FSA3031 — Dual High-Speed USB2.0 with Mobile High-Definition Link (MHL™) Description Features Low On Capacitance: 4.6 pF/6.75 pF MHL/USB (Typical) Low Power Consumption: 30 μA Maximum MHL Data Rate: ≥4.7Gbps with Ideal Input Source Supports MHL Rev. 2.0 Passes 1080 p/60 fps (3 Gbps) MHL Data Eye Diagram Mask Compliance Packaged in 12-Lead UMLP (1.8 x 1.8 mm) Over-Voltage Tolerance (OVT) on all USB Ports Up to 5.25 V without External Components Applications Cell Phones and Digital Cameras The FSA3031 is a bi-directional, low-power, high-speed, 3:1, dual USB2.0 and MHL switch. Configured as a double-pole, triple-throw (DP3T) switch; it is optimized for switching between dual high- or full-speed USB and Mobile High-Definition Link sources (MHL™ Rev. 2.0 specification). The FSA3031 contains special circuitry on the switch I/O pins, for applications where the VCC supply is powered off (VCC=0), that allows the device to withstand an over-voltage condition. This switch is designed to minimize current consumption even when the control voltage applied to the control pins is lower than the supply voltage (VCC). This feature is especially valuable to mobile applications, such as cell phones; allowing direct interface with the general-purpose I/Os of the baseband processor. Other applications include switching and connector sharing in portable cell phones, digital cameras, and notebook computers. IMPORTANT NOTE: For additional performance information, please contact [email protected]. Ordering Information Part Number FSA3031UMX Top Mark Operating Temperature Range LX -40 to +85°C Package 12-Lead, Ultrathin Molded Leadless Package (UMLP), 1.8 mm x 1.8 mm Figure 1. Typical Application All trademarks are the property of their respective owners. © 2011 Fairchild Semiconductor Corporation FSA3031 • Rev. 1.0.4 www.fairchildsemi.com FSA3031 — Dual High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) Switch November 2012 1.80 0.10 C A (11X) 2.10 B 0.563 0.588 2X 1 1.80 0.40 2.10 PIN#1 IDENT TOP VIEW 0.55 MAX. 0.10 C 0.10 C (12X) 0.20 2X RECOMMENDED LAND PATTERN 0.152 0.45 0.35 0.08 C 0.05 0.00 0.10 SEATING C PLANE SIDE VIEW 0.10 0.10 DETAIL A SCALE : 2X NOTES: 0.35 (11X) 0.45 3 A. PACKAGE DOES NOT FULLY CONFORM TO JEDEC STANDARD. B. DIMENSIONS ARE IN MILLIMETERS. 6 0.40 DETAIL A C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 1 PIN#1 IDENT 12 9 BOTTOM VIEW D. LAND PATTERN RECOMMENDATION IS BASED ON FSC DESIGN ONLY. 0.25 0.15 (12X) 0.10 C A B 0.05 C E. DRAWING FILENAME: MKT-UMLP12Arev4. PACKAGE EDGE LEAD OPTION 1 SCALE : 2X LEAD OPTION 2 SCALE : 2X FSA3031 — Dual High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) Switch Physical Dimensions Figure 20. 12-Lead, Ultrathin Molded Leadless Package (UMLP) Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2011 Fairchild Semiconductor Corporation FSA3031 • Rev. 1.0.4 www.fairchildsemi.com 12 FSA3031 — Dual High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) Switch 13 www.fairchildsemi.com © 2011 Fairchild Semiconductor Corporation FSA3031 • Rev. 1.0.4