INFINEON BSC190N15NS3G

BSC190N15NS3 G
OptiMOS™3 Power-Transistor
Product Summary
Features
• N-channel, normal level
• Excellent gate charge x R DS(on) product (FOM)
V DS
150
V
R DS(on),max
19
mΩ
ID
50
A
• Very low on-resistance R DS(on)
• 150 °C operating temperature
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC1) for target application
• Ideal for high-frequency switching and synchronous rectification
• Halogen-free according to IEC61249-2-21
Type
BSC190N15NS3 G
Package
PG-TDSON-8
Marking
190N15NS
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
ID
Value
T C=25 °C
50
T C=100 °C
33
Unit
A
Pulsed drain current2)
I D,pulse
T C=25 °C
200
Avalanche energy, single pulse
E AS
I D=50 A, R GS=25 Ω
170
mJ
Gate source voltage3)
V GS
±20
V
Power dissipation
P tot
125
W
Operating and storage temperature
T j, T stg
-55 ... 150
°C
T C=25 °C
IEC climatic category; DIN IEC 68-1
Rev. 2.4
55/175/56
page 1
2009-11-04
BSC190N15NS3 G
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
-
1
-
-
50
150
-
-
Thermal characteristics
Thermal resistance, junction - case
R thJC
Thermal resistance, junction ambient
R thJA
6 cm2 cooling area 3)
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=1 mA
Gate threshold voltage
V GS(th)
V DS=V GS, I D=90 µA
2
3
4
Zero gate voltage drain current
I DSS
V DS=120 V, V GS=0 V,
T j=25 °C
-
0.1
1
V DS=120 V, V GS=0 V,
T j=125 °C
-
10
100
V
µA
Gate-source leakage current
I GSS
V GS=20 V, V DS=0 V
-
1
100
nA
Drain-source on-state resistance
R DS(on)
V GS=10 V, I D=50 A
-
16
19
mΩ
V GS=8 V, I D=25 A
-
16
20
-
2.4
-
Ω
29
57
-
S
Gate resistance
RG
Transconductance
g fs
1)
2)
|V DS|>2|I D|R DS(on)max,
I D=50 A
J-STD20 and JESD22
See figure 3
3)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 2.4
page 2
2009-11-04
BSC190N15NS3 G
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
1820
2420
-
214
285
Dynamic characteristics
Input capacitance
C iss
Output capacitance
C oss
Reverse transfer capacitance
C rss
-
5
-
Turn-on delay time
t d(on)
-
15
-
Rise time
tr
-
53
-
Turn-off delay time
t d(off)
-
25
-
Fall time
tf
-
6
-
Gate to source charge
Q gs
-
10
-
Gate to drain charge
Q gd
-
4
-
-
9
-
V GS=0 V, V DS=75 V,
f =1 MHz
V DD=75 V, V GS=10 V,
I D=50 A, R G=1.6 Ω
pF
ns
Gate Charge Characteristics 5)
V DD=75 V, I D=50 A,
V GS=0 to 10 V
nC
Switching charge
Q sw
Gate charge total
Qg
-
23
31
Gate plateau voltage
V plateau
-
5.7
-
Output charge
Q oss
-
60
79
nC
-
-
50
A
-
-
200
-
1
1.2
V
-
130
-
ns
-
385
-
nC
V DD=75 V, V GS=0 V
V
Reverse Diode
Diode continous forward current
IS
Diode pulse current
I S,pulse
Diode forward voltage
V SD
Reverse recovery time
t rr
Reverse recovery charge
Q rr
5)
Rev. 2.4
T C=25 °C
V GS=0 V, I F=50 A,
T j=25 °C
V R=75 V, I F=I S,
di F/dt =100 A/µs
See figure 16 for gate charge parameter definition
page 3
2009-11-04
BSC190N15NS3 G
1 Power dissipation
2 Drain current
P tot=f(T C)
I D=f(T C); V GS≥10 V
150
60
125
40
I D [A]
P tot [W]
100
75
50
20
25
0
0
0
50
100
150
200
0
50
T C [°C]
100
150
200
T C [°C]
3 Safe operating area
4 Max. transient thermal impedance
I D=f(V DS); T C=25 °C; D =0
Z thJC=f(t p)
parameter: t p
parameter: D =t p/T
103
101
1 µs
10 µs
102
100 µs
100
101
10 ms
0.2
0.1
10
DC
10
0.5
Z thJC [K/W]
I D [A]
1 ms
-1
0.05
0
0.02
0.01
single pulse
10-1
10
10-2
-1
10
0
10
1
10
2
10
3
V DS [V]
Rev. 2.4
10-5
10-4
10-3
10-2
10-1
100
t p [s]
page 4
2009-11-04
BSC190N15NS3 G
5 Typ. output characteristics
6 Typ. drain-source on resistance
I D=f(V DS); T j=25 °C
R DS(on)=f(I D); T j=25 °C
parameter: V GS
parameter: V GS
80
40
10 V
5V
35
8V
5.5 V
6V
7V
6V
30
R DS(on) [mΩ]
I D [A]
60
40
5.5 V
20
25
20
8V
10 V
15
10
5V
5
4.5 V
0
0
0
0
1
2
3
4
5
0
20
V DS [V]
40
60
80
120
160
I D [A]
7 Typ. transfer characteristics
8 Typ. forward transconductance
I D=f(V GS); |V DS|>2|I D|R DS(on)max
g fs=f(I D); T j=25 °C
parameter: T j
100
80
80
60
60
I D [A]
g fs [S]
100
40
40
20
20
175 °C
25 °C
0
0
0
2
4
6
8
Rev. 2.4
0
40
80
I D [A]
V GS [V]
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2009-11-04
BSC190N15NS3 G
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
R DS(on)=f(T j); I D=50 A; V GS=10 V
V GS(th)=f(T j); V GS=V DS
parameter: I D
60
4
55
3.5
50
900 µA
45
3
90 µA
2.5
35
V GS(th) [V]
R DS(on) [mΩ]
40
30
25
98%
2
1.5
20
typ
15
1
10
0.5
5
0
0
-60
-20
20
60
100
140
180
-60
-20
20
60
100
140
180
T j [°C]
T j [°C]
11 Typ. capacitances
12 Forward characteristics of reverse diode
C =f(V DS); V GS=0 V; f =1 MHz
I F=f(V SD)
parameter: T j
104
103
Ciss
103
102
25 °C
I F [A]
C [pF]
Coss
102
175 °C
25°C, 98%
101
101
175°C, 98%
Crss
100
0
20
40
60
80
100
Rev. 2.4
0
0.5
1
1.5
2
V SD [V]
V DS [V]
page 6
2009-11-04
BSC190N15NS3 G
13 Avalanche characteristics
14 Typ. gate charge
I AS=f(t AV); R GS=25 Ω
V GS=f(Q gate); I D=50A pulsed
parameter: T j(start)
parameter: V DD
100
10
120 V
8
75 V
25 °C
30 V
10
6
V GS [V]
I AS [A]
100 °C
125 °C
4
2
1
0
1
10
100
1000
0
5
10
15
20
25
Q gate [nC]
t AV [µs]
15 Drain-source breakdown voltage
16 Gate charge waveforms
V BR(DSS)=f(T j); I D=1 mA
170
V GS
Qg
165
V BR(DSS) [V]
160
155
150
V g s(th)
145
Q g(th)
140
Q sw
Q gs
135
-60
-20
20
60
100
140
Q g ate
Q gd
180
T j [°C]
Rev. 2.4
page 7
2009-11-04
BSC190N15NS3 G
PG-TDSON-8 Outline
Rev. 2.4
page 8
2009-11-04
BSC190N15NS3 G
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
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conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
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contact the nearest Infineon Technologies Office ( www.infineon.com).
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Due to technical requirements, components may contain dangerous substances. For information
on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
the express written approval of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support device or system or to affect
the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.
Rev. 2.4
page 9
2009-11-04