1CY74FCT162374T Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered. CY74FCT16374T CY74FCT162374T 16-Bit Registers SCCS055C - August 1994 - Revised September 2001 Features Functional Description • Ioff supports partial-power-down mode operation • Edge-rate control circuitry for significantly improved noise characteristics • Typical output skew < 250 ps • ESD > 2000V • TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) packages • Industrial temperature range of −40˚C to +85˚C • VCC = 5V ± 10% CY74FCT16374T Features: • 64 mA sink current, 32 mA source current • Typical VOLP (ground bounce) <1.0V at VCC = 5V, TA = 25˚C CY74FCT162374T Features: • Balanced 24 mA output drivers • Reduced system switching noise • Typical VOLP (ground bounce) <0.6V at VCC = 5V, TA= 25˚C CY74FCT16374T and CY74FCT162374T are 16-bit D-type registers designed for use as buffered registers in high-speed, low power bus applications. These devices can be used as two independent 8-bit registers or as a single 16-bit register by connecting the output Enable (OE) and Clock (CLK) inputs. Flow-through pinout and small shrink packaging aid in simplifying board layout. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The CY74FCT16374T is ideally suited for driving high-capacitance loads and low-impedance backplanes. The CY74FCT162374T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The CY74FCT162374T is ideal for driving transmission lines. Logic Block Diagrams Pin Configuration SSOP/TSSOP Top View 1OE 1 48 1CLK 1O1 2 3 47 46 1 D1 GND 1O3 4 5 45 44 GND 1 D3 1O4 6 43 1 D4 VCC 1O5 7 42 8 9 41 VCC 1 D5 1O2 1OE 2OE 1CLK 1D1 2CLK D 1O1 2 D1 D 2O1 C C 1O6 GND 1O7 1O8 2O1 TO 7 OTHER CHANNELS FCT162374-1 2O2 TO 7 OTHER CHANNELS FCT162374-2 GND 2O3 10 11 12 13 40 39 38 14 15 37 36 35 34 1 D2 1 D6 GND 1 D7 1 D8 2 D1 2 D2 GND 2 D3 16 33 2O4 17 32 2 D4 VCC 2O5 18 31 19 30 VCC 2 D5 2O6 20 29 2 D6 GND 2O7 21 28 22 27 GND 2 D7 2O8 23 26 2 D8 2OE 24 25 2CLK FCT162374-3 Copyright © 2001, Texas Instruments Incorporated CY74FCT16374T CY74FCT162374T Maximum Ratings[2, 3] Function Table[1] Inputs Outputs D CLK OE O Function X L H Z High-Z X H H Z L L L H L H L H Z H H Z (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature .............................. −55°C to +125°C Ambient Temperature with Power Applied .......................................... −55°C to +125°C Load Register DC Input Voltage................................................. −0.5V to +7.0V DC Output Voltage.............................................. −0.5V to +7.0V DC Output Current (Maximum Sink Current/Pin)............................−60 to +120 mA Power Dissipation ..........................................................1.0W Pin Description Name Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015) Description D Data Inputs CLK Clock Inputs OE Three-State Output Enable Inputs (Active LOW) O Three-State Outputs Operating Range Range Industrial Ambient Temperature VCC −40°C to +85°C 5V ± 10% Electrical Characteristics Over the Operating Range Parameter Description Test Conditions Min. Typ.[4] Max. Input HIGH Voltage VIL Input LOW Voltage VH Input Hysteresis[5] VIK Input Clamp Diode Voltage VCC=Min., IIN=−18 mA −1.2 V IIH Input HIGH Current VCC=Max., VI=VCC ±1 µA IIL Input LOW Current VCC=Max., VI=GND ±1 µA IOZH High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=2.7V ±1 µA IOZL High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=0.5V ±1 µA IOS Short Circuit Current[6] VCC=Max., VOUT=GND −80 −200 mA [6] VCC=Max., VOUT=2.5V −50 −180 mA ±1 µA Max. Unit IO IOFF 2.0 Unit VIH V 0.8 100 Output Drive Current Power-Off Disable VCC=0V, VOUT −0.7 −140 ≤4.5V[7] V mV Output Drive Characteristics for CY74FCT16374T Parameter VOH VOL Description Output HIGH Voltage Output LOW Voltage Min. Typ.[4] VCC=Min., IOH=−3 mA 2.5 3.5 V VCC=Min., IOH=−15 mA 2.4 3.5 V VCC=Min., IOH=−32 mA 2.0 3.0 V Test Conditions VCC=Min., IOL=64 mA 0.2 0.55 V Notes: 1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = HIGH Impedance. = LOW-to-HIGH Transition. 2. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range. 3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. 4. Typical values are at VCC= 5.0V, TA= +25˚C ambient. 5. This parameter is specified but not tested. 6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. 7. Tested at +25˚C. 2 CY74FCT16374T CY74FCT162374T Output Drive Characteristics for CY74FCT162374T Parameter IODL Min. Typ.[4] Max. Unit VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA VCC=5V, VIN=VIH or VIL, VOUT=1.5V −60 −115 −150 mA 2.4 3.3 Description Output LOW Current [6] [6] Test Conditions IODH Output HIGH Current VOH Output HIGH Voltage VCC=Min., IOH=−24 mA VOL Output LOW Voltage VCC=Min., IOL=24 mA V 0.3 0.55 V Typ.[4] Max. Unit Capacitance[5] (TA = +25˚C, f = 1.0 MHz) Parameter Description Test Conditions CIN Input Capacitance VIN = 0V 4.5 6.0 pF COUT Output Capacitance VOUT = 0V 5.5 8.0 pF Typ.[4] Max. Unit 5 500 µA Power Supply Characteristics Parameter Description Test Conditions ICC Quiescent Power Supply Current VCC=Max. VIN≤0.2V, VIN≥VCC−0.2V ∆ICC Quiescent Power Supply Current (TTL inputs HIGH) VCC=Max. VIN=3.4V[8] 0.5 1.5 mA ICCD Dynamic Power Supply Current[9] VCC=Max., One Input Toggling, 50% Duty Cycle, Outputs Open, OE=GND VIN=VCC or VIN=GND 60 100 µA/ MHz IC Total Power Supply Current[10] VCC=Max., f0=10 MHz, f1=5 MHz, 50% Duty Cycle, Outputs Open, One Bit Toggling, OE=GND VIN=VCC or VIN=GND 0.6 1.5 mA VIN=3.4V or VIN=GND 1.1 3.0 mA VIN=VCC or VIN=GND 3.0 5.5[11] mA VIN=3.4V or VIN=GND 7.5 19.0[11] mA VCC=Max., f0=10 MHz, f1=2.5 MHz, 50% Duty Cycle, Outputs Open, Sixteen Bits Toggling, OE=GND Note: 8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. = IQUIESCENT + IINPUTS + IDYNAMIC 10. IC IC = ICC+∆ICCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) = Duty Cycle for TTL inputs HIGH DH = Number of TTL inputs at DH NT ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 = Input signal frequency f1 = Number of inputs changing at f1 N1 All currents are in milliamps and all frequencies are in megahertz. 11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested. 3 CY74FCT16374T CY74FCT162374T Switching Characteristics Over the Operating Range[12] CY74FCT16374T CY74FCT162374T Parameter Description CY74FCT16374AT CY74FCT162374AT Min. Max. Min. Max. Unit Fig. No.[13] tPLH tPHL Propagation Delay CLK to O 2.0 10.0 2.0 6.5 ns 1, 5 tPZH tPZL Output Enable Time 1.5 12.5 1.5 6.5 ns 1, 7, 8 tPHZ tPLZ Output Disable Time 1.5 8.0 1.5 5.5 ns 1, 7, 8 tSU Set-Up Time HIGH or LOW, D to CLK 2.0 2.0 ns 4 tH Hold Time HIGH or LOW, D to CLK 1.5 1.5 ns 4 tW CLK Pulse Width HIGH or LOW 5.0 5.0 ns 5 tSK(O) Output Skew[14] 0.5 0.5 ns CY74FCT16374CT CY74FCT162374CT Parameter Description Min. Max. Unit Fig. No.[13] tPLH tPHL Propagation Delay CLK to O 2.0 5.2 ns 1, 5 tPZH tPZL Output Enable Time 1.5 5.5 ns 1, 7, 8 tPHZ tPLZ Output Disable Time 1.5 5.0 ns 1, 7, 8 tSU Set-Up Time HIGH or LOW, D to CLK 2.0 ns 4 tH Hold Time HIGH or LOW, D to CLK 1.5 ns 4 tW CLK Pulse Width HIGH or LOW 3.3 ns 5 tSK(O) Output Skew[14] 0.5 Notes: 12. Minimum limits are specified but not tested on Propagation Delays. 13. See “Parameter Measurement Information” in the General Information section. 14. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design. 4 ns CY74FCT16374T CY74FCT162374T Ordering Information CY74FCT16374T Speed (ns) 5.2 6.5 10.0 Ordering Code Package Name Package Type CY74FCT16374CTPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT16374CTPVC/PVCT O48 48-Lead (300-Mil) SSOP CY74FCT16374ATPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT16374ATPVC/PVCT O48 48-Lead (300-Mil) SSOP CY74FCT16374TPVC/PVCT O48 48-Lead (300-Mil) SSOP Operating Range Industrial Industrial Industrial Ordering Information CY74FCT162374T Speed (ns) 5.2 6.5 10.0 Ordering Code Package Name Package Type 74FCT162374CTPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT162374CTPVC O48 48-Lead (300-Mil) SSOP 74FCT162374CTPVCT O48 48-Lead (300-Mil) SSOP 74FCT162374ATPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT162374ATPVC O48 48-Lead (300-Mil) SSOP 74FCT162374ATPVCT O48 48-Lead (300-Mil) SSOP CY74FCT162374TPVC/PVCT O48 48-Lead (300-Mil) SSOP 5 Operating Range Industrial Industrial Industrial CY74FCT16374T CY74FCT162374T Package Diagrams 48-Lead Shrunk Small Outline Package O48 48-Lead Thin Shrunk Small Outline Package Z48 6 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74FCT162374ATPACT ACTIVE TSSOP DGG 48 74FCT162374ATPVCG4 ACTIVE SSOP DL 48 74FCT162374ATPVCT ACTIVE SSOP DL 74FCT162374CTPACT ACTIVE TSSOP 74FCT162374CTPVCG4 ACTIVE 74FCT162374CTPVCT 2000 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SSOP DL 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI 74FCT162374ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI 74FCT162374TPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPVCG4 ACTIVE SSOP DL 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPVCG4 ACTIVE SSOP DL 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374TPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162374ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162374CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162374ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT162374ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT162374TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ATPVC ACTIVE SSOP DL 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM 25 25 25 25 25 Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CY74FCT16374CTPVC ACTIVE SSOP DL 48 CY74FCT16374CTPVCT ACTIVE SSOP DL 48 CY74FCT16374ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT16374ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT16374ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT16374ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT16374TPVC ACTIVE SSOP DL 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 25 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device 74FCT162374ATPACT Package Package Pins Type Drawing TSSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 74FCT162374ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 74FCT162374CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 74FCT162374CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT162374TPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT16374ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT16374ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT16374CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT16374CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74FCT162374ATPACT TSSOP DGG 48 2000 346.0 346.0 41.0 74FCT162374ATPVCT SSOP DL 48 1000 346.0 346.0 49.0 74FCT162374CTPACT TSSOP DGG 48 2000 346.0 346.0 41.0 74FCT162374CTPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT162374TPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT16374ATPACT TSSOP DGG 48 2000 346.0 346.0 41.0 CY74FCT16374ATPVCT SSOP DL 48 1000 346.0 346.0 49.0 CY74FCT16374CTPACT TSSOP DGG 48 2000 346.0 346.0 41.0 CY74FCT16374CTPVCT SSOP DL 48 1000 346.0 346.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374ATPVCT OBSOLETE SSOP DL 48 74FCT162374CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162374ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI 74FCT162374ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI 74FCT162374TPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16374TPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Call TI Samples (Requires Login) 74FCT162374ATPACT TBD (3) Call TI PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 23-Aug-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162374CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162374ETPAC OBSOLETE TSSOP DGG 48 CY74FCT162374ETPVC OBSOLETE SSOP DL 48 CY74FCT162374TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ATPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374CTPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16374CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Call TI Call TI Call TI Call TI CY74FCT16374ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT16374ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT16374ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT16374ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT16374TPVC ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374ATPVCTG4 ACTIVE SSOP DL 48 FCT162374CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162374CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Addendum-Page 2 Call TI Samples (Requires Login) CY74FCT162374ATPVC TBD (3) Call TI PACKAGE OPTION ADDENDUM www.ti.com Orderable Device FCT162374CTPVCTG4 23-Aug-2012 Status (1) ACTIVE Package Type Package Drawing SSOP DL Pins 48 Package Qty 1000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.6 15.8 1.8 12.0 24.0 Q1 74FCT162374ATPACT TSSOP DGG 48 2000 330.0 24.4 74FCT162374CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 74FCT162374CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT162374TPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT16374ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT16374ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 CY74FCT16374CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 CY74FCT16374CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74FCT162374ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0 74FCT162374CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0 74FCT162374CTPVCT SSOP DL 48 1000 367.0 367.0 55.0 CY74FCT162374TPVCT SSOP DL 48 1000 367.0 367.0 55.0 CY74FCT16374ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT16374ATPVCT SSOP DL 48 1000 367.0 367.0 55.0 CY74FCT16374CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0 CY74FCT16374CTPVCT SSOP DL 48 1000 367.0 367.0 55.0 Pack Materials-Page 2 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated