CHIN Series ELCH06-BJ4J6Z10-N0 Received ■ MASS PRODUCTION □ PRELIMINARY □ CUSTOMER DESIGN DEVICE NO. : DHE-0001303 PAGE : 12 Revised record 1 REV. DESCRIPTION RELEASE DATE 1 New spec 2010.12.01 2 1.Change format 2.Change IV、CCT、VF BIN 3.Change Package Dimension 2011.10.06 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 www.everlight.com DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 CHIN Series ELCH06-BJ4J6Z10-N0 MASS PRODUTION Features Small & compact package and with high efficiency Typical luminous flux: 200 lm @ 1000mA Typical color temperature: 6000 K@1000mA Optical efficiency@1000mA : 54 lm/W ESD protection up to 8KV Moisture Sensitivity Level (MSL) Class 1 Grouping parameter: total luminous flux, color coordinates. RoHS compliant & Pb free. Applications Mobile Torch Phone Camera Flash(Camera flash light /strobe light for mobile devices ) light for DV(Digital Video) application Indoor lighting applications Signal and symbol luminaries for orientation maker lights (e.g. steps, exit ways, etc.) TFT backlighting Exterior and interior illumination applications Decorative Exterior 2 and Entertainment Lighting and interior automotive illumination Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 www.everlight.com DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Device Selection Guide Chip Emitted Color Materials InGaN White Absolute Maximum Ratings (Tsolder pad =25℃) Parameter Symbol Rating Unit DC Forward Current (mA) IF 350 mA IPulse 1500 mA ESD Resistance VB 8000 V Reverse Voltage VR [1] V Junction Temperature TJ 125 Thermal Resistance(junction to case) Rs 10 Operating Temperature TOpr -40 ~ +85 Storage Temperature TStg -40 ~ +110 ℃ ℃/W ℃ ℃ Power Dissipation (Pulse Mode) Pd 6.5 W Soldering Temperature TSol 260 ℃ Allowable Reflow Cycles n/a 2 cycles Viewing Angle(2) 2θ1/2 120 deg Peak Pulse Current (mA) (400ms : ON ，3600ms : OFF) Note: 1. The Chin series LEDs are not designed for reverse bias used ∘ 2. View angle tolerance is ± 5 3. Avoid operating Chin series LEDs at maximum operating temperature exceed 1 hour. 4. All specification are assured by reliability test for 1000hr, IV degradation less than 30%. 5. All reliability items are tested under good thermal management with 1.0x 1.0 cm2 MCPCB. 6. Peak pulse current shall be applied under conditions as max duration time 50ms and max duty cycle 10% 7. Operate LED component at maximum rating conditions continuously will cause possible permanent damage and de-rating parameters. Exercise multiple maximum rating parameters simultaneously should not be allowed. When maximum rating parameters are applied over a long period will result potential reliability issue. 3 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 www.everlight.com DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 JEDEC Moisture Sensitivity Soak Requirements Standard Floor Life Level Time (hours) 1 Time (hours) Conditions ≦30℃ / 85% RH unlimited Conditions 85 168(+5/-0) ℃/ 85 RH ℃ Electro-Optical Characteristics (Tsolder pad =25 ) Parameter Symbol Min. Typ. Max. Unit Luminous Flux(1) Фv VF 200 ---- 250 4.45 lm Forward Voltage(2) (3) 160 2.95 CCT 4500 ---- 7000 K Bin Code Min. Typ. Max. Unit 2932 3235 3538 3841 4144 2.95 3.25 3.55 3.85 4.15 ---------------- 3.25 3.55 3.85 4.15 4.45 V Bin Code Min. Typ. Max. Unit J4 J5 J6 160 180 200 ---------- 180 200 250 lm Correlated Color Temperature V Condition IF=1000mA Note: 1. Luminous flux measurement tolerance: ±10% 2. Forward voltage measurement tolerance: ±0.1V 3. Electric and optical data is tested at 50 ms pulse condition Bin Range of Forward Voltage Binning Condition IF=1000mA Bin Range of Luminous Intensity 4 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 Condition IF=1000mA www.everlight.com DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 White Bin Structure 0.45 4500 5000 0.42 5700 0.39 y (1) 0.36 (2) 7000 0.33 (3) 0.30 0.27 0.27 0.30 0.33 0.36 0.39 0.42 0.45 x ： Notes ：4550K 2. Color Bin (2)：5057K 3. Color Bin (3)：5770K 1. Color Bin (1) White Bin Coordinate Bin CIE-X CIE-Y CCT Reference Range 4550 0.3738 0.3524 0.3440 0.3620 0.4378 0.4061 0.3420 0.3720 4500K ~ 5000K 5057 0.3300 0.3300 0.3440 0.3524 0.3200 0.3730 0.3420 0.4061 5000K ~ 5700K 5770 0.3030 0.3300 0.3300 0.3110 0.3330 0.3730 0.3200 0.2920 5700K ~ 7000K Note: 1. Color coordinates measurement allowance : ±0.01 2. Color bins are defined at IF =1000mA and 50ms pulse operation condition. 5 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 www.everlight.com DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Typical Electro-Optical Characteristics Curves Relative Spectral Distribution, IF=1000mA@50ms, Tsolder pad =25 ℃ 1 .0 Relative Intensity(a.u.) 0 .8 0 .6 0 .4 0 .2 0 .0 4 0 0 5 0 0 6 0 0 W 7 0 0 Typical Radiation Patterns 8 0 0 ) a v e le n g th ( n m Typical Polar Radiation Pattern for Lambertian X axis Y axis 0.8 Relative Intensity(a.u.) Relativety Luminous intensity 1.0 -15 -30 1.0 0 15 30 0.6 -45 0.8 0.6 0.4 -60 45 60 0.4 -75 0.2 75 0.2 0.0 -90 0.0 -60 -30 0 30 60 -90 90 90 2q (Degree) Degree Note: 1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. ∘. 2. View angle tolerance is ± 5 6 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 www.everlight.com DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Forward Voltage vs Forward Current, Tsolder pad =25 ℃ Correlated Color Temperature(CCT) vs. Forward Current 4.2 Correlated Color Temperatrue(K) 6200 Forward Voltage(V) 3.9 3.6 3.3 3.0 2.7 2.4 6000 5800 5600 5400 2.1 0 0 250 500 750 1000 1250 250 1500 Forward Current(mA@50ms) Luminous Flux vs Forward Current, Tsolder pad =25 750 1000 1250 1500 Forward Current Derating Curve, Derating based on T j MAX=125 at torch mode ℃ ℃ 1.4 600 Forward Current (mA) 1.2 Relative Luminous Flux(lm) 500 Forward Current(mA@50ms) 1.0 0.8 0.6 0.4 500 400 300 200 100 0.2 0.0 0 250 500 750 1000 1250 1500 0 0 Forward Current(mA@50ms) 25 50 75 100 o Solder temperature ( C) Note: 1. All correlation data is tested under superior thermal management with 1.0x 1.0 cm2 MCPCB 7 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 www.everlight.com DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Package Dimension 0.3 - 0 .05/ +0 0.3 1,64 Optical center 2,04 Chip position 0.75 Top view 1,64 0,25 1,1 Optical center 1,45 0,725±0.05 0,5 Anode pad Cathode pad 0,125 Note: 1. Dimensions are in millimeters. 2. Tolerances unless mentioned are ± 0.1mm. 8 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 www.everlight.com DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Moisture Resistant Packing Materials Label Explanation ‧CPN: Customer Specification (when required) ‧P/N: Everlight Production Number ‧QTY: Packing Quantity ‧CAT: Luminous Flux (Brightness) Bin ‧HUE: Color Bin ‧REF: Forward Voltage Bin ‧LOT No: Lot Number Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel Progress Direction Polarity Note: 1. Dimensions are in millimeters. 2. Tolerances unless mentioned are ± 0.1mm. 9 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 www.everlight.com DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Reel Dimensions Note: 1. Dimensions are in millimeters. Moisture Resistant Packing Process 10 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 www.everlight.com DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Reflow Soldering Characteristics Soldering and Handling 1. Over-current-proof Though Chin series has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shift may cause enormous current shift and burn out failure would happen 2. Storage i. ii. iii. Do not open the moisture-proof bag before the products are ready to use. ℃ and less and relative humidity less than 90%. After opening the package, the LEDs should be stored at temperature less than 30℃ and relative humidity less than 85%. Before opening the package, the LEDs should be stored at temperature less than 30 If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be ℃ for 24 hours. implemented based on the following conditions: Pre-curing at 60±5 3. Thermal Management i. For maintaining the high flux output and achieving reliability, Chin series LEDs should be mounted on a metal core printed circuit board (MCPCB), with proper thermal connection to dissipate approximately 1W to 5W of thermal energy under normal operation. ii. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LEDs lifetime will decrease critically iii. ℃. When operating , the solder pad temperature ( or the board temperature nearby the LED) must controlled under 70 4. Soldering Condition 4.1 Soldering Pad 11 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 www.everlight.com DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 4.2 For Reflow Process i. Lead reflow soldering temperature profile ii. Reflow soldering should not be done more than two times. iii. While soldering, do not put stress on the LEDs during heating. iv. After soldering, do not warp the circuit board. 12 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 www.everlight.com