Low Profile Option for 1x9 Transceivers Technical Data Option P Features Description • PMC (PCI Mezzanine Card) Compliant Packaging Style with 9.8 mm Height • Full Compliance with the Optical Performance Requirements of the FDDI PMD Standard and ATM Forum UNI SONET OC-3 Multimode Fiber Physical Layer Specification • Multisourced 1x9 Package Style with Duplex SC Connector • Wave Solder and Aqueous Wash Process Compatible • Manufactured in an ISO 9001 Certified Facility The low-profile option of the 1x9 transceivers gives the designers a PMC compliant package option with the performance of the standard 1x9 modules. The option P products have the same electrical and optical performances as the standard products. Applications • HFBR-5103P – FDDI/Fast Ethernet/ATM 100 Mbps Concentrators, Bridges, Routers, and Network Interface Cards • HFBR-5204P/5205P – Multimode Fiber ATM Backbone Links and Wiring Closet to Desktop Links Package The package outline drawing is shown on the reverse page. The pin-outs are the same as the original 1x9 package style. Regulatory Compliance These transceiver products enable commercial system designers to develop equipment that complies with the various international regulations which govern the certification of Information Technology Equipment. The transceivers typically provide a 10 dB margin to the FCC Class B standard for Electromagnetic Interference when tested at a certified test range without a chassis enclosure. Additional information is available from the data sheets of the standard products or your Agilent sales representative. Ordering Information This option will be available with the following part numbers in SC connector style only. The standard product part numbers for the following are the same part numbers without the “P” suffix. Part Number HFBR-5103P HFBR-5204P HFBR-5205P Baud/Distance 125 MBd/2 km 155 MBd/500 m 155 MBd/2 km Reliability Information The low-profile option modules use the same semiconductor devices and manufacturing processes as the standard 1x9 transceivers. Therefore, the reliability data for the standard parts is directly applicable. Package Outline Drawing 39.6 (1.559) MAX. TX RX 4.7 (0.185) AREA RESERVED FOR PROCESS PLUG SLOT DEPTH 0.7 MAX. (0.028) +0.1 0.25 -0.05 HFBR-5X0XP DATECODE COUNTRY OF ORIGIN 12.7 (0.500) A 25.4 (1.000) MAX. A 12.7 (0.500) SLOT WIDTH 1.9 ± 0.1 (0.075 ± 0.004) (0.010 +0.004 -0.002 ) 9.8 MAX. (0.386) 3.3 ± 0.38 (0.130 ± 0.015) 9X ∅ ( +0.25 0.46 -0.05 +0.010 0.018 -0.002 23.8 (0.937) 15.8 ± 0.15 (0.622 ± 0.006) 20.32 (0.800) ) 2X ∅ 20.32 [8x (2.54/0.100)] (0.800) 4X ∅ +0.25 1.27 -0.05 +0.010 0.050 -0.002 ( ) 20.32 (0.800) 1.3 (0.051) 24.2 (0.953) 1.35 (0.053) DIMENSIONS ARE IN MILLIMETERS (INCHES). www.semiconductor.agilent.com Data subject to change. Copyright © 2000 Agilent Technologies, Inc. Obsoletes 5965-7094E (11/99) 5980-1060E (10/00)