Issue No. : 151ERA011011 Date of Issue : February 15.2011 Classification : New Digi-Key Changed PRODUCT SPECIFICATION FOR APPROVAL Product Description : Metal Film (Thin Film)Chip Resistors (RoHS Compliance) Product Part Number : ERA3Y##***V ERA3E##****V Country of Origin : JAPAN Applications : Standard electronic equipment *If you approve this specification, please fill in and sign the below and return 1 copy to us. Approval No : Approval Date : Executed by : (signature) Title : Dept. : Circuit Components Business Unit Prepared by : Panasonic Electronic Devices Co., Ltd. Contact Person : Engineering Section Signature 401 Sadamasa-cho, Fukui City 910-8502 Japan Phone : +81-776-56-8034 Name(Print) Title H.Yabukoshi : Authorized by : Signature Name(Print) Title : T.Iseki Manager of Engineering Subject Spec. No. Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-SRA-E102R ERA3 1. Dimension 10－1 L a (1) a (2) (3) W (4) (5) (1) (2) (3) (4) (5) (6) (6) Substrate Protective coating Resistive element Inner termination Between termination Outer termination Alumina Epoxy resin NiCr alloy special termination Ni plating Sn plating t b mm inch b L 1.60±0.15 0.63±.006 W 0.80±0.20 .031±.008 a 0.30±0.20 .012±.008 b 0.30±0.20 .012±.008 t 0.45±0.10 .018±.004 2. Power deratimg Curve Rated Load(%) 120 Category temperature range 100 70 60 -55~+125°C 40 20 125 0 -55 -40 0 40 80 120 140 160 Flg.1 Ambient Temperature (°C) 3. Ratings Item Rated power Rated value 0.10 W (at 70 °C or lower) Explanation When used at ambient temperture over 70°C, the load power should be reduced as shown in Flg.1 Panasonic Electronic Devices Co., Ltd. Subject Spec. No. Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-SRA-E102R ERA3 10－2 The rated voltage of each resistance should be calculated from the equation below, and when the rated voltage exceeds the ｌ imiting element voltage, the ｌ imiting element voltage should be the rated voltage. Limiting element voltage ;75V E = P ×R E : Rated voltage (V) P : Rated power (W) R : Rated resistance value (Ω) Rated voltage & Limiting element voltage Code. D B Tolerance for resistance Tolerance D B Resistance range Tolerance for resis. ± 0.5% ± 0.1% Resistance range Series E-96 series :special E-24 When E-96 series overlap 10 Ω ~330k Ω E-24 series, E-24 series E-24 100Ω ~33k Ω Should be the first priority 4. Explanation of Part Number E R A 3 Y E D 1 (1) (2) (3) (4) (5) (1) Product Code : Metal Film Chip Resistors (2) Size and Rated Power : 1.6 mm x 0.8 mm, 0.10W (3) Series and marking Code Series Marking Y E-24 series 3 digit marking E E-96 series No marking (4) T.C.R. Code T.C.R. Resistance range ± 50x10-6/°C Η 10Ω ~ 97.6Ω -6 ± 25x10 /°C Ε 100Ω ~ 33 kΩ ±100x10-6/°C Κ 33.2kΩ ~ 330kΩ (5)Resistance Tolerance Code Resistance Tolerance D +/- 0.5% B +/- 0.1% (6) Resistance Value <E-24 series> 3-digits type 123 →12×103 →12kΩ <E-96 series> 4-digits type 3012 → 301×102 → 30.1kΩ (7) Packaging Configuration Code Packaging Configuration V Taping (5000pcs/reel) Panasonic Electronic Devices Co., Ltd. 0 (6) 2 V (7) Subject Spec. No. Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-SRA-E102R ERA3 10－3 5. Appearance & Construction Item Rated value Explanation 1. The resistive element should be covered with protective coating that don’t fade easily. The surface of coating should avoid unevenness, flaw, pinhole and discoloration. Appearance & 2. The electrode should be printed uniformly, as shown in the Construction dimensions. The plating should not fade easily, and should avoid unevenness, flaw, pinhole, projection and discoloration. 3. The electrode should be connected electrically, mechanically to resistive element. As far as there shall not designation especially, the following test and measurement shall be operated under normal temperature (15~35°C), normal humidity(25~75%), normal atmospheric pressure( 8.6 × 10 4 ~ 1.06 × 10 5 Pa ). 6. Performance Specification Specifications Item Chip Resistor DC Resistance value shall DC be within the specified Resistance tolerance Temperature Coefficient Short-time overload Resit. range TCR 10Ω ± 50x10-6/°C ~97.6Ω 100Ω ±25x10 -6/°C ~33 kΩ 33.2kΩ ±100x10-6/°C ~330kΩ ± (0.5 % + 0.1Ω) Explanation At 20°C, 65%RH Natural resistance change per Temperature degree centigrade. R 2 − R1 × 106 (10-6/℃) R 1(t 2 − t 1) R1 : Resistance value at reference temperature(t1) R2 : Resistance value at test temperature(t2) t2 – t1 = 100°C t1 = 25°C Resistors shall be applied 2.5 times the rated voltage for 5 seconds. However, the upper limit of the voltage in the test shall be 150V. AC 100V between substrate and termination for No evidence of flashover, 1 min. Dielectric Withstanding Insulation Resistance AC powersupply or Insulation resistance mechanical damage, arcing or insulation breakdown Min.1,000MΩ Resistors shall be facing down. After applying DC 100V to the resistor, insulation resistance shall be measured. Panasonic Electronic Devices Co., Ltd. Subject Spec. No. Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION Part No. ERA3 7. Mechanical characteristic Specifications Item Chip Resistor 10－4 Explanation Substrate : Glass epoxy(t=1.6mm) Span : 90mm Bending distance :3mm (10 seconds) 1.0 1.0 1.0 1 Without distinct deformation in appearance 151-SRA-E102R (unit: mm) 40 Bond strength of the face plating ± (0.5 % + 0.05Ω) 100 Solderability Resistance to Soldering Heat Resistance to Solvent Termination should be covered uniformly with solder (min. 95% coverage) ± (0.5 % + 0.05Ω) Resistors shall be dipped in the melted solder bath at 235 ± 5 °C for 2 ± 0.5 sec. Flux shall be removed from the surface of termination with clean organic solvent. Resistors shall be dipped in the melted solder bath at 270 ± 3 °C for 10 ± 1 °C sec. olvent solution : Isopropyl alcohol Without distinct deformation in appearance (1)Dipping 10 +/- 1 hours, dry in room condition for 30 +/- 10 minutes. ± (0.5 % + 0.05Ω) (2)Ultrasonic wave washing : 5 +/- 1 min. (0.3W/cm2,28kHz) Dry in room condition for 30 +/-10 minutes. Panasonic Electronic Devices Co., Ltd. Subject Spec. No. Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION Part No. ERA3 151-SRA-E102R 10－5 8. Environment Test Item High Temperature Exposure Specifications Chip Resistor Explanation Resistors shall be exposed at125±3°C for 1000 ± 048 hours. ± (0.5 % + 0.05Ω) − 55 ± 3 °C 30minutes Rapid change of temperatrure ± (0.5 % + 0.05Ω) Damp heat , Steady State ± (0.5 % + 0.05Ω) Load Life ± (1.0 % + 0.1Ω) Load Life in Humidity ± (1.0 % + 0.1Ω) ↓↑ Normal Within 3minutes 5 cycles ↓↑ 125 ± 3 °C 30minutes Resistors shall be exposed at 60±2°C and 90~95% relative humidity in a humidity test chamber for 1000 ± 048 hours. Resistors shall be exposed at 70±2°C and 1000 ± 048 hours. During this time. The rated voltage shall be applied intermittently for 1.5 hours ON,0.5 hours OFF. Resistors shall be exposed to at 40±2°C and 90~95% relative humidity for 1000 ± 048 hours. During this time the rated voltage shall be applied intermittently for 1.5 hours ON,0.5 hours OFF. 9. Marking Express resistance value on resin side with three digits. (For example) 101 100Ω The first two digits are significant figures of resistance and the third one denotes number of zeros following. E-96 series: No marking Panasonic Electronic Devices Co., Ltd. Subject Spec. No. Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION Part No. ERA3 151-SRA-E102R 10－6 10. Common Precautions in Handling Resistors ! Notice for use (1) This specification shows the quality and performance of a unit component. Before adoption, be sure to evaluate and verify the product mounting it in your product. (2) We take no responsibility for troubles caused by the product usage that is not specified in this specification. (3) In advance-notification to us is required in case you demand high reliability in the resistors because there is a possibility that a trouble or a failure in our resistor which is used in your transportation units (e.g. Trains, cars, ships, traffic signal equipment etc.), ocean floor-equipment, medical equipment, aerospace equipment, electrothermal goods, combustion and gas equipment, power station control equipment, information control equipment, rotating equipment, disaster and crime preventive equipment, various safety devices, and the equivalent equipment may cause critical damage occurrence such as loss of life or property. In addition, use fail-safe design as mentioned below for preventing extensive damage and for ensuring the safety: *Ensure safety by the system in which the protective circuits and/or protective equipment are installed. *Ensure safety by the system in which a single failure does not cause unsafety by installing such as redundant circuits. (4) When a dogma shall be occurred about safety for this product, be sure to inform us rapidly, operate your technical examination. (5) The product is designed to use in general standard applications of general electric equipment (AV products, household electric appliances, office equipment, information and communication equipment, etc.); hence, it do not take the use under the following special environments into consideration. Accordingly, the use in the following special environments, and such environmental conditions may affect the performance of the product; prior to use, verify the performance, reliability, etc. thoroughly. 1) Use in liquids such as water, oil, chemical, and organic solvent. 2) Use under direct sunlight, in outdoor or in dusty atmospheres. 3) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX. 4) Use in environment with large static electricity or strong electromagnetic waves or strong radial ray. 5) Where the product is close to a heating component, or where an inflammable such as a polyvinyl chloride wire is arranged close to the product. 6) Where the resistor is sealed or coated with resin etc. 7) Where solvent, water, or water-soluble detergent is used in cleaning free soldering and in flux cleaning after soldering. (Pay particular attention to water-soluble flux.) 8) Use in such a place where the product is wetted due to dew condensation. (6) If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and confirmation test with resistors actually mounted on your own board. When the load of more than rated power is applied under the load condition at steady state, it may impair performance and/or reliability of resistor. Never exceed the rated power and rated voltage. Temperature of resistors may become high even with specified conditions. Please confirm safety of heat from resistors on print circuit board and components around them. When the product shall be used under special condition, be sure to ask us in advance. (7) Halogen type (Chlorine type, Bromine type, etc.) or other high-activity flux is not recommended as the residue may affect performance or reliability of resistors. Strong acid flux, water soluble-flux and flux including fluorine ion shall not be used. (8) When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. When using a soldering iron with a tip at high temperature, solder for a time as short as possible. (three seconds or less up to 350 deg.C) (9) Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage protective film or the body of resistor and may affect resistor’s performance. (10) Avoid immersion of chip resistor in solvent for long time. Use solvent after the effect of immersion is confirmed. Panasonic Electronic Devices Co., Ltd. Subject Spec. No. Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION Part No. ERA3 151-SRA-E102R 10－7 11. Storage Method If the product is stored in the following environments and conditions, the performance and solderability may be badly affected, avoid the storage in the following environments. (1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX. (2) Storage in places exposed to direct sunlight. (3) Storage in places outside the temperature range of 5 oC to 35 oC and humidity range of 45 %RH to 85 %RH. (4) The period of guarantee for performance such as solderability is 1 year after our delivery; and this condition applies only to the case where the storage method specified in item (1) to (3) has been followed. 12. Laws and Regulations (1) This product has not been manufactured with any ozone-depleting chemical controlled under the Montreal Protocol. (2) This product complies with the RoHS Directive (Restriction of the use of certain Hazardous substances in electrical and electronic equipment (DIRECTIVE 2002/95/EC)). (3) All materials used in this part are registered material under the Law Concerning the examination and Regulation of Manufacturs, etc. of Chemical substances. (4) All the materials used in this part contain no brominated materials of PBBOS or PBBS as the flame-retardant. (5) If you need the notice by letter of “A preliminary judgement on the laws of Japan foreign exchange and foreign trade control”, be sure to let us know. 13. Production Site Country: Japan Plant: Panasonic Electronic Devices Japan Co., Ltd. Panasonic Electronic Devices Co., Ltd. Subject Spec. No. Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-SRA-E102R ERA3 10－8 Min. 60.0 13.0 +/- 1.0 Carrier tape Top tape 180.0 +0 / Min. 60.0 14. Tape and Reel Package 14.1 Structure and reel dimensions shall be as shown in the figure below. Inaccordance with EIAJ ET-7200. 9.0 +/- 1.0 11.4 +/- Adhesive tape Unit : mm 14.2 Carrier Tape Dimensions P1 Do P2 P0 S p ro c k e t h o le E F W B A T C h ip re s is to r C h ip h o le (mm) (inch) A 1.10±0.10 .043±.004 B 1.90±0.10 .074±.004 W 8.00±0.20 .314±.008 F 3.50±0.05 .137±.002 (mm) P1 4.00±0.10 P2 2.00±0.05 P0 4.00±0.10 1.50 ± (inchi) .157±.004 .079±.002 .157±.004 .059 ± .004 0 D0 0.10 0 E 1.75±0.10 .069±.004 T 0.70±0.05 .028±.002 14.3 Tapping specifications 14.3.1 Taping (1) Minimum Bending Radius There shall be no defection of chip and no breakage of carrier tape in case carrier tape have been bent by minimum bending radius (15mm). Test shall be conducted for 1 time. (2) Resistance to climate of top tape The top tape shall not tear off after exposure at 60 oC, 90 %RH to 95 %RH for 120 h. (3) Peeling strength Peeling strength shall be within 0.049 N to 0.49 N. There shall be no burr or breakage after test. Test method is as follows: Panasonic Electronic Devices Co., Ltd. Subject Spec. No. Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION Part No. ERA3 <Test Methods> 151-SRA-E102R 10－9 Carrier tape Peeling direction 10 o Top tape 14.3.2 Quantity in Taping: 5000 pcs. /reel 14.3.3 Tape packaging (1) Resistance side shall be facing upward. (2) Chip resistor shall not be sticking to top tape and bottom tape. (3) Chip resistor shall be easy to take out from carrier tape and chip hole or sprocket hole shall not have flash and break. 14.4 Outer Packaging Quantity: 20 reels (Max. 100,000pcs.) Tape Marking * When taping shall not reach Max. or quantity, the remaining empty space shall be buried with buffer material. * When the quantity shall be few, alternative packaging methods may be used. No problem must occur during the exportation of the product. 14.5 Marking (Label) Items listed below shall be displayed. (1) Side of reel (Marking shall be on one side) 1)Part name, 2)Part number, 3)Quantity, 4)Lot number, 5)Maker name, 6) Production country (2)Packaging box 1)Customer name, 2)Part name, 3)Part number, 4)Customer part number, 5)Quantity. 6)Maker name, 7)Production country Panasonic Electronic Devices Co., Ltd.