DATA SHEET KBPC15005N THRU KBPC1510N SEMICONDUCTOR VOLTAGE RANGE 50 to 1000 Volts CURRENT 15 Ampere BR35N / Unit:inch(mm) FEATURES •Low cost •This series is UL recognized under component index, file number E127707 •High forward surge current capability •Intergrally molded heatsink provide very low thermal resistance. •High isolation voltage from case to lugs. •High temperature soldering guaranteed: 260℃/10 second, at 5 lbs. (2.3kg) tension. •High temperature soldering : 260OC / 10 seconds at terminals •Pb free product at available : 99% Sn above meet RoHS environment substance directive request MECHANICAL DATA •Case: Molded plastic body, suffic "N" for thinner type •Terminal: Plated 0.25" (6.35mm) lug. •Polarity: Polarity symbols marked on case. •Mounting: Thru hole for #10 screw, 20 in,- lbs. Torqute Max. •Weight: 0.55 ounce, 15.6 gram(KBPC15N) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS •Ratings at 25℃ ambient temperature unless otherwise specified •Single phase, half wave, 60Hz, resistive or inductive load. •For capacitive load derate current by 20% SYMBOLS KBPC KBPC KBPC KBPC KBPC KBPC 15005N 1501N KBPC 1502N 1504N 1506N 1508N 1510N Maximum Repetitive Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 Volts Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 Volts VDC 50 100 200 400 600 800 1000 Volts Maximum DC Blocking Voltage Maximum Average Forward Rectified Output Current, at TC = 55℃ (Note 1, 2) I(AV) 15 Amps IFSM 300 Amps I2t 373 A2s VF 1.1 Volts 10 μA Peak Forward Surge Current 8.3ms single half sine - wave superimposed on rated load (JEDEC method ) Rating for Fusing (t<8.3ms) Maximum Instantaneous Forward Voltage Drop per bridge element at 7.5A Maximum DC Reverse Current at rate TA = 25℃ DC blocking voltage per element TA =100℃ IR 1.0 mA 2500 VAC RθJC 2.0 ℃/W TJ (-65 to +150) TSTG (-65 to +150) Isolation Voltage from case to lugs VISO Typical Thermal Resistance (Note 1,2) Operating Temperature Range Storage Temperature Range ℃ 1. Unit mounted on 5" X 4" X 3" (12.8cm X 10.2cm X 7.3cm)Al. finned Plate. 2. Bolt down on heat-sink with silicon thermal compound between bridge and mounting sutfae for maximum heat transfer efficiency with # 10 screw. http://www.yeashin.com 1 REV.02 20120305 DEVICE CHARACTERISTICS KBPC15005N THRU KBPC1510N FIG.1-DERATING CURVE FOR FIG.2-MAXIMUM NON-REPETITIVE PEAK OUTPUT RECTIFIED CURRENT FORWARD SURGE CURRENT PER ELEMENT AVERAGE FORWARD OUTPUT 15 Heat Sink Mounting AL.Finned Plate 10 Single Phase Half Wave 60Hz 5.0 Inductive or Resistive Load 300 CURRENT, (A) PEAK FORWARD SURGE CURRENT,(A) 5" X 4" X 3" Thick (12.8 X 10.2 X 7.3cm) 8.3ms Single Half Sine-Wave Tj (JEDEC Method) =T j max 200 100 1 Cycle 0 0 50 55 25 75 125 100 150 175 0 1 100 10 CASE TEMPERATURE, ( ° C) NUMBER OF CYCLES AT 60 Hz FIG.4-TYPICAL REVERSE FIG.3-TYPICAL FORWARD CHARACTERICTICS CHARACTERISTICS PER BRIDGE ELEMENT PER BRIDGE ELEMENT 100 100 1.0 Tj =25 ° C Pulse Width=300uS 1%Duty Cycle 0.1 10 (uA) INSTANTANEOUS REVERSE CURRENT, 10 (A) INSTANTANEOUS FORWARD CURRENT, Tj =100 ° C 1.0 Tj =25 ° C 0.1 0.01 0.01 0.4 0.6 1.0 0.8 1.2 1.4 1.6 1.8 60 40 20 0 120 100 80 PERCENT OF RATED PEAK INSTANTANEOUS FORWARD VOLTAGE,(V) REVERSE VOLTAGE,(%) FIG.5-TYPICAL JUNCTION CAPACITANCE FIG.6-MAXIMUM POWER DISSIPATION PER BRIDGE ELEMENT 100 100 T j=25 ° C f=1MHz V sig =50mV p-p 10 0.1 1.0 10 100 REVRESE VOLTAGE,(V) http://www.yeashin.com 2 80 (W) AVERAGE POWER DISSIPATION OF BRIDGE, JUNCTION CAPACITANCE,(pF) 1000 Tj =T j max 60 Capacitive Load 40 Resistive or Inductive 20 0 Load 0 5 10 15 20 25 30 35 AVERAGE OUTPUT CURRENT, (A) REV.02 20120305 140