HCS253MS Radiation Hardened Dual 4-Input Multiplexer September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg • Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/BitDay (Typ) • Dose Rate Survivability: >1 x 1012 RAD (Si)/s • Latch-Up Free Under Any Conditions • Fanout (Over Temperature Range) - Bus Driver Outputs - 15 LSTTL Loads • Military Temperature Range: -55oC to +125oC OE 1 1 16 VCC S1 2 15 2 OE I3 1 3 14 S0 I2 1 4 13 2 I3 I1 1 5 12 2 I2 I0 1 6 11 2 I1 Y1 7 10 2 I0 GND 8 9 2Y • Significant Power Reduction Compared to LSTTL ICs 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE (FLATPACK) MIL-STD-1835 CDFP4-F16, LEAD FINISH C TOP VIEW • DC Operating Voltage Range: 4.5V to 5.5V • Input Logic Levels - VIL = 0.3 VCC Max - VIH = 0.7 VCC Min OE 1 1 16 VCC S1 2 15 2 OE I3 1 3 14 S0 I2 1 4 13 2 I3 I1 1 5 12 2 I2 I0 1 6 11 2 I1 Y1 7 10 2 I0 GND 8 9 2Y • Input Current Levels Ii ≤ 5µA at VOL, VOH Description The Intersil HCS253MS is a Radiation Hardened 4-to-1 line selector multiplexer having three-state outputs. One of four sources for each section is selected by the common select inputs S0 and S1. When the output enable (1OE or 2OE) is HIGH, the output is in the high impedance state. The HCS253MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. The HCS253MS is supplied in a 16 lead Ceramic flatpack (K suffix) or a SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE SCREENING LEVEL PACKAGE HCS253DMSR -55oC to +125oC Intersil Class S Equivalent 16 Lead SBDIP HCS253KMSR -55oC to +125oC Intersil Class S Equivalent 16 Lead Ceramic Flatpack HCS253D/Sample +25oC Sample 16 Lead SBDIP HCS253K/Sample +25oC Sample 16 Lead Ceramic Flatpack HCS253HMSR +25oC Die Die CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 1 Spec Number File Number 518765 3068.1 HCS253MS Functional Diagram 20E 15 2I3 13 2I2 2I1 12 2I0 11 S0 10 S1 14 2 1I0 1I1 1I2 5 6 4 1I3 10E 1 3 20E 10E 20E 10E 16 VCC 8 GND p n n p 20E 20E 10E 10E 9 7 2Y 1Y TRUTH TABLE SELECT INPUTS DATA INPUTS OUTPUT ENABLE OUTPUT S1 S0 I0 I1 I2 I3 OE Y X X X X X X H Z L L L X X X L L L L H X X X L H L H X L X X L L L H X H X X L H H L X X L X L L H L X X H X L H H H X X X L L L H H X X X H L H Select inputs S0 and S1 are common to both sections H = High Level, L = Low Level, X = Immaterial, Z = High Impedance (Off) Spec Number 2 518765 Specifications HCS253MS Absolute Maximum Ratings Reliability Information Supply Voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VCC +0.5V DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA DC Drain Current, Any One Output. . . . . . . . . . . . . . . . . . . . . . .±25mA (All Voltage Reference to the VSS Terminal) Storage Temperature Range (TSTG) . . . . . . . . . . . -65oC to +150oC Lead Temperature (Soldering 10sec) . . . . . . . . . . . . . . . . . . +265oC Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 Thermal Resistance θJA θJC SBDIP Package. . . . . . . . . . . . . . . . . . . . 73oC/W 24oC/W Ceramic Flatpack Package . . . . . . . . . . . 114oC/W 29oC/W Maximum Package Power Dissipation at +125oC Ambient SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.68W Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.44W If device power exceeds package dissipation capability, provide heat sinking or derate linearly at the following rate: SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.7mW/oC Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . 8.8mW/oC CAUTION: As with all semiconductors, stress listed under “Absolute Maximum Ratings” may be applied to devices (one at a time) without resulting in permanent damage. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The conditions listed under “Electrical Performance Characteristics” are the only conditions recommended for satisfactory device operation.. Operating Conditions Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V Input Rise and Fall Times at 4.5V VCC (TR, TF) . . . . . . .500ns Max Operating Temperature Range (TA) . . . . . . . . . . . . -55oC to +125oC Input Low Voltage (VIL). . . . . . . . . . . . . . . . . . . 0.0V to 30% of VCC Input High Voltage (VIH) . . . . . . . . . . . . . . . . . . 70% of VCC to VCC TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER Quiescent Current Output Current (Sink) Output Current (Source) Output Voltage Low Output Voltage High Input Leakage Current Three-State Output Leakage Current Noise Immunity Functional Test GROUP A SUBGROUPS TEMPERATURE MIN MAX UNITS 1 +25oC - 40 µA 2, 3 +125oC, -55oC - 750 µA 1 +25oC 7.2 - mA 2, 3 +125oC, -55oC 6.0 - mA 1 +25oC -7.2 - mA 2, 3 +125oC, -55oC -6.0 - mA VCC = 4.5V, VIH = 3.15V, IOL = 50µA, VIL = 1.35V 1, 2, 3 +25oC, +125oC, -55oC - 0.1 V VCC = 5.5V, VIH = 3.85V, IOL = 50µA, VIL = 1.65V 1, 2, 3 +25oC, +125oC, -55oC - 0.1 V VCC = 4.5V, VIH = 3.15V, IOH = -50µA, VIL = 1.35V 1, 2, 3 +25oC, +125oC, -55oC VCC -0.1 - V VCC = 5.5V, VIH = 3.85V, IOH = -50µA, VIL = 1.65V 1, 2, 3 +25oC, +125oC, -55oC VCC -0.1 - V VCC = 5.5V, VIN = VCC or GND 1 +25oC - ±0.5 µA 2, 3 +125oC, -55oC - ±5.0 µA 1 +25oC - ±1.0 µA 2, 3 +125oC, -55oC - ±50 µA 7, 8A, 8B +25oC, +125oC, -55oC - - - (NOTE 1) CONDITIONS SYMBOL ICC IOL IOH VOL VOH IIN IOZ FN VCC = 5.5V, VIN = VCC or GND VCC = 4.5V, VIH = 4.5V, VOUT = 0.4V, VIL = 0V VCC = 4.5V, VIH = 4.5V, VOUT = VCC -0.4V, VIL = 0V VCC = 5.5V, Applied Voltage = 0V or VCC VCC = 4.5V, VIH = 0.7 (VCC), VIL = 0.3 (VCC) (Note 2) LIMITS NOTES: 1. All voltages reference to device GND. 2. For functional tests, VO ≥ 4.0V is recognized as a logic “1”, and VO ≤ 0.5V is recognized as a logic “0”. Spec Number 3 518765 Specifications HCS253MS TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER (NOTES 1, 2) CONDITIONS SYMBOL Select to Output Data to Output TPHL TPLH TPHL TPLH Enable to Output TPZH TPZL Disable to Output TPHZ TPLZ GROUP A SUBGROUPS TEMPERATURE MIN MAX UNITS 9 +25oC 2 26 ns 10, 11 +125oC, -55oC 2 31 ns 9 +25oC 2 19 ns 10, 11 +125oC, -55oC 2 22 ns 9 +25oC 2 21 ns 10, 11 +125oC, -55oC 2 24 ns 9 +25oC 2 17 ns 10, 11 +125oC, -55oC 2 20 ns 9 +25oC 2 15 ns 10, 11 +125oC, -55oC 2 17 ns 9 +25oC 2 18 ns 10, 11 +125oC, -55oC 2 19 ns 9 +25oC 2 16 ns 10, 11 +125oC, -55oC 2 17 ns VCC = 4.5V VCC = 4.5V VCC = 4.5V VCC = 4.5V VCC = 4.5V VCC = 4.5V VCC = 4.5V LIMITS NOTES: 1. All voltages referenced to device GND. 2. AC measurements assume RL = 500Ω, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = VCC. TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETER Capacitance Power Dissipation Input Capacitance Output Transition Time SYMBOL CPD CIN TTHL TTLH (NOTE 1) CONDITIONS VCC = 5.0V, f = 1MHz VCC = 5.0V, f = 1MHz VCC = 4.5V TEMPERATURE MIN MAX UNITS +25oC - 45 pF +125oC, -55oC - 56 pF +25oC - 10 pF +125oC, -55oC - 10 pF +25oC - 12 ns +125oC, -55oC - 18 ns NOTE: 1. The parameters listed in Table 3 are controlled via design or process parameters. Min and Max Limits are guaranteed but not directly tested. These parameters are characterized upon initial design release and upon design changes which affect these characteristics.. Spec Number 4 518765 Specifications HCS253MS TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS 200K RAD LIMITS PARAMETER (NOTES 1, 2) CONDITIONS SYMBOL TEMPERATURE MIN MAX UNITS Quiescent Current ICC VCC = 5.5V, VIN = VCC or GND +25oC - 0.75 mA Output Current (Sink) IOL VCC = 4.5V, VIN = VCC or GND, VOUT = 0.4V +25oC 6.0 - mA Output Current (Source) IOH VCC = 4.5V, VIN = VCC or GND, VOUT = VCC -0.4V +25oC -6.0 - mA Output Voltage Low VOL VCC = 4.5V and 5.5V, VIH = 0.70(VCC), VIL = 0.30(VCC), IOL = 50µA +25oC - 0.1 V Output Voltage High VOH VCC = 4.5V and 5.5V, VIH = 0.70(VCC), VIL = 0.30(VCC), IOH = -50µA +25oC VCC -0.1 - V Input Leakage Current IIN VCC = 5.5V, VIN = VCC or GND +25oC - ±5 µA Three-State Output Leakage Current IOZ Applied Voltage = 0V or VCC, VCC = 5.5V +25oC - ±50 µA Noise Immunity Functional Test FN VCC = 4.5V, VIH = 0.70(VCC), VIL = 0.30(VCC), (Note 3) +25oC - - - Select to Output TPHL VCC = 4.5V +25oC 2 31 ns TPLH VCC = 4.5V +25oC 2 31 ns TPHL VCC = 4.5V +25oC 2 22 ns TPLH VCC = 4.5V +25oC 2 24 ns TPZL VCC = 4.5V +25oC 2 17 ns TPZH VCC = 4.5V +25oC 2 20 ns TPHZ VCC = 4.5V +25oC 2 19 ns TPLZ VCC = 4.5V +25oC 2 17 ns Data to Output Enable to Output Disable to Output NOTES: 1. All voltages referenced to device GND. 2. AC measurements assume RL = 500Ω, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = VCC 3. For functional tests VO ≥ 4.0V is recognized as a logic “1”, and VO ≤ 0.5V is recognized as a logic “0”. TABLE 5. BURN-IN AND OPERATING LIFE TEST, DELTA PARAMETERS (+25oC) GROUP B SUBGROUP DELTA LIMIT ICC 5 12µA IOL/IOH 5 -15% of 0 Hour IOZL/IOZH 5 ±200nA PARAMETER Spec Number 5 518765 Specifications HCS253MS TABLE 6. APPLICABLE SUBGROUPS CONFORMANCE GROUPS METHOD GROUP A SUBGROUPS Initial Test (Preburn-In) 100%/5004 1, 7, 9 ICC, IOL/H Interim Test I (Postburn-In) 100%/5004 1, 7, 9 ICC, IOL/H Interim Test II (Postburn-In) 100%/5004 1, 7, 9 ICC, IOL/H PDA 100%/5004 1, 7, 9, Deltas Interim Test III (Postburn-In) 100%/5004 1, 7, 9 PDA 100%/5004 1, 7, 9, Deltas Final Test 100%/5004 2, 3, 8A, 8B, 10, 11 Sample/5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11 Subgroup B-5 Sample/5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas Subgroup B-6 Sample/5005 1, 7, 9 Sample/5005 1, 7, 9 Group A (Note 1) Group B Group D READ AND RECORD ICC, IOL/H Subgroups 1, 2, 3, 9, 10, 11, (Note 2) NOTES: 1. Alternate group A inspection in accordance with Method 5005 of MIL-STD-883 may be exercised. 2. Table 5 parameters only. TABLE 7. TOTAL DOSE IRRADIATION CONFORMANCE GROUPS TEST READ AND RECORD METHOD PRE RAD POST RAD PRE RAD POST RAD 5005 1, 7, 9 Table 4 1, 9 Table 4 (Note 1) Group E Subgroup 2 NOTE: 1. Except FN test which will be performed 100% Go/No-Go. TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OSCILLATOR OPEN GROUND 1/2 VCC = 3V ± 0.5V VCC = 6V ± 0.5V 50kHz 25kHz - 16 - - - 1 - 6, 10 -16 - - 7, 9 16 3 - 6, 10 - 14 2 STATIC BURN-IN I TEST CONNECTIONS (Note 1) 7, 9 1 - 6, 8, 10 - 15 STATIC BURN-IN II TEST CONNECTIONS (Note 1) 7, 9 8 DYNAMIC BURN-IN TEST CONNECTIONS (Note 2) - 1, 8, 15 NOTES: 1. Each pin except VCC and GND will have a resistor of 10KΩ ± 5% for static burn-in 2. Each pin except VCC and GND will have a resistor of 680Ω ± 5% for dynamic burn-in TABEL 9. IRRADIATION TEST CONNECTIONS OPEN GROUND VCC = 5V ± 0.5V 7, 9 8 1 - 6, 10 - 16 NOTE: Each pin except VCC and GND will have a resistor of 47KΩ ± 5% for irradiation testing. Group E, Subgroup 2, sample size is 4 dice/wafer 0 failures. Spec Number 6 518765 HCS253MS Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) 100% Interim Electrical Test 1 (T1) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Static Burn-In 2, Condition A or B, 24 hrs. min., +125oC min., Method 1015 100% Nondestructive Bond Pull, Method 2023 100% Interim Electrical Test 2 (T2) Sample - Wire Bond Pull Monitor, Method 2011 100% Delta Calculation (T0-T2) Sample - Die Shear Monitor, Method 2019 or 2027 100% PDA 1, Method 5004 (Notes 1and 2) 100% Internal Visual Inspection, Method 2010, Condition A 100% Dynamic Burn-In, Condition D, 240 hrs., +125oC or Equivalent, Method 1015 100% Delta Calculation (T0-T1) 100% Temperature Cycle, Method 1010, Condition C, 10 Cycles 100% Interim Electrical Test 3 (T3) 100% Constant Acceleration, Method 2001, Condition per Method 5004 100% Delta Calculation (T0-T3) 100% PDA 2, Method 5004 (Note 2) 100% PIND, Method 2020, Condition A 100% Final Electrical Test 100% External Visual 100% Fine/Gross Leak, Method 1014 100% Serialization 100% Radiographic, Method 2012 (Note 3) 100% Initial Electrical Test (T0) 100% External Visual, Method 2009 100% Static Burn-In 1, Condition A or B, 24 hrs. min., +125oC min., Method 1015 Sample - Group A, Method 5005 (Note 4) 100% Data Package Generation (Note 5) NOTES: 1. Failures from Interim electrical test 1 and 2 are combined for determining PDA 1. 2. Failures from subgroup 1, 7, 9 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the failures from subgroup 7. 3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004. 4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005. 5. Data Package Contents: • Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quantity). • Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage. • GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test equipment, etc. Radiation Read and Record data on file at Intersil. • X-Ray report and film. Includes penetrometer measurements. • Screening, Electrical, and Group A attributes (Screening attributes begin after package seal). • Lot Serial Number Sheet (Good units serial number and lot number). • Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test. • The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed by an authorized Quality Representative. Spec Number 7 518765 HCS253MS AC Timing Diagrams AC Load Circuit DUT TEST POINT VIH INPUT VS CL VIL RL TPLH TPHL VOH CL = 50pF VS OUTPUT RL = 500Ω VOL TTLH VOH TTHL 80% 20% VOL 80% 20% OUTPUT AC VOLTAGE LEVELS PARAMETER HCS UNITS VCC 4.50 V VIH 4.50 V VS 2.25 V VIL 0 V GND 0 V Three-State Low Load Circuit Three-State Low Timing Diagrams VIH VS INPUT VCC VIL RL TPZL TPLZ VOZ TEST POINT DUT VT VW OUTPUT CL VOL CL = 50pF RL = 500Ω THREE-STATE LOW VOLTAGE LEVELS PARAMETER HCS UNITS VCC 4.50 V VIH 4.50 V VS 2.25 V VT 2.25 V VW 0.90 V 0 V GND Spec Number 8 518765 HCS253MS Three-State High Timing Diagrams Three-State High Load Circuit DUT VIH VS TEST POINT INPUT CL VIL RL TPZL TPLZ VOH VT CL = 50pF VW OUTPUT RL = 500Ω VOZ THREE-STATE HIGH VOLTAGE LEVELS PARAMETER HCS UNITS VCC 4.50 V VIH 4.50 V VS 2.25 V VT 2.25 V VW 3.60 V 0 V GND All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Spec Number 9 518765 HCS253MS Die Characteristics DIE DIMENSIONS: 84 x 84 mils METALLIZATION: Type: AlSi Metal Thickness: 11kÅ ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13kÅ ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100µm x 100µm 4 mils x 4 mils Metallization Mask Layout (15) 2 OE (2) S1 (1) OE 1 (16) VCC HCS253MS I3 1 (3) (14) S0 (13) 2 I3 I2 1 (4) (12) 2 I2 I1 1 (5) (11) 2 I1 I0 1 (6) 2 Y (9) GND (8) Y 1 (7) (10) 2 I0 Spec Number 10 518765