DS22EV5110 May 11, 2009 DVI, HDMI Extended Reach Equalizer with Retimer and Output De-Emphasis General Description Features The DS22EV5110 is a 6.75 Gbps (3 x 2.25 Gbps) extended reach equalizer optimized for DVI™and HDMI™ cable extension applications with a high performance re-clocking feature. It supports 3 Transition Minimized Differential Signaling (TMDS®) data channels and a single clock channel over DVI™ v1.0, and HDMI™ v1.3a data rates up to 2.25 Gbps for each data channel. The device incorporates a configurable receive equalizer, a clock and data recovery (CDR) circuit and a de-emphasis driver on each data channel over DVI v1.0, and HDMI v1.3a data rates up to 2.25 Gbps for each data channel. The device incorporates a configurable receive equalizer with a clock and data recovery (CDR) circuit on each data channel. The clock channel feeds a high-perfromance phase locked loop (PLL) that regenerates a low jitter output clock for data recovery, enabling the extended reach of driving capability feature for repeater application. The DS22EV5110 equalizes greater than 25 meters 28 AWG of HDMI cable, enabling 1080p resolution with 12 bit deep color depth (2.25 Gbps), to a low jitter version of the clock and data signal outputs, reducing both deterministic and random jitter. Obtaining total jitter is 0.09 UI or less over the supported data rates. This extremely low level of output jitter provides system designers with extra margin and flexibility when working with stringent timing budgets. It is ideal for the DVI and HDMI source and repeater applications. The transmitter supports configurable transmit de-emphasis so the output can be optimized for driving additional lengths of cables or FR4 traces. ■ Optimized for HDMI/DVI source and repeater applications ■ TMDS compatible inputs with configurable receive equalization supporting data rates up to 2.25 Gbps ■ TMDS compatible outputs with configurable transmit deemphasis ■ Dedicated CDR on each data channel reduces jitter transfer ■ Resistor adjustable differential output voltage for AC ■ ■ ■ ■ ■ ■ coupled Cat5e and Cat6 extension applications 2 equalizer settings for a wide range of cable reaches up to 2.25 Gbps Total Output Jitter of 0.09 UI at 2.25 Gbps DVI 1.0 and HDMI v1.3a compatible TMDS source and sink interface 7 mm x 7 mm 48 pin LLP package >8 kV HBM ESD protection 0 °C to +70 °C operating temperature Applications ■ Repeater Applications — HDMI / DVI Extender ■ Source Applications — Video Cards — Blu-ray DVD Players — Game Consoles ■ Sink Applications — High Definition Displays — Projectors Application Diagram 30094953 © 2009 National Semiconductor Corporation 300949 www.national.com DS22EV5110 DVI, HDMI Extended Reach Equalizer with Retimer and Output De-Emphasis PRELIMINARY DS22EV5110 Pin Descriptions Pin Name Pin Number I/O, Type Description High Speed Differential I/O C_IN− C_IN+ 1 2 I, CML Inverting and non-inverting TMDS Clock inputs to the equalizer. An on-chip 50 Ω terminating resistor connects C_IN+ to VDD and C_IN- to VDD. D_IN0− D_IN0+ 4 5 I, CML Inverting and non-inverting TMDS Data inputs to the equalizer. An on-chip 50 Ω terminating resistor connects D_IN0+ to VDD and D_IN0- to VDD. D_IN1− D_IN1+ 8 9 I, CML Inverting and non-inverting TMDS Data inputs to the equalizer. An on-chip 50 Ω terminating resistor connects D_IN1+ to VDD and D_IN1- to VDD. D_IN2− D_IN2+ 11 12 I, CML Inverting and non-inverting TMDS Data inputs to the equalizer. An on-chip 50 Ω terminating resistor connects D_IN2+ to VDD and D_IN2- to VDD. C_OUTC_OUT+ 36 35 O, CML Inverting and non-inverting TMDS outputs from the equalizer. Open collector. D_OUT0− D_OUT0+ 33 32 O, CML Inverting and non-inverting TMDS outputs from the equalizer. Open collector. D_OUT1– D_OUT1+ 29 28 O, CML Inverting and non-inverting TMDS outputs from the equalizer. Open collector. D_OUT2− D_OUT2+ 26 25 O, CML Inverting and non-inverting TMDS outputs from the equalizer. Open collector. Equalization Control EQ2 EQ1 EQ0 37 38 39 I, LVCMOS EQ2, EQ1 and EQ0 select the equalizer boost level for EQ channels. Internally pulled LOW as default. See Table 1. De-Emphasis Control DE1 DE0 42 43 I, LVCMOS DE1, DE0 select the DE-emphasis level for output drivers. Internally pulled low as default. Refer to Table 2. BYPASS 47 I, LVCMOS Reclocker enable control. Internally pulled low as default. H = Reclock and De-Emphasis function is bypassed. L = Normal operation. EN 44 I, LVCMOS Enable Output Drivers. Internally pulled HIGH as default. H = normal operation (enabled). L = standby mode. SD 45 O, LVCMOS Signal Detect Output pin. H = signal detected on all channels. L = no signal detected on one or more channels. LOCK 14 O, LVCMOS Lock Indicator Output pin. H = PLL is locked. L = PLL is not locked. VOD_CRL 48 I, Analog VOD control pin. Refer to Table 3. See Functional Description. External resistance = 24 kΩ to GND, Output DC Coupled Application. External resistance = 12 kΩ to GND, Output AC Coupled Application. LFp LFn 40 41 I, Analog Loop filter capacitor pins. See Functional Description. VDD 3, 6, 7, 10, 13, 15, 46 Power VDD = 3.3 V ±5%. VDD pins should be tied to the VDD plane through a low inductance path. A 0.1 µF bypass capacitor should be connected between each VDD pin to the GND planes. See Power Supply Bypassing for additional details. GND 22, 24, 27, 30, 31, 34 GND Ground reference. GND should be tied to a solid ground plane through a low impedance path. DAP GND Ground reference. The exposed pad at the center of the package must be connected to the ground plane. Device Control Power Exposed DAP www.national.com 2 Pin Number I/O, Type DS22EV5110 Pin Name Description Other Reserv 16, 17, 18, 19, 20,21, 23 Note: I = Input, O = Output, Reserved. Do not connect. Leave open. IO =Input/Output, Connection Diagram 30094952 TOP VIEW — Not to Scale Ordering Information NSID Package Tape & Reel QTY Package Number DS22EV5110SQE 48 Lead LLP 250 SQA48A DS22EV5110SQ 48 Lead LLP 1000 SQA48A DS22EV5110SQX 48 Lead LLP 2,500 SQA48A 3 www.national.com DS22EV5110 Absolute Maximum Ratings (Note 1) ESD Rating If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. HBM, 1.5 kΩ, 100 pF Thermal Resistance θJA, No Airflow Supply Voltage (VDD) LVCMOS Input Voltage LVCMOS Output Voltage CML Input/Output Voltage Junction Temperature Storage Temperature Lead Temp. (Soldering, 5 sec.) -0.5V to 4.0 V -0.5V to (VDD+ 0.5) V -0.5V to (VDD+ 0.5) V -0.5V to (VDD+ 0.5) V +125°C -65°C to +150°C +260°C >8 kV 33°C/W Recommended Operating Conditions (Notes 3, 4) Supply Voltage (VDD to GND) Supply Noise Tolerance (100 Hz to 50 MHz) Ambient Temperature Min 3.135 Typ 3.3 Max 3.465 Units V 100 0 25 mVp-p +70 °C Electrical Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. All parameters are guaranteed by test, statistical analysis, or design unless otherwise specified. (Note 3) Symbol Parameter Condition Min Typ Max Unit Power P Power Supply Consumption EN = H, Device Enabled PRBS15 pattern, fCLK=225 MHz RT= 50Ω to AVCC, Figure 2 1000 1150 mW EN = L, Standby Mode PRBS15 pattern, fCLK=225 MHz RT= 50Ω to AVCC, Figure 2 750 900 mW LVCMOS / LVTTL DC Specifications VIH High level input voltage 2 VDD V VIL Low level input voltage GND 0.8 V VOH High level output voltage IOH = -3 mA VOL Low level output voltage IOL = 3 mA IIH 2.4 VIN = VDD, EQ2, EQ1, EQ0, DE1, DE0, BYPASS pins Input HighCurrent (pull down) VIN = VDD, EN pin (pull up) IIL V 0.4 V 60 mA -15 mA VIN = 0 V, EQ2, EQ1, EQ0, DE1, DE0, BYPASS pins Input Low Current (pull down) 15 VIN = 0 V, EN pin (pull up) μA μA -20 Signal Detect SDH Default Input signal level to Signal Detect High assert SD pin 80 mVp-p SDL Default Input signal level to Signal Detect Low deassert SD 20 mVp-p www.national.com 4 Parameter Condition Min Typ Max Unit VTX Input Voltage Swing (Launch Amplitude) Measured differentially at TPA, Figure 1, note 4 800 1000 1560 mVp-p VICMDC Input CommonMode Voltage DC-Coupled requirement Measured at TPB, VINmin=800mV, VINmax=1200mV, Figure 1 VDD-0.3 VDD-0.2 V VIN Input Voltage Sensitivity Measured differentially at TPB, Figure 1 2.25 Gbps, Clock Pattern 150 1560 mVp-p RIN Input resistance IN+ to VDD and IN- to VDD 40 60 Ohms RLI Differential output 100 MHz — 1125 MHz return loss CML Inputs 50 10 dB CML Outputs Measured DC outputs at TPC, RT = 50Ω when DUT VDD is off with OUT+ and OUT- terminated by RT= 50Ω to AVCC, Figure 2 VOFF Standby Output Voltage VO External resistor = 24 kΩ at VOD_CRL pin.Measured Differential Output differentially with OUT+ and OUT- terminated by voltage swing RT=50Ω to AVCC,Figures 2, 3 VOCM Output commonmode Voltage Measured single-ended, > 1.65 Gbps, Figure 2 tR, tF Transition time 20% to 80% of differential output voltage, measured within 1” from output pins, Figure 3 85 tCCSK Inter Pair Data Channel-toChannel Skew (all 3 data channels) Difference in 50% crossing between channels 2.25 Gbps, Clock Pattern (Note 4) 2 tPPSK Inter Pair Data Channels ParttoPart Skew Difference in 50% crossing between channels of any two devices 2.25 Gbps, Clock Pattern 50 ps tDD Data Channels Latency 2.25 Gbps, Clock Pattern, Figure 4 400 ps tCD Clock Channel Latency 2.25 Gbps, Clock Pattern, Figure 4 600 ps 4 ms AVCC- 10 AVCC+ 10 mV 800 1200 mVp-p AVCC- 0.35 AVCC- 0.2 V ps 3 ps LVCMOS Outputs tSL SD to LOCK time Figure 4 fCLK Clock Frequency Clock Path (Note 4) 25 250 MHz bR Bit Rate Data Paths (Note 4) 0.25 2.25 Gbps Bit Rate 5 www.national.com DS22EV5110 Symbol DS22EV5110 Symbol Parameter Condition Min Typ Max Unit Data Channel Random Jitter RJ Random Jitter (Notes 4, 5, 6) 3 psrms Data Channel CDR Jitter Generation TROJ1 Data Paths, measured at Total Output Jitter TPC PRBS7, EQ [2:0] = 000 0.25 Gbps Figure 1, (Notes 4, 5, 6) 0.03 0.05 UIp-p TROJ2 Data Paths, measured at Total Output Jitter TPC PRBS7, EQ [2:0] = 000 1.65 Gbps Figure 1, (Notes 4, 5, 6) 0.08 0.14 UIp-p TROJ3 Data Paths, measured at Total Output Jitter TPC PRBS7, EQ [2:0] = 000 2.25 Gbps Figure 1, (Notes 4, 5, 6) 0.09 0.16 UIp-p BWLOOP CDR Loop Bandwidth 0.25 Gbps data rate 0.25 MHz 1.65 Gbps data rate 1.65 MHz 2.25 Gbps data rate 2.25 MHz Clock Channel PLL Jitter Generation TROJ4 Clock Path, measured at Total Output Jitter TPC 25 MHz Figure 1 (Notes 4, 5, 6) 0.03 0.045 UIp-p TROJ5 Clock Path, measured at Total Output Jitter TPC 165 MHz Figure 1 (Notes 4, 5, 6) 0.07 0.13 UIp-p TROJ6 Clock Path, measured at Total Output Jitter TPC 225 MHz Figure 1 (Notes 4, 5, 6) 0.08 0.135 UIp-p Note 1: “Absolute Maximum Ratings” are the ratings beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. Note 2: Allowed supply noise (mVp-p sine wave) at typical condition. Note 3: Typical parameters are measured at VDD = 3.3 V, TA = 25 °C. They are for reference purposes, and are not production-tested. Note 4: Parameter is guaranteed by statistical analysis and/or design. Note 5: Deterministic jitter is measured at the differential outputs (TPC of Figure 1), minus the deterministic jitter before the test channel (TPA of Figure 1). Random jitter is removed through the use of averaging or similar means. Note 6: Total Jitter is defined as peak-to-peak deterministic jitter from + 12 times random jitter (ps). Note 7: Random jitter contributed by the equalizer is defined as sq rt (JOUT2 − JIN2). JOUT is the random jitter at equalizer outputs in ps-rms, see TPC of Figure 1; JIN is the random jitter at the input of the equalizer in ps-rms, see TPA of Figure 1. www.national.com 6 DS22EV5110 Setup and Timing Diagrams 30094910 FIGURE 1. Test Setup Diagram 30094912 FIGURE 2. CML Output Swings at A/B (VOD_CRL = 24 kΩ 7 www.national.com DS22EV5110 30094911 FIGURE 3. CML Output Transition Times 30094913 FIGURE 4. CML Latency Delay Time 30094914 FIGURE 5. SD – LOCK Delay Time www.national.com 8 The DS22EV5110 DVI, HDMI Extended Reach Equalizer with Retimer and Output De-Emphasis consists of three data 30094915 FIGURE 6. Block Diagram pins (EQ [2:0]). The range of boost settings provided enables the DS22EV5110 to address a wide range of transmission line path loss scenarios, enabling support for a variety of data rates and formats. See Applications Information for recommended EQ settings. PHASE-LOCKED-LOCKED LOOP (PLL) The clock channel has a high-performance PLL that creates a low jitter sampling clock for the clock and data recovery units in the data channels. An external loop filter, composed of 2.2 nF (+ 5% tolerance) capacitor and a 3.3 kΩ (+ 5% tolerance) resistor in series, are required between the LFp and the LFn pins. OUTPUT DE-EMPHASIS De-emphasis is the conditioning function for use in compensating against backplane and cable transmission loss. The DS22EV5110 provides four steps of de-emphasis ranging from 0, 3, 6 and 9 dB, user-selectable dependent on the loss profile of output channels. Table 2. shows the De-emphasis control with default VO = 1000 mVp-p, and Figure 7. shows a driver de-emphasis waveform. CLOCK-DATA RECOVERY UNIT (CDR) Each TMDS data channel has a CDR that operates independently from other TMDS data channels. Each CDR aligns the sampling clock edges by digitally interpolating the clock from PLL of the TMDS clock channel. The device is designed to connect to DVI/HDMI compatible transmitter and receiver at any data rate between 250 Mbps to 2.25 Gbps. The loop bandwidth of the CDR is approximately baud_rate/1000, i.e. 2.25 MHz for 2.25 Gbps data. OUTPUT VO CONTROL Output differential voltage (VO) is controlled through VOD_CRL pin ties an external resistor to the ground as shown in Table 3. Users should restrict the external resistor values used to be 12 kΩ to 24 kΩ. +5% tolerance is recommended. INPUT EQUALIZATION The input data channel equalizers support eight programmable levels of equalization boost Table 1 by the EQ 9 www.national.com DS22EV5110 channels and a clock channel. Each data channel consists of a TMDS compatible receiver with a power efficient equalizer, a dedicated clock-data recovery (CDR) unit, and a TMDS compatible transmitter. Functional Description DS22EV5110 TABLE 1. Equalization Control INPUTS RESULT EQ2 EQ1 EQ0 Equalization in dB (1.125 GHz) 0 0 0 0 (default) 0 0 1 12 0 1 0 18 0 1 1 21 1 0 0 24 1 0 1 26 1 1 0 28 1 1 1 30 TABLE 2. De-Emphasis Control INPUTS RESULT DE1 DE0 VO De-Emphasis level in mVpp (VODE w/VOD_CRL = 24 kΩ 0 0 1000 (default) 0 (default) 0 1 710 -3 1 0 500 -6 1 1 355 -9 VO De-Emphasis in dB TABLE 3. VO Control External Resistor Value (VOD_CRL pin) Applications VO Level (mVp-p) 24 kΩ DC Coupled 1000 12 kΩ AC Coupled 1000 30094916 FIGURE 7. Output De-Emphasis Differential Waveform (showing all de-emphasis steps) www.national.com 10 SIGNAL DETECT The DS22EV5110 features a signal detect circuit on all channels. The status of the input signals can be determined by the state of the SD pin. A logic HIGH indicates the presence of signals that have exceeded a specified maximum threshold value (called SD_ON) on all channels. A logic LOW means that the signals have fallen below a minimum threshold value (called SD_OFF) on one or more channels. DEVICE STATE AND ENABLE CONTROL The DS22EV5110 has an Enable feature which provides the ability to control device power consumption. This feature can be controlled via the Enable Pin (EN Pin). If Enable is activated, the data channels and clock channel are placed in the ACTIVE state and all device blocks function as described. The DS22EV5110 can also be placed in STANDBY mode to save power. In this mode, the output drivers of the device are disabled. The CML outputs are in the HIGH (AVCC) state. All LVCMOS outputs are in the HiZ state. AUTOMATIC ENABLE FEATURE During normal operation (i.e. BYPASS pin is LOW), the DS22EV5110 can be configured to automatically enter STANDBY mode, if the PLL of the DS22EV5110 is not locked. The STANDBY mode can be implemented by connecting the LOCK DETECT (LOCK) pin to the external (LVCMOS) Enable (EN) pin. If the LOCK pin is connected to the EN pin, a logic HIGH on the LOCK pin will enable the device; thus the DS22EV5110 will automatically enter the ACTIVE state. If the PLL is unlocked, then the LOCK pin will be asserted LOW, causing the aforementioned blocks to be placed in the STANDBY state. LOCK DETECT When the PLL of the DS22EV5110 is locked, and the generated reference phases are successfully interpolated by the CDR, this status is indicated by a logic HIGH on the LOCK pin. The LOCK pin may be connected to the Enable (EN) pin input to disable the data channels and clock channel when no data signal is being received. 11 www.national.com DS22EV5110 RETIMING AND DE-EMPHASIS BYPASS The retiming and De-emphasis BYPASS pin provides the flexibility to configure the device to an equalizer only mode. The device is in normal operation, when holding a LOW state on the BYPASS pin. The retiming and De-emphasis features are disabled, when a HIGH state is applied. DS22EV5110 vice, the output de-emphasis setting should be configured based on the driving cable length. When used as the sink device, the levels of the equalization boost of the input data channels should be optimized based on the receiving cable length. The DS22EV5110 can also be used as a repeater in an external extender box with the equalization and de-emphasis level settings optimized to provide the maximum cable reach. Application Information The DS22EV5110 is a DVI/HDMI video signal reconditioning device. The device conforms to DVI v1.0 and HDMI v1.3a standards supporting up to 6.75 Gbps total throughput TMDS data for 1080p with 36 bit deep color depth. TYPICAL APPLICATION The DS22EV5110 is used as a DVI/HDMI source device, sink device, or a repeater device, see Figure 8. As the source de- 30094953 FIGURE 8. Typical Application Diagram ground potential difference, or to use one CAT5/6 cable between two chassis. To optimize the DS22EV5110 performance, the external resistance of 12 kΩ at the VOD_CRL pin should be used on the Source DS22EV5110, and a pair of 50 Ω pull-up resistors should be placed close to the outputs of the Source DS22EV5110, in order to DC bias the output driver. Meanwhile, 622Ω pull-down resistors should be placed at the inputs of the Sink DS22EV5110 device, in order to set the input common mode to a 3.05 V. Note AC coupled configuration is not compliant to the HDMI specification of Source requirement (See Figure 10). DC AND AC COUPLED APPLICATIONS The DS22EV5110 is designed to support TMDS differential pairs with DC coupled transmission lines. It contains integrated termination resistors (50Ω), pulled up to VDD at the input stage, and open collector outputs for DVI / HDMI signaling. Figure 9 shows the DC coupled connection between the HDMI Source (ie. DS22EV5110) and HDMI Sink (ie. DS22EV5110) devices. In the DC coupled application, the external resistance of 24 kΩ at VOD_CRL pin is used at the Source to ensure the VO level of 1000 mVp-p. The AC coupled method connecting between the Source and the Sink devices may be preferred to eliminate the impact of the 30094920 FIGURE 9. DC Coupled Application www.national.com 12 DS22EV5110 30094921 FIGURE 10. AC Coupled Application 24 AWG UTP (LOW SKEW UNSHIELDED TWIST PAIRS) CABLES The DS22EV5110 can be used to extend the length of low skew grade UTP cables, such as Cat5e and Cat6 to distances greater than 30 meters at 1.65 Gbps with < 0.20 UI of jitter. Note that for non-standard DVI/HDMI cables, the user must ensure the inter pair skew requirements are met. Table 5 shows the recommended EQ control settings for various data rates and cable lengths for UTP configurations. CABLE SELECTION AND INTER-PAIR SKEW DVI v1.0 and HDMI v1.3a specify Inter-Pair Skew requirements for the system. The DS22EV5110 intends to extend the longer cable reach with STP (DVI / HDMI) cable, or UTP (Cat5 / Cat5e / Cat6) cable, and it does not have a de-skew function to compensate any cable Inter-Pair Skews. Long cable with Inter-Pair Skew exceeding the DVI / HDMI standard limit tolerance could cause system distortion. Therefore, National suggests the consideration of Inter-Pair Skew budget during the system design, and recommends Low-Skew Video grade cables for cable extending applications. TABLE 5. EQ Control Setting for UTP Cable Format (Data Rate) 28 AWG STP (SHIELDED TWIST PAIRS) DVI / HDMI CABLES RECOMMENDED EQ SETTINGS Table 4 provides the recommended EQ control settings for various data rates and cable lengths for 28 AWG DVI/HDMI compliant configurations. The EQ setting is made via three EQ [2:0] pins. 0 ~ 10m > 10m 1080P 36-bit (2.25 Gbps) Setting 0x01 Setting 0x05 1080P (1.65 Gbps) Setting 0x01 Setting 0x05 1080I (750 Mbps) Setting 0x05 Setting 0x05 TABLE 4. EQ Control Setting for STP Cable Format (Data Rate) 0 ~ 10m > 10m 1080P 36-bit (2.25 Gbps) Setting 0x01 Setting 0x06 1080P (1.65 Gbps) Setting 0x01 Setting 0x06 1080I (750 Mbps) Setting 0x06 Setting 0x06 13 www.national.com DS22EV5110 POWER SUPPLY BYPASSING Two approaches are recommended to ensure the DS22EV5110 is provided with an adequate power supply. First, the supply (VDD) and ground (GND) pins should be connected to power planes routed on adjacent layers of the printed circuit board. The layer thickness of the dielectric should be minimized so the VDD and GND planes create a low inductance supply with distributed capacitance. Second, careful attention to supply bypassing through the proper use of bypass capacitors is required. A 0.1 μF bypass capacitor should be connected to each VDD pin such that the capacitor is placed as close as possible to the DS22EV5110. Smaller body size capacitors can help facilitate proper component placement. Additionally, two capacitors with capacitance in the range of 2.2 μF to 10 μF should be incorporated in the power supply bypassing design as well. These capacitors can be either tantalum or an ultra-low ESR ceramic and should be placed as close as possible to the DS22EV5110. General Recommendations The DS22EV5110 is a high performance circuit capable of delivering excellent performance. To achieve optimal performance, careful attention must be paid to the details associated with high-speed design as well as providing a clean power supply. Refer to the LVDS Owner’s Manual for more detailed information on high-speed design tips as well as many other available resources addressing signal integrity design issues. PCB LAYOUT CONSIDERATIONS FOR DIFFERENTIAL PAIRS The TMDS differential inputs and outputs must have a controlled differential impedance of 100 Ω. It is preferable to route TMDS lines exclusively on one layer of the board, particularly for the input traces. The use of vias should be avoided if possible. If vias must be used, they should be used sparingly and must be placed symmetrically for each side of a given differential pair. Route the TMDS signals away from other signals and noise sources on the printed circuit board. All traces of TMDS differential inputs and outputs must be equal in length to minimize intra-pair skew. EQUIVALENT I/O STRUCTURES Figure 14 shows the DS22EV5110 CML output structure and ESD protection circuitry. Figure 15 shows the DS22EV5110 CML input structure and ESD protection circuitry. LLP FOOTPRINT RECOMMENDATIONS See National application note: AN-1187, “Leadless Leadframe Package (LLP)” for additional information on LLP packages footprint and soldering information. 30094922 FIGURE 11. Equivalent Output Structure 30094923 FIGURE 12. Equivalent Input Structure www.national.com 14 DS22EV5110 Typical Performance Characteristics as a Repeater 30094909 FIGURE 13. Simplified Test Setup as a Single Repeater 30094960 30094961 FIGURE 14. System Source Eye Diagram at TPA (2.25 Gbps) FIGURE 15. Device Sink Eye Diagram at TPB (2.25 Gbps, Cable A = 25m 28 AWG HDMI) 30094963 30094962 FIGURE 17. Device Source Eye Diagram at TPC (2.25 Gbps, Cable A = 25m 28 AWG HDMI, EQ = 0x05, BYPASS = 0, DE = -3dB) FIGURE 16. Device Source Eye Diagram at TPC (2.25 Gbps, Cable A = 25m 28 AWG HDMI, EQ = 0x05, BYPASS = 0, DE = 0dB) 30094964 FIGURE 18. System Sink Eye Diagram at TPD (2.25 Gbps, Cable A = 25m 28 AWG HDMI, Cable B = 7.5m 28AWG HDMI, EQ = 0x05, BYPASS = 0, DE = -3dB) 15 www.national.com DS22EV5110 30094965 30094966 FIGURE 19. System Source Eye Diagram at TPA (1.65 Gbps) FIGURE 20. Device Sink Eye Diagram at TPB (1.65 Gbps, Cable A = 35m 28 AWG HDMI) 30094967 30094968 FIGURE 21. Device Source Eye Diagram at TPC (1.65 Gbps, Cable A = 35m 28 AWG HDMI, EQ = 0x05, BYPASS = 0, DE = 0dB) FIGURE 22. Device Source Eye Diagram at TPC (1.65 Gbps, Cable A = 35m 28 AWG HDMI, EQ = 0x05, BYPASS = 0, DE = -6dB) 30094969 FIGURE 23. System Sink Eye Diagram at TPD (1.65 Gbps, Cable A = 35m 28 AWG HDMI, Cable B = 10m 28AWG HDMI, EQ = 0x05, BYPASS = 0, DE = -6dB) www.national.com 16 DS22EV5110 Physical Dimensions inches (millimeters) unless otherwise noted 7mm x 7mm 48-pin LLP Package Order Number DS22EV5110SQ Package Number SQA48A 17 www.national.com DS22EV5110 DVI, HDMI Extended Reach Equalizer with Retimer and Output De-Emphasis Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: Products Design Support Amplifiers www.national.com/amplifiers WEBENCH® Tools www.national.com/webench Audio www.national.com/audio App Notes www.national.com/appnotes Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns Data Converters www.national.com/adc Samples www.national.com/samples Interface www.national.com/interface Eval Boards www.national.com/evalboards LVDS www.national.com/lvds Packaging www.national.com/packaging Power Management www.national.com/power Green Compliance www.national.com/quality/green Switching Regulators www.national.com/switchers Distributors www.national.com/contacts LDOs www.national.com/ldo Quality and Reliability www.national.com/quality LED Lighting www.national.com/led Feedback/Support www.national.com/feedback Voltage Reference www.national.com/vref Design Made Easy www.national.com/easy www.national.com/powerwise Solutions www.national.com/solutions Mil/Aero www.national.com/milaero PowerWise® Solutions Serial Digital Interface (SDI) www.national.com/sdi Temperature Sensors www.national.com/tempsensors SolarMagic™ www.national.com/solarmagic Wireless (PLL/VCO) www.national.com/wireless www.national.com/training PowerWise® Design University THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS, IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS. EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other brand or product names may be trademarks or registered trademarks of their respective holders. Copyright© 2009 National Semiconductor Corporation For the most current product information visit us at www.national.com National Semiconductor Americas Technical Support Center Email: [email protected] Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Technical Support Center Email: [email protected] National Semiconductor Asia Pacific Technical Support Center Email: [email protected] National Semiconductor Japan Technical Support Center Email: [email protected]