IDT 2305NZT

IDT2305NZT
2.5V CLOCK BUFFER
COMMERCIAL TEMPERATURE RANGE
IDT2305NZT
2.5V CLOCK BUFFER
FEATURES:
DESCRIPTION:
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The IDT2305NZT is a high-speed clock buffer, designed to address
high-speed clock distribution applications. IDT2305NZT accepts one
reference input, and drives out five low skew clocks.
Clock Distribution
10MHz to 133MHz operating frequency
Distributes one clock input to one bank of five outputs
Output Skew < 250ps
No external RC network required
Operates at 2.5V VDD
Available in SOIC package
Available in commercial and industrial temperature range
FUNCTIONAL BLOCK DIAGRAM
8
CLKOUT
3
REF
1
CLK1
Control
Logic
2
5
7
CLK2
CLK3
CLK4
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
JANUARY 2012
1
c
2011
Integrated Device Technology, Inc.
DSC 7020/4
IDT2305NZT
2.5V CLOCK BUFFER
COMMERCIAL TEMPERATURE RANGE
ABSOLUTE MAXIMUM RATINGS(1)
PIN CONFIGURATION
Symbol
REF
1
8
CLKOUT
CLK2
2
7
CLK4
CLK1
3
6
VDD
GND
4
5
CLK3
Rating
Max.
Unit
VDD
Supply Voltage Range
–0.5 to +4.6
V
VI (2)
Input Voltage Range (REF)
–0.5 to +5.5
V
VI
Input Voltage Range
–0.5 to
V
(except REF)
VDD+0.5
IIK (VI < 0)
Input Clamp Current
–50
mA
IO (VO = 0 to VDD)
Continuous Output Current
±50
mA
VDD or GND
Continuous Current
±100
mA
TA = 55°C
Maximum Power Dissipation
0.7
W
Storage Temperature Range
–65 to +150
°C
Operating
Industrial Temperature
-40 to +85
°C
Temperature
Range
(in still air)(3)
TSTG
SOIC
TOP VIEW
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. The input and output negative-voltage ratings may be exceeded if the input and output
clamp-current ratings are observed.
3. The maximum package power dissipation is calculated using a junction temperature
of 150°C and a board trace length of 750 mils.
APPLICATIONS:
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SDRAM
Telecom
Datacom
PC Motherboards/Workstations
Critical Path Delay Designs
PIN DESCRIPTION
Pin Name
REF
(1)
CLK2(2)
CLK1
(2)
GND
CLK3
(2)
VDD
CLK4
(2)
CLKOUT
(2)
Pin Number
Type
Functional Description
1
IN
2
OUT
Input reference clock, 3.3V tolerant input
Output clock
3
OUT
Output clock
4
GND
Ground
5
OUT
Output clock
6
PWR
2.5V Supply
7
OUT
Output clock
8
OUT
Output clock
NOTES:
1. Weak pull down.
2. Weak pull down on all outputs.
2
IDT2305NZT
2.5V CLOCK BUFFER
COMMERCIAL TEMPERATURE RANGE
OPERATING CONDITIONS
Symbol
VDD
Min.
Max.
Unit
Supply Voltage
Parameter
2.3
2.7
V
TA
Operating Temperature (Ambient Temperature)
-40
+85
°C
CL
Load Capacitance 10MHz - 133MHz
—
15
pF
CIN
Input Capacitance
—
7
pF
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Conditions
Min.
Max.
Unit
VIL
Input LOW Voltage Level
—
0.7
V
VIH
Input HIGH Voltage Level
1.7
—
V
IIL
Input LOW Current
VIN = 0V
—
50
µA
IIH
Input HIGH Current
VIN = VDD
—
100
µA
VOL
Output LOW Voltage
Standard Drive, IOL = 8mA
—
0.3
V
VOH
Output HIGH Voltage
Standard Drive, IOH = -8mA
2
—
V
IDD_PD
Power Down Current
REF = 0MHz
—
12
µA
Supply Current
Unloaded Outputs at 66.66MHz
—
32
mA
IDD
(1,2)
SWITCHING CHARACTERISTICS
Symbol
t1
Parameter
Output Frequency
Conditions
15pF Load
Min.
Typ.
Max.
Unit
10
—
133
MHz
Duty Cycle = t2 ÷ t1
Measured at VDD/2, FOUT = 66.66MHz
40
50
60
%
t3
Rise Time
Measured between 0.7V and 1.7V
—
—
2.5
ns
t4
Fall Time
Measured between 0.7V and 1.7V
—
—
2.5
ns
t5
Output to Output Skew
All outputs equally loaded
—
—
250
ps
t6
Delay, REF Rising Edge to CLKOUT Rising Edge
Measured at VDD/2
—
0
8.7
ns
t7
Device-to-Device Skew
Measured at VDD/2 on the CLKOUT pins of devices
—
0
700
ps
NOTES:
1. REF Input has a threshold voltage of VDD/2.
2. All parameters specified with loaded outputs.
3
IDT2305NZT
2.5V CLOCK BUFFER
COMMERCIAL TEMPERATURE RANGE
TEST CIRCUIT
VDD
0.1µF
CLKOUT
OUTPUTS
CLOAD
VDD
0.1µF
GND
GND
Test Circuit for All Parameters
SWITCHING WAVEFORMS
t1
Output
VDD/2
t2
VDD/2
VDD/2
VDD/2
VDD/2
Output
t5
Output to Output Skew
Duty Cycle Timing
Output
0.7V
t3
1.7V 1.7V
0.7V
2.5V
VDD/2
REF
0V
t4
VDD/2
Output
t6
Input to Output Propagation Delay
All Outputs Rise/Fall Time
CLKOUT
Device 1
CLKOUT
Device 2
VDD/2
t7
VDD/2
Device to Device Skew
4
IDT2305NZT
2.5V CLOCK BUFFER
COMMERCIAL TEMPERATURE RANGE
Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Body)
Symbol
A
A1
B
C
D
E
e
H
h
L
a
5
Millimeters
Min
Max
1.35
1.75
0.1
0.25
0.33
0.51
0.19
0.25
4.8
5
3.8
4
1.27 BASIC
5.8
6.2
0.25
0.5
0.4
1.27
0°
8°
Inches
Min
Max
0.0532
0.0688
0.004
0.0098
0.013
0.02
0.0075
0.0098
0.189
0.1968
0.1497
0.1574
0.050 BASIC
0.2284
0.244
0.01
0.02
0.016
0.05
0°
8°
IDT2305NZT
2.5V CLOCK BUFFER
COMMERCIAL TEMPERATURE RANGE
Ordering Information
Part / Order Number
2305NZT-1DCG
2305NZT-1DCG8
2305NZT-1DCGI
2305NZT-1DCGI8
Shipping Packaging
Tubes
Tape and Reel
Tubes
Tape and Reel
Package
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
Temperature
0 to +70° C
0 to +70° C
-40 to +85° C
-40 to +85° C
"G" after the two-letter package code denotes Pb free configuration, RoHS complaint.
CORPORATE HEADQUARTERS
6024 Silver Creek Valley Road
San Jose, CA 95138
for SALES:
800-345-7015 or 408-284-8200
fax: 408-284-2775
www.idt.com
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for Tech Support:
www.idt.com/go/clockhelp