CAT93C66, CAT93W66 4 kb Microwire Serial CMOS EEPROM Description The CAT93C66 is a 4 kb CMOS Serial EEPROM device which is organized as either 256 registers of 16 bits (ORG pin at VCC) or 512 registers of 8 bits (ORG pin at GND). The CAT93W66 features x16 memory organization only. Each register can be written (or read) serially by using the DI (or DO) pin. The device features sequential read and self−timed internal write with auto−clear. On−chip Power−On Reset circuitry protects the internal logic against powering up in the wrong state. Features • • • • • • • • • • • • • High Speed Operation: 4 MHz (5 V), 2 MHz (1.8 V) 1.8 V to 5.5 V Supply Voltage Range Selectable x8 or x16 Memory Organization: CAT93C66 Self−timed Write Cycle with Auto−clear Sequential Read Software Write Protection Power−up Inadvertent Write Protection Low Power CMOS Technology 1,000,000 Program/Erase Cycles 100 Year Data Retention Industrial and Extended Temperature Ranges 8−lead PDIP, SOIC, TSSOP, 6−lead SOT−23, 8−pad TDFN and UDFN Packages These Devices are Pb−Free, Halogen Free/BFR Free, and RoHS Compliant VCC CS SK CS CAT93C66 DO SK CAT93W66 DO DI DI GND GND Figure 1. Functional Symbols When the ORG pin is connected to VCC, the x16 organization is selected. When it is connected to ground, the x8 organization is selected. If the ORG pin is left unconnected, then an internal pull−up device will select the x16 organization. TDFN−8* VP2 SUFFIX CASE 511AK PDIP−8 L SUFFIX CASE 646AA TSSOP−8 Y SUFFIX CASE 948AL SOIC−8 X SUFFIX CASE 751BE SOT23−6 TB SUFFIX CASE 527AJ CS 1 8 VCC NC 1 8 ORG SK 2 7 NC VCC 2 7 GND DI 3 6 ORG CS DO 4 5 GND SK 3 4 6 DO 5 DI PDIP (L), SOIC (V, X), TSSOP (Y), TDFN (VP2)*, UDFN (HU4) CS 1 8 VCC SK 2 7 NC DI 3 6 NC DO 4 5 GND SOIC (W)* DO 1 6 VCC GND 2 5 CS DI 3 4 SK SOT−23 (TB)** * Not recommended for new designs ** CAT93C66 available in SOT−23 6−pin for x8 Organization. Contact factory for availability. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 16 of this data sheet. CAT93W66: The device works in x16 mode only. April, 2012 − Rev. 11 UDFN−8 HU4 SUFFIX CASE 517AZ TDFN (VP2) CAT93W66 CAT93C66 Selectable Organization: © Semiconductor Components Industries, LLC, 2012 SOIC−8 V, W* SUFFIX CASE 751BD PIN CONFIGURATION VCC ORG http://onsemi.com 1 Publication Order Number: CAT93C66/D CAT93C66, CAT93W66 Table 1. PIN FUNCTION Pin Name Function Pin Name Function CS Chip Select VCC Power Supply SK Clock Input GND Ground DI Serial Data Input DO Serial Data Output ORG (Note 1) NC Memory Organization No Connection 1. ORG Pin available for the CAT93C66 only. Table 2. ABSOLUTE MAXIMUM RATINGS Parameters Ratings Units Storage Temperature −65 to +150 °C Voltage on Any Pin with Respect to Ground (Note 2) −0.5 to +6.5 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2. The DC input voltage on any pin should not be lower than −0.5 V or higher than VCC + 0.5 V. During transitions, the voltage on any pin may undershoot to no less than −1.5 V or overshoot to no more than VCC + 1.5 V, for periods of less than 20 ns. Table 3. RELIABILITY CHARACTERISTICS (Note 3) Symbol Parameter NEND (Note 4) TDR Endurance Data Retention Min Units 1,000,000 Program / Erase Cycles 100 Years 3. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100 and JEDEC test methods. 4. Block Mode, VCC = 5 V, 25°C. Table 4. D.C. OPERATING CHARACTERISTICS − MATURE PRODUCT (VCC = +1.8 V to +5.5 V, TA = −40°C to +125°C unless otherwise specified.) Symbol Parameter Test Conditions Min Max Units ICC1 Power Supply Current (Write) fSK = 1 MHz, VCC = 5.0 V 1 mA ICC2 Power Supply Current (Read) fSK = 1 MHz, VCC = 5.0 V 500 mA ISB1 Power Supply Current (Standby) (x8 Mode) VIN = GND or VCC, CS = GND ORG = GND TA = −40°C to +85°C 2 mA TA = −40°C to +125°C 4 Power Supply Current (Standby) (x16 Mode) VIN = GND or VCC, CS = GND ORG = Float or VCC TA = −40°C to +85°C 1 TA = −40°C to +125°C 2 Input Leakage Current VIN = GND to VCC TA = −40°C to +85°C 1 TA = −40°C to +125°C 2 TA = −40°C to +85°C 1 ISB2 ILI mA mA ILO Output Leakage Current VOUT = GND to VCC, CS = GND VIL1 Input Low Voltage 4.5 V ≤ VCC < 5.5 V −0.1 0.8 V VIH1 Input High Voltage 4.5 V ≤ VCC < 5.5 V 2 VCC + 1 V VIL2 Input Low Voltage 1.8 V ≤ VCC < 4.5 V 0 VCC x 0.2 V VIH2 Input High Voltage 1.8 V ≤ VCC < 4.5 V VCC x 0.7 VCC + 1 V VOL1 Output Low Voltage 4.5 V ≤ VCC < 5.5 V, IOL = 2.1 mA 0.4 V VOH1 Output High Voltage 4.5 V ≤ VCC < 5.5 V, IOH = −400 mA VOL2 Output Low Voltage 1.8 V ≤ VCC < 4.5 V, IOL = 1 mA VOH2 Output High Voltage 1.8 V ≤ VCC < 4.5 V, IOH = −100 mA TA = −40°C to +125°C http://onsemi.com 2 mA 2 2.4 V 0.2 VCC − 0.2 V V CAT93C66, CAT93W66 Table 5. D.C. OPERATING CHARACTERISTICS − NEW PRODUCT (REV H) (VCC = +1.8 V to +5.5 V, TA=−40°C to +125°C unless otherwise specified.) Symbol Parameter ICC1 Supply Current (Write) Write, VCC = 5.0 V ICC2 Supply Current (Read) Read, DO open, fSK = 2 MHz, VCC = 5.0 V ISB1 Standby Current (x8 Mode) VIN = GND or VCC CS = GND, ORG = GND TA = −40°C to +85°C TA = −40°C to +125°C 5 Standby Current (x16 Mode) VIN = GND or VCC CS = GND, ORG = Float or VCC TA = −40°C to +85°C 1 TA = −40°C to +125°C 3 VIN = GND to VCC TA = −40°C to +85°C 1 TA = −40°C to +125°C 2 TA = −40°C to +85°C 1 TA = −40°C to +125°C 2 ISB2 ILI Input Leakage Current ILO Test Conditions Min Output Leakage Current VOUT = GND to VCC CS = GND VIL1 Input Low Voltage 4.5 V ≤ VCC < 5.5 V −0.1 VIH1 Input High Voltage 4.5 V ≤ VCC < 5.5 V VIL2 Input Low Voltage 1.8 V ≤ VCC < 4.5 V VIH2 Input High Voltage 1.8 V ≤ VCC < 4.5 V VOL1 Output Low Voltage 4.5 V ≤ VCC < 5.5 V, IOL = 3 mA VOH1 Output High Voltage 4.5 V ≤ VCC < 5.5 V, IOH = −400 mA VOL2 Output Low Voltage 1.8 V ≤ VCC < 4.5 V, IOL = 1 mA VOH2 Output High Voltage 1.8 V ≤ VCC < 4.5 V, IOH = −100 mA Max Units 1 mA 500 mA 2 mA mA mA mA 0.8 V 2 VCC + 1 V 0 VCC x 0.2 V VCC x 0.7 VCC + 1 V 0.4 V 2.4 V 0.2 VCC − 0.2 V V Table 6. PIN CAPACITANCE (TA = 25°C, f = 1.0 MHz, VCC = +5.0 V) Test Conditions Output Capacitance (DO) Symbol COUT (Note 5) CIN (Note 5) Max Units VOUT = 0 V 5 pF VIN = 0 V 5 pF Input Capacitance (CS, SK, DI, ORG) Min Typ 5. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100 and JEDEC test methods. Table 7. POWER−UP TIMING (Notes 6, 7) Parameter Symbol Max Units tPUR Power−up to Read Operation 1 ms tPUW Power−up to Write Operation 1 ms 6. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100 and JEDEC test methods. 7. tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated. Table 8. A.C. TEST CONDITIONS Input Rise and Fall Times ≤ 50 ns Input Pulse Voltages 0.4 V to 2.4 V 4.5 V ≤ VCC ≤ 5.5 V Timing Reference Voltages 0.8 V, 2.0 V 4.5 V ≤ VCC ≤ 5.5 V Input Pulse Voltages 0.2 VCC to 0.7 VCC 1.8 V ≤ VCC ≤ 4.5 V Timing Reference Voltages 0.5 VCC 1.8 V ≤ VCC ≤ 4.5 V Output Load Current Source IOLmax/IOHmax; CL = 100 pF http://onsemi.com 3 CAT93C66, CAT93W66 Table 9. A.C. CHARACTERISTICS − MATURE PRODUCT (VCC = +1.8 V to +5.5 V, TA = −40°C to +125°C, unless otherwise specified.) (Note 8) Limits Symbol Min Parameter Max Units tCSS CS Setup Time 50 ns tCSH CS Hold Time 0 ns tDIS DI Setup Time 100 ns tDIH DI Hold Time 100 ns tPD1 Output Delay to 1 0.25 tPD0 Output Delay to 0 0.25 ms Output Delay to High−Z 100 ns 5 ms tHZ (Note 9) tEW Program/Erase Pulse Width ms tCSMIN Minimum CS Low Time 0.25 ms tSKHI Minimum SK High Time 0.25 ms tSKLOW Minimum SK Low Time 0.25 ms tSV Output Delay to Status Valid SKMAX Maximum Clock Frequency DC 0.25 ms 2000 kHz 8. Test conditions according to “A.C. Test Conditions” table. 9. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100 and JEDEC test methods. Table 10. A.C. CHARACTERISTICS − NEW PRODUCT (Rev H) (VCC = +1.8 V to +5.5 V, TA = −40°C to +125°C, unless otherwise specified.) VCC = 1.8 V − 5.5 V Symbol Min Parameter Max VCC = 4.5 V − 5.5 V Min Max Units tCSS CS Setup Time 50 50 ns tCSH CS Hold Time 0 0 ns tDIS DI Setup Time 100 50 ns 100 tDIH DI Hold Time tPD1 Output Delay to 1 0.25 0.1 ms tPD0 Output Delay to 0 0.25 0.1 ms Output Delay to High−Z 100 100 ns 5 5 ms tHZ (Note 10) tEW Program/Erase Pulse Width 50 ns tCSMIN Minimum CS Low Time 0.25 0.1 ms tSKHI Minimum SK High Time 0.25 0.1 ms tSKLOW Minimum SK Low Time 0.25 0.1 ms tSV Output Delay to Status Valid SKMAX Maximum Clock Frequency 0.25 DC 2000 10. This parameter is tested initially and after a design or process change that affects the parameter. http://onsemi.com 4 DC 0.1 ms 4000 kHz CAT93C66, CAT93W66 Device Operation The CAT93C66 is a 4096−bit nonvolatile memory intended for use with industry standard microprocessors. The CAT93C66 can be organized as either registers of 16 bits or 8 bits. When organized as X16, seven 11−bit instructions control the reading, writing and erase operations of the device. When organized as X8, seven 12−bit instructions control the reading, writing and erase operations of the device. The CAT93W66 works in x16 mode only. The device operates on a single power supply and will generate on chip, the high voltage required during any write operation. Instructions, addresses, and write data are clocked into the DI pin on the rising edge of the clock (SK). The DO pin is normally in a high impedance state except when reading data from the device, or when checking the ready/busy status after a write operation. The serial communication protocol follows the timing shown in Figure 2. The ready/busy status can be determined after the start of internal write cycle by selecting the device (CS high) and polling the DO pin; DO low indicates that the write operation is not completed, while DO high indicates that the device is ready for the next instruction. If necessary, the DO pin may be placed back into a high impedance state during chip select by shifting a dummy “1” into the DI pin. The DO pin will enter the high impedance state on the rising edge of the clock (SK). Placing the DO pin into the high impedance state is recommended in applications where the DI pin and the DO pin are to be tied together to form a common DI/O pin. The format for all instructions sent to the device is a logical “1” start bit, a 2−bit (or 4−bit) opcode, 8−bit address (an additional bit when organized X8) and for write operations a 16−bit data field (8−bit for X8 organizations). The instruction format is shown in Instruction Set table. Table 11. INSTRUCTION SET Address Data Instruction Start Bit Opcode x8 (Note 11) READ 1 10 A8−A0 A7−A0 Read Address AN – A0 ERASE 1 11 A8−A0 A7−A0 Clear Address AN – A0 WRITE 1 01 A8−A0 A7−A0 EWEN 1 00 11XXXXXXX 11XXXXXX Write Enable EWDS 1 00 00XXXXXXX 00XXXXXX Write Disable ERAL 1 00 10XXXXXXX 10XXXXXX Clear All Addresses WRAL 1 00 01XXXXXXX 01XXXXXX x16 11. The x8 memory organization is available for the CAT93C66 only. http://onsemi.com 5 x8 (Note 11) D7−D0 D7−D0 x16 D15−D0 D15−D0 Comments Write Address AN – A0 Write All Addresses CAT93C66, CAT93W66 Read words will follow without a dummy zero bit. The READ instruction timing is illustrated in Figure 3. Upon receiving a READ command and an address (clocked into the DI pin), the DO pin of the CAT93C66, CAT93W66 will come out of the high impedance state and, after sending an initial dummy zero bit, will begin shifting out the data addressed (MSB first). The output data bits will toggle on the rising edge of the SK clock and are stable after the specified time delay (tPD0 or tPD1). For the CAT93C66, CAT93W66 after the initial data word has been shifted out and CS remains asserted with the SK clock continuing to toggle, the device will automatically increment to the next address and shift out the next data word in a sequential READ mode. As long as CS is continuously asserted and SK continues to toggle, the device will keep incrementing to the next address automatically until it reaches to the end of the address space, then loops back to address 0. In the sequential READ mode, only the initial data word is preceeded by a dummy zero bit. All subsequent data tSKHI Erase/Write Enable and Disable The device powers up in the write disable state. Any writing after power−up or after an EWDS (erase/write disable) instruction must first be preceded by the EWEN (erase/write enable) instruction. Once the write instruction is enabled, it will remain enabled until power to the device is removed, or the EWDS instruction is sent. The EWDS instruction can be used to disable all CAT93C66, CAT93W66 write and erase instructions, and will prevent any accidental writing or clearing of the device. Data can be read normally from the device regardless of the write enable/disable status. The EWEN and EWDS instructions timing is shown in Figure 4. tSKLOW tCSH SK tDIS tDIH VALID DI VALID tCSS CS tPD0, tPD1 tDIS DO tCSMIN DATA VALID Figure 2. Synchronous Data Timing SK CS AN DI 1 1 AN−1 Don’t Care A0 0 tPD0 DO HIGH−Z Dummy 0 D15 . . . D0 or D7 . . . D0 Address + 1 D15 . . . D0 or D7 . . . D0 Figure 3. READ Instruction Timing http://onsemi.com 6 Address + 2 D15 . . . D0 or D7 . . . D0 Address + n D15 . . . or D7 . . . CAT93C66, CAT93W66 Write Erase After receiving a WRITE command (Figure 5), address and the data, the CS (Chip Select) pin must be deselected for a minimum of tCSMIN. The falling edge of CS will start the self clocking clear and data store cycle of the memory location specified in the instruction. The clocking of the SK pin is not necessary after the device has entered the self clocking mode. The ready/busy status of the CAT93C66, CAT93W66 can be determined by selecting the device and polling the DO pin. Since this device features Auto−Clear before write, it is NOT necessary to erase a memory location before it is written into. Upon receiving an ERASE command and address, the CS (Chip Select) pin must be deasserted for a minimum of tCSMIN (Figure 6). The falling edge of CS will start the self clocking clear cycle of the selected memory location. The clocking of the SK pin is not necessary after the device has entered the self clocking mode. The ready/busy status of the CAT93C66, CAT93W66 can be determined by selecting the device and polling the DO pin. Once cleared, the content of a cleared location returns to a logical “1” state. SK STANDBY CS DI 1 0 0 * ENABLE = 11 DISABLE = 00 * Figure 4. EWEN/EWDS Instruction Timing SK tCSMIN CS AN AN−1 DI 1 0 A0 DN STATUS VERIFY D0 STANDBY 1 tSV HIGH−Z DO BUSY READY tHZ HIGH−Z tEW Figure 5. Write Instruction Timing SK CS AN DI DO 1 1 AN−1 A0 tCS STATUS VERIFY STANDBY 1 tSV HIGH−Z BUSY tEW Figure 6. Erase Instruction Timing http://onsemi.com 7 tHZ READY HIGH−Z CAT93C66, CAT93W66 Erase All Write All Upon receiving an ERAL command (Figure 7), the CS (Chip Select) pin must be deselected for a minimum of tCSMIN. The falling edge of CS will start the self clocking clear cycle of all memory locations in the device. The clocking of the SK pin is not necessary after the device has entered the self clocking mode. The ready/busy status of the device can be determined by selecting the device and polling the DO pin. Once cleared, the contents of all memory bits return to a logical “1” state. Upon receiving a WRAL command and data, the CS (Chip Select) pin must be deselected for a minimum of tCSMIN (Figure 8). The falling edge of CS will start the self clocking data write to all memory locations in the device. The clocking of the SK pin is not necessary after the device has entered the self clocking mode. The ready/busy status of the device can be determined by selecting the device and polling the DO pin. It is not necessary for all memory locations to be cleared before the WRAL command is executed. SK CS STATUS VERIFY STANDBY tCS DI 1 0 1 0 0 tSV tHZ HIGH−Z DO BUSY READY HIGH−Z tEW Figure 7. ERAL Instruction Timing SK CS STATUS VERIFY STANDBY tCSMIN DI 1 0 0 0 1 DN D0 tSV tHZ DO BUSY tEW Figure 8. WRAL Instruction Timing http://onsemi.com 8 READY HIGH−Z CAT93C66, CAT93W66 PACKAGE DIMENSIONS PDIP−8, 300 mils CASE 646AA−01 ISSUE A SYMBOL MIN NOM A E1 5.33 A1 0.38 A2 2.92 3.30 4.95 b 0.36 0.46 0.56 b2 1.14 1.52 1.78 c 0.20 0.25 0.36 D 9.02 9.27 10.16 E 7.62 7.87 8.25 E1 6.10 6.35 7.11 e PIN # 1 IDENTIFICATION MAX 2.54 BSC eB 7.87 L 2.92 10.92 3.30 3.80 D TOP VIEW E A2 A A1 c b2 L e eB b SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MS-001. http://onsemi.com 9 CAT93C66, CAT93W66 PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O E1 E SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 c 0.19 0.25 D 4.80 5.00 E 5.80 6.20 E1 3.80 MAX 4.00 1.27 BSC e PIN # 1 IDENTIFICATION NOM h 0.25 0.50 L 0.40 1.27 θ 0º 8º TOP VIEW D h A1 θ A c e b L SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. http://onsemi.com 10 CAT93C66, CAT93W66 PACKAGE DIMENSIONS SOIC−8, 208 mils CASE 751BE−01 ISSUE O SYMBOL MIN NOM A E1 E MAX 2.03 A1 0.05 0.25 b 0.36 0.48 c 0.19 0.25 D 5.13 5.33 E 7.75 8.26 E1 5.13 5.38 e 1.27 BSC L 0.51 0.76 θ 0º 8º PIN#1 IDENTIFICATION TOP VIEW D A e b q L A1 c END VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with EIAJ EDR-7320. http://onsemi.com 11 CAT93C66, CAT93W66 PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O b SYMBOL MIN NOM A E1 E MAX 1.20 A1 0.05 A2 0.80 b 0.19 0.15 0.90 1.05 0.30 c 0.09 D 2.90 3.00 3.10 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 e 0.20 0.65 BSC L 1.00 REF L1 0.50 θ 0º 0.60 0.75 8º e TOP VIEW D A2 c q1 A A1 L1 SIDE VIEW L END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. http://onsemi.com 12 CAT93C66, CAT93W66 PACKAGE DIMENSIONS TDFN8, 2x3 CASE 511AK−01 ISSUE A D A e b E2 E PIN#1 IDENTIFICATION A1 PIN#1 INDEX AREA D2 TOP VIEW SIDE VIEW SYMBOL MIN NOM MAX A 0.70 0.75 0.80 A1 0.00 0.02 0.05 A2 0.45 0.55 0.65 A3 A2 A3 0.20 0.25 0.30 D 1.90 2.00 2.10 D2 1.30 1.40 1.50 E 2.90 3.00 3.10 E2 1.20 1.30 1.40 L BOTTOM VIEW 0.20 REF b e FRONT VIEW 0.50 TYP 0.20 0.30 L 0.40 Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MO-229. http://onsemi.com 13 CAT93C66, CAT93W66 PACKAGE DIMENSIONS SOT−23, 6 Lead CASE 527AJ−01 ISSUE O D SYMBOL e E1 E MIN NOM A 0.90 1.45 A1 0.00 0.15 A2 0.90 b 0.30 0.50 c 0.08 0.22 1.15 D 2.90 BSC E 2.80 BSC E1 1.60 BSC e 0.95 BSC L 0.45 0.30 L1 PIN #1 IDENTIFICATION 1.30 0.60 0.60 REF L2 TOP VIEW MAX 0.25 REF θ 0° 4° 8° θ1 5° 10° 15° θ2 5° 10° 15° θ1 A2 A θ b θ2 L1 A1 SIDE VIEW L2 L END VIEW Notes: (1) All dimensions in millimeters. Angles in degrees. (2) Complies with JEDEC standard MO-178. http://onsemi.com 14 c CAT93C66, CAT93W66 PACKAGE DIMENSIONS UDFN8, 2x3 EXTENDED PAD CASE 517AZ−01 ISSUE O D b A e L DAP SIZE 1.8 x 1.8 E2 E PIN #1 IDENTIFICATION A1 PIN #1 INDEX AREA D2 TOP VIEW SYMBOL MIN SIDE VIEW NOM MAX A 0.45 0.50 0.55 A1 0.00 0.02 0.05 A3 0.127 REF b 0.20 0.25 0.30 D 1.95 2.00 2.05 D2 1.35 1.40 1.45 E 2.95 3.00 3.05 E2 1.25 1.30 1.35 e L BOTTOM VIEW DETAIL A 0.065 REF A3 A FRONT VIEW 0.50 REF 0.25 0.30 0.35 A3 Notes: (1) All dimensions are in millimeters. (2) Refer JEDEC MO-236/MO-252. 0.0 - 0.05 DETAIL A http://onsemi.com 15 0.065 REF Copper Exposed CAT93C66, CAT93W66 Table 12. ORDERING INFORMATION Device Order Number Specific Device Marking* Package Type Temperature Range CAT93C66LI−G 93C66H PDIP−8 CAT93C66VE−G 93C66H CAT93C66VE−GT3 Lead Finish Shipping I = Industrial (−40°C to +85°C) NiPdAu Tube, 50 Units / Tube SOIC−8, JEDEC E = Extended (−40°C to +125°C) NiPdAu Tube, 100 Units / Tube 93C66H SOIC−8, JEDEC E = Extended (−40°C to +125°C) NiPdAu Tape & Reel, 3,000 Units / Reel CAT93C66VI−G 93C66H SOIC−8, JEDEC I = Industrial (−40°C to +85°C) NiPdAu Tube, 100 Units / Tube CAT93C66VI−GT3 93C66H SOIC−8, JEDEC I = Industrial (−40°C to +85°C) NiPdAu Tape & Reel, 3,000 Units / Reel CAT93C66VP2E−GT3 M2T TDFN−8 E = Extended (−40°C to +125°C) NiPdAu Tape & Reel, 3,000 Units / Reel CAT93C66VP2I−GT3 M2T TDFN−8 I = Industrial (−40°C to +85°C) NiPdAu Tape & Reel, 3,000 Units / Reel CAT93C66YI−G M66 TSSOP−8 I = Industrial (−40°C to +85°C) NiPdAu Tube, 100 Units / Tube CAT93C66YI−GT3 M66 TSSOP−8 I = Industrial (−40°C to +85°C) NiPdAu Tape & Reel, 3,000 Units / Reel CAT93C66YE−GT3 M66 TSSOP−8 E = Extended (−40°C to +125°C) NiPdAu Tape & Reel, 3,000 Units / Reel CAT93W66VP2I−GT3 M2C TDFN−8 I = Industrial (−40°C to +85°C) NiPdAu Tape & Reel, 3,000 Units / Reel 93C66H SOIC−8, EIAJ E = Extended (−40°C to +125°C) Matte−Tin Tape & Reel, 2,000 Units / Reel CAT93C66HU4I−GT3 M2U UDFN−8 I = Industrial (−40°C to +85°C) NiPdAu Tape & Reel, 3,000 Units / Reel CAT93C66HU4E−GT3 M2U UDFN−8 E = Extended (−40°C to +125°C) NiPdAu Tape & Reel, 3,000 Units / Reel CAT93C66XI−T2 * Marking for New Product (Rev H) 12. All packages are RoHS−compliant (Lead−free, Halogen−free). 13. The standard lead finish is NiPdAu. 14. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office. 15. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 16. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device Nomenclature document, TND310/D, available at www.onsemi.com ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 16 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CAT93C66/D