INTERSIL ISL3158EIUZ

ISL3150E, ISL3152E, ISL3153E,
ISL3155E, ISL3156E, ISL3158E
®
Data Sheet
January 18, 2008
FN6363.1
±16.5kV ESD (IEC61000-4-2) Protected,
Large Output Swing, 5V, Full Fail-Safe, 1/8
Unit Load, RS-485/RS-422 Transceivers
Features
The ISL315xE are BiCMOS, IEC61000 ESD protected, 5V
powered, single transceivers that meet both the RS-485 and
RS-422 standards for balanced communication. Each driver
output and receiver input is protected against ±16.5kV ESD
strikes without latch-up.
• IEC61000 ESD Protection on RS-485 I/O Pins . . ±16.5kV
- Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM
The ISL315xE transmitters all deliver exceptional differential
output voltages (2.4V min), into the RS-485 required 54Ω
load, for better noise immunity or to allow up to eight 120Ω
terminations in “star” or other non-standard bus topologies.
These devices have very low bus currents (+125µA/-75µA),
so they present a true “1/8 unit load” to the RS-485 bus. This
allows up to 256 transceivers on the network without violating
the RS-485 specification’s 32 unit load maximum, and without
using repeaters.
Receiver (Rx) inputs feature a “Full Fail-Safe” design, which
ensures a logic high Rx output if Rx inputs are floating,
shorted, or on a terminated but undriven bus. Rx outputs
feature high drive levels - typically 28mA @ VOL = 1V (to ease
the design of optocoupled isolated interfaces).
The ISL3150E, ISL3152E, ISL3153E, ISL3155E utilize slew
rate limited drivers which reduce EMI, and minimize reflections
from improperly terminated transmission lines, or unterminated
stubs in multidrop and multipoint applications.
Hot Plug circuitry ensures that the Tx and Rx outputs remain
in a high impedance state until the power supply has
stabilized, and the Tx outputs are fully short circuit protected.
The ISL3150E, ISL3153E, ISL3156E are configured for full
duplex applications. The half duplex versions multiplex the
Rx inputs and Tx outputs to allow transceivers with output
disable functions in 8 Ld packages.
• High Driver VOD . . . . . . . . . . . . . . 2.4V (Min) @ RD = 54Ω
Better Noise Immunity, or Drive Up to 8 Terminations
• Tiny MSOP Packages Save 50% Board Space
• Full Fail-safe (Open, Short, Terminated and Undriven)
Receivers
• High Rx IOL to Drive Opto-Couplers for Isolated
Applications
• Hot Plug Circuitry - Tx and Rx Outputs Remain
Three-State During Power-up/Power-down
• True 1/8 Unit Load Allows up to 256 Devices on the Bus
• Specified for Single 5V, 10% Tolerance, Supplies
• High Data Rates . . . . . . . . . . . . . . . . . . . . . up to 20Mbps
• Low Quiescent Supply Current . . . . . . . . . . . . . . . 600µA
Ultra Low Shutdown Supply Current . . . . . . . . . . . . 70nA
• -7V to +12V Common Mode Input Voltage Range
• Half and Full Duplex Pinouts
• Pb-free (RoHS compliant)
• Three-State Rx and Tx Outputs
• Current Limiting and Thermal Shutdown for Driver
Overload Protection
Applications
• Utility Meters and Automated Meter Reading Systems
• High Node Count Systems
• PROFIBUS® and Field Bus Networks, and Factory
Automation
• Security Camera Networks
• Building Lighting and Environmental Control Systems
• Industrial/Process Control Networks
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
HALF/FULL DATA RATE
DUPLEX
(Mbps)
SLEW-RATE
# DEVICES
LIMITED?
HOT PLUG ON BUS
Rx/Tx
ENABLE?
QUIESCENT
ICC (μA)
LOW POWER
SHUTDOWN?
PIN
COUNT
Yes
10, 14
ISL3150E
Full
0.115
Yes
Yes
256
Yes
600
ISL3152E
Half
0.115
Yes
Yes
256
Yes
600
Yes
8
ISL3153E
Full
1
Yes
Yes
256
Yes
600
Yes
10, 14
ISL3155E
Half
1
Yes
Yes
256
Yes
600
Yes
8
ISL3156E
Full
20
No
Yes
256
Yes
600
Yes
10, 14
ISL3158E
Half
20
No
Yes
256
Yes
600
Yes
8
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004-2006, 2008. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Pinouts
ISL3152E, ISL3155E, ISL3158E
(8 LD MSOP, 8 LD SOIC, 8 LD PDIP)
TOP VIEW
RO 1
8
VCC
RE 2
7
B/Z
DE 3
6
A/Y
5
GND
DI 4
R
D
ISL3150E, ISL3153E, ISL3156E
(10 LD MSOP)
TOP VIEW
RO 1
R
D
14 VCC
RO 2
13 NC
R
8 B
DE 3
GND 5
NC 1
10 VCC
9 A
RE 2
DI 4
ISL3150E, ISL3153E, ISL3156E
(14 LD SOIC)
TOP VIEW
7 Z
RE 3
12 A
DE 4
11 B
DI 5
6 Y
D
10 Z
GND 6
9 Y
GND 7
8 NC
Ordering Information
PART NUMBER (Note)
PART MARKING
TEMP. RANGE (°C)
PACKAGE (Pb-Free)
PKG. DWG. #
ISL3150EIBZ*
3150EIBZ
-40 to +85
14 Ld SOIC
M14.15
ISL3150EIUZ*
3150Z
-40 to +85
10 Ld MSOP
M10.118
ISL3152EIBZ*
3152EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3152EIPZ
ISL3152 EIPZ
-40 to +85
8 Ld PDIP**
E8.3
ISL3152EIUZ*
3152Z
-40 to +85
8 Ld MSOP
M8.118
ISL3153EIBZ*
3153EIBZ
-40 to +85
14 Ld SOIC
M14.15
ISL3153EIUZ*
3153Z
-40 to +85
10 Ld MSOP
M10.118
ISL3155EIBZ*
3155EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3155EIUZ*
3155Z
-40 to +85
8 Ld MSOP
M8.118
ISL3156EIBZ*
3156EIBZ
-40 to +85
14 Ld SOIC
M14.15
ISL3156EIUZ*
3156Z
-40 to +85
10 Ld MSOP
M10.118
ISL3158EIBZ*
3158EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3158EIUZ*
3158Z
-40 to +85
8 Ld MSOP
M8.118
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
2
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Truth Tables
RECEIVING
TRANSMITTING
INPUTS
INPUTS
OUTPUTS
RE
RE
DE
DI
Z
Y
X
1
1
0
1
X
1
0
1
0
0
0
X
High-Z
High-Z
1
0
X
High-Z*
High-Z*
NOTE: *Shutdown Mode (See Note 7).
DE
DE
Half Duplex Full Duplex
OUTPUT
A-B
RO
0
0
X
≥ -0.05V
1
0
0
X
≤ -0.2V
0
0
0
X
Inputs
Open/Shorted
1
1
0
0
X
High-Z*
1
1
1
X
High-Z
NOTE: *Shutdown Mode (See Note 7).
Pin Descriptions
PIN
FUNCTION
RO
Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted.
RE
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.
DE
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low.
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
GND
Ground connection.
A/Y
±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting receiver input and noninverting driver output. Pin is an input
if DE = 0; pin is an output if DE = 1.
B/Z
±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting receiver input and inverting driver output. Pin is an input if DE = 0;
pin is an output if DE = 1.
A
±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting receiver input.
B
±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting receiver input.
Y
±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting driver output.
Z
±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting driver output.
VCC
System power supply input (4.5V to 5.5V).
NC
No Connection.
3
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Typical Operating Circuit
ISL3152E, ISL3155E, ISL3158E
+5V
+5V
+
8
0.1µF
0.1µF
+
8
VCC
1 RO
VCC
R
D
2 RE
B/Z
7
3 DE
A/Y
6
4 DI
RT
RT
DI 4
7
B/Z
DE 3
6
A/Y
RE 2
RO 1
R
D
GND
GND
5
5
ISL3150E, ISL3153E, ISL3156E (SOIC PIN NUMBERS SHOWN)
+5V
+5V
+
14
VCC
2 RO
R
A 12
0.1µF
0.1µF
RT
+
14
VCC
9 Y
B 11
D
10 Z
3 RE
DE 4
RE 3
4 DE
Z 10
5 DI
DI 5
Y 9
D
GND
6, 7
4
RT
11 B
R
12 A
RO 2
GND
6, 7
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V)
Input/Output Voltages
A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V
A/Y, B/Z, A, B, Y, Z (Transient Pulse Through 100Ω) . . . . . . ±25V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
8 Ld SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
105
8 Ld MSOP, PDIP* . . . . . . . . . . . . . . . . . . . . . . . . . .
140
10 Ld MSOP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
130
14 Ld SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
130
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C
(Note 2).
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
MIN
(°C) (Note 10)
TYP
MAX
(Note 10) UNITS
DC CHARACTERISTICS
Driver Differential VOUT (No load)
VOD1
Driver Differential VOUT (Loaded)
VOD2
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Driver Common-Mode VOUT
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
Full
-
-
VCC
V
RL = 100Ω (RS-422) (Figure 1A)
Full
2.8
3.6
-
V
RL = 54Ω (RS-485) (Figure 1A)
Full
2.4
3.1
VCC
V
RL = 15Ω (Eight 120Ω terminations) (Note 11)
25
-
1.65
-
V
RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B)
Full
2.4
3
-
V
ΔVOD
RL = 54Ω or 100Ω (Figure 1A)
Full
-
0.01
0.2
V
VOC
RL = 54Ω or 100Ω (Figure 1A)
Full
-
-
3.15
V
ΔVOC
RL = 54Ω or 100Ω (Figure 1A)
Full
-
0.01
0.2
V
Logic Input High Voltage
VIH
DE, DI, RE
Full
2
-
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
-
-
0.8
V
25
-
100
-
mV
DI Input Hysteresis Voltage
VHYS
Logic Input Current
IIN1
DE, DI, RE
Full
-2
-
2
µA
Input Current (A, B, A/Y, B/Z)
IIN2
DE = 0V, VCC = 0V or 5.5V VIN = 12V
Full
-
70
125
µA
VIN = -7V
Full
-75
55
-
µA
VIN = 12V
Full
-
1
40
µA
VIN = -7V
Full
-40
-9
-
µA
RE = VCC, DE = 0V, VCC = VIN = 12V
0V or 5.5V
VIN = -7V
Full
-
1
20
µA
Full
-20
-9
-
µA
Output Leakage Current (Y, Z)
(Full Duplex Versions Only)
IIN3
Output Leakage Current (Y, Z)
in Shutdown Mode (Full Duplex)
IIN4
5
RE = 0V, DE = 0V, VCC =
0V or 5.5V
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C
(Note 2). (Continued)
PARAMETER
SYMBOL
Driver Short-Circuit Current,
VO = High or Low
IOSD1
Receiver Differential Threshold
Voltage
VTH
TEST CONDITIONS
TEMP
MIN
(°C) (Note 10)
TYP
MAX
(Note 10) UNITS
DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 4)
Full
-
-
±250
mA
-7V ≤ VCM ≤ 12V
Full
-200
-90
-50
mV
Receiver Input Hysteresis
ΔVTH
VCM = 0V
25
-
20
-
mV
Receiver Output High Voltage
VOH
IO = -8mA, VID = -50mV
Full
VCC - 1.2
4.3
-
V
Receiver Output Low Voltage
VOL
IO = -8mA, VID = -200mV
Full
-
0.25
0.4
V
Receiver Output Low Current
IOL
VO = 1V, VID = -200mV
Full
20
28
-
mA
Three-State (High Impedance)
Receiver Output Current
IOZR
0.4V ≤ VO ≤ 2.4V
Full
-1
0.03
1
µA
Receiver Input Resistance
RIN
-7V ≤ VCM ≤ 12V
Full
96
160
-
kΩ
Receiver Short-Circuit Current
IOSR
0V ≤ VO ≤ VCC
Full
±7
65
±85
mA
Half Duplex Versions, DE = VCC, RE = X,
DI = 0V or VCC
Full
-
650
800
µA
All Versions, DE = 0V, RE = 0V, or Full Duplex
Versions, DE = VCC, RE = X. DI = 0V or VCC
Full
-
550
700
µA
DE = 0V, RE = VCC, DI = 0V or VCC
Full
-
0.07
3
µA
IEC61000-4-2, Air-Gap
Discharge Method
1/2 Duplex
25
-
±16.5
-
kV
Full Duplex
25
-
±10
-
kV
IEC61000-4-2, Contact Discharge Method
25
-
±9
-
kV
Human Body Model, From Bus Pins to GND
25
-
±16.5
-
kV
Human Body Model, per MIL-STD-883 Method
3015
25
-
±7
-
kV
Machine Model
25
-
400
-
V
SUPPLY CURRENT
No-Load Supply Current (Note 3)
Shutdown Supply Current
ICC
ISHDN
ESD PERFORMANCE
RS-485 Pins (A, Y, B, Z, A/Y, B/Z)
All Pins
DRIVER SWITCHING CHARACTERISTICS (115kbps Versions; ISL3150E, ISL3152E)
Driver Differential Output Delay
tPLH, tPHL
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
500
970
1300
ns
Driver Differential Output Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
12
50
ns
Driver Differential Rise or Fall Time
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
700
1100
1600
ns
Maximum Data Rate
fMAX
CD = 820pF (Figure 4)
Full
115
2000
-
kbps
Driver Enable to Output High
tZH
RL = 500Ω, CL = 100pF, SW = GND (Figure 3),
(Note 5)
Full
-
300
600
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 100pF, SW = VCC (Figure 3),
(Note 5)
Full
-
130
500
ns
Driver Disable from Output Low
tLZ
RL = 500Ω, CL = 15pF, SW = VCC (Figure 3)
Full
-
50
65
ns
Driver Disable from Output High
tHZ
RL = 500Ω, CL = 15pF, SW = GND (Figure 3)
Full
-
35
60
ns
(Note 7)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Driver Enable from Shutdown to
Output High
tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND (Figure 3),
(Notes 7, 8)
Full
-
-
250
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
Full
-
-
250
ns
6
RL = 500Ω, CL = 100pF, SW = VCC (Figure 3),
(Notes 7, 8)
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C
(Note 2). (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
MIN
(°C) (Note 10)
TYP
MAX
(Note 10) UNITS
DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL3153E, ISL3155E)
Driver Differential Output Delay
tPLH, tPHL
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
150
270
400
ns
Driver Differential Output Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
3
10
ns
Driver Differential Rise or Fall Time
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
150
325
450
ns
Maximum Data Rate
fMAX
CD = 820pF (Figure 4)
Full
1
8
-
Mbps
Driver Enable to Output High
tZH
RL = 500Ω, CL = 100pF, SW = GND (Figure 3),
(Note 5)
Full
-
110
200
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 100pF, SW = VCC (Figure 3),
(Note 5)
Full
-
60
200
ns
Driver Disable from Output Low
tLZ
RL = 500Ω, CL = 15pF, SW = VCC (Figure 3)
Full
-
50
65
ns
Driver Disable from Output High
tHZ
RL = 500Ω, CL = 15pF, SW = GND (Figure 3)
Full
-
35
60
ns
(Note 7)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Driver Enable from Shutdown to
Output High
tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND (Figure 3),
(Notes 7, 8)
Full
-
-
250
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 500Ω, CL = 100pF, SW = VCC (Figure 3),
(Notes 7, 8)
Full
-
-
250
ns
DRIVER SWITCHING CHARACTERISTICS (20Mbps Versions; ISL3156E, ISL3158E)
Driver Differential Output Delay
tPLH, tPHL
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
21
30
ns
Driver Differential Output Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
0.2
3
ns
Driver Differential Rise or Fall Time
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
12
16
ns
Maximum Data Rate
fMAX
CD = 470pF (Figure 4)
Full
20
55
-
Mbps
Driver Enable to Output High
tZH
RL = 500Ω, CL = 100pF, SW = GND (Figure 3),
(Note 5)
Full
-
30
45
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 100pF, SW = VCC (Figure 3),
(Note 5)
Full
-
28
45
ns
Driver Disable from Output Low
tLZ
RL = 500Ω, CL = 15pF, SW = VCC (Figure 3)
Full
-
50
65
ns
Driver Disable from Output High
tHZ
RL = 500Ω, CL = 15pF, SW = GND (Figure 3)
Full
-
38
60
ns
(Note 7)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Driver Enable from Shutdown to
Output High
tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND (Figure 3),
(Notes 7, 8)
Full
-
-
200
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 500Ω, CL = 100pF, SW = VCC (Figure 3),
(Notes 7, 8)
Full
-
-
200
ns
RECEIVER SWITCHING CHARACTERISTICS (115kbps and 1Mbps Versions; ISL3150E through ISL3155E)
Maximum Data Rate
fMAX
Receiver Input to Output Delay
Receiver Skew | tPLH - tPHL |
(Figure 5)
Full
1
12
-
Mbps
tPLH, tPHL (Figure 5)
Full
-
100
150
ns
(Figure 5)
Full
-
4
10
ns
tSKD
Receiver Enable to Output Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6),
(Note 6)
Full
-
9
20
ns
Receiver Enable to Output High
tZH
RL = 1kΩ, CL = 15pF, SW = GND (Figure 6),
(Note 6)
Full
-
7
20
ns
Receiver Disable from Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6)
Full
-
8
15
ns
Receiver Disable from Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND (Figure 6)
Full
-
8
15
ns
7
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C
(Note 2). (Continued)
PARAMETER
SYMBOL
Time to Shutdown
tSHDN
TEST CONDITIONS
(Note 7)
TEMP
MIN
(°C) (Note 10)
TYP
MAX
(Note 10) UNITS
Full
60
160
600
ns
Receiver Enable from Shutdown to
Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6),
(Notes 7, 9)
Full
-
-
200
ns
Receiver Enable from Shutdown to
Output Low
tZL(SHDN)
Full
-
-
200
ns
(Figure 5)
Full
20
30
-
Mbps
tPLH, tPHL (Figure 5)
Full
-
33
45
ns
(Figure 5)
Full
-
2.5
5
ns
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6),
(Notes 7, 9)
RECEIVER SWITCHING CHARACTERISTICS (20Mbps Versions; ISL3156E, ISL3158E)
Maximum Data Rate
fMAX
Receiver Input to Output Delay
Receiver Skew | tPLH - tPHL |
tSKD
Receiver Enable to Output Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6),
(Note 6)
Full
-
8
15
ns
Receiver Enable to Output High
tZH
RL = 1kΩ, CL = 15pF, SW = GND (Figure 6),
(Note 6)
Full
-
7
15
ns
Receiver Disable from Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6)
Full
-
8
15
ns
Receiver Disable from Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND (Figure 6)
Full
-
8
15
ns
(Note 7)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Receiver Enable from Shutdown to
Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6),
(Notes 7, 9)
Full
-
-
200
ns
Receiver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6),
(Notes 7, 9)
Full
-
-
200
ns
NOTES:
2. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
3. Supply current specification is valid for loaded drivers when DE = 0V.
4. Applies to peak current. See “Typical Performance Curves” beginning on page 13 for more information.
5. Keep RE = 0 to prevent the device from entering SHDN.
6. The RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN.
7. Transceivers are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 60ns, the parts are guaranteed
not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See “Low Power
Shutdown Mode” on page 12.
8. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN.
9. Set the RE signal high time >600ns to ensure that the device enters SHDN.
10. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
11. See Figure 8 for more information, and for performance over-temperature.
8
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Test Circuits and Waveforms
VCC
375Ω
RL/2
DE
DE
VCC
Z
DI
Z
DI
VCM
VOD
D
VOD
D
RL = 60Ω
-7V TO +12V
Y
Y
375Ω
VOC
RL/2
FIGURE 1A. VOD AND VOC
FIGURE 1B. VOD WITH COMMON MODE LOAD
FIGURE 1. DC DRIVER TEST CIRCUITS
3V
DI
1.5V
1.5V
0V
tPHL
tPLH
VCC
CL = 100pF
DE
OUT (Z)
VOH
OUT (Y)
VOL
Z
DI
RDIFF
D
Y
CL = 100pF
90%
DIFF OUT (Y - Z)
10%
SIGNAL
GENERATOR
+VOD
90%
10%
tR
-VOD
tF
SKEW = |tPLH - tPHL|
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2A. TEST CIRCUIT
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
Z
DI
500Ω
VCC
D
SIGNAL
GENERATOR
SW
Y
GND
CL
3V
DE
1.5V
1.5V
NOTE 7
0V
tZH, tZH(SHDN)
PARAMETER OUTPUT
RE
DI
SW
CL (pF)
tHZ
Y/Z
X
1/0
GND
15
tLZ
Y/Z
X
0/1
VCC
15
tZH
Y/Z
0 (Note 5)
1/0
GND
100
OUTPUT HIGH
NOTE 7
tHZ
VOH - 0.5V
0V
tZL, tZL(SHDN)
tLZ
NOTE 7
tZL
Y/Z
tZH(SHDN)
Y/Z
tZL(SHDN)
Y/Z
0 (Note 5)
1 (Note 8)
1 (Note 8)
0/1
1/0
0/1
FIGURE 3A. TEST CIRCUIT
VCC
100
GND
100
VCC
VOH
2.3V
OUT (Y, Z)
VCC
OUT (Y, Z)
2.3V
OUTPUT LOW
100
VOL + 0.5V V
OL
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES
9
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Test Circuits and Waveforms (Continued)
3V
VCC
DE
DI
+
Z
DI
0V
60Ω
D
VOD
CD
Y
-
+VOD
DIFF OUT (Y - Z)
SIGNAL
GENERATOR
-VOD
0V
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4A. TEST CIRCUIT
FIGURE 4. DRIVER DATA RATE
+1.5V
A
0V
0V
RE
0V
-1.5V
15pF
B
R
A
RO
tPLH
tPHL
VCC
1.5V
RO
1.5V
0V
SIGNAL
GENERATOR
FIGURE 5A. TEST CIRCUIT
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. RECEIVER PROPAGATION DELAY AND DATA RATE
RE
GND
B
A
R
1kΩ
RO
VCC
SW
SIGNAL
GENERATOR
NOTE 7
GND
3V
15pF
RE
1.5V
1.5V
0V
PARAMETER
DE
A
SW
tZH, tZH(SHDN)
NOTE 7
tHZ
0
+1.5V
GND
tLZ
0
-1.5V
VCC
tZH (Note 6)
0
+1.5V
GND
tZL (Note 6)
0
-1.5V
VCC
tZH(SHDN) (Note 9)
0
+1.5V
GND
tZL(SHDN) (Note 9)
0
-1.5V
VCC
FIGURE 6A. TEST CIRCUIT
tHZ
OUTPUT HIGH
VOH - 0.5V
VOH
1.5V
RO
0V
tZL, tZL(SHDN)
tLZ
NOTE 7
VCC
RO
1.5V
OUTPUT LOW
VOL + 0.5V V
OL
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES
10
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Receiver (Rx) Features
These devices utilize a differential input receiver for maximum
noise immunity and common mode rejection. Input sensitivity
is better than ±200mV, as required by the RS-422 and RS-485
specifications.
Rx outputs feature high drive levels (typically 28mA @
VOL = 1V to ease the design of optically coupled isolated
interfaces).
Receiver input resistance of 96kΩ surpasses the RS-422
specification of 4kΩ, and is eight times the RS-485 “Unit
Load (UL)” requirement of 12kΩ minimum. Thus, these
products are known as “one-eighth UL” transceivers, and
there can be up to 256 of these devices on a network while
still complying with the RS-485 loading specification.
Rx inputs function with common mode voltages as great as
±7V outside the power supplies (i.e., +12V and -7V), making
them ideal for long networks where induced voltages are a
realistic concern.
All the receivers include a “full fail-safe” function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating), shorted together, or connected to
a terminated bus with all the transmitters disabled.
Receivers easily meet the data rates supported by the
corresponding driver, and all receiver outputs are
three-statable via the active low RE input.
Driver (Tx) Features
The ISL315xE driver design delivers larger differential output
voltages (VOD) than the RS-485 standard requires, or than
most RS-485 transmitters can deliver. The minimum ±2.4V
VOD guarantees at least ±900mV more noise immunity than
networks built using standard 1.5V VOD transmitters.
Another advantage of the large VOD is the ability to drive
more than two bus terminations, which allows for utilizing the
ISL315xE in “star” and other multi-terminated,
“non-standard” network topologies. Figure 8, details the
transmitter’s VOD vs IOUT characteristic, and includes load
lines for six (20Ω) and eight (15Ω) 120Ω terminations. The
figure shows that the driver typically delivers 1.65/1.5V into
6/8 terminations, even at the worst case temperature of
+85°C.The RS-485 standard requires a minimum 1.5V VOD
into two terminations, but the ISL315xE delivers RS-485
voltage levels with 3x to 4x the number of terminations.
Hot Plug Function
When a piece of equipment powers up, there is a period of
time where the processor or ASIC driving the RS-485 control
lines (DE, RE) is unable to ensure that the RS-485 Tx and
Rx outputs are kept disabled. If the equipment is connected
to the bus, a driver activating prematurely during power-up
may crash the bus. To avoid this scenario, the ISL315xE
devices incorporate a “Hot Plug” function. Circuitry monitoring
VCC ensures that, during power-up and power-down, the Tx
and Rx outputs remain disabled, regardless of the state of DE
and RE, if VCC is less than ~3.4V. This gives the
processor/ASIC a chance to stabilize and drive the RS-485
control lines to the proper states.
DE, DI = VCC
RE = GND
5.0
3.5V
11
2.5
0
5.0
RL = 1kΩ
2.5
A/Y
ISL315xE
0
5.0
RL = 1kΩ
RO
The RS-485/RS-422 driver is a differential output device that
delivers at least 2.4V across a 54Ω load (RS-485), and at
least 2.8V across a 100Ω load (RS-422). The drivers feature
low propagation delay skew to maximize bit width, and to
minimize EMI, and all drivers are three-statable via the
active high DE input.
3.3V
VCC
VCC (V)
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as
long as 4000’, so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.
High VOD Improves Noise Immunity and Flexibility
2.5
ISL315xE
0
RECEIVER OUTPUT (V)
RS-485 and RS-422 are differential (balanced) data
transmission standards used for long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a
point-to-multipoint (multidrop) standard, which allows only
one driver and up to 10 (assuming one unit load devices)
receivers on each bus. RS-485 is a true multipoint standard,
which allows up to 32 one unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 specification requires
that drivers must handle bus contention without sustaining
any damage.
The 115kbps and 1Mbps driver outputs are slew rate limited
to minimize EMI, and to minimize reflections in unterminated
or improperly terminated networks. Outputs of the
ISL3156Eand ISL3158E drivers are not limited, so faster
output transition times allow data rates of at least 20Mbps
DRIVER Y OUTPUT (V)
Application Information
TIME (40µs/DIV)
FIGURE 7. HOT PLUG PERFORMANCE (ISL315xE) vs
ISL83088E WITHOUT HOT PLUG CIRCUITRY
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
ESD Protection
All pins on these devices include class 3 (>7kV) Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (driver outputs and receiver inputs)
incorporate advanced structures allowing them to survive
ESD events in excess of ±16.5kV HBM and ±16.5kV (1/2
duplex) IEC61000-4-2. The RS-485 pins are particularly
vulnerable to ESD strikes because they typically connect to
an exposed port on the exterior of the finished product.
Simply touching the port pins, or connecting a cable, can
cause an ESD event that might destroy unprotected ICs.
These new ESD structures protect the device whether or
not it is powered up, and without degrading the RS-485
common mode range of -7V to +12V. This built-in ESD
protection eliminates the need for board level protection
structures (e.g., transient suppression diodes), and the
associated, undesirable capacitive load they present.
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-485 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The
IEC61000 standard’s lower current limiting resistor coupled
with the larger charge storage capacitor yields a test that is
much more severe than the HBM test. The extra ESD
protection built into this device’s RS-485 pins allows the
design of equipment meeting level 4 criteria without the need
for additional board level protection on the RS-485 port.
Twisted pair is the cable of choice for RS-485/RS-422
networks. Twisted pair cables tend to pick up noise and
other electromagnetically induced voltages as common
mode signals, which are effectively rejected by the
differential receivers in these ICs.
Proper termination is imperative, when using the 20Mbps
devices, to minimize reflections. Short networks using the
115kbps versions need not be terminated, but, terminations
are recommended unless power dissipation is an overriding
concern.
In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, stubs
connecting receivers to the main cable should be kept as
short as possible. Multipoint (multi-driver) systems require
that the main cable be terminated in its characteristic
impedance at both ends. Stubs connecting a transceiver to
the main cable should be kept as short as possible.
Built-In Driver Overload Protection
As stated previously, the RS-485 specification requires that
drivers survive worst case bus contentions undamaged.
These devices meet this requirement via driver output short
circuit current limits, and on-chip thermal shutdown circuitry.
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 specification, even at the common
mode voltage range extremes.
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The ISL315xE 1/2 duplex RS-485 pins
withstand ±16.5kV air-gap discharges.
In the event of a major short circuit condition, devices also
include a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissipation, allowing the die to cool. The
drivers automatically re-enable after the die temperature
drops about 15°. If the contention persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared.
Receivers stay operational during thermal shutdown.
CONTACT DISCHARGE TEST METHOD
Low Power Shutdown Mode
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±9kV. The RS-485 pins of all the ISL315xE
versions survive ±9kV contact discharges.
These CMOS transceivers all use a fraction of the power
required by their bipolar counterparts, but they also include a
shutdown feature that reduces the already low quiescent ICC
to a 70nA trickle. These devices enter shutdown whenever
the receiver and driver are simultaneously disabled
(RE = VCC and DE = GND) for a period of at least 600ns.
Disabling both the driver and the receiver for less than 60ns
guarantees that the transceiver will not enter shutdown.
AIR-GAP DISCHARGE TEST METHOD
Data Rate, Cables, and Terminations
RS-485/RS-422 are intended for network lengths up to
4000’, but the maximum system data rate decreases as the
transmission length increases. Devices operating at 20Mbps
are limited to lengths less than 100’, while the 115kbps
versions can operate at full data rates with lengths of several
1000’.
12
Note that receiver and driver enable times increase when
the transceiver enables from shutdown. Refer to Notes 5, 6,
7, 8 and 9, at the end of the “Electrical Specification” table on
page 8, for more information.
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Typical Performance Curves
VCC = 5V, TA = +25°C; Unless Otherwise Specified.
3.7
130
120
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
140
+25°C
+85°C
110
100
90
80
70
60
RD = 54Ω
RD = 15Ω
RD = 20Ω
50
40
RD = 100Ω
30
20
10
0
0
1
2
3
4
DIFFERENTIAL OUTPUT VOLTAGE (V)
3.6
RDIFF = 100Ω
3.5
3.4
3.3
3.2
3.1
3.0
2.9
-40
5
FIGURE 8. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
RDIFF = 54Ω
-25
0
25
TEMPERATURE (°C)
75
85
FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
660
200
150
640
DE = VCC, RE = X
Y OR Z = LOW
100
620
50
600
ICC (µA)
OUTPUT CURRENT (mA)
50
0
580
560
-50
540
-100
DE = GND, RE = GND
Y OR Z = HIGH
520
-150
500
-40
-200
-7 -6
-4
-2
0
2
4
6
OUTPUT VOLTAGE (V)
8
10
12
-25
0
25
50
75
85
TEMPERATURE (°C)
FIGURE 10. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
FIGURE 11. SUPPLY CURRENT vs TEMPERATURE
1010
4
1005
5
1000
6
995
SKEW (ns)
PROPAGATION DELAY (ns)
|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|
990
985
tPLH
980
7
8
9
975
10
tPHL
970
11
965
960
-40
-25
0
25
50
75
85
TEMPERATURE (°C)
FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL3150E, ISL3152E)
13
12
-40
-25
0
25
50
75
85
TEMPERATURE (°C)
FIGURE 13. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3150E, ISL3152E)
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Typical Performance Curves
VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued)
1.0
290
1.5
286
284
SKEW (ns)
PROPAGATION DELAY (ns)
288
282
280
278
2.0
2.5
276
274
3.0
272
|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|
270
-40
-25
25
0
50
75
3.5
-40
85
0
-25
TEMPERATURE (°C)
25
50
85
75
TEMPERATURE (°C)
FIGURE 14. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL3153E, ISL3155E)
FIGURE 15. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3153E, ISL3155E)
0.10
24
0.12
23
PROPAGATION DELAY (ns)
0.14
22
SKEW (ns)
0.16
21
20
0.18
0.20
0.22
19
0.24
18
0.26
17
-40
0.28
-40
|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|
25
50
85
75
0
-25
0
RO
0
5
4
B/Z
3
2
RECEIVER OUTPUT (V)
5
DRIVER INPUT (V)
RDIFF = 54Ω, CL = 100pF
5
A/Y
1
TIME (1μs/DIV)
FIGURE 18. DRIVER AND RECEIVER WAVEFORMS,
(ISL3150E, ISL3152E)
14
50
85
75
FIGURE 17. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3156E, ISL3158E)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
FIGURE 16. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL3156E, ISL3158E)
DI
25
TEMPERATURE (°C)
TEMPERATURE (°C)
RDIFF = 54Ω, CL = 100pF
5
DI
0
5
RO
DRIVER INPUT (V)
0
-25
0
5
4
B/Z
3
2
A/Y
1
TIME (400ns/DIV)
FIGURE 19. DRIVER AND RECEIVER WAVEFORMS,
(ISL3153E, ISL3155E)
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
RDIFF = 54Ω, CL = 100pF
5
DI
0
5
RO
0
5
4
B/Z
3
2
A/Y
DRIVER INPUT (V)
VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued)
60
RECEIVER OUTPUT CURRENT (mA)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
Typical Performance Curves
VOL, +25°C
50
VOL, +85°C
40
30
VOH, +25°C
20
10
0
1
TIME (20ns/DIV)
FIGURE 20. DRIVER AND RECEIVER WAVEFORMS,
(ISL3156E, ISL3158E)
VOH, +85°C
0
1
2
3
4
5
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 21. RECEIVER OUTPUT CURRENT vs RECEIVER
OUTPUT VOLTAGE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
530
PROCESS:
Si Gate BiCMOS
15
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Mini Small Outline Plastic Packages (MSOP)
N
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1
INCHES
E
-B-
INDEX
AREA
1 2
0.20 (0.008)
A B C
TOP VIEW
4X θ
0.25
(0.010)
R1
R
GAUGE
PLANE
SEATING
PLANE -CA
4X θ
A2
A1
b
-H-
0.10 (0.004)
L
SEATING
PLANE
C
MIN
MAX
MIN
MAX
NOTES
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
0.026 BSC
0.20 (0.008)
C
C
a
SIDE VIEW
CL
E1
0.20 (0.008)
C D
-B-
-
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
0.037 REF
N
-A-
0.65 BSC
E
L1
e
D
SYMBOL
e
L1
MILLIMETERS
0.95 REF
8
R
0.003
R1
0
α
-
8
-
0.07
0.003
-
5o
15o
0o
6o
7
-
-
0.07
-
-
5o
15o
-
0o
6o
Rev. 2 01/03
END VIEW
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. - H - Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums -A -H- .
and - B - to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only.
16
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Mini Small Outline Plastic Packages (MSOP)
N
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1
INCHES
E
-B-
INDEX
AREA
1 2
0.20 (0.008)
A B C
TOP VIEW
4X θ
0.25
(0.010)
R1
R
GAUGE
PLANE
SEATING
PLANE -CA
4X θ
A2
A1
b
-H-
0.10 (0.004)
L
SEATING
PLANE
C
MIN
MAX
MIN
MAX
NOTES
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.007
0.011
0.18
0.27
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
0.020 BSC
0.20 (0.008)
C
C
a
SIDE VIEW
CL
E1
0.20 (0.008)
C D
-B-
-
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
0.037 REF
N
-A-
0.50 BSC
E
L1
e
D
SYMBOL
e
L1
MILLIMETERS
0.95 REF
10
R
0.003
R1
θ
α
-
10
-
0.07
0.003
-
5o
15o
0o
6o
7
-
-
0.07
-
-
5o
15o
-
0o
6o
Rev. 0 12/02
END VIEW
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. - H - Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums -A -H- .
and - B -
to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only
17
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Small Outline Plastic Packages (SOIC)
M14.15 (JEDEC MS-012-AB ISSUE C)
N
INDEX
AREA
H
0.25(0.010) M
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
B M
E
INCHES
-B-
1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
α
e
A1
B
0.25(0.010) M
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3367
0.3444
8.55
8.75
3
E
0.1497
0.1574
3.80
4.00
4
e
C
0.10(0.004)
B S
0.050 BSC
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
NOTES:
MILLIMETERS
α
14
0o
14
8o
0o
7
8o
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
18
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Dual-In-Line Plastic Packages (PDIP)
E8.3 (JEDEC MS-001-BA ISSUE D)
N
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AD
E
BASE
PLANE
-C-
SEATING
PLANE
A2
A
L
D1
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8, 10
eA
C
0.008
0.014
0.204
C
D
0.355
0.400
9.01
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
eA
0.300 BSC
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
eB
-
L
0.115
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
5
D1
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
0.355
10.16
N
8
2.54 BSC
-
7.62 BSC
0.430
-
0.150
2.93
8
6
10.92
7
3.81
4
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
19
FN6363.1
January 18, 2008
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
N
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
H
0.25(0.010) M
B M
INCHES
E
SYMBOL
-B-
1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
α
B S
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
α
NOTES:
MILLIMETERS
8
0°
8
8°
0°
7
8°
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
20
FN6363.1
January 18, 2008