TN-100 R3 AHA 10/13/06 Chip Inductors Type KL32 Series CERTIFIED CERTIFIED 1. Scope This specification applies to Chip Inductors (KL32) produced by KOA Corporation. 2. Type Designation The type designation shall be the following form: KL 32 T TE 101 J Type Size Termination Material Packaging Nominal Inductance Tolerance 1210 T: Sn (Other termination styles available, contact factory for options) TE: 7" embossed plastic (2,000 pieces/reel) TED: 10" embossed plastic (4,000 pieces/reel) Reference inductance marking chart J: ±5% K: ±10% M: ±20% 3. Dimensions and Construction Type KL32 L W1 Dimensions inches (mm) W2 t h d .126±.008 .098±.008 .067±.004 .087±.008 .075±.004 .02 nominal (3.2±0.2) (2.5±0.2) (1.7±0.1) (2.2±0.2) (1.9±0.1) (.5 nominal) Inductance Marking L W1 Value 0.005µH - 0.082µH 0.10µH - 8.2µH t h 10µH - 330µH d Ferrite Core Magnet Wire Molded Resin W2 Code 005 - 082 R10 - 8R2 R indicates decimal point. 100 - 331 1st two figures are significant, the last figure indicates the number of zeros to follow. Electrode PAGE 1 OF 8 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 4. Standard Applications Part Designation Inductance (µH) Inductance Tolerance KL32TTE005* KL32TTE010* KL32TTE012* KL32TTE015* KL32TTE018* KL32TTE022* KL32TTE027* KL32TTE033* KL32TTE039* KL32TTE047* KL32TTE056* KL32TTE068* KL32TTE082* KL32TTER10* KL32TTER12* KL32TTER15* KL32TTER18* KL32TTER22* KL32TTER27* KL32TTER33* KL32TTER39* KL32TTER47* KL32TTER56* KL32TTER68* KL32TTER82* KL32TTE1R0* KL32TTE1R2* KL32TTE1R5* KL32TTE1R8* KL32TTE2R2* KL32TTE2R7* KL32TTE3R3* KL32TTE3R9* KL32TTE4R7* KL32TTE5R6* KL32TTE6R8* KL32TTE8R2* KL32TTE100* KL32TTE120* KL32TTE150* KL32TTE180* KL32TTE220* KL32TTE270* KL32TTE330* KL32TTE390* KL32TTE470* KL32TTE560* KL32TTE680* KL32TTE820* KL32TTE101* KL32TTE121* KL32TTE151* KL32TTE181* KL32TTE221* KL32TTE271* KL32TTE331* 0.005 0.010 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.082 0.10 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 0.82 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 M: ±20% Quality Factor Minimum K: ±10% M: ±20% 11 15 17 19 21 23 25 26 27 28 J: ±5% K: ±10% M: ±20% 30 J: ±5% K: ±10% M: ±20% Self Resonant Frequency Minimum (MHz) 2700 2500 2300 2100 1900 1700 1500 1400 1300 1200 1100 1000 900 700 500 450 400 350 320 300 250 220 180 160 140 120 100 85 80 75 70 60 55 50 47 43 40 36 33 30 27 25 20 17 16 15 13 12 11 DC Resistance Maximum (Ω) 0.12 0.13 0.14 0.16 0.18 0.20 0.22 0.24 0.27 0.30 0.33 0.36 0.40 0.44 0.22 0.25 0.28 0.32 0.36 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.85 0.90 1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.1 2.5 2.8 3.3 3.7 5.0 5.6 6.4 7.0 8.0 9.0 10 10 11 15 17 21 28 34 8 20 7 6 5 Allowable DC Current Maximum (mA) Measured Frequency (MHz) 100 450 25.2 400 390 370 350 320 290 260 250 220 200 180 170 150 140 130 120 110 80 70 65 60 55 50 45 40 70 65 60 7.96 2.52 0.796 50 * Add tolerance character (J, K, M) PAGE 2 OF 8 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 5. Measurement Method of L and Q Nominal Inductance Range (µH) Measurement Method Measuring Frequency (MHz) 0.005 ~ 0.10 100 0.12 ~ 0.82 Please see Method-1 1.0 ~ 8.2 10 ~ 82 25.2 7.96 2.52 Please see Method-2 100 ~ 330 0.796 Method-1 Test Equipment: Fixture: Electrical Length: Setting: Hewlett Packard RF Impedance analyzer 4191A Hewlett Packard Spring clip fixture 16092A 2.10 cm Please see the following figure KL32 Slide Clip Terminal Center Post 0.087 (2.2) Spacer (Unmagnetic Insulator) Method-2 Test Equipment: Fixture: OSC Level: Hewlett Packard LF Impedance analyzer 4192 Hewlett Packard Test fixture 16034E 0.3 V 6. Test Condition Unless otherwise specified, the test shall be performed in accordance with JIS-C-5202 specifying marking measurements as follows: Ambient temperature: 20 ± 15°C Relative humidity: 65 ± 20% If there may be any doubt on results, measurements shall be made within the following limits: Ambient temperature: 20 ± 2°C Relative humidity: 65 ± 5% PAGE 3 OF 8 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 7. Reliability Data 7-1 Electrical Characteristics Item Requirement Test Method DC Bias Characteristic Δ L/L: Within - 10% Measure inductance with application of rated current using LCR meter to compare it with the initial value. Dielectric Withstanding Voltage No fuming, flaming, or breakdown 5 seconds at DC 1000V between terminal 1 (one electrode of inductor) and terminal 2 (the thin copper wire which is wound around the inductor more than twice). Insulation Resistance More than 1000MΩ Measure resistance immediately after 1 minute passed since DC 500V was applied between terminal 1 and 2. 7-2 Mechanical Characteristics Item Requirement Test Method Terminal Pull Strength No damage Terminals shall withstand a pull of 0.5kgf in a horizontal direction. Terminal Bending Strength No damage Specimen shall be soldered on PCB-A (see figure below) and support by applying strength so that the bending width becomes 10 mm. 0.197 (5.0) Thickness: 1.6 mm Material: Paper Phenol Adhesive Agent Spreading Area 0.039 (1.0) (a) Board 1.575 (40.0) ø 0.177 (ø 4.5) 0.087 (2.2) 0.079 (2.0) 0.197 (5.0) 3.937 (100.0) (b) Install 1.77 (45.0) 1.77 (45.0) Solder Resist ø 0.394 x 1.969 (ø 10 x 50) (Support Stick) Soldering Units: inches (mm) 0.063 (1.6) Chip Inductor PAGE 4 OF 8 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 7-2 Mechanical Characteristics Continued Item Vibration Thickness: 1.6 mm Material: Glass Epoxy Requirement Test Method No significant abnormality in appearance Δ L/L: Within ± 3% 2 hours in each X, Y and Z directions on PCB-B (see figure below) at a frequency range of 10 to 55 to 10 Hz (1 min.) with 1.5 mm amplitude. Adhesive Agent Spreading Area 0.118 (3.0) 0.110 (2.8) Solder Resist 0.059 (1.5) 0.039 (1.0) 0.157 (4.0) 0.118 (3.0) 0.276 (7.0) 0.087 (2.2) 0.984 (25.0) 0.118 (3.0) 0.079 (2.0) 0.079 ~ 0.138 (2.0 ~ 3.5) Terminal Connection 0.098 (2.5) 0.082 (2.08) 2.180 (55.38) 2.436 or more (2.441 to 2.559) (61.88 or more) (62 to 65) Units: inches (mm) Resistance to Solder Heat No significant abnormality in appearance Δ L/L: Within ± 3% Immerse in the solder (H63A) of 260 ± 5°C for 10 ± 1 sec. Solderability Over 95% of electrode surface shall be covered with solder Immerse in the solder (H63A) of 230 ± 5°C for 3 ± 0.5 sec. Drop Test No significant abnormality in appearance Δ L/L: Within ± 3% Drop from a height of 1 m to the ground of concrete or tile 1 time. PAGE 5 OF 8 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 7-3 Environmental Characteristics * Item Requirement Test Method Low Temperature Life Test Δ L/L: Within ± 5% Δ Q/Q: Within ± 20% Store at -55 ± 2°C for 1000 hours. High Temperature Life Test Δ L/L: Within ± 5% Δ Q/Q: Within ± 30% Store at 100 ± 2°C for 1000 hours. Thermal Shock Δ L/L: Within ± 5% 100 cycles between -55 ± 2°C / 1 hour and +100 ± 2°C / 1 hour. Temperature Characteristic Δ L/L: Within ± 10% Measure Δ L/L at the temperature of between -55°C and +100°C as based on the temperature of 20°C. Humidity Δ L/L: Within ± 5% Δ Q/Q: Within ± 30% Store at 40 ± 2°C, 90 to 95% RH for 1000 hours. Humidity Loading Test Δ L/L: Within ± 5% Δ Q/Q: Within ± 30% Apply rated current continuously at 40 ± 2°C, 90 to 95% RH for 1000 hours. High Temperature Loading Test Δ L/L: Within ± 5% Δ Q/Q: Within ± 30% Apply rated current continuously at 100 ± 2°C for 1000 hours. Solvent Resistance No outstanding damage and markings can be easily judged According to MIL-STD-202 Method 215 (1990). Storage Temperature Range -55°C to +100°C ––– Operating Temperature Range -55°C to +100°C ––– * Unless otherwise specified, at least one hour of recovery under the normal temperature and normal humidity after the test, followed by the measurement within two hours. PAGE 6 OF 8 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 8. Packaging 8-1 Taping The tapes for taping shall be embossed carrier tapes of .315" (8 mm) width and .157" (4 mm) pitch. The standard quantity per reel shall be 2,000 pieces. (1) Dimensions of carrier tape Dimensions in inches (mm) A .140 (3.55 ± 0.10) T2 .011 (0.28 ± 0.05) B .106 (2.70 ± 0.10) P0 .157 (4.00 ± 0.10) W .315 (8.00 ± 0.10) P1 .157 (4.00 ± 0.10) E .069 (1.75 ± 0.10) P2 .079 (2.00 ± 0.05) F .138 (3.50 ± 0.05) øD* 0.1 0 .059 (1.50 ± 0.1 0 ) T1 .106 (2.70 ± 0.15) øD1 0.2 0) .039 (1.00 ± 0.2 0 T2 E øD * 20 pitches accumulation of sprocket holes shall be 80.00 ± 0.15 mm. P0 P2 øD1 F 5N6 W Direction of mark T1 The top tape requires a peel-off force of 15 to 60 gf. B Blank portions 300 mm or more A P1 Tape running direction Blank portions 230 mm or more Chip cavity Leader 270 mm or more End Beginning Top tape Empty Empty Tape running direction (2) Reel dimensions Dimensions in inches (mm) 7.087 (180 ± 03 ) Marking place 0.079 (2.0 ± 0.5) 0.512 (13 ± 0.2) 0.354 (9.0 ± 0.3) 0.449 (11.4 ± 1.0) 0.413 (R10.5 ± 0.4) Bolivar Drive ■ P.O. Box 547 2.362 (60 ± 10 ) ■ Bradford, PA 16701 ■ USA ■ (Marking item) (1) Type designation (2) Nominal inductance and tolerance (3) Quantity (4) Production lot number (5) Manufacturer's name PAGE 7 OF 8 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. TN-100 R3 9. Recommended Soldering Condition 0.197 (5.0) 9-1 Dimensions of Standard Land 0.087 (2.2) The following figure is recommended land dimensions. When two or more chip inductors are closely mounted, they must be separated by means of solder resists to prevent excessive solder. 0.079 (2.0) Dimensions in inches (mm) KL32 0.055 (1.4) 9-2 Soldering Condition Wave soldering should be done at 260°C for less than 10 seconds. Reflow soldering should be done at 240°C for less than 20 seconds. (Please see the following figures.) When using a soldering iron, temperature shall not exceed 350°C and within three seconds. Soldering iron time shall be allowed only one time. After soldering, chip inductors shall not be stressed excessively. Recommended Temperature Profile for Wave Soldering Preheat 120 Seconds Max. Soldering 10 Seconds Max. Recommended Temperature Profile for Reflow Soldering Natural Cooling Preheat 120 Seconds Max. 260°C 240°C 150°C 150°C 100°C 100°C Soldering 20 Seconds Max. Natural Cooling 10. Mounting Placement force should not be excessive. 11. Recommended Washing Condition Since this chip inductor is a coil of ultra-thin wire, it is susceptible to vibration. If an ultrasonic cleaning unit is used for cleaning, check for any possibility of problem generation before practical use since such cleaning units considerably differ in vibration level and mode. Although the conditions differ depending on the printed board size, ultrasonic cleaning is generally used in the conditions described below as examples: Ultrasonic power: Within 20W/1 Cleaning times: Within 5 minutes 12. Storage Chip inductors should not be stored under high temperature and high humidity conditions. In particular, do not store taping where it is exposed to heat or direct sunlight. Otherwise, the packing material may be deformed, causing problems during mounting. Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ PAGE 8 OF 8 www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.