Agilent HLMP-3707 T-13/4 (5 mm), T-1 (3 mm), Ultra-Bright LED Lamps Data Sheet HLMP-3707, -3807, -3907; HLMP-3750, -3850, -3950, -3960 HLMP-3390, -3490, -3590; HLMP-1340, -1440, -1540 HLMP-D640; HLMP-K640 Description These non-diffused lamps outperform conventional LED lamps. By utilizing new higher intensity material, we achieve superior product performance. The HLMP-3750/-3390/-1340 Series Lamps are Gallium Arsenide Phosphide on Gallium Phosphide red light emitting diodes. The HLMP-3850/-3490/-1440 Series are Gallium Arsenide Phosphide on Gallium Phosphide yellow light emitting diodes. The HLMP-3950/-3590/-3960/-1540/ -D640/-K640 Series Lamps are Gallium Phosphide green light emitting diodes. Features • Improved brightness • Improved color performance • Available in popular T-1 and T-13/4 packages • New sturdy leads • IC compatible/low current capability • Reliable and rugged • Choice of 3 bright colors High Efficiency Red High Brightness Yellow High Performance Green Applications • Lighted switches • Backlighting front panels • Light pipe sources • Keyboard indicators Selection Guide Luminous Intensity Iv (mcd) @ 20mA Package Description Color Device HLMP- Min. Typ. Max. 2q1/2 Degree Package Outline T-13/4 Red 3707-L00xx 90.2 - - 24 F 3750 90.2 125.0 - 24 A 3750-L00xx 90.2 125.0 - 24 A 3807-K00xx 96.2 - - 24 F 3850 96.2 140.0 - 24 A 3850-K00xx 96.2 140.0 - 24 A 3850-KL0xx 96.2 150.0 294.0 24 A 3907-K00xx 111.7 - - 24 F 3914-K00xx 111.7 - - 24 D 3950 111.7 265.0 - 24 A 3950-K00xx 111.7 265.0 - 24 A 3950-LM0xx 170.0 300.0 490.0 24 A 3960-K0xxx 111.7 265.0 - 24 E Emerald Green D640-E00xx 6.7 21.0 - 24 D Red 3390 35.2 55.0 - 32 B Yellow 3490 37.6 55.0 - 32 B 3490-I00xx 37.6 55.0 - 32 B 3590 43.6 55.0 - 32 B 3590-I00xx 43.6 55.0 - 32 B 1340 35.2 55.0 - 45 C 1340-H00xx 8.6 15.0 27.6 45 C 1340-J00xx 35.2 55.0 - 45 C 1340-JK0xx 35.2 55.0 112.8 45 C 1440 23.5 45.0 - 45 C 1440-H00xx 23.5 45.0 - 45 C 1440-HI0xx 23.5 - 75.2 45 C 1440-HIB00 23.5 - 75.2 45 C 1540 27.3 45.0 - 45 C 1540-H00xx 27.3 45.0 - 45 C 1540-IJ0xx 43.6 60.0 139.6 45 C K640 4.2 21.0 - 45 C K640-D00xx 4.2 21.0 - 45 C K640-FGNxx 10.6 20.0 34.0 45 C Yellow Green T-13/ 4 Low Profile Green T-1 Red Yellow Green Emerald Green 2 Package Dimensions 9.19 (0.362) 8.43 (0.332) 25.40 (1.00) MIN. 0.89 (0.035) 0.64 (0.025) 0.102 (0.004) MAX. TYP. 0.10 (0.004) MAX. 0.46 (0.018) SQUARE NOMINAL 2.54 (0.100) NOM. PACKAGE OUTLINE "D" HLMP-D640 1.52 (0.060) 1.02 (0.040) 13.11 (0.516) 12.34 (0.486) 9.07 (0.357) 8.56 (0.337) 0.89 (0.035) 0.64 (0.025) 1.02 (0.040) MAX. EPOXY MENISCUS 1.02 (0.040) MAX. 1.32 (0.052) 1.02 (0.040) 23.0 MIN. (0.900) 22.86 MIN. (0.900) 6.10 (0.240) 5.59 (0.220) 3 9.07 (0.357) 8.56 (0.337) 12.47 (0.491) 11.71 (0.461) 0.89 (0.035) 0.64 (0.025) CATHODE LEAD (NOTE 1) 1.27 (0.050) NOM. 5.08 (0.200) 4.78 (0.188) 5.08 (0.200) 4.78 (0.188) 5.08 (0.200) 4.57 (0.180) 0.74 (0.029) 0.58 (0.023) SQUARE ∅ 6.10 (0.240) 5.60 (0.220) CATHODE FLAT 2.54 (0.100) NOM. PACKAGE OUTLINE "E" HLMP-3960 1.52 (0.060) 1.02 (0.040) 0.53 (0.021) SQ. 0.43 (0.017) 6.10 (0.240) 5.60 (0.220) CATHODE FLAT 2.79 (0.110) 2.29 (0.090) PACKAGE OUTLINE "F" HLMP-3707/-3807/-3907 Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk 01: Tape & Reel, Crimped Leads 02, Bx: Tape & Reel, Straight Leads A1, B1: Right Angle Housing, Uneven Leads A2, B2: Right Angle Housing, Even Leads Dx, Ex: Ammo Pack, Straight Leads FH: 2 Iv Bin Select with Inventory Control Vx: Ammo Pack, Crimped Leads Color Bin Options 0: Full Color Bin Distribution B: Color Bin 2 & 3 Only N: Color Bin 6 & 7 Only Maximum Iv Bin Options 0: Open (No. Max. Limit) Others: Please Refer to the Iv Bin Table Minimum Iv Bin Options Please Refer to the Iv Bin Table Color Options 3, 7: GaP HER 4, 8: GaP Yellow (except K4xx series) 5, 9: GaP Green 6: GaP Emerald Green Package Option 1, K: T-1 (3 mm) 3, D: T-13/4 (5 mm) Absolute Maximum Ratings at TA = 25°C Parameter Peak Forward Current Average Forward Current[1] DC Current[2] Transient Forward Current[3] (10 µs Pulse) Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Red 90 25 30 500 Yellow 60 20 20 500 Green/Emerald Green 90 25 30 500 Units mA mA mA mA 5 110 -55 to +100 5 110 -55 to +100 5 110 -20 to +100 -55 to +100 V °C °C Notes: 1. See Figure 2 to establish pulsed operating conditions. 2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C. 3. The transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the LED die and wire bonds. It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current. 4 Electrical/Optical Characteristics at TA = 25°C T-13/4 Low Dome Test Conditions Symbol Description T-13/4 λPEAK Peak Wavelength 37xx 38xx 39xx D640 3390 3490 3590 1340 1440 1540 K640 635 583 565 558 nm Measurement at Peak λd Dominant Wavelength 37xx 38xx 39xx D640 3390 3490 3590 1340 1440 1540 K640 626 585 569 560 nm Note 1 ∆λ3/4 Spectral Line Halfwidth 37xx 38xx 39xx D640 3390 3490 3590 1340 1440 1540 K640 40 36 28 24 nm τs Speed of Respond 37xx 38xx 39xx D640 3390 3490 3590 1340 1440 1540 K640 90 90 500 3100 ns C Capacitance 37xx 38xx 39xx D640 3390 3490 3590 1340 1440 1540 K640 11 15 18 35 pF VF = 0, f = 1 MHz RθJ-PIN Thermal Resistance 37xx 38xx 39xx D640 3390 3490 3590 °C/W Junction to Cathode Lead 1340 1440 1540 K640 210 210 210 510 290 290 290 290 V IF = 20 mA (Figure 3) V IF = 100 µA lumens watt Note 2 T-1 Min. VF Forward Voltage 37xx 38xx 39xx D640 3390 3490 3590 1340 1440 1540 K640 1.5 1.5 1.5 VR Reverse Breakdown Voltage 37xx 38xx 39xx D640 3390 3490 3590 1340 1440 1540 K640 5.0 ηv Luminous Efficacy 37xx 38xx 39xx D640 3390 3490 3590 1340 1440 1540 K640 Typ. 1.9 2.1 2.2 2.2 145 500 595 655 Max. 2.6 2.6 3.0 3.0 Units Notes: 1. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = IV/hV , where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens/watt. 5 Red, Yellow, and Green 1.0 RELATIVE INTENSITY EMERALD GREEN TA = 25° C GREEN HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 650 700 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. Figure 2. Maximum tolerable peak current vs. pulse duration. (IDC MAX as per MAX ratings). Figure 3. Forward current vs. forward voltage. Figure 4. Relative luminous intensity vs. forward current. Figure 5. Relative efficiency (luminous intensity per unit current) vs. peak current. 6 Figure 6. Relative luminous intensity vs. angular displacement. T-13/4 lamp. Figure 7. Relative luminous intensity vs. angular displacement. T-13/4 low profile lamp. Intensity Bin Limits Color Red Figure 8. Relative luminous intensity vs. angular displacement. T-1 lamp. Bin G H I J K L M N O P Q R S T U V W X Y Z Intensity Range (mcd) Min. Max. 9.7 15.5 15.5 24.8 24.8 39.6 39.6 63.4 63.4 101.5 101.5 162.4 162.4 234.6 234.6 340.0 340.0 540.0 540.0 850.0 850.0 1200.0 1200.0 1700.0 1700.0 2400.0 2400.0 3400.0 3400.0 4900.0 4900.0 7100.0 7100.0 10200.0 10200.0 14800.0 14800.0 21400.0 21400.0 30900.0 Maximum tolerance for each bin limit is ±18%. 7 Intensity Bin Limits (continued) Color Yellow Green/ Emerald Green Bin H I J K L M N O P Q R S T U V W A B C D E F G H I J K L M N O P Q R S T U V W Intensity Range (mcd) Min. Max. 26.5 42.3 42.3 67.7 67.7 108.2 108.2 173.2 173.2 250.0 250.0 360.0 360.0 510.0 510.0 800.0 800.0 1250.0 1250.0 1800.0 1800.0 2900.0 2900.0 4700.0 4700.0 7200.0 7200.0 11700.0 11700.0 18000.0 18000.0 27000.0 1.1 1.8 1.8 2.9 2.9 4.7 4.7 7.6 7.6 12.0 12.0 19.1 19.1 30.7 30.7 49.1 49.1 78.5 78.5 125.7 125.7 201.1 201.1 289.0 289.0 417.0 417.0 680.0 680.0 1100.0 1100.0 1800.0 1800.0 2700.0 2700.0 4300.0 4300.0 6800.0 6800.0 10800.0 10800.0 16000.0 16000.0 25000.0 25000.0 40000.0 Maximum tolerance for each bin limit is ±18%. 8 Color Categories Color Emerald Green Green Yellow Orange Cat # 9 8 7 6 6 5 4 3 2 1 3 2 4 5 1 2 3 4 5 6 7 8 Lambda (nm) Min. 552.5 555.5 558.5 561.5 561.5 564.5 567.5 570.5 573.5 582.0 584.5 587.0 589.5 592.0 597.0 599.5 602.0 604.5 607.5 610.5 613.5 616.5 Maximum tolerance for each bin limit is ±0.5 nm. Max. 555.5 558.5 561.5 564.5 564.5 567.5 570.5 573.5 576.5 584.5 587.0 589.5 592.0 593.0 599.5 602.0 604.5 607.5 610.5 613.5 616.5 619.5 Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 01 Tape & Reel, crimped leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1 02 Tape & Reel, straight leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1 A1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag A2 T-1, Right Angle Housing, even leads, minimum increment 500 psc/bag B1 T-13/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag B2 T-13/4, Right Angle Housing, even leads, minimum increment 500 psc/bag BJ T-1, Tape & Reel, straight leads, minimum increment 2000 pcs/bag EG Ammo Pack, straight leads in 5 K increment FH Devices that require inventory control and 2 Iv bin select VR Ammo Pack, crimped leads, min. increment 2 k for T-13/4 and T-1 Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information. 9 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time TEMPERATURE – °C Manual Solder Dipping – – 260 °C Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) BOTTOM SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA 150 FLUXING 100 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME – SECONDS Figure 8. Recommended wave soldering profile. 90 100 Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. TOP SIDE OF PC BOARD 50 30 10 • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Recommended PC board plated through hole sizes for LED component leads: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2005 Agilent Technologies, Inc. Obsoletes 5989-2810 November 12, 2005 5989-4254EN