INTEGRATED CIRCUITS DATA SHEET PCA8581; PCA8581C 128 × 8-bit EEPROM with I2C-bus interface Product specification Supersedes data of 1996 Aug 19 File under Integrated Circuits, IC12 1997 Apr 02 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 QUICK REFERENCE DATA 4 ORDERING INFORMATION 5 BLOCK DIAGRAM 6 PINNING 7 CHARACTERISTICS OF THE I2C-BUS 7.1 7.2 7.3 7.4 7.5 Bit transfer Start and stop conditions System configuration Acknowledge I2C-bus protocol 8 LIMITING VALUES 9 HANDLING 10 DC CHARACTERISTICS 11 AC CHARACTERISTICS 12 APPLICATION INFORMATION 12.2 12.2 12.3 Application example Slave address Diode protection 13 PACKAGE OUTLINES 14 SOLDERING 14.1 14.2 14.2.1 14.2.2 14.3 14.3.1 14.3.2 14.3.3 Introduction DIP Soldering by dipping or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints 15 DEFINITIONS 16 LIFE SUPPORT APPLICATIONS 17 PURCHASE OF PHILIPS I2C COMPONENTS 1997 Apr 02 2 PCA8581; PCA8581C Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface 1 FEATURES 2 • Operating supply voltage: PCA8581; PCA8581C GENERAL DESCRIPTION The PCA8581 and PCA8581C are low power CMOS EEPROMs with standard and wide operating voltages: – 4.5 to 5.5 V (PCA8581) 4.5 to 5.5 V (PCA8581) – 2.5 to 6.0 V (PCA8581C) 2.5 to 6.0 V (PCA8581C). • Integrated voltage multiplier and timer for writing (no external components required) In the following text, the generic term ‘PCA8581’ is used to refer to both types in all packages except when otherwise specified. • Automatic erase before write • Low standby current; maximum 10 µA • 8-byte page write mode The PCA8581 is organized as 128 words of 8-bytes. • Serial input/output bus (I2C-bus) Addresses and data are transferred serially via a two-line bidirectional bus (I2C-bus). The built-in word address register is incremented automatically after each written or read data byte. All bytes can be read in a single operation. Up to 8 bytes can be written in one operation, reducing the total write time per byte. Three address pins, A0, A1 and A2 are used to define the hardware address, allowing the use of up to 8 devices connected to the bus without additional hardware. • Address by 3 hardware address pins • Automatic word address incrementing • Designed for minimum 10000 write cycles per byte • 10 years minimum non-volatile data retention • Infinite number of read cycles • Pin and address compatibility to PCF8570C and PCF8582 • Operating ambient temperature: −25 to +85 °C. 3 QUICK REFERENCE DATA SYMBOL VDD PARAMETER MIN. MAX. UNIT supply voltage PCA8581 4.5 5.5 V PCA8581C 2.5 6.0 V IDD supply current (standby) Tamb operating ambient temperature Tstg storage temperature 4 CONDITIONS − 10 µA −25 +85 °C without EEPROM retention −65 +150 °C with EEPROM retention −65 +85 °C fSCL = 0 Hz ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION PCA8581P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 PCA8581CP DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 PCA8581T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 PCA8581CT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 1997 Apr 02 3 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface 5 PCA8581; PCA8581C BLOCK DIAGRAM handbook, full pagewidth VOLTAGE MULTIPLIER TIMER PCA8581 PCA8581C WORD ADDRESS REGISTER 7 ROW SELECT MEMORY CELL ARRAY COLUMN SELECT MULTIPLEXER 1 A0 2 A1 3 A2 6 SCL 5 SDA 8 VDD INPUT FILTER POWER ON RESET 2 I C BUS CONTROL 8 SHIFT REGISTER R/W CONTROL 4 VSS 7 TEST MLB887 Fig.1 Block diagram. 6 PINNING SYMBOL PIN DESCRIPTION A0 1 hardware address input 0 A1 2 hardware address input 1 A0 1 A2 3 hardware address input 2 A1 2 VSS 4 negative supply A2 3 SDA 5 serial data input/output VSS 4 SCL 6 serial clock input TEST 7 test output can be connected to VSS, VDD or left open-circuit VDD 8 positive supply 1997 Apr 02 fpage PCA8581 PCA8581C 8 VDD 7 TEST 6 SCL 5 SDA MLB888 4 Fig.2 Pin configuration. Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface 7 CHARACTERISTICS OF THE I2C-BUS 7.1 The I2C-bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor. Data transfer may be initiated only when the bus is not busy. PCA8581; PCA8581C Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as a control signal. SDA SCL change of data allowed data line stable; data valid MBA607 Fig.3 Bit transfer. 7.2 Start and stop conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the stop condition (P). SDA SDA SCL SCL S P START condition STOP condition Fig.4 Definition of START and STOP conditions. 1997 Apr 02 5 MBA608 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface 7.3 PCA8581; PCA8581C System configuration A device generating a message is a ‘transmitter’, a device receiving a message is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’. SDA SCL MASTER TRANSMITTER / RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER / RECEIVER MASTER TRANSMITTER / RECEIVER MASTER TRANSMITTER MBA605 Fig.5 System configuration. 7.4 The device that acknowledges must pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse (set-up and hold times must be taken into consideration). A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a stop condition. Acknowledge The number of data bytes transferred between the start and stop conditions from transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowledge bit. The acknowledge bit is a HIGH level signal put on the bus by the transmitter during which time the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. clock pulse for acknowledgement START condition handbook, full pagewidth SCL FROM MASTER 1 2 8 DATA OUTPUT BY TRANSMITTER S DATA OUTPUT BY RECEIVER MBA606 - 1 Fig.6 Acknowledgement on the I2C-bus. 1997 Apr 02 6 9 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface 7.5 PCA8581; PCA8581C I2C-bus protocol Before any data is transmitted on the I2C-bus, the device which should respond is addressed first. The addressing is always carried out with the first byte transmitted after the start procedure. The I2C-bus configuration for the different PCA8581 WRITE and READ cycles is shown in Figs 7, 9 and 10. S acknowledgement from slave acknowledgement from slave handbook, full pagewidth SLAVE ADDRESS 0 A X WORD ADDRESS A acknowledgement from slave DATA R/W don't care A P WRITING t WR n bytes auto increment memory word address MLB889 Fig.7 Master transmits to slave receiver (WRITE) mode. After the word address, one-to-eight data bytes can be sent. The address is automatically incremented, but the four highest address bits (row) are internally latched. Therefore all bytes are written in the same row. An example of writing eight bytes with word address X 0 0 0 0 0 0 0 and six bytes with word address X 0 0 1 0 1 0 1 is shown in Fig.8. handbook, full pagewidth Word Address (1) Row X0000000 0 X0001... 1 X0010101 2 X0011... 3 column 1 2 3 4 5 6 0 1 2 4 3 5 4 6 7 8 1 2 3 5 6 7 MLB890 (1) X = don’t care. Fig.8 Writing eight and six bytes with different word addresses. 1997 Apr 02 7 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C To transmit eight bytes in sequential order, begin with the lowest address bits 0 0 0. The data is written after a stop is detected. The data is only written if complete bytes have been received and acknowledged. Writing takes a time tWR (6 to 10 ms) during which the device will not respond to its slave address. Note that to write the next row, a new write operation is required (start, slave address, row address, data and stop). acknowledgement from slave handbook, full pagewidth S SLAVE ADDRESS 0 A X acknowledgement from slave WORD ADDRESS R/W don't care A S acknowledgement from slave SLAVE ADDRESS at this moment master transmitter becomes master - receiver and PCA8581(C) slave - receiver becomes slave - transmitter 1 A acknowledgement from master DATA A n bytes R/W auto increment memory word address no acknowledgement from master DATA 1 P last byte auto increment memory word address MLB891 Fig.9 Master reads after setting word address (WRITE word address; READ data). acknowledgement from slave acknowledgement from slave handbook, full pagewidth S SLAVE ADDRESS 1 A R/W DATA A n bytes acknowledgement from slave DATA 1 P last bytes auto increment word address auto increment word address MBD824 Fig.10 Master reads slave immediately after first byte (READ mode). An unlimited number of data bytes can be read in one operation. The address is automatically incremented. If a read without setting the word address is performed after a write operation, the address pointer may point at a byte in the row after the previously written row. This occurs if, during writing, the three lowest address bits (column) rolled over. 1997 Apr 02 8 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C 8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT −0.3 +7.0 −0.8 VDD + 0.8 V DC input current − ±10 mA IO DC output current − ±10 mA Ptot total power dissipation per package − 150 mW PO power dissipation per output − 50 mW Tamb operating ambient temperature −25 +85 °C Tstg storage temperature without EEPROM retention −65 +150 °C with EEPROM retention −65 +85 °C VDD supply voltage (pin 8) VI input voltage (any input) II 9 measured via a 500 Ω resistor V HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under “Handling MOS Devices”. 1997 Apr 02 9 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C 10 DC CHARACTERISTICS VDD = 2.5 to 6.0 V (PCA8581C); VDD = 4.5 to 5.5 V (PCA8581); VSS = 0 V; Tamb = −25 to +85 °C; note 1; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDD IDD supply voltage PCA8581C 2.5 − 6.0 V PCA8581 4.5 − 5.5 V supply current standby mode fSCL = 0 Hz; VIL = 0 V; VIH = VDD − − 10 µA during read cycle fSCL = 100 Hz; VIL = 0 V; VIH = VDD − − 400 µA during write cycle VIL = 0 V; VIH = VDD − − 1000 µA − − 0.3VDD V Inputs A0, A1, A2, SDA and SCL VIL LOW level input voltage VIH HIGH level input voltage 0.7VDD − − V ILI input leakage current VI = VDD or VSS − − 1 µA Ci input capacitance VI = VSS − − 7 pF 3 − − mA Output SDA IOL LOW level output current VOL = 0.4 V Erase/write data tWR write time − 7 10 ms tRET data retention time 10 − − years Note 1. The PCA8581C is guaranteed to be programmed with all locations ‘FF’ (hexadecimal) provided the device has been stored within the temperature limits −65 to +85 °C. 1997 Apr 02 10 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C 11 AC CHARACTERISTICS All timing values are valid within the operating supply voltage and ambient temperature range and reference to VIL and VIH with an input voltage swing of VSS to VDD. SYMBOL PARAMETER MIN. TYP. MAX. UNIT I2C-bus timing (see Fig.11; note 1) fSCL SCL clock frequency − − 100 kHz tSP tolerable spike width on bus − − 100 ns tBUF bus free time 4.7 − − µs tSU;STA START condition set-up time 4.7 − − µs tHD;STA START condition hold time 4.0 − − µs tLOW SCL LOW time 4.7 − − µs tHIGH SCL HIGH time 4.0 − − µs tr SCL and SDA rise time − − 1.0 µs tf SCL and SDA fall time − − 0.3 µs tSU;DAT data set-up time 250 − − ns tHD;DAT data hold time 0 − − ns tVD;DAT SCL LOW to data out valid − − 3.4 µs tSU;STO STOP condition set-up time 4.0 − − µs Note 1. A detailed description of the I2C-bus specification, with applications, is given in brochure “The I2C-bus and how to use it”. This brochure may be ordered using the code 9398 393 40011. handbook, full pagewidth t SU;STA BIT 6 (A6) BIT 7 MSB (A7) START CONDITION (S) PROTOCOL t LOW t HIGH BIT 0 LSB (R/W) ACKNOWLEDGE (A) STOP CONDITION (P) 1 / f SCL SCL t tr BUF t f SDA t HD;STA t SU;DAT t HD;DAT t VD;DAT MBD820 Fig.11 I2C-bus timing diagram; rise and fall times refer to VIL and VIH. 1997 Apr 02 11 t SU;STO Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C 12 APPLICATION INFORMATION 12.1 Application example VDD handbook, full pagewidth SDA MASTER TRANSMITTER/ RECEIVER SCL VDD 0 0 0 SCL A0 A1 PCA8581/PCA8581C '1010' A2 V SS TEST SDA VDD VDD 1 0 0 SCL A0 A1 PCA8581/PCA8581C '1010' A2 V SS TEST SDA V DD VDD 1 VDD 1 VDD 1 SCL A0 A1 PCA8581/PCA8581C '1010' A2 TEST V SS V DD SDA R SDA SCL (I 2 C bus) Inputs A0, A1 and A2 must be connected to VDD of VSS but not left open-circuit. Fig.12 Application diagram. 1997 Apr 02 12 R R: pull up resistor tr R= C BUS MLB893 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface 12.2 PCA8581; PCA8581C Slave address The PCA8581 has a fixed combination 1 0 1 0 as group 1, while group 2 is fully programmable (see Fig.13). handbook, halfpage 1 0 1 0 A2 A1 A0 R/W group 2 group 1 MLB892 Fig.13 Slave address. 12.3 Diode protection handbook, halfpage A0 VDD A1 TEST A2 SCL VSS SDA substrate MLB894 There is no connection between SCL and VDD, and SDA and VDD; this allows powering down the device without affecting I2C-bus operation. Fig.14 Device diode protection. 1997 Apr 02 13 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C 13 PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 14 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp L 4 1 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1997 Apr 02 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 15 o 8 0o Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. 14 SOLDERING 14.1 Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 14.3.2 This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). 14.2 14.2.1 Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 14.2.2 Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. 14.3 14.3.1 14.3.3 REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1997 Apr 02 WAVE SOLDERING 16 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface PCA8581; PCA8581C 15 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 16 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 17 PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1997 Apr 02 17 Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface NOTES 1997 Apr 02 18 PCA8581; PCA8581C Philips Semiconductors Product specification 128 × 8-bit EEPROM with I2C-bus interface NOTES 1997 Apr 02 19 PCA8581; PCA8581C Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 417067/1200/03/pp20 Date of release: 1997 Apr 02 Document order number: 9397 750 01747