HLMP-RG10 4 mm Super Oval Precision Optical Performance AlInGaP and InGaN LEDs Data Sheet SunPower Series HLMP-RG10, HLMP-SG10, HLMP-RL10, HLMP-SL10, HLMP-RD11, HLMP-SD11, HLMP-RL11, HLMP-SL11, HLMP-RM11, HLMP-SM11, HLMP-RB11, HLMP-SB11 Description These Precision Optical Performance Oval LEDs are specifically designed for Full Color/Video and Passenger Information signs. The oval shaped radiation pattern (60° x 120°) and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED materials are used in these lamps: Aluminum Indium Gallium Phosphide (AlInGaP) for Red and Amber color and Indium Gallium Nitride (InGaN) for Blue and Green. There are two families of red and amber lamps, AlInGaP and the higher performance AlInGaP II. Each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long term exposure to direct sunlight. Designers can select parallel (where the axis of the leads is parallel to the wide axis of the oval radiation pattern) or perpendicular orientation. Both lamps are available in tinted version. Features • Well defined spatial radiation pattern • Viewing angle: major axis 120° minor axis 60° • High luminous output • Two red and amber intensity levels: AlInGaP (bright) and AlInGaP II (brightest) • Colors: 626/630 nm red 590/592 nm amber526 nm green 470 nm blue • Superior resistance to moisture • UV resistant epoxy Benefits • Viewing angle designed for wide field of view applications • Superior performance for outdoor environments • Radiation pattern matched for red, green, and blue for full color sign Applications • Full color signs CAUTION: The Blue and Green LEDs are Class 1 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Package Dimensions 21.0 MIN. (0.827) 9.50 ± 0.50 (0.374 ± 0.007) A ∅ 4.0 ± 0.20 (0.157 ± 0.008) 1.0 MIN. (0.039) 6.30 ± 0.20 (0.248 ± 0.008) 1.25 ± 0.20 (0.049 ± 0.008) CATHODE LEAD 0.44 ± 0.20 (0.017 ± 0.008) 2.54 ± 0.30 (0.100 ± 0.012) 0.80 MAX. EPOXY MENISCUS (0.016) +0.10 0.45 –0.04 +0.10 0.40 –0 +0.004 (0.018 –0.002) +0.004 (0.016 –0.000) 21.0 MIN. (0.827) 9.50 ± 0.50 (0.374 ± 0.007) B ∅ 4.0 ± 0.20 (0.157 ± 0.008) 1.0 MIN. (0.039) 6.30 ± 0.20 (0.248 ± 0.008) 1.25 ± 0.20 (0.049 ± 0.008) CATHODE LEAD 0.44 ± 0.20 (0.017 ± 0.008) 2.54 ± 0.30 (0.100 ± 0.012) 0.80 MAX. EPOXY MENISCUS (0.016) +0.10 0.45 –0.04 +0.10 0.40 –0 +0.004 (0.018 –0.002) +0.004 (0.016 –0.000) DIMENSIONS ARE IN MILLIMETERS (INCHES). Device Selection Guide for AlInGaP Part Number Color and Dominant Wavelength λd (nm) Typ. Luminous Intensity IV (mcd) at 20 mA Min. Max. Leads with Stand-Offs Leadframe Orientation Package Drawing HLMP-SG10-JM000 Red 626 240 680 Yes Perpendicular A HLMP-RG10-JM000 Red 626 240 680 Yes Parallel B HLMP-SL10-LP0xx Amber 590 400 1150 Yes Perpendicular A HLMP-RL10-LP0xx Amber 590 400 1150 Yes Parallel B Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 2 Device Selection Guide for AlInGaP II Part Number Color and Dominant Wavelength λd (nm) Typ. Luminous Intensity IV (mcd) at 20 mA Min. Max. Leads with Stand-Offs Leadframe Orientation Package Drawing HLMP-RD11-J0000 Red 630 240 - Yes Parallel B HLMP-RD11-LP000 Red 630 400 1150 Yes Parallel B HLMP-RD11-LPT00 Red 630 400 1150 Yes Parallel B HLMP-RL11-H0000 Amber 592 180 - Yes Parallel B HLMP-RL11-LP000 Amber 592 400 1150 Yes Parallel B HLMP-RL11-LPRxx Amber 592 400 1150 Yes Parallel B HLMP-SD11-J0000 Red 630 240 - Yes Perpendicular A HLMP-SD11-LP000 Red 630 400 1150 Yes Perpendicular A HLMP-SD11-LPT00 Red 630 400 1150 Yes Perpendicular A HLMP-SD11-MN0xx Red 630 520 880 Yes Perpendicular A HLMP-SD11-MNTxx Red 630 520 880 Yes Perpendicular A HLMP-SL11-H0000 Amber 592 180 - Yes Perpendicular A HLMP-SL11-HL0xx Amber 592 180 520 Yes Perpendicular A HLMP-SL11-KN0xx Amber 592 310 880 Yes Perpendicular A HLMP-SL11-LP0xx Amber 592 400 1150 Yes Perpendicular A HLMP-SL11-LPRxx Amber 592 400 1150 Yes Perpendicular A Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. Device Selection Guide for InGaN Part Number Color and Dominant Wavelength λd (nm) Typ. Luminous Intensity IV (mcd) at 20 mA Min. Max. Leads with Stand-Offs Leadframe Orientation Package Drawing HLMP-SM11-LP0xx Green 526 400 1150 Yes Perpendicular A HLMP-RM11-H00xx Green 526 180 - Yes Parallel B HLMP-RM11-M00xx Green 526 520 - Yes Parallel B HLMP-SB11-H00xx Blue 470 180 - Yes Perpendicular A HLMP-RB11-D00xx Blue 470 65 - Yes Parallel B HLMP-RB11-H00xx Blue 470 180 - Yes Parallel B Notes: 4. The luminous intensity is measured on the mechanical axis of the lamp package. 5. The optical axis is closely aligned with the package mechanical axis. 6. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 3 Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk Packaging DD: Ammo Pack YY: Flexi-Bin; Bulk Packaging ZZ: Flexi-Bin; Ammo Pack Color Bin & VF Selections 0: No Color Bin Limitation R: Amber Color Bins 1, 2, 4, and 6 with VF Maximum of 2.6 V T: Red Color with VF Maximum of 2.6 V Maximum Intensity Bin 0: No Iv Bin Limitation Minimum Intensity Bin Refer to Device Selection Guide Color B: 470 nm Blue D: 630 nm Red G: 626 nm Red L: 590/592 nm Amber M: 526 nm Green Package R: 4 mm 60º x 120º Oval, Parallel S: 4 mm 60º x 120º Oval, Perpendicular Absolute Maximum Ratings TA = 25°C Parameter Blue and Green Amber and Red 30 mA 50 mA Peak Pulsed Forward Current 100 mA 100 mA Average Forward Current 30 mA 30 mA Reverse Voltage (IR = 100 µA) 5V 5V Power Dissipation 120 mW 120 mW LED Junction Temperature 130°C 130°C Operating Temperature Range –40°C to +80°C –40°C to +100°C Storage Temperature Range –40°C to +100°C –40°C to +120°C DC Forward Current[1] Note: 1. Derate linearly as shown in Figures 6 and 7. 4 Electrical/Optical Characteristics TA = 25°C Parameter Typical Viewing Angle[1] Major Minor Symbol 2θ1/2 Forward Voltage Red (λd = 626 nm) Red (λd = 630 nm) Amber (λd = 590 nm) Amber (λd = 592 nm) Blue (λd = 470 nm) Green (λd = 526 nm) Reverse Voltage Amber and Red Blue and Green Peak Wavelength Red (λd = 626 nm) Red (λd = 630 nm) Amber (λd = 590 nm) Amber (λd = 592 nm) VF LED Indicators Parameter Blue (λd = 470 nm) Green (λd = 526 nm) Spectral Halfwidth Red (λd = 626/630 nm) Amber (λd = 590/592 nm) Blue (λd = 470 nm) Green (λd = 526 nm) Capacitance All Colors Thermal Resistance All Colors Luminous Efficacy[3] Red (λd = 626 nm) Red (λd = 630 nm) Amber (λd = 590 nm) Amber (λd = 592 nm) Blue (λd = 470 nm) Green (λd = 526 nm) Min. Typ. Max. Units deg Test Conditions V IF = 20 mA V IR = 100 µA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Units Test Conditions nm Wavelength Width at Spectral Distribution 1/2 Power Point at I = 20 mA F pF VF = 0, F = 1 MHz °C/W LED Junction-to-Cathode Lead Emitted Luminous Power/ Emitted Radiant Power 120 60 1.9 2.0 2.02 2.15 3.5 3.5 2.4 2.4[2] 2.4 2.4[2] 4.0 4.0 VR 5 5 20 – λPEAK 635 639 592 594 Symbol Min. Typ. 467 524 ∆λ1/2 Max. 17 17 20 35 C 40 RθJ-PIN 240 ηv lm/W 150 155 480 500 70 540 Notes: 1. 2θ1/2 is the off-axis angle where the luminous intensity is the on-axis intensity. 2. For options -xxRxx, -xxTxx, and -xxVxx, maximum forward voltage, VF, is 2.6 V. Please refer to VF Bin Table below. 3. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. 5 1.0 50 GREEN AMBER RED IF – FORWARD CURRENT – mA RELATIVE INTENSITY BLUE 0.5 450 500 600 550 700 650 RED 30 20 AMBER 10 0 1.0 0 400 40 1.5 Figure 1. Relative intensity vs. wavelength. 2.5 20 15 10 5 0 2.0 2.8 2.4 3.2 3.6 2.0 1.5 1.0 0.5 0 4.0 VF – FORWARD VOLTAGE 30 Rθj-a = 780° C/W 20 10 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 6. Amber, Red maximum forward current vs. ambient temperature. 6 120 50 Rθj-a = 585° C/W 25 20 15 10 5 0 0 40 0 0 5 10 15 20 25 Figure 5. Blue, Green relative luminous intensity vs. forward current. 50 Rθj-a = 585° C/W 30 20 Figure 4. Amber, Red relative luminous intensity vs. forward current. 35 30 10 0.5 IF – FORWARD CURRENT – mA 60 40 0 1.0 IF – FORWARD CURRENT – mA IF – FORWARD CURRENT – mA IF – FORWARD CURRENT – mA Figure 3. Blue, Green forward current vs. forward voltage. 3.0 1.5 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT 25 2.5 Figure 2. Amber, Red forward current vs. forward voltage. 35 30 2.0 VF – FORWARD VOLTAGE – V WAVELENGTH – nm 0 20 40 60 80 TA – AMBIENT TEMPERATURE – °C Figure 7. Blue, Green maximum forward current vs. ambient temperature. 100 30 1.0 Intensity Bin Limits (mcd at 20 mA) RELATIVE INTENSITY 0.8 0.6 0.4 0.2 0 -90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90 ANGULAR DISPLACEMENT – DEGREES Figure 8a. Representative spatial radiation pattern for major axis. Bin Name Min. Max. D 65 85 E 85 110 F 110 140 G 140 180 H 180 240 J 240 310 K 310 400 L 400 520 M 520 680 N 680 880 P 880 1150 Tolerance for each bin limit is ± 15%. 1.0 VF Bin Table[2] RELATIVE INTENSITY 0.8 Bin Name VA VB VC 0.6 0.4 Max. 2.2 2.4 2.6 Tolerance for each bin is ± 0.05 V. 0.2 0 -90 Min. 2.0 2.2 2.4 -75 -60 -45 -30 -15 0 15 30 45 60 75 90 ANGULAR DISPLACEMENT – DEGREES Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Figure 8b. Representative spatial radiation pattern for minor axis. Color Bin Limits (nm at 20 mA) Blue Color Range (nm) Bin Min. Max. 1 460.0 464.0 2 464.0 468.0 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 Tolerance for each bin limit is ± 0.5 nm. Green Bin ID 1 2 3 4 5 Color Range (nm) Min. Max. 520.0 524.0 524.0 528.0 528.0 532.0 532.0 536.0 536.0 540.0 Amber Bin ID 1 2 4 6 Color Range (nm) Min. Max. 584.5 587.0 587.0 589.5 589.5 592.0 592.0 594.5 Tolerance for each bin limit is ± 0.5 nm. Tolerance for each bin limit is ± 0.5 nm. Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representatives for further information. 7 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time TEMPERATURE – °C Manual Solder Dipping – – 260 °C Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) BOTTOM SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA 150 FLUXING 100 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME – SECONDS Figure 9. Recommended wave soldering profile. 90 100 Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. TOP SIDE OF PC BOARD 50 30 8 • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Recommended PC board plated through hole sizes for LED component leads: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2793EN 5989-4174EN May 21, 2006