DIODES DMN6068LK3_10

A Product Line of
Diodes Incorporated
DMN6068LK3
60V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V(BR)DSS
Features and Benefits
ID
RDS(on)
TA = 25°C
68mΩ @ VGS= 10V
8.5A
60V
100mΩ @ VGS= 4.5V
7.0A
•
100% Unclamped Inductive Switch (UIS) test in production
•
Low on-resistance
•
Fast switching speed
•
“Green” component and RoHS compliant (Note 1)
•
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Description and Applications
This MOSFET has been designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
•
Case: TO252-3L
•
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0 (Note 1)
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Motor Control
•
Terminals Connections: See Diagram
•
Transformer Driving Switch
•
•
DC-DC Converters
Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
•
Power Management Functions
•
Weight: 0.33 grams (approximate)
•
Uninterrupted Power Supply
D
D
TO252-3L
G
D
G
TOP VIEW
Ordering Information
Product
DMN6068LK3-13
Note:
S
S
PIN OUT -TOP
Equivalent Circuit
(Note 1)
Marking
N6068L
Reel size (inches)
13
Tape width (mm)
16
Quantity per reel
2,500
1. Diodes, Inc. defines “Green” products as those which are RoHS compliant and contain no halogens or antimony compounds; further information
Diodes Inc.’s “Green” Policy can be found on our website. For packaging details, go to our website.
about
Marking Information
YYWW
N6068L
DMN6068LK3
Document Number DS32057 Rev 2 - 2
= Manufacturer’s Marking
N6068L = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 09 = 2009)
WW = Week (01-52)
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DMN6068LK3
Maximum Ratings
@TA = 25°C unless otherwise specified
Characteristic
Drain-Source voltage
Gate-Source voltage
Single Pulsed Avalanche Energy
Single Pulsed Avalanche Current
Continuous Drain current
VGS = 10V
Pulsed Drain current
VGS= 10V
Continuous Source current (Body diode)
Pulsed Source current (Body diode)
(Note 2)
(Note 8)
(Note 8)
(Note 4)
TA = 70°C (Note 4)
(Note 3)
(Note 5)
(Note 4)
(Note 5)
Symbol
VDSS
VGS
EAS
IAS
ID
IDM
IS
ISM
Value
60
±20
37.5
5.0
8.5
6.8
6.0
22.2
10.2
22.2
Unit
V
V
mJ
A
Value
4.12
33
8.49
67.9
2.12
16.9
30.3
14.7
59.0
3.09
-55 to 150
Unit
A
A
A
A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
(Note 3)
Power dissipation
Linear derating factor
(Note 4)
PD
(Note 6)
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
Operating and storage temperature range
Notes:
(Note 3)
(Note 4)
(Note 6)
(Note 7)
RθJA
RθJL
TJ, TSTG
W
mW/°C
°C/W
°C
2. AEC-Q101 VGS maximum is ±16V.
3. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
4. Same as note 2, except the device is measured at t ≤ 10 sec.
5. Same as note 2, except the device is pulsed with D = 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature.
6. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
7. Thermal resistance from junction to solder-point (at the end of the drain lead).
8. UIS in production with L = 3.0mH, IAS = 5.0A, RG = 25Ω, VDD = 50V, starting TJ = 25°C
DMN6068LK3
Document Number DS32057 Rev 2 - 2
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Thermal Characteristics
RDS(on)
10 Limited
1
DC
ID Drain Current (A)
ID Drain Current (A)
RDS(on)
1s
100ms
10ms
Tamb=25°C
100m
100µs
1
DC
1
1s
100ms
10ms
Tamb=25°C
100m
1ms
25mm x 25mm
1oz FR4
10 Limited
1ms
50mm x 50mm
2oz FR4
10
100µs
1
VDS Drain-Source Voltage (V)
10
VDS Drain-Source Voltage (V)
Safe Operating Area
Safe Operating Area
Tamb=25°C
50
25mm x 25mm
1oz FR4
40
D=0.5
30
20
D=0.1
D=0.2
D=0.05
10
Single Pulse
0
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Thermal Resistance (°C/W)
Thermal Resistance (°C/W)
35
60
Transient Thermal Impedance
T amb=25°C
30
50mm x 50mm
2oz FR4
25
20
D=0.5
15
D=0.1
D=0.2
10
D=0.05
5
Single Pulse
0
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Transient Thermal Impedance
100
50mm x 50mm
2oz FR4
10
25mm x 25mm
1oz FR4
1
100µ
1m
10m 100m
1
10
100
Pulse Width (s)
1k
Max Power Dissipation (W)
Max Power Dissipation (W)
4.5
Single Pulse
Tamb=25°C
4.0
50mm x 50mm
2oz FR4
3.5
3.0
25mm x 25mm
1oz FR4
2.5
2.0
1.5
1.0
0.5
0.0
0
Pulse Power Dissipation
DMN6068LK3
Document Number DS32057 Rev 2 - 2
20
40
60
80
100 120 140 160
Temperature (°C)
Derating Curve
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DMN6068LK3
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS
Symbol
Min
Typ
Max
Unit
Test Condition
Drain-Source Breakdown Voltage
BVDSS
60
⎯
⎯
V
ID = 250μA, VGS= 0V
Zero Gate Voltage Drain Current
IDSS
⎯
⎯
0.5
μA
VDS= 60V, VGS= 0V
Gate-Source Leakage
IGSS
⎯
⎯
±100
nA
VGS= ±20V, VDS= 0V
VGS(th)
1.0
⎯
3.0
V
ID= 250μA, VDS= VGS
ON CHARACTERISTICS
Gate Threshold Voltage
0.068
VGS= 10V, ID= 12A
Static Drain-Source On-Resistance (Note 9)
RDS (ON)
⎯
⎯
Forward Transconductance (Notes 9 & 10)
gfs
⎯
19.7
⎯
S
VDS= 15V, ID= 12A
Diode Forward Voltage (Note 9)
VSD
⎯
0.98
1.15
V
IS= 12A, VGS= 0V
Reverse recovery time (Note 10)
trr
145
⎯
ns
Reverse recovery charge (Note 10)
Qrr
⎯
929
⎯
nC
Input Capacitance
Ciss
⎯
502
⎯
pF
Output Capacitance
Coss
⎯
45.7
⎯
pF
Reverse Transfer Capacitance
Crss
⎯
27.1
⎯
pF
Total Gate Charge
Qg
⎯
5.55
⎯
nC
0.100
Ω
VGS= 4.5V, ID= 6A
IS= 12A, di/dt= 100A/μs
DYNAMIC CHARACTERISTICS (Note 10)
Total Gate Charge
Qg
⎯
10.3
⎯
nC
Gate-Source Charge
Qgs
⎯
1.6
⎯
nC
Gate-Drain Charge
Qgd
⎯
3.5
⎯
nC
tD(on)
⎯
3.6
⎯
ns
Turn-On Rise Time (Note 11)
tr
⎯
10.8
⎯
ns
Turn-Off Delay Time (Note 11)
tD(off)
⎯
11.9
⎯
ns
tf
⎯
8.7
⎯
ns
Turn-On Delay Time (Note 11)
Turn-Off Fall Time (Note 11)
Notes:
VDS= 30V, VGS= 0V
f= 1MHz
VGS= 4.5V
VGS= 10V
VDS= 30V
ID= 12A
VDD= 30V, VGS= 10V
ID= 12A, RG ≅ 6.0Ω
9. Measured under pulsed conditions. Pulse width ≤ 300μs; duty cycle ≤ 2%
10. For design aid only, not subject to production testing.
11. Switching characteristics are independent of operating junction temperatures.
DMN6068LK3
Document Number DS32057 Rev 2 - 2
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DMN6068LK3
Typical Characteristics
10V
T = 150°C
5V
4.5V
ID Drain Current (A)
ID Drain Current (A)
T = 25°C
10
4V
1
3.5V
VGS
0.1
3V
0.01
3.5V
1
2.5V
VGS
2V
1
10
0.1
T = 150°C
T = 25°C
0.01
1E-3
2
3
4
5
VGS Gate-Source Voltage (V)
Typical Transfer Characteristics
Normalised RDS(on) and VGS(th)
1
1
10
Output Characteristics
VDS = 10V
0.1
1
VDS Drain-Source Voltage (V)
Output Characteristics
2.0
VGS = 10V
1.8
ID = 12A
1.6
RDS(on)
1.4
1.2
1.0
0.8
VGS = VDS
0.6
ID = 250uA
0.4
-50
0
VGS(th)
50
100
150
Tj Junction Temperature (°C)
Normalised Curves v Temperature
100
3V
VGS
3.5V
10
4V
1
4.5V
5V
0.1
10V
T = 25°C
0.01
0.01
0.1
1
10
ID Drain Current (A)
On-Resistance v Drain Current
DMN6068LK3
Document Number DS32057 Rev 2 - 2
ISD Reverse Drain Current (A)
ID Drain Current (A)
3V
0.1
VDS Drain-Source Voltage (V)
RDS(on) Drain-Source On-Resistance (Ω)
4.5V
4V
10
0.01
0.1
10
10V
10
T = 150°C
1
T = 25°C
0.1
Vgs = 0V
0.01
0.2
0.4
0.6
0.8
1.0
VSD Source-Drain Voltage (V)
Source-Drain Diode Forward Voltage
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DMN6068LK3
Typical Characteristics - continued
600
VGS Gate-Source Voltage (V)
C Capacitance (pF)
10
VGS = 0V
f = 1MHz
CISS
400
COSS
CRSS
200
0
0.1
1
10
8
6
4
0
VDS - Drain - Source Voltage (V)
ID = 12A
0
2
4
6
8
10
Q - Charge (nC)
Capacitance v Drain-Source Voltage
Gate-Source Voltage v Gate Charge
40
20
Starting T J = 25°C
15
30
10
20
5
10
100µ
1m
EAS Avalanche Energy (mJ)
IAS Avalanche Current (A)
VDS = 30V
2
L Inductor (H)
Single-Pulsed Avalanche Rating
DMN6068LK3
Document Number DS32057 Rev 2 - 2
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DMN6068LK3
Test Circuits
Current
regulator
QG
50k
12V
VG
Q GS
Same as
D.U.T
Q GD
V DS
IG
D.U.T
ID
V GS
Charge
Basic gate charge waveform
Gate charge test circuit
V DS
90%
RD
V GS
V DS
RG
VDD
10%
V GS
td(on)
tr
t(on)
td(off)
tr
t(on)
Switching time waveforms
DMN6068LK3
Document Number DS32057 Rev 2 - 2
Switching time test circuit
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DMN6068LK3
Package Outline Dimensions
DIM
Inches
Millimeters
DIM
Inches
Min
Millimeters
Min
Max
Min
Max
Max
Min
A
0.086
0.094
2.18
2.39
e
A1
-
0.005
-
0.127
H
0.370
0.410
9.40
10.41
b
0.020
0.035
0.508
0.89
L
0.055
0.070
1.40
1.78
b2
0.030
0.045
0.762
1.14
L1
0.108 REF
2.74 REF
b3
0.205
0.215
5.21
5.46
L2
0.020 BSC
0.508 BSC
0.090 BSC
Max
2.29 BSC
c
0.018
0.024
0.457
0.61
L3
0.035
0.065
0.89
1.65
c2
0.018
0.023
0.457
0.584
L4
0.025
0.040
0.635
1.016
D
0.213
0.245
5.41
6.22
L5
0.045
0.060
1.14
1.52
D1
0.205
-
5.21
-
θ1°
0°
10°
0°
10°
E
0.250
0.265
6.35
6.73
θ°
0°
15°
0°
15°
E1
0.170
-
4.32
-
-
-
-
-
-
DMN6068LK3
Document Number DS32057 Rev 2 - 2
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DMN6068LK3
Suggested Pad Layout
6.2
0.244
3.0
0.118
5.8
0.228
1.6
0.063
2.58
0.101
6.17
0.243
mm
inches
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
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LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A.
B.
Life support devices or systems are devices or systems which:
1.
are intended to implant into the body, or
2.
support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2009, Diodes Incorporated
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DMN6068LK3
Document Number DS32057 Rev 2 - 2
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