IFX8117 1A Low-Dropout Linear Voltage Regulator IFX8117MEV IFX8117MEV33 IFX8117MEV50 Data Sheet Rev. 1.01, 2010-07-02 Standard Power 1A Low-Dropout Linear Voltage Regulator 1 IFX8117 Overview Features • • • • • • • • • 5 V, 3.3 V and Adjustable Voltage Versions SOT-223 Package Output Current Limitation and Overtemperature Shutdown Output Current up to 1A Temperature Range 0 °C to 125 °C Line Regulation max. 0.2 % Load Regulation max. 0.4 % “1117” and “8117” Pin Compatible Green Product (RoHS compliant) PG-SOT223-4 Applications • • • • • • • • Post Regulator for Switching DC/DC Converter High Efficiency Linear Regulators Battery Charger Battery Powered Instrumentation 5 V to 3.3 V Linear Regulators USB Hubs Routers, ISDN/DSL Modems Active SCSI Terminators General Description The IFX8117 is a family of low dropout voltage regulators with a dropout voltage of 1.2 V at 1 A of load current. It is available as adjustable version (IFX8117MEV), providing output voltages from 1.25 V to 13.8 V, configured by two external resistors. Additionally, the IFX8117 is also available in two fixed voltages, 5 V (IFX8117MEV50) and 3.3 V (IFX8117MEV33). The IFX8117 implements protection features such as output current limitation and overtemperature shutdown. A highly precise bandgap reference trimmed in production assures output voltage accuracy to within ±1 %. The IFX8117 family comes in the PG-SOT223-4 package. To improve the transient response and the stability, a minimum of 10 µF tantalum capacitor is required at the output. Type Package Marking IFX8117MEV PG-SOT223-4 8117AD IFX8117MEV33 PG-SOT223-4 8117V3 IFX8117MEV50 PG-SOT223-4 8117V5 Data Sheet 2 Rev. 1.01, 2010-07-02 IFX8117 Typical Application 2 Typical Application IFX 8117 VI 10 µF* VQ GND *Required if the regulator is located far from the power supply filter Figure 1 Data Sheet 10 µF Typical_Application.vsd Typical Application 3 Rev. 1.01, 2010-07-02 IFX8117 Block Diagram 3 Block Diagram IFX8117 I Power Stage CL + - Thermal Shutdown Q CL: Current Limitation GND Block_Diagram.vsd Figure 2 Block Diagram (fixed voltage versions IFX8117MEV33 and IFX8117MEV50) IFX8117 I Power Stage CL + - Thermal Shutdown Q CL: Current Limitation ADJ Block_Diagram_Adj.vsd Figure 3 Data Sheet Block Diagram (adjustable voltage version IFX8117MEV) 4 Rev. 1.01, 2010-07-02 IFX8117 Pin Configuration 4 Pin Configuration 4.1 Pin Assignment Fixed Voltage Versions IFX8117MEV33 and IFX8117MEV50 PG-SOT223-4 Q 4 1 2 3 GND Q I AEP02868_1117_01 Figure 4 Pin Assignment IFX8117MEV33 and IFX8117MEV50 (top view) 4.2 Pin Definitions and Functions Fixed Voltage Versions IFX8117MEV33 and IFX8117MEV50 Pin Symbol Function 1 GND Ground 2 Q Output block to GND with a capacitor close to the IC terminals, respecting the values given for its capacitance CQ and ESR in the table “Functional Range” on Page 8 3 I Input for compensating line influences, a capacitor to GND close to the IC terminals is recommended 4 (Tab) Q Data Sheet Output connect to pin 2; connect to heatsink area 5 Rev. 1.01, 2010-07-02 IFX8117 Pin Configuration 4.3 Pin Assignment Adjustable Voltage Version IFX8117MEV PG-SOT223-4 Q 4 1 2 3 ADJ Q I AEP02868_1117_02 Figure 5 Pin Assignment IFX8117MEV (top view) 4.4 Pin Definitions and Functions Fixed Voltage Version IFX8117MEV Pin Symbol Function 1 ADJ Adjust connect to a voltage divider between Q and GND, see “External Resistor Divider (Adjustable Version IFX8117MEV only)” on Page 16 2 Q Output block to GND with a capacitor close to the IC terminals, respecting the values given for its capacitance CQ and ESR in the table “Functional Range” on Page 8 3 I Input for compensating line influences, a capacitor to GND close to the IC terminals is recommended 4 (Tab) Q Data Sheet Output connect to pin 2; connect to heatsink area 6 Rev. 1.01, 2010-07-02 IFX8117 General Product Characteristics 5 General Product Characteristics 5.1 Absolute Maximum Ratings Absolute Maximum Ratings 1) 0°C ≤ Tj ≤ 125 °C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Max. VI -0.3 20 V – Voltage VI - VQ -0.3 20 V – 5.1.3 Voltage VQ -0.3 20 V IFX8117MEV33 IFX8117MEV50 5.1.4 Voltage VQ - VADJ -0.3 6 V IFX8117MEV Tj Tstg -40 150 °C – -50 150 °C – VESD,HBM -3 3 kV Human Body Model (HBM)2) VESD,CDM -1 1 kV Charge Device Model (CDM)3) Input (fixed voltage version only) 5.1.1 Voltage Input (adjustable voltage version only) 5.1.2 Output Temperature 5.1.5 Junction Temperature 5.1.6 Storage Temperature Electrostatic Discharge ESD 5.1.7 ESD 5.1.8 1) Not subject to production test, specified by design. 2) ESD susceptibility, HBM according to EIA/JESD 22-A114B 3) ESD susceptibility, CDM EIA/JESD22-C101 or ESDA STM5.3.1 Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation. Data Sheet 7 Rev. 1.01, 2010-07-02 IFX8117 General Product Characteristics 5.2 Pos. 5.2.1 5.2.2 5.2.3 Functional Range Parameter Symbol VI Input Voltage Output Capacitor’s Requirements for Stability Junction Temperature Limit Values Unit Conditions Min. Max. VQ + VDR 15 V IFX8117MEV 4.55 15 V IFX8117MEV33 6.25 15 V IFX8117MEV50 – µF – 5 Ω – 125 °C – CQ 10 ESR(CQ) 0.5 Tj 0 Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table. 5.3 Pos. Thermal Resistance Parameter Symbol Limit Values Min. 1) Typ. Unit Conditions Max. RthSP – 15 – K/W measured to Pin 4 (Tab) RthJA – 51 – K/W 2) 5.3.3 – 146 – K/W Footprint only3) 5.3.4 – 75 – K/W 300mm2 heatsink area on PCB3) 5.3.5 – 63 – K/W 600mm2 heatsink area on PCB3) 5.3.1 Junction to Soldering Point 5.3.2 Junction to Ambient1) 1) not subject to production test, specified by design 2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). Where applicable a thermal via array under the heat slug contacted the first inner copper layer. 3) Specified RthJA value is according to Jedec JESD 51-3 at natural convection on FR4 1s0p board; The Product (Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu). Data Sheet 8 Rev. 1.01, 2010-07-02 IFX8117 General Product Characteristics 5.4 Electrical Characteristics Electrical Characteristics Adjustable Version IFX8117MEV 0 °C ≤ Tj ≤ 125 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol 5.4.1 Reference Voltage VRef 5.4.2 5.4.3 5.4.4 Line Regulation1) Load Regulation 1) Dropout Voltage2) Vdr = VI - VQ Limit Values Unit Conditions VQ IQ = 10 mA VI - VQ = 2 V TJ = 25 °C 10 mA < IQ < 1 A 1.4 V < VI - VQ < 10 V IQ = 10 mA 1.5 V < VI - VQ < 13.75 V VI - VQ = 3 V 10 mA < IQ < 1 A Min. Typ. Max. 1.238 1.250 1.262 V 1.225 1.250 1.270 V ΔVQ,line – 0.035 0.2 % of ΔVQ,load – Vdr – 1.1 1.15 V IQ = 100 mA – 1.15 1.2 V IQ = 500 mA – 1.2 1.25 1.0 1.4 1.9 IQ = 1 A A VI - VQ = 5 V TJ = 25 °C mA VI = 15 V % of TA = 25 °C VQ per 30 ms pulse VQ 0.2 0.4 % of V 5.4.5 Output Current Limitation IQ,max 5.4.6 Minimum Load Current3) 0.4 5 5.4.7 Thermal Regulation IQ,min – ΔVQ,power – 0.01 0.1 5.4.8 Power Supply Ripple Rejection4) PSRR 60 75 – dB VI - VQ = 3 V fripple = 120 Hz Vripple = 1 Vpp 5.4.9 Adjust Pin Current IADJ 10 30 50 µA – 5.4.10 Adjust Pin Current Change ΔIADJ – 0.2 5 µA 10 mA < IQ < 1 A 1.4 V < VI - VQ < 10 V 5.4.11 Temperature Stability4) ΔVQ,temp – 0.5 – % of – 1W 5.4.12 5.4.13 1) 2) 3) 4) Long Term Stability4) RMS Output Noise4) VQ ΔVQ,1000h – 0.3 VQ,RMS 0.003 – – – VQ TA = 125 °C 1000h % of 10 Hz < f < 10 kHz % of VQ Measured at constant junction temperature Measured when the output voltage VQ has dropped 100mV from the nominal value obtained at VI = VQ + 1.5 V Minimum output current required to maintain regulation Not subject to production test, specified by design Data Sheet 9 Rev. 1.01, 2010-07-02 IFX8117 General Product Characteristics Electrical Characteristics 3.3 V Version IFX8117MEV33 0 °C ≤ Tj ≤ 125 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol 5.4.14 Output Voltage VQ Limit Values Unit Conditions VQ IQ = 10 mA VI = 5 V TJ = 25 °C 0 mA < IQ < 1 A 4.75 V < VI < 10 V IQ = 0 mA 4.75 V < VI < 15 V VI = 4.75 V 0 mA < IQ < 1 A Min. Typ. Max. 3.267 3.300 3.333 V 3.235 3.300 3.365 V 5.4.15 Line Regulation1) ΔVQ,line – 1 6 mV 5.4.16 Load Regulation1) ΔVQ,load – 0.2 0.4 % of Vdr – 1.1 1.15 V IQ = 100 mA – 1.15 1.2 V IQ = 500 mA – 1.2 1.25 1.0 1.4 1.9 IQ = 1 A A VI - VQ = 5 V TJ = 25 °C mA VI = 15 V % of TA = 25 °C VQ per 30 ms pulse 5.4.17 Dropout Voltage2) Vdr = VI - VQ V 5.4.18 Output Current Limitation IQ,max 5.4.19 Quiescent Current 5 10 5.4.20 Thermal Regulation Iq – ΔVQ,power – 0.01 0.1 5.4.21 Power Supply Ripple Rejection3) PSRR 60 75 – dB VI - VQ = 3 V fripple = 120 Hz Vripple = 1 Vpp 5.4.22 Temperature Stability3) ΔVQ,temp – 0.5 – % of – 1W 5.4.23 5.4.24 Long Term Stability3) RMS Output Noise3) VQ ΔVQ,1000h – 0.3 VQ,RMS 0.003 – – – VQ TA = 125 °C 1000h % of 10 Hz < f < 10 kHz % of VQ 1) Measured at constant junction temperature 2) Measured when the output voltage VQ has dropped 100mV from the nominal value obtained at VI = VQ + 1.5 V 3) Not subject to production test, specified by design Data Sheet 10 Rev. 1.01, 2010-07-02 IFX8117 General Product Characteristics Electrical Characteristics 5 V Version IFX8117MEV50 0 °C ≤ Tj ≤ 125 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol 5.4.25 Output Voltage VQ Limit Values Unit Conditions VQ IQ = 10 mA VI = 7 V TJ = 25 °C 0 mA < IQ < 1 A 6.5 V < VI < 10 V IQ = 0 mA 6.5 V < VI < 15 V VI = 6.5 V 0 mA < IQ < 1 A Min. Typ. Max. 4.950 5.000 5.050 V 4.900 5.000 5.100 V 5.4.26 Line Regulation1) ΔVQ,line – 1 6 mV 5.4.27 Load Regulation1) ΔVQ,load – 0.2 0.4 % of Vdr – 1.1 1.15 V IQ = 100 mA – 1.15 1.2 V IQ = 500 mA – 1.2 1.25 1.0 1.4 1.9 IQ = 1 A A VI - VQ = 5 V TJ = 25 °C mA VI = 15 V % of TA = 25 °C VQ per 30 ms pulse 5.4.28 Dropout Voltage2) Vdr = VI - VQ V 5.4.29 Output Current Limitation IQ,max 5.4.30 Quiescent Current 5 10 5.4.31 Thermal Regulation Iq – ΔVQ,power – 0.01 0.1 5.4.32 Power Supply Ripple Rejection3) PSRR 60 75 – dB VI - VQ = 3 V fripple = 120 Hz Vripple = 1 Vpp 5.4.33 Temperature Stability3) ΔVQ,temp – 0.5 – % of – 1W 5.4.34 5.4.35 Long Term Stability3) RMS Output Noise3) VQ ΔVQ,1000h – 0.3 VQ,RMS 0.003 – – – VQ TA = 125 °C 1000h % of 10 Hz < f < 10 kHz % of VQ 1) Measured at constant junction temperature 2) Measured when the output voltage VQ has dropped 100mV from the nominal value obtained at VI = VQ + 1.5 V 3) Not subject to production test, specified by design Data Sheet 11 Rev. 1.01, 2010-07-02 IFX8117 General Product Characteristics 5.5 Typical Performance Characteristics Dropout Voltage V dr versus Dropout Voltage V dr versus Output Current I Q Junction Temperature T j 1_VDR_IQ.VSD 1200 2_VDR_TJ.VSD 1200 T j = 0 °C T j = 25 °C 1000 I Q = 100 mA 800 V dr [V] 800 V dr [V] IQ = 1 A 1000 T j = 125 °C 600 600 400 400 200 200 0 I Q = 10 mA 0 0 200 400 600 800 1000 -50 0 I Q [mA] 50 100 150 T j [°C] Load Regulation ΔVQ,load versus ΔIQ Line Regulation ΔVQ,line versus ΔVI 0,000 DVQ_DVI.vsd 0,070 DVQ_DIQ.vsd -0,005 T j = 125 °C T j = 25 °C 0,060 T j = 0 °C ΔV Q,line [% of V Q] ΔV Q,load [% of V Q] -0,010 -0,015 -0,020 -0,025 T j = 0 °C -0,030 T j = 25 °C 0,050 0,040 0,030 0,020 -0,035 0,010 -0,040 T j = 125 °C -0,045 0 200 400 600 800 0,000 0 1000 10 15 20 VI [V] I Q [mA] Data Sheet 5 12 Rev. 1.01, 2010-07-02 IFX8117 General Product Characteristics Current Limit IQ,max versus VI Temperature Stability ΔVQ versus Tj 0,010 VQ_Tj.vsd IQmax_VI.vsd 1600 1400 0,005 VI = 7 V 1200 V I = 15 V Ι Q,max [ mA ] ΔV Q[% of V Q] I Q = 5 mA 0,000 1000 800 600 -0,005 400 200 -0,010 0 0 50 100 150 T j [°C] -0,015 0 50 100 IFX8117MEV (adjustable) Adjust Pin Current IADJ versus TJ IFX8117MEV (adj.) Power Supply Ripple Rejection PSRR versus fr IADJ_Tj.vsd 35 10_PSRR_FR_ADJ.VSD 100 30 90 80 70 PSRR [dB] Ι ADJ [µA] 25 20 15 60 I Q = 1 mA 50 40 I Q = 10 mA 30 10 I Q = 100 mA 20 5 10 0 0,01 0 0 50 100 150 0,1 1 10 100 1000 f [kHz] T j [°C] Data Sheet 13 Rev. 1.01, 2010-07-02 IFX8117 General Product Characteristics IFX8117MEV (adj.) Load Transient Response IFX8117MEV (adj.) Line Transient Response adjLoadTransResp.vsd adjLineTransResp.vsd ΔV Q Δ VQ 3 3 0 0 -3 -3 [%] [%] VI - VQ = 3 V CQ = 10 µF Tantalum -6 -6 IQ = 100 mA CQ = 10 µF Tantalum V I - VQ ΙQ [A] [V] 0.6 3.5 0.1 2.5 0 20 40 60 0 80 20 40 60 80 t [µs] IFX8117MEV33 (3.3 V) Load Transient Response t [µs] IFX8117MEV33 (3.3 V) Line Transient Response 33LineTransResp.vsd 33LoadTransResp.vsd ΔVQ Δ VQ 50 50 0 0 [mV] [mV] -50 -50 VI = 5 V CQ = 10 µF Tantalum -100 IQ = 100 mA CQ = 10 µF Tantalum Ι Q [A] V I [V] 0.6 5.75 0.1 4.75 0 20 40 60 0 80 40 60 80 t [µs] t [µs] Data Sheet 20 14 Rev. 1.01, 2010-07-02 IFX8117 General Product Characteristics IFX8117MEV50 (5 V) Load Transient Response IFX8117MEV50 (5 V) Line Transient Response 50LoadTransResp.vsd 50LineTransResp.vsd V Q [V] V Q [V] 5.1 5.1 5.0 5.0 4.9 4.9 VI = 7 V CQ = 10 µF Tantalum 4.8 4.8 IQ = 100 mA CQ = 10 µF Tantalum ΙQ [A] V I [V] 0.6 8.0 0.1 7.0 0 20 40 60 0 80 t [µs] Data Sheet 20 40 60 80 t [µs] 15 Rev. 1.01, 2010-07-02 IFX8117 Application Hints 6 Application Hints 6.1 External Components Input Capacitor An input capacitor is recommended to compensate line influences. As a minimum a 100 nF ceramic input capacitor should be used to filter high frequency noise. For buffering line transients a capacitance of 10µF is suggested. Output Capacitor The output capacitor is part of the regulation loop of the regulator and therefore important to maintain stability. It must meet the required conditions for minimum capacitance value and maximum value of equivalent series resistance (ESR) as given in “Functional Range” on Page 8. An increase of the output capacitance will improve the transient response and the loop stability. To achieve low voltage drops at load transients, tantalum capacitors are recommended. External Resistor Divider (Adjustable Version IFX8117MEV only) The IFX8117MEV adjustable version develops a 1.25 V reference voltage, VRef, between the output Q and the adjust terminal ADJ. As shown in Figure 6, this voltage is applied across resistor R1 to generate a constant current I1. The current IADJ from the adjust terminal could introduce error to the output. But since it is very small (50µA) compared to the I1 and very constant with line and load changes, the error can be ignored. The constant current I1 then flows through the output set resistor R2 and sets the output voltage to the desired level. At the fixed voltage devices IFX8117MEV33 and IFX8117MEV50 the resistor divider is integrated inside the device. IFX 8117 MEV VI VQ I1 V Ref ADJ 10 µF R1 10 µF IADJ R2 V Q = VRef (1 + R2/R1 ) + IADJR2 Adjustable _Version .vsd Figure 6 Data Sheet IFX8117MEV Adjustable Version 16 Rev. 1.01, 2010-07-02 IFX8117 Application Hints 6.2 Protection Diodes 1N4001 (optional ) IFX 8117 MEV VI VQ R1 ADJ R2 Protection_Diode.vsd Figure 7 IFX8117MEV with Protection Diode In normal operating conditions, no diodes are needed for protection of the device. In case the input is shorted to GND and the output capacitor is still charged, a peak current can flow from the output to the input of the regulator. This peak current depends on the size and the equivalent series resistor (ESR) of the output capacitor. When the input is instantaneously shorted to GND, and with a large output capacitor with low ESR, the regulator risks to be damaged. For this environment it is recommended to add an external diode between the output and the input to protect the regulator as shown in Figure 7. Data Sheet 17 Rev. 1.01, 2010-07-02 IFX8117 Package Outlines Package Outlines 1.6±0.1 6.5 ±0.2 A 0.1 MAX. 3 ±0.1 7 ±0.3 3 2 0.5 MIN. 1 2.3 0.7 ±0.1 B 15˚ MAX. 4 3.5 ±0.2 7 4.6 0.28 ±0.04 0...10˚ 0.25 M A 0.25 M B GPS05560 Figure 8 PG-SOT223-4 Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Data Sheet 18 Dimensions in mm Rev. 1.01, 2010-07-02 IFX8117 Revision History 8 Revision History Version Date Changes 1.01 2010-07-02 data sheet Rev. 1.01 editorial changes Data Sheet 19 Rev. 1.01, 2010-07-02 Edition 2010-07-02 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.