[ /Title (CD74 HC402 4, CD74 HCT40 24) /Subject (High Speed CMOS CD54HC4024, CD74HC4024, CD54HCT4024, CD74HCT4024 Data sheet acquired from Harris Semiconductor SCHS202C High-Speed CMOS Logic 7-Stage Binary Ripple Counter November 1997 - Revised October 2003 Features Description • Fully Static Operation The ’HC4024 and ’HCT4024 are 7-stage ripple-carry binary counters. All counter stages are master-slave flip-flops. The state of the stage advances one count on the negative transition of each input pulse; a high voltage level on the MR line resets all counters to their zero state. All inputs and outputs are buffered. • Buffered Inputs • Common Reset • Negative Edge Clocking • Fanout (Over Temperature Range) Ordering Information - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads PART NUMBER • Wide Operating Temperature Range . . . -55oC to 125oC TEMP. RANGE (oC) PACKAGE • Balanced Propagation Delay and Transition Times CD54HC4024F3A -55 to 125 14 Ld CERDIP • Significant Power Reduction Compared to LSTTL Logic ICs CD54HCT4024F3A -55 to 125 14 Ld CERDIP CD74HC4024E -55 to 125 14 Ld PDIP CD74HC4024M -55 to 125 14 Ld SOIC CD74HC4024MT -55 to 125 14 Ld SOIC CD74HC4024M96 -55 to 125 14 Ld SOIC CD74HC4024PW -55 to 125 14 Ld TSSOP CD74HC4024PWR -55 to 125 14 Ld TSSOP CD74HC4024PWT -55 to 125 14 Ld TSSOP CD74HCT4024E -55 to 125 14 Ld PDIP CD74HCT4024M -55 to 125 14 Ld SOIC • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. Pinout CD54HC4024, CD54HCT4024 (CERDIP) CD74HC4024 (PDIP, SOIC, TSSOP) CD74HCT4024 (PDIP, SOIC) TOP VIEW CP 1 14 VCC MR 2 13 NC Q7 3 12 Q1’ Q6 4 11 Q2 Q5 5 10 NC Q4 6 9 Q3 GND 7 8 NC CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54HC4024, CD74HC4024, CD54HCT4024, CD74HCT4024 Functional Diagram 12 CP Q1’ 11 1 Q2 9 Q3 6 Q4 5 Q5 4 2 MR Q6 3 Q7 TRUTH TABLE CP COUNT MR OUTPUT STATE ↑ L No Change ↓ L Advance to Next State X H All Outputs Are Low H = High Voltage Level, L = Low Voltage Level, X = Don’t Care, ↑ = Transition from Low to High Level, ↓ = Transition from High to Low. Logic Diagram 1 CP Q CP CP Q CP Q CP Q CP Q CP Q CP Q 2 3 4 5 6 7 CP Q CP Q CP Q CP Q CP Q CP Q CP Q R R R R R R R 1 Q1 2 MR 7 GND 14 VCC 12 Q1’ 11 Q2 9 Q3 2 6 Q4 5 Q5 4 Q6 3 Q7 CD54HC4024, CD74HC4024, CD54HCT4024, CD74HCT4024 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1) θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 80 M (SOIC) Package . . . . . . . . . . . . . . . . . . . . . . . . 86 PW (TSSOP) Package. . . . . . . . . . . . . . . . . . . . . . 113 (Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) VIH - - 2 1.5 - - 1.5 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V MIN TYP MAX MIN MAX MIN MAX UNITS - 1.5 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 3 CD54HC4024, CD74HC4024, CD54HCT4024, CD74HCT4024 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) IO (mA) High Level Input Voltage VIH - - Low Level Input Voltage VIL - High Level Output Voltage CMOS Loads VOH VIH or VIL PARAMETER 25oC VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 to 5.5 2 - - 2 - 2 - V - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC and GND 0 5.5 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC (Note 2) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS CP, MR 0.5 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g., 360µA max at 25oC. Prerequisite for Switching Specifications 25oC PARAMETER SYMBOL VCC (V) MIN -40oC TO 85oC MAX MIN MAX -55oC TO 125oC MIN MAX UNITS HC TYPES Maximum Input Pulse Frequency Input Pulse Width Reset Removal Time fMAX tW tREM 2 6 - 5 - 4 - MHz 4.5 30 - 24 - 20 - MHz 6 35 - 29 - 24 - MHz 2 80 - 100 - 120 - ns 4.5 16 - 20 - 24 - ns 6 14 - 17 - 20 - ns 2 50 - 65 - 75 - ns 4.5 10 - 13 - 15 - ns 6 9 - 11 - 13 - ns 4 CD54HC4024, CD74HC4024, CD54HCT4024, CD74HCT4024 Prerequisite for Switching Specifications (Continued) 25oC PARAMETER Reset Pulse Width -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN MAX MIN MAX MIN MAX UNITS tW 2 80 - 100 - 120 - ns 4.5 16 - 20 - 24 - ns 6 14 - 17 - 20 - ns fMAX 4.5 25 - 20 - 16 - MHz tW 4.5 20 - 25 - 30 - ns tREC 4.5 10 - 13 - 15 - ns tW 4.5 20 - 25 - 30 - ns HCT TYPES Maximum Input Pulse Frequency Input Pulse Width Reset Recovery Time Reset Pulse Width Switching Specifications Input tr, tf = 6ns PARAMETER TEST SYMBOL CONDITIONS 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 140 - 175 - 210 ns 4.5 - - 28 - 35 - 42 ns CL =15pF 5 - 11 - - - - - ns CL = 50pF 6 - - 24 - 30 - 36 ns CL = 50pF 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns CL =15pF 5 - 6 - - - - - ns CL = 50pF 6 - - 13 - 13 - 19 ns CL = 50pF 2 - - 170 - 215 - 255 ns 4.5 - - 34 - 43 - 51 ns 5 - 14 - - - - - ns 6 - - 29 - 27 - 43 ns 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns HC TYPES Propagation Delay Time (Figure 1) tPLH, tPHL CL = 50pF CP to Q1’ Output Qn to Qn + 1 MR to Qn Output Transition Time (Figure 1) tPLH, tPHL tPLH, tPHL tTLH, tTHL CL = 50pF Input Capacitance CIN CL = 50pF - - - 10 - 10 - 10 pF Power Dissipation Capacitance (Notes 3, 4) CPD CL =15pF 5 - 30 - - - - - pF tPLH, tPHL CL = 50pF 4.5 - - 40 - 50 - 60 ns CL =15pF 5 - 17 - - - - - ns tPLH, tPHL CL = 50pF 4.5 - - 15 - 19 - 22 ns CL =15pF 5 - 6 - - - - - ns tPLH, tPHL CL = 50pF 4.5 - - 40 - 50 - 60 ns CL =15pF 5 - 17 - - - - - ns HCT TYPES Propagation Delay Time (Figure 2) CP to Q1’ Output Qn to Qn + 1 MR to Qn 5 CD54/74HC4024, CD54/74HCT4024 Switching Specifications Input tr, tf = 6ns PARAMETER Output Transition (Continued) 25oC -40oC TO 85oC -55oC TO 125oC TEST SYMBOL CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tTLH, tTHL CL = 50pF 4.5 - - 15 - 19 - 22 ns Input Capacitance CIN CL =15pF - - - 10 - 10 - 10 pF Power Dissipation Capacitance (Notes 3, 4) CPD CL =15pF 5 - 30 - - - - - pF NOTES: 3. CPD is used to determine the dynamic power consumption, per package. 4. PD = VCC2 fi + ∑ (CLVCC2 fi/M) where: M = 21, 22, 23, 24,25, 26, 27 fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms tfCL trCL CLOCK tWL + tWH = 90% 10% I fCL CLOCK 50% 50% 1.3V 0.3V tf = 6ns tr = 6ns VCC 90% 50% 10% GND tTLH 3V 2.7V 1.3V 0.3V INPUT GND tTHL 90% 50% 10% INVERTING OUTPUT tWH FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tf = 6ns tTHL GND NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tr = 6ns I fCL 1.3V 1.3V tWL tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tPHL 2.7V 0.3V GND tWL INPUT tfCL = 6ns 3V VCC 50% 10% tWL + tWH = trCL = 6ns tTLH 90% 1.3V 10% INVERTING OUTPUT tPHL tPLH FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 6 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) CD54HC4024F ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type CD54HC4024F3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type CD54HCT4024F3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type CD74HC4024E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC4024EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC4024M ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024M96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024M96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024M96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024ME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024MG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024MT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024MTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024MTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4024PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4024E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT4024EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT4024M ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74HCT4024ME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4024MG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC4024M96 D 14 SITE 41 330 16 6.5 9.0 2.1 8 16 Q1 CD74HC4024PWR PW 14 SITE 41 330 12 7.0 5.6 1.6 8 12 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 4-Oct-2007 Package Pins Site Length (mm) Width (mm) Height (mm) CD74HC4024M96 D 14 SITE 41 346.0 346.0 33.0 CD74HC4024PWR PW 14 SITE 41 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. 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