[ /Title (CD74 HC393 , CD74 HCT39 3) /Subject (High Speed CMOS CD54HC393, CD74HC393, CD54HCT393, CD74HCT393 Data sheet acquired from Harris Semiconductor SCHS186E High-Speed CMOS Logic Dual 4-Stage Binary Counter September 1997 - Revised August 2003 Features Description • Fully Static Operation The ’HC393 and ’HCT393 are 4-stage ripple-carry binary counters. All counter stages are master-slave flip-flops. The state of the stage advances one count on the negative transition of each clock pulse; a high voltage level on the MR line resets all counters to their zero state. All inputs and outputs are buffered. • Buffered Inputs • Common Reset • Negative-Edge Clocking • Fanout (Over Temperature Range) Ordering Information - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads PART NUMBER • Wide Operating Temperature Range . . . -55oC to 125oC TEMP. RANGE (oC) PACKAGE • Balanced Propagation Delay and Transition Times CD54HC393F3A -55 to 125 14 Ld CERDIP • Significant Power Reduction Compared to LSTTL Logic ICs CD54HCT393F3A -55 to 125 14 Ld CERDIP CD74HC393E -55 to 125 14 Ld PDIP CD74HC393M -55 to 125 14 Ld SOIC CD74HC393MT -55 to 125 14 Ld SOIC CD74HC393M96 -55 to 125 14 Ld SOIC CD74HCT393E -55 to 125 14 Ld PDIP CD74HCT393M -55 to 125 14 Ld SOIC CD74HCT393MT -55 to 125 14 Ld SOIC CD74HCT393M96 -55 to 125 14 Ld SOIC • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. Pinout CD54HC393, CD54HCT393 (CERDIP) CD74HC393, CD74HCT393 (PDIP, SOIC) TOP VIEW 1CP 1 14 VCC 1MR 2 13 2CP 1Q0 3 12 2MR 1Q1 4 11 2Q0 1Q2 5 10 2Q1 1Q3 6 9 2Q2 GND 7 8 2Q3 CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54HC393, CD74HC393, CD54HCT393, CD74HCT393 Functional Diagram 3 1Q0 1 1CP 2 1MR 4 BINARY COUNTER 1Q1 5 1Q2 6 1Q3 11 13 2CP 12 2MR 2Q0 10 BINARY COUNTER 2Q1 9 2Q2 8 2Q3 GND = 7 VCC = 14 TRUTH TABLE OUTPUTS CP COUNT Q0 Q1 Q2 Q3 0 L L L L 1 H L L L 2 L H L L 3 H H L L 4 L L H L 5 H L H L 6 L H H L 7 H H H L 8 L L L H 9 H L L H 10 L H L H 11 H H L H 12 L L H H 13 H L H H 14 L H H H 15 H H H H CP COUNT MR OUTPUT ↑ L No Change ↓ L Count X H LLLL H = High Voltage Level, L = Low Voltage Level, X = Don’t Care, ↑ = Transition from Low to High Level, ↓ = Transition from High to Low. 2 CD54HC393, CD74HC393, CD54HCT393, CD74HCT393 Logic Diagram Φ 1(13) CP Φ Q Φ Q Φ R Q Φ Q Φ R Q Φ Q Φ R Q Q R 2(12) MR 3(11) 4(10) Q1 Q0 3 5(9) Q2 6(8) Q3 CD54HC393, CD74HC393, CD54HCT393, CD74HCT393 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1) θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 80 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 86 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) VIH - - 2 1.5 - - 1.5 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V MIN TYP MAX MIN MAX MIN MAX UNITS - 1.5 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 4 CD54HC393, CD74HC393, CD54HCT393, CD74HCT393 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) IO (mA) High Level Input Voltage VIH - - Low Level Input Voltage VIL - High Level Output Voltage CMOS Loads VOH VIH or VIL PARAMETER VCC (V) 25oC -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 to 5.5 2 - - 2 - 2 - V - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC and GND 0 5.5 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC (Note 2) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS nCP 0.4 nMR 1 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g., 360µA max at 25oC. Prerequisite for Switching Specifications 25oC PARAMETER -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS fMAX 2 6 - - 5 - 4 - MHz 4.5 30 - - 24 - 20 - MHz 6 35 - - 28 - 24 - MHz 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns HC TYPES Maximum Clock Frequency Clock Pulse Width tW 5 CD54HC393, CD74HC393, CD54HCT393, CD74HCT393 Prerequisite for Switching Specifications (Continued) 25oC PARAMETER Reset Recovery Time Reset Pulse Width -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tREC 2 5 - - 5 - 5 - ns 4.5 5 - - 5 - 5 - ns 6 5 - - 5 - 5 - ns 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns fMAX 4.5 27 - - 22 - 18 - MHz tW 4.5 19 - - 24 - 29 - ns tREC 4.5 5 - - 5 - 5 - ns tW 4.5 16 - - 20 - 24 - ns tW HCT TYPES Maximum Clock Frequency Clock Pulse Width Reset Recovery Time Reset Pulse Width Switching Specifications Input tr, tf = 6ns PARAMETER HC TYPES Propagation Delay Time (Figure 1) TEST SYMBOL CONDITIONS tPLH, tPHL nCP to nQ2 nCP to nQ3 MR to Qn Output Transition Time (Figure 1) tPLH, tPHL tPLH, tPHL tPLH, tPHL -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 150 - 190 - 225 ns 4.5 - - 30 - 38 - 59 ns CL =15pF 5 - 12 - - - - - ns CL = 50pF 6 - - 26 - 33 - 50 ns CL = 50pF 2 - - 190 - 245 - 295 ns 4.5 - - 38 - 49 - 59 ns 6 - - 33 - 42 - 50 ns 2 - - 240 - 300 - 360 ns 4.5 - - 48 - 60 - 72 ns 6 - - 41 - 51 - 61 ns 2 - - 285 - 355 - 430 ns CL = 50pF nCP to nQ0 nCP to nQ1 25oC VCC (V) CL = 50pF CL = 50pF - 57 - 71 - 86 ns 6 - - 48 - 60 - 73 ns 2 - - 135 - 170 - 205 ns 4.5 - - 27 - 34 - 41 ns CL =15pF 5 - 11 - - - - - ns CL = 50pF 6 - - 23 - 29 - 35 ns tTLH, tTHL CL = 50pF 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns tPLH, tPHL 4.5 CL = 50pF 6 - - 13 - 16 - 19 ns Input Capacitance CIN CL = 50pF - - - 10 - 10 - 10 pF Power Dissipation Capacitance (Notes 3, 4) CPD CL =15pF 5 - 20 - - - - - pF 6 CD54HC393, CD74HC393, CD54HCT393, CD74HCT393 Switching Specifications Input tr, tf = 6ns (Continued) TEST SYMBOL CONDITIONS PARAMETER HCT TYPES Propagation Delay Time (Figure 1) tPLH, tPHL nCP to nQ0 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS CL = 50pF 4.5 - - 32 - 40 - 48 ns CL =15pF 5 - 13 - - - - - ns nCP to nQ1 tPLH, tPHL CL = 50pF 4.5 - - 44 - 55 - 66 ns nCP to nQ2 tPLH, tPHL CL = 50pF 4.5 - - 50 - 63 - 75 ns nCP to nQ3 tPLH, tPHL CL = 50pF 4.5 - - 62 - 78 - 93 ns MR to Qn tPLH, tPHL CL = 50pF 4.5 - - 32 - 40 - 48 ns CL =15pF 5 - 13 - - - - - ns 4.5 - - 15 - 19 - 22 ns Output Transition tTLH, tTHL CL = 50pF Input Capacitance CIN CL =15pF - - - 10 - 10 - 10 pF Power Dissipation Capacitance (Notes 3, 4) CPD CL =15pF 5 - 21 - - - - - pF NOTES: 3. CPD is used to determine the dynamic power consumption, per stage. 4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms tr = 6ns tf = 6ns VCC 90% 50% 10% INPUT GND tTLH GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL tPHL tf = 6ns tr = 6ns tTLH 90% 1.3V 10% INVERTING OUTPUT tPHL tPLH FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 7 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-8989001CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type CD54HC393F3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) CD54HCT393F ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type CD54HCT393F3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type CD74HC393E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC393EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC393M ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC393M96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC393M96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC393M96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC393ME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC393MG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC393MT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC393MTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC393MTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT393E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT393EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT393M ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT393M96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT393M96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT393M96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT393ME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT393MG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT393MT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT393MTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT393MTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC393M96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD74HCT393M96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC393M96 SOIC D 14 2500 346.0 346.0 33.0 CD74HCT393M96 SOIC D 14 2500 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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