INTERSIL CD40103BMS

CD40102BMS
CD40103BMS
CMOS 8-Stage Presettable
Synchronous Down Counters
December 1992
Features
Description
• High Voltage Type (20V Rating)
CD40102BMS and CD40103BMS consist of an 8-stage synchronous down counter with a single output which is active
when the internal count is zero. The CD40102BMS is configured as two cascaded 4-bit BCD counters, and the
CD40103BMS contains a single 8-bit binary counter. Each
type has control inputs for enabling or disabling the clock, for
clearing the counter to its maximum count, and for presetting
the counter either synchronously or asynchronously. All control inputs and the CARRY-OUT/ZERO-DETECT output are
active-low logic.
• CD40102BMS: 2-Decade BCD Type
• CD40103BMS: 8-Bit Binary Type
• Synchronous or Asynchronous Preset
• Medium Speed Operation
- fCL = 3.6MHz (Typ) at 10V
• Cascadable
• 100% Tested for Quiescent Current at 20V
• Maximum Input Current of 1µA at 18V Over Full Package Temperature Range; 100nA at 18V and +25oC
• Noise Margin (Over Full Package/Temperature Range)
- 1V at VDD = 5V
- 2V at VDD = 10V
- 2.5V at VDD = 15V
• Standardized Symmetrical Output Characteristics
• 5V, 10V and 15V Parametric Ratings
• Meets All Requirements of JEDEC Tentative Standard
No. 13B, “Standard Specifications for Description of
‘B’ Series CMOS Devices”
In normal operation, the counter is decremented by one
count on each positive transition of the CLOCK. Counting is
inhibited when the CARRY-IN/COUNTER ENABLE (CI/CE)
inputs is high. The CARRY-OUT/ZERO-DETECT (CO/ZD)
output goes low when the count reaches zero if the CI/CE
input is low, and remains low for one full clock period.
When the SYNCHRONOUS PRESET-ENABLE (SPE) input
is low, data at the JAM input is clocked into the counter on
the next positive clock transition regardless of the state of
the CI/CE input. When the ASYNCHRONOUS PRESETENABLE (APE) input is low, data at the JAM inputs is asynchronously forced into the counter regardless of the state of
the SPE, CI/CE, or CLOCK inputs. JAM inputs J0-J7 represent two 4-bit BCD words for the CD40102BMS and a single
8-bit binary word for the CD40103BMS.
When the CLEAR (CLR) input is low, the counter is asynchronously cleared to its maximum count (9910 for the
CD40102BMS and 25510 for the CD40103BMS) regardless
of the state of any other input. The precedence relationship
between control inputs is indicated in the truth table.
Applications
• Divide-By- “N” Counters
• Programmable Times
• Interrupt Timers
• Cycle/Program Counter
If all control inputs except CI/CE are high at the time of zero
count, the counters will jump to the maximum count, giving a
counting sequence of 100 or 256 clock pulses long.
Pinout
This causes the CO/ZD output to go low to enable the clock
on each succeeding clock pulse.
CD40102BMS, CD40130BMS
TOP VIEW
CLOCK
1
CLEAR
2
CARRY IN/
COUNTER ENABLE
J0
3
4
16 VDD
SYNCHRONOUS
15
PRESET ENABLE
14 CARRY OUT/
ZERO DETECT
13 J7
J1
5
12 J6
J2
6
11 J5
J3
7
10 J4
VSS
8
The CD40102BMS and CD40103BMS may be cascaded
using the CI/CE input and the CO/ZD output, in either a synchronous or ripple mode as shown in Figures 16 and 17.
The CD40102MS and CD40103BMS are supplied in these
16-lead outline packages:
Braze Seal DIP
Frit Seal DIP
Ceramic Flatpack
*CD40102B Only
*H4W †H4X
*H1L
†H1F
H6W
†CD40130B Only
9 ASYNCHRONOUS
PRESET ENABLE
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
7-1294
File Number
3351
Specifications CD40102BMS, CD40103BMS
Absolute Maximum Ratings
Reliability Information
DC Supply Voltage Range, (VDD) . . . . . . . . . . . . . . . -0.5V to +20V
(Voltage Referenced to VSS Terminals)
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VDD +0.5V
DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA
Operating Temperature Range . . . . . . . . . . . . . . . . -55oC to +125oC
Package Types D, F, K, H
Storage Temperature Range (TSTG) . . . . . . . . . . . -65oC to +150oC
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . +265oC
At Distance 1/16 ± 1/32 Inch (1.59mm ± 0.79mm) from case for
10s Maximum
Thermal Resistance
θja
θjc
Ceramic DIP Package . . . . . . . . . . . . . 80oC/W
20oC/W
Flatpack Package . . . . . . . . . . . . . . . . 70oC/W
20oC/W
Maximum Package Power Dissipation (PD) at +125oC
For TA = -55oC to +100oC (Package Type D, F, K) . . . . . . 500mW
For TA = +100oC to +125oC (Package Type D, F, K). . . . . . Derate
Linearity at 12mW/oC to 200mW
Device Dissipation per Output Transistor . . . . . . . . . . . . . . . 100mW
For TA = Full Package Temperature Range (All Package Types)
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
Supply Current
SYMBOL
IDD
CONDITIONS (NOTE 1)
VDD = 20V, VIN = VDD or GND
VDD = 18V, VIN = VDD or GND
Input Leakage Current
IIL
VIN = VDD or GND
VDD = 20V
VDD = 18V
Input Leakage Current
IIH
VIN = VDD or GND
VDD = 20V
VDD = 18V
Output Voltage
Output Voltage
VOL15
VOH15
VDD = 15V, No Load
VDD = 15V, No Load (Note 3)
LIMITS
GROUP A
SUBGROUPS
TEMPERATURE
MIN
MAX
UNITS
1
+25oC
-
10
µA
2
+125oC
-
1000
µA
3
-55oC
-
10
µA
1
+25oC
-100
-
nA
2
+125oC
-1000
-
nA
3
-55oC
-100
-
nA
1
+25oC
-
100
nA
2
+125oC
-
1000
nA
3
-55oC
-
100
nA
1, 2, 3
+25oC,
+125oC,
-55oC
-
50
mV
1, 2, 3
+25oC,
+125oC,
-55oC
14.95
-
V
Output Current (Sink)
IOL5
VDD = 5V, VOUT = 0.4V
1
+25oC
0.53
-
mA
Output Current (Sink)
IOL10
VDD = 10V, VOUT = 0.5V
1
+25oC
1.4
-
mA
1
+25oC
3.5
-
mA
1
+25oC
-
-0.53
mA
Output Current (Sink)
Output Current (Source)
IOL15
IOH5A
VDD = 15V, VOUT = 1.5V
VDD = 5V, VOUT = 4.6V
Output Current (Source)
IOH5B
VDD = 5V, VOUT = 2.5V
1
+25oC
-
-1.8
mA
Output Current (Source)
IOH10
VDD = 10V, VOUT = 9.5V
1
+25oC
-
-1.4
mA
1
+25oC
-
-3.5
mA
1
+25oC
-2.8
-0.7
V
VSS = 0V, IDD = 10µA
1
+25oC
0.7
2.8
V
VDD = 2.8V, VIN = VDD or GND
7
+25oC
VDD = 20V, VIN = VDD or GND
7
+25oC
VDD = 18V, VIN = VDD or GND
8A
+125oC
VDD = 3V, VIN = VDD or GND
8B
-55oC
Output Current (Source)
N Threshold Voltage
P Threshold Voltage
Functional
IOH15
VNTH
VPTH
F
VDD = 15V, VOUT = 13.5V
VDD = 10V, ISS = -10µA
VOH > VOL <
VDD/2 VDD/2
V
Input Voltage Low
(Note 2)
VIL
VDD = 5V, VOH > 4.5V, VOL < 0.5V
1, 2, 3
+25oC, +125oC, -55oC
-
1.5
V
Input Voltage High
(Note 2)
VIH
VDD = 5V, VOH > 4.5V, VOL < 0.5V
1, 2, 3
+25oC, +125oC, -55oC
3.5
-
V
Input Voltage Low
(Note 2)
VIL
VDD = 15V, VOH > 13.5V,
VOL < 1.5V
1, 2, 3
+25oC, +125oC, -55oC
-
4
V
Input Voltage High
(Note 2)
VIH
VDD = 15V, VOH > 13.5V,
VOL < 1.5V
1, 2, 3
+25oC, +125oC, -55oC
11
-
V
NOTES: 1. All voltages referenced to device GND, 100% testing being
implemented.
2. Go/No Go test with limits applied to inputs.
7-1295
3. For accuracy, voltage is measured differentially to VDD. Limit
is 0.050V max.
Specifications CD40102BMS, CD40103BMS
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
Propagation Delay
Clock to Output
SYMBOL
TPHL1
TPLH1
CONDITIONS (NOTE 1, 2)
VDD = 5V, VIN = VDD or GND
TPHL2
TPLH2
VDD = 5V, VIN = VDD or GND
Propagation Delay
Asynchronous Preset
Enable to Output
TPHL3
TPLH3
VDD = 5V, VIN = VDD or GND
Propagation Delay
Clear to Output
TPLH4
VDD = 5V, VIN = VDD or GND
Maximum Clock Input
Frequency
9
10, 11
Propagation Delay
Carry In/Counter Enable
to Output
Transition Time
GROUP A
SUBGROUPS TEMPERATURE
9
10, 11
VDD = 5V, VIN = VDD or GND
FCL
VDD = 5V, VIN = VDD or GND
+125oC,
-55oC
+25oC
+125oC,
-55oC
MIN
MAX
UNITS
-
600
ns
-
810
ns
-
400
ns
-
540
ns
9
+25oC
-
1300
ns
10, 11
+125oC, -55oC
-
1755
ns
9
+25oC
-
750
ns
-
1012
ns
-
200
ns
10, 11
TTHL
TTLH
+25oC
LIMITS
9
10, 11
+125oC,
-55oC
+25oC
+125oC,
-55oC
-
270
ns
9
+25oC
.7
-
MHz
10, 11
+125oC, -55oC
.52
-
MHz
NOTES:
1. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
2. -55oC and +125oC limits guaranteed, 100% testing being implemented.
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
LIMITS
PARAMETER
Supply Current
SYMBOL
CONDITIONS
NOTES
TEMPERATURE
MIN
MAX
UNITS
IDD
VDD = 5V, VIN = VDD or GND
1, 2
-55oC, +25oC
-
5
µA
+125oC
-
150
µA
µA
VDD = 10V, VIN = VDD or GND
VDD = 15V, VIN = VDD or GND
Output Voltage
VOL
VDD = 5V, No Load
1, 2
1, 2
1, 2
-55oC,
+25oC
-
10
+125oC
-
300
µA
-55oC, +25oC
-
10
µA
+125oC
-
600
µA
+25oC, +125oC,
-
50
mV
-55oC
Output Voltage
VOL
VDD = 10V, No Load
1, 2
+25oC, +125oC,
-55oC
-
50
mV
Output Voltage
VOH
VDD = 5V, No Load
1, 2
+25oC, +125oC,
-55oC
4.95
-
V
Output Voltage
VOH
VDD = 10V, No Load
1, 2
+25oC, +125oC,
-55oC
9.95
-
V
Output Current (Sink)
IOL5
VDD = 5V, VOUT = 0.4V
1, 2
+125oC
0.36
-
mA
-55oC
0.64
-
mA
+125oC
0.9
-
mA
-55oC
1.6
-
mA
+125oC
2.4
-
mA
-55oC
4.2
-
mA
+125oC
-
-0.36
mA
-55oC
-
-0.64
mA
+125oC
-
-1.15
mA
-55oC
-
-2.0
mA
Output Current (Sink)
Output Current (Sink)
Output Current (Source)
Output Current (Source)
IOL10
IOL15
IOH5A
IOH5B
VDD = 10V, VOUT = 0.5V
VDD = 15V, VOUT = 1.5V
VDD = 5V, VOUT = 4.6V
1, 2
1, 2
1, 2
VDD = 5V, VOUT = 2.5V
1, 2
7-1296
Specifications CD40102BMS, CD40103BMS
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
LIMITS
PARAMETER
SYMBOL
Output Current (Source)
IOH10
Output Current (Source)
IOH15
CONDITIONS
VDD = 10V, VOUT = 9.5V
VDD =15V, VOUT = 13.5V
NOTES
TEMPERATURE
MIN
MAX
UNITS
1, 2
+125oC
-
-0.9
mA
-55oC
-
-1.6
mA
+125oC
-
-2.4
mA
-55oC
1, 2
-
-4.2
mA
Input Voltage Low
VIL
VDD = 10V, VOH > 9V, VOL < 1V
1, 2
+25oC, +125oC,
-55oC
-
3
V
Input Voltage High
VIH
VDD = 10V, VOH > 9V, VOL < 1V
1, 2
+25oC, +125oC,
-55oC
7
-
V
Propagation Delay
Clock to Output
TPHL1
TPLH1
VDD = 10V
1, 2, 3
+25oC
-
260
ns
VDD = 15V
1, 2, 3
+25 C
-
190
ns
Propagation Delay
Carry In/Counter Enable
to Output
TPHL2
TPLH2
VDD = 10V
1, 2, 3
+25oC
-
180
ns
VDD = 15V
1, 2, 3
+25 C
-
130
ns
Propagation Delay
Asynchronous Preset Enable to Output
TPHL3
TPLH3
VDD = 10V
1, 2, 3
+25oC
-
600
ns
VDD = 15V
1, 2, 3
+25oC
-
400
ns
Propagation Delay
Clear to Output
TPLH4
VDD = 10V
1, 2, 3
+25oC
-
360
ns
VDD = 15V
1, 2, 3
+25oC
-
200
ns
Transition Time
TTHL1
TTLH1
VDD = 10V
1, 2, 3
+25oC
-
100
ns
1, 2, 3
+25oC
-
80
ns
1, 2
+25oC
1.8
-
MHz
VDD = 15V
1, 2
+25oC
2.4
-
MHz
VDD = 5V
1, 2, 3
+25oC
-
280
ns
1, 2, 3
+25oC
-
140
ns
1, 2, 3
+25oC
-
100
ns
VDD = 5V
1, 2, 3
+25oC
-
500
ns
VDD = 10V
1, 2, 3
+25oC
-
250
ns
1, 2, 3
+25oC
-
150
ns
1, 2, 3
+25oC
-
300
ns
VDD = 10V
1, 2, 3
+25oC
-
180
ns
VDD = 15V
1, 2, 3
+25oC
-
80
ns
1, 2, 3
+25oC
-
360
ns
1, 2, 3
+25oC
-
160
ns
VDD = 15V
1, 2, 3
+25oC
-
120
ns
VDD = 5V
1, 2, 3
+25oC
-
200
ns
1, 2, 3
+25oC
-
80
ns
1, 2, 3
+25oC
-
60
ns
VDD = 5V
1, 2, 3
+25oC
-
220
ns
VDD = 10V
1, 2, 3
+25oC
-
100
ns
1, 2, 3
+25oC
-
70
ns
1, 2, 3
+25oC
-
320
ns
VDD = 10V
1, 2, 3
+25oC
-
160
ns
VDD = 15V
1, 2, 3
+25oC
-
100
ns
Maximum Clock Input
Frequency
FCL
Minimum SPE Setup
Time
TSU
VDD = 15V
VDD = 10V
VDD = 10V
VDD = 15V
Minimum CI/CE Setup
Time
TSU
VDD = 15V
Minimum Clock Pulse
Width
Minimum APE Pulse
Width
Minimum JAM Setup
Time (Synchronous Presetting)
TW
TW
VDD = 5V
VDD = 5V
VDD = 10V
TSU
VDD = 10V
VDD = 15V
Minimum APE Removal
Time
TREM
VDD = 15V
Minimum CLR Pulse
Width
TW
VDD = 5V
7-1297
o
o
Specifications CD40102BMS, CD40103BMS
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
LIMITS
PARAMETER
SYMBOL
Input Capacitance
CIN
CONDITIONS
Any Input
NOTES
TEMPERATURE
MIN
MAX
UNITS
1, 2
+25oC
-
7.5
pF
NOTES:
1. All voltages referenced to device GND.
2. The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized
on initial design release and upon design changes which would affect these characteristics.
3. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS
LIMITS
PARAMETER
SYMBOL
CONDITIONS
NOTES
TEMPERATURE
MIN
MAX
UNITS
IDD
VDD = 20V, VIN = VDD or GND
1, 4
+25oC
-
25
µA
1, 4
+25oC
-2.8
-0.2
V
VDD = 10V, ISS = -10µA
1, 4
+25oC
-
±1
V
VSS = 0V, IDD = 10µA
1, 4
+25oC
0.2
2.8
V
1, 4
+25oC
-
±1
V
1
+25oC
VOH >
VDD/2
VOL <
VDD/2
V
1, 2, 3, 4
+25oC
-
1.35 x
+25oC
Limit
ns
Supply Current
N Threshold Voltage
VNTH
N Threshold Voltage
Delta
∆VTN
P Threshold Voltage
VTP
P Threshold Voltage
Delta
∆VTP
Functional
F
VDD = 10V, ISS = -10µA
VSS = 0V, IDD = 10µA
VDD = 18V, VIN = VDD or GND
VDD = 3V, VIN = VDD or GND
Propagation Delay Time
TPHL
TPLH
VDD = 5V
3. See Table 2 for +25oC limit.
NOTES: 1. All voltages referenced to device GND.
2. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
4. Read and Record
TABLE 5. BURN-IN AND LIFE TEST DELTA PARAMETERS +25oC
PARAMETER
SYMBOL
DELTA LIMIT
Supply Current - MSI-2
IDD
± 1.0µA
Output Current (Sink)
IOL5
± 20% x Pre-Test Reading
IOH5A
± 20% x Pre-Test Reading
Output Current (Source)
TABLE 6. APPLICABLE SUBGROUPS
MIL-STD-883
METHOD
GROUP A SUBGROUPS
Initial Test (Pre Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
Interim Test 1 (Post Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
Interim Test 2 (Post Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
100% 5004
1, 7, 9, Deltas
CONFORMANCE GROUP
PDA (Note 1)
Interim Test 3 (Post Burn-In)
100% 5004
1, 7, 9
100% 5004
1, 7, 9, Deltas
100% 5004
2, 3, 8A, 8B, 10, 11
Sample 5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11
Subgroup B-5
Sample 5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas
Subgroup B-6
Sample 5005
1, 7, 9
PDA (Note 1)
Final Test
Group A
Group B
7-1298
READ AND RECORD
IDD, IOL5, IOH5A
Subgroups 1, 2, 3, 9, 10, 11
Specifications CD40102BMS, CD40103BMS
TABLE 6. APPLICABLE SUBGROUPS (Continued)
CONFORMANCE GROUP
Group D
MIL-STD-883
METHOD
GROUP A SUBGROUPS
Sample 5005
1, 2, 3, 8A, 8B, 9
READ AND RECORD
Subgroups 1, 2 3
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE GROUPS
Group E Subgroup 2
TEST
READ AND RECORD
MIL-STD-883
METHOD
PRE-IRRAD
POST-IRRAD
PRE-IRRAD
POST-IRRAD
5005
1, 7, 9
Table 4
1, 9
Table 4
TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS
OSCILLATOR
FUNCTION
OPEN
GROUND
VDD
9V ± -0.5V
50kHz
25kHz
14
1, 4, 6, 11, 13
5, 7, 9, 10, 12
PART NUMBER CD40102BMS, CD40103BMS
Static Burn-In 1
Note 1
14
1 - 13, 15
16
Static Burn-In 2
Note 1
14
8
1 - 7, 9 - 13, 15, 16
Dynamic BurnIn Note 1
-
3, 8, 15
2, 16
Irradiation
Note 2
-
NOTES:
1. Each pin except VDD and GND will have a series resistor of 10K ± 5%, VDD = 18V ± 0.5V
2. Each pin except VDD and GND will have a series resistor of 47K ± 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,
VDD = 10V ± 0.5V
Functional Diagram
SPE
APE
CI/CE
CLR
JAM
J0
8 - STAGE
DOWN
COUNTER
J7
C0/ZD
CLOCK
CD40102BMS, CD40103BMS
7-1299
CD40102BMS, CD40103BMS
Logic Diagrams
LSD
J0
*
J1
*
4
J2
*
5
J3
*
6
(MSB)
7
A
B
TO
FF1 - FF7
CLR
CLR
*
SPE
FF3
SPE
15
CL
9
Q
J
Q
FF1
FF2
CI
CI
Q
CL
CI
CLOCK
*
J
Q
J
Q
APE
APE
*
J
CLR
2
SPE
*
C
FF3
CI Q
1
TO
FF1 - FF7
D
CI/CE
*
E
3
MSD
J4
*
J5
*
10
11
J6
*
12
J7
*
13
(MSB)
A
B
C
14
CARRY OUT/
ZERO DETECT
J
J
FF4
FF5
FF6
FF7
CI
CI
CI
Q
CI
Q
J
Q
J
VDD
Q
VSS
D
*ALL INPUTS ARE
PROTECTED BY COS/MOS
PROTECTION NETWORK
E
FIGURE 1. LOGIC DIAGRAM FOR CD40102BMS
7-1300
CD40102BMS, CD40103BMS
Logic Diagrams
(Continued)
J0
*
J1
*
4
J2
*
5
J3
*
6
7
A
B
TO
FF1 - FF7
CLR
CLR
*
SPE
FF3
SPE
15
J
FF1
CL
9
Q
CL
J
FF2
Q
CI
CLOCK
*
J
Q
Q
APE
APE
*
J
CLR
2
SPE
*
C
CI
FF3
Q
CI
CI
Q
1
VDD
TO
FF1 - FF7
D
CI/CE
*
E
3
J4
*
J5
*
10
11
J6
*
12
J7
*
13
(MSB)
A
B
C
14
CARRY OUT/
ZERO DETECT
J
J
J
J
FF4
FF5
FF6
FF7
Q
Q
CI
CI
Q
VDD
CI
Q
CI
VSS
D
*ALL INPUTS ARE
VDD
E
FIGURE 2. LOGIC DIAGRAM FOR CD40103BMS
7-1301
PROTECTED BY COS/MOS
PROTECTION NETWORK
CD40102BMS, CD40103BMS
TRUTH TABLE
CONTROL INPUTS
CLR
APE
SPE
CI/CE
1
1
1
1
PRESET MODE
1
1
1
0
Count Down*
1
1
0
X
Preset on next positive clock transition
1
0
X
X
0
X
X
X
Synchronous
ACTION
Inhibit Counter
Asynchronous
Preset Asynchronously
Clear to maximum count
NOTES:
1. 0 = Low Level
1 = High Level
X = Don’t Care
4. JAM inputs: CD40102BMS;
MSD = J7, J6, J5, J4, (J7 is MSB)
LSD = J3, J2, J1, J0 (J3 is MSB)
CD40103BMS Binary;
MBS = J7, LSB = J0
2. Clock connected to clock input
3. Synchronous operation: changes occur on negative-to-positive clock transitions
*At zero count, the counters will jump to the maximum count on the next clock transition to “High”
30
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
25
20
15
10V
10
5
5V
0
5
10
15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
AMBIENT TEMPERATURE (TA) = +25oC
15.0
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
12.5
10.0
10V
7.5
5.0
2.5
5V
0
5
10
15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
FIGURE 3. TYPICAL OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
FIGURE 4. MINIMUM OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
-15
-10
-5
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
-15
-10
-5
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
0
-5
-10
-15
-10V
-20
-25
-15V
-30
FIGURE 5. TYPICAL OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
AMBIENT TEMPERATURE (TA) = +25oC
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
AMBIENT TEMPERATURE (TA) = +25oC
0
0
0
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
-5
-10V
-15V
-10
-15
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
AMBIENT TEMPERATURE (TA) = +25oC
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
Typical Performance Characteristics
FIGURE 6. MINIMUM OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
7-1302
CD40102BMS, CD40103BMS
(Continued)
PROPAGATION DELAY TIME (tPHL, tPLH) (ns)
Typical Performance Characteristics
TRANSITION TIME (tTHL, tTLH) (ns)
AMBIENT TEMPERATURE (TA) = +25oC
200
150
SUPPLY VOLTAGE (VDD) = 5V
100
10V
15V
50
0
0
20
300
SUPPLY VOLTAGE (VDD) = 5V
200
10V
100
15V
0
40
60
80
100
LOAD CAPACITANCE (CL) (pF)
20
10
AMBIENT TEMPERATURE (TA) = 25oC
LOAD CAPACITANCE (CL) = 50pF
7.5
5
2.5
30
40
50
60
70
80
LOAD CAPACITANCE (CL) (pF)
90
100
FIGURE 8. TYPICAL PROPAGATION DELAY TIME AS A FUNCTION OF LOAD CAPACITANCE (CLOCK TO CO/ZD)
POWER DISSIPATION /PACKAGE (PD) (µW)
FIGURE 7. TYPICAL TRANSITION TIME AS A FUNCTION OF
LOAD CAPACITANCE
MAXIMUM CLOCK INPUT FREQUENCY (fCL MAX) (MHz)
AMBIENT TEMPERATURE (TA) = +25oC
105
8
6
4
AMBIENT TEMPERATURE (TA) = +25oC
tr, tf = 20ns
RL = 200kΩ
2
104
8
6
4
103
SUPPLY VOLTAGE (VDD) = 15V
2
8
6
4
10V
10V
2
102
5V
8
6
4
CL = 50pF
2
CL = 15pF
10
0
5
10
15
2
20
1
SUPPLY VOLTAGE (VDD) (V)
FIGURE 9. TYPICAL MAXIMUM CLOCK INPUT FREQUENCY
AS A FUNCTION OF SUPPLY VOLTAGE
4 68
2
4 6 8
2
4 6 8
103
10
102
INPUT FREQUENCY (fI) (kHz)
2
4 6 8
104
FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A
FUNCTION OF FREQUENCY
7-1303
CD40102BMS, CD40103BMS
Q
CI
CI
CI
D
S Q
TO GATING
Q
CL
CL
CL
CL
TO GATING
Q
R
SPE
SPE
J
CLR
APE
CLR
FIGURE 11. DETAIL LOGIC DIAGRAM FOR FLIP-FLOPS, FF0 - FF7, USED IN
LOGIC DIAGRAMS FOR CD40102BMS AND CD40103BMS
CLK
CLR
CI/CE
SPE
APE
J0
J1
J2
J3
J4
J5
J6
J7
CO/ZD
CD40102BMS COUNT
99
98
3
2
1
0
99
98
98
97
8
7
6
5
4
99
98
97
96
CD40103BMS COUNT
255
254
3
2
1
0
255
254
254
253
8
7
6
5
4
255
254
253
252
FIGURE 12. TIMING DIAGRAM FOR CD40102BMS AND CD40103BMS
7-1304
CD40102BMS, CD40103BMS
VDD
VDD
fOUT =
fIN ÷ (N + 1)
CO/ZD
J0
J1
TIME-OUT
CO/ZD
J0
J1
J2
CI/CE
J3
SPE
N
J2
CI/CE
J3
SPE
COUNT DOWN
N
J4
APE
J4
APE
J5
CLR
J5
CLR
J6
PRESET
J6
J7
CLOCK
J7
fIN
CLOCK
VSS
fIN
VSS
FIGURE 13. DIVIDE-BY- “N” COUNTER
FIGURE 14. PROGRAMMABLE TIMER
VDD
TO
MICROPROCESSOR
INTERRUPT LINE
CO/ZD
J0
J1
FROM
MICROPROCESSOR
DATA BUS
J2
CI/CE
J3
SPE
J4
APE
J5
CLR
J6
J7
EXT
OSC
CLOCK
PRESET TIMER
(I/O COMMAND)
VSS
FIGURE 15. MICROPROCESSOR INTERRUPT TIMER
CD4071BMS*
CLOCK
ENABLE
CI/CE
CO/ZD
CLOCK
CI/CE
CO/ZD
CLOCK
CI/CE
CO/ZD
CLOCK
CASCADED
OUTPUT
INPUT
CLOCK
*An output spike (160ns at VDD = 5V) occurs whenever two or more devices are cascaded in the
parallel-clocked mode because the clock-to-carry out delay is greater than the carry-in-to-carry
out delay. This spike is eliminated by gating the output of the last device with the clock as shown.
FIGURE 16. SYNCHRONOUS CASCADING
CLOCK
ENABLE
CI/CE
CI/CE
CO/ZD
CLOCK
CO/ZD
CLOCK
CI/CE
INPUT
CLOCK
VSS
VSS
FIGURE 17. RIPPLE CASCADING
7-1305
CO/ZD
CLOCK
CASCADED
OUTPUT
CD40102BMS, CD40103BMS
Chip Dimensions and Pad Layouts
CD40102BMS
CD40103BMS
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
METALLIZATION:
PASSIVATION:
Thickness: 11kÅ − 14kÅ,
AL.
10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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