ASI Select Input H = DVB_ASI Mode enabled L = Normal Mode enabled GPIO[2:0] I/O, LVCMOS General Purpose Input / Output Software configurable I/O pins. RSVD_H Input, LVCMOS Configuration Input – Must tie High Pull High via 5 kΩ resistor to VDD3V3 RSET Input, analog Serial Output Amplitude Control Resistor connected from this pin to ground to set the signal amplitude. Nominally 8.06kΩ for 800mV output (SMPTE). LF_CP Input, analog Loop Filter Connection LF_REF Input, analog Loop Filter Reference Analog Inputs DNC Do Not Connect – Leave Open Power Supply and Ground VDD3V3 Power 3.3V Power Supply connection VDDPLL Power 3.3V PLL Power Supply connection VDD2V5 Power 2.5V Power Supply connection GND Ground Ground connection – The DAP (large center pad) is the primary GND connection for the device and must be connected to Ground along with the GND pins. Table 1. Feature Table Device SMPTE 424M Support (3G) SMPTE 292M Support (HD) SMPTE 259M Support (SD) DVB-ASI Support SMPTE compliant Cable Driver LMH0340 X X X X X X X X X X X X X X LMH0040 LMH0070 LMH0050 X Copyright © 2007–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 3 LMH0040, LMH0050 LMH0070, LMH0340 SNLS271I – APRIL 2007 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) −0.3V to +4.0V Supply Voltage (VDD3V3) −0.3V to +3.0V Supply Voltage (VDD2V5) LVCMOS input voltage −0.3V to (VDD3V3+0.3V) LVCMOS output voltage −0.3V to (VDD3V3+0.3V) SMBus I/O voltage -0.3V to +3.6V LVDS Input Voltage -0.3V to +3.6V Junction Temperature +150°C Storage Temperature −65° to 150°C Thermal Resistance— Junction to Ambient—θJA ESD Rating—Human Body Model, (1) (2) 25°C/W ≥±8kV 1.5 KΩ, 100 pF “Absolute Maximum Ratings” are limits beyond which the safety of the device cannot be ensured. It is not implied that the device will operate up to these limits. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Recommended Operating Conditions Parameter Min Typ Max Units Supply Voltage (VDD3V3-GND) 3.135 3.3 3.465 V Supply Voltage (VDD2V5-GND) 2.375 2.5 2.625 V 100 mVP-P +85 °C Supply noise amplitude (10 Hz to 50 MHz) −40 Ambient Temperature +25 Case Temperature TXCLK input frequency 100 °C LMH0340 27 297 MHz LMH0040 27 149 MHz LMH0070 26.5 LMH0050 27 27 LVDS PCB board trace length (mismatch <2%) Output Driver Pullup Resistor Termination Voltage (1) 4 (1) 2.5 28 MHz 149 MHz 25 cm 2.625 V Applies to LMH0340, LMH0040, and LMH0070. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com SNLS271I – APRIL 2007 – REVISED APRIL 2013 Electrical Characteristics Over supply and Operating Temperature ranges unless otherwise specified. Symbol Parameter Condition IDD2.5 2.5V supply current for LMH0340, LMH0040, or LMH0070 2.5V supply current for LMH0050 IDD3.3 3.3V supply current for LMH0340, LMH0040, or LMH0070 3.3V supply current for LMH0050 PD (1) Power Consumption (1) Min Typ Max Units 2.97 Gbps 93 102 mA 1.485 Gbps 80 87 mA 270 Mbps 63 69 mA 1.485 Gbps 87 95 mA 270 Mbps 70 75 mA 2.97 Gbps 73 85 mA 1.485 Gbps 73 85 mA 270 Mbps 73 85 mA 1.485 Gbps 73 85 mA 270 Mbps 73 85 mA LMH0340 - 2.97 Gbps 475 545 mW LMH0040 - 1.485 Gbps 440 510 mW LMH0050 - 1.485 Gbps 460 525 mW LMH0050 - 270 Mbps 415 485 mW LMH0070 - 270 Mbps 400 470 mW Typical Parameters measured at VDD3V3=3.3V, VDD2V5=2.5V, TA=25°C. They are for reference purposes and are not production tested. Control Pin Electrical Characteristics Over supply and Operating Temperature ranges unless otherwise specified. Applies to DVB_ASI, RESET, GPIO[2:0] and LOCK. (1) Symbol Parameter VIH High Level Input Voltage VIL Low Level Input Voltage VOH High Level Output Voltage IOH=−2 mA VOL Low Level Output Voltage IOL=2 mA VCL Input Clamp Voltage ICL=−18 mA IIN Input Current VIN=0.4V, 2.5V or VDD IOS Output Short Circuit Current VOUT=0V (1) Condition Min Typ Max Units 2.0 VDD3V3 V 0 0.8 V 2.7 3.3 V 0.3 -0.79 -35 V -1.5 V 35 μA -40 mA Typical Parameters measured at VDD3V3=3.3V, VDD2V5=2.5V, TA=25°C. They are for reference purposes and are not production tested. LVDS Input Electrical Characteristics Over supply and Operating Temperature ranges unless otherwise specified. Symbol Parameter Condition VTH Differential Input High threshold 0.05V<VCM<2.4V VTL Differential Input Low threshold RLVIN Input Impedance (1) (1) Min Typ Max Units +100 mV −100 Measured between LVDS pairs 85 mV 100 115 Ω Typical Parameters measured at VDD3V3=3.3V, VDD2V5=2.5V, TA=25°C. They are for reference purposes and are not production tested. Copyright © 2007–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 5 LMH0040, LMH0050 LMH0070, LMH0340 SNLS271I – APRIL 2007 – REVISED APRIL 2013 www.ti.com LVDS Switching Characteristics Over supply and Operating Temperature ranges unless otherwise specified. (1) Symbol Parameter Condition Min tCIP TxCLKIN Period See Figure 2 3.2 tCIT TxCLKIN Transition Time See Figure 3 0.5 tCIH TxCLKIN IN High Time See Figure 2 0.7T tCIL TxCLKIN IN Low Time See Figure 2 0.7T tXIT TxIN Transition Time tSTC TxIN Setup to TxCLKIN tHTC TxIN Hold to TxCLKIN (1) (2) Typ Max Units 2T 37 ns 1.0 3.0 ns T 1.3T ns T 1.3T ns 3 ns 0.15 See Figure 2 (2) -550 ps 900 ps Typical Parameters measured at VDD3V3=3.3V, VDD2V5=2.5V, TA=25°C. They are for reference purposes and are not production tested. Parameter uses default settings in registers: 0x24'h and 0x30'h. tCIP/2 +100 mV TXCLK 0V -100 mV tCIL, tCIH tSTC tHTC Hold Setup TXn 0V Figure 2. LVDS Input Timing Diagram 80% 80% TXCLK 20% 20% tCIT tCIT Figure 3. Transmit Clock Transition Times SMBus Input Electrical Characteristics Over supply and Operating Temperature ranges unless otherwise specified. Symbol Parameter VSIL Data, Clock Input Low Voltage VSIH Data, Clock Input High Voltage ISPULLUP Current through pull-up resistor or current source VSDD Nominal Bus Voltage ISLEAKB Input Leakage per bus segment ISLEAKP Input Leakage per pin CSI Capacitance for SMBdata and SMBclk (2) (3) RSTERM Termination Resistance VSDD3V3 (4) (1) (2) (3) (4) 6 Condition (1) Min Typ 2 (2) Max Units 0.8 V VSDD 4 (2) V mA 2.375 3.6 V −200 200 μA −10 10 μA 10 pF (3) (2) 1000 Ω Typical Parameters measured at VDD3V3=3.3V, VDD2V5=2.5V, TA=25°C. They are for reference purposes and are not production tested. Recommended value—Parameter is not tested. Recommended maximum capacitance load per bus segment is 400 pF. Maximum termination voltage should be identical to the device supply voltage. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com SNLS271I – APRIL 2007 – REVISED APRIL 2013 SMBus Switching Characteristics Over supply and Operating Temperature ranges unless otherwise specified. (1) Symbol Parameter fSMB Bus Operating Frequency 10 tBUF Bus free time between stop and start condition 4.7 μs tHD:STA Hold time after (repeated) start condition. After this period, the first clock is generated 4.0 μs tSU:STA Repeated Start condition setup time 4.7 μs tSU:STO Stop Condition setup time 4.0 μs tHD:DAT Data hold time 300 ns tSU:DAT Data setup time 250 ns tLOW Clock Low Time 4.7 μs tHIGH Clock High Time tF Clock/data fall time tR Clock/data rise time tSU:CS SMB_CS setup time tPOR Time in which a device must be operational after power on (1) Condition Min At ISPULLUP = MAX Typ 4.0 20% to 80% Max Units 100 kHz 50 μs 300 ns 1000 ns 500 ms 30 ns Typical Parameters measured at VDD3V3=3.3V, VDD2V5=2.5V, TA=25°C. They are for reference purposes and are not production tested. tSU:CS SMB_CS tLOW tR tHIGH SCK tHD:STA tBUF tF tHD:DAT tSU:STA tSU:STO tSU:DAT SDA SP ST SP ST NOTE: (levels are VSIL and VSIH) Figure 4. SMBus Timing Parameters SDI Output Characteristics — LMH0340 / LMH0040 / LMH0070 Over supply and Operating Temperature ranges unless otherwise specified. (1) Symbol Parameter Condition Min Typ Max Units VOD SDI Output Voltage into 75Ω load 720 800 880 mV DR SDI Output Datarate LMH0340 270 2,970 Mbps LMH0040 270 1,485 Mbps tr SDI Output Rise Time LMH0070 270 2.97 Gbps 90 135 ps 1.485 Gbps 90 220 ps 700 1000 ps 90 135 ps 90 220 ps 700 1000 ps <1.485 Gbps tf SDI Output Fall Time 400 2.97 Gbps 1.485 Gbps <1.485 Gbps (1) 400 Mbps Typical Parameters measured at VDD3V3=3.3V, VDD2V5=2.5V, TA=25°C. They are for reference purposes and are not production tested. Copyright © 2007–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 7 LMH0040, LMH0050 LMH0070, LMH0340 SNLS271I – APRIL 2007 – REVISED APRIL 2013 www.ti.com SDI Output Characteristics — LMH0340 / LMH0040 / LMH0070 (continued) Over supply and Operating Temperature ranges unless otherwise specified. (1) Symbol Parameter Condition Δtt Mismatch between rise and fall time ≥1.485 Gbps tSD Propagation Delay Latency See Figure 5 tJ Peak to Peak Alignment Jitter ≥1.485 Gbps (3) 30 50 270 Mbps (3) 100 200 RL tOS (2) (3) (4) Min Typ (2) Max Units 30 ps 9.5 TXCLK cycle ps ps Output Return Loss — EVK Specification (4) Measured 5 MHz to 1485 MHz 15 20 dB Measured 1485 MHz to 2970 MHz 10 15 dB Output Overshoot (2) 2.97 Gbps 8 % 1.485 Gbps 5 % 270 Mbps 2 % Specification ensured by characterization. Measured in accordance with SMPTE RP184. 100% production tested. Output Return Loss specification applies to measurement on the EVK PCB (LMH0340 ALP Daughter Card) per SMPTE requirements. CML Output Characteristics — LMH0050 Over supply and Operating Temperature ranges unless otherwise specified. (1) Symbol Parameter Condition Min Max Units VOD Output Voltage into 100 Ω differential load 1175 1450 mV DR Data Rate 270 1485 Mbps tr Output Rise Time 100 ps tf Output Fall Time 100 ps tJ Peak-to-Peak Alignment Jitter 1.485 Gbps 25 50 ps ROUT Output Termination Resistance Output Pin to VDD2V5 Pin 50 60 Ω (1) Typ 40 Typical Parameters measured at VDD3V3=3.3V, VDD2V5=2.5V, TA=25°C. They are for reference purposes and are not production tested. Device Switching Characteristics Over supply and Operating Temperature ranges unless otherwise specified. (1) Symbol Parameter Condition Max Units tTPLD Device Lock Time 2.97 Gbps 10 ms 1.485 Gbps 11 ms 270 Mbps 15 ms (1) Min Typ Typical Parameters measured at VDD3V3=3.3V, VDD2V5=2.5V, TA=25°C. They are for reference purposes and are not production tested. TXN Symbol N Symbol N+1 Symbol N+2 Symbol N+3 Symbol N+4 tSD TXCLK Symbol N-4 Symbol N-3 Symbol N-2 Symbol N-1 Symbol N TXOUT Figure 5. LVDS Interface Propagation Delay 8 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com SNLS271I – APRIL 2007 – REVISED APRIL 2013 FUNCTIONAL DESCRIPTION DEVICE OPERATION The SER is used in digital video signal origination equipment. It is intended to be operated in conjunction with an FPGA host which preprocesses data for it, and then provides this data over the five bit wide data path. Provided the host has properly formatted the data for the SER, the output of the device will be compliant with DVB-ASI, SMPTE 259M-C, SMPTE 292M or SMPTE 424M depending upon the output mode selected. Texas Instruments offers IP in source code format to perform the appropriate formatting of the data, as well as evaluation platforms to assist in the development of target applications. For more information please contact your local Texas Instruments Sales Office/Distributor. POWER SUPPLIES The SER has several power supply pins, at 2.5V as well as 3.3V. It is important that these pins all be connected, and properly bypassed. Bypassing should consist of parallel 4.7μF and 0.1μF capacitors as a minimum, with a 0.1μF capacitor on each power pin. The device has a large contact in the center of the bottom of the package. This contact must be connected to the system GND as it is the major ground connection for the device. A 22 μF capacitor is required on the VDDPLL pin which is connected to the 3.3V rail. Discrete bypassing is ineffective above 30 MHz to 50 MHz in power plane-based distribution systems. Above this frequency range, the intrinsic capacitance of the power-ground system can be used to provide additional RF bypassing. To make the best use of this, make certain that there are PCB layers dedicated to the Power supplies and to GND, and that they are placed next to each other to provide a distributed capacitance between power and GND. The SER will work best when powered from linear regulators. The output of linear regulators is generally cleaner with less noise than switching regulators. Output filtering and power system frequency compensation are generally simpler and more effective with linear regulators. Low dropout linear regulators are available which can usually operate from lower input voltages such as logic power supplies, thereby reducing regulator power dissipation. Cascading of low dropout regulators should not be done since this places the entire supply current load of both load systems on the first regulator in the cascade and increases its loading and thermal output. POWER UP The 3.3V power supply should be brought up before the 2.5V supply. The timing of the supply sequencing is not important. The device has a power on reset sequence which takes place once both power supplies are brought up. This sequence will reset all register contents to their default values, and will place the PLLs into link acquisition mode, attempting to lock on the TXCLK input. RESET There are three ways in which the device may be reset. There is an automatic reset which happens on power-up; there is a reset pin, which when brought low will reset the device, with normal operation resuming when the pin is driven high again. The third way to reset the device is a soft reset, implemented via a write to the reset register. This reset will put all of the register values back to their default values, except it will not affect the address register value if the SMBus default address has been changed. LVDS INPUTS The SER has LVDS inputs that conform with the ANSI/TIA/EIA-644–A Standard. These inputs have an internal 100 Ω resistor across the inputs which allows for the closing of a current loop interface from the LVDS driver in the host. It is recommended that the PCB trace between the FPGA and the transmitter be less than 25cm. Longer PCB traces may introduce signal degradation as well as channel skew which could cause serialization errors. This connection between the host and the SER should be over a controlled impedance transmission line with an impedance which matches the termination resistor – usually 100 Ω. Setup and hold times are specified in LVDS Switching Characteristics, however there is the ability to change these by use of the CLK delay adjustment available via the SMBus, and writing to register 0x30'h. Copyright © 2007–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 9 LMH0040, LMH0050 LMH0070, LMH0340 SNLS271I – APRIL 2007 – REVISED APRIL 2013 www.ti.com LVDS DATA ORDER When serializing the data, the data bit latched in on TX0 is output first, followed by TX1, TX2, TX3 and then TX4. If starting with a 10 bit word, T0..T9, with T0 being the LSB, and it is desired that this be serialized such that the LSB is sent out first, then the least significant 5 bit word would be provided to the serializer first, followed by the most significant word, and the resulting serialized output would have the LSB being sent first, and the 10 bit MSB (T9) would be transmitted last. If it is desired to reverse the serialization order, such that the bit presented on TX4 is output first, this mode of operation may be selected via register 0x2E'h. LOOP FILTER The SER has an internal PLL which is used to generate the serialization clock from the parallel clock input. The loop filter for this PLL is external, and for optimum results in Serial Digital Interface applications, a capacitor and a resistor in series should be connected between pins 26 and 27. Recommended value for the capacitor is 0.1 μF. Recommended value for the resistor is 500 Ω. PLL FILTER / BYPASS The SER has an external filter capacitor for the PLL. The recommended value for this capacitor is 22 μF with a connection to the 3.3V rail. DVB_ASI MODE The SER has a special mode for DVB-ASI. In this mode, the input signal on TX4± is treated as a data valid bit, if high, then the four bit nibbles from TX0-TX3 are taken to form an 8 bit word, which is then converted to a 10 bit code via an internal 8b10b encoder and this 10 bit word is serialized and driven on the output. The nibble taken in on the rising edge of the clock is the most significant nibble and the nibble taken in on the falling edge is the least significant nibble. If TX4± is low, then the input on TX0-TX3 are ignored and the 10b idle character is inserted in the output stream. The Idle character can be reprogrammed to be any 10 bit code desired via registers 0x11'h and 0x12'h. SDI OUTPUT INTERFACING The serial outputs provide low-skew complimentary or differential signals. The output buffer is a current mode design, with a high impedance output. To drive a 75Ω transmission line connect a 75Ω resistor from each of the output pins to 2.5V. This resistor has two functions – it converts the current output to a voltage, which is used to drive the cable, and it acts as the back termination resistor for the transmission line. The resistor should be placed as close to the output pin as is practicable. The output driver automatically adjusts its slew rate depending on the input datarate so that it will be in compliance with SMPTE 259M, SMPTE292M or SMPTE 424M as appropriate. In addition to output amplitude and rise/fall time specifications, the SMPTE specs require that SDI outputs meet an Output Return Loss (ORL) specification. There are parasitic capacitances that will be present both at the output pin of the device and on the application printed circuit board. To optimize the return loss implement a series network comprised of a parallel inductor and resistor. The actual values for these components will vary from application to application, but the typical interface circuit shows values that would be a good starting point. Figure 6 shows an equivalent output circuit for the LMH0340 / LMH0040 / LMH0070. The collectors present a high impedance current source. The external 75Ω resistors will provide the back termination resistance as well as converting the current to a voltage – with the addition of the termination resistance at the load, there will be an overall output resistance of 37.5Ω, which in conjunction with the 24mA current source will develop the 800mV swings called for in the standard. 10 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com SNLS271I – APRIL 2007 – REVISED APRIL 2013 TXOUT+ TXOUT2.5V 2.5V 24 mA Figure 6. Simplified SDI Output Circuit Care must be taken in the layout of the output circuitry to meet SMPTE return loss specifications as any parasitic impedances or transmission line discontinuities will result in reflections which will adversely affect the output return loss. For more details on how to get good output return loss, please refer to the application note “Successful design with the FPGA-Attach SER/DES”. 0 RETURN LOSS (dB) -10 SMPTE424 Limit -20 -30 Measured EVK Return Loss -40 -50 -60 1.00E+07 1.00E+08 1.00E+09 1.00E+10 FREQUENCY Figure 7. SDI Output Return Loss (EVK Example) The amplitude of the output is ensured to be compliant with SMPTE specifications if the specified value of RSET resistor is used, however if the designer wishes to change the output amplitude, there are two methods by which this can be done. By changing the value of resistor connected to the RSET pin, the output amplitude will be adjusted. 1000 950 VOUT (mV) 900 850 800 750 700 650 600 6 7 8 9 RSET (k:) 10 11 Figure 8. Output Voltage vs. RSET Copyright © 2007–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 11 LMH0040, LMH0050 LMH0070, LMH0340 SNLS271I – APRIL 2007 – REVISED APRIL 2013 www.ti.com CML Output Interfacing The LMH0050 does not include the internal SMPTE cable driver, as its outputs are CML, include internal 50 Ω pull up resistors, and are intended to drive 100 Ω transmission lines. The LMH0050 outputs may either be connected to a differential transmission medium such as twisted pair cable, or used to drive an external cable driver. Power Down Mode If the device is not to be used, some power can be saved by writing a ‘0x40h’ to register 0x26'h, register 0x01'h. The write to register 0x26'h will disable the input buffers of the device, and the 0x01'h will power down the output buffer. In this mode, the device power dissipation can be reduced by approximately 30%. There are portions of the circuit which will automatically power no clock present on the TXCLK input, so this method can be used to further reduce the power. and a 0x10'h to write to register expected to be down if there is SMBus INTERFACE The configuration bus conforms to the System Management Bus (SMBus) 2.0 specification. SMBus 2.0 includes multiple options. The optional ARP (Address Resolution Protocol) feature is not supported. The I/O rail is 3.3V only and is not 5V tolerant. The use of the SMB_CS signal is recommended for applications with multi-drop applications (multiple devices to a host). The SMBus is a two wire interface designed for the communication between various system component chips, additional signals maybe required for chip select function depending upon application. By accessing the control functions of the circuit via the SMBus, signal count is kept to a minimum while allowing a maximum amount of versatility. The SMBus has three pins to control it: an SMBus CS pin which enables the SMBus interface for the device, a Clock and a Data line. In applications where there might be several SER devices, the SDA and SCK pins can be bussed together and the individual devices to be communicated with may be selected via their respective SMB_CS pin. The SCK and SDA are both open drain and are pulled high by external pullup resistors. The SER has several internal configuration registers which may be accessed via the SMBus. These registers are listed in Table 2. TRANSFER OF DATA TO THE DEVICE VIA THE SMBus During normal operation the data on SDA must be stable during the time when SCK is high. START / STOP / IDLE CONDITIONS There are three unique states for the SMBus: START A HIGH-to-LOW transition on SDA while SCK is High indicates a message START condition STOP A LOW-to-HIGH transition on SDA while SCK is High indicates a message STOP condition. IDLE If SCK and SDA are both High for a time exceeding tBUF from the last detected STOP condition or if they are high for a total exceeding the maximum specification for tHIGH then the bus will transfer to the IDLE state. SMBus TRANSACTIONS A transaction begins with the host placing the SER SMBus into the START condition. Then a byte (8 bits) is transferred, MSB first, followed by a ninth ACK bit. ACK bits are ‘0’ to signify an ACK, or ‘1’ to signify NACK. After this the host holds the SCK line Low, and waits for the receiver to raise the SDA line as an ACKnowledge that the byte has been received. REGISTER WRITE To write a data value to a register in the SER, the host writes three bytes to the SER. The first byte is the device address—the device address is a 7 bit value, and if writing to the SER the last bit (LSB) is set to ‘0’ to signify that the operation is a write. The second byte written is the register address, and the third byte written is the data to be written into the addressed register. If additional data writes are performed, the register address is automatically incremented. At the end of the write cycle the host places the bus in the STOP state. REGISTER READ 12 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com SNLS271I – APRIL 2007 – REVISED APRIL 2013 To read the data value from a register, first the host writes the device address with the LSB set to a ‘0’ denoting a write, and then the register address is written to the device. The host then reasserts the START condition, and writes the device address once again, but this time with the LSB set to a ‘1’ denoting a read, and following this the SER will drive the SDA line with the data from the addressed register. The host indicates that it has finished reading the data by asserting a ‘0’ for the ACK bit. After reading the last byte, the host will assert a ‘1’ for NACK to indicate to the SER that it does not require any more data. Note that the SMBus pins are not 5V compliant and they must be driven by a 3.3V source. SMBus CONFIGURATIONS Many different configurations of the SMBus are possible and depend upon the specific requirements of the applications. Several possible applications are described. CONFIGURATION 1 The SER SMB_CS may be tied High (always enabled) since it is the only device on the SMBus. See Figure 9. CONFIGURATION 2 Since the multiple SER devices have the same address, the use of the individual SMB_CS signals is required. To communicate with a specific device, its SMB_CS is driven High to select the device. After the transaction is complete, its SMB_CS is driven Low to disable its SMB interface. Other devices on the bus may now be selected with their respective chip select signals and communicated with. See Figure 10. CONFIGURATION 3 The addressing field is limited to 7-bits by the SMBus protocol. Thus it is possible that multiple devices may share the same 7-bit address. An optional feature in the SMBus 2.0 specification supports an Address Resolution Protocol (ARP). This optional feature is not supported by the LMH0340/0040/0070/0050 devices. Solutions for this include: the use of the independent SMB_CS signals, independent SMBus segments, or other means. See Figure 11. SMBus Device FPGA Host 3V3 SMB_CS SDA LVCMOS GPIO SMBus Interface SCK 3V3 Figure 9. SMBus Configuration 1 — Host to single device SMBus Device FPGA Host SMBus Device SMBus Device SMB_CS SDA SCK SMB_CS SDA SCK SMB_CS SDA LVCMOS GPIO SMBus Interface SCK 3V3 Figure 10. SMBus Configuration 2 — Host to multiple devices with SMB_CS signals Copyright © 2007–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 13 LMH0040, LMH0050 LMH0070, LMH0340 SNLS271I – APRIL 2007 – REVISED APRIL 2013 www.ti.com SMBus Device SMBus Device SMBus Device 3V3 3V3 SMB_CS SDA SCK SMB_CS 3V3 SDA SMB_CS SDA LVCMOS GPIO SMBus Interface SCK 3V3 SCK FPGA Host Figure 11. SMBus Configuration 3 — Host to multiple devices with multiple SMBus Interfaces GENERAL PURPOSE I/O PINS GPIO[2:0] The SER has three pins which can be configured to provide direct access to certain register values via a dedicated pin. For example if a particular application required fast action to the condition of the serializer losing it’s input clock, the TXCLK detect status bit could be routed directly to an external pin where it might generate an interrupt for the host processor. GPIO pins can be configured to be in TRI-STATE® (High Impedance) mode, the buffers can be disabled, and when used as inputs can be configured with a pullup resistor, a pulldown resistor or no input pin biasing at all. When the GPIO pins are being used as inputs, there is the ability to have an internal pullup or pull down resistor. This is selected via the GPIO Configuration registers. Each of the GPIO pins has a register to control it. For each of these registers, the upper 4 bits are used to define what function is desired of the GPIO pin with options being slightly different for each of the three GPIO pins. The pins can be used to monitor the status of various internal states of the SER device, to serve as an input from some external stimulus, and for output to control some external function. GPIO_0 FUNCTIONS Allow for the output of a signal programmed by the SMBus Allow the monitoring of an external signal via the SMBus Monitor Status of TXCLK signal Monitor Status of TXCLKDetect Monitor Power On Reset GPIO_1 FUNCTIONS Monitor Power On Reset Allow for the output of a signal programmed by the SMBus Allow the monitoring of an external signal via the SMBus Monitor LOS for data bit 0 Monitor LOS for data bit 1 Monitor LOS for data bit 2 Monitor LOS for data bit 3 Monitor LOS for data bit 4 GPIO_2 FUNCTIONS Allow for the output of a signal programmed by the SMBus 14 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com SNLS271I – APRIL 2007 – REVISED APRIL 2013 Allow the monitoring of an external signal via the SMBus Serializer Clock output Bits 2 and 3 are used to determine the status of the internal pullup/pulldown resistors on the device—they are loaded according to the following truth table: 00: pullup and pulldown disabled 01: pulldown enabled 10: pullup enabled 11: Reserved Bit 1 is used to enable or disable the input buffer. If the GPIO pin is to be used as an output pin, then this bit must be set to a ‘0’ disabling the output. The LSB is used to switch the output between normal output state and high impedance mode. If the GPIO is to be used as an input pin, this bit must be set to ‘0’ placing the output in high Z mode. As an example, if you wanted to use the GPIO0 pin to reflect the status of the LOCK pin, you would load the appropriate register with the value 0001 0001b. POTENTIAL APPLICATION FOR GPIO PINS In addition to being useful debug tools while bringing a design up, there are other practical uses to which the GPIO pins can be put: Sensing if a cable is connected to an output – When connecting the BNC cable to the output, connect the shield of the connector to GND via a capacitor—making it an AC GND, but a DC open. Now connect that shield to one of the GPIO connections which you configure as an input with a pullup. With no cable on the BNC, the GPIO pin will see a high state, but once a terminated cable is connected, the shield will be brought down and you will read a low state. VDD VDD 3.3V 3.3V p p Output Input n n Figure 12. Simplified LVCMOS Input Circuit Copyright © 2007–2013, Texas Instruments Incorporated Figure 13. Simplified LVCMOS Output Circuit Submit Documentation Feedback Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 15 LMH0040, LMH0050 LMH0070, LMH0340 SNLS271I – APRIL 2007 – REVISED APRIL 2013 www.ti.com APPLICATION INFORMATION PCB RECOMMENDATIONS The SMPTE Serial specifications have very stringent requirements for output return loss on drivers. The output return loss will be degraded by non-idealities in the connection between the SER (all variants with the exception of the LMH0050) and the output connector. All efforts should be taken to minimize the trace lengths for this area, and to assure that the characteristic impedance of this trace is 75Ω. It is recommended that the PCB traces between the host FPGA and the SER be no longer than 10 inches (25cm) and that the traces be routed as differential pairs, with very tight matching of line lengths and coupling within a pair, as well as equal length traces for each of the six pairs. For additional information on layout and soldering of the WQFN package, please refer to the applications note AN-1187 (SNOA401). PCB Design do’s and don’ts: • DO Whenever possible dedicate an entire layer to each power supply – this will reduce the inductance in the supply plane. • DO use surface mount components whenever possible • DO place bypass capacitors close to each power pin • DON’T create ground loops – pay attention to the cutouts that are made in your power and ground planes to make sure that there are not opportunities for loops. • DON’T allow discontinuities in the ground planes – return currents will follow the path of least resistance – for high frequency signals this will be the path of least inductance. • DO place the SER outputs as close as possible to the edge of the PCB where it will connect to the outside world. • DO make sure to match the trace lengths of all differential traces, both between the sides of an individual pair, and from pair to pair. • DO remember that VIAs have significant inductance – when using a via to connect to a power supply or ground layer, two in parallel are better than one. • DO connect the slug on the bottom of the package to a solid Ground connection. This contact is used for the major GND connection to the device as well as serving as a thermal via to keep the die at a low operating temperature. • There is an application note available which discusses layout suggestions for the SER in greater detail. TYPICAL SMPTE APPLICATIONS CIRCUIT A typical application circuit for the LMH0340 is shown in Figure 14. Alternately this could also employ the LMH0040 or LMH0070 Serializers in lower data rate SMPTE applications. The TX interface between the host FPGA and the SER is composed of a 5-bit LVDS Data bus and its LVDS clock. This is a point-to-point interface and the SER includes on-chip 100 terminations. Pairs should be of equal length to minimize any skew impact. The LVDS clock (TXCLK) uses both edges to transfer the data. An SMBus is also connected from the host FPGA to the SER. If the SMBus is shared, a chip select signal is used to select the device being addressed. The SCK and SDA signals require a pull up resistor. The SMB_CS is driven by a GPO signal from the FPGA. Depending on the FPGA I/O it may also require a pull up unless it is a push / pull output. Depending upon the application, several other GPIO signals maybe used. This includes the DVB_ASI and RESET input signals. If these pins are not used, then must be tied off to the desired state. The LOCK signal maybe used to monitor the SER. If it is unused, leave the pin as a NC (or route to a test point). The SER includes a SMPTE compliant cable driver. While this is a differential driver, it is commonly used singleendedly to drive 75 Ω coax cables. External 75 Ω pull up resistors are used to the 2.5V rail. The active output(s) also includes a matching network to meet the required Output Return Loss SMPTE specification. While application specific, in general a series 75 Ω resistor shunted by a 6.8 nH inductor will provide a starting value to design with. The signal is then AC coupled to the cable with a 4.7 µF capacitor. If the complementary output is not used, simply terminate it after its AC coupling capacitor to ground. This output (even though its inverting) may still be used for a loop back or 1:2 function due to the nature of the NRZI coding that the SMPTE standards require. The output voltage amplitude of the cable driver is set by the RSET resistor. For single-ended applications, an 8.06 kΩ resistor is connected between this pin and ground to set the swing to 800mV. 16 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com SNLS271I – APRIL 2007 – REVISED APRIL 2013 The PLL loop filter is external for the SER. A capacitor is connected in series to a resistor between the LF_CP and LF_REF pins. Typical values are 500 Ω and 0.1 µF. There are several configuration pins that requiring setting to the proper level. The RSVD_H pins should be pulled High to the 3.3V rail with a 5 kΩ resistor. Depending upon the application the DVB_ASI pin may be tied off or driven. There are three supply connections (see PLL FILTER / BYPASS and for recommendations). The two main supplies are the 3.3V rail and the 2.5V rail. There is also a 3.3V connection for the PLL circuitry. There are multiple Ground connections for the device. The main ground connection for the SER is through the large center DAP pad. This must be connected to ground for proper device operation. In addition, multiple other inputs are required to be connected to ground as show in Figure 14 and listed in . 3.3V 2.5V All Bypass CAPS not shown 3.3V 5 k: DAP,8,9,10,12,13, 21,22,23,24,29 GND RSVD_H 45 + TX3 46 43 + TX2 44 41 + TX1 42 39 + TX0 40 37 + TXCLK 38 - LVDS Outputs FPGA Host VDD 3V3 47 + TX4 48 - VDD 2V5 7,15,18, 25,35 2,5 1,36 2.5V TXOUT+ 17 VDDPLL RSET LVCMOS GPIO SMBus Interface SDA 33 SCK 31 30 LF_REF LF_CP 32 6 75Ö 4.7 PF 3.3V 1 kÖ 34 SDI Output 75Ö LMH0340 1 kÖ 4.7 PF 16 TXOUT- 3.3V 3.3V 75Ö 6.8 nH 75Ö 28 22 PF 14 8.06 kÖ 26 27 0.1 PF 500Ö 3 GPIO_0 GPIO_1 4 GPIO_2 11 SMB_CS DVB_ASI LOCK RESET DNC 19, 20 Figure 14. Typical SMPTE Application Circuit TYPICAL LMH0050 CML APPLICATIONS CIRCUIT A typical application circuit for the LMH0050 is shown in Figure 15. Copyright © 2007–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 17 LMH0040, LMH0050 LMH0070, LMH0340 SNLS271I – APRIL 2007 – REVISED APRIL 2013 www.ti.com The TX interface between the host FPGA and the SER is composed of a 5-bit LVDS Data bus and its LVDS clock. This is a point-to-point interface and the SER includes on-chip 100 terminations. Pairs should be of equal length to minimize any skew impact. The LVDS clock (TXCLK) uses both edges to transfer the data. An SMBus is also connected from the host FPGA to the SER. If the SMBus is shared, a chip select signal is used to select the device being addressed. The SCLK and SDA signals require a pull up resistor. The SMB_CS is driven by a GPO signal from the FPGA. Depending on the FPGA I/O it may also require a pull up unless it is a push / pull output. Depending upon the application, several other GPIO signals maybe used. This includes the DVB_ASI and RESET input signals. If these pins are not used, then must be tied off to the desired state. The LOCK signal maybe used to monitor the SER. If it is unused, leave the pin as a NC (or route to a test point). The LMH0050 SER includes a CML cable driver. This is a differential driver, and includes internal 50 Ω pull up resistors to the 2.5V rail. The output voltage amplitude of the cable driver is set by the RSET resistor. The RSET resistor recommended value for the LMH0050 is 9.1KΩ. It is intended to drive 100 Ω differential pairs or twisted pair cables. The PLL loop filter is external for the SER. A capacitor is connected in series to a resistor between the LF_CP and LF_REF pins. Typical values are 500 Ω and 0.1 µF. There are several configuration pins that requiring setting to the proper level. The RSVD_H pins should be pulled High to the 3.3V rail with a 5 kΩ resistor. Depending upon the application the DVB_ASI pin may be tied off or driven. There are three supply connections (see PLL FILTER / BYPASS and for recommendations). The two main supplies are the 3.3V rail and the 2.5V rail. There is also a 3.3V connection for the PLL circuitry. There are multiple Ground connections for the device. The main ground connection for the SER is through the large center DAP pad. This must be connected to ground for proper device operation. In addition, multiple other inputs are required to be connected to ground as show in Figure 15 and listed in . 18 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com SNLS271I – APRIL 2007 – REVISED APRIL 2013 3.3V 2.5V All Bypass CAPS not shown 3.3V 5 k: DAP,8,9,10,12,13, 21,22,23,24,29 GND RSVD_H 45 + TX3 46 43 + TX2 44 41 + TX1 42 39 + TX0 40 37 + TXCLK 38 - LVDS Outputs FPGA Host VDD 3V3 47 + TX4 48 - VDD 2V5 7,15,18, 2,5 25,35 1,36 TXOUT+ 17 TXOUT- 3.3V VDDPLL RSET 3.3V 3.3V LMH0050 LVCMOS GPIO SMBus Interface 1 kÖ 1 kÖ SDA 33 34 6 31 30 LF_REF LF_CP 32 SCK 100Ö TWP 16 28 22 PF 14 9.1 kÖ 26 27 0.1 PF 500Ö 3 GPIO_0 4 GPIO_1 11 GPIO_2 SMB_CS DVB_ASI LOCK DNC 19, 20 RESET Figure 15. Typical LMH0050 CML Application Circuit SERIAL JITTER OPTIMIZATION The SER is capable of very low jitter operation, however it is dependent on the TXCLK provided by the host in order to operate, and depending on the quality of the TXCLK provided, the SER output jitter may not be as low as it could be. The SER includes circuitry to filter out any TXCLK jitter at frequencies above 1MHz (see Figure 16), however, for frequencies below 100 kHz, any jitter that is in the TXCLK is passed directly through to the serialized output. In most cases, passing the TXCLK through the FPGA will add high frequency noise to the signal, which will be filtered out by the SER, resulting in a clean output, however for better jitter performance, it is best to minimize the noise that is on the TXCLK that is provided to the SER. This can be done by careful routing of the CLK signals, both within the FPGA and on the board. Very clean clocks can be derived from video reference signals through the use of the LMH1981 Sync Separator and the LMH1982 Clock Generator products from Texas Instruments. These products allow low jitter video frequency clocks to be generated either independently, or phase locked to a video reference signal. Copyright © 2007–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 19 LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com JITTER TRANSFER (dB) SNLS271I – APRIL 2007 – REVISED APRIL 2013 2 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 -22 -24 -26 1 10 100 1000 10000 100000 JITTER FREQUENCY (kHz) Figure 16. SER Jitter Transfer Function Register Descriptions Table 2 provides details on the device's configuration registers. Table 2. SER Register Detail Table ADD 'h 00 01 02 20 Name Bits Field R/W Default Description device_identification The seven MSBs of this register define the SMBus address for the device – the default value is 0x57'h, but this may be overwritten. The LSB of this register must always be ‘0’ Note that since the address is shifted over by 1 bit, some systems may address the 57'h as AE'h. reset GPIO_0 Configuration 7:1 device id 0 Reserved r/w 57'h SMBus device ID 0'b If a ‘1’ is written to bit 0 (LSB) of this register the device will do a soft reset, restoring it’s internal state to the same as at powerup except device_id register. Once the reset operation is complete, the value in this register is reset to ‘0’ Bit 4 of this register has a default of 0, if a ‘1’ is written to this location it will disable the analog output buffer of the device, allowing for some power savings. 7:5 Reserved 4 Analog Dis 3:1 Reserved 0 sw_rst r/w 0'b Disables Analog r/w 0'b software reset This register configures GPIO_0. Note, if this pin is to be used as an input, then the output must be TRISTATE (bit[0]=’0’) and if used as an output, then the input buffer must be disabled (bit[1]=’0’). 7:4 GPIO_0_mode[3:0] r/w 0000'b 0000: GPout register 0011: TXCLK LOS 0100: TXCLK Detect 0110: Power On Reset all others: reserved 3:2 GPIO_0_ren[1:0] r/w 01'b 00: 01: 10: 11: 1 GPIO_0_sleepz r/w 0'b 0: input buffer disabled 1: input buffer enabled 0 GPout0 enable r/w 1'b 0: output TRI-STATE 1: output enabled Submit Documentation Feedback pullup and pulldown disabled pulldown enabled pullup enabled Reserved Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com SNLS271I – APRIL 2007 – REVISED APRIL 2013 Table 2. SER Register Detail Table (continued) ADD 'h 03 04 05 Name Bits GPIO_1 Configuration This register configures GPIO_1. Note, if this pin is to be used as an input, then the output must be TRISTATE (bit[0]=’0’) and if used as an output, then the input buffer must be disabled (bit[1]=’0’). GPIO_2 Configuration GP INPUT GP OUTPUT Reserved 11 DVB_ASI Idle_A DVB_ASI Idle_B 0000'b 0000: Power On Reset 0001: GPout register 0010: pll lock 0100: Data LOS [0] 0101: Data LOS [1] 0110: Data LOS [2] 0111: Data LOS [3] 1000: Data LOS [4] all others: reserved 3:2 GPIO_1_ren[1:0] r/w 01'b 00: 01: 10: 11: 1 GPIO_1_sleepz r/w 0'b 0: input buffer disabled 1: input buffer enabled 0 GPout1 enable r/w 1'b 0: output in TRI-STATE mode 1: output enabled pullup and pulldown disabled pulldown enabled pullup enabled Reserved This register configures GPIO_2. Note, if this pin is to be used as an input, then the output must be TRISTATE (bit[0]=’0’) and if used as an output, then the input buffer must be disabled (bit[1]=’0’). 7:4 GPIO_2_mode[3:0] r/w 0000'b 0000: GPout register 0001: always on out 0010: parallel to serial clk out 0011: parallel clock output 0100: TXCLK Digital out all others: reserved 3:2 GPIO_2_ren[1:0] r/w 01'b 00: 01: 10: 11: 1 GPIO_2_sleepz r/w 0'b 0: input buffer disabled 1: input buffer enabled 0 GPout2 enable r/w 0'b 0: output TRI-STATEd 1: output enabled pullup and pulldown disabled pulldown enabled pullup enabled Reserved If any of the GPIO pins are configured as inputs, then reading from this register provides the values on those input pins. Reserved 2 r input data on GPIO_2 1 r input data on GPIO_1 0 r input data on GPIO_0 If the GPIO pins are configured as general purpose output pins, then writing to this register has the effect of transferring the bits in this register to the output buffers of the appropriate GPIO pins. Reserved 2 r/w 0'b output data on GPIO_2 1 r/w 0'b output data on GPIO_1 0 r/w 0'b output data on GPIO_0 When in DVB-ASI mode, idle characters are inserted into the datastream when there is no valid data to transmit. The idle character default is K28.5 but if desired, that can be redefined via this register pair. r/w BC'h K28.5 Idle character used for DVB_ASI r/w 01'b K28.5 Idle character used for DVB_ASI DVB-ASI mode, idle character LSBs 7:2 Reserved 1:0 13–1C Description r/w 7:0 12 Default GPIO_1_mode[3:0] 7:3 07–10 R/W 7:4 7:3 06 Field Reserved Copyright © 2007–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 21 LMH0040, LMH0050 LMH0070, LMH0340 SNLS271I – APRIL 2007 – REVISED APRIL 2013 www.ti.com Table 2. SER Register Detail Table (continued) ADD 'h Name Bits 1D Device Type Reading from this register will return an 8 bit value which indicates which product from the SER family is being addressed 7:0 1E-20 Reserved 21 Mode Field Device r/w Reserved LVDS Clock Delay Bypass r/w Reserved 26 Powerdown 27 28 22 Event Disable LMH0340 LMH0040 LMH0070 LMH0050 11 = DVB ASI mode 01,10, 00 = SDI mode 0'b 1: contents of register 21h will override the DVB_ASI pin 0: Pin control This register selects of the TXCLK delay adjust is enabled or bypassed. 7 r/w 6:0 25 the the the the Reserved 0 24 xx1xxx00 for xx1xxx01 for xx1xxx10 for xx0xxx01 for In normal operation, the DVB_ASI mode is selected via the external pin. By setting the 0 bit in this register, the function of this pin is overridden, and the mode is set via register 21'h instead. After setting this bit, a channel reset must be executed via reg 0x26h, bit 7 7:1 23 r Description Reserved 1:0 DVB_ASI Override Default This register returns the mode that the device is operating in. 7:2 22 R/W 0'b 1: Bypasses TXCLK delay 0: Delay Enabled Reserved Individual bits from this register can power down different parts of the SER – to place the part into a low power standby mode, write a ‘0’ to this register. 7 channel reset r/w 0'b Used to reset the channel, needed when changing between DVB_ASI mode and normal operating mode via SMBus 6:0 Powerdown r/w 0x3Fh for normal operation, write x011 1111b to this register. For low power mode write x100 0000b to the register. The SER keeps counts of various types of events. These include FIFO over/underflows, and loss of the input signals or clocks. This register allows the user to mask these errors from being counted. 7:5 Reserved 4 PLL_CLK_disable r/w 0'b 1: Clock Error disabled 0: Clock Errors counted 3 fifo_error_disable r/w 0'b 1: FIFO Errors ignored 0: FIFO Errors counted 2 TXCLK_detect_disable r/w 0'b 1: TXCLK Detect Errors ignored 0: TXCLK Detect Errors counted 1 CLK_LOS_disable r/w 0'b 1: CLK_LOS Errors ignored 0: CLK_LOS Errors counted 0 Data_LOS_disable r/w 0'b 1: Data_LOS Errors ignored 0: Data_LOS Errors counted LVDS LOS Override These bits are used to force the LOS indicator regardless of the input signal level on the LVDS pins. Operation 7:2 Reserved 1 LVDS Preset LOS r/w 0'b LVDS Preset LOS 1: Forces LOS to be Low 0: normal mode 0 LVDS Reset LOS r/w 0'b LVDS Reset LOS (has priority over Preset) 1: Forces LOS to be High 0: normal mode Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 LMH0040, LMH0050 LMH0070, LMH0340 www.ti.com SNLS271I – APRIL 2007 – REVISED APRIL 2013 Table 2. SER Register Detail Table (continued) ADD 'h Name Bits 29 LOS Status Reading the LOS status register will provide a byte which has six bits which represent the presence or absence of a signal at each of the LVDS inputs to the SER. 2A Event Status 2B-2D Reserved 2E Reverse Bit Order 2F Reserved 30 CLK_Delay Field R/W Default Description 7:6 Reserved 5 LOS_CLK r 0'b 1: No clock present on TXCLK 0: Clock present 4:0 LOS_Data r 0'b 1:No data present 0: Data Present(one bit per TX channel) The event status register has two user readable bits which indicate if the device is locked, and if there is a signal present on the TXCLK input. 7:4 Reserved 3 TXCLK_detect r 0'b 1: TXCLK detected 0: TXCLK not detected 2 PLL_lock r 0'b 1: PLL locked 0: PLL not locked 1:0 Reserved This bit can be used to reverse the serialization order, however it will only work properly when the device is NOT in DVB_ASI mode 7 Reserved 6 Reverse Bit Order 5:0 Reserved r/w 0'b 1: reverses serialization order 0: normal order The three msbs from this register are used to insert a programmable delay into the TXCLK path, if the host FPGA does not provide adequate setup and hold times for the SER, this register can be used to shift the window in 125ps increments. 7:5 TCLK Delay 4:0 Reserved Copyright © 2007–2013, Texas Instruments Incorporated r/w 011'b 000'b is minimum delay setting, 111'b is maximum delay setting, each step is approx 125ps Submit Documentation Feedback Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 23 LMH0040, LMH0050 LMH0070, LMH0340 SNLS271I – APRIL 2007 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision H (April 2013) to Revision I • 24 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 23 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: LMH0040 LMH0050 LMH0070 LMH0340 PACKAGE OPTION ADDENDUM www.ti.com 17-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LMH0040SQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 LMH0040 LMH0040SQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 LMH0040 LMH0040SQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 LMH0040 LMH0050SQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 LMH0050 LMH0050SQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 LMH0050 LMH0050SQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 LMH0050 LMH0070SQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 LMH0070 LMH0070SQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 LMH0070 LMH0070SQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 LMH0070 LMH0340SQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 L0340 LMH0340SQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 L0340 LMH0340SQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 L0340 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Apr-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing LMH0040SQ/NOPB WQFN RHS 48 LMH0040SQE/NOPB WQFN RHS LMH0040SQX/NOPB WQFN RHS LMH0050SQ/NOPB WQFN LMH0050SQE/NOPB SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 LMH0050SQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 LMH0070SQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 LMH0070SQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 LMH0070SQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 LMH0340SQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 LMH0340SQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 LMH0340SQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMH0040SQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0 LMH0040SQE/NOPB WQFN RHS 48 250 213.0 191.0 55.0 LMH0040SQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0 LMH0050SQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0 LMH0050SQE/NOPB WQFN RHS 48 250 213.0 191.0 55.0 LMH0050SQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0 LMH0070SQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0 LMH0070SQE/NOPB WQFN RHS 48 250 213.0 191.0 55.0 LMH0070SQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0 LMH0340SQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0 LMH0340SQE/NOPB WQFN RHS 48 250 213.0 191.0 55.0 LMH0340SQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA RHS0048A SQA48A (Rev B) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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