PHILIPS ISP1123D

ISP1123
Universal Serial Bus compound hub
Rev. 01 — 5 October 1999
Preliminary specification
1. General description
The ISP1123 is a compound Universal Serial Bus (USB) hub device which complies
with USB Specification Rev. 1.1. It integrates a Serial Interface Engine (SIE), hub
repeater, hub controller, USB data transceivers and a 3.3 V voltage regulator. It has a
configurable number of downstream ports, ranging from 2 to 5, with one port
dedicated to an embedded or non-removable function.
The ISP1123 can be bus-powered, self-powered or hybrid-powered. When it is
hybrid-powered the hub functions are powered by the upstream power supply (VBUS),
but the downstream ports are powered by an external 5 Volt supply. The low power
consumption in ‘suspend’ mode allows easy design of equipment that is compliant
with the ACPI™, OnNow™ and USB power management requirements.
The ISP1123 has built-in overcurrent sense inputs, supporting individual and ganged
mode overcurrent protection for downstream ports. All ports (including the hub) have
GoodLink™ indicator outputs for easy visual monitoring of USB traffic. The ISP1123
has a serial I2C-bus interface for external EEPROM access and a reduced frequency
(6 MHz) crystal oscillator. These features allow significant cost savings in system
design and easy implementation of advanced USB functionality into PC peripherals.
c
2. Features
c
■ High performance USB hub device with integrated hub repeater, hub controller,
Serial Interface Engine (SIE), data transceivers and 3.3 V voltage regulator
■ Complies with Universal Serial Bus Specification Rev. 1.1 and ACPI, OnNow and
USB power management requirements
■ Downstream port 1 dedicated to a non-removable function, correctly reported in
the related descriptors
■ Configurable from 2 to 5 downstream ports with automatic speed detection
■ Internal power-on reset and low voltage reset circuit
■ Supports bus-powered, hybrid-powered and self-powered application
■ Individual or global power switching for downstream ports
■ Individual or ganged port overcurrent protection with built-in sense circuits
■ 6 MHz crystal oscillator with on-chip PLL for low EMI
■ Visual USB traffic monitoring (GoodLink™) for hub and downstream ports
■ I2C-bus interface to read vendor ID, product ID and configuration bits from
external EEPROM
ISP1123
Philips Semiconductors
USB compound hub
■
■
■
■
■
Operation over the extended USB bus voltage range (4.0 to 5.5 V)
Operating temperature range −40 to +85 °C
8 kV in-circuit ESD protection for lower cost of external components
Full-scan design with high test coverage
Available in 32-pin SDIP, SO and LQFP packages.
3. Ordering information
Table 1:
Ordering information
Type number
Package
Name
Description
Version
ISP1123D
SO32
plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
ISP1123NB
SDIP32
plastic shrink dual in-line package; 32 leads (400 mil)
SOT232-1
ISP1123BD [1]
LQFP32
plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm
SOT358-1
[1]
For the availability of the LQFP32 package please contact your local Philips Semiconductors sales office.
4. Block diagram
upstream
port
VCC
Vreg(3.3)
D+
6 MHz
D−
LED
5V
PLL
SUPPLY
REGULATOR
ISP1123
ANALOG
Tx / Rx
HUB
GoodLink
PACKET
GENERATOR
I2C-BUS
INTERFACE
SDA
SCL
BIT CLOCK
RECOVERY
3.3 V
full
speed
PHILIPS
SIE
INDV
HUB
CONTROLLER OPTION
END OF
FRAME
TIMERS
HUB
REPEATER
GENERAL
PORT
CONTROLLER
ANALOG
Tx /Rx
D+
GoodLink/
POWER SWITCH/
OC DETECT
ANALOG
Tx/ Rx
LED/
D− overcurrent
D+
detection power switch
downstream port 1:
embedded or non-removable
function
GoodLink/
POWER SWITCH/
OC DETECT
ANALOG
Tx/ Rx
LED/
D− overcurrent
D+
detection power switch
downstream port 2
(removable)
GoodLink/
POWER SWITCH/
OC DETECT
ANALOG
Tx / Rx
LED/
D− overcurrent
D+
detection power switch
downstream port 3
(removable)
GoodLink/
POWER SWITCH/
OC DETECT
ANALOG
Tx / Rx
LED/
D− overcurrent
D+
detection power switch
downstream port 4
(removable)
GoodLink/
POWER SWITCH/
OC DETECT
self/bus
powered
LED/
D− overcurrent
detection power switch
downstream port 5
(removable)
MBL083
This is a conceptual block diagram and does not include each individual signal.
Fig 1. Block diagram of the ISP1123.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
Philips Semiconductors
USB compound hub
5. Functional diagram
host
handbook, halfpage
port 0
USB DEVICE
(e.g. keyboard)
(1)
port 1
ISP1123
ports 2 to 5
MBL082
compound hub box
removable external devices
(1) Downstream port 1 is non-removable.
Fig 2. A compound hub box using ISP1123.
6. Pinning information
6.1 ISP1123D (SO32) and ISP1123NB (SDIP32)
6.1.1
Pinning
handbook, halfpage
handbook, halfpage
Vreg(3.3) 1
Vreg(3.3) 1
32 PSW1/GL1
32 PSW1/GL1
PSW2/GL2 2
31 DP2
PSW2/GL2 2
31 DP2
GND 3
30 DM2
GND 3
30 DM2
DM3 4
29 DP0
DM3 4
29 DP0
DP3 5
28 DM0
DP3 5
28 DM0
VCC 6
27 DP1
VCC 6
27 DP1
OC1 7
26 DM1
OC1 7
26 DM1
25 DP5
OC2 8
OC2 8
ISP1123D
25 DP5
ISP1123NB
OC3 9
24 DM5
OC3 9
24 DM5
OC4 10
23 INDV/SDA
OC4 10
23 INDV/SDA
22 OPTION/SCL
OC5/GOC 11
22 OPTION/SCL
OC5/GOC 11
DM4 12
21 RESET
DM4 12
21 RESET
DP4 13
20 XTAL2
DP4 13
20 XTAL2
SP/BP 14
19 XTAL1
SP/BP 14
19 XTAL1
HUBGL 15
18 PSW5/GL5/GPSW
PSW3/GL3 16
HUBGL 15
17 PSW4/GL4
PSW3/GL3 16
MBL076
Fig 3. Pin configuration SO32.
17 PSW4/GL4
MBL077
Fig 4. Pin configuration SDIP32.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
18 PSW5/GL5/GPSW
Rev. 01 — 5 October 1999
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ISP1123
Philips Semiconductors
USB compound hub
6.1.2
Pin description
Table 2:
Pin description for SO32 and SDIP32
Symbol [1]
Pin
Type
Description
Vreg(3.3) [2]
1
-
regulated supply voltage (3.3 V ± 10%) from internal
regulator; used to connect pull-up resistor on DP0 line
PSW2/GL2 [3]
2
O
modes 4 to 6: power switch control output for downstream
port 2 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 2 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
GND
3
-
ground supply
DM3
4
AI/O
downstream port 3 D− connection (analog) [4]
DP3
5
AI/O
downstream port 3 D+ connection (analog) [4]
VCC
6
-
supply voltage; connect to USB supply VBUS (bus-powered or
hybrid-powered) or to local supply VDD (self-powered)
OC1
7
AI/I
overcurrent sense input for downstream port 1 (analog [5])
OC2
8
AI/I
overcurrent sense input for downstream port 2 (analog [5])
OC3
9
AI/I
overcurrent sense input for downstream port 3 (analog [5])
OC4
10
AI/I
overcurrent sense input for downstream port 4 (analog [5])
OC5/GOC [3]
11
AI/I
modes 5, 7: overcurrent sense input for downstream port 5
(analog [5])
modes 0, 1, 3: global overcurrent sense input (analog [5])
DM4
12
AI/O
downstream port 4 D− connection (analog) [4]
DP4
13
AI/O
downstream port 4 D+ connection (analog) [4]
SP/BP
14
I
selects power mode:
self-powered: connect to VDD (local power supply); also use
this mode for hybrid-powered operation
bus-powered: connect to GND; disable downstream port 5 to
meet supply current requirements [4]
HUBGL
15
O
hub GoodLink LED indicator output (open-drain, 6 mA);
to connect an LED use a 330 Ω series resistor; if unused
connect to VCC via a 10 kΩ resistor
PSW3/GL3 [3]
16
O
modes 4 to 6: power switch control output for downstream
port 3 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 3 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
PSW4/GL4 [3]
17
O
modes 4 to 6: power switch control output for downstream
port 4 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 4 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
Philips Semiconductors
USB compound hub
Table 2:
Pin description for SO32 and SDIP32…continued
Symbol [1]
Pin
Type
Description
PSW5/GL5/
GPSW [3]
18
O
mode 5: power switch control output for downstream port 5
(open-drain, 6 mA)
modes 3, 7: GoodLink LED indicator output for downstream
port 5 (open-drain, 6 mA); to connect an LED use a 330 Ω
series resistor
modes 0 to 2: gang mode power switch control output
(open-drain, 6 mA)
XTAL1
19
I
crystal oscillator input (6 MHz)
XTAL2
20
O
crystal oscillator output (6 MHz)
RESET [2]
21
I
reset input (Schmitt trigger); a LOW level produces an
asynchronous reset; connect to VCC for power-on reset
(internal POR circuit)
OPTION/SCL
22
I/O
mode selection input; also functions as I2C-bus clock output
(open-drain, 6 mA)
INDV/SDA
23
I/O
selects individual (HIGH) or global (LOW) power switching
and overcurrent detection; also functions as bidirectional
I2C-bus data line (open-drain, 6 mA)
DM5
24
AI/O
downstream port 5 D− connection (analog) [4]
DP5
25
AI/O
downstream port 5 D+ connection (analog) [4]
DM1
26
AI/O
downstream port 1 D− connection (analog) [6]
DP1
27
AI/O
downstream port 1 D+ connection (analog) [6]
DM0
28
AI/O
upstream port D− connection (analog)
DP0
29
AI/O
upstream port D+ connection (analog)
DM2
30
AI/O
downstream port 2 D− connection (analog) [6]
DP2
31
AI/O
downstream port 2 D+ connection (analog) [6]
PSW1/GL1 [3]
32
O
modes 4 to 6: power switch control output for downstream
port 1 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 1 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
[1]
[2]
[3]
[4]
[5]
[6]
Symbol names with an overscore (e.g. NAME) indicate active LOW signals.
The voltage at pin Vreg(3.3) is gated by the RESET pin. This allows fully self-powered operation by
connecting RESET to VBUS (+5 V USB supply). If VBUS is lost upstream port D+ will not be driven.
See Table 4 “Mode selection”.
To disable a downstream port connect both D+ and D− to VCC via a 1 MΩ resistor; unused ports must
be disabled in reverse order starting from port 5.
Analog detection circuit can be switched off using an external EEPROM, see Table 23; in this case,
the pin functions as a logic input (TTL level).
Downstream ports 1 and 2 cannot be disabled.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
Philips Semiconductors
USB compound hub
6.2 ISP1123BD (LQFP32)
25 DP0
26 DM2
27 DP2
28 PSW1/GL1
32 DM3
31 GND
handbook, full pagewidth
29 Vreg(3.3)
Pinning
30 PSW2/GL2
6.2.1
DP3 1
24 DM0
VCC 2
23 DP1
OC1 3
22 DM1
21 DP5
OC2 4
ISP1123BD
OC3 5
20 DM5
OC4 6
19 INDV/SDA
18 OPTION/SCL
OC5/GOC 7
DM4 8
XTAL2 16
XTAL1 15
PSW5/GL5/GPSW 14
PSW4/GL4 13
PSW3/GL3 12
HUBGL 11
DP4
9
SP/BP 10
17 RESET
MBL078
Fig 5. Pin configuration LQFP32.
6.2.2
Pin description
Table 3:
Pin description for LQFP32
Symbol [1]
Vreg(3.3)
[2]
PSW2/GL2 [3]
Pin
Type
Description
29
-
regulated supply voltage (3.3 V ± 10%) from internal
regulator; used to connect pull-up resistor on DP0 line
30
O
modes 4 to 6: power switch control output for downstream
port 2 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 2 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
GND
31
-
ground supply
DM3
32
AI/O
downstream port 3 D− connection (analog) [4]
DP3
1
AI/O
downstream port 3 D+ connection (analog) [4]
VCC
2
-
supply voltage; connect to USB supply VBUS (bus-powered or
hybrid-powered) or to local supply VDD (self-powered)
OC1
3
AI/I
overcurrent sense input for downstream port 1 (analog [5])
OC2
4
AI/I
overcurrent sense input for downstream port 2 (analog [5])
OC3
5
AI/I
overcurrent sense input for downstream port 3 (analog [5])
OC4
6
AI/I
overcurrent sense input for downstream port 4 (analog [5])
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
6 of 49
ISP1123
Philips Semiconductors
USB compound hub
Table 3:
Pin description for LQFP32…continued
Symbol [1]
Pin
Type
Description
OC5/GOC [3]
7
AI/I
modes 5, 7: overcurrent sense input for downstream port 5
(analog [5])
modes 0, 1, 3: global overcurrent sense input (analog [5])
DM4
8
AI/O
downstream port 4 D− connection (analog) [4]
DP4
9
AI/O
downstream port 4 D+ connection (analog) [4]
SP/BP
10
I
selects power mode:
self-powered: connect to VDD (local power supply); also use
this mode for hybrid-powered operation
bus-powered: connect to GND; disable downstream port 5 to
meet supply current requirements [4]
HUBGL
11
O
hub GoodLink LED indicator output (open-drain, 6 mA);
to connect an LED use a 330 Ω series resistor; if unused
connect to VCC via a 10 kΩ resistor
PSW3/GL3 [3]
12
O
modes 4 to 6: power switch control output for downstream
port 3 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 3 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
PSW4/GL4 [3]
13
O
modes 4 to 6: power switch control output for downstream
port 4 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 4 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
PSW5/GL5/
GPSW [3]
14
O
mode 5: power switch control output for downstream port 5
(open-drain, 6 mA)
modes 3, 7: GoodLink LED indicator output for downstream
port 5 (open-drain, 6 mA); to connect an LED use a 330 Ω
series resistor
modes 0 to 2: gang mode power switch control output
(open-drain, 6 mA)
XTAL1
15
I
crystal oscillator input (6 MHz)
XTAL2
16
O
crystal oscillator output (6 MHz)
RESET [2]
17
I
reset input (Schmitt trigger); a LOW level produces an
asynchronous reset; connect to VCC for power-on reset
(internal POR circuit)
OPTION/SCL
18
I/O
mode selection input; also functions as I2C-bus clock output
(open-drain, 6 mA)
INDV/SDA
19
I/O
selects individual (HIGH) or global (LOW) power switching
and overcurrent detection; also functions as bidirectional
I2C-bus data line (open-drain, 6 mA)
DM5
20
AI/O
downstream port 5 D− connection (analog) [4]
DP5
21
AI/O
downstream port 5 D+ connection (analog) [4]
DM1
22
AI/O
downstream port 1 D− connection (analog) [6]
DP1
23
AI/O
downstream port 1 D+ connection (analog) [6]
DM0
24
AI/O
upstream port D− connection (analog)
DP0
25
AI/O
upstream port D+ connection (analog)
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
7 of 49
ISP1123
Philips Semiconductors
USB compound hub
Table 3:
Pin description for LQFP32…continued
Symbol [1]
Pin
Type
Description
DM2
26
AI/O
downstream port 2 D− connection (analog) [6]
DP2
27
AI/O
downstream port 2 D+ connection (analog) [6]
PSW1/GL1 [3]
28
O
modes 4 to 6: power switch control output for downstream
port 1 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 1 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
[1]
[2]
[3]
[4]
[5]
[6]
Symbol names with an overscore (e.g. NAME) indicate active LOW signals.
The voltage at pin Vreg(3.3) is gated by the RESET pin. This allows fully self-powered operation by
connecting RESET to VBUS (+5 V USB supply). If VBUS is lost upstream port D+ will not be driven.
See Table 4 “Mode selection”.
To disable a downstream port connect both D+ and D− to VCC via a 1 MΩ resistor; unused ports must
be disabled in reverse order starting from port 5.
Analog detection circuit can be switched off using an external EEPROM, see Table 23; in this case,
the pin functions as a logic input (TTL level).
Downstream ports 1 and 2 cannot be disabled.
7. Functional description
The ISP1123 is a compound USB hub with up to 5 downstream ports. The number of
ports can be configured between 2 and 5. The downstream ports can be used to
connect low-speed or full-speed USB peripherals. Downstream port 1 is dedicated to
an embedded or non-removable function, the other ports are removable.
All standard USB requests from the host are handled by the hardware without the
need for firmware intervention. The block diagram is shown in Figure 1 and the basic
architecture of a compound hub in Figure 2.
The ISP1123 requires only a single supply voltage. An internal 3.3 V regulator
provides the supply voltage for the analog USB data transceivers.
The ISP1123 supports both bus-powered and self-powered hub operation. When
using bus-powered operation a downstream port cannot supply more than 100 mA to
a peripheral. In case of self-powered operation an external supply is used to power
the downstream ports, allowing a current consumption of max. 500 mA per port.
A basic I2C-bus interface is provided for reading vendor ID, product ID and
configuration bits from an external EEPROM upon a reset.
7.1 Analog transceivers
The integrated transceiver interfaces directly to the USB cables through external
termination resistors. They are capable of transmitting and receiving serial data at
both ‘full-speed’ (12 Mbit/s) and ‘low-speed’ (1.5 Mbit/s) data rates. The slew rates
are adjusted according to the speed of the device connected and lie within the range
mentioned in the USB Specification Rev. 1.1.
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9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
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USB compound hub
7.2 Philips Serial Interface Engine (SIE)
The Philips SIE implements the full USB protocol layer. It is completely hardwired for
speed and needs no firmware intervention. The functions of this block include:
synchronization pattern recognition, parallel/serial conversion, bit (de-)stuffing, CRC
checking/generation, Packet IDentifier (PID) verification/generation, address
recognition, handshake evaluation/generation.
7.3 Hub repeater
The hub repeater is responsible for managing connectivity on a ‘per packet’ basis. It
implements ‘packet signalling’ and ‘resume’ connectivity. Low-speed devices can be
connected to downstream ports. If a low-speed device is detected the repeater will
not propagate upstream packets to the corresponding port, unless they are preceded
by a PREAMBLE PID.
7.4 End-of-frame timers
This block contains the specified EOF1 and EOF2 timers which are used to detect
‘loss-of-activity’ and ‘babble’ error conditions in the hub repeater. The timers also
maintain the low-speed keep-alive strobe which is sent at the beginning of a frame.
7.5 General and individual port controller
The general and individual port controllers together provide status and control of
individual downstream ports. Any port status change will be reported to the host via
the hub status change (interrupt) endpoint.
7.6 GoodLink
Indication of a good USB connection is provided through GoodLink technology. An
LED can be directly connected via an external 330 Ω resistor.
During enumeration the LED blinks on momentarily. After successful configuration of
the ISP1123, the LED is permanently on. The LED blinks off for 100 ms upon each
successful packet transfer (with ACK). The hub GoodLink indicator blinks when the
hub receives a packet addressed to it. Downstream GoodLink indicators blink upon
an acknowledgment from the associated port. In ‘suspend’ mode the LED is off.
This feature provides a user-friendly indication of the status of the hub, the connected
downstream devices and the USB traffic. It is a useful diagnostics tool to isolate faulty
USB equipment and helps to reduce field support and hotline costs.
7.7 Bit clock recovery
The bit clock recovery circuit recovers the clock from the incoming USB data stream
using a 4× oversampling principle. It is able to track jitter and frequency drift as
specified by the USB Specification Rev. 1.1.
7.8 Voltage regulator
A 5 to 3.3 V DC-DC regulator is integrated on-chip to supply the analog transceiver
and internal logic. This can also be used to supply the terminal 1.5 kΩ pull-up resistor
on the D+ line of the upstream connection.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
Philips Semiconductors
USB compound hub
7.9 PLL clock multiplier
A 6 to 48 MHz clock multiplier Phase-Locked Loop (PLL) is integrated on-chip. This
allows for the use of low-cost 6 MHz crystals. The low crystal frequency also
minimizes Electro-Magnetic Interference (EMI). The PLL requires no external
components.
7.10 Overcurrent detection
An overcurrent detection circuit for downstream ports has been integrated on-chip. It
is self-reporting, resets automatically, has a low trip time and requires no external
components. Both individual and ganged mode overcurrent detection are supported.
7.11 I2C-bus interface
A basic serial I2C-bus interface (single master, 100 kHz) is provided to read VID, PID
and configuration bits from an external I2C-bus EEPROM (e.g. Philips PCF8582 or
equivalent). At reset the ISP1123 reads 6 bytes of data from the external memory.
The I2C-bus interface timing complies with the standard mode of operation as
described in The I2C-bus and how to use it, order number 9398 393 40011.
8. Modes of operation
The ISP1123 has several modes of operation, each corresponding with a different pin
configuration. Modes are selected by means of pins INDV, OPTION and SP/BP, as
shown in Table 4.
Table 4:
Mode selection
Mode
INDV
OPTION SP/BP
[2]
PSWn/GLn
(n = 1 to 4)
PSW5/GL5/GPSW OCn
(n = 1 to 4)
OC5/GOC
0
0
0
0
GoodLink
ganged power
inactive
global overcurrent
1
0
0
1
GoodLink
ganged power
inactive
global overcurrent
inactive [3]
[1]
2
0
1
0
GoodLink
ganged power
inactive [3]
3
0
1
1
GoodLink [4]
GoodLink [4]
inactive
global overcurrent
4
1
0
0
individual power
inactive
individual
overcurrent
inactive
5
1
0
1
individual power
individual power
individual
overcurrent
individual
overcurrent
6
1
1
0
individual power
inactive
inactive [3]
inactive [3]
7
1
1
1
GoodLink [4]
GoodLink [4]
individual
overcurrent
individual
overcurrent
[1]
[2]
[3]
[4]
Port power switching: logic 0 = ganged, logic 1 = individual.
Power mode: logic 0 = bus-powered, logic 1 = self-powered (or hybrid-powered).
No overcurrent detection.
No power switching.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
Philips Semiconductors
USB compound hub
9. Endpoint descriptions
Each USB device is logically composed of several independent endpoints. An
endpoint acts as a terminus of a communication flow between the host and the
device. At design time each endpoint is assigned a unique number (endpoint
identifier, see Table 5). The combination of the device address (given by the host
during enumeration), the endpoint number and the transfer direction allows each
endpoint to be uniquely referenced.
The ISP1123 has two endpoints, endpoint 0 (control) and endpoint 1 (interrupt).
Table 5:
Function
Hub
[1]
Hub endpoints
Ports
Endpoint
identifier
Transfer
type
0: upstream
0
control
1
interrupt
1 to 5: downstream
Direction [1] Max. packet
size (bytes)
OUT
64
IN
64
IN
1
IN: input for the USB host; OUT: output from the USB host.
9.1 Hub endpoint 0 (control)
All USB devices and functions must implement a default control endpoint (ID = 0).
This endpoint is used by the host to configure the device and to perform generic USB
status and control access.
The ISP1123 hub supports the following USB descriptor information through its
control endpoint 0, which can handle transfers of 64 bytes maximum:
•
•
•
•
•
•
Device descriptor
Configuration descriptor
Interface descriptor
Endpoint descriptor
Hub descriptor
String descriptor.
9.2 Hub endpoint 1 (interrupt)
Endpoint 1 is used by the ISP1123 hub to provide status change information to the
host. This endpoint can be accessed only after the hub has been configured by the
host (by sending the Set Configuration command).
Endpoint 1 is an interrupt endpoint: the host polls it once every 255 ms by sending an
IN token. If the hub has detected no change in the port status it returns a NAK (Not
AcKnowledge) response to this request, otherwise it sends the Status Change byte
(see Table 6).
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Table 6:
Status Change byte: bit allocation
Bit
Symbol
Description
0
Hub SC
a logic 1 indicates a status change on the hub’s upstream port
1
Port 1 SC
a logic 1 indicates a status change on downstream port 1
2
Port 2 SC
a logic 1 indicates a status change on downstream port 2
3
Port 3 SC
a logic 1 indicates a status change on downstream port 3
4
Port 4 SC
a logic 1 indicates a status change on downstream port 4
5
Port 5 SC
a logic 1 indicates a status change on downstream port 5
6
reserved
not used
7
reserved
not used
10. Host requests
The ISP1123 handles all standard USB requests from the host via control endpoint 0.
The control endpoint can handle a maximum of 64 bytes per transfer.
Remark: Please note that the USB data transmission order is Least Significant Bit
(LSB) first. In the following tables multi-byte variables are displayed least significant
byte first.
10.1 Standard requests
Table 7 shows the supported standard USB requests. Some requests are explicitly
unsupported. All other requests will be responded with a STALL packet.
Table 7:
Standard USB requests
Request name
bmRequestType
byte 0 [7:0]
(Bin)
bRequest
byte 1
(Hex)
wValue
byte 2, 3
(Hex)
wIndex
byte 4, 5
(Hex)
wLength
byte 6, 7
(Hex)
Data
X000 0000
05
address [1]
00, 00
00, 00
none
Get Configuration
1000 0000
08
00, 00
00, 00
01, 00
configuration
value = 01H
Set Configuration (0)
X000 0000
09
00, 00
00, 00
00, 00
none
Set Configuration (1)
X000 0000
09
01, 00
00, 00
00, 00
none
Get Configuration
Descriptor
1000 0000
06
00, 02
00, 00
length [2]
configuration,
interface and
endpoint
descriptors
Get Device Descriptor
1000 0000
06
00, 01
00, 00
length [2]
device
descriptor
Get String Descriptor (0)
1000 0000
06
03, 00
00, 00
length [2]
language ID
string
Get String Descriptor (1)
1000 0000
06
03, 01
00, 00
length [2]
manufacturer
string
Get String Descriptor (2)
1000 0000
06
03, 02
00, 00
length [2]
product string
Address
Set Address
Configuration
Descriptor
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Table 7:
Standard USB requests…continued
Request name
bmRequestType
byte 0 [7:0]
(Bin)
bRequest
byte 1
(Hex)
wValue
byte 2, 3
(Hex)
wIndex
byte 4, 5
(Hex)
wLength
byte 6, 7
(Hex)
Data
Clear Device Feature
(REMOTE_WAKEUP)
X000 0000
01
01, 00
00, 00
00, 00
none
Clear Endpoint (1)
Feature (HALT/STALL)
X000 0010
01
00, 00
81, 00
00, 00
none
Set Device Feature
(REMOTE_WAKEUP)
X000 0000
03
01, 00
00, 00
00, 00
none
Set Endpoint (1)
Feature (HALT/STALL)
X000 0010
03
00, 00
81, 00
00, 00
none
Feature
Status
Get Device Status
1000 0000
00
00, 00
00, 00
02, 00
device status
Get Interface Status
1000 0001
00
00, 00
00, 00
02, 00
zero
Get Endpoint (0) Status
1000 0010
00
00, 00
00/80 [3], 00
02, 00
endpoint 0
status
Get Endpoint (1) Status
1000 0010
00
00, 00
81, 00
02, 00
endpoint 1
status
Set Descriptor
0000 0000
07
XX, XX
XX, XX
XX, XX
descriptor;
STALL
Get Interface
1000 0001
0A
00, 00
XX, XX
01, 00
STALL
Set Interface
X000 0001
0B
XX, XX
XX, XX
00, 00
STALL
Synch Frame
1000 0010
0C
00, 00
XX, XX
02, 00
STALL
Unsupported
[1]
[2]
[3]
Device address: 0 to 127.
Returned value in bytes.
MSB specifies endpoint direction: 0 = OUT, 1 = IN. The ISP1123 accepts either value.
10.2 Hub specific requests
In Table 8 the supported hub specific requests are listed, as well as some
unsupported requests. Table 9 provides the feature selectors for setting or clearing
port features.
Table 8:
Hub specific requests
Request name
bmRequestType
byte 0 [7:0]
(Bin)
bRequest
byte 1
(Hex)
wValue
byte 2, 3
(Hex)
wIndex
byte 4, 5
(Hex)
wLength
byte 6, 7
(Hex)
Data
1010 0000
06
00, 00/29 [1]
00, 00
length [2], 00
hub descriptor
Clear Hub Feature
(C_LOCAL_POWER)
X010 0000
01
00, 00
00, 00
00, 00
none
Clear Port Feature
(feature selectors)
X010 0011
01
feature [3], 00 port [4], 00
00, 00
none
Set Port Feature
(feature selectors)
X010 0011
03
feature [3], 00 port [4], 00
00, 00
none
Descriptor
Get Hub Descriptor
Feature
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Table 8:
Hub specific requests…continued
Request name
bmRequestType
byte 0 [7:0]
(Bin)
bRequest
byte 1
(Hex)
wValue
byte 2, 3
(Hex)
wIndex
byte 4, 5
(Hex)
wLength
byte 6, 7
(Hex)
Data
Get Hub Status
1010 0000
00
00, 00
00, 00
04, 00
hub status and
status change
field
Get Port Status
1010 0011
00
00, 00
port [4], 00
04, 00
port status
Get Bus Status
1010 0011
02
00, 00
port [4], 00
01, 00
STALL
Clear Hub Feature
(C_OVER_CURRENT)
X010 0000
01
01, 00
00, 00
00, 00
STALL
Set Hub Descriptor
0010 0000
07
XX, XX
00, 00
3E, 00
STALL
Set Hub Feature
(C_LOCAL_POWER)
X010 0000
03
00, 00
00, 00
00, 00
STALL
Set Hub Feature
(C_OVER_CURRENT)
X010 0000
03
01, 00
00, 00
00, 00
STALL
Status
Unsupported
[1]
[2]
[3]
[4]
USB Specification Rev. 1.0 uses 00H, USB Specification Rev. 1.1 specifies 29H.
Returned value in bytes.
Feature selector value, see Table 9.
Downstream port identifier: 1 to N with N = number of enabled ports (2 to 5).
Table 9:
Port feature selectors
Feature selector name
Value (Hex)
Set feature
Clear feature
PORT_CONNECTION
00
not used
not used
PORT_ENABLE
01
not used
disables a port
PORT_SUSPEND
02
suspends a port
resumes a port
PORT_OVERCURRENT
03
not used
not used
PORT_RESET
04
resets and enables a
port
not used
PORT_POWER
08
powers on a port
powers off a port
PORT_LOW_SPEED
09
not used
not used
C_PORT_CONNECTION
10
not used
clears port connection
change bit
C_PORT_ENABLE
11
not used
clears port enable
change bit
C_PORT_SUSPEND
12
not used
clears port suspend
change bit
C_PORT_OVERCURRENT
13
not used
clears port overcurrent
change bit
C_PORT_RESET
14
not used
clears port reset
change bit
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10.3 Descriptors
The ISP1123 hub controller supports the following standard USB descriptors:
•
•
•
•
•
•
Device
Configuration
Interface
Endpoint
Hub
String.
Table 10: Device descriptor
Values in square brackets are optional.
Offset
(bytes)
Field name
Size
(bytes)
Value
(Hex)
Comments
0
bLength
1
12
descriptor length = 18 bytes
1
bDescriptorType
1
01
type = DEVICE
2
bcdUSB
2
10, 01
USB Specification Rev. 1.1
4
bDeviceClass
1
09
HUB_CLASSCODE
5
bDeviceSubClass
1
00
-
6
bDeviceProtocol
1
00
-
7
bMaxPacketSize0
1
40
packet size = 64 bytes
8
idVendor
2
CC, 04
Philips Semiconductors vendor ID
(04CC); can be customized using an
external EEPROM (see Table 23)
10
idProduct
2
23, 11
ISP1123 product ID; can be
customized using an external
EEPROM (see Table 23)
12
bcdDevice
2
00, 01
device release 1.0; silicon revision
increments this value
14
iManufacturer
1
00
no manufacturer string (default)
[01]
manufacturer string enabled
(using an external EEPROM)
00
no product string (default)
[02]
product string enabled
(using an external EEPROM)
15
iProduct
1
16
iSerialNumber
1
00
no serial number string
17
bNumConfigurations
1
01
one configuration
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Table 11: Configuration descriptor
Values in square brackets are optional.
Offset
(bytes)
Field name
Size
(bytes)
Value
(Hex)
Comments
0
bLength
1
09
descriptor length = 9 bytes
1
bDescriptorType
1
02
type = CONFIGURATION
2
wTotalLength
2
19, 00
total length of configuration, interface
and endpoint descriptors (25 bytes)
4
bNumInterfaces
1
01
one interface
5
bConfigurationValue
1
01
configuration value = 1
6
iConfiguration
1
00
no configuration string
7
bmAttributes
1
E0
self-powered with remote wake-up [1]
A0
bus-powered with remote wake-up [1]
MaxPower [2]
8
[1]
[2]
1
32
100 mA (default)
[00]
0 mA (using an external EEPROM)
[FA]
500 mA (using an external EEPROM)
Selected by input SP/BP.
Value in units of 2 mA.
Table 12: Interface descriptor
Offset
(bytes)
Field name
Size
(bytes)
Value
(Hex)
Comments
0
bLength
1
09
descriptor length = 9 bytes
1
bDescriptorType
1
04
type = INTERFACE
2
bInterfaceNumber
1
00
-
3
bAlternateSetting
1
01
no alternate setting
4
bNumEndpoints
1
01
status change (interrupt) endpoint
5
bInterfaceClass
1
09
HUB_CLASSCODE
6
bInterfaceSubClass
1
00
-
7
bInterfaceProtocol
1
00
no class-specific protocol
8
bInterface
1
00
no interface string
Table 13: Endpoint descriptor
Offset
(bytes)
Field name
Size
(bytes)
Value
(Hex)
Comments
0
bLength
1
07
descriptor length = 7 bytes
1
bDescriptorType
1
05
type = ENDPOINT
2
bEndpointAddress
1
81
endpoint 1, direction: IN
3
bmAttributes
1
03
interrupt endpoint
4
wMaxPacketSize
2
01, 00
packet size = 1 byte
6
bInterval
1
FF
polling interval (255 ms)
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Table 14: Hub descriptor
Values in square brackets are optional.
Offset
(bytes)
Field name
Size
(bytes)
Value
(Hex)
Comments
0
bDescLength
1
09
descriptor length = 9 bytes
1
bDescriptorType
1
29
type = HUB
2
bNbrPorts
1
05 to 02 number of enabled downstream ports;
selectable by DP/DM strapping
3
wHubCharacteristics
2
0D, 00
individual power switching [1],
overcurrent protection active
(modes 0, 1, 3, 4, 5, 7), hub is part of a
compound device
15, 00
individual power switching [1], no
overcurrent protection (modes 2, 6) [2],
hub is part of a compound device
32
100 ms (default; modes 0, 1, 2, 4, 5, 6)
00
0 ms (default; modes 3, 7)
[FA]
500 ms (using an external EEPROM;
modes 0, 1, 2, 4, 5, 6); see Table 23
bPwrOn2PwrGood [3]
5
1
6
bHubContrCurrent
1
64
maximum hub controller current
(100 mA)
7
DeviceRemovable
1
02
port 1 is non-removable
8
PortPwrCtrlMask
1
FF
must be all ones for compatibility with
USB Specification Rev. 1.0
[1]
[2]
[3]
ISP1123 always reports power management status on an individual basis, even for ganged/global
modes. This is compliant with USB Specification Rev. 1.1.
Condition with no overcurrent detection is reported to the host.
Value in units of 2 ms.
Table 15: String descriptors
String descriptors are optional and therefore disabled by default; they can be enabled through
an external EEPROM.
Offset
(bytes)
Field name
Size
(bytes)
Value
(Hex)
Comments
04
descriptor length = 4 bytes
String descriptor (0): language ID string
0
bLength
1
1
bDescriptorType
1
03
type = STRING
2
bString
2
09, 04
LANGID code zero
String descriptor (1): manufacturer string
0
bLength
1
1
bDescriptorType
2
bString
2E
descriptor length = 46 bytes
1
03
type = STRING
44
UC [1]
“Philips Semiconductors”
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Table 15: String descriptors…continued
String descriptors are optional and therefore disabled by default; they can be enabled through
an external EEPROM.
Offset
(bytes)
Field name
Size
(bytes)
Value
(Hex)
Comments
10
descriptor length = 16 bytes
String descriptor (2): product string
0
bLength
1
bDescriptorType
1
03
type = STRING
2
bString
14
UC [1]
“ISP1122”
[1]
1
Unicode encoded string.
10.4 Hub responses
This section describes the hub responses to requests from the USB host.
10.4.1
Get device status
The hub returns 2 bytes, see Table 16.
Table 16: Get device status response
10.4.2
Bit #
Function
Value
Description
0
self-powered
0
bus-powered
1
self-powered
no remote wake-up
1
remote wake-up
0
1
remote wake-up enabled
2 to 15
reserved
0
-
Get configuration
The hub returns 1 byte, see Table 17.
Table 17: Get configuration response
Bit #
Function
Value
Description
0
configuration value
0
device not configured
1
device configured
0
-
1 to 7
10.4.3
reserved
Get interface status
The hub returns 2 bytes, see Table 18.
Table 18: Get interface status response
Bit #
Function
Value
Description
0 to 15
reserved
0
-
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10.4.4
Get hub status
The hub returns 4 bytes, see Table 19.
Table 19: Get hub status response
Bit #
Function
Value
Description
0
local power source
0
local power supply good
1
local power supply lost
1
overcurrent indicator
0
no overcurrent condition
1
hub overcurrent condition detected
0
-
2 to 15
reserved
16
local power status change
17
18 to 31
10.4.5
0
no change in local power status
1
local power status changed
overcurrent indicator change 0
reserved
no change in overcurrent condition
1
overcurrent condition changed
0
-
Get port status
The hub returns 4 bytes. The first 2 bytes contain the port status bits (wPortStatus,
see Table 20). The last 2 bytes hold the port status change bits (wPortChange, see
Table 21).
Table 20: Get port status response (wPortStatus)
Bit #
Function
0
current connect status
1
2
3
4
port enabled/disabled
suspend
overcurrent indicator
reset
Value
0
no device present
1
device present on this port
0
port disabled
1
port enabled
0
port not suspended
1
port suspended
0
no overcurrent condition
1
overcurrent condition detected
0
reset not asserted
1
reset asserted
5 to 7
reserved
0
-
8
port power
0
port powered off
1
port power on
9
low-speed device attached
0
full-speed device attached
1
low-speed device attached
0
-
10 to 15
reserved
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Table 21: Get port status response (wPortChange)
Bit #
Function
0
connect status change
1
2
3
port enabled/disabled
change
suspend change
Value
0
no change in current connect status
1
current connect status changed
0
no port error
1
port disabled by a port error
0
no change in suspend status
1
resume complete
overcurrent indicator change 0
1
4
5 to 15
10.4.6
reset change
reserved
Description
no change in overcurrent status
overcurrent indicator changed
0
no change in reset status
1
reset complete
0
-
Get configuration descriptor
The hub returns 25 bytes containing the configuration descriptor (9 bytes, see
Table 11), the interface descriptor (9 bytes, see Table 12) and the endpoint descriptor
(7 bytes, see Table 13).
10.4.7
Get device descriptor
The hub returns 18 bytes containing the device descriptor, see Table 10.
10.4.8
Get hub descriptor
The hub returns 9 bytes containing the hub descriptor, see Table 14.
10.4.9
Get string descriptor (0)
The hub returns 4 bytes containing the language ID, see Table 15.
10.4.10
Get string descriptor (1)
The hub returns 46 bytes containing the manufacturer name, see Table 15.
10.4.11
Get string descriptor (2)
The hub returns 16 bytes containing the product name, see Table 15.
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11. I2C-bus interface
A simple I2C-bus interface is provided in the ISP1123 to read customized vendor ID,
product ID and some other configuration bits from an external EEPROM. The
interface supports single master operation at a nominal bus speed of 93.75 kHz.
The I2C-bus interface is intended for bidirectional communication between ICs via two
serial bus wires, SDA (data) and SCL (clock). Both lines are driven by open-drain
circuits and must be connected to the positive supply voltage via pull-up resistors.
11.1 Protocol
The I2C-bus protocol defines the following conditions:
•
•
•
•
Bus free: both SDA and SCL are HIGH
START: a HIGH-to-LOW transition on SDA, while SCL is HIGH
STOP: a LOW-to-HIGH transition on SDA, while SCL is HIGH
Data valid: after a START condition, data on SDA are stable during the HIGH
period of SCL; data on SDA may only change while SCL is LOW.
Each device on the I2C-bus has a unique slave address, which the master uses to
select a device for access.
The master starts a data transfer using a START condition and ends it by generating
a STOP condition. Transfers can only be initiated when the bus is free. The receiver
must acknowledge each byte by means of a LOW level on SDA during the ninth clock
pulse on SCL.
For detailed information please consult The I2C-bus and how to use it., order number
9398 393 40011.
11.2 Hardware connections
Via the I2C-bus interface the ISP1123 can be connected to an external EEPROM
(PCF8582 or equivalent). The hardware connections are shown in Figure 6.
The SCL and SDA pins are multiplexed with pins OPTION and INDV respectively.
VDD
idth
VDD
RP
OPTION/SCL
INDV/SDA
RP
SCL
A0
SDA
A1
I2C-bus
PCF8582 A2
ISP1123
USB HUB
EEPROM
or
equivalent
MBL081
Fig 6. EEPROM connection diagram.
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The slave address which ISP1123 uses to access the EEPROM is 1010000B. Page
mode addressing is not supported, so pins A0, A1 and A2 of the EEPROM must be
connected to GND (logic 0).
11.3 Data transfer
When the ISP1123 is reset, the I2C-bus interface tries to read 6 bytes of configuration
data from an external EEPROM. If no response is detected, the levels on inputs SDA
and SCL are interpreted as INDV and OPTION to select the operating mode (see
Table 4).
The data in the EEPROM memory are organized as shown in Table 22.
Table 22: EEPROM organization
Address
(Hex)
Default value
(Hex)
Contents
00
CC
idVendor [1] (lower byte)
01
04
idVendor [1] (upper byte)
02
23
idProduct [2] (lower byte)
03
11
idProduct [2] (upper byte)
04
-
configuration bits C7 to C0; see Table 23
05
AA
signature
[1]
[2]
Vendor ID code in the Device descriptor, see Table 10.
Product ID code in the Device descriptor, see Table 10.
Table 23: Configuration bits
Bit
Function
Value
(Bin)
C0
OPTION
see Table 4 “Mode selection”
C1
INDV
see Table 4 “Mode selection”
C2
reserved
0 [1]
must always be programmed to logic 0
C3
PwrOn2PwrGood [2]
0 [1]
100 ms (bPwrOn2PwrGood = 32H)
1
500 ms (bPwrOn2PwrGood = FAH)
0 [1]
string descriptors disabled
1
string descriptors enabled (strings:
“Philips Semiconductors”, “ISP1122”)
0
internal analog overcurrent detection
circuit disabled; overcurrent pins OCn
function as digital inputs (TTL level)
1 [1]
internal analog overcurrent detection
circuit enabled
00 [1]
100 mA (MaxPower = 32H)
01
500 mA (MaxPower = FAH)
1X
0 mA (MaxPower = 00H)
C4
string descriptor enable
C5
internal analog overcurrent
detection enable
C7, C6
[1]
[2]
[3]
MaxPower [3]
Default value at reset if no external EEPROM is present.
Modifies the Hub Descriptor field ‘bPwrOn2PwrGood’, see Table 14.
Modifies the Hub Descriptor field ‘MaxPower’, see Table 14.
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12. Hub power modes
USB hubs can either be self-powered or bus-powered.
Self-powered — Self-powered hubs have a 5 V local power supply on board which
provide power to the hub and the downstream ports. The USB Specification Rev. 1.1
requires that these hubs limit the current to 500 mA per downstream port and report
overcurrent conditions to the host. The hub may optionally draw 100 mA from the
USB supply (VBUS) to power the interface functions (hybrid-powered).
Bus-powered — Bus-powered hubs obtain all power from the host or an upstream
self-powered hub. The maximum current is 100 mA per downstream port. Current
limiting and reporting of overcurrent conditions are both optional.
Power switching of downstream ports can be done individually or ganged, where all
ports are switched simultaneously with one power switch. The ISP1123 supports both
modes, which can be selected using input INDV (see Table 4).
12.1 Voltage drop requirements
12.1.1
Self-powered hubs
Self-powered hubs are required to provide a minimum of 4.75 V to its output port
connectors at all legal load conditions. To comply with Underwriters Laboratory Inc.
(UL) safety requirements, the power from any port must be limited to 25 W (5 A at
5 V). Overcurrent protection may be implemented on a global or individual basis.
Assuming a 5 V ± 3% power supply the worst case supply voltage is 4.85 V. This only
allows a voltage drop of 100 mV across the hub printed-circuit board (PCB) to each
downstream connector. This includes a voltage drop across:
•
•
•
•
Power supply connector
Hub PCB (power and ground traces, ferrite beads)
Power switch (FET on-resistance)
Overcurrent sense device.
PCB resistance and power supply connector resistance may cause a drop of 25 mV,
leaving only 75 mV as the voltage drop allowed across the power switch and
overcurrent sense device. The individual voltage drop components are shown in
Figure 7.
voltage drop
75 mV
handbook, full pagewidth
5V
+
POWER SUPPLY
± 3% regulated −
4.85 V(min)
low-ohmic
PMOS switch
voltage drop
25 mV
hub board (1)
resistance
ISP1123
power
switch
4.75 V(min)
VBUS
D+
downstream
port
connector
D−
GND
SHIELD
MBL088
(1) Includes PCB traces, ferrite beads, etc.
Fig 7. Typical voltage drop components in self-powered mode using individual overcurrent detection.
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9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
23 of 49
ISP1123
Philips Semiconductors
USB compound hub
In case of global overcurrent detection an increased voltage drop is needed for the
overcurrent sense device (in this case a low-ohmic resistor). This can be realized by
using a special power supply of 5.1 V ± 3%, as shown in Figure 8.
voltage drop
4.95 V(min) 100 mV
handbook, full pagewidth
5.1 V KICK-UP +
POWER SUPPLY
± 3% regulated −
voltage drop
75 mV
low-ohmic
sense resistor
for overcurrent
detection
voltage drop
25 mV
4.75 V(min)
low-ohmic
PMOS switch
hub board (1)
resistance
ISP1123
power
switch
VBUS
D+
downstream
port
connector
D−
GND
SHIELD
MBL089
(1) Includes PCB traces, ferrite beads, etc.
Fig 8. Typical voltage drop components in self-powered mode using global overcurrent detection.
12.1.2
Bus-powered hubs
Bus-powered hubs are guaranteed to receive a supply voltage of 4.5 V at the
upstream port connector and must provide a minimum of 4.4 V to the downstream
port connectors. The voltage drop of 100 mV across bus-powered hubs includes:
• Hub PCB (power and ground traces, ferrite beads)
• Power switch (FET on-resistance)
• Overcurrent sense device.
The PCB resistance may cause a drop of 25 mV, which leaves 75 mV for the power
switch and overcurrent sense device. The voltage drop components are shown in
Figure 9.
For bus-powered hubs overcurrent protection is optional. It may be implemented for
all downstream ports on a global or individual basis.
handbook, full pagewidth
VBUS
upstream
port
connector
4.50 V(min)
voltage drop
75 mV
D+
low-ohmic
PMOS switch
D−
GND
SHIELD
voltage drop
25 mV
hub board (1)
resistance
ISP1123
power
switch
4.40 V(min)
VBUS
D+
downstream
port
connector
D−
GND
SHIELD
MBL090
(1) Includes PCB traces, ferrite beads, etc.
Fig 9. Typical voltage drop components in bus-powered mode (no overcurrent detection).
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
Philips Semiconductors
USB compound hub
13. Overcurrent detection
The ISP1123 has an analog overcurrent detection circuit for monitoring downstream
port lines. This circuit automatically reports an overcurrent condition to the host and
turns off the power to the faulty port. The host must reset the condition flag.
Pins OC1 to OC5/GOC are used for individual port overcurrent detection. Pin
OC5/GOC can also be used for global overcurrent detection. This is controlled by
input INDV (see Table 4).
The overcurrent detection circuit can be switched off using an external EEPROM (see
Table 23). In this case, the overcurrent pins OCn function as logic inputs (TTL level).
13.1 Overcurrent circuit description
The integrated overcurrent detection circuit of ISP1123 senses the voltage drop
across the power switch or an extra low-ohmic sense resistor. When the port draws
too much current, the voltage drop across the power switch exceeds the trip voltage
threshold (∆Vtrip). The overcurrent circuit detects this and switches off the power
switch control signal after a delay of 15 ms (ttrip). This delay acts as a ‘debounce’
period to minimize false tripping, especially during the inrush current produced by ‘hot
plugging’ of a USB device.
13.2 Power switch selection
From the voltage drop analysis given in Figure 7, Figure 8 and Figure 9, the power
switch has a voltage drop budget of 75 mV. For individual self-powered mode, the
current drawn per port can be up to 500 mA. Thus the power switch should have
maximum on-resistance of 150 mΩ.
If the voltage drop due to the hub board resistance can be minimized, the power
switch can have more voltage drop budget and therefore a higher on-resistance.
Power switches with a typical on-resistance of around 100 mΩ fit into this application.
The ISP1123 overcurrent detection circuit has been designed with a nominal trip
voltage (∆Vtrip) of 85 mV. This gives a typical trip current of approximately 850 mA for
a power switch with an on-resistance of 100 mΩ1.
13.3 Tuning the overcurrent trip voltage
The ISP1123 trip voltage can optionally be adjusted through external components to
set the desired trip current. This is done by inserting tuning resistors at pins SP/BP or
OCn (see Figure 10). Rtu tunes up the trip voltage ∆Vtrip and Rtd tunes it down
according to Equation 1.
∆V trip = ∆V trip ( intrinsic ) + I ref ⋅ R tu – I OC ⋅ R td
(1)
with Iref(nom) = 5 µA and IOC(nom) = 0.5 µA.
1.
The following PMOS power switches have been tested to work well with the ISP1123: Philips PHP109, Vishay Siliconix Si2301DS,
Fairchild FDN338P.
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9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
Philips Semiconductors
USB compound hub
low-ohmic
PMOS switch
handbook, halfpage
low-ohmic
PMOS switch
handbook, halfpage
VCC
VBUS
Iref
IOC
Rtu
VCC
IOC
Rtd
SP/BP
Rtd
VCC
OCn
SP/BP
ISP1123
OCn
ISP1123
MBL079
MBL080
Iref(nom) = 5 µA
IOC(nom) = 0.5 µA
IOC(nom) = 0.5 µA
a.
Self-powered mode.
b.
Bus-powered mode.
Fig 10. Tuning the overcurrent trip voltage.
13.4 Reference circuits
Some typical examples of port power switching and overcurrent detection modes are
given in Figure 11 to Figure 14.
The RC circuit (10 kΩ and 0.1 µF) around the PMOS switch provides for soft turn-on.
The series resistor connecting the SP/BP pin to VCC tunes up the overcurrent trip
voltage slightly (see Figure 10). In the schematic diagram the resistor separates the
net names for pins VCC and SP/BP. This allows an automatic router to use a wide
trace for VCC and a narrow trace to connect pin SP/BP.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
26 of 49
ISP1123
Philips Semiconductors
USB compound hub
downstream
ports
handbook, full pagewidth
5V
+
POWER SUPPLY
−
± 3%
low-ohmic
PMOS switch
+4.85 V(min)
1
0.1 µF
ferrite bead
120
µF
10 kΩ
VBUS
+4.75 V
(min) D+
D−
1
GND
SHIELD
low-ohmic
PMOS switch
330 kΩ
(5×)
2
0.1 µF
ferrite bead
120
µF
10 kΩ
VBUS
+4.75 V
(min) D+
D−
2
GND
SHIELD
low-ohmic
PMOS switch
+4.85 V(min)
VCC
ferrite bead
PSW1/GL1
GND
PSW2/GL2
3
0.1 µF
120
µF
10 kΩ
VBUS
+4.75 V
(min) D+
D−
3
GND
PSW3/GL3
SHIELD
100 Ω
to
1 kΩ
PSW4/GL4
low-ohmic
PMOS switch
PSW5/GL5/GPSW
4
0.1 µF
ferrite bead
120
µF
10 kΩ
INDV
VBUS
+4.75 V
(min) D+
D−
4
GND
SHIELD
SP/BP
low-ohmic
PMOS switch
OPTION
0.1 µF
ISP1123
5
10 kΩ
ferrite bead
120
µF
VBUS
+4.75 V
(min) D+
D−
5
GND
SHIELD
OC1
MBL084
OC2
OC3
OC4
OC5/GOC
Power switches 1 to 5 are low-ohmic PMOS devices as specified in Section 13.2.
Fig 11. Mode 5: self-powered hub; individual port power switching; individual overcurrent detection.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
27 of 49
ISP1123
Philips Semiconductors
USB compound hub
downstream
ports
handbook, full pagewidth
5.1 V KICK-UP +
POWER SUPPLY
−
± 3%
ferrite bead
+4.95 V(min)
low-ohmic
sense resistor
for overcurrent
detection
330
kΩ
+4.95 V(min)
VCC
120
µF
VBUS
+4.75 V
(min) D+
D−
SHIELD
ferrite bead
PSW1/GL1
GND
PSW2/GL2
low-ohmic
PMOS switch
120
µF
VBUS
+4.75 V
(min) D+
D−
PSW4/GL4
2
GND
PSW3/GL3
100 Ω
to
1 kΩ
1
GND
SHIELD
0.1 µF
10 kΩ
ferrite bead
PSW5/GL5/GPSW
120
µF
VBUS
+4.75 V
(min) D+
D−
3
GND
INDV
SHIELD
SP/BP
ferrite bead
OPTION
120
µF
ISP1123
VBUS
+4.75 V
(min) D+
D−
4
GND
OC1
SHIELD
OC2
ferrite bead
OC3
120
µF
OC4
OC5/GOC
VBUS
+4.75 V
(min) D+
D−
5
GND
SHIELD
MBL085
Power switch is low-ohmic PMOS device as specified in Section 13.2.
Fig 12. Mode 1: self-powered hub; ganged port power switching; global overcurrent detection.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
28 of 49
ISP1123
Philips Semiconductors
USB compound hub
handbook, full pagewidth
upstream
port
VBUS
low-ohmic
PMOS switch
+4.50 V(min)
D+
0.1 µF
D−
1
ferrite bead
120
µF
10 kΩ
GND
VBUS
+4.40 V
(min) D+
D−
SHIELD
low-ohmic
PMOS switch
PSW1/GL1
2
0.1 µF
ferrite bead
120
µF
10 kΩ
VBUS
+4.40 V
(min) D+
D−
2
GND
PSW2/GL2
GND
1
GND
330 kΩ
(4×)
SHIELD
VCC
downstream
ports
SHIELD
PSW3/GL3
PSW4/GL4
low-ohmic
PMOS switch
PSW5/GL5/GPSW
3
0.1 µF
ferrite bead
120
µF
10 kΩ
VBUS
+4.40 V
(min) D+
D−
3
GND
SHIELD
INDV
low-ohmic
PMOS switch
ferrite bead
SP/BP
0.1 µF
OPTION
4
10 kΩ
ISP1123
120
µF
VBUS
+4.40 V
(min) D+
D−
4
GND
SHIELD
MBL086
OC1
OC2
OC3
OC4
OC5/GOC
Power switches 1 to 4 are low-ohmic PMOS devices as specified in Section 13.2.
Fig 13. Mode 4: bus-powered hub; individual port power switching; individual overcurrent detection.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
29 of 49
ISP1123
Philips Semiconductors
USB compound hub
handbook, full pagewidth
upstream
port
VBUS
downstream
ports
ferrite bead
+4.50 V(min)
120
µF
D+
D−
VBUS
+4.40 V
(min) D+
D−
GND
1
GND
SHIELD
SHIELD
330
kΩ
VCC
PSW1/GL1
GND
PSW2/GL2
ferrite bead
120
µF
VBUS
+4.40 V
(min) D+
D−
2
GND
low-ohmic
PMOS switch
SHIELD
PSW3/GL3
PSW4/GL4
0.1 µF
10 kΩ
PSW5/GL5/GPSW
ferrite bead
120
µF
VBUS
+4.40 V
(min) D+
D−
3
GND
INDV
SHIELD
SP/BP
ferrite bead
OPTION
120
µF
ISP1123
VBUS
+4.40 V
(min) D+
D−
4
GND
SHIELD
OC1
MBL087
OC2
OC3
OC4
OC5/GOC
Power switch is low-ohmic PMOS device as specified in Section 13.2.
Fig 14. Mode 0: bus-powered hub; ganged port power switching; global overcurrent detection.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
30 of 49
ISP1123
Philips Semiconductors
USB compound hub
14. Limiting values
Table 24: Absolute maximum ratings
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
Ilatchup
latchup current
VI < 0 or VI > VCC
Vesd
electrostatic discharge voltage
ILI < 15 µA
Tstg
Ptot
[1]
[2]
[3]
Conditions
Min
Max
Unit
−0.5
+6.0
V
−0.5
VCC + 0.5
V
-
200
mA
-
±4000 [3]
V
storage temperature
−60
+150
°C
total power dissipation
-
95
mW
[1] [2]
Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).
Values are given for device only; in-circuit Vesd(max) = ±8000 V.
For open-drain pins Vesd(max) = ±2000 V.
Table 25: Recommended operating conditions
Symbol
Parameter
VCC
Conditions
Min
Max
Unit
supply voltage
4.0
5.5
V
VI
input voltage
0
5.5
V
VI(AI/O)
input voltage on analog I/O pins
(D+/D−)
0
3.6
V
VO(od)
open-drain output pull-up voltage
0
5.5
V
Tamb
operating ambient temperature
−40
+85
°C
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9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
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USB compound hub
15. Static characteristics
Table 26: Static characteristics; supply pins
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Vreg(3.3)
Parameter
regulated supply voltage
ICC
operating supply current
ICC(susp)
suspend supply current
[1]
Conditions
Min
Typ
Max
Unit
3.0 [1]
3.3
3.6
V
-
18
-
mA
1.5 kΩ pull-up on upstream
port D+ (pin DP0)
-
-
270
µA
no pull-up on upstream port
D+ (pin DP0)
-
-
80
µA
Min
Typ
Max
Unit
In ‘suspend’ mode the minimum voltage is 2.7 V.
Table 27: Static characteristics: digital pins
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Input levels
VIL
LOW-level input voltage
-
-
0.8
V
VIH
HIGH-level input voltage
2.0
-
-
V
Schmitt trigger inputs
Vth(LH)
positive-going threshold
voltage
1.4
-
1.9
V
Vth(HL)
negative-going threshold
voltage
0.9
-
1.5
V
Vhys
hysteresis voltage
0.4
-
0.7
V
IOL = 6 mA
-
-
0.4
V
IOL = 20 µA
-
-
0.1
V
-
-
±1
µA
-
-
±1
µA
Min
Typ
Max
Unit
65
85
105
mV
Output levels
LOW-level output voltage
(open drain outputs)
VOL
Leakage current
input leakage current
ILI
Open-drain outputs
OFF-state output current
IOZ
Table 28: Static characteristics: overcurrent sense pins
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
∆Vtrip
[1]
[2]
Parameter
Conditions
overcurrent detection
trip voltage on OCn pins
∆V = VCC − VOCn
[1]
∆V = VSP/BP − VOCn
[2]
Bus-powered mode.
Self-powered or hybrid-powered mode.
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9397 750 06325
Preliminary specification
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ISP1123
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USB compound hub
Table 29: Static characteristics: analog I/O pins (D+, D−) [1]
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDI
differential input sensitivity
|VI(D+) − VI(D−)|
0.2
-
-
V
VCM
differential common mode
voltage
includes VDI range
0.8
-
2.5
V
VIL
LOW-level input voltage
-
-
0.8
V
VIH
HIGH-level input voltage
2.0
-
-
V
Input levels
Output levels
VOL
LOW-level output voltage
RL = 1.5 kΩ to +3.6V
-
-
0.3
V
VOH
HIGH-level output voltage
RL = 15 kΩ to GND
2.8
-
3.6
V
-
-
±10
µA
Leakage current
OFF-state leakage current
ILZ
Capacitance
transceiver capacitance
pin to GND
-
-
20
pF
ZDRV [2]
driver output impedance
steady-state drive
28
-
44
Ω
ZINP
input impedance
10
-
-
MΩ
termination voltage for
upstream port pull-up (RPU)
3.0 [4]
-
3.6
V
Max
Unit
CIN
Resistance
Termination
VTERM [3]
[1]
[2]
[3]
[4]
D+ is the USB positive data pin (DPn); D− is the USB negative data pin (DMn).
Includes external resistors of 20 Ω ±1% on both D+ and D−.
This voltage is available at pin Vreg(3.3).
In ‘suspend’ mode the minimum voltage is 2.7 V.
16. Dynamic characteristics
Table 30: Dynamic characteristics
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
pulse width on input RESET
crystal oscillator running
10
-
-
µs
crystal oscillator stopped
-
2 [1]
-
ms
-
6
-
MHz
Reset
tW(RESET)
Crystal oscillator
fXTAL
[1]
crystal frequency
Dependent on the crystal oscillator start-up time.
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9397 750 06325
Preliminary specification
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ISP1123
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USB compound hub
Table 31: Dynamic characteristics: overcurrent sense pins
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Conditions
Min
Typ
Max
Unit
-
-
15
ms
[1]
overcurrent trip response time see Figure 15
from OCn LOW to PSWn HIGH
ttrip
[1]
Parameter
Operating modes 0, 1, 4 and 5; see Table 4.
Table 32: Dynamic characteristics: analog I/O pins (D+, D−); full-speed mode [1]
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D+ to VTERM.; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Driver characteristics
tFR
rise time
CL = 50 pF;
10 to 90% of |VOH − VOL|
4
-
20
ns
tFF
fall time
CL = 50 pF;
10 to 90% of |VOH − VOL|
4
-
20
ns
FRFM
differential rise/fall time
matching (tFR/tFF)
90
-
111.11
%
VCRS
output signal crossover voltage
[2] [3]
1.3
-
2.0
V
[2]
Data source timing
tDJ1
source differential jitter for
consecutive transitions
see Figure 16
[2] [3]
−3.5
-
+3.5
ns
tDJ2
source differential jitter for
paired transitions
see Figure 16
[2] [3]
−4
-
+4
ns
tFEOPT
source EOP width
see Figure 17
[3]
160
-
175
ns
tFDEOP
source differential data-to-EOP see Figure 17
transition skew
[3]
−2
-
+5
ns
Receiver timing
tJR1
receiver data jitter tolerance for see Figure 18
consecutive transitions
[3]
−18.5
-
+18.5
ns
tJR2
receiver data jitter tolerance for see Figure 18
paired transitions
[3]
−9
-
+9
ns
tFEOPR
receiver SE0 width
[3]
82
-
-
ns
tFST
width of SE0 during differential rejected as EOP;
transition
see Figure 19
[3]
-
-
14
ns
accepted as EOP;
see Figure 17
Hub timing (downstream ports configured as full-speed)
tFHDD
hub differential data delay
(without cable)
see Figure 20;
CL = 0 pF
[3]
-
-
44
ns
tFSOP
data bit width distortion after
SOP
see Figure 20
[3]
−5
-
+5
ns
tFEOPD
hub EOP delay relative to tHDD see Figure 21
[3]
0
-
15
ns
hub EOP output width skew
[3]
−15
-
+15
ns
tFHESK
[1]
[2]
[3]
see Figure 21
Test circuit; see Figure 23.
Excluding the first transition from Idle state.
Characterized only, not tested. Limits guaranteed by design.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
34 of 49
ISP1123
Philips Semiconductors
USB compound hub
Table 33: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode [1]
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D− to VTERM; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Driver characteristics
tLR
rise time
CL = 200 to 600 pF;
10 to 90% of |VOH − VOL|
75
-
300
ns
tLF
fall time
CL = 200 to 600 pF;
10 to 90% of |VOH − VOL|
75
-
300
ns
LRFM
differential rise/fall time
matching (tLR/tLF)
80
-
125
%
VCRS
output signal crossover voltage
1.3
-
2.0
V
[2]
[2] [3]
Hub timing (downstream ports configured as low-speed)
tLHDD
hub differential data delay
see Figure 20
-
-
300
ns
tLSOP
data bit width distortion after
SOP
see Figure 20
[3]
−60
-
+60
ns
tLEOPD
hub EOP delay relative to tHDD see Figure 21
[3]
0
-
200
ns
hub EOP output width skew
[3]
−300
-
+300
ns
tLHESK
[1]
[2]
[3]
see Figure 21
Test circuit: see Figure 23.
Excluding the first transition from Idle state.
Characterized only, not tested. Limits guaranteed by design.
VCC
handbook, halfpage
∆Vtrip
overcurrent
input
0V
ttrip
VCC
power switch
output
MBL032
0V
Overcurrent input: OCn; power switch output: PSWn.
Reference voltage for overcurrent sensing: VCC (bus-powered mode) or VSP/BP (self-powered mode).
Fig 15. Overcurrent trip response timing.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
Philips Semiconductors
USB compound hub
handbook, full pagewidth TPERIOD
+3.3 V
crossover point
crossover point
crossover point
differential
data lines
0V
MGR870
consecutive
transitions
N × TPERIOD + t DJ1
paired
transitions
N × TPERIOD + t DJ2
TPERIOD is the bit duration corresponding with the USB data rate.
Fig 16. Source differential data jitter.
TPERIOD
handbook, full pagewidth
+3.3 V
crossover point
extended
crossover point
differential
data lines
0V
differential data to
SE0/EOP skew
N × TPERIOD + t DEOP
source EOP width: t EOPT
receiver EOP width: t EOPR
MGR776
TPERIOD is the bit duration corresponding with the USB data rate.
Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L’.
Fig 17. Source differential data-to-EOP transition skew and EOP width.
handbook, full pagewidth TPERIOD
+3.3 V
differential
data lines
0V
tJR
tJR1
tJR2
MGR871
consecutive
transitions
N × TPERIOD + t JR1
paired
transitions
N × TPERIOD + t JR2
TPERIOD is the bit duration corresponding with the USB data rate.
Fig 18. Receiver differential data jitter.
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9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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USB compound hub
tFST
handbook, halfpage
+3.3 V
VIH(min)
differential
data lines
0V
MGR872
Fig 19. Receiver SE0 width tolerance.
+3.3 V
handbook, full pagewidth
upstream
differential
data lines
crossover
point
crossover
point
downstream
differential
data
0V
hub delay
downstream
t HDD
hub delay
upstream
t HDD
+3.3 V
downstream
differential
data lines
crossover
point
crossover
point
upstream
differential
data
0V
MGR777
(A) downstream hub delay
(B) upstream hub delay
SOP distortion:
t SOP = t HDD (next J) − t HDD(SOP)
Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L’.
Fig 20. Hub differential data delay and SOP distortion.
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9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
Philips Semiconductors
USB compound hub
+3.3
handbook,
fullVpagewidth
crossover
point
extended
upstream
differential
data lines
crossover
point
extended
downstream
port
0V
t EOP−
t EOP+
t EOP+
t EOP−
+3.3 V
crossover
point
extended
downstream
differential
data lines
crossover
point
extended
upstream
end of cable
0V
MGR778
(A) downstream EOP delay
(B) upstream EOP delay
EOP delay:
t EOP = max (t EOP−, tEOP+)
EOP delay relative to t HDD:
t EOPD = t EOP − t HDD
EOP skew:
t HESK = t EOP+ − t EOP−
Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L’.
Fig 21. Hub EOP delay and EOP skew.
Table 34: Dynamic characteristics: I2C-bus pins (SDA, SCL)
VCC and Tamb within recommended operating range; VDD = +5 V; VSS = VGND ; VIL and VIH between VSS and VDD.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fSCL
SCL clock frequency
fXTAL = 6 MHz
0
93.75 [1]
100
kHz
tBUF
bus free time
4.7
-
-
µs
tSU;STA
START condition set-up time
250
-
-
ns
tHD;STA
hold time START condition
4.0
-
-
µs
tLOW
SCL LOW time
4.7
-
-
µs
tHIGH
SCL HIGH time
4.0
-
-
µs
-
-
1000
ns
tr
SCL and SDA rise time
[2]
tf
SCL and SDA fall time
-
-
300
ns
tSU;DAT
data set-up time
250
-
-
ns
tHD;DAT
data hold time
0
-
-
µs
tVD;DAT
SCL LOW to data out valid
time
-
-
0.4
µs
tSU;STO
STOP condition set-up time
4.0
-
-
µs
Cb
capacitive load for each bus
line
-
-
400
pF
[1]
[2]
fSCL = 1⁄64fXTAL.
Rise time is determined by Cb and pull-up resistor value Rp (typ. 4.7 kΩ).
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USB compound hub
handbook, full pagewidth
SDA
t LOW
t BUF
tr
tf
t HD;STA
SCL
P
S
P
t SU;STA
t SU;STO
S
t HD;STA
t HD;STA
t HIGH
t SU;DAT
MGR779
Fig 22. I2C-bus timing.
17. Test information
The dynamic characteristics of the analog I/O ports (D+ and D−) as listed in Table 32
and Table 33, were determined using the circuit shown in Figure 23.
handbook, halfpage
Vreg(3.3)
test point
20 Ω
S1
RPU
1.5 kΩ
D.U.T.
15 kΩ
CL
test
S1
D−/LS closed
D+/LS open
D−/FS open
D+/FS closed
MGR775
Load capacitance:
CL = 50 pF (full-speed mode)
CL = 200 pF or 600 pF (low-speed mode, minimum or maximum timing).
Speed selection:
full-speed mode (FS): 1.5 kΩ pull-up resistor on D+
low-speed mode (LS): 1.5 kΩ pull-up resistor on D−.
Fig 23. Load impedance for D+ and D- pins.
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Preliminary specification
Rev. 01 — 5 October 1999
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USB compound hub
18. Package outline
SO32: plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
D
E
A
X
c
y
HE
v M A
Z
17
32
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
16
1
0
detail X
w M
bp
e
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.27
0.18
20.7
20.3
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.2
1.0
0.25
0.25
0.1
0.95
0.55
inches
0.10
0.012 0.096
0.004 0.086
0.01
0.02
0.01
0.011
0.007
0.81
0.80
0.30
0.29
0.050
0.419
0.394
0.055
0.043
0.016
0.047
0.039
0.01
0.01
0.004
0.037
0.022
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-25
97-05-22
SOT287-1
Fig 24. SO32 package outline.
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9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
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USB compound hub
SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)
SOT232-1
ME
seating plane
D
A2 A
A1
L
c
e
Z
(e 1)
w M
b1
MH
b
17
32
pin 1 index
E
1
16
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.8
1.3
0.8
0.53
0.40
0.32
0.23
29.4
28.5
9.1
8.7
1.778
10.16
3.2
2.8
10.7
10.2
12.2
10.5
0.18
1.6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-04
SOT232-1
Fig 25. SDIP32 package outline.
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9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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ISP1123
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USB compound hub
LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm
SOT358-1
c
y
X
24
A
17
25
16
ZE
e
E HE
A A2 A
1
(A 3)
wM
θ
bp
Lp
L
pin 1 index
32
9
detail X
8
1
e
ZD
v M A
wM
bp
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HD
HE
L
Lp
v
w
y
mm
1.60
0.20
0.05
1.45
1.35
0.25
0.4
0.3
0.18
0.12
7.1
6.9
7.1
6.9
0.8
9.15
8.85
9.15
8.85
1.0
0.75
0.45
0.2
0.25
0.1
Z D (1) Z E (1)
0.9
0.5
0.9
0.5
θ
o
7
0o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-12-19
97-08-04
SOT358 -1
Fig 26. LQFP32 package outline.
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9397 750 06325
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Rev. 01 — 5 October 1999
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USB compound hub
19. Soldering
19.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. However, wave soldering is not always suitable for surface
mount ICs, or for printed-circuit boards with high population densities. In these
situations reflow soldering is often used.
19.2 Surface mount packages
19.2.1
Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, infrared/convection heating in a
conveyor type oven. Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250 °C. The top-surface
temperature of the packages should preferable be kept below 230 °C.
19.2.2
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
• Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
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9397 750 06325
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USB compound hub
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
19.2.3
Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.
19.3 Through-hole mount packages
19.3.1
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260 °C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
19.3.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 °C, contact may be up to 5 seconds.
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9397 750 06325
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USB compound hub
19.4 Package related soldering information
Table 35: Suitability of IC packages for wave, reflow and dipping soldering methods
Mounting
Package
Soldering method
Reflow [1] Dipping
Wave
Through-hole
mount
DBS, DIP, HDIP, SDIP, SIL suitable [2]
−
suitable
Surface mount
BGA, LFBGA, SQFP,
TFBGA
not suitable
suitable
−
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP, SMS
not suitable [3]
suitable
−
PLCC [4], SO, SOJ
suitable
suitable
−
LQFP, QFP, TQFP
not recommended [4] [5] suitable
−
SSOP, TSSOP, VSO
not recommended [6]
−
[1]
[2]
[3]
[4]
[5]
[6]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06325
Preliminary specification
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Rev. 01 — 5 October 1999
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20. Revision history
Table 36: Revision history
Rev Date
01
CPCN
19991005
Description
Preliminary specification; initial version.
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21. Data sheet status
Datasheet status
Product status
Definition [1]
Objective specification
Development
This data sheet contains the design target or goal specifications for product development. Specification may
change in any manner without notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any
time without notice in order to improve design and supply the best possible product.
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
22. Definitions
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
24. Licenses
Purchase of Philips I2C components
Purchase of Philips I2C components conveys a license
under the Philips’ I2C patent to use the components in the
I2C system provided the system conforms to the I2C
specification defined by Philips. This specification can be
ordered using the code 9398 393 40011.
23. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
25. Trademarks
ACPI — is an open industry specification for PC power management,
co-developed by Intel Corp., Microsoft. and Toshiba
OnNow — is a trademark of Microsoft
GoodLink — is a trademark of Philips Electronics
SMBus — is a bus specification for PC power management, developed by
Intel Corp. based on the I2C-bus from Philips Electronics
LazyClock — is a trademark of Philips Electronics
SoftConnect — is a trademark of Philips Electronics
© Philips Electronics N.V. 1999 All rights reserved.
9397 750 06325
Preliminary specification
Rev. 01 — 5 October 1999
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USB compound hub
Philips Semiconductors - a worldwide company
Argentina: see South America
Australia: Tel. +61 29 805 4455, Fax. +61 29 805 4466
Austria: Tel. +43 160 101, Fax. +43 160 101 1210
Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102
Canada: Tel. +1 800 234 7381
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Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: Tel. +381 11 62 5344, Fax. +381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 272 4825
Internet: http://www.semiconductors.philips.com
(SCA65)
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Contents
1
2
3
4
5
6
6.1
6.1.1
6.1.2
6.2
6.2.1
6.2.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
8
9
9.1
9.2
10
10.1
10.2
10.3
10.4
10.4.1
10.4.2
10.4.3
10.4.4
10.4.5
10.4.6
10.4.7
10.4.8
10.4.9
10.4.10
10.4.11
11
11.1
11.2
11.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
ISP1123D (SO32) and ISP1123NB (SDIP32) . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
ISP1123BD (LQFP32) . . . . . . . . . . . . . . . . . . . 6
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 8
Analog transceivers . . . . . . . . . . . . . . . . . . . . . 8
Philips Serial Interface Engine (SIE). . . . . . . . . 9
Hub repeater. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
End-of-frame timers . . . . . . . . . . . . . . . . . . . . . 9
General and individual port controller . . . . . . . . 9
GoodLink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Bit clock recovery . . . . . . . . . . . . . . . . . . . . . . . 9
Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . 9
PLL clock multiplier. . . . . . . . . . . . . . . . . . . . . 10
Overcurrent detection . . . . . . . . . . . . . . . . . . . 10
I2C-bus interface. . . . . . . . . . . . . . . . . . . . . . . 10
Modes of operation . . . . . . . . . . . . . . . . . . . . . 10
Endpoint descriptions . . . . . . . . . . . . . . . . . . . 11
Hub endpoint 0 (control) . . . . . . . . . . . . . . . . . 11
Hub endpoint 1 (interrupt). . . . . . . . . . . . . . . . 11
Host requests . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Standard requests . . . . . . . . . . . . . . . . . . . . . 12
Hub specific requests . . . . . . . . . . . . . . . . . . . 13
Descriptors . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Hub responses . . . . . . . . . . . . . . . . . . . . . . . . 18
Get device status . . . . . . . . . . . . . . . . . . . . . . 18
Get configuration . . . . . . . . . . . . . . . . . . . . . . 18
Get interface status. . . . . . . . . . . . . . . . . . . . . 18
Get hub status . . . . . . . . . . . . . . . . . . . . . . . . 19
Get port status . . . . . . . . . . . . . . . . . . . . . . . . 19
Get configuration descriptor . . . . . . . . . . . . . . 20
Get device descriptor . . . . . . . . . . . . . . . . . . . 20
Get hub descriptor . . . . . . . . . . . . . . . . . . . . . 20
Get string descriptor (0) . . . . . . . . . . . . . . . . . 20
Get string descriptor (1) . . . . . . . . . . . . . . . . . 20
Get string descriptor (2) . . . . . . . . . . . . . . . . . 20
I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . . 21
Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Hardware connections . . . . . . . . . . . . . . . . . . 21
Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . 22
© Philips Electronics N.V. 1999.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 5 October 1999
Document order number: 9397 750 06325
12
12.1
12.1.1
12.1.2
13
13.1
13.2
13.3
13.4
14
15
16
17
18
19
19.1
19.2
19.2.1
19.2.2
19.2.3
19.3
19.3.1
19.3.2
19.4
20
21
22
23
24
25
Hub power modes . . . . . . . . . . . . . . . . . . . . . .
Voltage drop requirements . . . . . . . . . . . . . . .
Self-powered hubs . . . . . . . . . . . . . . . . . . . . .
Bus-powered hubs . . . . . . . . . . . . . . . . . . . . .
Overcurrent detection . . . . . . . . . . . . . . . . . . .
Overcurrent circuit description . . . . . . . . . . . .
Power switch selection . . . . . . . . . . . . . . . . . .
Tuning the overcurrent trip voltage . . . . . . . . .
Reference circuits . . . . . . . . . . . . . . . . . . . . . .
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .
Static characteristics . . . . . . . . . . . . . . . . . . . .
Dynamic characteristics . . . . . . . . . . . . . . . . .
Test information . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . .
Surface mount packages . . . . . . . . . . . . . . . .
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . .
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . .
Manual soldering. . . . . . . . . . . . . . . . . . . . . . .
Through-hole mount packages . . . . . . . . . . . .
Soldering by dipping or by solder wave . . . . .
Manual soldering. . . . . . . . . . . . . . . . . . . . . . .
Package related soldering information . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
23
23
23
24
25
25
25
25
26
31
32
33
39
40
43
43
43
43
43
44
44
44
44
45
46
47
47
47
47
47