19-5480; Rev 8/10 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS1553 is a full-function, year-2000compliant (Y2KC) real-time clock/calendar (RTC) with an RTC alarm, watchdog timer, power-on reset, battery monitor, and 8k x 8 nonvolatile static RAM. User access to all registers within the DS1553 is accomplished with a byte-wide interface as shown in Figure 1. The RTC registers contain century, year, month, date, day, hours, minutes, and seconds data in 24-hour BCD format. Corrections for day of month and leap year are made automatically. Integrated NV SRAM, RTC, Crystal, Power-Fail Control Circuit, and Lithium Energy Source Clock Registers are Accessed Identically to the Static RAM; These Registers are Resident in the 16 Top RAM Locations Totally Nonvolatile with Over 10 Years of Operation in the Absence of Power Precision Power-On Reset Programmable Watchdog Timer and RTC Alarm BCD-Coded Year, Month, Date, Day, Hours, Minutes, and Seconds with Automatic Leap Year Compensation Valid Up to the Year 2100 Battery Voltage Level Indicator Flag Power-Fail Write Protection Allows for 10% VCC Power-Supply Tolerance Lithium Energy Source is Electrically Disconnected to Retain Freshness Until Power is Applied for the First Time Pin Configurations appear at end of data sheet. ORDERING INFORMATION PART DS1553-85+ DS1553-100+ DS1553W-120+ DS1553W-150+ DS1553P-85+ DS1553P-100+ DS1553WP-120+ DS1553WP-150+ DS9034PCX+ VOLTAGE (V) 5.0 5.0 3.3 3.3 5.0 5.0 3.3 3.3 3 TEMP RANGE 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C PIN-PACKAGE 28 EDIP (0.740) 28 EDIP (0.740) 28 EDIP (0.740) 28 EDIP (0.740) 34 PowerCap* 34 PowerCap* 34 PowerCap* 34 PowerCap* — TOP MARK** DS1553+85 DS1553+100 DS1553W+120 DS1553W+150 DS1553P+85 DS1553P+100 DS1553WP+120 DS1553WP+150 DS9034PCX +Denotes a lead(Pb)-free/RoHS-compliant package. *PowerCap required, must be ordered separately **A “+” symbol anywhere on the top mark indicates a lead(Pb)-free package. Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata. 1 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM PIN DESCRIPTION EDIP 1 2 3 4 5 6 7 8 9 10 21 23 24 25 11 12 13 15 16 17 18 19 20 22 26 27 28 — PIN PowerCap 2 30 25 24 23 22 21 20 19 18 28 29 27 26 16 15 14 13 12 11 10 9 8 7 1 6 5 17 2, 3, 31–34 NAME RST A12 A7 A6 A5 A4 A3 A2 A1 A0 A10 A11 A9 A8 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 CE OE IRQ/FT WE VCC GND N.C FUNCTION Active-Low Power-On Reset Output (Open Drain) Address Inputs Data Input/Outputs Active-Low Chip Enable Active-Low Output Enable Active-Low Interrupt/Frequency Test Output (Open Drain) Active-Low Write Enable Power-Supply Input Ground No Connection 2 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM DETAILED DESCRIPTION The RTC registers in the DS1553 are double-buffered into an internal and external set. The user has direct access to the external set. Clock/calendar updates to the external set of registers can be disabled and enabled to allow the user to access static data. Assuming the internal oscillator is turned on, the internal set of registers is continuously updated. This occurs regardless of external registers settings to guarantee that accurate RTC information is always maintained. The DS1553 has interrupt ( IRQ /FT) and reset ( RST ) outputs that can be used to control CPU activity. The IRQ /FT interrupt output can be used to generate an external interrupt when the RTC register values match user-programmed alarm values. The interrupt is always available while the device is powered from the system supply, and it can be programmed to occur when in the battery-backed state to serve as a system wakeup. Either the IRQ /FT or RST outputs can also be used as a CPU watchdog timer. CPU activity is monitored and an interrupt or reset output is activated if the correct activity is not detected within programmed limits. The DS1553 power-on reset can be used to detect a system power-down or failure and can hold the CPU in a safe reset state until normal power returns and stabilizes. The RST output is used for this function. The DS1553 also contains its own power-fail circuitry, which automatically deselects the device when the VCC supply enters an out-of-tolerance condition. This feature provides a high degree of data security during unpredictable system operation brought on by low VCC levels. PACKAGES The DS1553 is available in a 28-pin DIP and a 34-pin PowerCap module. The 28-pin DIP module integrates the crystal, lithium energy source, and silicon in one package. The 34-pin PowerCap module board is designed with contacts for connection to a separate PowerCap (DS9034PCX) that contains the crystal and battery. This design allows the PowerCap to be mounted on top of the DS1553P after completion of the surface-mount process. Mounting the PowerCap after the surface-mount process prevents damage to the crystal and battery due to the high temperatures required for solder reflow. The PowerCap is keyed to prevent reverse insertion. The PowerCap module board and PowerCap are ordered separately and shipped in separate containers. The part number for the PowerCap is DS9034PCX. Figure 1. Block Diagram 3 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM Table 1. Operating Modes CE OE WE DQ0–DQ7 MODE POWER VIH X X High-Z Deselect Standby VIL X VIL DIN Write Active VIL VIL VIH DOUT Read Active VIL VIH VIH High-Z Read Active VSO < VCC <VPF X X X High-Z Deselect CMOS Standby <VBAT X X X High-Z Data Retention Battery Current VCC VCC > VPF DATA READ MODE The DS1553 is in read mode whenever CE (chip enable) is low and WE (write enable) is high. The device architecture allows ripple-through access to any valid address location. Valid data is available at the data input/output (DQ) pins within tAA after the last address input is stable, provided that CE and OE access times are satisfied. If CE or OE access times are not met, valid data is available at the latter of chip-enable access (tCEA) or at output-enable access time (tOEA). The state of the DQ pins is controlled by CE and OE . If the outputs are activated before tAA, the data lines are driven to an intermediate state until tAA. If the address inputs are changed while CE and OE remain valid, output data remains valid for output data hold time (tOH) but will then go indeterminate until the next address access. DATA WRITE MODE The DS1553 is in write mode whenever WE and CE are in their active state. The start of a write is referenced to the latter occurring transition of WE or CE . The addresses must be held valid throughout the cycle. CE and WE must return inactive for a minimum of tWR prior to the initiation of a subsequent read or write cycle. Data in must be valid tDS prior to the end of the write and remain valid for tDH afterward. In a typical application, the OE signal is high during a write cycle. However, OE can be active provided that care is taken with the data bus to avoid bus contention. If OE is low prior to WE transitioning low, the data bus can become active with read data defined by the address inputs. A low transition on WE will then disable the outputs tWEZ after WE goes active. DATA RETENTION MODE The 5V device is fully accessible, and data can be written and read only when VCC is greater than VPF. However, when VCC is below the power-fail point (VPF)—the point at which write protection occurs—the internal clock registers and SRAM are blocked from any access. When VCC falls below the battery switch point VSO (battery supply level), device power is switched from the VCC pin to the internal backup lithium battery. RTC operation and SRAM data are maintained from the battery until VCC is returned to nominal levels. The 3.3V device is fully accessible and data can be written and read only when VCC is greater than VPF. When VCC falls below VPF, access to the device is inhibited. If VPF is less than VSO, the device power is switched from VCC to the internal backup lithium battery when VCC drops below VPF. If VPF is greater than VSO, the device power is switched from VCC to the internal backup lithium battery when VCC drops 4 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM below VSO. RTC operation and SRAM data are maintained from the battery until VCC is returned to nominal levels. All control, data, and address signals must be powered down when VCC is powered down. BATTERY LONGEVITY The DS1553 has a lithium power source that is designed to provide energy for the clock activity and clock and RAM data retention when the VCC supply is not present. The capability of this internal power supply is sufficient to power the DS1553 continuously for the life of the equipment in which it is installed. For specification purposes, the life expectancy is 10 years at +25C with the internal clock oscillator running in the absence of VCC. Each DS1553 is shipped from Dallas Semiconductor with its lithium energy source disconnected, guaranteeing full energy capacity. When VCC is first applied at a level greater than VPF, the lithium energy source is enabled for battery backup operation. INTERNAL BATTERY MONITOR The DS1553 constantly monitors the battery voltage of the internal battery. The Battery Low Flag (BLF) bit of the Flags register (B4 of 1FF0h) is not writeable and should always be 0 when read. If a 1 is ever present, an exhausted lithium energy source is indicated, and both the contents of the RTC and RAM are questionable. POWER-ON RESET A temperature-compensated comparator circuit monitors the VCC level. When VCC falls to the power-fail trip point, the RST signal (open drain) is pulled low. When VCC returns to nominal levels, the RST signal continues to be pulled low for 40ms to 200ms. The power-on reset function is independent of the RTC oscillator and is therefore operational whether or not the oscillator is enabled. 5 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM CLOCK OPERATIONS Table 2 and the following paragraphs describe the operation of RTC, alarm, and watchdog functions. Table 2. Register Map ADDRESS B7 1FFFh 1FFEh 1FFDh 1FFCh 1FFBh 1FFAh 1FF9h 1FF8h X X X X X OSC W 1FF7h WDS 1FF6h 1FF5h 1FF4h 1FF3h 1FF2h 1FF1h 1FF0h AE AM4 AM3 AM2 AM1 Y WF DATA B4 B3 B6 B5 10 Year X X 10 M X 10 Date FT X X X 10 Hour 10 Minutes 10 Seconds R 10 Century BMB BMB3 BMB2 4 Y ABE Y Y 10 Date Y 10 Hours 10 Minutes 10 Seconds Y Y Y AF 0 BLF X BMB 1 Y Y 0 B2 B1 Year Month Date Day Hour Minutes Seconds Century BMB RB 0 1 Y Y Date Hours Minutes Seconds Y Y 0 0 B0 FUNCTION/RANGE Year Month Date Day Hour Minutes Seconds Control RB0 Watchdog Y Interrupts Alarm Date Alarm Hours Alarm Minutes Alarm Seconds Unused Flags Y 0 00-99 01-12 01-31 01-07 00-23 00-59 00-59 00-39 01-31 00-23 00-59 00-59 — — X = Unused, Read/Writable Under Write and Read Bit Control FT = Frequency Test Bit AE = Alarm Flag Enable Y = Unused, Read/Writable Without Write and Read Bit Control OSC = Oscillator Start/Stop Bit ABE = Alarm in Battery-Backup Mode Enable W = Write Bit AM1–AM4 = Alarm Mask Bits R = Read Bit WF = Watchdog Flag WDS = Watchdog Steering Bit AF = Alarm Flag BMB0–BMB4 = Watchdog Multiplier Bits 0 = 0 Read Only RB0–RB1 = Watchdog Resolution Bits BLF = Battery Low Flag CLOCK OSCILLATOR CONTROL The clock oscillator may be stopped at any time. To increase the shelf life of the backup lithium battery source, the oscillator can be turned off to minimize current drain from the battery. The OSC bit is the MSB of the Seconds register (B7 of 1FF9h). Setting it to 1 stops the oscillator; setting it to 0 starts the oscillator. The DS1553 is shipped from Dallas Semiconductor with the clock oscillator turned off, with the OSC bit set to 1. 6 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM READING THE CLOCK When reading the RTC data, it is recommended to halt updates to the external set of double-buffered RTC registers. This puts the external registers into a static state, allowing data to be read without register values changing during the read process. Normal updates to the internal registers continue while in this state. External updates are halted when a 1 is written into the read bit, B6 of the Control register (1FF8h). As long as a 1 remains in the Control register read bit, updating is halted. After a halt is issued, the registers reflect the RTC count (day, date, and time) that was current at the moment the halt command was issued. Normal updates to the external set of registers resume within 1 second after the read bit is set to 0 for a minimum of 500s. The read bit must be 0 for a minimum of 500s to ensure the external registers are updated. SETTING THE CLOCK The 8th bit, B7 of the Control register, is the write bit. Setting the write bit to 1, like the read bit, halts updates to the DS1553 (1FF8h–1FFFh) registers. After setting the write bit to 1, RTC registers can be loaded with the desired RTC count (day, date, and time) in 24-hour BCD format. Setting the write bit to 0 then transfers the values written to the internal RTC registers and allows normal operation to resume. CLOCK ACCURACY (DIP MODULE) The DS1553 is guaranteed to keep time accuracy to within 1 minute per month at +25C. The RTC is calibrated at the factory by Dallas Semiconductor using nonvolatile tuning elements and does not require additional calibration. For this reason, methods of field clock calibration are not available and not necessary. The electrical environment also affects clock accuracy and caution should be taken to place the RTC in the lowest level EMI section of the PC board layout. For additional information, refer to Application Note 58: Crystal Considerations with Dallas Real-Time Clocks, available on our website at www.maxim-ic.com/appnoteindex.com. CLOCK ACCURACY (PowerCap MODULE) The DS1553 and DS9034PCX are each individually tested for accuracy. Once mounted together, the module typically keeps time accuracy to within 1.53 minutes per month (35ppm) at +25°C. The electrical environment affects clock accuracy and caution should be taken to place the RTC in the lowest level EMI section of the PC board layout. For additional information, refer to Application Note 58: Crystal Considerations with Dallas Real-Time Clocks, available on our website at www.maxim-ic.com/appnoteindex.com. FREQUENCY TEST MODE The DS1553 frequency test mode uses the open-drain IRQ /FT output. With the oscillator running, the IRQ /FT output toggles at 512Hz when the FT bit is 1, the Alarm Flag Enable bit (AE) is 0, and the Watchdog Steering bit (WDS) is 1 or the Watchdog register is reset (Register 1FF7h = 00h). The IRQ /FT output and the frequency test mode can be used as a measure of the actual frequency of the 32.768kHz RTC oscillator. The IRQ /FT pin is an open-drain output that requires a pullup resistor for proper operation. The FT bit is cleared to 0 on power-up. 7 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM USING THE CLOCK ALARM The alarm settings and control for the DS1553 reside within registers 1FF2h–1FF5h. Register 1FF6h contains two alarm-enable bits: Alarm Enable (AE) and Alarm in Backup Enable (ABE). The AE and ABE bits must be set as described below for the IRQ /FT output to be activated for a matched alarm condition. The alarm can be programmed to activate on a specific day of the month or repeat every day, hour, minute, or second. It can also be programmed to go off while the DS1553 is in the battery-backed state of operation to serve as a system wakeup. Alarm mask bits AM1–AM4 control the alarm mode. Table 3 shows the possible settings. Configurations not listed in the table default to the once-per-second mode to notify the user of an incorrect alarm setting. Table 3. Alarm Mask Bits AM4 1 1 1 1 0 AM3 1 1 1 0 0 AM2 1 1 0 0 0 AM1 1 0 0 0 0 ALARM RATE Once per second When seconds match When minutes and seconds match When hours, minutes, and seconds match When date, hours, minutes, and seconds match When the RTC register values match Alarm register settings, the Alarm Flag bit (AF) is set to 1. If the Alarm Flag Enable (AE) is also set to 1, the alarm condition activates the IRQ /FT pin. The IRQ /FT signal is cleared by a read or write to the Flags register (Address 1FF0h) as shown in Figures 2 and 3. When CE is active, the IRQ /FT signal may be cleared by having the address stable for as short as 15ns and either OE or WE active, but it is not guaranteed to be cleared unless tRC is fulfilled. The alarm flag is also cleared by a read or write to the Flags register, but the flag does not change states until the end of the read/write cycle and the IRQ /FT signal has been cleared. 8 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM Figure 2. Clearing IRQ Waveforms CE , Figure 3. Clearing IRQ Waveforms CE = Ø The IRQ /FT pin can also be activated in the battery-backed mode. The IRQ /FT goes low if an alarm occurs and both ABE and AE are set. The ABE and AE bits are cleared during the power-up transition, however, an alarm generated during power-up sets AF. Therefore, the AF bit can be read after system power-up to determine if an alarm was generated during the power-up sequence. Figure 4 illustrates alarm timing during the battery-backup mode and power-up states. Figure 4. Backup Mode Alarm Waveforms 9 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM USING THE WATCHDOG TIMER The watchdog timer can be used to detect an out-of-control processor. The user programs the watchdog timer by setting the desired amount of timeout into the 8-bit Watchdog register (Address 1FF7h). The five Watchdog register bits BMB4–BMB0 store a binary multiplier and the two lower-order bits RB1–RB0 select the resolution, where 00 = 1/16 second, 01 = 1/4 second, 10 = 1 second, and 11 = 4 seconds. The watchdog timeout value is then determined by the multiplication of the 5-bit multiplier value with the 2-bit resolution value. (For example: writing 00001110 in the Watchdog register = 3 x 1 second or 3 seconds.) If the processor does not reset the timer within the specified period, the Watchdog Flag (WF) is set and a processor interrupt is generated and stays active until either the Watchdog Flag (WF) is read or the Watchdog register (1FF7) is read or written. The most significant bit of the Watchdog register is the Watchdog Steering Bit (WDS). When set to 0, the watchdog activates the IRQ /FT output when the watchdog times out. When WDS is set to 1, the watchdog outputs a negative pulse on the RST output for 40ms to 200ms. The Watchdog register (1FF7) and the FT bit are reset to 0 at the end of a watchdog timeout when the WDS bit is set to 1. The watchdog timer resets when the processor performs a read or write of the Watchdog register. The timeout period then starts over. Writing a value of 00h to the Watchdog register disables the watchdog timer. The watchdog function is automatically disabled upon power-up and the Watchdog register is cleared. If the watchdog function is set to output to the IRQ /FT output and the frequency test function is activated, the watchdog function prevails and the frequency test function is denied. POWER-ON DEFAULT STATES Upon application of power to the device, the following register bits are set to 0: WDS = 0, BMB0–BMB4 = 0, RB0–RB1 = 0, AE = 0, and ABE = 0. 10 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM ABSOLUTE MAXIMUM RATINGS Voltage Range on Any Pin Relative to Ground……………………………………………..-0.3V to +6.0V Storage Temperature Range EDIP .......................………………………………………………………………..-40C to +85C PowerCap...............………………………………………………………………..-55C to +125C Lead Temperature (soldering, 10s)…………………………….........................................................+260°C (Note: EDIP is hand or wave-soldered only.) (Note 8) Soldering Temperature (reflow)……………………………………..................................................+260°C This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. OPERATING RANGE RANGE Commercial TEMP RANGE 0°C to +70°C VCC 3.3V 10% or 5V 10% RECOMMENDED DC OPERATING CONDITIONS (TA = Over the operating range.) PARAMETER SYMBOL MIN TYP MAX UNITS NOTES Logic 1 Voltage All Inputs VCC = 5V ±10% VIH 2.2 VCC + 0.3V V 1 VCC = 3.3V ±10% VIH 2.0 VCC + 0.3V V 1 Logic 0 Voltage All Inputs VCC = 5V ±10% VIL -0.3 +0.8 1 VCC = 3.3V ±10% VIL -0.3 +0.6 1 DC ELECTRICAL CHARACTERISTICS (VCC = 5.0V ±10%, TA = Over the operating range.) PARAMETER SYMBOL MIN TYP MAX UNITS NOTES Active Supply Current ICC 15 50 mA 2, 3 TTL Standby Current (CE = VIH) CMOS Standby Current (CE VCC - 0.2V) ICC1 1 3 mA 2, 3 ICC2 1 3 mA 2, 3 Input Leakage Current (Any Input) IIL -1 +1 A Output Leakage Current (Any Output) Output Logic 1 Voltage (IOUT = -1.0mA) IOUT = 2.1mA, DQ0-7 Outputs Output Logic 0 Voltage IOUT = 7.0mA, IRQ/FT and RST Outputs IOL -1 +1 A VOH 2.4 V 1 VOL1 0.4 V 1 VOL2 0.4 V 1, 5 4.50 V 1 V 1, 4 Write Protection Voltage VPF Battery Switchover Voltage VSO 11 of 20 4.20 VBAT DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM DC ELECTRICAL CHARACTERISTICS (VCC = 3.3V ±10%, TA = Over the operating range.) PARAMETER SYMBOL MIN TYP MAX UNITS NOTES Active Supply Current ICC 10 30 mA 2, 3 TTL Standby Current (CE = VIH) ICC1 0.7 2 mA 2, 3 CMOS Standby Current (CE VCC - 0.2V) ICC2 0.7 2 mA 2, 3 Input Leakage Current (Any Input) IIL -1 +1 A Output Leakage Current (Any Output) IOL -1 +1 A VOH 2.4 Output Logic 1 Voltage (IOUT = -1.0mA) IOUT = 2.1mA, Output Logic 0 DQ0–7 Outputs Voltage IOUT = 7.0mA, IRQ/FT and RST Outputs V 1 VOL1 0.4 V 1 VOL2 0.4 V 1, 5 2.97 V 1 V 1, 4 Write Protection Voltage VPF Battery Switchover Voltage VSO 2.75 VBAT or VPF Figure 5. Read Cycle Timing Diagram 12 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM READ CYCLE, AC CHARACTERISTICS (VCC = 5.0V ±10%, TA = Over the operating range.) 85ns ACCESS PARAMETER SYMBOL MIN MAX 85 100ns ACCESS MIN MAX 100 UNITS Read Cycle Time tRC Address Access Time tAA CE to DQ Low-Z tCEL CE Access Time tCEA 85 100 ns CE Data Off Time tCEZ 30 35 ns OE to DQ Low-Z tOEL OE Access Time tOEA 45 55 ns OE Data Off Time tOEZ 30 35 ns Output Hold from Address tOH 85 5 ns 100 5 5 ns 5 5 ns ns 5 ns READ CYCLE, AC CHARACTERISTICS (VCC = 3.3V ±10%, TA = Over the operating range.) PARAMETER Read Cycle Time Address Access Time CE to DQ Low-Z CE Access Time CE Data Off Time OE to DQ Low-Z OE Access Time OE Data Off Time Output Hold from Address SYMBOL tRC tAA tCEL tCEA tCEZ tOEL tOEA tOEZ tOH 120ns ACCESS MIN MAX 120 120 5 120 40 5 100 35 5 13 of 20 150ns ACCESS MIN MAX 150 150 5 150 50 5 130 35 5 UNITS ns ns ns ns ns ns ns ns ns DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM WRITE CYCLE, AC CHARACTERISTICS (VCC = 5.0V ±10%, TA = Over the operating range.) PARAMETER 85ns ACCESS SYMBOL MIN MAX 100ns ACCESS MIN MAX UNITS Write Cycle Time tWC 85 100 ns Address Access Time tAS 0 0 ns WE Pulse Width tWEW 65 70 ns CE Pulse Width tCEW 70 75 ns Data Setup Time tDS 35 40 ns Data Hold time Address Hold Time WE Data Off Time Write Recovery Time tDH tAH tWEZ tWR 0 5 0 5 ns ns ns ns 30 5 35 5 WRITE CYCLE, AC CHARACTERISTICS (VCC = 3.3V ±10%, TA = Over the operating range.) PARAMETER SYMBOL 120ns ACCESS MIN MAX 150ns ACCESS MIN MAX UNITS Write Cycle Time tWC 120 150 ns Address Setup Time tAS 0 0 ns WE Pulse Width tWEW 100 130 ns CE Pulse Width tCEW 110 140 ns Data Setup Time tDS 80 90 ns Data Hold Time tDH 0 0 ns Address Hold Time tAH 0 0 ns WE Data Off Time tWEZ Write Recovery Time tWR 40 10 14 of 20 50 10 ns ns DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM Figure 6. Write Cycle Timing, Write-Enable Controlled Figure 7. Write Cycle Timing, Chip-Enable Controlled 15 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM POWER-UP/DOWN CHARACTERISTICS (VCC = 5.0V ±10%, TA = Over the operating range.) PARAMETER SYMBOL MIN CE or WE at VIH, Before Power-Down tPD 0 s VCC Fall Time: VPF(MAX) to VPF(MIN) tF 300 s VCC Fall Time: VPF(MIN) to VSO tFB 10 s VCC Rise Time: VPF(MIN) to VPF(MAX) tR 0 s VPF to RST High tREC 40 Expected Data Retention Time (Oscillator On) tDR 10 Figure 8. Power-Up/Down Waveform Timing 5V Device 16 of 20 TYP MAX 200 UNITS NOTES ms years 6, 7 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM POWER-UP/DOWN CHARACTERISTICS (VCC = 3.3V ±10%, TA = Over the operating range.) PARAMETER SYMBOL MIN TYP MAX CE or WE at VIH, Before Power-Down tPD 0 s VCC Fall Time: VPF(MAX) to VPF(MIN) tF 300 s VCC Rise Time: VPF(MIN) to VPF(MAX) tR 0 s VPF to RST High tREC 40 Expected Data Retention Time (Oscillator On) tDR 10 200 UNITS NOTES ms years 6, 7 MAX UNITS NOTES Figure 9. Power-Up/Down Waveform Timing 3.3V Device CAPACITANCE (TA = +25°C) PARAMETER SYMBOL MIN TYP Capacitance on All Input Pins CIN 7 pF 1 Capacitance on IRQ/FT, RST, and DQ Pins CIO 10 pF 1 17 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM AC TEST CONDITIONS Output Load: 100 pF + 1TTL Gate Input Pulse Levels: 0 to 3.0V Timing Measurement Reference Levels: Input: 1.5V Output: 1.5V Input Pulse Rise and Fall Times: 5ns NOTES: 1) 2) 3) 4) 5) 6) 7) Voltage referenced to ground. Typical values are at +25C and nominal supplies. Outputs are open. Battery switch over occurs at the lower of either the battery voltage or VPF. The IRQ /FT and RST outputs are open drain. Data retention time is at +25C. Each DS1553 has a built-in switch that disconnects the lithium source until VCC is first applied by the user. The expected tDR is defined for DIP modules as a cumulative time in the absence of VCC starting from the time power is first applied by the user. 8) Real-time clock modules (DIP) can be successfully processed through conventional wave-soldering techniques as long as temperature exposure to the lithium energy source contained within does not exceed +85C. Post solder cleaning with water-washing techniques is acceptable, provided that ultrasonic vibration is not used. In addition, for the PowerCap: a. Maxim recommends that PowerCap Module bases experience one pass through solder reflow oriented with the label side up (“live-bug”). b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than 3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to remove solder. 18 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM PIN CONFIGURATIONS TOP VIEW RST A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 GND 28 1 27 2 3 DS1553 26 25 4 24 5 23 6 22 7 21 8 20 9 19 10 18 11 17 12 16 13 14 15 VCC WE IRQ/FT A8 A9 A11 OE A10 CE DQ7 DQ6 DQ5 DQ4 DQ3 28-Pin Encapsulated Package (700-mil Extended) IRQ/FT N.C. N.C. RST VCC WE OE CE DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 DS1553 X1 GND VBAT X2 N.C. N.C. N.C. N.C. A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 34-Pin PowerCap Module Board (Uses DS9034PCX PowerCap) PACKAGE INFORMATION For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 28 EDIP MDP28+2 21-0241 — 34 PWRCP PC1+2 21-0246 — 19 of 20 DS1553 64kB, Nonvolatile, Year-2000-Compliant Timekeeping RAM REVISION HISTORY REVISION DATE DESCRIPTION PAGES CHANGED 8/10 Updated the Ordering Information table; updated the storage and soldering temperatures and added the lead temperature in the Absolute Maximum Ratings section; changed 70ns Access to 85ns Access in the Read Cycle, AC Characteristics (5V) table and updated the min/max values for tRC, tAA, tCEA, tCEZ, tOEA, and tOEZ; changed 70ns Access to 85ns Access in the Write Cycle, AC Characteristics (5V) table and updated the min/max values for tWC, tWEW, tCEW, tDS, and tWEZ; updated the Package Information table and removed the package drawings 1, 13, 14, 19 20 of 20 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2010 Maxim Integrated Products Maxim and the Dallas logo are registered trademarks of Maxim Integrated Products, Inc.