ISM68 Series 9mm x 14 mm Ceramic Package SMD Oscillator, LVPECL / LVDS Product Features: 14.22 Max. Applications: Surface Mount Package Reflow Compatible Compatible with Leadfree Processing 6 5 4 1 2 3 Test Equipment Server & Storage Sonet /SDH 9.78 Max. Frequency 1 MHz to 750.000 MHz Ref. 7.62 4.7 Max. Output Level LVDS LVPECL Vod = 393 mV Typ., 475 mV Max. ‘0’ = Vcc - 1.63 V Max. ‘1’ = Vcc - 1.02 V Min. Duty Cycle Specify 50% ±10% or ±5% See Table in Part Number Guide Rise / Fall Time 0.6 nS Max. Output Load LVDS LVPECL 100 : Differential 50 : to Vcc - 2.0 VDC 5.08 0.46 Frequency Stability See Frequency Stability Table in Part Numbering Guide (Includes room temperature tolerance and stability over operating temperature) Start-up Time 10 mS Max. Enable / Disable Time Supply Voltage 100 nS Max. Current LVDS = 90 mA Max., *** 1.27 3.0 See Input Voltage Table, tolerance ±5 % 8.8 2.54 LVPECL = 130 mA Max. *** Operating See Operating Temperature Table in Part Number Guide Storage -55q C to +125q C Pin Connection 1 N.C. 2 Enable 3 GND Pin 4 5 6 Connection Output Comp. Output Vcc Dimension Units: mm Part Number Guide Package ISM68 - Input Voltage Sample Part Number: Operating Temperature ISM68 - 3169BH - 156.250 Symmetry (Duty Cycle) Output Stability (in ppm) Enable / Disable Frequency **A = r25 H = Enable - 156.250 MHz 3 = 3.3 V 1 = 0q C to +70q C 5 = 45 / 55 Max. 8 = LVDS 7 = 3.0 V 6 = -10q C to +70q C 6 = 40 / 60 Max. 9 = LVPECL 2 = 2.7 V 3 = -20q C to +70q C 6 = 2.5 V 4 = -30q C to +75q C B = r50 C = r100 2 = -40q C to +85q C NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise. ** Not available for all temperature ranges. *** Frequency, supply, and load related parameters. [email protected]• www.ilsiamerica.com • www.ilsiamerica.com ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] 06/09 Specifications subject to change without notice Page 1 ISM68 Series 9mm x 14 mm Ceramic Package SMD Oscillator, LVPECL / LVDS Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 24 +/-.3 12 +/-.2 11.5 +/-.2 25 +/-1.5 80 / 100 330 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code (YWW) Line 2: Frequency [email protected]• www.ilsiamerica.com • www.ilsiamerica.com ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] 06/09 Specifications subject to change without notice Page 2