M27C1024 1 Mbit (64Kb x16) UV EPROM and OTP EPROM 5V ± 10% SUPPLY VOLTAGE in READ OPERATION FAST ACCESS TIME: 35ns LOW POWER CONSUMPTION: – Active Current 35mA at 5MHz – Standby Current 100µA PROGRAMMING VOLTAGE: 12.75V ± 0.25V PROGRAMMING TIME: 100µs/byte (typical) ELECTRONIC SIGNATURE – Manufacturer Code: 0020h – Device Code: 008Ch DESCRIPTION The M27C1024 is a 1 Mbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for microprocessor systems requiring large data or program storage and is organized as 65,536 words of 16 bits. The FDIP40W (window ceramic frit-seal package) has a transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For application where the content is programmed only one time and erasure is not required, the M27C1024 is offered in PDIP40, PLCC44 and TSOP40 (10 x 14mm) packages. Table 1. Signal Names A0-A15 Address Inputs Q0-Q15 Data Outputs E Chip Enable G Output Enable P Program VPP Program Supply VCC Supply Voltage VSS Ground September 1998 40 40 1 1 FDIP40W (F) PDIP40 (B) PLCC44 (C) TSOP40 (N) 10 x 14mm Figure 1. Logic Diagram VCC VPP 16 16 A0-A15 P Q0-Q15 M27C1024 E G VSS AI00702B 1/15 M27C1024 Figure 2A. DIP Pin Connections VCC P NC A15 A14 A13 A12 A11 A10 A9 VSS A8 A7 A6 A5 A4 A3 A2 A1 A0 Q13 Q14 Q15 E VPP NC VCC P NC A15 A14 1 40 2 39 3 38 4 37 5 36 6 35 7 34 8 33 9 32 10 31 M27C1024 30 11 12 29 13 28 14 27 15 26 16 25 17 24 18 23 19 22 20 21 1 44 Q12 Q11 Q10 Q9 Q8 VSS NC Q7 Q6 Q5 Q4 12 M27C1024 34 A13 A12 A11 A10 A9 VSS NC A8 A7 A6 A5 23 Q3 Q2 Q1 Q0 G NC A0 A1 A2 A3 A4 VPP E Q15 Q14 Q13 Q12 Q11 Q10 Q9 Q8 VSS Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 G Figure 2B. LCC Pin Connections AI00704 AI00703 Warning: NC = Not Connected. Warning: NC = Not Connected. Figure 2C. TSOP Pin Connections DEVICE OPERATION The modes of operations of the M27C1024 are listed in the OperatingModes table. A single power supply is required in the read mode. All inputs are TTL levels except for Vpp and 12V on A9 for Electronic Signature. Read Mode The M27C1024 has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (tAVQV) is equalto the delay from E to output (tELQV). Data is available at the output after a delay of tOE from the falling edge of G, assuming that E has been low and the addresses have been stable for at least t AVQV-tGLQV. Standby Mode The M27C1024 has a standby mode which reduces the active current from 35mA to 100µA. The M27C1024 is placed in the standby mode by applying a TTL high signal to the E input. When in the standby mode, the outputs are in a high impedance state, independent of the G input. A9 A10 A11 A12 A13 A14 A15 NC P VCC VPP E DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9 DQ8 1 10 11 40 M27C1024 (Normal) 20 31 30 21 AI01582 Warning: NC = Not Connected. 2/15 VSS A8 A7 A6 A5 A4 A3 A2 A1 A0 G DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 VSS M27C1024 Table 2. Absolute Maximum Ratings (1) Symbol Parameter Ambient Operating Temperature TA Value (3) Unit –40 to 125 °C TBIAS Temperature Under Bias –50 to 125 °C TSTG Storage Temperature –65 to 150 °C Input or Output Voltages (except A9) –2 to 7 V Supply Voltage –2 to 7 V A9 Voltage –2 to 13.5 V Program Supply Voltage –2 to 14 V VIO (2) VCC VA9 (2) VPP Notes: 1. Except for the rating ”Operating Temperature Range”, stresses above those listed in the Table ”Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not i mplied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. 2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns. 3. Depends on range. Table 3. Operating Modes Mode E G P A9 VPP Q0 - Q15 Read VIL VIL VIH X VCC or VSS Data Output Output Disable VIL VIH X X VCC or VSS Hi-Z Program VIL X VIL Pulse X VPP Data Input Verify VIL VIL VIH X VPP Data Output Program Inhibit VIH X X X VPP Hi-Z Standby VIH X X X VCC or VSS Hi-Z Electronic Signature VIL VIL VIH VID VCC Codes Note: X = VIH or VIL, VID = 12V ±0.5V Table 4. Electronic Signature Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data Manufacturer’s Code VIL 0 0 1 0 0 0 0 0 20h Device Code VIH 1 0 0 0 1 1 0 0 8Ch Note: Outputs Q8-Q15 are set to ’0’. 3/15 M27C1024 Table 5. AC Measurement Conditions High Speed Standard Input Rise and Fall Times ≤ 10ns ≤ 20ns Input Pulse Voltages 0 to 3V 0.4V to 2.4V 1.5V 0.8V and 2V Input and Output Timing Ref. Voltages Figure 3. AC Testing Input Output Waveform Figure 4. AC Testing Load Circuit 1.3V High Speed 1N914 3V 1.5V 3.3kΩ 0V DEVICE UNDER TEST Standard 2.4V OUT CL 2.0V 0.8V 0.4V CL = 30pF for High Speed CL = 100pF for Standard AI01822 CL includes JIG capacitance AI01823B Table 6. Capacitance (1) (TA = 25 °C, f = 1 MHz ) Symbol C IN COUT Parameter Test Condition Input Capacitance Output Capacitance Min Max Unit VIN = 0V 6 pF VOUT = 0V 12 pF Note: 1. Sampled only, not 100% tested. Two Line Output Control BecauseEPROMs are usually used in largermemory arrays, this product features a 2 line control function which accommodates the use of multiple memory connection. The two line control function allows: a. the lowest possible memory power dissipation, b. complete assurance that output bus contention will not occur. For the most efficientuse of thesetwo controllines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system 4/15 control bus. This ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device. System Considerations The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the devices. The supply current, ICC, has three segments that are of interest to the system designer : the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of transientcurrent peaks is dependenton the capacitive and inductive loading of the device at the output. M27C1024 Table 7. Read Mode DC Characteristics (1) (TA = 0 to 70 °C, –40 to 85 °C; –40 to 105 °C or –40 to 125 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC) Symbol Parameter Test Condition ILI Input Leakage Current ILO Output Leakage Current ICC Supply Current ICC1 Supply Current (Standby) TTL ICC2 Supply Current (Standby) CMOS IPP Program Current VIL Input Low Voltage Input High Voltage VIH (2) VOL VOH Output Low Voltage Min Max Unit 0V ≤ VIN ≤ VCC ±10 µA 0V ≤ VOUT ≤ VCC ±10 µA E = VIL, G = VIL, IOUT = 0mA, f = 5MHz 35 mA E = VIH 1 mA E > VCC – 0.2V 100 µA VPP = VCC 100 µA –0.3 0.8 V 2 VCC + 1 V 0.4 V IOL = 2.1mA Output High Voltage TTL IOH = –400µA 2.4 V Output High Voltage CMOS IOH = –100µA VCC – 0.7 V Notes: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously with or after V PP. 2. Maximum DC voltage on Output is VCC +0.5V. Table 8A. Read Mode AC Characteristics (1) (TA = 0 to 70 °C, –40 to 85 °C; –40 to 105 °C or –40 to 125 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC) M27C1024 Symbol Alt Parameter Test Condition -35 (3) -45 (3) -55 (3) Unit Min Max Min Max Min Max tAVQV tACC Address Valid to Output Valid E = VIL, G = VIL 35 45 55 ns tELQV tCE Chip Enable Low to Output Valid G = VIL 35 45 55 ns tGLQV 20 25 30 ns tOE Output Enable Low to Output Valid E = VIL (2) tDF Chip Enable High to Output Hi-Z G = VIL 0 30 0 30 0 30 ns tGHQZ (2) tDF Output Enable High to Output Hi-Z E = VIL 0 30 0 30 0 30 ns tAXQX tOH Address Transition to Output Transition E = VIL, G = VIL 0 tEHQZ 0 0 ns Notes: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously with or after V PP. 2. Sampled only, not 100% tested. 3. Speed obtained with High Speed AC measurement conditions. 5/15 M27C1024 Table 8B. Read Mode AC Characteristics (1) (TA = 0 to 70 °C, –40 to 85 °C; –40 to 105 °C or –40 to 125 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC) M27C1024 Symbol Alt Parameter Test Condition -70 -80/-90 -10/-12/ -15/-20 Unit Min Max Min Max Min Max tAVQV tACC Address Valid to Output Valid E = VIL, G = VIL 70 80 100 ns tELQV tCE Chip Enable Low to Output Valid G = VIL 70 80 100 ns tGLQV tOE Output Enable Low to Output Valid E = VIL 35 40 50 ns tEHQZ (2) tDF Chip Enable High to Output Hi-Z G = VIL 0 30 0 30 0 30 ns tGHQZ (2) tDF Output Enable High to Output Hi-Z E = VIL 0 30 0 30 0 30 ns tAXQX tOH Address Transition to Output Transition E = VIL, G = VIL 0 0 0 ns Notes: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously with or after V PP. 2. Sampled only, not 100% tested. Figure 5. Read Mode AC Waveforms A0-A15 VALID tAVQV VALID tAXQX E tGLQV tEHQZ G tELQV Q0-Q15 tGHQZ Hi-Z AI00705B 6/15 M27C1024 Table 9. Programming Mode DC Characteristics (1) (TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V) Symbol Parameter Test Condition Min 0 ≤ VIN ≤ VIH Max Unit ±10 µA 50 mA 50 mA ILI Input Leakage Current ICC Supply Current IPP Program Current VIL Input Low Voltage –0.3 0.8 V V IH Input High Voltage 2 VCC + 0.5 V VOL Output Low Voltage 0.4 V V OH Output High Voltage TTL V ID A9 Voltage E = VIL IOL = 2.1mA IOH = –400µA 2.4 V 11.5 12.5 V Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously with or after V PP. Table 10. Programming Mode AC Characteristics (1) (TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V) Symbol Alt tAVPL tAS Address Valid to Program Low 2 µs tQVPL tDS Input Valid to Program Low 2 µs tVPHPL tVPS VPP High to Program Low 2 µs tVCHPL tVCS VCC High to Program Low 2 µs tELPL tCES Chip Enable Low to Program Low 2 µs tPLPH tPW Program Pulse Width 95 tPHQX tDH Program High to Input Transition 2 µs tQXGL tOES Input Transition to Output Enable Low 2 µs tGLQV tOE Output Enable Low to Output Valid tDFP Output Enable High to Output Hi-Z 0 tAH Output Enable High to Address Transition 0 tGHQZ (2) tGHAX Parameter Test Condition Min Max 105 Unit µs 100 ns 130 ns ns Notes: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously with or after V PP. 2. Sampled only, not 100% tested. 7/15 M27C1024 Figure 6. Programming and Verify Modes AC Waveforms VALID A0-A15 tAVPL Q0-Q15 DATA IN tQVPL DATA OUT tPHQX VPP tVPHPL tGLQV tGHQZ VCC tVCHPL tGHAX E tELPL P tPLPH tQXGL G PROGRAM VERIFY AI00706 DEVICE OPERATION (cont’d) The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1µF ceramic capacitor be used on every device between VCC and VSS. This should be a high frequencycapacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used between Vcc and VSS for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces. Programming When delivered (and after each ’1’s erasure for UV EPROM), all bits of the M27C1024 are in the ’1’ state. Data is introduced by selectively programming ’0’s into the desired bit locations. Although only ’0’s will be programmed,both ’1’s and ’0’s can 8/15 be present in the data word. The only way to change a ’0’ to a ’1’ is by die exposure to ultraviolet light (UV EPROM). The M27C1024 is in the programming mode when VPP input is at 12.75V, E is at VIL and P is pulsed to VIL. The data to be programmed is applied to 16 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6.25V ± 0.25V. PRESTO II Programming Algorithm PRESTO II Programming Algorithm allows programming of the whole array with a guaranteed margin, in a typical time of 6.5 seconds. Programming with PRESTO II consists of applying a sequenceof 100 µs program pulses toeach word until a correct verify occurs (see Figure 7). During programming and verify operation, a MARGIN MODE circuit is automaticallyactivated in order to guarantee that each cell is programmed with enough margin. No overprogrampulse is applied since the verify in MARGIN MODE provides necessary margin to each programmed cell. M27C1024 Figure 7. Programming Flowchart VCC = 6.25V, VPP = 12.75V n=0 P = 100µs Pulse NO ++n = 25 YES FAIL NO ++ Addr VERIFY YES Last Addr NO YES CHECK ALL WORDS 1st: VCC = 6V 2nd: VCC = 4.2V AI00707C Program Inhibit Programming of multiple M27C1024s in parallel with different data is also easily accomplished. Except for E, all like inputs including G of the parallel M27C1024 may be common. A TTL low level pulse applied to a M27C1024’s P input, with E low and VPP at 12.75V, will program that M27C1024. A high level E input inhibits the other M27C1024s from being programmed. Program Verify A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with E and G at VIL, P at VIH, VPP at 12.75V and VCC at 6.25V. On-Board Programming The M27C1024 can be directly programmed in the application circuit. See the relevant Application Note AN620. Electronic Signature The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its correspondingprogramming algorithm. The ES mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the M27C1024. To activate the ES mode, the programming equipmentmust force 11.5Vto 12.5V on address line A9 of the M27C1024 with VPP = VCC = 5V. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All otheraddress lines must be held at VIL during Electronic Signature mode. Byte 0 (A0=VIL) represents the manufacturer code and byte 1 (A0=VIH) the device identifier code. For the STMicroelectronics M27C1024, these two iden-tifier bytes are given in Table 4 and can be read-out on outputs Q0 to Q7. ERASURE OPERATION (applies to UV EPROM) The erasure characteristics of the M27C1024 is such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 Å. It shouldbe notedthat sunlight and some type of fluorescent lamps have wavelengthsin the 3000-4000Å range. Research shows that constant exposure to room level fluorescent lighting could erase a typical M27C1024 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27C1024 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27C1024 window to prevent unintentional erasure. The recommended erasure procedurefor the M27C1024 is exposure to short wave ultraviolet light which has wavelength 2537 Å. The integrated dose (i.e. UV intensity x exposuretime) for erasure should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately 15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. The M27C1024 should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure. 9/15 M27C1024 ORDERING INFORMATION SCHEME Example: Speed M27C1024 -12 X VCC Tolerance C 1 Package X F FDIP40W 1 0 to 70 °C ± 5% B PDIP40 6 –40 to 85 °C 55ns C PLCC44 7 –40 to 105 °C -70 70ns N 3 –40 to 125 °C -80 80ns TSOP40 10 x 14mm -90 90ns -10 100ns -12 120ns -15 150ns -20 200ns -10 100ns 35ns blank -45 (1) 45ns X -55 (1) Option Temperature Range ± 10% -35 (1) X TR Additional Burn-in Tape & Reel Packing Note: 1. High Speed, see AC Characteristics section for further information. For a list of available options (Speed, Package, etc...) or for further informationon any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you. 10/15 M27C1024 FDIP40W - 40 pin Ceramic Frit-seal DIP, with window mm Symb Typ inches Min Max A Typ Min 5.72 Max 0.225 A1 0.51 1.40 0.020 0.055 A2 3.91 4.57 0.154 0.180 A3 3.89 4.50 0.153 0.177 B 0.41 0.56 0.016 0.022 – – – – B1 1.45 0.057 C 0.23 0.30 0.009 0.012 D 51.79 52.60 2.039 2.071 D2 48.26 – – 1.900 – – E 15.24 – – 0.600 – – 13.06 13.36 0.514 0.526 – – 0.100 – – 1.900 E1 e 2.54 eA 14.99 – – eB 16.18 18.03 L 3.18 S 2.49 – – α 4° 11° N 40 8.13 0.320 0.060 0.098 – – 4° 11° 40 A2 A3 A1 B1 – 0.710 0.125 1.52 ∅ – 0.637 B A L e α eA D2 C eB D S N ∅ E1 E 1 FDIPW-a Drawing is not to scale. 11/15 M27C1024 PDIP40 - 40 pin Plastic DIP, 600 mils width mm Symb inches Typ Min Max Typ Min Max A 4.45 – – 0.175 – – A1 0.64 0.38 – 0.025 0.015 – A2 3.56 3.91 0.140 0.154 B 0.38 0.53 0.015 0.021 B1 1.14 1.78 0.045 0.070 C 0.20 0.31 0.008 0.012 D 51.78 52.58 2.039 2.070 – – – – E 14.80 16.26 0.583 0.640 E1 13.46 13.99 0.530 0.551 – D2 48.26 1.900 e1 2.54 – – 0.100 – eA 15.24 – – 0.600 – eB 15.24 17.78 0.600 0.700 L 3.05 3.81 0.120 0.150 S 1.52 2.29 0.060 0.090 α 0° 15° 0É 15° N 40 40 A2 A1 B1 B A L e1 α eA D2 C eB D S N E1 E 1 PDIP Drawing is not to scale. 12/15 M27C1024 PLCC44 - 44 lead Plastic Leaded Chip Carrier, square mm Symb Typ inches Min Max A 4.20 A1 Typ Min Max 4.70 0.165 0.185 2.29 3.04 0.090 0.120 B 0.33 0.53 0.013 0.021 B1 0.66 0.81 0.026 0.032 D 17.40 17.65 0.685 0.695 D1 16.51 16.66 0.650 0.656 D2 14.99 16.00 0.590 0.630 E 17.40 17.65 0.685 0.695 E1 16.51 16.66 0.650 0.656 E2 14.99 16.00 0.590 0.630 e 1.27 – – 0.050 – – j 0.89 – – 0.035 – – N 44 CP 44 0.10 0.004 D D1 A1 A2 1 N B1 E1 E Ne e D2/E2 F B 0.51 (.020) 1.14 (.045) A Nd R CP PLCC Drawing is not to scale. 13/15 M27C1024 TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 14mm mm Symb Typ inches Min Max A Typ Min 1.20 0.047 A1 0.05 0.15 0.002 0.006 A2 0.95 1.05 0.037 0.041 B 0.17 0.27 0.007 0.011 C 0.10 0.21 0.004 0.008 D 13.80 14.20 0.543 0.559 D1 12.30 12.50 0.484 0.492 E 9.90 10.10 0.390 0.398 – – – – L 0.50 0.70 0.020 0.028 α 0° 5° 0° 5° N 40 e 0.50 0.020 40 CP 0.10 0.004 A2 1 N e E B N/2 D1 A CP D DIE C TSOP-a Drawing is not to scale. 14/15 Max A1 α L M27C1024 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Spec ifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 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