Data Sheet
June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Features
RoHS Compliant
Compatible with RoHS EU Directive 200295/EC (-Z Versions)
n
Compatible in RoHS EU Directive 200295/EC with lead
solder exemption (non -Z versions)
n
Applications
n
Distributed Power Architectures
n
Wireless Networks
n
Access and Optical Network Equipment
n
Enterprise Networks
n
Latest generation IC’s (DSP, FPGA, ASIC) and Microprocessor-powered applications.
Options
n
Remote On/Off negative logic
n
Surface-mount package (–S Suffix)
n
Basic Insulation (–B Suffix)
n
Delivers up to 12A output current
n
High efficiency: 90% at 3.3V full load (VIN = 48V)
n
Small size and low profile:
47.2 mm x 29.5 mm x 8.50 mm
(1.86 in x 1.16 in x 0.335 in)
n
Low output ripple and noise
n
Exceptional thermal performance
n
High reliability: MTBF > 4.5M hours at 25 °C
n
Remote On/Off positive logic (primary referenced)
n
Constant switching frequency (285 KHz typical)
n
Output overvoltage and overcurrent protection
n
Overtemperature protection
n
Input undervoltage lockout
n
Adjustable output voltage (± 10%)
n
Surface mount or through-hole package
Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and is approved for
Basic Insulation rating per IEC60950 3rd (-B version only)
n
UL* 60950 Recognized, CSA† C22.2 No. 60950-00 Certified, and VDE‡ 0805 (IEC60950, 3rd edition) Licensed
n
n
n
CE mark meets 73/23/EEC and 93/68/EEC directives§
ISO** 9001 and ISO14001 certified manufacturing facilities
Description
The HW series power modules are isolated dc-dc converters that can deliver up to 12A of output current and provide a precisely
regulated output voltage over a wide range of input voltages (VI = 36 V to 75 Vdc for HW modules). The modules achieve full load
efficiency of 90% at 3.3 V output voltage. The open frame modules, available in both surface-mount and through-hole packaging,
enable designers to develop cost- and space-efficient solutions. Standard features include remote On/Off, output voltage adjustment, overvoltage, overcurrent and overtemperature protection.
*
†
‡
§
**
UL is a registered trademark of Underwriters Laboratories, Inc.
CSA is a registered trademark of Canadian Standards Association.
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should be followed. (The CE mark is placed on selected products.)
ISO is a registered trademark of the Internation Organization of Standards
Document No: ADS02-006EPS ver.1.4
PDF Name: fds03-0031.pdf
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress
ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the
operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the
device reliabiltiy.
Parameter
Device
Symbol
Min
Max
Unit
Input Voltage:Continuous
Transient (100ms)
HW
HW
VI
VI, trans
–0.3
—
80
100
Vdc
Vdc
Operating Ambient Temperature
(See Thermal Considerations section)
All
TA
–40
85
°C
Storage Temperature
All
Tstg
–55
125
°C
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter
Device
Symbol
Min
Typ
36
48
Max
Unit
Operating Input Voltage
HW
VIN
75
Vdc
Maximum Input Current
(VI = 0 V to 75 V; IO = IO, max)
HW
II, max
1.6
Adc
Inrush Transient
All
I2 t
1
A 2s
Input Reflected Ripple Current, peak-peak
(5 Hz to 20 MHz, 12 µH source impedance
See Test configuration section)
All
II
Input Ripple Rejection (120 Hz)
All
3
mAp-p
50
dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated
part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included however, to achieve
maximum safety and system protection, always use an input line fuse. The safety agencies require a time-delay fuse with a
maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush
energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s
data sheet for further information.
Lineage Power
2
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Electrical Specifications (continued)
Parameter
Device
Symbol
Min
Typ
Max
Unit
Output Voltage Set Point
(VI = 48 Vdc; IO = IO, min to IO, max, TA = 25 °C)
HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
Vo, set
Vo, set
Vo, set
Vo, set
Vo, set
Vo, set
1.17
1.46
1.75
2.46
3.25
4.92
1.2
1.5
1.8
2.5
3.3
5.0
1.23
1.54
1.85
2.54
3.35
5.08
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Output Voltage
(Over all operating input voltage, resistive load, and
temperature conditions at steady state until end of life.)
HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
VO
VO
VO
VO
VO
VO
1.15
1.44
1.73
2.42
3.2
4.85
—
—
—
—
—
—
1.25
1.56
1.87
2.57
3.4
5.15
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Output Regulation:
Line (VI = VI, min to VI, max)
Load (IO = IO, min to IO, max)
Temperature (TA = TA, min to TA, max)
All
All
All
—
—
—
—
—
—
—
—
0.2
0.1
10
—
%, VO, set
mV
%, VO, set
Output Ripple and Noise
Measured across 10µF Tantalum, 1µF
Ceramic, VI = VI, nom TA = 25 °C, IO = IO, max See test
Configuration section
RMS (5 Hz to 20 MHz bandwidth)
Peak-to-peak (5 Hz to 20 MHz bandwidth)
All
All
—
—
8
40
20
75
mVrms
mVp-p
External Load Capacitance
HW006A6A1
All others
CO, max
CO, max
0
0
—
—
470
1000
µF
µF
Output Current
(At Io < Io,min, the output ripple may exceed the
maximum specifications. All modules shall operate at no
load without damage and without exceeding 110% of VO,
set.)
HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
IO
IO
IO
IO
IO
IO
0.15
0.15
0.15
0.05
0.05
0.05
—
—
—
—
—
—
12
12
12
10
10
6.6
Adc
Adc
Adc
Adc
Adc
Adc
Output Current-limit Inception
(VO = 90% of VO, set)
HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
IO, lim
IO, lim
IO, lim
IO, lim
IO, lim
IO, lim
—
—
—
—
—
—
18
18
18
12
12
8
—
—
—
—
—
—
Adc
Adc
Adc
Adc
Adc
Adc
Output Short-circuit Current (Average)
VO = 0.25 V
HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
IO, s/c
IO, s/c
IO, s/c
IO, s/c
IO, s/c
IO, s/c
—
—
—
—
—
—
20
20
20
17
17
13
—
—
—
—
—
—
Adc
Adc
Adc
Adc
Adc
Adc
Efficiency
(VI = VIN, nom; IO = IO, max), TA = 25 °C
HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
h
h
h
h
h
h
—
—
—
—
—
—
82
83
85
89
90
91
—
—
—
—
—
—
%
%
%
%
%
%
All
fSW
—
285
—
kHz
HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
h
h
h
h
h
h
—
—
—
—
—
—
82
83
85
89
90
91
—
—
—
—
—
—
%
%
%
%
%
%
Switching Frequency
Efficiency
(VI = VIN, nom; IO = IO, max), TA = 25 °C
Lineage Power
3
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Electrical Specifications (continued)
Parameter
Device
Symbol
Min
Typ
Max
Unit
All
All
—
—
—
—
200
0.2
—
—
mV
msec
All
All
—
—
—
—
200
0.2
—
—
mV
msec
Dynamic Load Response
(di/dt = 0.1 A/ µs, VI = VI, nom, TA = 25 °C)
Load change from IO = 50% to 75% of IO, max,
Peak Deviation
Settling Time (VO < 10% of peak deviation)
Load Change from IO = 50% to 25% of IO, max,
Peak Deviation
Setting Time (VO < 10% peak deviation)
Isolation Specifications
Symbol
Min
Typ
Max
Isolation Capacitance
Parameter
Ciso
—
1000
—
Unit
PF
Isolation Resistance
Riso
10
—
—
MΩ
Isolation Voltage
Viso
—
—
1500
Vdc
General Specifications
Parameter
Min
Calculated MTBF (IO = 80% of IO, max TA = 25 °C)
RIN (Reliability Infomation Notebook) Method
Weight
Lineage Power
Typ
Max
4,537,000
—
13 (0.46)
Unit
Hours
—
g (oz.)
4
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.
Parameter
Remote On/Off Signal interface
(VI = VI, min to VI, max; Open collector or compatible, signal
referenced to VI (-) terminal
Negative Logic: Device code with suffix "1"
Logic Low—Module On / Logic High—Module Off
Positive Logic: If device code suffix "1" is not specified
Logic Low—Module Off / Logic High—Module On
Module Specifications:
On/Off Current—Logic Low
On/Off Voltage:
Logic Low
Logic High
Open Collector Specifications:
Leakage Current during Logic High
(Von/off = 15 V)
Output Low Voltage during Logic Low
(Ion/Off – 1 mA)
Turn-On Delay and Rise Times
(IO = 80% of IO, max, VIN = 48 Vdc, TA = 25 °C)
Case 1: On/Off input is set to Logic high and then input power
is applied (delay from instant at which VI = VI, min until VO =
10% of VO, set)
Case 2: Input power is applied for at least one second and
then the On/Off input is set to logic high (delay from instant at
which Von/off = 0.9 V until VO = 10% of VO, set)
Output voltage Rise time (time for VO to rise from 10% of VO,
set to 90% of VO, set)
Output voltage overshoot
(IO = 80% of IO, max, VI = 48 Vdc TA = 25 °C)
Device
Symbol
Min
Typ
Max
Unit
All
Ion/off
—
—
1.0
mA
All
All
Von/off
Von/off
–0.7
—
—
—
1.2
15
V
V
All
Ion/off
—
—
50
µA
All
Von/off
—
—
1.2
V
All
Tdelay
—
25
—
msec
All
Tdelay
—
25
—
msec
All
Trise
—
0.9
—
msec
—
—
5
%VO, set
90
—
110
%VO, set
—
—
—
—
—
—
—
2.0
2.3
2.3
3.1
4.0
6.1
125
2.8
3.2
3.2
3.7
4.6
7.0
—
V
V
V
V
V
V
°C
—
25
32
27
36
—
V
V
All
Output voltage adjustment (see Feature Description section)
Output voltage set-point adjustment range (TRIM)
ALL
Output Overvoltage Protection (clamp)
Overtemperaute Protection (IO = IO, max)
See Figure 44
Input Undervoltage Lockout
Turn-on Threshold
Turn-off Threshold
Lineage Power
HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
All
All
All
VO, ovsd
VO, ovsd
VO, ovsd
VO, ovsd
VO, ovsd
VO, ovsd
TQ203
5
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Characteristic Curves
The following figures provide typical characteristics curves for the HW012A0P1 (VO = 1.2 V) module at room temperature (TA
= 25 °C).
OUTPUT VOLTAGE,
VO (V) (200 mV/div)
0.7
0.5
IO = 12A
0.4
OUTPUT CURRENT,
IO (A) (2 A/div)
INPUT CURRENT, II (A)
0.6
0.3
IO = 6A
0.2
0.1
IO = 0.15A
0
25
30
35
40
45
50
55
60
INPUT VOLTAGE, VI (V)
65
70
75
TIME, t (200 µs/div)
Figure 1. Input Voltage and Current Characteristics.
Figure 4.
Transient Response to Step Decrease in
Load from 50% to 25% of Full Load
(VI = 48 Vdc).
82
VI = 36V
VI = 48V
80
78
76
74
72
VI = 75V
70
0
2
4
6
8
OUTPUT CURRENT, IO (A)
10
12
OUTPUT CURRENT,
IO (A) (5 A/div)
EFFICIENCY,
(%)
84
OUTPUT VOLTAGE,
VO (V) (200 mV/div)
86
TIME, t (200 µs/div)
Figure 5.
REMOTE ON/OFF,
VON/OFF (V) (5 V/div)
OUTPUT VOLTAGE,
VO (V) (10 mV/div)
TIME, t (1 µs/div)
Figure 3.
Transient Response to Step Increase in
Load from 50% to 75% of Full Load
(VI = 48 Vdc).
OUTPUT VOLTAGE,
VO (V) (1 V/div)
Figure 2. Converter Efficiency vs. Output Current.
Output Ripple Voltage (IO = IO, max).
Lineage Power
TIME, t (10 ms/div)
Figure 6.
Start-up from Remote On/Off (IO = IO, max).
6
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Characteristic Curves
The following figures provide typical characteristics curves for the HW012A0M1 (VO = 1.5 V) module at room temperature (TA =
25 °C)
INPUT CURRENT, II (A)
0.8
0.7
0.6
0.5
IO = 12A
0.4
0.3
IO = 6A
0.2
0.1
0
IO = 0.15A
25
30
35
40
45
50
55
60
INPUT VOLTAGE, VI (V)
65
70
75
OUTPUT CURRENT,
IO (A) (2 A/div)
OUTPUT VOLTAGE,
VO (V) (100 mV/div)
0.9
TIME, t (200 ms/div)
Figure 7. Input Voltage and Current Characteristics.
Figure 10. Transient Response to Step Decrease in
Load from 50% to 25% of Full Load
(VI = 48 Vdc).
OUTPUT VOLTAGE,
VO (V) (100 mV/div)
90
88
84
82
80
78
VI = 36V
VI = 48V
VI = 75V
76
74
72
70
0
2
4
6
8
10
12
OUTPUT CURRENT, IO (A)
OUTPUT CURRENT,
IO (A) (5 A/div)
EFFICIENCY,
(%)
86
TIME, t (200 ms/div)
REMOTE ON/OFF,
VON/OFF (V) (5 V/div)
OUTPUT VOLTAGE,
VO (V) (10 mV/div)
TIME, t (1 µs/div)
Figure 9.
Figure 11. Transient Response to Step Increase in Load
from 50% to 75% of Full Load
(VI = 48 Vdc).
OUTPUT VOLTAGE,
VO (V) (0.5 V/div)
Figure 8. Converter Efficiency vs. Output Current.
Output Ripple Voltage (IO = IO, max).
Lineage Power
TIME, t (10 ms/div)
Figure 12. Start-up from Remote On/Off (IO = IO, max).
7
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Characteristic Curves
The following figures provide typical characteristics curves for the HW012A0Y1 (VO = 1.8 V) module at room temperature (TA
= 25 °C)
OUTPUT VOLTAGE,
VO (V) (100 mV/div)
1
0.8
IO = 12A
0.6
0.4
IO = 6A
0.2
IO = 0.15A
0
25
30
35
40
45
50
55
60
INPUT VOLTAGE, VI (V)
65
70
75
OUTPUT CURRENT,
IO (A) (2 A/div)
INPUT CURRENT, II (A)
1.2
TIME, t (200 ms/div)
Figure 13. Input Voltage and Current Characteristics.
Figure 16. Transient Response to Step Decrease in
Load from 50% to 25% of Full Load
(VI = 48 Vdc).
OUTPUT VOLTAGE,
VO (V) (100 mV/div)
90
88
84
82
80
78
VI = 36V
VI = 48V
VI = 75V
76
74
72
70
0
2
4
6
8
OUTPUT CURRENT, IO (A)
10
12
OUTPUT CURRENT,
IO (A) (5 A/div)
EFFICIENCY,
(%)
86
TIME, t (200 ms/div)
REMOTE ON/OFF,
VON/OFF (V) (5 V/div)
OUTPUT VOLTAGE,
VO (V) (10 mV/div)
TIME, t (1 µs/div)
Figure 15. Output Ripple Voltage (IO = IO, max).
Lineage Power
Figure 17. Transient Response to Step Increase in
Load from 50% to 75% of Full Load
(VI = 48 Vdc).
OUTPUT VOLTAGE,
VO (V) (1 V/div)
Figure 14. Converter Efficiency vs. Output Current.
TIME, t (10 ms/div)
Figure 18. Start-up from Remote On/Off (IO = IO, max).
8
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Characteristic Curves
The following figures provide typical characteristics curves for the HW010A0G1 (VO = 2.5 V) module at room temperature (TA =
25 °C)
OUTPUT VOLTAGE,
VO (V) (100 mV/div)
1
0.8
IO = 10A
0.6
0.4
IO = 5A
0.2
IO = 0.05A
0
25
30
35
40
45
50
55
60
INPUT VOLTAGE, VI (V)
65
70
75
OUTPUT CURRENT,
IO (A) (5 A/div)
INPUT CURRENT, II (A)
1.2
TIME, t (100 µs/div)
Figure 19. Input Voltage and Current Characteristics.
Figure 22. Transient Response to Step Decrease in
Load from 50% to 25% of Full Load
(VI = 48 Vdc).
OUTPUT VOLTAGE,
VO (V) (100 mV/div)
95
(%)
90
80
VI = 36V
VI = 48V
VI = 75V
75
70
0
1
2
3
4
5
6
7
OUTPUT CURRENT, IO (A)
8
9
10
OUTPUT CURRENT,
IO (A) (5 A/div)
EFFICIENCY,
85
TIME, t (100 µs/div)
REMOTE ON/OFF,
VON/OFF (V) (5 V/div)
OUTPUT VOLTAGE,
VO (V) (10 mV/div)
TIME, t (1 µs/div)
Figure 21. Output Ripple Voltage (IO = IO, max).
Lineage Power
Figure 23. Transient Response to Step Increase in Load
from 50% to 75% of Full Load
(VI = 48 Vdc).
OUTPUT VOLTAGE,
VO (V) (500 mV/div)
Figure 20. Converter Efficiency vs. Output Current.
TIME, t (5 ms/div)
Figure 24. Start-up from Remote On/Off (IO = IO, max).
9
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Characteristic Curves
The following figures provide typical characteristics curves for the HW010A0F1 (VO = 3.3 V) module at room temperature (TA
= 25 °C)
OUTPUT VOLTAGE,
VO (V) (200 mV/div)
1.6
1.2
1
IO = 10A
0.8
OUTPUT CURRENT,
IO (A) (5 A/div)
INPUT CURRENT, II (A)
1.4
0.6
IO = 5A
0.4
0.2
0
25
IO = 0.05A
30
35
40
45
50
55
60
INPUT VOLTAGE, VI (V)
65
70
75
TIME, t (100 µs/div)
Figure 25. Input Voltage and Current Characteristics.
Figure 28. Transient Response to Step Decrease in
Load from 50% to 25% of Full Load
(VI = 48 Vdc).
EFFICIENCY,
(%)
90
85
80
VI = 36V
VI = 48V
VI = 75V
75
70
0
1
2
3
4
5
6
7
OUTPUT CURRENT, IO (A)
8
9
10
OUTPUT CURRENT,
IO (A) (5 A/div)
OUTPUT VOLTAGE,
VO (V) (200 mV/div)
95
TIME, t (100 µs/div)
REMOTE ON/OFF,
VON/OFF (V) (5 V/div)
OUTPUT VOLTAGE,
VO (V) (20 mV/div)
TIME, t (1 µs/div)
Figure 27. Output Ripple Voltage (IO = IO, max).
Lineage Power
Figure 29. Transient Response to Step Increase in
Load from 50% to 75% of Full Load
(VI = 48 Vdc).
OUTPUT VOLTAGE,
VO (V) (1 V/div)
Figure 26. Converter Efficiency vs. Output Current.
TIME, t (5 ms/div)
Figure 30. Start-up from Remote On/Off (IO = IO, max).
10
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Characteristic Curves
The following figures provide typical characteristics curves for the HW006A6A1 (VO = 5.0 V) module at room temperature (TA =
25 °C)
OUTPUT VOLTAGE,
VO (V) (200 mV/div)
1.4
1
IO = 6.6A
0.8
OUTPUT CURRENT,
IO (A) (2 A/div)
INPUT CURRENT, II (A)
1.2
0.6
IO = 3.3A
0.4
0.2
IO = 0.05A
0
25
30
35
40
45
50
55
60
INPUT VOLTAGE, VI (V)
65
70
75
TIME, t (100 µs/div)
Figure 31. Input Voltage and Current Characteristics.
Figure 34. Transient Response to Step Decrease in
Load from 50% to 25% of Full Load
(VI = 48 Vdc).
EFFICIENCY,
(%)
90
85
80
VI = 36V
VI = 48V
VI = 75V
75
70
0
1
2
3
4
5
OUTPUT CURRENT, IO (A)
6
7
OUTPUT CURRENT,
IO (A) (2 A/div)
OUTPUT VOLTAGE,
VO (V) (200 mV/div)
95
TIME, t (100 µs/div)
REMOTE ON/OFF,
VON/OFF (V) (5 V/div)
OUTPUT VOLTAGE,
VO (V) (10m V/div)
TIME, t (1 µs/div)
Figure 33. Output Ripple Voltage (IO = IO, max).
Lineage Power
Figure 35. Transient Response to Step Increase in Load
from 50% to 75% of Full Load
(VI = 48 Vdc).
OUTPUT VOLTAGE,
VO (V) (2 V/div)
Figure 32. Converter Efficiency vs. Output Current.
TIME, t (5 ms/div)
Figure 36. Start-up from Remote On/Off (IO = IO, max).
11
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Test Configurations
Safety Considerations
For safety-agency approval of the system in which the power
module is used, the power module must be installed in compliance with the spacing and separation requirements of the
end-use safety agency standard, i.e., UL60950, CSA C22.2
No. 60950-00, and
VDE 0805:2001-12 (IEC60950, 3rd Ed).
TO OSCILLOSCOPE
CURRENT
PROBE
LTEST
VI(+)
12 µH
CS 220 µF
ESR < 0.1 Ω
@ 20 ˚C, 100 kHz
BATTERY
33 µF
ESR < 0.7 Ω
@ 100 kHz
These converters have been evaluated to the spacing
requirements for Basic Insulation, per the above safety standards.
VI(-)
Note: Measure input reflected ripple current with a simulated source
inductance (LTEST) of 12µH. Capacitor CS offsets possible
battery impedance. Measure current as shown above.
Figure 37. Input Reflected Ripple Current Test Setup.
For end products connected to –48 Vdc, or –60 Vdc nomianl
DC MAINS (i.e. central office dc battery plant), no further
fault testing is required.
Note:–60 V dc nominal bettery plants are not available in the
U.S. or Canada.
For all input voltages, other than DC MAINS, where the input
voltage is less than 60 Vdc, if the input meets all of the
requirements for SELV, then:
COPPER STRIP
V O (+)
1.0 µF
For Basic Insulation models ("–B" Suffix), 1500 Vdc is
applied from VI to VO to 100% of outgoing production.
10 µF
RESISTIVE
LOAD
SCOPE
n
The output may be considered SELV. Output voltages will
remain withing SELV limits even with internally-generated
non-SELV voltages. Single component failure and fault
tests were performed in the power converters.
n
One pole of the input and one pole of the output are to be
grounded, or both circuits are to be kept floating, to maintain the output voltage to ground voltage within ELV or
SELV limits.
V O (–)
GROUND PLANE
Note: Scope measurements should be made using a BNC socket,
with a 10 µF tantalum capacitor and a 1 µF ceramic capcitor.
Position the load between 51 mm and 76 mm (2 in and 3 in)
from the module
Figure 38. Peak-to-Peak Output Ripple Measurement
Test Setup.
For all input sources, other than DC MAINS, where the input
voltage is between 60 and 75 Vdc (Classified as TNV-2 in
Europe), the following must be adhered to, if the converter’s
output is to be evaluated for SELV:
n
The input source is to be provided with reinforced insulation from any hazardous voltage, including the AC mains.
n
One VI pin and one VO pin are to be reliably earthed, or
both the input and output pins are to be kept floating.
n
Another SELV reliability test is conducted on the whole
system, as required by the safety agencies, on the combination of supply source and the subject module to verify
that under a single fault, hazardous voltages do not
appear at the module’s output.
CONTACT AND
DISTRIBUTION LOSSES
VI(+)
VO(+)
IO
II
LOAD
SUPPLY
VI(–)
VO(–)
CONTACT
RESISTANCE
Note: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid
measurement errors due to socket contact resistance.
Figure 39. Output Voltage and Efficiency Test Setup.
The power module has ELV (extra-low voltage) outputs
when all inputs are ELV.
All flammable materials used in the manufacturing of these
modules are rated 94V-0, and UL60950A.2 for reduced
thicknesses. The input to these units is to be provided with a
maximum 5A time-delay in the unearthed lead.
[ V O(+) – V O(-) ] × I O
η = ⎛⎝ ------------------------------------------------⎞⎠ × 100
[ V I(+) – V I(-) ] × I I
Lineage Power
12
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Design Considerations
Output Voltage Set-Point Adjustment (Trim)
Input Source Impedance
Output voltage trim allows the user to increase or decrease
the output voltage set point of a module. This is accomplished by connecting an external resistor between the TRIM
pin and either the VO(+) or VO(–) pins. The trim resistor
should be positioned close to the module. If not using the trim
feature, leave the TRIM pin open.
The power module should be connected to a low
ac-impedance source. A highly inductive source impedance
can affect the stability of the power module. For the test configuration in Figure 37, a 33µF electrolytic capacitor
(ESR<0.7W at 100kHz), mounted close to the power module
helps ensure the stability of the unit. Consult the factory for
further application guidelines.
Feature Descriptions
Remote On/Off
Two remote On/Off options are available. Positive logic
remote On/Off turns the module on during a logic-high voltage on the remote ON/OFF pin, and off during a logic low.
Negative logic remote On/Off, device code suffix "1", turns
the module off during logic-high voltage and on during a logic
low.
To turn the power module on and off, the user must supply a
switch to control the voltage between the
ON/OFF pin and the VI(–) terminal. The switch may be an
open collector or equivalent (see Figure 40). A logic low is
Von/off = –0.7 V to 1.2 V. The maximum Ion/off during a logic
low is 1 mA. The switch should maintain a logic-low voltage
while sinking 1 mA. During a logic high, the maximum Von/off
generated by the power module is 15 V. The maximum allowable leakage current of the switch at Von/off = 15 V is 50 µA.
If not using the remote on/off feature, do one of the following:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VI(–).
ON/OFF
Von/off
–
VO(+)
LOAD
VI(+)
⎧ A
⎫
R trim-down = ⎨ --------- – B ⎬kΩ
Δ%
⎩
⎭
Rtrim-down is the external resistor in kW
D% is the % change in output voltage
A & B are defined in Table 1 for various models
Table 1
Output Voltage
(V)
A
B
1.2
1.5
1.8
2.5
3.3
5.0
1089
1089
1089
1690
1690
1690
62.0
104
104
73.1
73.1
73.1
For example, to trim-down the output voltge of 2.5 V module
(HW010A0G) by 8% to 2.3 V, Rtrim-down is calculated as follows:
D% = 8
A = 1690
B = 73.1
Ion/off
+
With an external resistor Trim-down between the TRIM and
VO(–) pins, the output voltage set point VO, set decreases
(see Figure 41). The following equation determines the
required external-resistor value to trim-down the output voltage from VO, set to VO:
VO(–)
VI(–)
⎧ 1690
⎫
R trim-down = ⎨ ------------ – 73.1 ⎬kΩ
8
⎩
⎭
R trim – down = 138.15kΩ
Figure 40. Remote On/Off Implementation.
Lineage Power
13
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Feature Descriptions (continued)
VI(+)
Output Voltage Set-Point Adjustment
(Trim) (continued)
VO(+)
Rtrim-up
ON/OFF
TRIM
VI(+)
RLOAD
VI(–)
VO(+)
VO(–)
ON/OFF
RLOAD
TRIM
VI(–)
Figure 42. Circuit Configuration to Increase
Output Voltage.
Rtrim-down
VO(–)
Figure 41. Circuit Configuration to Decrease Output
Voltage.
With an external resistor Rtrim-up, connected between the
TRIM and VO(+) pins, the output voltage set point VO, set
increases (see Fiugre 42). The following equation determines the required external-resistor value to trim-up the output voltage from VO, set to VO:
The amount of power delivered by the module is defined as
the voltage at the output terminals multiplied by the output
current. When using trim, the output voltage of the module
can be increased, which at the same output current would
increase the power output of the module. Care should be
taken to ensure that the maximum output power of the module remains at or below the maximum rated power (maximum rated power = VO, set x IO, max).
Overcurrent Protection
To provide protection in an output overload fault condition,
the module is equipped with internal current-limiting circuitry,
and can endure current limiting for an unlimited duration. At
the instance of current-limit inception, the module enters a
"hiccup" mode of operation, whereby it shuts down and automatically attempts to restart. While the fault condition exists,
the module will remain in this mode until the fault is cleared.
The unit operates normally once the output current is
reduced back into its specified range.
⎧ A ( 100 + Δ% ) – B
⎫
R trim-up = ⎨ ------------------------------------------- – C ⎬kΩ
Δ%
⎩
⎭
Rtrim-up is the external resistor in kW
D% is the % change in output voltage
A, B and C are defined in Table 2
Table 2
Output Voltage
(V)
A
B
C
1.2
1.5
1.8
2.5
3.3
5.0
15.9
19.8
23.8
34.5
45.5
69.0
1089
1089
1089
1690
1690
1690
62.0
104
104
73.1
73.1
73.1
For example, to trim-up the output voltage of 1.5 V module
(HW012A0M) by 8% to 1.62 V, Rtrim-up is calcualted is as
follows:
Output Overvoltage Protection
The output overvoltage protection clamp consists of control
circuitry, independent of the primary regulation loop, that
monitors the voltage on the output terminals. This control
loop has a higher voltage set point than the primary loop
(See the overvoltage clamp values in the Feature Specifications Table). In a fault condition, the overvoltage clamp
ensures that the output voltage does not exceed VO, ovsd,
max. This provides a redundant voltage-control that reduces
the risk of output overvoltage.
D% = 8
A = 19.8
B = 1089
C = 104
⎧ 19.8 ( 100 + 8 ) – 1089
⎫
R trim-up = ⎨ ---------------------------------------------------- – 104 ⎬kΩ
8
⎩
⎭
R trim-up = 27.175kΩ
Lineage Power
14
Data Sheet
June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Feature Descriptions (continued)
Overtemperature Protection
To provide protection under certain fault conditios, the unit is
equipped with a thermal shutdown circuit. The unit will shudown if the overtemperature threshold is exceeded, but the
thermal shut down is not intended as a guarantee that the
unit will survive temperatures beyond its rating. The module
will automatically restart after it cools down.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will begin to
operate at an input voltage above the undervoltage lockout
turn-on threshold.
Lineage Power
15
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
12
The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help
ensure reliable operation of the unit. Heat is removed by conduction, convection, and radiation to the surrounding environment. Proper cooling can be verified by measuring drain pin
Q203 at the position indicated in Figure 43.
10
The temperature at Q203 drain pins should not exceed 115
°C. The output power of the module should not exceed the
rated power for the module
(VO, set x IO, max).
Although the maximum operating ambient temperature of the
power modules is 85 °C, you can limit this temperature to a
lower value for extremely high reliability.
Output Current IO (A)
Thermal Considerations
8
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
NATURAL CONVECTION
6
4
2
0
20
30
40
50
60
70
Ambient Temperature TA (˚C)
80
90
Figure 44. Derating Curves for HW010A0F1
(VO = 3.3 V) in Transverse Orientation
(VI = 48 Vdc).
8
Q203
Attach thermocouple
to drain lead.
AIRFLOW
OUTPUT CURRENT, IO (A)
7
Systems in which these power modules may be used typically generate natural convection airflow rates of 0.3 ms–1
(60 ft./min.) due to other heat-dissipating components in the
system. Therefore, the natural convection condition represents airflow rates of up to 0.3 ms–1 (60 ft./min.). Use of Figure 44 is shown in the following example.
Example
What is the minimum airflow necessary for a HW010A0F1
operating at VIN = 48 V, an output current of 10 A, and a
maximum ambient temperature of 75 °C.
4
3
2
1
20
30
40
50
60
70
AMBIENT TEMPERATURE, TA (˚C)
80
90
Figure 45. Derating Curves for HW006A6A1
(VO = 5.0 V) in Transverse Orientation
(VI = 48 Vdc).
11
10
OUTPUT CURRENT, IO (A)
Increasing airflow over the module enhances the heat transfer via convection. Figures 44—48 show the maximum current that can be delivered by various modules versus local
ambient temperature (TA) for natural convection through 2 m/
s (400 ft./min.).
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
NATURAL CONVECTION
5
0
Figure 43. HW 6.6A-12A-Series Temperature
Measurement Location (Top View).
Heat Transfer via Convection
6
9
8
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
NATURAL CONVECTION
7
6
5
4
3
2
1
0
20
30
40
50
60
70
AMBIENT TEMPERATURE, TA (˚C)
80
90
Solution
Given:
VIN = 48V
IO = 12 A
TA = 75 °C
Figure 46. Derating Curves for HW010A0G1
(VO = 2.5 V) in Transverse Orientation
(VI = 48 Vdc).
Determine airflow (v) (Use Figure 44.):
v = 0.5 m/s (100 ft./min.)
Lineage Power
16
Data Sheet
June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Thermal Considerations (continued)
Figure 47. Derating Curves for HW012A0Y1
(VO = 1.8 V) in Transverse Orientation
(VI = 48 Vdc).
Figure 48. Derating Curves for HW012A0P1
(VO = 1.2 V) in Transverse Orientation
(VI = 48 Vdc).
Layout Considerations
Copper paths must not be routed beneath the power module.
For additional layout guidelines, refer to the FLTR100V10 or
FLTR100V20 data sheet.
EMC Considerations
For assistance with designing for EMC compliance, please
refer to the FLTR100V10 data sheet
(FDS01-043EPS)
Lineage Power
17
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Through-Hole Lead-Free Soldering Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual
wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3°C/s is
suggested. The wave preheat process should be such that
the temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot temperature is
260°C, while the Pb-free solder pot is 270°C max. Not all
RoHS-compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please consult with your
Lineage Power representative for more details.
Surface Mount Information
Pick and Place Area
Although the module weight is minimized by using openframe construction, the modules have a relatively large mass
compared to conventional surface-mount components. To
optimize the pick-and-place process, automated vacuum
equipment variables such as
nozzle size, tip style, vacuum pressure, and placement
speed should be considered. Surface-mount versions of this
family have a flat surface which serves as a
pick-and-place location for automated vacuum equipment.
The module’s pick-and-place location is identified in Figure
49.
sure and placement speed should be considered to optimize
this process.
The minimum recommended nozzle diameter for reliable
operation is 6mm. The maximum nozzle outer diameter,
which will safely fit within the allowable component spacing,
is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.
For further information please contact your local Lineage
Power Technical Sales Representative.
Reflow Soldering Information
The HW006 family of power modules is available for either
Through-Hole (TH) or Surface Mount (SMT) soldering.
These power modules are large mass, low thermal resistance devices and typically heat up slower than other SMT
components. It is recommended that the customer review
data sheets in order to customize the solder reflow profile for
each application board assembly.
The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may
result in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
The surface mountable modules in the HW006 family use our
newest SMT technology called "Column Pin" (CP) connectors. Figure 50 shows the new CP connector before and after
reflow soldering onto the end-board assembly.
HW006 Board
Insulator
Solder Ball
X
14mm
(0.57in)
21mm
(0.84in)
Figure 49. Pick and Place Location.
Z Plane Height
The 'Z' plane height of the pick and place location is 7.50mm
nominal with an RSS tolerance of +/-0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, they have a relatively
large mass when compared with conventional SMT components. Variables such as nozzle size, tip style, vacuum presLineage Power
End assembly PCB
Figure 50. Column Pin Connector Before and After
Reflow Soldering.
The CP is constructed from a solid copper pin with an integral
solder ball attached, which is composed of tin/lead (Sn/Pb)
solder. The CP connector design is able to compensate for
large amounts of co-planarity and still ensure a reliable SMT
solder joint.
Typically, the eutectic solder melts at 183oC, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. There are several types of
SMT reflow technologies currently used in the industry.
These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared),
or a combination of convection/IR. For reliable soldering the
solder reflow profile should be established by accurately
measuring the modules CP connector temperatures.
18
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
ages should not be broken until time of use. Once the original package is broken, the floor life of the product at
conditions of < 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry
packed SMT packages will be a minimum of 12 months from
the bag seal date, when stored at the following conditions: <
40° C, < 90% relative humidity.
300
Peak Temp 235 oC
250
Cooling
zone
1-4oCs -1
Heat zone
max 4oCs -1
200
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Lineage
Power Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
150
Soak zone
30-240s
100
50
Tlim above
205 o C
Preheat zone
max 4oCs -1
0
REFLOW TIME (S)
Per J-STD-020 Rev. C
300
Figure 51. Recommended Reflow profile.
Peak Temp
250
Cooling
Zone
Reflow Temp (°C)
240
235
230
225
220
215
200
150
* Min. Time
Above 235°C
Heating
Zone
*Time Above
217°C
100
50
210
0
Reflow Time (Seconds)
205
200
0
10
20
30
TIME (S)
40
50
60
Figure 52. Time Limit curve above 2050C.
Lead Free Soldering
The -Z version SMT modules of the HW/HC series are leadfree (Pb-free) and RoHS compliant and are compatible in a
Pb-free soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to the
modules and can adversely affect long-term reliability.
Figure 53. Recommended linear reflow profile using Sn/
Ag/Cu solder.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These requirements state that solder balls must neither be loose nor violate
the power module minimum electrical spacing.
The cleanliness designator of the open frame power module
is C00 (per J specification).
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/
Reflow Sensitivity Classification for Nonhermetic Solid State
Surface Mount Devices) for both Pb-free solder profiles and
MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown
in Figure. 53.
MSL Rating
The HW series SMT modules have a MSL rating of 1.
Storage and Handling
The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed packLineage Power
19
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Outline Diagram for Surface-Mount Module
Dimensions are in millimeters and (inches).
Tolerances:
x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.)
47.2
(1.86)
Top View
29.5
(1.16)
0.06 x 0.06
chamffer
8.50
(0.335)
MAX
2.54
(0.100)
min stand-off
height
Side View
0.5
(.020)
max
compliance
1.7
(0.07)
3.6
(0.14)
TRIM
Bottom View
VO+ VO-
26.16
(1.030)
On/Off
VI+ VI5.00
(0.197)
35.00
(1.375)
40.00
(1.575)
Lineage Power
20
Data Sheet
June 26, 2009
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Outline Diagram for Through-Hole Module
Dimensions are in millimeters and (inches).
Tolerances:
x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.)
Lineage Power
21
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Recommended Pad Layout for Surface-Mount Module
and Recommended Hole Layout for Through-Hole Module
Component-side footprint.
47.24 (1.860)
43.64 (1.718)
38.63 (1.521)
8.64 (0.340)
3.63 (0.143)
0 (0)
Dimensions are in millimeters and (inches), unless otherwise noted.
29.46 (1.160)
27.84 (1.096)
20.73 (0.816)
KEEP-OUT AREA:
Besides trace to ON/OFF pin,
do not route other traces on the
PWB top layer closest to the
power module in this keep-out area.
1.68 (0.066)
0 (0)
NOTES:
32.56 (1.282)
0 (0)
0 (0)
1. FOR CGA SURFACE MOUNT PIN
USE THE FOLLOWING PAD
0.022" DIA VIA
0.032" DIA SOLDER MASK OPENING
4 PLACES FOR OUTPUT PINS
2 PLACES FOR INPUT PINS
0.025" SPACING VIA TO PAD
0.015" MIN SOLDER MASK WALL
0.105" PASTE MASK OPENING
0.110" SOLDER MASK OPENING
Lineage Power
22
HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Input Voltage
Output
Voltage
Output
Current
Efficiency
Connector Type
Device Code
Comcodes
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
36 – 75 Vdc
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
3.3 V
5.0 V
5.0 V
1.2 V
1.2 V
1.5 V
1.5 V
1.8 V
1.8 V
2.5 V
3.3 V
3.3 V
5.0 V
5.0 V
5.0 V
12 A
12 A
12 A
10 A
10 A
10 A
6A
6A
12 A
12 A
12 A
12 A
12 A
12 A
10 A
10 A
10 A
6A
6A
6A
82
83
85
89
90
90
91
91
82
82
83
83
85
85
89
90
90
91
91
91
Through-Hole
Through-Hole
Through-Hole
Through-Hole
Through-Hole
Through-Hole
Through-Hole
Through-Hole
SMT
SMT
SMT
SMT
SMT
SMT
SMT
SMT
SMT
SMT
SMT
SMT
HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW010A0F1Z
HW006A6A1
HW006A6A1Z
HW012A0P1-S
HW012A0P1-SZ
HW012A0M1-S
HW012A0M1-SZ
HW012A0Y1-S
HW012A0Y1-SZ
HW010A0G1-S
HW010A0F1-S
HW010A0F1-SZ
HW006A6A1-S
HW006A6A-S
HW006A6A1-SZ
108965591
108968389
108968405
108968421
108965625
CC109107141
108968363
CC109107133
108965617
109100360
108968371
CC109101805
108968397
109100377
108968413
108967985
108995214
108968355
CC109142155
109100352
Optional features can be ordered using the suffixes shown below. The suffixes follow the last letter of the Product Code and are
placed in descending alphanumerical order.
Table 2. Device Options
Option
Negative remote on/off logic
Approved for Basic Insulation
Surface mount interconnections
RoHS Compliant
Suffix
1
–B
–S
-Z
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© 2008 Lineage Power Corpor ation, (Mesquite, Texas ) All International Rights Res er ved.
Document No: ADS02-006EPS ver.1.4
PDF Name: fds03-0031.pdf