ISL90843 ® Quad Digital Controlled Potentiometers (XDCP™) Data Sheet March 29, 2006 Low Noise, Low Power, I2C® Bus, 256 Taps FN8095.2 Features • Four potentiometers in one package The ISL90843 integrates four digitally controlled potentiometers (XDCP) on a monolithic CMOS integrated circuit. • 256 resistor taps–0.4% resolution • I2C serial interface - Two address pins allow up to four devices/bus The digitally controlled potentiometers are implemented with a combination of resistor elements and CMOS switches. The position of the wipers are controlled by the user through the I2C bus interface. Each potentiometer has an associated Wiper Register (WR) that can be directly written to and read by the user. The contents of the WR controls the position of the wiper. • Wiper resistance: 70Ω typical @ 3.3V • Standby current <5µA max • Power supply: 2.7V to 5.5V • 10kΩ or 50kΩ total resistance • 10 Ld MSOP package The DCPs can be used as a voltage divider in a wide variety of applications including control, AC measurement, and signal processing. • Pb-free plus anneal product (RoHS compliant) Pinout ISL90843 (10 LD MSOP) TOP VIEW RW3 1 10 RW0 SCL 2 9 VCC SDA 3 8 A1 GND 4 7 A0 RW2 5 6 RW1 Ordering Information PART NUMBER (Note) PART MARKING RESISTANCE OPTION (kΩ) TEMP RANGE (°C) PACKAGE (Pb-Free) ISL90843WIU1027Z* DET 10 -40 to +85 10 Ld MSOP ISL90843UIU1027Z* DES 50 -40 to +85 10 Ld MSOP *Add "-TK" suffix for tape and reel. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. XDCP is a trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005, 2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL90843 Functional Diagram VCC RH RH RH RH SCL SDA I2C INTERFACE A0 A1 RL GND RW0 RL RL RL RW1 RW2 RW3 Block Diagram VCC I2C INTERFACE SDA SCL WR3 DCP3 RW3 WR2 DCP2 RW2 WR1 DCP1 RW1 WR0 DCP0 RW0 POWER-UP, INTERFACE, CONTROL AND STATUS LOGIC A1 A0 GND Pin Descriptions MSOP PIN SYMBOL 1 RW3 “Wiper” terminal of DCP3 2 SCL I2C interface clock 3 SDA Serial data I/O for the I2C interface 4 GND Device ground pin 5 RW2 “Wiper” terminal of DCP2 6 RW1 “Wiper” terminal of DCP1 7 A0 Device address for the I2C interface 8 A1 Device address for the I2C interface 9 VCC Power supply pin 10 RW0 “Wiper” terminal of DCP0 2 DESCRIPTION FN8095.2 March 29, 2006 ISL90843 Absolute Maximum Ratings Recommended Operating Conditions Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Voltage at any Digital Interface Pin with Respect to GND . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC+0.3 VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V Voltage at any DCP Pin with Respect to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . . 300°C IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V Power Rating of each DCP . . . . . . . . . . . . . . . . . . . . . . . . . . . .5mW Wiper Current of each DCP . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.0mA CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Analog Specifications SYMBOL Over recommended operating conditions unless otherwise stated. PARAMETER RTOTAL TEST CONDITIONS RH to RL Resistance MIN W, U versions respectively RH to RL Resistance Tolerance TYP (NOTE 1) Wiper Resistance CW Potentiometer Capacitance (Note 15) UNITS 10, 50 -20 RW MAX VCC = 3.3V @ 25°C kΩ +20 % 70 Ω 25 pF VOLTAGE DIVIDER MODE (0V @ RLi; VCC @ RHi; measured at RWi, unloaded; i = 0, 1, 2, or 3) INL (Note 6) Integral Non-Linearity DNL (Note 5) Differential Non-Linearity ZSerror (Note 3) Zero-Scale Error FSerror (Note 4) Full-Scale Error VMATCH (Note 7) DCP to DCP Matching Monotonic over all tap positions TCV (Note 8) Ratiometric Temperature Coefficient -1 1 LSB (Note 2) -0.5 0.5 LSB (Note 2) LSB (Note 2) W option 0 1 7 U option 0 0.5 2 W option -7 -1 0 U option -2 -1 0 Any two DCPs at same tap position, same voltage at all RH terminals, and same voltage at all RL terminals -2 DCP register set to 80 hex LSB (Note 2) 2 LSB (Note 2) ±4 ppm/°C Operating Specifications Over the recommended operating conditions unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS MIN TYP (NOTE 1) MAX UNITS = 400kHz; SDA = Open; (for I2C, Active, ICC1 VCC Supply Current (Volatile write/read) 10k DCPs, fSCL Read and Write States) 3.8 mA ICC2 VCC Supply Current (Volatile write/read) 50k DCPs, fSCL = 400kHz; SDA = Open; (for I2C, Active, Read and Write States) 2.9 mA VCC current (standby) VCC = +5.5V, 10k DCPs, I2C Interface in Standby State 2.8 mA VCC = +5.5V, 50k DCPs, I2C Interface in Standby State 0.6 mA VCC = +3.6V, 10k DCPs, I2C Interface in Standby State 1.9 mA VCC = +3.6V, 50k DCPs, I2C Interface in Standby State 0.4 mA 10 µA 1 µs 2.6 V ISB ILkgDig tDCP (Note 15) Vpor Leakage Current, at Pins A0, A1, Voltage at pin from GND to VCC SDA and SCL Pins DCP Wiper Response Time SCL falling edge of last bit of DCP Data Byte to wiper change Power-On Recall Voltage Minimum VCC at which memory recall occurs 3 -10 1.8 FN8095.2 March 29, 2006 ISL90843 Operating Specifications Over the recommended operating conditions unless otherwise specified. (Continued) SYMBOL VccRamp PARAMETER TEST CONDITIONS VCC Ramp Rate MIN TYP (NOTE 1) MAX 0.2 tD (Note 15) Power-Up Delay VCC above Vpor, to DCP Initial Value Register recall completed, and I2C Interface in Standby State. UNITS V/ms 3 ms SERIAL INTERFACE SPECS VIL A1, A0, SDA, and SCL Input Buffer LOW Voltage -0.3 0.3*VCC V VIH A1, A0, SDA, and SCL Input Buffer HIGH Voltage 0.7*VCC VCC+0.3 V Hysteresis SDA and SCL Input Buffer (Note 15) Hysteresis VOL (Note 15) SDA Output Buffer LOW Voltage, Sinking 4mA Cpin (Note 15) V 0.05* VCC 0.4 V A1, A0, SDA, and SCL Pin Capacitance 10 pF SCL Frequency 400 kHz tIN (Note 15) Pulse Width Suppression Time at Any pulse narrower than the max spec is suppressed. SDA and SCL Inputs 50 ns tAA (Note 15) SCL Falling Edge to SDA Output SCL falling edge crossing 30% of VCC, until SDA exits the 30% to 70% of VCC window. Data Valid 900 ns tBUF (Note 15) Time the Bus Must be Free Before SDA crossing 70% of VCC during a STOP condition, to the Start of a New Transmission SDA crossing 70% of VCC during the following START condition. 1300 ns tLOW Clock LOW Time Measured at the 30% of VCC crossing. 1300 ns tHIGH Clock HIGH Time Measured at the 70% of VCC crossing. 600 ns tSU:STA START Condition Setup Time SCL rising edge to SDA falling edge. Both crossing 70% of VCC. 600 ns tHD:STA START Condition Hold Time From SDA falling edge crossing 30% of VCC to SCL falling edge crossing 70% of VCC. 600 ns tSU:DAT Input Data Setup Time From SDA exiting the 30% to 70% of VCC window, to SCL rising edge crossing 30% of VCC. 100 ns tHD:DAT Input Data Hold Time From SCL rising edge crossing 70% of VCC to SDA entering the 30% to 70% of VCC window. 0 ns tSU:STO STOP Condition Setup Time From SCL rising edge crossing 70% of VCC, to SDA rising edge crossing 30% of VCC. 600 ns tHD:STO STOP Condition Hold Time for Read, or Volatile Only Write From SDA rising edge to SCL falling edge. Both crossing 70% of VCC. 600 ns tDH (Note 15) Output Data Hold Time From SCL falling edge crossing 30% of VCC, until SDA enters the 30% to 70% of VCC window. 0 ns tR (Note 15) SDA and SCL Rise Time From 30% to 70% of VCC 20 + 0.1 * Cb 250 ns tF (Note 15) SDA and SCL Fall Time From 70% to 30% of VCC 20 + 0.1 * Cb 250 ns Cb (Note 15) Capacitive Loading of SDA or SCL Total on-chip and off-chip 10 400 pF Rpu (Note 15) SDA and SCL Bus Pull-Up Resistor Off-Chip fSCL 4 0 Maximum is determined by tR and tF. For Cb = 400pF, max is about 2~2.5kΩ. For Cb = 40pF, max is about 15~20kΩ 1 kΩ FN8095.2 March 29, 2006 ISL90843 Operating Specifications Over the recommended operating conditions unless otherwise specified. (Continued) SYMBOL PARAMETER TEST CONDITIONS MIN TYP (NOTE 1) MAX UNITS tSU:A A1 and A0 Setup Time Before START condition 600 ns tHD:A A1 and A0 Hold Time After STOP condition 600 ns SDA vs SCL Timing tF tHIGH SCL tLOW tR tSU:DAT tSU:STA tHD:DAT tHD:STA SDA (INPUT TIMING) tSU:STO tAA tDH tBUF SDA (OUTPUT TIMING) A0 and A1 Pin Timing STOP START SCL CLK 1 SDA IN tSU:A tHD:A A0, A1 NOTES: 1. Typical values are for TA = 25°C and 3.3V supply voltage. 2. LSB: [V(RW)255 – V(RW)0]/255. V(RW)255 and V(RW)0 are V(RW) for the DCP register set to FF hex and 00 hex respectively. LSB is the incremental voltage when changing from one tap to an adjacent tap. 3. ZS error = V(RW)0/LSB. 4. FS error = [V(RW)255 – VCC]/LSB. 5. DNL = [V(RW)i – V(RW)i-1]/LSB-1, for i = 1 to 255. i is the DCP register setting. 6. INL = [V(RW)i – i • LSB – V(RW)0]/LSB for i = 1 to 255. 7. VMATCH = [V(RWx)i – V(RWy)i]/LSB, for i = 0 to 255, x = 0 to 3 and y = 0 to 3. Max ( V ( RW ) i ) – Min ( V ( RW ) i ) 10 6 8. TC V = ---------------------------------------------------------------------------------------------- × ----------------- for i = 16 to 240 decimal, T = -40°C to 85°C. Max( ) is the maximum value of the wiper [ Max ( V ( RW ) i ) + Min ( V ( RW ) i ) ] ⁄ 2 125°C voltage and Min ( ) is the minimum value of the wiper voltage over the temperature range. 9. MI = |R255 – R0|/255. R255 and R0 are the measured resistances for the DCP register set to FF hex and 00 hex respectively. 10. Roffset = R0/MI, when measuring between RW and RL. Roffset = R255/MI, when measuring between RW and RH. 11. RDNL = (Ri – Ri-1)/MI-1, for i = 32 to 255. 12. RINL = [Ri – (MI • i) – R0]/MI, for i = 32 to 255. 13. RMATCH = (Ri,x – Ri,y)/MI, for i = 0 to 255, x = 0 to 3 and y = 0 to 3. 6 [ Max ( Ri ) – Min ( Ri ) ] 10 14. TC R = ---------------------------------------------------------------- × ----------------- for i = 32 to 255, T = -40°C to 85°C. Max( ) is the maximum value of the resistance and Min ( ) is the [ Max ( Ri ) + Min ( Ri ) ] ⁄ 2 125°C minimum value of the resistance over the temperature range. 15. This parameter is not 100% tested. 5 FN8095.2 March 29, 2006 ISL90843 Typical Performance Curves 1.8 160 Vcc = 2.7, T = 85°C Vcc = 2.7, T = -40°C 1.6 Vcc = 2.7, T = 25°C 1.4 120 STANDBY ICC (µA) WIPER RESISTANCE (Ω) 140 100 80 60 40 Vcc = 5.5, T = -40°C 20 Vcc = 5.5, T = 85°C Vcc = 5.5, T = 25°C 50 100 150 200 -40°C 1.0 0.8 85°C 0.6 0.4 0.2 25°C 0.0 2.7 0 0 1.2 250 3.2 3.7 0.3 Vcc = 5.5, T = -40°C 0.15 4.7 5.2 FIGURE 2. STANDBY Icc vs Vcc FIGURE 1. WIPER RESISTANCE vs TAP POSITION [ I(RW) = Vcc/RTOTAL] FOR 50kΩ (U) 0.2 4.2 VCC (V) TAP POSITION (DECIMAL) Vcc = 2.7, T = -40°C Vcc = 5.5, T = -40°C Vcc = 2.7, T = -40°C Vcc = 2.7, T = 25°C Vcc = 5.5, T = 85°C 0.2 0.1 INL (LSB) DNL (LSB) 0.1 0.05 0 -0.05 0 Vcc = 2.7, T = 25°C Vcc = 2.7, T = 85°C -0.1 Vcc = 5.5, T = 25°C Vcc = 2.7, T = 85°C Vcc = 5.5, T = 85°C -0.1 -0.15 -0.2 0 -0.2 -0.3 50 100 150 200 Vcc = 5.5, T = 25°C 250 0 50 100 150 200 250 TAP POSITION (DECIMAL) TAP POSITION (DECIMAL) FIGURE 4. INL vs TAP POSITION FOR 10kΩ (W) FIGURE 3. DNL vs TAP POSITION FOR 10kΩ (W) 0 0.4 -0.1 -0.2 Vcc = 5.5V -0.3 FSerror (LSB) ZSerror (LSB) 0.35 0.3 2.7V 0.25 -0.4 Vcc = 2.7V -0.5 -0.6 -0.7 0.2 -0.8 5.5V -0.9 0.15 -40 -20 0 20 40 60 TEMPERATURE (°C) FIGURE 5. ZSerror vs TEMPERATURE 6 80 -1 -40 -20 0 20 40 60 80 TEMPERATURE (°C) FIGURE 6. FSerror vs TEMPERATURE FN8095.2 March 29, 2006 ISL90843 Typical Performance Curves (Continued) 20 1.00 10 0.50 0.00 2.7V TC (ppm/°C) END TO END RTOTAL CHANGE (%) 1.50 5.5V -0.50 0 -10 -1.00 -1.50 -40 -20 0 20 40 60 80 TEMPERATURE (°C) FIGURE 7. END TO END RTOTAL % CHANGE vs TEMPERATURE Signal at Wiper (Wiper Unloaded) -20 32 82 132 182 232 TAP POSITION (DECIMAL) FIGURE 8. TC FOR VOLTAGE DIVIDER MODE IN ppm SCL Signal at Wiper (Wiper Unloaded Movement From ffh to 00h) Wiper Movement Mid Point From 80h to 7fh FIGURE 9. MIDSCALE GLITCH, CODE 80h TO 7Fh (WIPER 0) Principles of Operation The ISL90843 is an integrated circuit incorporating four DCPs with their associated registers, and an I2C serial interface providing direct communication between a host and the potentiometers. DCP Description Each DCP is implemented with a combination of resistor elements and CMOS switches. The physical ends of each DCP are equivalent to the fixed terminals of a mechanical potentiometer (RH and RL pins). The RW pin of each DCP is connected to intermediate nodes, and is equivalent to the wiper terminal of a mechanical potentiometer. The position of the wiper terminal within the DCP is controlled by an 8-bit volatile Wiper Register (WR). Each DCP has its own WR. When the WR of a DCP contains all zeroes (WR<7:0>: 00h), its wiper terminal (RW) is closest to its “Low” terminal (RL). When the WR of a DCP contains all ones (WR<7:0>: FFh), its wiper terminal (RW) is closest to its “High” terminal (RH). 7 FIGURE 10. LARGE SIGNAL SETTLING TIME As the value of the WR increases from all zeroes (00h) to all ones (255 decimal), the wiper moves monotonically from the position closest to RL to the closest to RH. At the same time, the resistance between RW and RL increases monotonically, while the resistance between RH and RW decreases monotonically. While the ISL90843 is being powered up, all four WRs are reset to 80h (128 decimal), which locates RW roughly at the center between RL and RH. The WRs can be read or written directly using the I2C serial interface as described in the following sections. The I2C interface Address Byte has to be set to 00hex, 01hex, 02hex, and 03hex to access the WR of DCP0, DCP1, DCP2, and DCP3 respectively. I2C Serial Interface The ISL90843 supports a bidirectional bus oriented protocol. The protocol defines any device that sends data onto the FN8095.2 March 29, 2006 ISL90843 bus as a transmitter and the receiving device as the receiver. The device controlling the transfer is a master and the device being controlled is the slave. The master always initiates data transfers and provides the clock for both transmit and receive operations. Therefore, the ISL90843 operates as a slave device in all applications. All communication over the I2C interface is conducted by sending the MSB of each byte of data first. Protocol Conventions Data states on the SDA line can change only during SCL LOW periods. SDA state changes during SCL HIGH are reserved for indicating START and STOP conditions (See Figure 11). On power-up of the ISL90843 the SDA pin is in the input mode. All I2C interface operations must begin with a START condition, which is a HIGH to LOW transition of SDA while SCL is HIGH. The ISL90843 continuously monitors the SDA and SCL lines for the START condition and does not respond to any command until this condition is met (See Figure 11). A START condition is ignored during the powerup of the device. of a read operation, or at the end of a write operation places the device in its standby mode. An ACK, Acknowledge, is a software convention used to indicate a successful data transfer. The transmitting device, either master or slave, releases the SDA bus after transmitting eight bits. During the ninth clock cycle, the receiver pulls the SDA line LOW to acknowledge the reception of the eight bits of data (See Figure 12). The ISL90843 responds with an ACK after recognition of a START condition followed by a valid Identification Byte, and once again after successful receipt of an Address Byte. The ISL90843 also responds with an ACK after receiving a Data Byte of a write operation. The master must respond with an ACK after receiving a Data Byte of a read operation A valid Identification Byte contains 01010 as the five MSBs, and the following two bits matching the logic values present at pins A1 and A0. The LSB is in the Read/Write bit. Its value is “1” for a Read operation, and “0” for a Write operation (See Table 1). TABLE 1. IDENTIFICATION BYTE FORMAT Logic values at pins A1, and A0 respectively All I2C interface operations must be terminated by a STOP condition, which is a LOW to HIGH transition of SDA while SCL is HIGH (See Figure 11). A STOP condition at the end 0 1 0 1 0 A1 (MSB) A0 R/W (LSB) SCL SDA START DATA STABLE DATA CHANGE DATA STABLE STOP FIGURE 11. VALID DATA CHANGES, START, AND STOP CONDITIONS SCL FROM MASTER 1 8 SDA OUTPUT FROM TRANSMITTER 9 HIGH IMPEDANCE HIGH IMPEDANCE SDA OUTPUT FROM RECEIVER START ACK FIGURE 12. ACKNOWLEDGE RESPONSE FROM RECEIVER 8 FN8095.2 March 29, 2006 ISL90843 WRITE SIGNALS FROM THE MASTER SIGNAL AT SDA S T A R T IDENTIFICATION BYTE ADDRESS BYTE 0 1 0 1 0 A1 A0 0 0 0 0 0 0 0 SIGNALS FROM THE ISL90843 S T O P DATA BYTE A C K A C K A C K FIGURE 13. BYTE WRITE SEQUENCE SIGNALS FROM THE MASTER S T A R T SIGNAL AT SDA IDENTIFICATION BYTE WITH R/W=0 ADDRESS BYTE 0 1 0 1 0 A1 A0 0 A C K S A T C O K P A C K 0 1 0 1 0 A1 A0 1 0 0 0 0 0 0 A C K SIGNALS FROM THE SLAVE S T A IDENTIFICATION R BYTE WITH T R/W=1 A C K A C K FIRST READ DATA BYTE LAST READ DATA BYTE FIGURE 14. READ SEQUENCE Write Operation Read Operation A Write operation requires a START condition, followed by a valid Identification Byte, a valid Address Byte, a Data Byte, and a STOP condition. After each of the three bytes, the ISL90843 responds with an ACK. At this time, the device enters its standby state (See Figure 13). A Read operation consist of a three byte instruction followed by one or more Data Bytes (See Figure 14). The master initiates the operation issuing the following sequence: a START, the Identification byte with the R/W bit set to “0”, an Address Byte, a second START, and a second Identification byte with the R/W bit set to “1”. After each of the three bytes, the ISL90843 responds with an ACK. Then the ISL90843 transmits Data Bytes as long as the master responds with an ACK during the SCL cycle following the eighth bit of each byte. The master terminates the read operation (issuing a NACK and a STOP condition) following the last bit of the last Data Byte (See Figure 14). The Data Bytes are from the registers indicated by an internal pointer. This pointer initial value is determined by the Address Byte in the Read operation instruction, and increments by one during transmission of each Data Byte. After reaching the memory location 03h the pointer “rolls over” to 00h, and the device continues to output data for each ACK received. 9 FN8095.2 March 29, 2006 ISL90843 MSOP Packaging Information 10 Lead MSOP, Package Code 0.0106 [0.27] 0.0067 [0.17] 10 9 8 7 4 6 0.0106 [0.27] 0.1970 [5.00] 0.1890 [4.80] 1 2 3 4 4 0.0067 [0.17] WITH PLATING (S) 0.0091 [0.23] 0.0050 [0.127] 0.0051 [0.13] WITH PLATING 0.0080 [0.203] REF 5 BASE METAL 0.0197 [0.50] BSC SECTION A-A 0.1220 [3.10] 0.1142 [2.90] 0.0374 [0.95] 2 0.0295 [0.75] 0.0433 [1.10] MAX. 0.1220 [3.10] 0.0098 [0.25] GAUGE PLANE 0.1142 [2.90] 0.1220 [3.10] 0.0059 [0.15] 0.0020 [0.05] 0.0039 [0.10] MAX. 0.1142 [2.90] (S) (S) 3 A 3 0°-6° A 0.0276 [0.70] 0.0157 [0.40] NOTES: 1. Package dimensions conform to JEDEC specification MO-187BA. 2. 2 Does not include mold flash, protrusion or gate burrs, mold flash protrusions or gate burrs shall not exceed 0.15 mm per side. 3. 3 Does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side. 4. 4 Does not include dambar protrusion. Allowable dambar protrusion shall be 0.8 mm. 5. Lead span/stand-off height/coplanarity are considered as special characteristics. 6. Controlling dimensions in inches [mm]. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 10 FN8095.2 March 29, 2006