INTERSIL ISL28291FBZ

ISL28191, ISL28291
®
Data Sheet
February 20, 2008
Single and Dual Single Supply Ultra-Low
Noise, Low Distortion Rail-to-Rail Output,
Op Amp
The ISL28191 and ISL28291 are tiny single and dual
ultra-low noise, ultra-low distortion operational amplifiers.
They are fully specified to operate down to +3V single
supply. These amplifiers have outputs that swing rail-to-rail
and an input common mode voltage that extends to ground
(ground sensing).
The ISL28191 and ISL28291 are unity gain stable with an
input referred voltage noise of 1.7nV/√Hz. Both parts feature
0.00018% THD+N at 1kHz.
FN6156.5
Features
• 1.7nV/√Hz input voltage noise at 1kHz
• 1kHz THD+N typical 0.00018% at 2VP-P VOUT
• Harmonic Distortion -76dBc, -70dBc, fo = 1MHz
• 61MHz -3dB bandwidth
• 630µV maximum offset voltage
• 3µA input bias current
• 100dB typical CMRR
• 3V to 5.5V single supply voltage range
• Rail-to-rail output
The ISL28191 is available in the space-saving 6 Ld µTDFN
(1.6mmx1.6mm) and 6 Ld SOT-23 packages. The ISL28291
is available in the 8 Ld SOIC, 10 Ld 1.8mmx1.4mm µTQFN
and 10 Ld MSOP packages. All devices are guaranteed over
-40°C to +125°C.
Ordering Information
PART
NUMBER
PART
MARKING
PACKAGE
(Pb-free)
PKG.
DWG. #
• Ground Sensing
• Enable pin (not available in the 8 Ld SOIC package
option)
• Pb-free (RoHS compliant)
Applications
• Low noise signal processing
ISL28191FHZ-T7* (Note 1)
GABJ
6 Ld SOT-23 MDP0038
• Low noise microphones/preamplifiers
Coming Soon
ISL28191FRUZ (Note 2)
M8
6 Ld µTDFN
L6.1.6x1.6A
• ADC buffers
Coming Soon
M8
ISL28191FRUZ-T7* (Note 2)
6 Ld µTDFN
L6.1.6x1.6A
ISL28291FUZ (Note 1)
8291Z
10 Ld MSOP MDP0043
• Strain gauges/sensor amplifiers
ISL28291FUZ-T7* (Note 1)
8291Z
10 Ld MSOP MDP0043
• Radio systems
Coming Soon
ISL28291FBZ (Note 1)
28291 FBZ 8 Ld SOIC
MDP0027
Coming Soon
ISL28291FBZ-T7 (Note 1)
28291 FBZ 8 Ld SOIC
MDP0027
• DAC output amplifiers
• Digital scales
Coming Soon
F
ISL28291FRUZ-T7* (Note 2)
• Portable equipment
• Infrared detectors
10 Ld µTQFN L10.1.8x1.4A
*Please refer to TB347 for details on reel specifications.
NOTES:
1. These Intersil Pb-free plastic packaged products employ special
Pb-free material sets; molding compounds/die attach materials
and 100% matte tin plate PLUS ANNEAL - e3 termination finish,
which is RoHS compliant and compatible with both SnPb and Pbfree soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J STD-020.
2. These Intersil Pb-free plastic packaged products employ special
Pb-free material sets; molding compounds/die attach materials
and NiPdAu plate - e4 termination finish, which is RoHS compliant
and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2006-2008. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
ISL28191, ISL28291
Pinouts
ISL28191
(6 LD 1.6X1.6X0.5 µTDFN)
TOP VIEW
ISL28191
(6 LD SOT-23)
TOP VIEW
OUT 1
V- 2
IN+ 3
OUT 1
6 V+
5 EN
IN- 2
5 EN
4 IN-
IN+ 3
+
+
V- 4
7 OUT_B
IN-_A 2
6 IN-_B
IN+_A 3
5 IN+_B
V- 4
EN_A 5
10 V+
9 OUT_B
+
+
8 IN-_B
7 IN+_B
6 EN_B
IN-_A
V+
OUT_B
ISL28291
(10 LD µTQFN)
TOP VIEW
OUT_A
10
9
8
1
7
2
6 IN+_B
2
3
4
5
EN_B
IN+_A
IN-_B
+
+
EN_A
IN+_A 3
OUT_A 1
8 V+
V-
IN-_A 2
4 V-
ISL28291
(10 LD MSOP)
TOP VIEW
ISL28291
(8 LD SOIC)
TOP VIEW
OUT_A 1
- +
+ -
6 V+
FN6156.5
February 20, 2008
ISL28191, ISL28291
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V
Supply Turn On Voltage Slew Rate . . . . . . . . . . . . . . . . . . . . . 1V/µs
Differential Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . V- - 0.5V to V+ + 0.5V
ESD Tolerance
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .300V
Thermal Resistance
θJA (°C/W)
6 Ld SOT-23 Package . . . . . . . . . . . . . . . . . . . . . . .
230
6 Ld µTDFN Package . . . . . . . . . . . . . . . . . . . . . . .
120
8 Ld SO Package . . . . . . . . . . . . . . . . . . . . . . . . . . .
110
10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . .
115
6 Ld µTQFN Package . . . . . . . . . . . . . . . . . . . . . . .
143
Ambient Operating Temperature Range . . . . . . . . .-40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER
V+ = 5.0V, V- = GND, RL = Open, RF = 1kΩ, AV = -1 unless otherwise specified. Parameters are per amplifier.
Typical values are at V+= 5V, TA = +25°C. Boldface limits apply over the operating temperature range,
-40°C to +125°C, temperature data guaranteed by characterization.
DESCRIPTION
CONDITIONS
MIN
(Note 3)
TYP
MAX
(Note 3)
UNIT
DC SPECIFICATIONS
VOS
Input Offset Voltage
ΔV OS
--------------ΔT
Input Offset Drift vs Temperature
IIO
Input Offset Current
35
500
900
nA
IB
Input Bias Current
3
6
7
µA
CMIR
Common-Mode Input Range
3.8
V
CMRR
Common-Mode Rejection Ratio
VCM = 0V to 3.8V
78
100
dB
PSRR
Power Supply Rejection Ratio
VS = 3V to 5V
74
80
dB
AVOL
Large Signal Voltage Gain
VO = 0.5V to 4V, RL = 1kΩ
90
86
98
dB
VOUT
Maximum Output Voltage Swing
Output low, RL = 1kΩ
270
Figure 21
3.1
0
Output high, RL = 1kΩ, V+ = 5V
630
840
20
4.95
4.92
µV
µV/°C
50
80
4.97
mV
V
IS,ON
Supply Current, Enabled
2.6
3.5
3.9
mA
IS,OFF
Supply Current, Disabled
26
35
48
µA
IO+
Short-Circuit Output Current
RL = 10Ω
95
90
130
mA
IO-
Short-Circuit Output Current
RL = 10Ω
95
90
130
mA
VSUPPLY
Supply Operating Range
V+ to V-
3
VENH
EN High Level
Referred to V-
2
VENL
EN Low Level
Referred to V-
3
5.5
V
V
0.8
V
FN6156.5
February 20, 2008
ISL28191, ISL28291
Electrical Specifications
PARAMETER
V+ = 5.0V, V- = GND, RL = Open, RF = 1kΩ, AV = -1 unless otherwise specified. Parameters are per amplifier.
Typical values are at V+= 5V, TA = +25°C. Boldface limits apply over the operating temperature range,
-40°C to +125°C, temperature data guaranteed by characterization. (Continued)
DESCRIPTION
CONDITIONS
MIN
(Note 3)
TYP
MAX
(Note 3)
UNIT
IENH
EN Pin Input High Current
VEN = V+
0.8
1.1
1.3
µA
IENL
EN Pin Input Low Current
VEN = V-
20
80
100
nA
61
MHz
0.00018
%
-76
dBc
-70
dBc
AC SPECIFICATIONS
GBW
-3dB Unity Gain Bandwidth
RF = 0Ω, CL = 20pF, AV = 1, RL = 10kΩ
THD+N
Total Harmonic Distortion + Noise
f = 1kHz. VOUT + 2VP-P, AV = +1, RL = 10kΩ
HD
(1MHz)
2nd Harmonic Distortion
2VP-P output voltage, AV = 1
ISO
Off-state Isolation
fO = 100kHz
AV = +1, VIN = 100mVP-P, RF = 0Ω
CL = 20pF, AV = 1, RL = 10kΩ
-38
dB
X-TALK
ISL28291
Channel to Channel Crosstalk
fO = 100kHz
VS = ±2.5V, AV = +1, VIN = 1VP-P,
RF = 0Ω, CL = 20pF, AV = 1, RL = 10kΩ
-105
dB
PSRR
Power Supply Rejection Ratio
fO = 100kHz
VS = ±2.5V, AV = +1, VSOURCE = 1VP-P,
RF = 0Ω, CL = 20pF, AV = 1, RL = 10kΩ
-70
dB
CMRR
Common Mode Rejection Ratio
fO = 100kHz
VS = ±2.5V, AV = +1, VCM = 1VP-P,
RF = 0Ω, CL = 20pF, AV = 1, RL = 10kΩ
-65
dB
en
Input Referred Voltage Noise
fO = 1kHz
1.7
nV/√Hz
in
Input Referred Current Noise
fO = 1kHz
1.8
pA/√Hz
17
V/µs
7
ns
12
ns
44
ns
50
ns
190
ns
190
ns
3rd Harmonic Distortion
TRANSIENT RESPONSE
SR
Slew Rate
12
12
tr, tf, Small
Signal
Rise Time, tr 10% to 90%
tr, tf Large
Signal
Rise Time, tr 10% to 90%
Fall Time, tf 90% to 10%
Fall Time, tf 90% to 10%
Rise Time, tr 10% to 90%
Fall Time, tf 90% to 10%
tEN
AV = 1, VOUT = 0.1VP-P, RL = 10kΩ, CL = 1.2pF
AV = 2, VOUT = 1VP-P; RL = 10kΩ,
RF /RG = 499Ω/499Ω, CL = 1.2pF
AV = 2, VOUT =4.7VP-P; RL = 10kΩ,
RF /RG = 499Ω/499Ω, CL = 1.2pF
ENABLE to Output Turn-on Delay
Time; 10% EN - 10% VOUT
AV = 1, VOUT = 1VDC, RL = 10kΩ, CL = 1.2pF
330
ns
ENABLE to Output Turn-off Delay
Time; 10% EN - 10% VOUT
AV = 1, VOUT = 0VDC, RL = 10kΩ, CL = 1.2pF
50
ns
NOTE:
3. Parts are 100% tested at +25°C. Temperature limits established by characterization and are not production tested.
4
FN6156.5
February 20, 2008
ISL28191, ISL28291
Typical Performance Curves
10
3
CLOSED LOOP GAIN (dB)
2
CLOSED LOOP GAIN (dB)
RL = 100k
1
0
-1
-2
RL = 10k
-3
-4
-5
-6
RL = 1k
V+ = 5V
AV = +1
CL = 10pF
VOUT = 10mVP-P
-7
10k
1M
10M
CL = 110pF
6
CL = 57pF
4
CL = 57pF
2
CL = 32pF
0
CL = 10pF
-2
-4
-8
-10
10k
100M
100k
FREQUENCY (Hz)
AV = 1000, RF = 499k, RG = 499
VOUT = 100mVP-P
-3
VOUT = 1VP-P
-5
-7
-8
10k
40
30
AV = 100, RF = 49.9k,
RG = 499
20
AV = 10, RF = 4.42k, RG = 499
V+ = 5V
AV = +1
RL = 10kΩ
CL = 10pF
-6
10
0
100k
1M
10M
AV = 1, RF = 0, RG = INF
-10
10k
100M
100k
FREQUENCY (Hz)
100M
100k
OUTPUT IMPEDANCE (Ω)
INPUT IMPEDANCE (Ω)
10M
FIGURE 4. FREQUENCY RESPONSE vs CLOSED LOOP
GAIN
1M
100k
V+ = 5V, 3V
ENABLED AND
DISABLED
VSOURCE = 1VP-P
1k
100
10k
1M
FREQUENCY (Hz)
FIGURE 3. -3dB BANDWIDTH vs VOUT
10k
V+ = 5V
RL = 10k
VOUT = 100mVP-P
50
GAIN (dB)
CLOSED LOOP GAIN (dB)
60
0
-4
100M
70
-1
-2
10M
FIGURE 2. GAIN vs FREQUENCY FOR VARIOUS CLOAD
VOUT = 1mVP-P
VOUT = 10mVP-P
1
1M
FREQUENCY (Hz)
FIGURE 1. GAIN vs FREQUENCY FOR VARIOUS RLOAD
2
CL = 20pF
V+ = 5V
AV = +1
RL = 10kΩ
VOUT = 10mVP-P
-6
RL = 100
100k
8
100k
1M
10M
100M
FREQUENCY (Hz)
FIGURE 5. INPUT IMPEDANCE vs FREQUENCY
5
10k
V+ = 5V, 3V
VSOURCE = 1VP-P
1k
100
10k
100k
1M
10M
100M
FREQUENCY (Hz)
FIGURE 6. DISABLED OUTPUT IMPEDANCE vs FREQUENCY
FN6156.5
February 20, 2008
ISL28191, ISL28291
Typical Performance Curves (Continued)
100
10
0
-10
VSOURCE = 1V
-20
10
-30
CMRR (dB)
OUTPUT IMPEDANCE (Ω)
V+ = 5V, 3V
VSOURCE = 0.1V
-40
-50
-60
1
V+ = 5V
AV = +1
RL = 10kΩ
CL = 10pF
VOUT = 100mVP-P
-70
-80
0.10
10k
100k
1M
10M
-90
-100
1k
100M
10k
100k
FIGURE 7. ENABLED OUTPUT IMPEDANCE vs FREQUENCY
-10
-20
PSRR (dB)
FIGURE 8. CMRR vs FREQUENCY
V+ = 5V
AV = +1
RL = 10kΩ
CL = 10pF
VOUT = 100mVP-P
OFF ISOLATION (dB)
0
-30
-40
PSRR+
-50
-60
PSRR+
PSRR-
-70
-80
-10
VP-P = 1V
-20
VP-P = 10mV
-30
VP-P = 100mV
-40
-50
V+ = 5V
AV = +1
RL = 10kΩ
CL = 10pF
-60
-70
-90
1k
10k
100k
1M
FREQUENCY (Hz)
10M
-80
10k
100M
100k
1M
10M
100M
1G
FREQUENCY (Hz)
FIGURE 10. OFF ISOLATION vs FREQUENCY
FIGURE 9. PSRR vs FREQUENCY
0.1
-30
V+ = 5V
RL = 10k
-40
RF = 0, AV = 1
VOUT = 2VP-P
400Hz TO 22kHz FILTER
THD + NOISE (%)
-50
CROSSTALK (dB)
100M
0
10
-100
10M
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
-60
-70
VP-P = 1V
-80
-90
0.01
0.001
-100
-110
-120
10k
100k
1M
10M
FREQUENCY (Hz)
100M
1G
FIGURE 11. CHANNEL TO CHANNEL CROSSTALK vs
FREQUENCY
6
0.0001
0
2k
4k
6k
8k
10k 12k 14k 16k 18k 20k
FREQUENCY (Hz)
FIGURE 12. THD+N vs FREQUENCY
FN6156.5
February 20, 2008
ISL28191, ISL28291
Typical Performance Curves (Continued)
1
INPUT VOLTAGE NOISE (nV/√Hz)
0.1
THD +NOISE (%)
10
V+ = 5V
AV = +1
RL = 10kΩ
FREQUENCY = 1kHz
FILTER = 400Hz TO 22kHz
0.01
0.001
0.0001
0
0.5
1.0
1.5
2.0
VOUT (VP-P)
2.5
3.0
1
0.1
3.5
10
100
1k
10k
100k
FREQUENCY (Hz)
FIGURE 13. THD+N @ 1kHz vs VOUT
FIGURE 14. INPUT REFERRED NOISE VOLTAGE vs
FREQUENCY
5
100
10
V+ = 5V
AV = +1
RL = 10kΩ
CL = 10pF
VIN = 1VDC
EN INPUT
4
VOLTS (V)
CURRENT NOISE (pA/√Hz)
1
3
2
ENABLE
DISABLE
ENABLE
1
OUTPUT
1
0.1
1
10
100
1k
10k
0
100k
-1
0
1
FREQUENCY (Hz)
FIGURE 15. INPUT REFERRED NOISE CURRENT vs
FREQUENCY
0.08
0.8
0.06
0.6
VOUT
0.4
VIN
VOUT
0.04
0.02
VIN
0
-0.02
V+ = ±2.5V
AV = +1
RL = 10kΩ
VOUT = 100mVP-P
-0.04
-0.06
-0.08
0
20
40
60
80 100 120
TIME (ns)
4
0.2
0
-0.2
V+ = ±2.5V
AV = +2
RF = RG = 499Ω
RL = 10kΩ
VOUT = 1VP-P
-0.4
-0.6
140
160
180
FIGURE 17. SMALL SIGNAL STEP RESPONSE
7
3
FIGURE 16. ENABLE/DISABLE TIMING
LARGE SIGNAL (V)
SMALL SIGNAL (V)
2
TIME (µs)
200
-0.8
0
100
200
300
400
500
TIME (ns)
600
700
800
FIGURE 18. LARGE SIGNAL (1V) STEP RESPONSE
FN6156.5
February 20, 2008
ISL28191, ISL28291
Typical Performance Curves (Continued)
3
3.5
VOUT
VIN
CURRENT (mA)
LARGE SIGNAL (V)
3.1
1
0
-1
V+ = ±2.5V
AV = +2
RF = RG = 499Ω
RL = 10kΩ
VOUT = 4.7VP-P
-2
-3
0
400
MEDIAN
2.9
2.7
2.5
MIN
2.3
2.1
1.7
800
1200
TIME (ns)
1600
1.5
-40
2000
-20
0
20
40
60
80
TEMPERATURE (°C)
-3.0
MAX
MAX
-3.4
400
IBIAS+ (µA)
VOS (µV)
500
MEDIAN
300
200
-3.6
MEDIAN
-3.8
-4.0
100
MIN
-4.2
MIN
0
-4.4
-100
-200
-40
-20
0
20
40
60
80
100
-4.6
-40
120
-20
0
TEMPERATURE (°C)
FIGURE 21. VOS vs TEMPERATURE, VS = ±2.5V
-3.2
800
n = 100
-3.6
MAX
100
120
n = 100
600
MEDIAN
400
-4.0
IIO (nA)
-3.8
MIN
-4.2
MEDIAN
200
MAX
0
-4.4
-4.6
-200
-4.8
-5.0
-40
20
40
60
80
TEMPERATURE (°C)
FIGURE 22. IBIAS+ vs TEMPERATURE, VS = ±2.5V
-3.4
IBIAS- (µA)
120
n = 100
-3.2
600
-3.0
100
FIGURE 20. SUPPLY CURRENT vs TEMPERATURE,
VS = ±2.5V ENABLED, RL = INF
n = 100
700
MAX
1.9
FIGURE 19. LARGE SIGNAL (4.7V) STEP RESPONSE
800
n = 100
3.3
2
MIN
-20
0
20
40
60
80
TEMPERATURE (°C)
100
120
FIGURE 23. IBIAS- vs TEMPERATURE, VS = ±2.5V
8
-400
-40
-20
0
20
40
60
80
TEMPERATURE (°C)
100
120
FIGURE 24. IIO vs TEMPERATURE, VS = ±2.5V
FN6156.5
February 20, 2008
ISL28191, ISL28291
Typical Performance Curves (Continued)
160
82
n = 100
150
MAX
130
PSRR (dB)
CMRR (dB)
MAX
80
140
120
110
n = 100
MEDIAN
100
78
MEDIAN
76
MIN
74
90
80
72
MIN
70
-40
-20
0
20
40
60
80
100
70
-40
120
-20
0
TEMPERATURE (°C)
40
60
80
100
120
FIGURE 26. PSRR vs TEMPERATURE ±1.5V TO ±2.5V
FIGURE 25. CMRR vs TEMPERATURE, VCM = 3.8V,
VS = ±2.5V
60
4.990
n = 100
55
4.985
45
VOUT (mV)
4.980
MEDIAN
4.975
4.970
40
MAX
35
30
25
MEDIAN
20
4.965
15
MIN
4.960
-40
n = 100
50
MAX
VOUT (V)
20
TEMPERATURE (°C)
-20
0
20
40
60
80
100
10
-40
120
MIN
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 28. NEGATIVE VOUT vs TEMPERATURE, RL = 1k
VS = ±2.5V
FIGURE 27. POSITIVE VOUT vs TEMPERATURE, RL = 1k
VS = ±2.5V
Pin Descriptions
ISL28191
ISL28191
ISL28291
ISL28291
ISL28291
(6 Ld SOT-23) (6 Ld µTDFN) (8 Ld SOIC) (10 Ld MSOP) (10 Ld µTQFN)
4
2
2 (A)
6 (B)
2 (A)
8 (B)
1 (A)
7 (B)
PIN
NAME
ININ-_A
IN-_B
FUNCTION
EQUIVALENT CIRCUIT
Inverting input
V+
IN-
IN+
VCircuit 1
3
2
3 (A)
5 (B)
3 (A)
7 (B)
2 (A)
6 (B)
IN+
IN+_B
IN+_B
4
4
3
V-
3
4
9
Non-inverting
input
(See circuit 1)
Negative supply
FN6156.5
February 20, 2008
ISL28191, ISL28291
Pin Descriptions (Continued)
ISL28191
ISL28191
ISL28291
ISL28291
ISL28291
(6 Ld SOT-23) (6 Ld µTDFN) (8 Ld SOIC) (10 Ld MSOP) (10 Ld µTQFN)
1
1
1 (A)
7 (B)
1 (A)
9 (B)
10 (A)
8 (B)
PIN
NAME
FUNCTION
EQUIVALENT CIRCUIT
OUT Output
OUT_A
OUT_B
V+
OUT
VCircuit 2
6
6
8
5
5
N/A
10
9
V+
Positive supply
5 (A)
6 (B)
4 (A)
5 (B)
EN
EN_A
EN_B
Enable BAR pin
internal pulldown; Logic “1”
selects the
disabled state;
Logic “0” selects
the enabled
state.
Applications Information
Product Description
The ISL28191 and ISL28291 are voltage feedback operational
amplifiers designed for communication and imaging
applications requiring low distortion, very low voltage and
current noise. Both parts feature high bandwidth while drawing
moderately low supply current. They use a classical
voltage-feedback topology, which allows them to be used in a
variety of applications where current-feedback amplifiers are
not appropriate because of restrictions placed upon the
feedback element used with the amplifier.
Enable/Power-Down
The ISL28191 and ISL28291 amplifiers are disabled by
applying a voltage greater than 2V to the EN pin, with
respect to the V- pin. In this condition, the output(s) will be in
a high impedance state and the amplifier(s) current will be
reduced to 13µA/Amp. By disabling the part, multiple parts
can be connected together as a MUX. The outputs are tied
together in parallel and a channel can be selected by the EN
pin. The EN pin also has an internal pull-down. If left open,
the EN pin will pull to the negative rail and the device will be
enabled by default.
Input Protection
All input terminals have internal ESD protection diodes to both
positive and negative supply rails, limiting the input voltage to
within one diode beyond the supply rails. Both parts have
additional back-to-back diodes across the input terminals (as
shown in Figure 29). In pulse applications where the input
Slew Rate exceeds the Slew Rate of the amplifier, the
possibility exists for the input protection diodes to become
forward biased. This can cause excessive input current and
distortion at the outputs. If overdriving the inputs is necessary,
the external input current must never exceed 5mA. An
10
V+
EN
VCircuit 3
external series resistor may be used to limit the current, as
shown in Figure 29.
R
+
FIGURE 29. LIMITING THE INPUT CURRENT TO LESS THAN
5mA
Using Only One Channel
The ISL28291 is a dual channel op amp. If the application
only requires one channel when using the ISL28291, the
user must configure the unused channel to prevent it from
oscillating. Oscillation can occur if the input and output pins
are floating. This will result in higher than expected supply
currents and possible noise injection into the channel being
used. The proper way to prevent this oscillation is to short
the output to the negative input and ground the positive input
(as shown in Figure 30).
+
FIGURE 30. PREVENTING OSCILLATIONS IN UNUSED
CHANNELS
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Low
impedance ground plane construction is essential. Surface
mount components are recommended, but if leaded
components are used, lead lengths should be as short as
possible. The power supply pins must be well bypassed to
FN6156.5
February 20, 2008
ISL28191, ISL28291
reduce the risk of oscillation. The combination of a 4.7µF
tantalum capacitor in parallel with a 0.01µF capacitor has
been shown to work well when placed at each supply pin.
package type need to be modified to remain in the safe
operating area. These parameters are related in Equation 1:
T JMAX = T MAX + ( θ JA xPD MAXTOTAL )
(EQ. 1)
For good AC performance, parasitic capacitance should be
kept to a minimum, especially at the inverting input. When
ground plane construction is used, it should be removed
from the area near the inverting input to minimize any stray
capacitance at that node. Carbon or Metal-Film resistors are
acceptable with the Metal-Film resistors giving slightly less
peaking and bandwidth because of additional series
inductance. Use of sockets, particularly for the SOIC
package, should be avoided if possible. Sockets add
parasitic inductance and capacitance, which will result in
additional peaking and overshoot.
• PDMAX for each amplifier can be calculated in Equation 2:
Current Limiting
• TMAX = Maximum ambient temperature
The ISL28191 and ISL28291 have no internal current-limiting
circuitry. If the output is shorted, it is possible to exceed the
Absolute Maximum Rating for output current or power
dissipation, potentially resulting in the destruction of the
device. This is why the output short circuit current is specified
and tested with RL = 10Ω.
Power Dissipation
It is possible to exceed the +125°C maximum junction
temperatures under certain load and power-supply
conditions. It is therefore important to calculate the
maximum junction temperature (TJMAX) for all applications
to determine if power supply voltages, load conditions, or
11
where:
• PDMAXTOTAL is the sum of the maximum power
dissipation of each amplifier in the package (PDMAX)
V OUTMAX
PD MAX = 2*V S × I SMAX + ( V S - V OUTMAX ) × ---------------------------R
L
(EQ. 2)
where:
• θJA = Thermal resistance of the package
• PDMAX = Maximum power dissipation of 1 amplifier
• VS = Supply voltage
• IMAX = Maximum supply current of 1 amplifier
• VOUTMAX = Maximum output voltage swing of the
application
• RL = Load resistance
FN6156.5
February 20, 2008
ISL28191, ISL28291
SOT-23 Package Family
MDP0038
e1
D
SOT-23 PACKAGE FAMILY
A
MILLIMETERS
6
N
SYMBOL
4
E1
2
E
3
0.15 C D
1
2X
2
3
0.20 C
5
2X
e
0.20 M C A-B D
B
b
NX
0.15 C A-B
1
3
SOT23-5
SOT23-6
A
1.45
1.45
MAX
A1
0.10
0.10
±0.05
A2
1.14
1.14
±0.15
b
0.40
0.40
±0.05
c
0.14
0.14
±0.06
D
2.90
2.90
Basic
E
2.80
2.80
Basic
E1
1.60
1.60
Basic
e
0.95
0.95
Basic
e1
1.90
1.90
Basic
L
0.45
0.45
±0.10
L1
0.60
0.60
Reference
N
5
6
Reference
D
2X
TOLERANCE
Rev. F 2/07
NOTES:
C
A2
2. Plastic interlead protrusions of 0.25mm maximum per side are not
included.
SEATING
PLANE
A1
0.10 C
1. Plastic or metal protrusions of 0.25mm maximum per side are not
included.
3. This dimension is measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
NX
5. Index area - Pin #1 I.D. will be located within the indicated zone
(SOT23-6 only).
(L1)
6. SOT23-5 version has no center lead (shown as a dashed line).
H
A
GAUGE
PLANE
c
L
12
0.25
0° +3°
-0°
FN6156.5
February 20, 2008
ISL28191, ISL28291
Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
A
A
E
6
B
6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
4
MILLIMETERS
D
PIN 1
REFERENCE
2X
0.15 C
1
2X
L6.1.6x1.6A
3
MIN
NOMINAL
MAX
NOTES
A
0.45
0.50
0.55
-
A1
-
-
0.05
-
0.127 REF
A3
0.15 C
A1
TOP VIEW
e
1.00 REF
4
6
L
CO.2
D2
SYMBOL
b
0.15
0.20
0.25
-
D
1.55
1.60
1.65
4
D2
0.40
0.45
0.50
-
E
1.55
1.60
1.65
4
E2
0.95
1.00
1.05
-
0.50 BSC
e
DAP SIZE 1.30 x 0.76
L
3
1
b 6X
0.10 M C A B
E2
-
0.25
0.30
0.35
Rev. 1 6/06
NOTES:
1. Dimensions are in mm. Angles in degrees.
BOTTOM VIEW
2. Coplanarity applies to the exposed pad as well as the terminals.
Coplanarity shall not exceed 0.08mm.
DETAIL A
6X
0.10 C
3. Warpage shall not exceed 0.10mm.
0.08 C
4. Package length/package width are considered as special
characteristics.
5. JEDEC Reference MO-229.
A3
SIDE VIEW
C
SEATING
PLANE
6. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
0.127±0.008
0.127 +0.058
-0.008
TERMINAL THICKNESS
A1
DETAIL A
0.25
0.50
1.00
0.45
1.00
2.00
0.30
1.25
LAND PATTERN
13
6
FN6156.5
February 20, 2008
ISL28191, ISL28291
Small Outline Package Family (SO)
A
D
h X 45°
(N/2)+1
N
A
PIN #1
I.D. MARK
E1
E
c
SEE DETAIL “X”
1
(N/2)
B
L1
0.010 M C A B
e
H
C
A2
GAUGE
PLANE
SEATING
PLANE
A1
0.004 C
0.010 M C A B
L
b
0.010
4° ±4°
DETAIL X
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
INCHES
SYMBOL
SO-14
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28)
TOLERANCE
NOTES
A
0.068
0.068
0.068
0.104
0.104
0.104
0.104
MAX
-
A1
0.006
0.006
0.006
0.007
0.007
0.007
0.007
±0.003
-
A2
0.057
0.057
0.057
0.092
0.092
0.092
0.092
±0.002
-
b
0.017
0.017
0.017
0.017
0.017
0.017
0.017
±0.003
-
c
0.009
0.009
0.009
0.011
0.011
0.011
0.011
±0.001
-
D
0.193
0.341
0.390
0.406
0.504
0.606
0.704
±0.004
1, 3
E
0.236
0.236
0.236
0.406
0.406
0.406
0.406
±0.008
-
E1
0.154
0.154
0.154
0.295
0.295
0.295
0.295
±0.004
2, 3
e
0.050
0.050
0.050
0.050
0.050
0.050
0.050
Basic
-
L
0.025
0.025
0.025
0.030
0.030
0.030
0.030
±0.009
-
L1
0.041
0.041
0.041
0.056
0.056
0.056
0.056
Basic
-
h
0.013
0.013
0.013
0.020
0.020
0.020
0.020
Reference
-
16
20
24
28
Reference
-
N
SO-8
SO16
(0.150”)
8
14
16
Rev. M 2/07
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
14
FN6156.5
February 20, 2008
ISL28191, ISL28291
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
D
6
INDEX AREA
A
L10.1.8x1.4A
B
N
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
MILLIMETERS
E
SYMBOL
2X
MIN
NOMINAL
MAX
NOTES
0.10 C
1
2X
2
0.10 C
TOP VIEW
0.45
0.50
0.55
-
A1
-
-
0.05
-
A3
0.10 C
C
A
0.05 C
A
0.127 REF
0.15
0.20
0.25
5
D
1.75
1.80
1.85
-
E
1.35
1.40
1.45
-
e
SEATING PLANE
A1
SIDE VIEW
(DATUM A)
PIN #1 ID
NX L
1
NX b 5
10X
0.10 M C A B
0.05 M C
2
L1
5
(DATUM B)
7
-
b
0.40 BSC
-
L
0.35
0.40
0.45
L1
0.45
0.50
0.55
-
N
10
2
Nd
2
3
Ne
3
3
θ
0
-
12
4
Rev. 3 6/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
e
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
BOTTOM VIEW
4. All dimensions are in millimeters. Angles are in degrees.
NX (b)
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
CL
(A1)
5
L
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
SECTION "C-C"
e
8. Maximum allowable burrs is 0.076mm in all directions.
TERMINAL TIP
C C
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
2.20
1.00
0.60
1.00
0.50
1.80
0.40
0.20
0.20
0.40
10 LAND PATTERN
15
FN6156.5
February 20, 2008
ISL28191, ISL28291
Mini SO Package Family (MSOP)
0.25 M C A B
D
MINI SO PACKAGE FAMILY
(N/2)+1
N
E
MDP0043
A
E1
MILLIMETERS
PIN #1
I.D.
1
B
(N/2)
e
H
C
SEATING
PLANE
0.10 C
N LEADS
SYMBOL
MSOP8
MSOP10
TOLERANCE
NOTES
A
1.10
1.10
Max.
-
A1
0.10
0.10
±0.05
-
A2
0.86
0.86
±0.09
-
b
0.33
0.23
+0.07/-0.08
-
c
0.18
0.18
±0.05
-
D
3.00
3.00
±0.10
1, 3
E
4.90
4.90
±0.15
-
E1
3.00
3.00
±0.10
2, 3
e
0.65
0.50
Basic
-
L
0.55
0.55
±0.15
-
L1
0.95
0.95
Basic
-
N
8
10
Reference
-
0.08 M C A B
b
Rev. D 2/07
NOTES:
1. Plastic or metal protrusions of 0.15mm maximum per side are not
included.
L1
2. Plastic interlead protrusions of 0.25mm maximum per side are
not included.
A
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
c
SEE DETAIL "X"
A2
GAUGE
PLANE
A1
L
0.25
3° ±3°
DETAIL X
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
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16
FN6156.5
February 20, 2008