ATM Multimode Fiber
Transceivers for SONET
OC-3/SDH STM-1 in Low
Cost 1x9 Package Style
Data Sheet
Features
• Full Compliance with ATM
Forum UNI SONET OC-3
Multimode Fiber Physical
Layer Specification
• Multisourced 1 x 9 Package
Style with Choice of Duplex
SC or Duplex ST* Receptacle
• Wave Solder and Aqueous
Wash Process Compatibility
• Manufactured in an ISO 9002
Certified Facility
Applications
• Multimode Fiber ATM
Backbone Links
• Multimode Fiber ATM Wiring
Closet to Desktop Links
• ATM 155 Mbps/194 MBd
Encoded Links (available
upon special request)
Description
The HFBR-5200 family of transceivers from Agilent Technologies
provide the system designer with
products to implement a range of
solutions for multimode fiber
SONET OC-3 (SDH STM-1) physical
layers for ATM and other services.
HFBR-5204/-5204P/-5204T
1300 nm 500 m
HFBR-5205/-5205A/
-5205AT/-5205P/-5205T/
-5205PE
1300 nm 2 km
These transceivers are all
supplied in the new industry
standard 1x9 SIP package style
with either a duplex SC or a
duplex ST* connector interface.
ATM 2000 m Backbone Links
The HFBR-5205/-5205T are
1300 nm products with optical
performance compliant with the
SONET STS-3c (OC-3) Physical
Layer Interface Specification. This
physical layer is defined in the
ATM Forum User-Network Interface (UNI) Specification Version
3.0. This document references the
ANSI T1E1.2 specification for the
details of the interface for 2000
meter multimode fiber backbone
links.
Selected versions of these
transceivers may be used to
implement the ATM Forum UNI
Physical Layer Interface at the
155 Mbps/194 MBd rate.
The ATM 100 Mbps/125 MBd
Physical Layer interface is best
implemented with the HFBR-5100
family of FDDI Transceivers
which are specified for use in this
4B/5B encoded physical layer per
the FDDI PMD standard.
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
ATM 500 m Backbone and
Desktop Links
The HFBR-5204/-5204T are 1300
nm products which are similar to
the HFBR-5205/5205T except
that they are intended to provide
a lower cost SONET OC-3 link to
distances up to 500 meters in
62.5/125 µm multimode fiber
optic cables.
Transmitter Sections
The transmitter sections of the
HFBR-5204 and HFBR-5205
series utilize 1300 nm InGaAsP
LEDs. These LEDs are packaged
in the optical subassembly portion
of the transmitter section. They
are driven by a custom silicon IC
which converts differential PECL
logic signals, ECL referenced
(shifted) to a +5 Volt supply, into
an analog LED drive current.
2
Receiver Sections
The receiver sections of the
HFBR-5204 and HFBR-5205
series utilize InGaAs PIN photodiodes coupled to a custom
silicon transimpedance preamplifier IC. These are packaged in the
optical subassembly portion of
the receiver.
These PIN/preamplifier combinations are coupled to a custom
quantizer IC which provides the
final pulse shaping for the logic
output and the Signal Detect
function. The data output is
differential. The signal detect
output is single-ended. Both data
and signal detect outputs are
PECL compatible, ECL referenced
(shifted) to a +5 volt power
supply.
Package
The overall package concept for
the Agilent transceivers consists
of three basic elements; the two
optical subassemblies, an
electrical subassembly, and the
housing as illustrated in the block
diagrams in Figure 1 and
Figure 1a.
The package outline drawing and
pin out are shown in Figures 2,
2a, and 3. The details of this
package outline and pin out are
compliant with the multisource
definition of the 1x9 SIP. The low
profile of the Agilent transceiver
design complies with the
maximum height allowed for the
duplex SC connector over the
entire length of the package.
Figures 2b and 2c show the
outline drawings for options that
include mezzanine height and
extended and flush shields
respectively.
The optical subassemblies utilize
a high volume assembly process
together with low cost lens
elements which result in a cost
effective building block.
The electrical subassembly consists of a high volume multilayer
printed circuit board on which the
IC chips and various surfacemounted passive circuit elements
are attached.
The package includes internal
shields for the electrical and
optical subassemblies to insure
low EMI emissions and high
immunity to external EMI fields.
The outer housing including the
duplex SC connector or the
duplex ST ports is molded of filled
non-conductive plastic to provide
mechanical strength and electrical
isolation. The solder posts of the
Agilent design are isolated from
the circuit design of the
transceiver and do not require
connection to a ground plane on
the circuit board.
The transceiver is attached to a
printed circuit board with the nine
signal pins and the two solder
posts which exit the bottom of the
housing. The two solder posts
provide the primary mechanical
strength to withstand the loads
imposed on the transceiver by
mating with the duplex or simplex
SC or ST connectored fiber
cables.
Note: The “T” in the product
numbers indicates a transceiver
with a duplex ST connector
receptacle. Product numbers
without a “T” indicate transceivers
with a duplex SC connector
receptacle.
Application Information
The Applications Engineering
group in the Agilent Optical
Communication Division is
available to assist you with the
technical understanding and
design trade-offs associated with
these transceivers. You can contact them through your Agilent
sales representative.
ELECTRICAL SUBASSEMBLY
DIFFERENTIAL
DATA OUT
DUPLEX SC
RECEPTACLE
PIN PHOTODIODE
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
LED
DATA IN
DRIVER IC
TOP VIEW
Figure 1. SC Block Diagram.
3
ELECTRICAL SUBASSEMBLY
DUPLEX ST
RECEPTACLE
DIFFERENTIAL
DATA OUT
PIN PHOTODIODE
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
LED
DATA IN
DRIVER IC
TOP VIEW
Figure 1a. ST Block Diagram.
39.12
MAX.
(1.540)
25.40
MAX.
(1.000)
A
12.70
(0.500)
6.35
(0.250)
AREA
RESERVED
FOR
PROCESS
PLUG
12.70
(0.500)
HFBR-5XXX
DATE CODE (YYWW)
SINGAPORE
+ 0.08
- 0.05
+ 0.003
)
(0.030
- 0.002
5.93 ± 0.1
(0.233 ± 0.004)
0.75
3.30 ± 0.38
(0.130 ± 0.015)
10.35
MAX.
(0.407)
2.92
(0.115)
ø
23.55
(0.927)
18.52
(0.729)
4.14
(0.163)
0.46
(9x)
(0.018)
NOTE 1
20.32
[8x(2.54/.100)]
(0.800)
16.70
(0.657)
0.87
(0.034)
+ 0.25
- 0.05
+ 0.010
)
(0.050
- 0.002
NOTE 1
1.27
17.32 20.32 23.32
(0.682) (0.800) (0.918)
23.24
(0.915)
15.88
(0.625)
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 2. SC Package Outline Drawing with Standard Height.
4
42 MAX.
(1.654)
5.99
(0.236)
24.8
(0.976)
12.7
(0.500)
25.4
MAX.
(1.000)
HFBR-5103T
DATE CODE (YYWW)
SINGAPORE
+ 0.08
0.5
- 0.05
(0.020) + 0.003
- 0.002
(
12.0
MAX.
(0.471)
3.2
(0.126)
φ 0.46
(0.018)
NOTE 1
3.3 ± 0.38
(0.130) (± 0.015)
20.32 ± 0.38
(± 0.015)
φ 2.6
(0.102)
+ 0.25
- 0.05
+ 0.010
0.050
- 0.002
1.27
(
20.32
17.4
[(8x (2.54/0.100)]
(0.800)
(0.685)
22.86
21.4
(0.900)
(0.843)
3.6
(0.142)
(
20.32
(0.800)
1.3
(0.051)
23.38
(0.921)
18.62
(0.733)
NOTE 1: PHOSPHOR BRONZE IS THE BASE MATERIAL FOR THE POSTS & PINS
WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS IN MILLIMETERS (INCHES).
Figure 2a. ST Package Outline Drawing with Standard Height.
(
5
29.6 UNCOMPRESSED
(1.16)
39.6
(1.56) MAX.
4.7
(0.185)
AREA
RESERVED
FOR
PROCESS
PLUG
A
25.4
(1.00)MAX.
12.70
(0.50)
12.7
(0.50)
0.51
SLOT DEPTH (0.02)
+0.1
0.25 -0.05
+0.004
0.010 -0.002
(
)
9.8 MAX.
(0.386)
SLOT WIDTH
2.09 UNCOMPRESSED
(0.08)
10.2 MAX.
(0.40)
1.3
(0.05)
3.3 ± 0.38
(0.130 ± 0.015)
+0.25
0.46 -0.05
9X ∅
+0.010
0.018 -0.002
(
20.32
23.8
(0.937) (0.800)
2X ∅
20.32
(0.80)
2.0 ± 0.1
(0.079 ± 0.004)
15.8 ± 0.15
(0.622 ± 0.006)
)
8X 2.54
(0.100)
2X ∅
+0.25
1.27 -0.05
+0.010
0.050 -0.002
(
20.32
(0.800)
1.3
(0.051)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 2b. Package Outline Drawing with Mezzanine Height and Extended Shield.
)
6
39.6
(1.56) MAX.
12.7
(0.50)
4.7
(0.185)
1.01
(0.40)
AREA
RESERVED
FOR
PROCESS
PLUG
A
25.4
(1.00)MAX.
25.8 MAX.
(1.02)
+0.1
0.25 -0.05
+0.004
0.010 -0.002
(
+0.25
0.46 -0.05
9x ∅
+0.010
0.018 -0.002
(
20.32
23.8
(0.937) (0.800)
2x ∅
SLOT DEPTH 2.2
(0.09)
SLOT WIDTH 2.0 ± 0.1
(0.079 ± 0.004)
14.4
(0.57)
9.8 MAX.
(0.386)
22.0
(0.87)
20.32
(0.800)
15.8 ± 0.15
(0.622 ± 0.006)
)
2x ∅
+0.25
1.27 -0.05
+0.010
0.050 -0.002
(
AREA
RESERVED
FOR
PROCESS
PLUG
8x 2.54
(0.100)
1.3
(0.051)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 2c. Package Outline Drawing with Mezzanine Height and Flush Shield.
1 = VEE
N/C
2 = RD
Rx
3 = RD
4 = SD
5 = VCC
6 = VCC
7 = TD
Tx
8 = TD
N/C
9 = VEE
TOP VIEW
Figure 3. Pin Out Diagram.
12.7
(0.50)
10.2 MAX.
(0.40)
)
3.3 ± 0.38
(0.130 ± 0.015)
29.7
(1.17)
20.32
(0.800)
)
7
Transceiver Optical Power
Budget versus Link Length
Optical Power Budget (OPB) is
the available optical power for a
fiber optic link to accommodate
fiber cable losses plus losses due
to in-line connectors, splices,
optical switches, and to provide
margin for link aging and
unplanned losses due to cable
plant reconfiguration or repair.
Figure 4 illustrates the predicted
OPB associated with the three
transceivers series specified in
this data sheet at the Beginning of
Life (BOL). These curves represent the attenuation and chromatic
plus modal dispersion losses
associated with the 62.5/125 µm
and 50/125 µm fiber cables only.
The area under the curves
represents the remaining OPB at
any link length, which is available
for overcoming non-fiber cable
losses.
Agilent LED technology has
produced 1300 nm LED devices
with lower aging characteristics
than normally associated with
these technologies in the industry.
The industry convention is 1.5 dB
aging for 1300 nm LEDs. The
1300 nm Agilent LEDs are
specified to experience less than
1 dB of aging over normal
commercial equipment mission
life periods. Contact your Agilent
sales representative for additional
details.
Figure 4 was generated for the
1300 nm transceivers with an
Agilent fiber optic link model
containing the current industry
conventions for fiber cable
specifications and the draft ANSI
T1E1.2. These optical parameters
are reflected in the guaranteed
performance of the transceiver
specifications in this data sheet.
This same model has been used
extensively in the ANSI and IEEE
committees, including the ANSI
T1E1.2 committee, to establish
the optical performance
requirements for various fiber
optic interface standards. The
cable parameters used come from
the ISO/IEC JTC1/SC 25/WG3
Generic Cabling for Customer
Premises per DIS 11801 document and the EIA/TIA-568-A
Commercial Building
Telecommunications Cabling
Standard per SP-2840.
Transceiver Signaling
Operating Rate Range and BER
Performance
For purposes of definition, the
symbol (Baud) rate, also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to
encode the data (symbols/bit).
When used in 155 Mbps SONET
OC-3 applications the performance of the 1300 nm transceivers,
HFBR-5204/5205 is guaranteed
to the full conditions listed in
individual product specification
tables.
12
HFBR-5205, 62.5/125 µm
OPTICAL POWER BUDGET (dB)
The following information is
provided to answer some of the
most common questions about
the use of these parts.
10
8
HFBR-5205,
50/125 µm
6
HFBR-5204,
62.5/125 µm
4
2
HFBR-5204,
50/125 µm
0
0.3 0.5
1.0
1.5
2.0
FIBER OPTIC CABLE LENGTH (km)
Figure 4. Optical Power Budget vs.
Fiber Optic Cable Length.
2.5
8
The transceivers may be used for
other applications at signaling
rates different than 155 Mbps
with some variation in the link
optical power budget. Figure 5
gives an indication of the typical
performance of these products at
different rates.
Table B1 of Annex B of the draft
ANSI T1E1.2 Revision 3 standard.
These transceivers can also be
used for applications which
require different Bit Error Rate
(BER) performance. Figure 6
illustrates the typical trade-off
between link BER and the
receivers input optical power
level.
The Agilent 1300 nm receivers
will tolerate the worst case input
optical jitter allowed in Annex B
without violating the worst case
output electrical jitter allowed.
The jitter specifications stated in
the following 1300 nm transceiver
specification tables are derived
from the values in Table B1 of
Annex B. They represent the
worst case jitter contribution that
the transceivers are allowed to
make to the overall system jitter
Recommended Handling
Precautions
Agilent recommends that normal
static precautions be taken in the
handling and assembly of these
transceivers to prevent damage
which may be induced by
electrostatic discharge (ESD).
The HFBR-5200 series of
transceivers meet MIL-STD-883C
Method 3015.4 Class 2 products.
Care should be used to avoid
shorting the receiver data or
signal detect outputs directly to
ground without proper current
limiting impedance.
2.5
1 x 10-2
2.0
1 x 10-3
1.5
BIT ERROR RATE
TRANSCEIVER RELATIVE OPTICAL POWER BUDGET
AT CONSTANT BER (dB)
Transceiver Jitter
Performance
The Agilent 1300 nm transceivers
are designed to operate per the
system jitter allocations stated in
The Agilent 1300 nm transmitters
will tolerate the worst case input
electrical jitter allowed in Annex
B without violating the worst case
output optical jitter requirements.
without violating the Annex B
allocation example. In practice,
the typical contribution of the
Agilent transceivers is well below
these maximum allowed amounts.
1.0
0.5
0
0.5
0
25
50
75
100
125
150
175 200
SIGNAL RATE (MBd)
CONDITIONS:
1. PRBS 27-1
2. DATA SAMPLED AT CENTER OF DATA SYMBOL.
3. BER = 10-6
4. TA = 25° C
5. VCC = 5 Vdc
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
Figure 5. Transceiver Relative Optical Power Budget
at Constant BER vs. Signaling Rate.
1 x 10-4
HFBR-5204/5205
SERIES
1 x 10-5
1 x 10-6
CENTER OF SYMBOL
1 x 10-7
1 x 10-8
1 x 10-9
1 x 10-10
1 x 10-11
1 x 10-12
-6
-4
-2
0
2
4
RELATIVE INPUT OPTICAL POWER – dB
CONDITIONS:
1. 155 MBd
2. PRBS 27-1
3. CENTER OF SYMBOL SAMPLING.
4. TA = 25° C
5. VCC = 5 Vdc
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
Figure 6. Bit Error Rate vs. Relative Receiver Input
Optical Power.
9
optical subassemblies during
wave solder and aqueous wash
processing and acts as a dust
cover during shipping.
Solder and Wash Process
Compatibility
The transceivers are delivered
with protective process plugs
inserted into the duplex SC or
duplex ST connector receptacle.
This process plug protects the
These transceivers are compatible
with either industry standard
wave or hand solder processes.
Rx
Tx
NO INTERNAL CONNECTION
NO INTERNAL CONNECTION
HFBR-520X
TOP VIEW
Rx
VEE
1
RD
2
RD
3
SD
4
Rx
VCC
5
Tx
VCC
6
C1
TERMINATION
AT PHY
DEVICE
INPUTS
VCC
C3
R7
R1
C4
TERMINATION
AT TRANSCEIVER
INPUTS
R10
RD
RD
SD
VCC
R4
C5
R9
R8
Tx
VEE
9
VCC
R2
R3
L2
VCC FILTER
AT VCC PINS
TRANSCEIVER
C6
R6
TD
8
C2
L1
R5
TD
7
TD
TD
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
R1 = R4 = R6 = R8 = R10 = 130 OHMS.
R2 = R3 = R5 = R7 = R9 = 82 OHMS.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.
Figure 7. Recommended Decoupling and Termination Circuits.
Shipping Container
The transceiver is packaged in a
shipping container designed to
protect it from mechanical and
ESD damage during shipment or
storage.
10
Board Layout – Decoupling
Circuit and Ground Planes
It is important to take care in the
layout of your circuit board to
achieve optimum performance
from these transceivers. Figure 7
provides a good example of a
schematic for a power supply
decoupling circuit that works well
with these parts. It is further
recommended that a contiguous
ground plane be provided in the
circuit board directly under the
transceiver to provide a low
inductance ground for signal
return current. This recommendation is in keeping with good
high frequency board layout
practices.
Board Layout – Hole Pattern
The Agilent transceiver complies
with the circuit board “Common
(2X) ø
20.32
.800
1.9 ± 0.1
.075 ± .004
Ø0.000
(9X) ø
20.32
.800
0.8 ± 0.1
.032 ± .004
Ø0.000
(8X)
2.54
.100
TOP VIEW
Figure 8. Recommended Board Layout Hole Pattern.
M A
M A
Transceiver Footprint” hole
pattern defined in the original
multisource announcement which
defined the 1x9 package style.
This drawing is reproduced in
Figure 8 with the addition of ANSI
Y14.5M compliant dimensioning
to be used as a guide in the
mechanical layout of your circuit
board.
–A–
11
Board Layout – Art Work
The Applications Engineering
group is developing Gerber file
art work for a multilayer printed
circuit board layout incorporating
the recommendations above.
Contact your local Agilent sales
representative for details.
duplex SC or a duplex ST connector interface, while utilizing
the same pinout on the printed
circuit board, the ST port needs
to protrude from the chassis
panel a minimum of 9.53 nm for
sufficient clearance to install the
ST connector.
Board Layout – Mechanical
For applications interested in
providing a choice of either a
Please refer to Figure 8a for a
mechanical layout detailing the
recommended location of the
duplex SC and duplex ST
transceiver packages in relation
to the chassis panel.
For both shielded design options,
Figures 8b and 8c identify front
panel aperture dimensions.
Regulatory Compliance
These transceiver products are
intended to enable commercial
system designers to develop
equipment that complies with the
various international regulations
governing certification of Information Technology Equipment.
See the Regulatory Compliance
Table for details. Additional
information is available from your
Agilent sales representative.
42.0
12.0
24.8
9.53
(NOTE 1)
0.51
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage is
important.
12.09
25.4
The first case is during handling
of the transceiver prior to
mounting it on the circuit board.
It is important to use normal ESD
handling precautions for ESD
sensitive devices. These precautions include using grounded
wrist straps, work benches, and
floor mats in ESD controlled
areas.
39.12
11.1
6.79
0.75
25.4
NOTE 1: MINIMUM DISTANCE FROM FRONT
OF CONNECTOR TO THE PANEL FACE.
Figure 8a. Recommended Common Mechanical Layout for ST and ST 1x9
Connectored Transceivers.
The second case to consider is
static discharges to the exterior of
the equipment chassis containing
the transceiver parts. To the
extent that the duplex SC
connector is exposed to the
outside of the equipment chassis
it may be subject to whatever ESD
system level test criteria that the
equipment is intended to meet.
A
12
0.8
2x (0.032)
0.8
2x (0.032)
+ 0.5
10.9 – 0.25
+ 0.02
0.43 – 0.01
(
9.4
(0.374)
6.35
(0.25)
MODULE
PROTRUSION
)
27.4 ± 0.50
(1.08 ± 0.02)
PCB BOTTOM VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 8b. Dimensions Shown for Mounting Module with Extended Shield to Panel.
Electromagnetic Interference
(EMI)
Most equipment designs utilizing
these high speed transceivers
from Agilent will be required to
meet the requirements of FCC in
the United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan.
These products are suitable for
use in designs ranging from a
desktop computer with a single
transceiver to a concentrator or
switch product with large number
of transceivers.
In all well-designed chassis, the
two 0.5" holes required for ST
connectors to protrude through,
will provide 4.6 dB more
shielding than one 1.2" duplex SC
rectangular cutout. Thus, in a
well-designed chassis, the duplex
ST 1x9 transceiver emissions will
be identical to the duplex SC 1x9
transceiver emissions.
13
5
3.0
180
1.0
160
1.5
140
2.0
tr/f – TRANSMITTER
OUTPUT OPTICAL
RISE/FALL TIMES – ns
2.5
120
3.0
100
1260
1280
1300
1320
1340
1360
λC – TRANSMITTER OUTPUT OPTICAL
CENTER WAVELENGTH –nm
HFBR-5205 TRANSMITTER TEST RESULTS
OF λC, ∆λ AND tr/f ARE CORRELATED AND
COMPLY WITH THE ALLOWED SPECTRAL WIDTH
AS A FUNCTION OF CENTER WAVELENGTH FOR
VARIOUS RISE AND FALL TIMES.
Figure 9. Transmitter Output Optical Spectral Width
(FWHM) vs. Transmitter Output Optical Center
Wavelength and Rise/Fall Times.
RELATIVE INPUT OPTICAL POWER (dB)
∆λ – TRANSMITTER OUTPUT OPTICAL
SPECTRAL WIDTH (FWHM) –nm
200
4
3
HFBR-5204/-5205
SERIES
2
1
0
-3
-2
-1
0
1
2
3
EYE SAMPLING TIME POSITION (ns)
CONDITIONS:
1.TA = 25° C
2. VCC = 5 Vdc
3. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
4. INPUT OPTICAL POWER IS NORMALIZED TO
CENTER OF DATA SYMBOL.
5. NOTE 16 AND 17 APPLY.
Figure 10. Relative Input Optical Power vs. Eye Sampling
Time Position.
Regulatory Compliance Table
Feature
Test Method
Electrostatic Discharge
(ESD) to the Electrical
Pins
Electrostatic Discharge
(ESD) to the Duplex SC
Receptacle
Electromagnetic
Interference (EMI)
MIL-STD-883C
Method 3015.4
Immunity
Variation of IEC 801-3
Variation of
IEC 801-2
FCC Class B
CENELEC EN55022
Class B (CISPR 22B)
VCCI Class 2
Performance
Meets Class 2 (2000 to 3999 Volts)
Withstand up to 2200 V applied between electrical
pins.
Typically withstand at least 25 kV without damage
when the Duplex SC Connector Receptacle
is contacted by a Human Body Model probe.
Transceivers typically provide a 13 dB margin
(with duplex SC receptacle) or a 9 dB margin
(with duplex ST receptacles) to the noted
standard limits when tested at a certified test
range with the transceiver mounted to a circuit
card without a chassis enclosure.
Typically show no measurable effect from a
10 V/m field swept from 10 to 450 MHz applied
to the transceiver when mounted to a circuit card
without a chassis enclosure.
14
A
1.98 THICKER PANEL WILL RECESS MODULE.
(0.078) THINNER PANEL WILL PROTRUDE MODULE.
1.27 OPTIONAL SEPTUM
(0.05)
30.2
(1.19)
0.36
(0.014)
KEEP OUT ZONE
10.82
(0.426)
13.82
(0.544)
26.4
(1.04)
BOTTOM SIDE OF PCB
12.0
(0.47)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 8c. Dimensions Shown for Mounting Module Flush to Panel.
14.73
(0.58)
15
Immunity
Equipment utilizing these transceivers will be subject to radiofrequency electromagnetic fields
in some environments. These
transceivers have a high immunity
to such fields.
For additional information regarding EMI, susceptibility, ESD and
conducted noise testing procedures and results on the 1x9
transceiver family, please refer to
Applications Note 1075, Testing
and Measuring Electromagnetic Compatibility
Performance of the HFBR510X/-520X Fiber Optic
Transceivers.
Transceiver Reliability
and Performance
Qualification Data
The 1 x 9 transceivers have
passed Agilent reliability and
performance qualification testing
and are undergoing ongoing
quality monitoring. Details are
available from your Agilent sales
representative.
These transceivers are
manufactured at the Agilent
Singapore location which is an
ISO 9002 certified facility.
Applications Support
Materials
Contact your local Agilent
Component Field Sales Office for
information on how to obtain PCB
Layouts, Test Boards and demo
boards for the 1x9 transceivers.
Evaluation Kits
Agilent has available three
evaluation kits for the 1x9
transceivers. The purpose of these
kits is to provide the necessary
materials to evaluate the performance of the HFBR-520X family in
a pre-existing 1x13 or 2x11
pinout system design configuration or when connectored to
various test equipment.
1. HFBR-0319 – Evaluation Test
Fixture Board:
This test fixture converts +5 V
ECL 1x9 transceivers to –5 V
ECL BNC Coax Connections so
that direct connections to
industry standard fiber optic
test equipment can be
accomplished.
Accessory Duplex SC
Connectored Cable Assemblies
Agilent recommends for optimal
coupling the use of flexible-body
duplex SC connectored cable.
Accessory Duplex ST
Connectored Cable Assemblies
Agilent recommends the use of
Duplex Push-Pull ST connectored
cable for optimal repeatibility of
the optical power coupling.
16
HFBR-5204, and -5205 Series
Absolute Maximum Ratings
Parameter
Storage Temperature
Symbol
Min.
TS
-40
Typ.
Max.
Unit
100
°C
Lead Soldering Temperature
TSOLD
260
°C
Lead Soldering Time
tSOLD
10
sec.
Supply Voltage
VCC
-0.5
7.0
V
Data Input Voltage
VI
-0.5
VCC
V
Differential Input Voltage
VD
1.4
V
Output Current
IO
50
mA
Max.
Unit
Reference
Note 1
HFBR-5204, and -5205 Series
Recommended Operating Conditions
Parameter
Symbol
Min.
Ambient Operating Temperature*
TA
0
70
°C
Supply Voltage
VCC
4.75
5.25
V
Data Input Voltage - Low
VIL - VCC
-1.810
-1.475
V
Data Input Voltage - High
VIH - VCC
-1.165
-0.880
V
Data and Signal Detect Output Load
RL
Typ.
50
Ω
Reference
Note 2
*Applies to HFBR-5204 and 5205 Series except for HFBR-5205A and HFBR-5205AT. Ambient Operating Temp. for HFBR-5205A
and HFBR-5205AT is Min. -40°C and Max. 85°C.
17
HFBR-5204 and -5205 Series
Transmitter Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)*
Parameter
Symbol
Typ.
Max.
Unit
Reference
ICC
145
185
mA
Note 3
P DISS
0.76
0.97
W
Supply Current
Power Dissipation
Data Input Current - Low
I IL
Data Input Current - High
IIH
Min.
-350
µA
0
14
350
µA
*Applies to HFBR-5204 and 5205 Series except for HFBR-5205A and HFBR-5205AT. TA for HFBR-5205A and HFBR-5205AT
is -40°C and 85°C.
HFBR-5204 and -5205 Series
Receiver Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)*
Parameter
Supply Current
Power Dissipation
Symbol
Min.
Typ.
Max.
Unit
Reference
ICC
82
145
mA
Note 4
P DISS
0.3
0.5
W
Note 5
Data Output Voltage - Low
VOL - VCC
-1.840
-1.620
V
Note 6
Data Output Voltage - High
VOH - VCC
-1.045
-0.880
V
Note 6
Data Output Rise Time
tr
0.35
2.2
ns
Note 7
Data Output Fall Time
tf
0.35
2.2
ns
Note 7
Signal Detect Output Voltage - Low
VOL - VCC
-1.840
-1.620
V
Note 6
Signal Detect Output Voltage - High
VOH - VCC
-1.045
-0.880
V
Note 6
Signal Detect Output Rise Time
tr
0.35
2.2
ns
Note 7
Signal Detect Output Fall Time
tf
0.35
2.2
ns
Note 7
*Applies to HFBR-5204 and 5205 Series except for HFBR-5205A and HFBR-5205AT. TA for HFBR-5205A and HFBR-5205AT
is -40°C and 85°C.
18
HFBR-5204/-5204P/-5204T
Transmitter Optical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter
Output Optical Power
62.5/125 µm, NA = 0.275 Fiber
Output Optical Power
50/125 µm, NA = 0.20 Fiber
Optical Extinction Ratio
BOL
EOL
Symbol
PO
Min.
-21
-22
PO
-24.5
-25.5
BOL
EOL
Output Optical Power at
Logic “0” State
Center Wavelength
Spectral Width - FWHM
- nm RMS
Typ.
PO (“0”)
λC
∆λ
1270
1310
Max.
-14
Unit
dBm avg.
Reference
Note 8
-14
dBm avg.
Note 8
0.03
-35
%
dB
Note 9
-45
dBm avg.
Note 10
1380
250
107
nm
nm
nm RMS
Note 11
4
4
ns
ns
Note 12
Note 12
Optical Rise Time
Optical Fall Time
tr
tf
Systematic Jitter Contributed
by the Transmitter
Random Jitter Contributed
by the Transmitter
SJ
0.04
1.2
ns p-p
Note 13
RJ
0
0.52
ns p-p
Note 14
Typ.
Max.
-29
Unit
dBm avg.
-30
dBm avg.
Reference
Note 15
Figure 10
Note 16
Figure 10
0.2
1.2
dBm avg.
ns p-p
Note 15
Note 17
1
1.91
ns p-p
Note 18
1380
-31
nm
dBm avg.
Note 19
HFBR-5204/-5204P/-5204T
Receiver Optical and Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter
Input Optical Power
Minimum at Window Edge
Input Optical Power
Minimum at Eye Center
Input Optical Power Maximum
Systematic Jitter Contributed
by the Receiver
Symbol
PIN Min. (W)
Min.
PIN Min. (C)
PIN Max.
SJ
-14
Random Jitter Contributed
by the Receiver
Operating Wavelength
Signal Detect - Asserted
RJ
λ
PA
1270
PD + 1.5 dB
Signal Detect - Deasserted
Signal Detect - Hysteresis
PD
PA - PD
-45
1.5
Signal Detect Assert Time
(off to on)
Signal Detect Deassert Time
(on to off)
dBm avg.
dB
Note 20
0
55
100
µs
Note 21
0
110
350
µs
Note 22
19
HFBR-5205/-5205A/-5205AT/-5205P/-5205T/-5205PE
Transmitter Optical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)*
Parameter
Output Optical Power
62.5/125 µm, NA = 0.275 Fiber
Output Optical Power
50/125 µm, NA = 0.20 Fiber
Optical Extinction Ratio
Output Optical Power at
Logic "0" State
Center Wavelength
BOL
EOL
BOL
EOL
Symbol
Min.
PO
-19
-20
-22.5
-23.5
PO
Typ.
0.001
-50
PO ("0")
λC
Max.
Unit
Reference
-14
dBm avg.
Note 8
-14
dBm avg.
Note 8
0.03
-35
%
dB
Note 9
-45
dBm avg.
Note 10
1380
nm
Note 23
Figure 9
Note 23
Figure 9
Note 11, 23
Figure 9
Note 11, 23
Figure 9
1270
1310
tr
0.6
137
58
1.0
3.0
nm
nm RMS
ns
Optical Fall Time
tf
0.6
2.1
3.0
ns
Systematic Jitter Contributed
by the Transmitter
Random Jitter Contributed
by the Transmitter
SJ
0.04
1.2
ns p-p
Note 13
RJ
0
0.52
ns p-p
Note 14
Spectral Width – FWHM
– nm RMS
Optical Rise Time
∆λ
*Applies to 5205 Series except for HFBR-5205A/-5205AT. TA for HFBR-5205A/-5205AT is -40°C and 85°C.
20
HFBR-5205/-5205A/-5205AT/-5205P/-5205T/-5205PE
Receiver Optical and Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)*
Parameter
Input Optical Power
Minimum at Window Edge
Symbol
PIN Min. (W)
Input Optical Power
Minimum at Eye Center
Input Optical Power Maximum
PIN Min. (C)
Operating Wavelength
Systematic Jitter Contributed
by the Receiver
Random Jitter Contributed
by the Receiver
Min.
PIN Max.
-14
λ
SJ
1260
RJ
Typ.
Max.
-30
Unit
dBm avg.
Reference
Note 15
Figure 10
-31
dBm avg.
dBm avg.
Note 16
Figure 10
Note 15
0.2
1360
1.2
nm
ns p-p
Note 17
1
1.91
ns p-p
Note 18
-31
dBm avg.
dBm avg.
Note 19
Note 20
Note 21
Signal Detect - Asserted
Signal Detect - Deasserted
PA
PD
PD + 1.5 dB
-45
Signal Detect - Hysteresis
Signal Detect Assert Time
(off to on)
Signal Detect Assert Time
(off to on)
PA - PD
1.5
0
55
100
dB
µs
Max
0
55
130
µs
Note 21
Max
0
55
130
µs
Note 21
0
110
350
µs
Note 22
Signal Detect Assert Time
(off to on) for -40°C to 0°C
Signal Detect Deassert Time
(on to off)
*Applies to 5205 Series except for HFBR-5205A. TA for HFBR-5205A is -40°C to 85°C.
Notes:
1. This is the maximum voltage that
can be applied across the Differential
Transmitter Data Inputs to prevent
damage to the input ESD protection
circuit.
2. The outputs are terminated with
50 Ω connected to VCC -2 V.
3. The power supply current needed to
operate the transmitter is provided
to differential ECL circuitry. This
circuitry maintains a nearly constant current flow from the power
supply. Constant current operation
helps to prevent unwanted electrical
noise from being generated and
conducted or emitted to neighboring
circuitry.
4. This value is measured with the
outputs terminated into 50 Ω
connected to VCC -2 V and an Input
Optical Power level of -14 dBm
average.
5. The power dissipation value is the
power dissipated in the receiver
itself. Power dissipation is calculated as the sum of the products of
supply voltage and currents, minus
the sum of the products of the
output voltages and currents.
6. This value is measured with respect
to VCC with the output terminated
into 50 Ω connected to V CC -2 V.
7. The output rise and fall times are
measured between 20% and 80%
levels with the output connected to
VCC -2 V through 50 Ω.
8. These optical power values are
measured with the following
conditions:
• The Beginning of Life (BOL) to
the End of Life (EOL) optical
power degradation is typically
1.5 dB per the industry convention for long wavelength LEDs.
The actual degradation observed
in Agilent’s 1300 nm LED
products is <1 dB, as specified in
this datasheet.
• Over the specified operating
voltage and temperature ranges.
• With 25 MBd (12.5 MHz squarewave) input signal.
• At the end of one meter of noted
optical fiber with cladding modes
removed.
The average power value can be
converted to a peak power value
by adding 3 dB. Higher output
optical power transmitters are
available on special request.
9. The Extinction Ratio is a measure of
the modulation depth of the optical
signal. The data “0” output optical
power is compared to the data “1”
21
peak output optical power and
expressed as a percentage. With the
transmitter driven by a 25 MBd
(12.5 MHz square-wave) input
signal, the average optical power is
measured. The data “1” peak power
is then calculated by adding 3dB to
the measured average optical power.
The data “0” output optical power is
found by measuring the optical
power when the transmitter is
driven by a logic “0” input. The
extinction ratio is the ratio of the
optical power at the “0” level
compared to the optical power at the
“1” level expressed as a percentage
or in decibels.
10. The transmitter will provide this low
level of Output Optical Power when
driven by a logic “0” input. This can
be useful in link troubleshooting.
11. The relationship between Full Width
Half Maximum and RMS values for
Spectral Width is derived from the
assumption of a Gaussian shaped
spectrum which results in a 2.35 X
RMS = FWHM relationship.
12. The optical rise and fall times are
measured from 10% to 90% when
the transmitter is driven by a 25
MBd (12.5 MHz square-wave) input
signal. The ANSI T1E1.2 committee
has designated the possibility of
defining an eye pattern mask for the
transmitter optical output as an
item for further study. Agilent will
incorporate this requirement into
the specifications for these products
if it is defined. The HFBR-5204 and
HFBR-5205 products typically
comply with the template requirements of CCITT (now ITU-T) G.957
Section 3.2.5, Figure 2 for the STM1 rate, excluding the optical receiver
filter normally associated with
single mode fiber measurements
which is the likely source for the
ANSI T1E1.2 committee to follow in
this matter.
13. Systematic Jitter contributed by the
transmitter is defined as the combination of Duty Cycle Distortion
and Data Dependent Jitter.
Systematic Jitter is measured at
50% threshold using a 155.52 MBd
(77.5 MHz square-wave), 27 - 1
psuedorandom data pattern input
signal.
14. Random Jitter contributed by the
transmitter is specified with a
155.52 MBd (77.5 MHz squarewave) input signal.
15. This specification is intended to
indicate the performance of the
receiver section of the transceiver
when Input Optical Power signal
characteristics are present per the
following definitions. The Input
Optical Power dynamic range from
the minimum level (with a window
time-width) to the maximum level is
the range over which the receiver is
guaranteed to provide output data
with a Bit Error Ratio (BER) better
than or equal to 1 x 10-10.
• At the Beginning of Life (BOL)
• Over the specified operating
temperature and voltage ranges
• Input is a 155.52 MBd, 2 23 - 1
PRBS data pattern with 72 “1”s
and 72 “0”s inserted per the
CCITT (now ITU-T) recommendation G.958 Appendix I.
• Receiver data window time-width
is 1.23 ns or greater for the clock
recovery circuit to operate in. The
actual test data window timewidth is set to simulate the effect
of worst case optical input jitter
based on the transmitter jitter
values from the specification
tables. The test window timewidths are as follows: HFBR-5205
and HFBR-5204 are 3.32 ns.
• Transmitter operating with a
155.52 MBd, 77.5 MHz squarewave, input signal to simulate
any cross-talk present between
the transmitter and receiver
sections of the transceiver.
16. All conditions of Note 15 apply except
that the measurement is made at
the center of the symbol with no
window time-width.
17. Systematic Jitter contributed by the
receiver is defined as the combination of Duty Cycle Distortion and
Data Dependent Jitter. Systematic
Jitter is measured at 50% threshold
using a 155.52 MBd (77.5 MHz
square-wave), 27 - 1 psuedorandom
data pattern input signal.
18. Random Jitter contributed by the
receiver is specified with a 155.52
MBd (77.5 MHz square-wave) input
signal.
19. This value is measured during the
transition from low to high levels of
input optical power.
20. This value is measured during the
transition from high to low levels of
input optical power.
21. The Signal Detect output shall be
asserted within 100 µs after a step
increase of the Input Optical Power
(130 µs for -40°C to 0°C).
22. Signal detect output shall be deasserted within 350 µs after a step
decrease in the Input Optical Power.
23. The HFBR-5205 transceiver
complies with the requirements for
the tradeoffs between center wavelength, spectral width, and rise/fall
times shown in Figure 9. This figure
is derived from the FDDI PMD
standard (ISO/IEC 9314-3 : 1990
and ANSI X3.166 - 1990) per the
description in ANSI T1E1.2 Revision
3. The interpretation of this figure is
that values of Center Wavelength
and Spectral Width must lie along
the appropriate Optical Rise/Fall
Time curve.
22
Ordering Information
The following 1300 nm
transceivers are available for
production orders through the
Agilent Component Field Sales
Offices and Authorized
Distributors world wide.
*For flush shield options, please
contact Field Sales Offices and
Authorized Distributors world
wide.
1300nm LED, ATM/SONET OC-3, 155MBd temperature range 0°C to +70°C
HFBR-5204
DuplesSC Connector1X9, 500M
HFBR-5204T Duplex ST Connector 1X9
HFBR-5204P Duplex SC Connector, Mezzanine Height
HFBR-5205
DUPLEX SC Connector 1X9, 2KM
HFBR-5205T Duplex ST Connector 1X9
HFBR-5205P Duplex SC Connector 1x9, Mezzanine Height
HFBR-5205PE Duplex SC Connector 1x9, Mezzanine Height with Extended Shield
1300nm LED, 155MBd temperature range -40°C to +85°C
HFBR-5205A ATM/SONET OC-3 DUPLEX SC Connector 1X9
HFBR-5205AT ATM/SONET OC-3 DUPLEX ST Connector1X9
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes 5988-4379EN
April 6, 2002
5988-5710EN