HY62KF08802B Series 1Mx8bit full CMOS SRAM Document Title 1M x 8bit 2.7 ~ 3.6V Super low Power FCMOS Slow SRAM Revision History Revision No 00 History Initial Draft Draft Date Remark Jan.19.2002 Preliminary This document is a general product description and is subject to change without notice. Hynix Electronics does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev.00 / Jan.02 Hynix Semiconductor HY62KF08802B Series DESCRIPTION FEATURES The HY62KF08802B is a high speed, super low power and 8Mbit full CMOS SRAM organized as 1M words by 8bits. The HY62KF08802B uses high performance full CMOS process technology and is designed for high speed and low power circuit technology. It is particularly well-suited for the high density low power system application. This device has a data retention mode that guarantees data to remain valid at a minimum power supply voltage of 1.2V. • Fully static operation and Tri-state output • TTL compatible inputs and outputs • Battery backup -. 1.2V(min) data retention • Standard pin configuration -. 44pin 400mil TSOP-II (Forward) Product No. Voltage (V) Speed (ns) Operation Current/Icc(mA) HY62KF08802B-I 2.7~3.6 55/70 2 Standby Current(uA) SL LL 12 30 Temperature (°C) -40~85 Note 1. I : Industrial 2. Current value is max. PIN CONNECTION I/O1 DATA I/O BUFFER WRITE DRIVER A19 MEMORY ARRAY 1M x 8 SENSE AMP ROW DECODER A0 BLOCK DECODER A5 A6 A7 /OE CS2 A8 NC NC I/O8 I/O7 Vss Vcc I/O6 I/O5 NC NC A9 A10 A11 A12 A13 A14 COLUMN DECODER 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 PRE DECODER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 ADD INPUT BUFFER A4 A3 A2 A1 A0 /CS1 NC NC I/O1 I/O2 Vcc Vss I/O3 I/O4 NC NC /WE A19 A18 A17 A16 A15 BLOCK DIAGRAM I/O8 /CS1 CS2 TSOPII (Forward) /OE /WE PIN DESCRIPTION Pin Name /CS1, CS2 /WE /OE I/O1~I/O8 Rev.00 / Jan.02 Pin Function Chip Select Write Enable Output Enable Data Inputs/Outputs Pin Name A0~A19 Vcc Vss NC Pin Function Address Inputs Power (2.7~3.6V) Ground No Connection 2 HY62KF08802B Series ORDERING INFORMATION Part No. HY62KF08802B-SD(I) HY62KF08802B-DD(I) Speed 55/70 55/70 Power SL-part LL-part Temp. I I Package TSOP-II TSOP-II Note 1. I : Industrial ABSOLUTE MAXIMUM RATINGS (1) Symbol VIN, VOUT Vcc TA TSTG PD TSOLDER Parameter Input/Output Voltage Power Supply Operating Temperature Storage Temperature Power Dissipation Ball Soldering Temperature & Time Rating -0.3 to VCC+0.3V -0.3 to 4.6 -40 to 85 -55 to 150 1.0 260 • 10 Unit V V °C °C W °C•sec Remark HY62KF08802B-I Note 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is stress rating only and the functional operation of the device under these or any other conditions above those indicated in the operation of this specification is not implied. Exposure to the absolute maximum rating conditions for extended period may affect reliability. TRUTH TABLE /CS1 CS2 /WE /OE Mode I/O Pin (I/O1~I/O8) H X L L L X L H H H X X H H L X X H L X Deselected Deselected Output Disabled Read Write High-Z High-Z High-Z DOUT DIN Power Standby Active Active Active Note: 1. H=VIH, L=VIL, X=don't care (VIL or VIH) Rev.00 / Jan.02 2 HY62KF08802B Series RECOMMENDED DC OPERATING CONDITION Symbol Vcc Vss VIH VIL Parameter Supply Voltage Ground Input High Voltage Input Low Voltage Min. 2.7 0 2.2 -0.31. Typ 3.0 or 3.3 0 - Max. 3.6 0 Vcc+0.3 0.6 Unit V V V V Note : 1. Undershoot : VIL = -1.5V for pulse width less than 30ns 2. Undershoot is sampled, not 100% tested. DC ELECTRICAL CHARACTERISTICS TA = -40°C to 85°C Sym Parameter ILI Input Leakage Current ILO Output Leakage Current Icc Operating Power Supply Current ICC1 ISB Average Operating Current Standby Current (TTL Input) ISB1 Standby Current (CMOS Input) VOL VOH Output Low Output High Test Condition Vss < VIN < Vcc Vss < VOUT < Vcc, /CS1 = VIH or CS2 = VIL or /OE = VIH or /WE = VIL /CS1 = VIL, CS2 = VIH VIN = VIH or VIL, II/O = 0mA /CS1 = VIL, CS2 = VIH 3.0~ 55ns VIN = VIH or VIL, Cycle 3.6V 70ns Time = Min, 2.7~ 55ns 100% Duty, II/O = 0mA 3.3V 70ns /CS1 < 0.2V, CS2 > Vcc-0.2V VIN < 0.2V or VIN > Vcc-0.2V, Cycle Time = 1us, 100% Duty, II/O = 0mA /CS1 = VIH, CS2 = VIL VIN = VIH or VIL /CS1 > Vcc - 0.2V, 3.0~ SL CS2 < Vss + 0.2V, 3.6V LL VIN > Vcc - 0.2V or SL 2.7~ VIN < Vss + 0.2V 3.3V LL IOL = 2.1mA IOH = -1.0mA Min -1 Typ1. - Max 1 Unit uA -1 - 1 uA 4 mA 25 20 20 15 mA mA mA mA 3 mA 300 uA 12 30 12 25 0.4 - uA uA uA uA V V 2.4 0.2 0.2 0.2 0.2 - Note 1. Typical values are at Vcc = 3.0V TA = 25°C 2. Typical values are not 100% tested CAPACITANCE (Temp = 25°C, f= 1.0MHz) Symbol Parameter CIN Input Capacitance (Add, /CS1,CS2, /WE, /OE) COUT Output Capacitance (I/O) Condition VIN = 0V VI/O = 0V Max. 8 10 Unit pF pF Note : These parameters are sampled and not 100% tested Rev.00 / Jan.02 3 HY62KF08802B Series AC CHARACTERISTICS TA = -40°C to 85°C, unless otherwise specified # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 Symbol 55ns Min. Max. Parameter READ CYCLE tRC Read Cycle Time tAA Address Access Time tACS Chip Select Access Time tOE Output Enable to Output Valid tCLZ Chip Select to Output in Low Z tOLZ Output Enable to Output in Low Z tCHZ Chip Deselection to Output in High Z tOHZ Out Disable to Output in High Z tOH Output Hold from Address Change WRITE CYCLE tWC Write Cycle Time tCW Chip Selection to End of Write tAW Address Valid to End of Write tAS Address Set-up Time tWP Write Pulse Width tWR Write Recovery Time tWHZ Write to Output in High Z tDW Data to Write Time Overlap tDH Data Hold from Write Time tOW Output Active from End of Write 70ns Min. Max. Unit 55 10 5 0 0 10 55 55 30 20 20 - 70 10 5 0 0 10 70 70 35 25 25 - ns ns ns ns ns ns ns ns ns 55 50 50 0 45 0 0 25 0 5 20 - 70 60 60 0 50 0 0 30 0 5 20 - ns ns ns ns ns ns ns ns ns ns AC TEST CONDITIONS TA = -40°C to 85°C, unless otherwise specified Parameter Input Pulse Level Input Rise and Fall Time Input and Output Timing Reference Level Output Load tCLZ, tOLZ, tCHZ, tOHZ, tWHZ, tOW Others Value 0.4V to 2.2V 5ns 1.5V CL = 5pF + 1TTL Load CL = 30pF + 1TTL Load AC TEST LOADS VTM=2.8V 1029 Ohm DOUT CL(1) 1728 Ohm Note 1. Including jig and scope capacitance Rev.00 / Jan.02 4 HY62KF08802B Series TIMING DIAGRAM READ CYCLE 1 (Note 1,4) tRC ADDR tAA tOH tACS /CS1 CS2 tCHZ(3) tOE /OE tOLZ(3) Data Out tOHZ(3) tCLZ(3) High-Z Data Valid READ CYCLE 2 (Note 1,2,4) tRC ADDR tAA tOH tOH Data Out Previous Data Data Valid READ CYCLE 3 (Note 1,2,4) /CS1 CS2 tACS tCLZ(3) Data Out tCHZ(3) Data Valid Notes: 1. Read Cycle occurs whenever a high on the /WE and /OE is low, while /CS1 and CS2 are in active status. 2. /OE = VIL 3. Transition is measured + 200mV from steady state voltage. This parameter is sampled and not 100% tested. 4. /CS1 in high for the standby, low for active CS2 in low for the standby, high for active. Rev.00 / Jan.02 5 HY62KF08802B Series WRITE CYCLE 1 (1,4,8) (/WE Controlled) tWC ADDR tWR(2) tCW /CS1 CS2 tAW tWP /WE tAS Data In tDW High-Z tDH Data Valid tWHZ(3,7) tOW (5) (6) Data Out WRITE CYCLE 2 (Note 1,4,8) (/CS1, CS2 Controlled) tWC ADDR tCW tAS tWR(2) /CS1 tAW CS2 tWP /WE tDW Data In Data Out High-Z tDH Data Valid High-Z Notes: 1. A write occurs during the overlap of a low /WE, a low /CS1, a high CS2. 2. tWR is measured from the earlier of /CS1or /WE going high or CS2 going low to the end of write cycle. 3. During this period, I/O pins are in the output state so that the input signals of opposite phase to the output must not be applied. 4. If the /CS1, CS2 high transition occur simultaneously with the /WE low transition or after the /WE transition, outputs remain in a high impedance state. 5. Q(data out) is the same phase with the write data of this write cycle. 6. Q(data out) is the read data of the next address. 7. Transition is measured + 200mV from steady state. This parameter is sampled and not 100% tested. 8. /CS1 in high for the standby, low for active. CS2 in low for the standby, high for active. Rev.00 / Jan.02 6 HY62KF08802B Series DATA RETENTION ELECTRIC CHARACTERISTIC TA = -40°C to 85°C Symbol Parameter VDR Vcc for Data Retention Iccdr Data Retention Current tCDR tR Chip Deselect to Data Retention Time Operating Recovery Time Test Condition /CS > Vcc - 0.2V, VIN > Vcc - 0.2V or VIN < Vss + 0.2V Vcc=1.5V, /CS > Vcc - 0.2V or VIN > Vcc - 0.2V or VIN < Vss + 0.2V Min Typ1. Max Unit 1.2 - 3.6 V SL - 0.1 6 uA LL - 0.1 20 uA 0 - - ns tRC - - ns See Data Retention Timing Diagram Notes: 1. Typical values are under the condition of TA = 25°C. 2. Typical value are sampled and not 100% tested DATA RETENTION TIMING DIAGRAM 1 DATA RETENTION MODE VCC 2.7V tCDR tR VIH VDR CS1>VCC-0.2V /CS1 VSS DATA RETENTION TIMING DIAGRAM 2 DATA RETENTION MODE VCC 2.7V tCDR tR CS2 VDR 0.4V VSS Rev.00 / Jan.02 CS2<0.2V 7 HY62KF08802B Series PACKAGE INFORMATION 44pin 400mil Thin Small Outline Package Forward (D) #44 #23 UNIT : INCH(mm) #1 #22 Max. Min. 0.470(11.938) 0.462(11.735) 0.729(18.517) 0.721(18.313) 0.047(1.194) 0.039(0.991) 0.0083(0.21) 0.0047(0.120) 0.404(10.262) 0.396(10.058) 0.10MAX 0.004MAX 0.016(0.4) 0.012(0.3) Rev.00 / Jan.02 0.0315(0.800) BSC 0.0059(0.150) 0.002(0.050) 0.0235(0.597) 0.0160(0.406) 0~5 8 HY62KF08802B Series MARKING INFORMATION Package TSOP-II (Forward) Marking Example h y n i x H Y 6 2 K K O R E A F 8 8 0 2 y y w w p B c s s t Index • hynix : hynix Logo • yy : Year ( ex : 02 = year 2002, 03 = year 2002 ) • ww : Work Week ( ex : 12 = ww12 ) •p : Process Code • HY62KF8802B : Part Name •c : Power Consumption -D -S • ss : Low Low Power : Super Low Power : Speed - 55 - 70 : 55ns : 70ns •t : Temperature -I • KOREA : Origin Country Note - Capital Letter - Small Letter : Fixed Item : Non-fixed Item (Except hynix) Rev.00 / Jan.02 : Industrial ( -40 ~ 85 °C ) 9