GULFSEMI GUFB30M

GUFB30M
SINTERED GLASS JUNCTION
PLASTIC RECTIFIER
VOLTAGE: 1000V
CURRENT: 3.0A
FEATURE
G-3
High temperature metallurgically bonded construction
Sintered glass cavity free junction
Capability of meeting environmental standard of
MIL-S-19500
High temperature soldering guaranteed
350°C /10sec/0.375”lead length at 5 lbs tension
Operate at Ta =55°C with no thermal run away
Typical Ir<0.1µA
MECHANICAL DATA
Terminal: Plated axial leads solderable per
MIL-STD 202E, method 208C
Case: Molded with UL-94 Class V-0 recognized Flame
Retardant Epoxy
Polarity: color band denotes cathode
Mounting position: any
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half-wave, 60HZ, resistive or inductive load rating at 25°C, unless otherwise stated,
for capacitive load, derate current by 20%)
SYMBOL
GUFB30M
units
Maximum Recurrent Peak Reverse Voltage
Vrrm
1000
V
Maximum RMS Voltage
Vrms
700
V
Maximum DC blocking Voltage
Vdc
1000
V
Maximum Average Forward Rectified Current 3/8”lead
length at Ta =55°C
Peak Forward Surge Current 8.3ms single Half sinewave superimposed on rated load
If(av)
3.0
A
Ifsm
80.0
A
Maximum Instantaneous Forward Voltage at 9.0A
Vf
1.70
V
Maximum DC Reverse Current
at rated DC blocking voltage
Ir
10.0
100.0
µA
Ta =25°C
Ta =150°C
Maximuml Reverse Recovery Time
(Note 1)
Trr
75
nS
Typical Junction Capacitance
(Note 2)
Cj
40.0
pF
Typical Thermal Resistance
(Note 3)
Rth(ja)
20.0
°C /W
Tstg, Tj
-65 to +175
°C
Storage and Operating Junction Temperature
Note:
1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
2. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc
3. Thermal Resistance from Junction to Ambient at 3/8”lead length, P.C. Board Mounted
Rev.A1
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RATINGS AND CHARACTERISTIC CURVES GUFB30M
Rev.A1
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