Class D/1-Bit Audio Power Output Stage AD1991 FEATURES Class D/1-Bit Audio Power Output Stage 5 V Analog and Digital Supply Voltages Power Stage Power Supply 8 V to 20 V Output Power @ 0.1% THD + N Stereo Mode 2 20 W @ 4 @ 14.4 V 2 20 W @ 8 @ 20 V Mono Mode 1 40 W @ 4 @ 20 V RON < 320 m (per Transistor) Efficiency > 85% @ Full Power/8 Clickless Mute Function Turn-On and Turn-Off Pop Suppression Short-Circuit Protection Overtemperature Protection Data Loss Protection 2-Channel BTL Outputs or 4-Channel Single-Ended Outputs 52-Lead Exposed Pad TQFP Package Low Cost DMOS Process APPLICATIONS PC Audio Systems Minicomponents Automotive Amplifiers Home Theater Systems Televisions FUNCTIONAL BLOCK DIAGRAMS 2-Channel Mode AVDD DVDD PVDD 6 OUTA A1 INA LEFT INPUT 3 A2 B1 INB OUTB B2 LEVEL SHIFTER AND SWITCH CONTROL 3 H-BRIDGE OUTC C1 INC RIGHT INPUT 3 C2 D1 IND OUTD D2 3 ⴜn CLK CURRENT OVERLOAD THERMAL SHUTDOWN THERMAL WARNING DATA LOSS THERMAL PROTECTION SHORT-CIRCUIT PROTECTION MUTE CONTROL RST/PDN MUTE 4 2 AGND DGND 14 TEST CONTROL PGND 4-Channel Mode GENERAL DESCRIPTION The AD1991 is a 2-channel BTL or 4-channel single-ended class D audio power output stage. The part is configured during reset to be in either 2-channel mode or 4-channel mode. To protect the IC as well as the connected speakers, the AD1991 provides turn-on and turn-off pop suppression, short-circuit protection, and overtemperature shutdown. To control the IC, a power-down/reset input and a mute pin are available. AVDD DVDD 6 A1 INA 3 H-BRIDGE C1 INC OUTC 3 C2 D1 IND OUTD 3 D2 CLK ⴜn 4 2 TEST CONTROL LOAD REQUIRING DC VOLTAGE SUPPLY CURRENT OVERLOAD THERMAL SHUTDOWN THERMAL WARNING DATA LOSS THERMAL PROTECTION SHORT-CIRCUIT PROTECTION MUTE CONTROL AGND DGND LOAD REQUIRING DC VOLTAGE SUPPLY OUTB B2 LEVEL SHIFTER AND SWITCH CONTROL MUTE Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies. 3 B1 INB RST/PDN REV. 0 OUTA A2 The output stage can be operated over a power supply range from 8 V to 20 V. In 2-channel mode, Transistors A1, B2, C1, and D2 are turned on by a Logic 1 on inputs INA and INC, and Transistors A2, B1, C2, and D1 are turned on by a Logic 0 on inputs INA and INC. In 4-channel mode, Transistors A1, B1, C1, and D1 are turned on by a Logic 1 on the four inputs, and Transistors A2, B2, C2, and D2 are turned on by a Logic 0 on the four inputs (see the Functional Block Diagrams). PVDD 14 PGND One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2003 Analog Devices, Inc. All rights reserved. (AV = 5 V, DV = 5 V, PV = 20 V, Ambient Temperature = 25C, Impedance = 8 , unless otherwise noted.) AD1991–SPECIFICATIONS1 Load DD Parameter Min 2 OUTPUT POWER PO (f = 1 kHz SINE WAVE) EFFICIENCY RON Per High-Side Transistor Per Low-Side Transistor Temperature Coefficient THERMAL WARNING ACTIVE THERMAL SHUTDOWN ACTIVE OVERCURRENT SHUTDOWN ACTIVE POWER SUPPLIES Supply Voltage AVDD Supply Voltage DVDD Supply Voltage PVDDX Power-Down Current AVDD DVDD PVDDX Operating Current AVDD DVDD PVDDX DIGITAL I/O Input Voltage High Input Voltage Low Output Voltage High Output Voltage Low Leakage Current on Digital Inputs DD DDX Typ Max 20 20 87 Test Conditions W W % RL = 4 Ω, PVDDX = 14 V RL = 8 Ω, PVDDX = 20 V f = 1 kHz, PO = 20 W, RL = 8 Ω @1A @1A 3.8 260 190 0.7 135 150 5 6.75 mΩ mΩ mΩ/°C °C °C A 4.5 4.5 6.5 5.0 5.0 8 to 20 5.5 5.5 22.5 V V V 6 1 17 14 13 µA µA µA 1.8 4 40 2.75 5.2 mA mA mA 2.0 320 235 Unit DVDD 1.2 DVDD – 0.8 0.4 10 Die temperature Die temperature RST/PDN held low RST/PDN held low RST/PDN held low 50:50 384 kHz square wave on INA and INC V V V V µA @ 2 mA @ 2 mA NOTES 1 Performance of both channels is identical. 2 Measurement requires PWM modulator. Specifications subject to change without notice. DIGITAL TIMING CHARACTERISTICS (Guaranteed over –40C to +85C, AVDD = DVDD = 5 V 10%, PVDDX = 20 V 10%, Edge Speed = Slowest, Nonoverlap Time = Shortest.) Symbol Parameter Min tPDL tPST tNOL tPDRP tMSU tMH tMPDL Input transition to output initial response Power transistor switching time Nonoverlap time RST/PDN minimum low pulsewidth Mode pin setup time before RST/PDN going high Mode pin hold time after RST/PDN going high MUTE asserted to output initial response Typ Max Unit 30 ns ns ns ns ns ns s 3.5 25 to 40 20 5 5 3 Specifications subject to change without notice. –2– REV. 0 AD1991 INA tPST tPST tPST tPST tNOL tNOL tPDL tPDL OUTA OUTB Figure 1. Output Timing tPDRP RST/PDN MODEx tMSU tMH Figure 2. RESET and Mode Timing MUTE tPST tPST OUTx tMPDL tMPDL Figure 3. MUTE Timing REV. 0 –3– AD1991 ABSOLUTE MAXIMUM RATINGS 1 NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Including any induced voltage due to inductive load. 3 With respect to the temperature of the exposed pad. (TA = 25°C, unless otherwise noted.) AVDD, DVDD to AGND, DGND . . . . . . . . . . –0.3 V to +6.5 V PVDDX to PGNDx2 . . . . . . . . . . . . . . . . . . . –0.3 V to +30.0 V AGND to DGND to PGNDx . . . . . . . . . . . . –0.3 V to +0.3 V AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +0.5 V Operating Temperature Range (Ambient) Industrial . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150°C θJC Thermal Resistance3 . . . . . . . . . . . . . . . . . . . . . . . 1°C/W Lead Temperature Soldering (10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C ORDERING GUIDE Model AD1991ASV AD1991ASVRL EVAL-AD1991EB Temperature Range Package Description Package Option –40°C to +85°C –40°C to +85°C Thin Quad Flat Pack [TQFP] Thin Quad Flat Pack [TQFP] Evaluation Board SV-52 SV-52 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD1991 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. –4– REV. 0 AD1991 PGND2 PGND2 PGND2 MODE0 AGND AGND MODE1 AVDD AGND PGND1 PGND1 AGND PGND1 PIN CONFIGURATION 52 51 50 49 48 47 46 45 44 43 42 41 40 PGND1 1 OUTA PVDD1 PVDD1 PVDD1 PGND2 OUTC 37 OUTC 39 PIN 1 IDENTIFIER OUTA 2 OUTA 3 38 4 36 5 35 6 7 OUTB 8 OUTB 9 AD1991 34 TOP VIEW (Not to Scale) 33 32 31 OUTB 10 PGND1 11 PGND1 12 30 PGND1 13 OUTC PVDD2 PVDD2 PVDD2 OUTD OUTD 29 OUTD PGND2 28 PGND2 27 PGND2 IND RST/PDN CLK MUTE INC DGND INB DVDD ERR0 INA ERR1 ERR3 ERR2 14 15 16 17 18 19 20 21 22 23 24 25 26 PIN FUNCTION DESCRIPTIONS Pin No. Mnemonic In/Out Description 1 2, 3, 4 5, 6, 7 8, 9, 10 11, 12, 13 14 PGND1 OUTA PVDD1 OUTB PGND1 ERR3 15 ERR2 I/O 16 ERR1 I/O 17 ERR0 I/O 18 19 INA INB I I 20 21 22 23 24 DVDD DGND MUTE INC IND I I I 25 26 27, 28, 29 30, 31, 32 33, 34, 35 36, 37, 38 39, 40, 41, 42 43, 45, 48, 49 44 46 47 50, 51, 52 RST/PDN CLK PGND2 OUTD PVDD2 OUTC PGND2 AGND MODE0 AVDD MODE1 PGND1 Negative power supply for high power Transistors A2 and B2. Output of transistor pair A1 and A2. Positive power supply for high power Transistors A1 and B1. Output of transistor pair B1 and B2. Negative power supply for high power Transistors A2 and B2. Edge speed setting MSB during RESET/active low thermal shutdown error output during normal operation. Edge speed setting Bit 1 during RESET/active low thermal warning error output during normal operation. Nonoverlap time setting MSB during RESET/active thermal low shutdown error output during normal operation. Nonoverlap time setting Bit 1 during RESET/active low data-loss error output or low-side transistor disable input during normal operation. Control pin for Transistors A1 and A2 always; also control pin for B1 and B2 in 2-channel mode. Edge speed setting LSB during RESET/during normal operation, control pin for Transistors B1 and B2 in 4-channel mode; no function in 2-channel mode. Positive power supply for low power digital circuitry. Negative power supply for low power digital circuitry. Active low clickless mute input. Control pin for Transistors C1 and C2 always; also control pin for D1 and D2 in 2-channel mode. Nonoverlap time setting LSB during RESET/during normal operation, control pin for Transistors D1 and D2 in 4-channel mode; no function in 2-channel mode. Active low RESET/power-down input. External clock input in external clock mode. Negative power supply for high power Transistors C2 and D2. Output of transistor pair D1 and D2. Positive power supply for high power Transistors C1 and D1. Output of transistor pair C1 and C2. Negative power supply for high power Transistors C2 and D2. Negative power supply for low power analog circuitry. Clock source select (referenced to AGND); normally connected to AGND. Positive power supply for low power analog circuitry. Channel mode select (referenced to AGND). Negative power supply for high power Transistors A2 and B2. REV. 0 O O I/O I I O O I –5– AD1991 FUNCTIONAL DESCRIPTION Device Architecture 4-Channel Mode The 4-channel mode has two types of configuration: audio and power supply. Neither of these configurations require data loss detection. In the audio configuration, each single-ended load is connected to the output through a blocking capacitor, which prevents dc from reaching the load, thereby negating the need for data loss detection. While in the power supply configuration, it is desired to maintain a dc voltage on the load, also negating the need for data loss detection. When used in the power supply configuration, the four low-side transistors can also be disabled and left permanently open if desired. This allows the loads to be driven by switching only the high-side transistor on and off. ERR0 is an input in 4-channel mode and is used to select whether the four low-side transistors are enabled or disabled, with 0 selecting disabled and 1 selecting enabled. Table IV summarizes the function of ERR0 in this mode. Table V shows the input/output relationship. The AD1991 is an 8-transistor, audio, power output stage. The AD1991 is arranged internally as four transistor pairs that can be used as two H-bridge outputs (2-channel mode) or as four single-ended outputs (4-channel mode), using either two or four TTL compatible inputs to control the transistors. A dead time is automatically provided between the switching of the highside transistor and low-side transistor when the control inputs change level, to ensure that both the high-side transistor and low-side transistor are never on at the same time. Clock Source and Channel Mode Selection When the AD1991 is brought out of reset, the logic levels on MODE0 and MODE1 are latched internally. MODE0 determines the internal state machine clock source. MODE1 determines the channel mode and the function of ERR0 (see Tables I and II.) When the internal clock is used, the CLK pin should not be connected. Table IV. ERR0 Function in 4-Channel Mode Table I. Clock Source Selection ERR0 Low-Side Transistor Status MODE0 CLK Source 0 1 Internal External 0 1 Disabled Enabled Table V. Input/Output Relationship in 4-Channel Mode Table II. Channel Mode Selection MODE1 Channel Mode ERR0 Function 0 1 2-Channel Mode 4-Channel Mode Data Loss Detection Output Low-Side Disable Input 2-Channel Mode INA INC OUTA, OUTB OUTC, OUTD INA INB INC IND OUTA OUTB OUTC OUTD One load is connected differentially—across OUTA and OUTC, and OUTB and OUTD. This mono operation is established by configuring the part for 2-channel mode and externally connecting INA to INC, OUTA to OUTC, and OUTB to OUTD (see Figure 4). Thermal Protection The AD1991 features thermal protection. When the die temperature exceeds approximately 135°C, the thermal warning error output (ERR2) is asserted. If the die temperature exceeds approximately 150°C, the thermal shutdown error output (ERR3) is asserted. If this occurs, the part shuts down to prevent damage to the part. When the die temperature drops below approximately 120°C, both error outputs de-assert and the part returns to normal operation. Table III. Input/Output Relationship in 2-Channel Mode Controlled Output Controlled Output 1-Channel Mode Two loads are connected differentially—across OUTA and OUTB and across OUTC and OUTD. Inputs INB and IND are unused and should be tied to an appropriate dc voltage (see the Edge Speed and Nonoverlap Settings section). In this mode, ERR0 is an error output used to indicate data loss, which occurs when there are no transitions on INA or INC for more than 50 ms. This signal condition is hazardous in 2-channel mode because it can cause a potentially large and harmful dc voltage across the differential loads. Table III shows the input/output relationship. Input Input Overcurrent Protection The AD1991 features overcurrent or short-circuit protection. If the current through any power transistors exceeds 5 A, the part is muted and the overcurrent error output (ERR1) is asserted. This is a latched error and does not clear automatically. To clear the error condition and restore normal operation, the part must be reset or MUTE must be asserted and de-asserted. –6– REV. 0 AD1991 INPUT AVDD DVDD Table VI. Edge Speed Settings PVDD 6 A1 INA OUTA 3 A2 B1 INB OUTB 3 B2 LEVEL SHIFTER AND SWITCH CONTROL H-BRIDGE C1 INC OUTC D1 IND CLK 3 n CURRENT OVERLOAD THERMAL SHUTDOWN THERMAL WARNING DATA LOSS THERMAL PROTECTION SHORT-CIRCUIT PROTECTION MUTE CONTROL RST/PDN MUTE 4 AGND DGND 2 TEST CONTROL INB Edge Speed 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 1 0 1 0 1 0 1 0 1 (Slowest Edge Speed) 2 3 4 5 6 7 8 (Fastest Edge Speed) The nonoverlap time is set by using the three pins, ERR1, ERR0, and IND, when RST/PDN is low. The levels on the three pins are latched by the rising edge of RST/PDN. The latched value determines the nonoverlap time thereafter, until RST/PDN is brought low. Table VII shows the appropriate logic levels for the corresponding nonoverlap times. Note that IND is internally inverted, resulting in the nonmonotonic sequence in Table VII. OUTD D2 ERR2 Nonoverlap Time 3 C2 ERR3 Note that ERR3, ERR2, ERR1, and ERR0 are driven outputs under normal operation and, therefore, should never be tied to a dc voltage. The part contains internal 300 kΩ pull-up resistors to pull these pins high during reset. If it is desired to set them low to achieve a particular edge speed or nonoverlap time, this should be done by pulling them low through resistors between 10 kΩ and 50 kΩ. 14 PGND Figure 4. Functional Block Diagram (1-Channel Mode) EDGE SPEED AND NONOVERLAP SETTINGS Table VII. Nonoverlap Time Settings The AD1991 allows the user to select from one of eight different edge speeds and from one of eight different nonoverlap times. This allows the user to make a trade-off between distortion, efficiency, overshooting at the outputs, and EMI. The following sections describe the method used to program the settings. Edge Speed The edge speed is set by using the three pins, ERR3, ERR2, and INB, when RST/PDN is low. The levels on the three pins are latched by the rising edge of RST/PDN. The latched value determines the edge speed thereafter, until RST/PDN is brought low. Table VI shows the appropriate logic levels for the corresponding edge speeds. Note that INB is internally inverted, resulting in the nonmonotonic sequence in Table VI. REV. 0 –7– ERR1 ERR0 IND Nonoverlap Time 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 1 0 1 0 1 0 1 0 1 (Shortest Nonoverlap Time) 2 3 4 5 6 7 8 (Longest Nonoverlap Time) AD1991 junction (die) and the case (package) for each watt of power dissipated in the die. The AD1991 is specified with a JC of 1°C/W, which means that for each watt of power dissipated in the part, the junction (or die) temperature will be 1ºC higher than the case (or package) temperature. APPLICATION CONSIDERATIONS Good board layout and decoupling are vital for correct operation of the AD1991. Due to the fact that the part switches high currents, there is the potential for large PVDD bounce each time a transistor transitions. This can cause unpredictable operation of the part. To avoid this potential problem, close chip decoupling is essential. It is also recommended that the decoupling capacitors be placed on the same side of the board as the AD1991 and connected directly to the PVDD and PGND pins. By placing the decoupling capacitors on the other side of the board and decoupling through vias, the effectiveness of the decoupling is reduced. This is because vias have inductive properties and, therefore, prevent very fast discharge of the decoupling capacitors. Best operation is achieved with at least one decoupling capacitor on each side of the AD1991 or optionally two capacitors per side can be used to further reduce the series resistance of the capacitor. If these decoupling recommendations cannot be followed and decoupling through vias is the only option, the vias should be made as large as possible to increase surface area, thereby reducing inductance and resistance. The value of CA, the difference between the case and ambient temperatures, is entirely dependent on the size of heat sink attached to the case, the material used, the method of attachment, and the airflow over the heat sink. The value of CA is specified as 26°C/W for no heat sink and no airflow over the device. Finally, JA is the sum of the JC and CA values, and will be between 1°C/W and 27°C/W depending on the heat sink used. This is the temperature difference between the junction (die) and ambient temperature around the case (package) for each watt dissipated in the part. The AD1991 is specified to have a thermal shutdown of typically 150°C die temperature. Good design procedures allow for a margin, so the system should be designed such that the AD1991 die never goes above 140°C. Knowing the maximum desirable die temperature, the efficiency of the AD1991, the maximum ambient temperature, and the maximum power that will be delivered to the load, the necessary CA can be calculated. For an 8 Ω load, the AD1991 has a typical efficiency of 87%, which can be reduced slightly to be conservative. For this example, assume an 85% efficiency. If the power delivered to the loads is to be 2 ⫻ 20 W rms continuous power, the power dissipated in the AD1991 can be calculated as follows: Figures 5 and 6 show two possible layouts to provide close chip decoupling. In both cases, the PVDD to PGND decoupling is as close as possible to the pins of the AD1991. One solution uses surface-mount capacitors that offer low inductance; however, each output (OUTA, OUTB, OUTC, and OUTD) must be brought through vias to another layer of the board to be brought to the LC filter. The other solution uses through-hole capacitors that have higher inductance but allow the outputs to connect directly to the LC filter. In this solution, the inductor for OUTA and OUTC would span the PVDD trace. These diagrams show four decoupling capacitors from PVDD to PGND; however, this may not be necessary if capacitors with low series resistance are used. Another close chip capacitor is used for AVDD to AGND decoupling, with the actual power connections to the capacitors being done through vias. This is quite acceptable since AVDD is a low current stable supply. Finally, a close chip capacitor is used to decouple DVDD to DGND. This is quite important since DVDD is a digital supply whose current will change dynamically and, therefore, requires good decoupling. For both PVDD and DVDD, additional reservoir capacitors should be used to augment the close chip decoupling, especially for PVDD, which usually has very large transients. Power Supplied to Loads = 40 W rms Total Power Supplied to the AD1991 = (40/85 ⫻ 100) = 47 W rms Power Dissipated in the AD1991 = 7 W rms If the ambient temperature can reach 85°C maximum, the allowable difference between the die temperature and ambient temperature is (140 – 85) = 55°C. This gives a JA requirement of (55/7) = 7.9°C/W. This requires a heat sink that gives a CA of 6.9°C/W. The size and type of heat sink required can now be calculated. If adequate heat sinking is not applied to the AD1991, the system will suffer from the AD1991 going into thermal shutdown. It is advisable to also use the thermal warning output on the AD1991 to attenuate the power being delivered to help prevent thermal shutdown. THERMAL CONSIDERATIONS POWER-UP CONSIDERATIONS Careful consideration must be given to heat sinking the AD1991, particularly in applications where the ambient temperature can be much higher than normal room temperature. The three thermal resistances of JC, CA, and JA should be known in order to correctly heat sink the part. These values specify the temperature difference between two points, per unit power dissipation. JC specifies the temperature difference between the Careful power-up is necessary when using the AD1991 to ensure correct operation and to avoid possible latch-up issues. The AD1991 should be held in RESET with MUTEB asserted until all three power supplies have stabilized. Once the supplies have stabilized, the part can be brought out of RESET, and following this, MUTEB can be negated. –8– REV. 0 AD1991 PVDD PLANE CAP 51 50 49 48 46 45 44 43 42 41 40 39 AGND PLANE 2 38 3 37 4 36 5 35 34 6 PGND PLANE CAP 7 33 8 32 9 31 10 30 11 29 12 28 13 27 14 15 16 17 18 19 20 21 22 23 24 25 CAP CAP 1 47 CAP 52 26 CAP Figure 5. Layout Using Surface-Mount Capacitors (4 × 10 nF or 2 × 22 nF Recommended) PVDD PLANE CAP 51 50 49 48 46 45 44 43 42 41 40 39 AGND PLANE 2 38 3 37 4 36 5 35 6 34 PGND PLANE CAP 7 33 8 32 9 31 10 30 11 29 12 28 13 27 14 15 16 17 18 19 20 21 22 23 24 25 CAP CAP 1 47 CAP 52 26 CAP Figure 6. Layout Using Through-Hole Capacitors (4 × 10 nF or 2 × 22 nF Recommended) REV. 0 –9– AD1991 AVDD DVDD AVDD DVDD PVDD FEEDBACK ANALOG INPUT_L AVDD DVDD PVDD PWM_L GND GND MODULATOR ANALOG INPUT_R PWM_R AGND DGND FEEDBACK AD1991 AGND DGND PGND PGND AGND DGND Figure 7. Simplified System Schematic for Analog-In, Analog-Out System –10– REV. 0 AD1991 OUTLINE DIMENSIONS 52-Lead Thin Quad Flat Package, Exposed Pad [TQFP/EP] (SV-52) Dimensions shown in millimeters 12.00 BSC SQ 52 40 1 40 39 52 39 1 BOTTOM VIEW (PINS UP) 10.00 BSC SQ TOP VIEW 13 27 14 27 26 13 26 14 0.65 BSC 1.20 MAX 1.05 1.00 0.95 VIEW A 0.20 0.09 6.50 SQ EXPOSED PAD (PINS DOWN) SEATING PLANE 0.38 0.32 0.22 7 3.5 0 0.15 0.05 VIEW A 0.75 0.60 0.45 COMPLIANT TO JEDEC STANDARDS MS-026ACC WITH THE EXCEPTION THAT THE EXPOSED DIE PAD SHALL BE COPLANAR WITH BOTTOM OF PACKAGE WITHIN 0.05 MILLIMETERS. REV. 0 –11–