ISL95710 ® Digitally Controlled Potentiometer (XDCP™) Data Sheet August 31, 2006 Terminal Voltage ±2.7V to ±5V, 128 Taps, Up/Down Interface The Intersil ISL95710 is a digitally controlled potentiometer (XDCP). The device consists of a resistor array, wiper switches, a control section, and nonvolatile memory. The wiper position is controlled by a Up/Down interface. The potentiometer is implemented by a resistor array composed of 127 resistive elements and a wiper switching network. Between each element and at either end are tap points accessible to the wiper terminal. The position of the wiper element is controlled by the CS, U/D, and INC inputs. The position of the wiper can be stored in nonvolatile memory and then be recalled upon a subsequent power-up operation. The device can be used as a three-terminal potentiometer or as a two-terminal variable resistor in a wide variety of applications including: • Industrial and automotive control FN8240.3 Features • Non-Volatile Solid-State Potentiometer • Up/Down Interface with Chip Select Enable • DCP Terminal Voltage ±2.7V to ±5.5V • 128 Wiper Tap Points - Wiper position stored in nonvolatile memory and recalled on power-up • 127 Resistive Elements - Typical RTOTAL tempco = ±50ppm/°C - End to end resistance range ±20% • Low Power CMOS - Standby current, 1µA - Active current, 3mA max - VCC = 2.7V to 5.5V - V- = -2.7V to -5.5V • High Reliability - Endurance, 200,000 data changes per bit - Register data retention, 50 years • Parameter and bias adjustments • Amplifier bias and control • RTOTAL Values = 10kΩ, 50kΩ Pinout • Package - 10 Ld MSOP - Pb-free plus anneal (RoHS compliant) ISL95710 (10 LD MSOP) TOP VIEW U/D 1 10 INC V- 2 9 VCC GND 3 8 RL CS 4 7 RW NC 5 6 RH Ordering Information PART NUMBER (Notes 1, 2) PART MARKING RESISTANCE OPTION (Ω) TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL95710WIU10Z AKR 10k -40 to +85 10 Ld MSOP M10.118 ISL95710UIU10Z AKP 50k -40 to +85 10 Ld MSOP M10.118 NOTES: 1. Add “-T” suffix for tape and reel. 2. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. XDCP is a trademark of Intersil, Inc. Copyright Intersil Americas Inc. 2005, 2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL95710 Block Diagram U/D INC VCC V- (ANALOG VOLTAGE) CS UP/DOWN (INC) DEVICE SELECT CONTROL AND MEMORY 126 125 7-BIT NONVOLATILE MEMORY RW (CS) RH 127 RH (U/D) INCREMENT 7-BIT UP/DOWN COUNTER 124 ONE OF 128 TRANSFER GATES RESISTOR ARRAY DECODER RL 2 GND (GROUND) VGND GENERAL STORE AND RECALL CONTROL CIRCUITRY 1 0 RL RW DETAILED Pin Descriptions PIN NUMBER SYMBOL DESCRIPTION 1 U/D 2 V- 3 GND 4 CS Chip select. The device is selected when the CS input is LOW. Also used to initiate a nonvolatile store 5 NC No Connect. Pin is to be left unconnected 6 RH A fixed terminal for one end of the potentiometer resistor 7 RW The wiper terminal which is equivalent to the movable terminal of a potentiometer 8 RL A fixed terminal for one end of the potentiometer resistor 9 VCC Positive logic supply voltage 10 INC Increment input; negative edge triggered Controls the direction of wiper movement and whether the counter is incremented or decremented Negative bias voltage for the potentiometer wiper control Ground 2 FN8240.3 August 31, 2006 ISL95710 Absolute Maximum Ratings Thermal Information Temperature under bias . . . . . . . . . . . . . . . . . . . . . .-65°C to +135°C Storage temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Voltage on CS, INC, U/D and VCC with respect to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . -1V to +6V Voltage on V- (referenced to GND) . . . . . . . . . . . . . . . . . . . . . . . -6V ∆V = |V(RH)-V(RL)| . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12V Lead temperature (soldering 10 seconds) . . . . . . . . . . . . . . . . 300°C IW (10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA ESD (Mil-Std 883, Method 3015) . . . . . . . . . . . . . . . . . . . . . . . .>2kV ESD Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>150V Thermal Resistance (Typical, Note 3) θJA (°C/W) MSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . +170 Recommended Operating Conditions Temperature Range (Industrial) . . . . . . . . . . . . . . . . .-40°C to +85°C VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.7V to -5.5V CAUTION: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. NOTE: 3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Analog Specifications SYMBOL RTOTAL Over recommended operating conditions unless otherwise stated. PARAMETER RH to RL resistance TEST CONDITIONS VRH,VRL RW CH/CL/CW (Note 13) ILkgDCP UNIT kΩ U option 50 kΩ -20 IDCP = 1mA T = -40°C to +85°C +20 ±50 VV- = -5.5V; VCC = +5.5V, wiper current = (VCC-V-)/RTOTAL VCC V 200 Ω 10/10/25 Voltage at pins; V- to VCC -1 % ppm/°C 70 Potentiometer Capacitance Leakage on DCP pins MAX 10 RH,RL terminal voltage Wiper resistance TYP (Note 1) W option RH to RL resistance tolerance TCR Resistance Temperature Coefficient (Note 12, 13) MIN 0.1 pF 1 µA -1 1 LSB (Note 2) -0.5 0.5 LSB (Note 2) LSB (Note 2) VOLTAGE DIVIDER MODE (V- @ RL; VCC @ RH; Voltage at RW = VRW unloaded) INL (Note 6) Integral non-linearity DNL (Note 5) Differential non-linearity W, U options ZSerror (Note 3) Zero-scale error W option 0 1 4 U option 0 0.5 2 FSerror (Note 4) Full-scale error W option -4 -1 0 U option -2 -0.5 0 TCV Ratiometric Temperature Coefficient (Notes 7, 13) DCP Register set at 63d, T = -40°C to +85°C ±4 LSB (Note 2) ppm/°C RESISTOR MODE (Measurements between RW and RL with RH not connected, or between RW and RH with RL not connected) RINL (Note 11) Integral non-linearity DCP register set between 20 hex and 5F hex. Monotonic over all tap positions RDNL (Note 10) Differential non-linearity W, U options Roffset (Note 9) Offset DCP Register set to 00 hex, W option 0 DCP Register set to 00 hex, U option 0 3 -1 1 MI (Note 8) -0.5 0.5 MI (Note 8) 2 5 0.5 2 MI (Note 8) FN8240.3 August 31, 2006 ISL95710 Operating Specifications Over the recommended operating conditions unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS MIN TYP (Note 1) MAX UNIT 500 µA ICC1 VCC supply current, volatile write/read CS = VIL, U/D = VIL or VIH and INC = VIL or VIH, RL, RH, RW not connected IV-1 V- supply current, volatile write/read CS = VIL, U/D = VIL or VIH and INC = VIL or VIH, RL, RH, RW not connected ICC2 VCC supply current, nonvolatile write U/D = VIL or VIH and INC = VIH, CS = transitions from VIL to VIH. RL, RH, RW not connected IV-2 V- supply current, nonvolatile write U/D = VIL or VIH and INC = VIH, CS = transitions from VIL to VIH. RL, RH, RW not connected VCC current (standby) VCC = +5.5V, I2C Interface in Standby State 1 µA VCC = +3.6V, I2C Interface in Standby State 1 µA ICCSB IV-SB V- current (standby) µA -100 500 µA -3 mA V- = -5.5V, CS = VIH -5 µA V- = -3.6V, CS = VIH -2 µA ILkgDig Leakage current, at pins INC, CS, and VIL or VIH applied at pin U/D -10 IIL_CS Leakage at CS, input low VIL = 0V -300 µA Power-on recall for both V- and VCC V- -2.5 V Vpor 10 VCC V- Ramp V- ramp rate µA 2.5 V -0.2 V/ms EEPROM SPECS EEPROM Endurance 200,000 Cycles 50 Years Temperature ≤ +75°C EEPROM Retention 3-WIRE INTERFACE SPECS VIL INC, CS, and U/D input buffer LOW voltage -0.3 0.3*VCC V VIH INC, CS, and U/D input buffer HIGH voltage 0.7*VCC VCC+ 0.3 V Hysteresis (Note 13) Cpin INC, CS, and U/D input buffer hysteresis INC, CS, and U/D pin capacitance AC Electrical Specifications SYMBOL 0.15* VCC V 10 pF VCC = 5V ±10%, TA = Full Operating Temperature Range unless otherwise stated PARAMETER MIN TYP (Note 1) MAX UNIT tCl CS to INC setup 100 ns tlD INC HIGH to U/D change 100 ns tDI U/D to INC setup 1 µs tlL INC LOW period 1 µs tlH INC HIGH period 1 µs tlC INC inactive to CS inactive 1 µs tCPHS (Note 14) CS deselect time (STORE) 20 ms CS deselect time (NO STORE) 1 µs tCPHNS 4 FN8240.3 August 31, 2006 ISL95710 AC Electrical Specifications VCC = 5V ±10%, TA = Full Operating Temperature Range unless otherwise stated (Continued) SYMBOL tIW PARAMETER MIN INC to RW change tCYC INC cycle time tR, tF INC input rise and fall time TYP (Note 1) MAX UNIT 100 500 µs 2 µs 500 µs NOTES: 1. Typical values are for TA = +25°C and 3.3V supply voltage. 2. LSB: [V(RW)127 – V(RW)0]/127. V(RW)127 and V(RW)0 are V(RW) for the DCP register set to 7F hex and 00 hex respectively. LSB is the incremental voltage when changing from one tap to an adjacent tap. 3. ZS error = (V(RW)0– V-)/LSB. 4. FS error = [V(RW)127 – V+]/LSB. 5. DNL = [V(RW)i – V(RW)i-1]/LSB-1, for i = 1 to 127. i is the DCP register setting. 6. INL = V(RW)i – (i • LSB – V(RW)0)/LSB for i = 1 to 127. Max ( V ( RW ) i ) – Min ( V ( RW ) i ) 10 6 7. TC V = ----------------------------------------------------------------------------------------------x ----------------[ Max ( V ( RW ) i ) + Min ( V ( RW ) i ) ] ⁄ 2 125°C for i = 16 to 120 decimal. Max ( ) is the maximum value of the wiper voltage and Min ( ) is the minimum value of the wiper voltage over the temperature range. 8. MI = |R127 – R0| /127. R127 and R0 are the measured resistances for the DCP register set to 7F hex and 00 hex respectively. 9. Roffset = R0/MI, when measuring between RW and RL. Roffset = R127/MI, when measuring between RW and RH. 10. RDNL = (Ri – Ri-1)/MI -1, for i = 16 to 127. 11. RINL = [Ri – (MI • i) – R0]/MI, for i = 16 to 127. 6 [ Max ( Ri ) – Min ( Ri ) ] 10 12. TC = ---------------------------------------------------------------- × ----------------R [ Max ( Ri ) + Min ( Ri ) ] ⁄ 2 125°C for i = 16 to 127, T = -40°C to +85°C. Max ( ) is the maximum value of the resistance and Min ( ) is the minimum value of the resistance over the temperature range. 13. This parameter is not 100% tested. 14. tCPHS is the minimum cycle time to be allowed for any non-volatile Write by the user. It is the time from a valid STORE condition to the end of the self-timed internal non-volatile write cycle. No CS or INC changes should be allowed. Symbol Table WAVEFORM INPUTS OUTPUTS Must be steady Will be steady May change from Low to High Will change from Low to High May change from High to Low Will change from High to Low Don’t Care: Changes Allowed Changing: State Not Known N/A Center Line is High Impedance 5 FN8240.3 August 31, 2006 ISL95710 A.C. Timing CS tCYC tCI tIL tIC tIH tCPHNS tCPHS 90% 90% 10% INC tID tDI tF tR U/D tIW MI RW (1) NOTE (1): MI IN THE TIMING DIAGRAM REFERS TO THE MINIMUM INCREMENTAL CHANGE IN THE WIPER POSITION. Typical Performance Curves 120 Irw=0.6mA T=85ºC 80 0.6 60 0.5 Isb (µA) WIPER RESISTANCE (Ω) 100 T=25ºC 40 20 T = 85ºC T = 25ºC T = -40ºC 0.4 T=-40ºC 0.3 2.7 0 0 20 40 60 80 100 120 3.2 3.7 4.2 TAP POSITION (DECIMAL) 5.2 FIGURE 2. STANDBY ICC vs VCC FIGURE 1. WIPER RESISTANCE vs TAP POSITION [I(RW) = VCC/RTOTAL] for 10kΩ (W) 0.2 0.2 Vrh=5.5V, Vrl=-5.5V Vrh=5.5V, Vrl=-5.5V 0.1 0.1 INL (LSB) DNL (LSB) 4.7 Vcc, V 0 0 -0.1 -0.1 Vrh=2.7V, Vrl=-2.7V Vrh=2.7V, Vrl=-2.7V -0.2 -0.2 0 20 40 60 80 100 120 TAP POSITION (DECIMAL) FIGURE 3. DNL vs TAP POSITION IN VOLTAGE DIVIDER MODE FOR 10kΩ (W) 6 0 20 40 60 80 100 120 TAP POSITION (DECIMAL) FIGURE 4. INL vs TAP POSITION IN VOLTAGE DIVIDER MODE FOR 10kΩ (W) FN8240.3 August 31, 2006 ISL95710 Typical Performance Curves (Continued) 1.6 0 Vrh=2.7V, Vrl=-2.7V, 10k -0.4 FSerror (LSB) ZSerror (LSB) 1.2 0.8 Vrh=5.5V, Vrl=-5.5V, 10k 0.4 Vrh=5.5V, Vrl=-5.5V, 10k -0.8 -1.2 -1.6 Vrh=2.7V, Vrl=-2.7V, 10k 0 -40 -20 0 20 40 60 -2 -40 80 -20 TEMPERATURE (C) 0 20 60 80 TEMPERATURE (C) FIGURE 5. ZSerror vs TEMPERATURE FIGURE 6. FSerror vs TEMPERATURE 1 0.1 T=25ºC T=25º C Vcc=2.7V, V-=-2.7V 0.8 Vcc=2.7V, V-=2 7V 0.05 RINL (LSB) 0.6 RDNL (LSB) 40 0 0.4 0.2 -0.05 0 Vcc=5.5V, V-=-5.5V -0.1 Vcc=5.5V, V-=5 5V -0.2 0 20 40 60 80 100 120 0 50 FIGURE 8. INL vs TAP POSITION IN RHEOSTAT MODE FOR 10kΩ (W) FIGURE 7. DNL vs TAP POSITION IN RHEOSTAT MODE FOR 10kΩ (W) 100 1 Idcp= 0.57mA 80 0.5 TCv (ppm/°C) END TO END RTOTAL CHANGE (%) 100 TAP POSITION (DECIM AL) TAP POSITION (DECIMAL) 0 Idcp= 1.16mA -0.5 60 40 10k 20 50k -1 -40 0 -20 0 20 40 60 TEMPERATURE (ºC) FIGURE 9. END TO END RTOTAL % CHANGE vs TEMPERATURE 7 80 16 36 56 76 96 116 TAP POSITION (DECIMAL) FIGURE 10. TC FOR VOLTAGE DIVIDER MODE IN ppm FN8240.3 August 31, 2006 ISL95710 Typical Performance Curves (Continued) 200 10k TCr (ppm/°C) 150 100 50 50k 0 16 36 56 76 96 TAP POSITION (DECIMAL) FIGURE 11. TC FOR RHEOSTAT MODE IN ppm FIGURE 12. FREQUENCY RESPONSE (1.8MHz) FIGURE 13. WIPER MOVEMENT FIGURE 14. LARGE SIGNAL SETTLING TIME Power Up and Down Requirements RW In order to prevent unwanted tap position changes, or an inadvertent store, bring the CS and INC high before or concurrently with the VCC pin on power-up. The potentiometer voltages must be applied after this sequence is completed. During power-up, the data sheet parameters for the DCP do not fully apply until 1ms after VCC reaches its final value. The VCC ramp spec is always in effect. Rw is the wiper terminal and is equivalent to the movable terminal of a mechanical potentiometer. The position of the wiper within the array is determined by the wiper counter. Up/Down (U/D) The U/D input controls the direction of the wiper movement and whether the wiper counter is incriminated or decremented. Increment (INC) Pin Descriptions RH and RL The high (RH) and low (RL) terminals of the ISL95710 are equivalent to the fixed terminals of a mechanical potentiometer. The terminology of RL and RH references the relative position of the terminal in relation to wiper movement direction selected by the U/D input and not the voltage potential on the terminal. 8 The INC input is negative-edge triggered. Toggling INC will move the wiper and either increment or decrement the wiper counter in the direction indicated by the logic level on the U/D input. Chip Select (CS) The device is selected when the CS input is LOW. The current wiper counter value is stored in nonvolatile memory when CS is returned HIGH while the INC input is also HIGH. After the store operation is complete the ISL95710 will be FN8240.3 August 31, 2006 ISL95710 placed in the low power standby mode until the device is selected once again. adjustments might be based on user preference, system parameter changes due to temperature drift, etc. Principles of Operation The state of U/D may be changed while CS remains LOW. This allows the host system to enable the device and then move the wiper up and down until the proper trim is attained. During initial power-up CS must go high along with or before VCC to avoid an accidental store generation. There are three sections of the ISL95710: the input control, wiper counter and decode section; the nonvolatile memory; and the resistor array. The input control section operates as an up/down counter. The output of this wiper counter is decoded to turn on a electronic switch connecting a point on the resistor array to the wiper output. The contents of the wiper counter can be stored in nonvolatile memory and retained for future use. The resistor array is comprised of individual resistors connected in series. At either end of the array and between each resistor is an electronic switch that transfers the potential at that point to the wiper. The wiper, when at either fixed terminal, acts like its mechanical equivalent and does not move beyond the last position. The wiper counter does not wrap around when clocked to either extreme. The electronic switches on the device operate in a “make before break” mode when the wiper changes tap positions. If the wiper is moved several positions, multiple taps are connected to the wiper for tIW (INC to RW change). The RTOTAL value for the device can temporarily be reduced by a significant amount if the wiper is moved several positions. TABLE 1. MODE SELECTION CS INC U/D MODE L H Wiper up L L Wiper down H X Store wiper position X X Standby current L X No store, return to standby H X Standby L H Wiper up one position (not recommended) L L Wiper down one position (not recommended) H H When the device is powered-down, the last wiper position stored will be maintained in the nonvolatile memory. When power is restored, the contents of the memory are recalled and the wiper is set to the value last stored. Instructions and Programming The INC, U/D and CS inputs control the movement of the wiper along the resistor array. With CS set LOW the device is selected and enabled to respond to the U/D and INC inputs. HIGH to LOW transitions on INC will increment or decrement (depending on the state of the U/D input) a seven bit wiper counter. The output of this wiper counter is decoded to select one of 128 wiper positions along the resistive array. The value of the wiper counter is stored in nonvolatile memory whenever CS transitions HIGH while the INC input is also HIGH. The system may select the ISL95710, move the wiper and deselect the device without having to store the latest wiper position in nonvolatile memory. After the wiper movement is performed as described above and once the new position is reached, the system must keep INC LOW while taking CS HIGH. The new wiper position will be maintained until changed by the system or until a power-up/down cycle recalls the previously stored data. This procedure allows the system to always power-up to a preset value stored in nonvolatile memory; then during system operation minor adjustments could be made. The 9 FN8240.3 August 31, 2006 ISL95710 Mini Small Outline Plastic Packages (MSOP) N M10.118 (JEDEC MO-187BA) 10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 INCHES E -B- INDEX AREA 1 2 0.20 (0.008) A B C TOP VIEW 4X θ 0.25 (0.010) R1 R GAUGE PLANE A SEATING PLANE -C- A2 A1 b -He D 0.10 (0.004) 4X θ L SEATING PLANE C 0.20 (0.008) MIN MAX MIN MAX NOTES A 0.037 0.043 0.94 1.10 - A1 0.002 0.006 0.05 0.15 - A2 0.030 0.037 0.75 0.95 - b 0.007 0.011 0.18 0.27 9 c 0.004 0.008 0.09 0.20 - D 0.116 0.120 2.95 3.05 3 E1 0.116 0.120 2.95 3.05 4 0.020 BSC C a CL E1 0.20 (0.008) C D - 0.187 0.199 4.75 5.05 - L 0.016 0.028 0.40 0.70 6 0.037 REF N C 0.50 BSC E L1 -A- SIDE VIEW SYMBOL e L1 MILLIMETERS 0.95 REF 10 R 0.003 R1 - 10 - 0.07 0.003 - θ 5o 15o α 0o 6o 7 - - 0.07 - - 5o 15o - 0o 6o -B- Rev. 0 12/02 END VIEW NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B - to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 10 FN8240.3 August 31, 2006