M16C/62P Group (M16C/62P, M16C/62PT) SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0001-0241 Rev.2.41 Jan 10, 2006 Overview The M16C/62P Group (M16C/62P, M16C/62PT) of single-chip microcomputers are built using the high performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 80-pin, 100-pin and 128-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high level of instruction efficiency. With 1M bytes of address space, they are capable of executing instructions at high speed. In addition, this microcomputer contains a multiplier and DMAC which combined with fast instruction processing capability, makes it suitable for control of various OA, communication, and industrial equipment which requires highspeed arithmetic/logic operations. 1.1 Applications Audio, cameras, television, home appliance, office/communications/portable/industrial equipment, automobile, etc. Specifications written in this manual are believed to be accurate, but are not guaranteed to be entirely free of error. Specifications in this manual may be changed for functional or performance improvements. Please make sure your manual is the latest edition. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 1 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 1.2 1. Overview Performance Outline Table 1.1 to 1.3 list Performance Outline of M16C/62P Group (M16C/62P, M16C/62PT)(128-pin version). Table 1.1 Performance Outline of M16C/62P Group (M16C/62P, M16C/62PT)(128-pin version) Item CPU Peripheral Function Number of Basic Instructions Minimum Instruction Execution Time Operating Mode Address Space 91 instructions 41.7ns(f(BCLK)=24MHz, VCC1=3.3 to 5.5V) 100ns(f(BCLK)=10MHz, VCC1=2.7 to 5.5V) Single-chip, memory expansion and microprocessor mode Memory Capacity See Table 1.4 to 1.5 Product List Port Multifunction Timer Input/Output : 113 pins, Input : 1 pin Timer A : 16 bits x 5 channels, Timer B : 16 bits x 6 channels, Three phase motor control circuit 3 channels Clock synchronous, UART, I2C bus(1), IEBus(2) 2 channels Clock synchronous 10-bit A/D converter: 1 circuit, 26 channels 8 bits x 2 channels 2 channels CCITT-CRC 15 bits x 1 channel (with prescaler) Internal: 29 sources, External: 8 sources, Software: 4 sources, Priority level: 7 levels 4 circuits Main clock generation circuit (*), Subclock generation circuit (*), On-chip oscillator, PLL synthesizer (*)Equipped with a built-in feedback resistor. Stop detection of main clock oscillation, re-oscillation detection function Available (option(4)) VCC1=3.0 to 5.5 V, VCC2=2.7V to VCC1 (f(BCLK=24MHz) VCC1=2.7 to 5.5 V, VCC2=2.7V to VCC1 (f(BCLK=10MHz) 14 mA (VCC1=VCC2=5V, f(BCLK)=24MHz) 8 mA (VCC1=VCC2=3V, f(BCLK)=10MHz) 1.8µA (VCC1=VCC2=3V, f(XCIN)=32kHz, wait mode) 0.7µA (VCC1=VCC2=3V, stop mode) 3.3±0.3 V or 5.0±0.5 V 100 times (all area) or 1,000 times (user ROM area without block A and block 1) / 10,000 times (block A, block 1) (3) -20 to 85°C, -40 to 85°C (3) 128-pin plastic mold LQFP Serial Interface A/D Converter D/A Converter DMAC CRC Calculation Circuit Watchdog Timer Interrupt Clock Generation Circuit Electric Characteristics Oscillation Stop Detection Function Voltage Detection Circuit Supply Voltage Power Consumption Flash memory version Performance M16C/62P Program/Erase Supply Voltage Program and Erase Endurance Operating Ambient Temperature Package 1 Mbyte (Available to 4 Mbytes by memory space expansion function) NOTES: 1. I2C bus is a registered trademark of Koninklijke Philips Electronics N. V. 2. IEBus is a registered trademark of NEC Electronics Corporation. 3. See Table 1.8 Product Code for the program and erase endurance, and operating ambient temperature. In addition 1,000 times/10,000 times are under development as of Jul., 2005. Please inquire about a release schedule. 4. All options are on request basis. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 2 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.2 Performance Outline of M16C/62P Group (M16C/62P, M16C/62PT)(100-pin version) Item CPU 1. Overview Number of Basic Instructions Minimum Instruction Execution Time Operating Mode Performance M16C/62P M16C/62PT(4) 91 instructions 41.7ns(f(BCLK)=24MHz, VCC1=3.3 to 5.5V) 41.7ns(f(BCLK)=24MHz, VCC1=4.0 to 5.5V) 100ns(f(BCLK)=10MHz, VCC1=2.7 to 5.5V) Single-chip, memory expansion Single-chip and microprocessor mode Address Space 1 Mbyte (Available to 4 Mbytes by 1 Mbyte memory space expansion function) Memory Capacity See Table 1.4 to 1.7 Product List Peripheral Port Input/Output : 87 pins, Input : 1 pin Function Multifunction Timer Timer A : 16 bits x 5 channels, Timer B : 16 bits x 6 channels, Three phase motor control circuit Serial Interface 3 channels Clock synchronous, UART, I2C bus(1), IEBus(2) 2 channels Clock synchronous A/D Converter 10-bit A/D converter: 1 circuit, 26 channels D/A Converter 8 bits x 2 channels DMAC 2 channels CRC Calculation Circuit CCITT-CRC Watchdog Timer 15 bits x 1 channel (with prescaler) Internal: 29 sources, External: 8 sources, Software: 4 sources, Priority level: 7 levels Interrupt Clock Generation Circuit 4 circuits Main clock generation circuit (*), Subclock generation circuit (*), On-chip oscillator, PLL synthesizer (*)Equipped with a built-in feedback resistor. Oscillation Stop Stop detection of main clock oscillation, re-oscillation detection function Detection Function Absent Voltage Detection Circuit Available (option (5)) Electric Supply Voltage VCC1=3.0 to 5.5 V, VCC2=2.7V to VCC1=VCC2=4.0 to 5.5V Characteristics VCC1 (f(BCLK=24MHz) (f(BCLK=24MHz) VCC1=2.7 to 5.5 V, VCC2=2.7V to VCC1 (f(BCLK=10MHz) 14 mA (VCC1=VCC2=5V, f(BCLK)=24MHz) 14 mA (VCC1=VCC2=5V, f(BCLK)=24MHz) Power Consumption 8 mA (VCC1=VCC2=3V, f(BCLK)=10MHz) 2.0µA (VCC1=VCC2=5V, f(XCIN)=32kHz, wait mode) 1.8µA (VCC1=VCC2=3V, f(XCIN)=32kHz, wait mode) 0.8µA (VCC1=VCC2=5V, stop mode) 0.7µA (VCC1=VCC2=3V, stop mode) Flash memory Program/Erase Supply Voltage 3.3±0.3 V or 5.0±0.5 V 5.0±0.5 V version Program and Erase 100 times (all area) Endurance or 1,000 times (user ROM area without block A and block 1) / 10,000 times (block A, block 1) (3) Operating Ambient Temperature -20 to 85°C, T version : -40 to 85°C V version : -40 to 125°C -40 to 85°C (3) Package 100-pin plastic mold QFP, LQFP NOTES: 1. I2C bus is a registered trademark of Koninklijke Philips Electronics N. V. 2. IEBus is a registered trademark of NEC Electronics Corporation. 3. See Table 1.8 and 1.9 Product Code for the program and erase endurance, and operating ambient temperature. In addition 1,000 times/10,000 times are under development as of Jul., 2005. Please inquire about a release schedule. 4. Use the M16C/62PT on VCC1=VCC2 5. All options are on request basis. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 3 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.3 Performance Outline of M16C/62P Group (M16C/62P, M16C/62PT)(80-pin version) Item CPU 1. Overview Number of Basic Instructions Minimum Instruction Execution Time Operating Mode Address Space Performance M16C/62P M16C/62PT(4) 91 instructions 41.7ns(f(BCLK)=24MHz, VCC1=3.3 to 5.5V) 41.7ns(f(BCLK)=24MHz, VCC1=4.0 to 5.5V) 100ns(f(BCLK)=10MHz, VCC1=2.7 to 5.5V) Single-chip mode 1 Mbyte See Table 1.4 to 1.7 Product List Peripheral Port Input/Output : 70 pins, Input : 1 pin Function Multifunction Timer Timer A : 16 bits x 5 channels (Timer A1 and A2 are internal timer), Timer B : 16 bits x 6 channels (Timer B1 is internal timer) Serial Interface 2 channels Clock synchronous, UART, I2C bus(1), IEBus(2) 1 channel Clock synchronous, I2C bus(1), IEBus(2) 2 channels Clock synchronous (1 channel is only transmission) A/D Converter 10-bit A/D converter: 1 circuit, 26 channels D/A Converter 8 bits x 2 channels DMAC 2 channels CRC Calculation Circuit CCITT-CRC Watchdog Timer 15 bits x 1 channel (with prescaler) Internal: 29 sources, External: 5 sources, Software: 4 sources, Priority level: 7 levels Interrupt Clock Generation Circuit 4 circuits Main clock generation circuit (*), Subclock generation circuit (*), On-chip oscillator, PLL synthesizer (*)Equipped with a built-in feedback resistor. Oscillation Stop Stop detection of main clock oscillation, re-oscillation detection function Detection Function Absent Voltage Detection Circuit Available (option (4)) Electric Supply Voltage VCC1=3.0 to 5.5 V, (f(BCLK=24MHz) VCC1=4.0 to 5.5V, (f(BCLK=24MHz) Characteristics VCC1=2.7 to 5.5 V, (f(BCLK=10MHz) Power Consumption 14 mA (VCC1=5V, f(BCLK)=24MHz) 14 mA (VCC1=5V, f(BCLK)=24MHz) 8 mA (VCC1=3V, f(BCLK)=10MHz) 2.0µA (VCC1=5V, f(XCIN)=32kHz, wait mode) 1.8µA (VCC1=3V, f(XCIN)=32kHz, 0.8µA (VCC1=5V, stop mode) wait mode) 0.7µA (VCC1=3V, stop mode) 5.0 ± 0.5V Flash memory Program/Erase Supply Voltage 3.3 ± 0.3V or 5.0 ± 0.5V version Program and Erase 100 times (all area) Endurance or 1,000 times (user ROM area without block A and block 1) / 10,000 times (block A, block 1) (3) Operating Ambient Temperature -20 to 85°C, T version : -40 to 85°C V version : -40 to 125°C -40 to 85°C (3) Memory Capacity Package 80-pin plastic mold QFP NOTES: 1. I2C bus is a registered trademark of Koninklijke Philips Electronics N. V. 2. IEBus is a registered trademark of NEC Electronics Corporation. 3. See Table 1.8 and 1.9 Product Code for the program and erase endurance, and operating ambient temperature. In addition 1,000 times/10,000 times are under development as of Jul., 2005. Please inquire about a release schedule. 4. All options are on request basis. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 4 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 1.3 1. Overview Block Diagram Figure 1.1 is a M16C/62P Group (M16C/62P, M16C/62PT) 128-pin and 100-pin version Block Diagram, Figure 1.2 is a M16C/62P Group (M16C/62P, M16C/62PT) 80-pin version Block Diagram. 8 8 Port P0 8 Port P1 8 Port P2 8 Port P3 8 Port P5 Port P4 A/D converter System clock generation circuit (10 bits X 8 channels Output (timer A): 5 Input (timer B): 6 UART or clock synchronous serial I/O XIN-XOUT XCIN-XCOUT PLL frequency synthesizer On-chip oscillator Clock synchronous serial I/O (8 bits X 2 channels) M16C/60 series16-bit CPU core SB R0L R1L R2 R3 DMAC ISP INTB D/A converter PC FLG Multiplier <VCC1 ports>(4) 8 <VCC2 ports>(4) Port P14 (3) Port P12 (3) 2 8 (8 bits X 2 channels) Port P11 RAM (2) Port P10 A0 A1 FB (2 channels) ROM (1) USP 8 (15 bits) Port P9 R0H R1H Watchdog timer Memory Port P8_5 CRC arithmetic circuit (CCITT ) (Polynomial : X16+X12+X5+1) <VCC1 ports> (4) (8 bits X 3 channels) Three-phase motor control circuit 7 Expandable up to 26 channels) Port P8 Timer (16-bit) 8 Internal peripheral functions Port P6 <VCC1 ports>(4) Port P7 <VCC2 ports>(4) 8 Port P13 (3) 8 (3) 8 NOTES : 1. ROM size depends on microcomputer type. 2. RAM size depends on microcomputer type. 3. Ports P11 to P14 exist only in 128-pin version. 4. Use M16C/62PT on VCC1= VCC2. Figure 1.1 M16C/62P Group (M16C/62P, M16C/62PT) 128-pin and 100-pin version Block Diagram Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 5 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 1. Overview 8 8 Port P0 8 Port P2 Port P3 4 8 Port P4 Port P5 8 Port P6 Internal peripheral functions Timer (16-bit) Expandable up to 26 channels) XIN-XOUT XCIN-XCOUT PLL frequency synthesizer On-chip oscillator UART or clock synchronous serial I/O (2 channels) UART (1 channel) (3) Watchdog timer M16C/60 series16-bit CPU core R0H R1H R0L R1L DMAC (2 channels) D/A converter (8 bits X 2 channels) ISP INTB ROM (1) RAM (2) PC FLG 8 Multiplier Port P10 A0 A1 FB USP Memory 7 R2 R3 SB Port P9 (15 bits) (4) (8 bits X 2 channels) Port P8_5 Clock synchronous serial I/O CRC arithmetic circuit (CCITT ) (Polynomial : X16+X12+X5+1) 7 Port P8 Output (timer A): 5 Input (timer B): 6 System clock generation circuit A/D converter (10 bits X 8 channels 4 Port P7 (4) NOTES : 1. ROM size depends on microcomputer type. 2. RAM size depends on microcomputer type. 3. To use a UART2, set the CRD bit in the U2C0 register to “1” (CTS/RTS function disabled). 4. There is no external connections for port P1, P4_4 to P4_7, P7_2 to P7_5 and P9_1 in 80-pin version. Set the direction bits in these ports to “1” (output mode), and set the output data to “0” (“L”) using the program. Figure 1.2 M16C/62P Group (M16C/62P, M16C/62PT) 80-pin version Block Diagram Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 6 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 1.4 1. Overview Product List Table 1.4 to 1.7 list the product list, Figure 1.3 shows the Type No., Memory Size, and Package, Table 1.8 lists the Product Code of Flash Memory version and ROMless version for M16C/62P, and Table 1.9 lists the Product Code of Flash Memory version for M16C/62PT. Figure 1.4 shows the Marking Diagram of Flash Memory version and ROM-less version for M16C/62P (Top View), and Figure 1.5 shows the Marking Diagram of Flash Memory version for M16C/62PT (Top View) at the time of ROM order. Table 1.4 Product List (1) (M16C/62P) Type No. M30622M6P-XXXFP M30622M6P-XXXGP M30622M8P-XXXFP M30622M8P-XXXGP M30623M8P-XXXGP M30622MAP-XXXFP M30622MAP-XXXGP M30623MAP-XXXGP M30620MCP-XXXFP M30620MCP-XXXGP M30621MCP-XXXGP M30622MEP-XXXFP M30622MEP-XXXGP M30623MEP-XXXGP M30622MGP-XXXFP M30622MGP-XXXGP M30623MGP-XXXGP M30624MGP-XXXFP M30624MGP-XXXGP M30625MGP-XXXGP M30622MWP-XXXFP M30622MWP-XXXGP M30623MWP-XXXGP M30624MWP-XXXFP M30624MWP-XXXGP M30625MWP-XXXGP M30626MWP-XXXFP M30626MWP-XXXGP M30627MWP-XXXGP ROM Capacity RAM Capacity Package Type 48 Kbytes 4 Kbytes PRQP0100JB-A PLQP0100KB-A 64 Kbytes 4 Kbytes PRQP0100JB-A PLQP0100KB-A PRQP0080JA-A 96 Kbytes 5 Kbytes PRQP0100JB-A PLQP0100KB-A PRQP0080JA-A 128 Kbytes 10 Kbytes PRQP0100JB-A PLQP0100KB-A PRQP0080JA-A 192 Kbytes 12 Kbytes PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A 256 Kbytes 12 Kbytes PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A 20 Kbytes PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A 320 Kbytes 16 Kbytes PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A 24 Kbytes PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A 31 Kbytes PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A (D): Under development NOTES: 1. The old package type numbers of each package type are as follows. PLQP0128KB-A : 128P6Q-A, PRQP0100JB-A : 100P6S-A, PLQP0100KB-A : 100P6Q-A, PRQP0080JA-A : 80P6S-A Rev.2.41 Jan 10, 2006 REJ03B0001-0241 As of Dec. 2005 (1) Page 7 of 96 Remarks Mask ROM version M16C/62P Group (M16C/62P, M16C/62PT) Table 1.5 1. Overview Product List (2) (M16C/62P) Type No. M30622MHP-XXXFP M30622MHP-XXXGP M30623MHP-XXXGP M30624MHP-XXXFP M30624MHP-XXXGP M30625MHP-XXXGP M30626MHP-XXXFP M30626MHP-XXXGP M30627MHP-XXXGP M30626MJP-XXXFP M30626MJP-XXXGP M30627MJP-XXXGP M30622F8PFP M30622F8PGP M30623F8PGP M30620FCPFP M30620FCPGP M30621FCPGP M3062LFGPFP(3) M3062LFGPGP(3) M30625FGPGP M30626FHPFP M30626FHPGP M30627FHPGP M30626FJPFP M30626FJPGP M30627FJPGP M30622SPFP M30622SPGP M30620SPFP M30620SPGP M30624SPFP M30624SPGP M30626SPFP M30626SPGP ROM Capacity 384 Kbytes As of Dec. 2005 RAM Capacity 16 Kbytes 24 Kbytes 31 Kbytes (D) 512 Kbytes (D) (D) 64K+4 Kbytes 31 Kbytes 4 Kbytes 128K+4 Kbytes 10 Kbytes (D) 256K+4 Kbytes 20 Kbytes (D) 384K+4 Kbytes 31 Kbytes 512K+4 Kbytes 31 Kbytes − 4 Kbytes 10 Kbytes (D) − (D) (D) (D) 20 Kbytes 31 Kbytes Package Type (1) PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A PRQP0100JB-A PLQP0100KB-A PRQP0080JA-A PRQP0100JB-A PLQP0100KB-A PRQP0080JA-A PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A PRQP0100JB-A PLQP0100KB-A PLQP0128KB-A PRQP0100JB-A PLQP0100KB-A PRQP0100JB-A PLQP0100KB-A PRQP0100JB-A PLQP0100KB-A PRQP0100JB-A PLQP0100KB-A Remarks Mask ROM version Flash memory version (2) ROM-less version (D): Under development NOTES: 1. The old package type numbers of each package type are as follows. PLQP0128KB-A : 128P6Q-A, PRQP0100JB-A : 100P6S-A, PLQP0100KB-A : 100P6Q-A, PRQP0080JA-A : 80P6S-A 2. In the flash memory version, there is 4K bytes area (block A). 3. Please use M3062LFGPFP and M3062LFGPGP for your new system instead of M30624FGPFP and M30624FGPGP. The M16C/62P Group (M16C/62P, M16C/62PT) hardware manual is still good for M30624FGPFP and M30624FGPGP. M30624FGPFP M30624FGPGP Rev.2.41 Jan 10, 2006 REJ03B0001-0241 256K+4 Kbytes 20 Kbytes Page 8 of 96 PRQP0100JB-A Flash memory version PLQP0100KB-A M16C/62P Group (M16C/62P, M16C/62PT) Table 1.6 1. Overview Product List (3) (T version (M16C/62PT)) Type No. M3062CM6T-XXXFP M3062CM6T-XXXGP M3062EM6T-XXXGP M3062CM8T-XXXFP M3062CM8T-XXXGP M3062EM8T-XXXGP M3062CMAT-XXXFP M3062CMAT-XXXGP M3062EMAT-XXXGP M3062AMCT-XXXFP M3062AMCT-XXXGP M3062BMCT-XXXGP M3062CF8TFP M3062CF8TGP M3062AFCTFP M3062AFCTGP M3062BFCTGP M3062JFHTFP M3062JFHTGP RAM Package Type (1) Capacity (D) 48 Kbytes 4 Kbytes PRQP0100JB-A (D) PLQP0100KB-A (P) PRQP0080JA-A (D) 64 Kbytes 4 Kbytes PRQP0100JB-A (D) PLQP0100KB-A (P) PRQP0080JA-A (D) 96 Kbytes 5 Kbytes PRQP0100JB-A (D) PLQP0100KB-A (P) PRQP0080JA-A (D) 128 Kbytes 10 Kbytes PRQP0100JB-A (D) PLQP0100KB-A (P) PRQP0080JA-A (D) 64 K+4 Kbytes 4 Kbytes PRQP0100JB-A PLQP0100KB-A (D) 128K+4 Kbytes 10 Kbytes PRQP0100JB-A (D) PLQP0100KB-A (P) PRQP0080JA-A (D) 384K+4 Kbytes 31 Kbytes PRQP0100JB-A (D) PLQP0100KB-A ROM Capacity (D): Under development (P): Under planning NOTES: 1. The old package type numbers of each package type are as follows. PRQP0100JB-A : 100P6S-A, PLQP0100KB-A : 100P6Q-A, PRQP0080JA-A : 80P6S-A 2. In the flash memory version, there is 4K bytes area (block A). Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 9 of 96 As of Dec. 2005 Remarks Mask ROM T Version version (High reliability 85°C version) Flash memory version (2) M16C/62P Group (M16C/62P, M16C/62PT) Table 1.7 1. Overview Product List (4) (V version (M16C/62PT)) Type No. M3062CM6V-XXXFP M3062CM6V-XXXGP M3062EM6V-XXXGP M3062CM8V-XXXFP M3062CM8V-XXXGP M3062EM8V-XXXGP M3062CMAV-XXXFP M3062CMAV-XXXGP M3062EMAV-XXXGP M3062AMCV-XXXFP M3062AMCV-XXXGP M3062BMCV-XXXGP M3062AFCVFP M3062AFCVGP M3062BFCVGP M3062JFHVFP M3062JFHVGP RAM Package Type(1) Capacity (P) 48 Kbytes 4 Kbytes PRQP0100JB-A (P) PLQP0100KB-A (P) PRQP0080JA-A (P) 64 Kbytes 4 Kbytes PRQP0100JB-A (P) PLQP0100KB-A (P) PRQP0080JA-A (P) 96 Kbytes 5 Kbytes PRQP0100JB-A (P) PLQP0100KB-A (P) PRQP0080JA-A (D) 128 Kbytes 10 Kbytes PRQP0100JB-A (D) PLQP0100KB-A (P) PRQP0080JA-A (D) 128K+4 Kbytes 10 Kbytes PRQP0100JB-A (D) PLQP0100KB-A (P) PRQP0080JA-A (P) 384K+4 Kbytes 31 Kbytes PRQP0100JB-A (P) PLQP0100KB-A ROM Capacity (D): Under development (P): Under planning NOTES: 1. The old package type numbers of each package type are as follows. PLQP0128KB-A : 128P6Q-A, PRQP0100JB-A : 100P6S-A, PLQP0100KB-A : 100P6Q-A, PRQP0080JA-A : 80P6S-A 2. In the flash memory version, there is 4K bytes area (block A). Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 10 of 96 As of Dec. 2005 Remarks Mask ROM V Version version (High reliability 125°C version) Flash memory version (2) M16C/62P Group (M16C/62P, M16C/62PT) Type No. 1. Overview M3062 6 MH P - XXX FP Package type: FP : Package GP : Package PRQP0100JB-A (100P6S-A) PRQP0080JA-A (80P6S-A), PLQP0100KB-A (100P6Q-A), PLQP0128KB-A (128P6Q-A), ROM No. Omitted for flash memory version and ROMless version Classification P : M16C/62P T : T version (M16C/62PT) V : V version (M16C/62PT) ROM capacity: 6: 48 Kbytes 8: 64 Kbytes A: 96 Kbytes C: 128 Kbytes E: 192 Kbytes G: 256 Kbytes W: 320 Kbytes H: 384 Kbytes J: 512 Kbytes Memory type: M: Mask ROM version F: Flash memory version S: ROM-less version Shows RAM capacity, pin count, etc Numeric, Alphabet (L) : M16C/62P Alphabet (L is excluded.) : M16C/62PT M16C/62(P) Group M16C Family Figure 1.3 Type No., Memory Size, and Package Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 11 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.8 Product Code of Flash Memory version and ROMless version for M16C/62P Product Code Flash memory Version 1. Overview D3 D5 Package Internal ROM (User ROM Area Without Block A, Block 1) Program and Erase Endurance Leadincluded Temperature Range 100 Internal ROM (Block A, Block 1) Program and Erase Endurance 0°C to 60°C 100 0°C to 60°C 1,000 10,000 D9 Lead-free 100 100 -40°C to 85°C -40°C to 85°C -20°C to 85°C -20°C to 85°C 0°C to 60°C -40°C to 85°C U5 -20°C to 85°C U7 1,000 10,000 U9 ROM-less version D3 D5 U3 -40°C to 85°C -20°C to 85°C D7 U3 Temperature Range Operating Ambient Temperature Leadincluded − Lead-free − − − -40°C to 85°C -40°C to 85°C -20°C to 85°C -20°C to 85°C − -40°C to 85°C -20°C to 85°C − − − U5 -40°C to 85°C -20°C to 85°C M1 6 C M3 0 6 2 6 F H P F P B D5 XXXXXXX Type No. (See Figure 1.3 Type No., Memory Size, and Package) Chip version and product code B : Shows chip version. Henceforth, whenever it changes a version, it continues with B, C, and D. D5 : Shows Product code. (See table 1.8 Product Code) Date code seven digits The product without marking of chip version of the flash memory version and the ROMless version corresponds to the chip version “A”. Figure 1.4 Marking Diagram of Flash Memory version and ROM-less version for M16C/62P (Top View) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 12 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.9 Product Code of Flash Memory version for M16C/62PT Product Code T Version Flash memory Version 1. Overview B V Version T Version Package Leadincluded B7 Internal ROM (User ROM Area Without Block A, Block 1) Program and Erase Endurance 100 Temperature Range 0°C to 60°C Internal ROM (Block A, Block 1) Program and Erase Endurance 100 0°C to 60°C 1,000 10,000 -40°C to 85°C U Lead-free 100 100 0°C to 60°C U7 1,000 10,000 -40°C to 85°C -40°C to 85°C -40°C to 125°C -40°C to 125°C M1 6 C M3 0 6 2 J F H T F P Y YY X X X X X X X Type No. (See Figure 1.3 Type No., Memory Size, and Package) Date code seven digits Product code. (See table 1.9 Product Code) “ ” : Product code “B” “ P B F ” : Product code “U” “ B 7 ” : Product code “B” “ U 7 ” : Product code “U7” NOTES: 1. : Blank Marking Diagram of Flash Memory version for M16C/62PT (Top View) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 -40°C to 85°C -40°C to 125°C V Version Figure 1.5 -40°C to 85°C -40°C to 125°C -40°C to 125°C V Version T Version -40°C to 85°C -40°C to 125°C V Version T Version Temperature Range Operating Ambient Temperature Page 13 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 1.5 1. Overview Pin Configuration Figures 1.6 to 1.9 show the Pin Configuration (Top View). 102 101 100 P1_0/D8 P0_7/AN0_7/D7 P0_6/AN0_6/D6 P0_5/AN0_5/D5 P0_4/AN0_4/D4 P0_3/AN0_3/D3 P0_2/AN0_2/D2 P0_1/AN0_1/D1 P0_0/AN0_0/D0 P11_7 P11_6 P11_5 P11_4 P11_3 P11_2 P11_1 P11_0 P10_7/AN7/KI3 P10_6/AN6/KI2 P10_5/AN5/KI1 P10_4/AN4/KI0 P10_3/AN3 P10_2/AN2 P10_1/AN1 AVSS P10_0/AN0 P4_4/CS0 P4_5/CS1 P4_6/CS2 P4_7/CS3 P1_3/D11 P1_4/D12 P1_5/D13/INT3 P1_6/D14/INT4 P1_7/D15/INT5 P2_0/AN2_0/A0(/D0/-) P2_1/AN2_1/A1(/D1/D0) P2_2/AN2_2/A2(/D2/D1) P2_3/AN2_3/A3(/D3/D2) P2_4/AN2_4/A4(/D4/D3) P2_5/AN2_5/A5(/D5/D4) P2_6/AN2_6/A6(/D6/D5) P2_7/AN2_7/A7(/D7/D6) VSS P3_0/A8(/-/D7) VCC2 P12_0 P12_1 P12_2 P12_3 P12_4 P3_1/A9 P3_2/A10 P3_3/A11 P3_4/A12 P3_5/A13 P3_6/A14 P3_7/A15 P4_0/A16 P4_1/A17 P4_2/A18 P4_3/A19 P1_1/D9 P1_2/D10 PIN CONFIGURATION (top view) 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 103 104 63 <VCC2> (2) 105 106 62 61 60 59 107 108 109 110 58 57 56 55 54 53 111 112 113 114 M16C/62P Group (M16C/62P) 115 116 52 51 50 49 48 47 117 118 119 120 121 46 45 44 122 123 43 42 41 124 125 126 127 <VCC1> (2) 40 39 128 P12_5 P12_6 P12_7 P5_0/WRL/WR P5_1/WRH/BHE P5_2/RD P5_3/BCLK P13_0 P13_1 P13_2 P13_3 P5_4/HLDA P5_5/HOLD P5_6/ALE P5_7/RDY/CLKOUT P13_4 P13_5 P13_6 P13_7 P6_0/CTS0/RTS0 P6_1/CLK0 P6_2/RXD0/SCL0 P6_3/TXD0/SDA0 P6_4/CTS1/RTS1/CTS0/CLKS1 P6_5/CLK1 VSS NOTES: 1. P7_0 and P7_1 are N channel open-drain output pins. 2. Use the M16C/62PT on VCC1=VCC2. P7_5/TA2IN/W P7_4/TA2OUT/W P7_3/CTS2/RTS2/TA1IN/V P7_2/CLK2/TA1OUT/V P7_1/RXD2/SCL2/TA0IN/TB5IN (1) P7_0/TXD2/SDA2/TA0OUT (1) P6_7/TXD1/SDA1 VCC1 P6_6/RXD1/SCL1 BYTE CNVSS P8_7/XCIN P8_6/XCOUT RESET XOUT VSS XIN VCC1 P8_5/NMI P8_4/INT2/ZP P8_3/INT1 P8_2/INT0 P8_1/TA4IN/U P8_0/TA4OUT/U P7_7/TA3IN P7_6/TA3OUT VREF AVCC P9_7/ADTRG/SIN4 P9_6/ANEX1/SOUT4 P9_5/ANEX0/CLK4 P9_4/DA1/TB4IN P9_3/DA0/TB3IN P9_2/TB2IN/SOUT3 P9_1/TB1IN/SIN3 P9_0/TB0IN/CLK3 P14_1 P14_0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 Package : PLQP0128KB-A (128P6Q-A) Figure 1.6 Pin Configuration (Top View) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 14 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.10 Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 1. Overview Pin Characteristics for 128-Pin Package (1) Control Pin Port Interrupt Pin Timer Pin P9_7 P9_6 P9_5 P9_4 P9_3 P9_2 P9_1 P9_0 P14_1 P14_0 BYTE CNVSS XCIN XCOUT SIN4 SOUT4 CLK4 TB4IN TB3IN TB2IN TB1IN TB0IN P8_5 NMI P8_4 INT2 24 P8_3 INT1 25 P8_2 INT0 26 P8_1 P8_0 P7_7 P7_6 TA4IN/U TA4OUT/U TA3IN TA3OUT P7_5 P7_4 TA2IN/W TA2OUT/W P7_3 P7_2 P7_1 P7_0 P6_7 TA1IN/V TA1OUT/V TA0IN/TB5IN TA0OUT 27 28 29 30 31 32 ZP CTS2/RTS2 CLK2 RXD2/SCL2 TXD2/SDA2 TXD1/SDA1 VCC1 P6_6 RXD1/SCL1 VSS P6_5 CLK1 CTS1/RTS1/CTS0/CLKS1 TXD0/SDA0 RXD0/SCL0 CLK0 P6_0 P13_7 P13_6 P13_5 P13_4 CTS0/RTS0 46 47 48 49 50 P5_7 45 ADTRG ANEX1 ANEX0 DA1 DA0 SOUT3 SIN3 CLK3 P6_4 P6_3 P6_2 P6_1 42 43 44 Bus Control Pin RESET XOUT VSS XIN VCC1 23 41 Analog Pin P8_7 P8_6 22 33 34 35 36 37 38 39 40 UART Pin VREF AVCC Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 15 of 96 RDY/CLKOUT M16C/62P Group (M16C/62P, M16C/62PT) Table 1.11 Pin No. 1. Overview Pin Characteristics for 128-Pin Package (2) Control Pin Port Interrupt Pin Timer Pin UART Pin Analog Pin Bus Control Pin 51 P5_6 ALE 52 P5_5 HOLD 53 HLDA 54 55 56 57 58 P5_4 P13_3 P13_2 P13_1 P13_0 P5_3 59 P5_2 RD 60 P5_1 WRH/BHE 61 WRL/WR 62 63 64 P5_0 P12_7 P12_6 P12_5 65 P4_7 CS3 66 P4_6 CS2 67 P4_5 CS1 68 P4_4 P4_3 P4_2 P4_1 P4_0 P3_7 P3_6 P3_5 P3_4 P3_3 P3_2 P3_1 P12_4 P12_3 P12_2 P12_1 P12_0 CS0 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 P3_0 A8(/-/D7) 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 BCLK VCC2 VSS P2_7 P2_6 P2_5 P2_4 P2_3 P2_2 P2_1 P2_0 AN2_7 AN2_6 AN2_5 AN2_4 AN2_3 AN2_2 AN2_1 AN2_0 A7(/D7/D6) A6(/D6/D5) A5(/D5/D4) A4(/D4/D3) A3(/D3/D2) A2(/D2/D1) A1(/D1/D0) A0(/D0/-) 96 P1_7 INT5 D15 97 P1_6 INT4 D14 98 99 100 P1_5 P1_4 P1_3 INT3 D13 D12 D11 Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 16 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.12 Pin No. 1. Overview Pin Characteristics for 128-Pin Package (3) Control Pin Port Interrupt Pin Timer Pin UART Pin Analog Pin 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 P1_2 P1_1 P1_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 P11_7 P11_6 P11_5 P11_4 P11_3 P11_2 P11_1 P11_0 120 P10_7 KI3 AN7 121 P10_6 KI2 AN6 122 P10_5 KI1 AN5 123 124 125 126 127 128 P10_4 P10_3 P10_2 P10_1 KI0 AN4 AN3 AN2 AN1 AN0_7 AN0_6 AN0_5 AN0_4 AN0_3 AN0_2 AN0_1 AN0_0 AVSS P10_0 Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 17 of 96 AN0 Bus Control Pin D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 M16C/62P Group (M16C/62P, M16C/62PT) 1. Overview P1_0/D8 P1_1/D9 P1_2/D10 P1_3/D11 P1_4/D12 P1_5/D13/INT3 P1_6/D14/INT4 P1_7/D15/INT5 P2_0/AN2_0/A0(/D0/-) P2_1/AN2_1/A1(/D1/D0) P2_2/AN2_2/A2(/D2/D1) P2_3/AN2_3/A3(/D3/D2) P2_4/AN2_4/A4(/D4/D3) P2_5/AN2_5/A5(/D5/D4) P2_6/AN2_6/A6(/D6/D5) P2_7/AN2_7/A7(/D7/D6) VSS P3_0/A8(/-/D7) VCC2 P3_1/A9 P3_2/A10 P3_3/A11 P3_4/A12 P3_5/A13 P3_6/A14 P3_7/A15 P4_0/A16 P4_1/A17 P4_2/A18 P4_3/A19 PIN CONFIGURATION (top view) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 P0_7/AN0_7/D7 P0_6/AN0_6/D6 P0_5/AN0_5/D5 P0_4/AN0_4/D4 P0_3/AN0_3/D3 P0_2/AN0_2/D2 P0_1/AN0_1/D1 P0_0/AN0_0/D0 P10_7/AN7/KI3 P10_6/AN6/KI2 P10_5/AN5/KI1 P10_4/AN4/KI0 P10_3/AN3 P10_2/AN2 P10_1/AN1 AVSS P10_0/AN0 VREF AVCC P9_7/ADTRG/SIN4 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 50 49 48 47 46 45 44 43 <VCC2> (2) M16C/62P Group (M16C/62P, M16C/62PT) <VCC1> (2) 100 42 41 40 39 38 37 36 35 34 33 32 31 P4_4/CS0 P4_5/CS1 P4_6/CS2 P4_7/CS3 P5_0/WRL/WR P5_1/WRH/BHE P5_2/RD P5_3/BCLK P5_4/HLDA P5_5/HOLD P5_6/ALE P5_7/RDY/CLKOUT P6_0/CTS0/RTS0 P6_1/CLK0 P6_2/RXD0/SCL0 P6_3/TXD0/SDA0 P6_4/CTS1/RTS1/CTS0/CLKS1 P6_5/CLK1 P6_6/RXD1/SCL1 P6_7/TXD1/SDA1 P9_6/ANEX1/SOUT4 P9_5/ANEX0/CLK4 P9_4/DA1/TB4IN P9_3/DA0/TB3IN P9_2/TB2IN/SOUT3 P9_1/TB1IN/SIN3 P9_0/TB0IN/CLK3 BYTE CNVSS P8_7/XCIN P8_6/XCOUT RESET XOUT VSS XIN VCC1 P8_5/NMI P8_4/INT2/ZP P8_3/INT1 P8_2/INT0 P8_1/TA4IN/U P8_0/TA4OUT/U P7_7/TA3IN P7_6/TA3OUT P7_5/TA2IN/W P7_4/TA2OUT/W P7_3/CTS2/RTS2/TA1IN/V P7_2/CLK2/TA1OUT/V P7_1/RXD2/SCL2/TA0IN/TB5IN (1) P7_0/TXD2/SDA2/TA0OUT (1) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 NOTES: 1. P7_0 and P7_1 are N channel open-drain output pins. 2. Use the M16C/62PT on VCC1=VCC2. Package : PRQP0100JB-A (100P6S-A) Figure 1.7 Pin Configuration (Top View) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 18 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 1. Overview P1_3/D11 P1_4/D12 P1_5/D13/INT3 P1_6/D14/INT4 P1_7/D15/INT5 P2_0/AN2_0/A0(/D0/-) P2_1/AN2_1/A1(/D1/D0) P2_2/AN2_2/A2(/D2/D1) P2_3/AN2_3/A3(/D3/D2) P2_4/AN2_4/A4(/D4/D3) P2_5/AN2_5/A5(/D5/D4) P2_6/AN2_6/A6(/D6/D5) P2_7/AN2_7/A7(/D7/D6) VSS P3_0/A8(/-/D7) VCC2 P3_1/A9 P3_2/A10 P3_3/A11 P3_4/A12 P3_5/A13 P3_6/A14 P3_7/A15 P4_0/A16 P4_1/A17 PIN CONFIGURATION (top view) 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 P1_2/D10 P1_1/D9 P1_0/D8 P0_7/AN0_7/D7 P0_6/AN0_6/D6 P0_5/AN0_5/D5 P0_4/AN0_4/D4 P0_3/AN0_3/D3 P0_2/AN0_2/D2 P0_1/AN0_1/D1 P0_0/AN0_0/D0 P10_7/AN7/KI3 P10_6/AN6/KI2 P10_5/AN5/KI1 P10_4/AN4/KI0 P10_3/AN3 P10_2/AN2 P10_1/AN1 AVSS P10_0/AN0 VREF AVCC P9_7/ADTRG/SIN4 P9_6/ANEX1/SOUT4 P9_5/ANEX0/CLK4 76 77 78 50 49 48 47 <VCC2> (2) 79 80 81 46 45 44 82 83 84 85 43 42 41 40 86 87 88 89 M16C/62P Group (M16C/62P, M16C/62PT) 39 38 92 93 37 36 35 34 33 94 95 96 32 31 30 90 91 29 97 98 99 28 27 <VCC1> (2) 26 100 P4_2/A18 P4_3/A19 P4_4/CS0 P4_5/CS1 P4_6/CS2 P4_7/CS3 P5_0/WRL/WR P5_1/WRH/BHE P5_2/RD P5_3/BCLK P5_4/HLDA P5_5/HOLD P5_6/ALE P5_7/RDY/CLKOUT P6_0/CTS0/RTS0 P6_1/CLK0 P6_2/RXD0/SCL0 P6_3/TXD0/SDA0 P6_4/CTS1/RTS1/CTS0/CLKS1 P6_5/CLK1 P6_6/RXD1/SCL1 P6_7/TXD1/SDA1 P7_0/TXD2/SDA2/TA0OUT (1) P7_1/RXD2/SCL2/TA0IN/TB5IN (1) P7_2/CLK2/TA1OUT/V P7_3/CTS2/RTS2/TA1IN/V NOTES: 1. P7_0 and P7_1 are N channel open-drain output pins. 2. Use the M16C/62PT on VCC1=VCC2. P8_5/NMI P8_4/INT2/ZP P8_3/INT1 P8_2/INT0 P8_1/TA4IN/U P8_0/TA4OUT/U P7_7/TA3IN P7_6/TA3OUT P7_5/TA2IN/W P7_4/TA2OUT/W P9_4/DA1/TB4IN P9_3/DA0/TB3IN P9_2/TB2IN/SOUT3 P9_1/TB1IN/SIN3 P9_0/TB0IN/CLK3 BYTE CNVSS P8_7/XCIN P8_6/XCOUT RESET XOUT VSS XIN VCC1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Package : PLQP0100KB-A (100P6Q-A) Figure 1.8 Pin Configuration (Top View) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 19 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.13 1. Overview Pin Characteristics for 100-Pin Package (1) Pin No. Control Pin FP GP Port Interrupt Pin Timer Pin 1 2 99 100 P9_6 P9_5 3 4 5 6 7 8 9 10 11 1 2 3 4 5 6 7 8 9 P9_4 TB4IN P9_3 P9_2 P9_1 P9_0 TB3IN TB2IN TB1IN TB0IN 12 13 14 15 16 10 RESET 11 XOUT 12 VSS 13 XIN 14 VCC1 17 15 P8_5 NMI 18 16 P8_4 INT2 19 17 P8_3 INT1 20 18 P8_2 INT0 21 19 22 23 24 20 21 22 P8_1 P8_0 P7_7 P7_6 TA4IN/U TA4OUT/U TA3IN TA3OUT 25 23 26 24 P7_5 P7_4 TA2IN/W TA2OUT/W 27 25 28 29 30 31 32 33 26 27 28 29 30 31 P7_3 P7_2 P7_1 P7_0 P6_7 P6_6 P6_5 TA1IN/V TA1OUT/V TA0IN/TB5IN TA0OUT BYTE CNVSS XCIN XCOUT UART Pin SOUT4 CLK4 Analog Pin Bus Control Pin ANEX1 ANEX0 DA1 DA0 SOUT3 SIN3 CLK3 P8_7 P8_6 ZP CTS2/RTS2 CLK2 RXD2/SCL2 TXD2/SDA2 TXD1/SDA1 RXD1/SCL1 CLK1 34 32 35 33 P6_4 P6_3 CTS1/RTS1/CTS0/CLKS1 TXD0/SDA0 36 34 P6_2 RXD0/SCL0 37 35 P6_1 CLK0 38 36 P6_0 CTS0/RTS0 39 37 P5_7 RDY/CLKOUT 40 38 P5_6 ALE 41 39 P5_5 HOLD 42 40 43 41 P5_4 P5_3 HLAD BCLK 44 42 P5_2 RD 45 43 P5_1 WRH/BHE 46 44 P5_0 WRL/WR 47 45 P4_7 CS3 48 46 P4_6 CS2 49 47 P4_5 CS1 50 48 P4_4 CS0 Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 20 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.14 1. Overview Pin Characteristics for 100-Pin Package (2) Pin No. Control Pin FP GP Port Interrupt Pin Timer Pin UART Pin Analog Pin Bus Control Pin 51 52 49 50 P4_3 P4_2 A19 A18 53 54 51 P4_1 A17 52 P4_0 A16 P3_7 A15 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 53 54 55 56 57 58 59 60 VCC2 61 62 VSS 63 64 65 66 67 68 69 70 P3_6 P3_5 P3_4 P3_3 P3_2 P3_1 A14 A13 A12 A11 A10 A9 P3_0 A8(/-/D7) 73 71 P1_7 INT5 D15 74 72 P1_6 INT4 D14 75 73 INT3 76 77 74 75 P1_5 P1_4 P1_3 D13 D12 D11 78 76 P1_2 D10 79 77 P1_1 D9 80 78 P1_0 81 82 83 84 85 79 80 81 82 83 P0_7 P0_6 P0_5 P0_4 P0_3 AN0_7 AN0_6 AN0_5 AN0_4 AN0_3 D7 D6 D5 D4 D3 86 84 P0_2 AN0_2 D2 87 88 85 86 P0_1 P0_0 AN0_1 AN0_0 D1 D0 89 87 P10_7 KI3 AN7 90 88 P10_6 KI2 AN6 91 89 P10_5 KI1 AN5 92 90 91 92 93 94 AVSS 95 P10_4 P10_3 P10_2 P10_1 KI0 93 94 95 96 97 AN4 AN3 AN2 AN1 98 96 VREF 99 97 AVCC 100 98 55 P2_7 P2_6 P2_5 P2_4 P2_3 P2_2 P2_1 P2_0 AN2_7 AN2_6 AN2_5 AN2_4 AN2_3 AN2_2 AN2_1 AN2_0 D8 P10_0 P9_7 Rev.2.41 Jan 10, 2006 REJ03B0001-0241 A7(/D7/D6) A6(/D6/D5) A5(/D5/D4) A4(/D4/D3) A3(/D3/D2) A2(/D2/D1) A1(/D1/D0) A0(/D0/-) Page 21 of 96 AN0 SIN4 ADTRG M16C/62P Group (M16C/62P, M16C/62PT) 1. Overview P4_1 P4_2 P4_0 P3_7 P3_6 P3_5 P3_4 P3_3 P3_2 P3_1 P2_7/AN2_7 P3_0 P2_6/AN2_6 P2_5/AN2_5 P2_4/AN2_4 P2_3/AN2_3 P2_2/AN2_2 P2_1/AN2_1 P2_0/AN2_0 P0_7/AN0_7 PIN CONFIGURATION (top view) 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 P0_6/AN0_6 P0_5/AN0_5 P0_4/AN0_4 P0_3/AN0_3 P0_2/AN0_2 P0_1/AN0_1 P0_0/AN0_0 P10_7/AN7/KI3 P10_6/AN6/KI2 P10_5/AN5/KI1 P10_4/AN4/KI0 P10_3/AN3 P10_2/AN2 P10_1/AN1 AVSS P10_0/AN0 VREF AVCC 61 40 P4_3 62 39 63 38 64 37 65 36 66 35 67 34 68 33 72 29 73 28 74 27 75 26 76 25 77 24 78 23 P9_7/ADTRG/SIN4 79 22 P5_0 P5_1 P5_2 P5_3 P5_4 P5_5 P5_6 P5_7/CLKOUT P6_0/CTS0/RTS0 P6_1/CLK0 P6_2/RXD0/SCL0 P6_3/TXD0/SDA0 P6_4/CTS1/RTS1/CTS0/CLKS1 P6_5/CLK1 P6_6/RXD1/SCL1 P6_7/TXD1/SDA1 P7_0/TXD2/SDA2/TA0OUT (1) P7_1/RXD2/SCL2/TA0IN/TB5IN P9_6/ANEX1/SOUT4 80 21 P7_6/TA3OUT 69 32 M16C/62P Group (M16C/62P, M16C/62PT) (1) P7_7/TA3IN P8_0/TA4OUT P8_1/TA4IN P8_2/INT0 P8_3/INT1 P9_0/TB0IN/CLK3 CNVSS(BYTE) 9 10 11 12 13 14 15 16 17 18 19 20 P8_4/INT2/ZP P9_2/TB2IN/SOUT3 8 P8_5/NMI P9_3/DA0/TB3IN 7 VCC1 P9_4/DA1/TB4IN 6 XIN 5 VSS 4 XOUT 3 30 RESET 2 31 P8_6/XCOUT 1 P9_5/ANEX0/CLK4 71 P8_7/XCIN 70 NOTES: 1. P7_0 and P7_1 are N channel open-drain output pins. Package : PRQP0080JA-A (80P6S-A) Figure 1.9 Pin Configuration (Top View) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 22 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.15 Pin No. 1. Overview Pin Characteristics for 80-Pin Package (1) Control Pin Port Interrupt Pin Timer Pin 1 2 P9_5 P9_4 3 4 5 P9_3 TB3IN P9_2 P9_0 TB2IN TB0IN 6 7 8 9 10 11 12 13 CNVSS (BYTE) XCIN XCOUT TB4IN Analog Pin Bus Control Pin ANEX0 DA1 DA0 SOUT3 CLK3 P8_7 P8_6 RESET XOUT VSS XIN VCC1 14 P8_5 NMI 15 P8_4 INT2 16 P8_3 INT1 17 P8_2 INT0 18 P8_1 P8_0 19 UART Pin CLK4 ZP TA4IN TA4OUT 20 P7_7 TA3IN 21 22 23 24 25 26 P7_6 P7_1 P7_0 P6_7 P6_6 P6_5 TA3OUT TA0IN/TB5IN TA0OUT 27 28 29 30 P6_4 P6_3 P6_2 P6_1 CTS1/RTS1/CTS0/CLKS1 TXD0/SDA0 RXD0/SCL0 CLK0 31 P6_0 CTS0/RTS0 32 P5_7 33 P5_6 34 P5_5 35 36 P5_4 P5_3 37 P5_2 38 P5_1 39 P5_0 40 P4_3 41 P4_2 42 P4_1 43 P4_0 44 P3_7 45 P3_6 46 P3_5 47 P3_4 48 P3_3 49 P3_2 50 P3_1 Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 23 of 96 RXD2/SCL2 TXD2/SDA2 TXD1/SDA1 RXD1/SCL1 CLK1 CLKOUT M16C/62P Group (M16C/62P, M16C/62PT) Table 1.16 Pin No. 1. Overview Pin Characteristics for 80-Pin Package (2) Control Pin Port Interrupt Pin Timer Pin UART Pin Analog Pin 51 52 P3_0 P2_7 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 P2_6 AN2_6 P2_5 P2_4 P2_3 P2_2 P2_1 P2_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 AN2_5 AN2_4 AN2_3 AN2_2 AN2_1 AN2_0 AN0_7 AN0_6 AN0_5 AN0_4 AN0_3 AN0_2 AN0_1 AN0_0 68 P10_7 KI3 AN7 69 P10_6 KI2 AN6 70 P10_5 KI1 AN5 71 KI0 72 P10_4 P10_3 AN4 AN3 73 P10_2 AN2 P10_1 AN1 P10_0 AN0 74 75 AN2_7 AVSS 76 77 VREF 78 AVCC 79 P9_7 SIN4 ADTRG 80 P9_6 SOUT4 ANEX1 Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 24 of 96 Bus Control Pin M16C/62P Group (M16C/62P, M16C/62PT) 1.6 1. Overview Pin Description Table 1.17 Signal Name Power supply input Analog power supply input Reset input Pin Description (100-pin and 128-pin Version) (1) Pin Name VCC1,VCC2 VSS AVCC AVSS I/O Power Description Type Supply(3) I − Apply 2.7 to 5.5 V to the VCC1 and VCC2 pins and 0 V to the VSS pin. The VCC apply condition is that VCC1 ≥ VCC2. (1, 2) I VCC1 Applies the power supply for the A/D converter. Connect the AVCC pin to VCC1. Connect the AVSS pin to VSS. RESET CNVSS I I VCC1 VCC1 External data bus width select input BYTE I VCC1 Bus control pins (4) D0 to D7 I/O VCC2 D8 to D15 I/O VCC2 A0 to A19 A0/D0 to A7/D7 A1/D0 to A8/D7 O I/O VCC2 VCC2 I/O VCC2 CS0 to CS3 O VCC2 Output CS0 to CS3 signals. CS0 to CS3 are chip-select signals to specify an external space. WRL/WR WRH/BHE RD O VCC2 ALE O VCC2 Output WRL, WRH, (WR, BHE), RD signals. WRL and WRH or BHE and WR can be switched by program. • WRL, WRH and RD are selected The WRL signal becomes "L" by writing data to an even address in an external memory space. The WRH signal becomes "L" by writing data to an odd address in an external memory space. The RD pin signal becomes "L" by reading data in an external memory space. • WR, BHE and RD are selected The WR signal becomes "L" by writing data in an external memory space. The RD signal becomes "L" by reading data in an external memory space. The BHE signal becomes "L" by accessing an odd address. Select WR, BHE and RD for an external 8-bit data bus. ALE is a signal to latch the address. HOLD I VCC2 While the HOLD pin is held "L", the microcomputer is placed in a hold state. HLDA O VCC2 In a hold state, HLDA outputs a "L" signal. RDY I VCC2 While applying a "L" signal to the RDY pin, the microcomputer is placed in a wait state. CNVSS The microcomputer is in a reset state when applying “L” to the this pin. Switches processor mode. Connect this pin to VSS to when after a reset to start up in single-chip mode. Connect this pin to VCC1 to start up in microprocessor mode. Switches the data bus in external memory space. The data bus is 16 bits long when the this pin is held "L" and 8 bits long when the this pin is held "H". Set it to either one. Connect this pin to VSS when an single-chip mode. Inputs and outputs data (D0 to D7) when these pins are set as the separate bus. Inputs and outputs data (D8 to D15) when external 16-bit data bus is set as the separate bus. Output address bits (A0 to A19). Input and output data (D0 to D7) and output address bits (A0 to A7) by timesharing when external 8-bit data bus are set as the multiplexed bus. Input and output data (D0 to D7) and output address bits (A1 to A8) by timesharing when external 16-bit data bus are set as the multiplexed bus. I : Input O : Output I/O : Input and output Power Supply : Power supplies which relate to the external bus pins are separated as VCC2, thus they can be interfaced using the different voltage as VCC1. NOTES: 1. In this manual, hereafter, VCC refers to VCC1 unless otherwise noted. 2. In M16C/62PT, apply 4.0 to 5.5 V to the VCC1 and VCC2 pins. Also the apply condition is that VCC1 = VCC2. 3. When use VCC1 > VCC2, contacts due to some points or restrictions to be checked. 4. Bus control pins in M16C/62PT cannot be used. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 25 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.18 Signal Name Main clock input Main clock output Sub clock input Sub clock output BCLK output (2) Clock output 1. Overview Pin Description (100-pin and 128-pin Version) (2) Pin Name XIN XOUT I/O Power Description Type Supply(1) I VCC1 I/O pins for the main clock generation circuit. Connect a ceramic resonator or crystal oscillator between XIN and XOUT (3). To use O VCC1 the external clock, input the clock from XIN and leave XOUT open. XCIN XCOUT I O VCC1 VCC1 I/O pins for a sub clock oscillation circuit. Connect a crystal oscillator between XCIN and XCOUT (3). To use the external clock, input the clock from XCIN and leave XCOUT open. BCLK CLKOUT VCC2 VCC2 Outputs the BCLK signal. The clock of the same cycle as fC, f8, or f32 is outputted. VCC1 Input pins for the INT interrupt. INT interrupt input INT0 to INT2 O O I NT3 to INT5 I VCC2 NMI interrupt input Key input interrupt input Timer A NMI I VCC1 KI0 to KI3 I VCC1 I/O VCC1 I VCC1 These are timer A0 to timer A4 I/O pins. (however, output of TA0OUT for the N-channel open drain output.) These are timer A0 to timer A4 input pins. I I VCC1 VCC1 Input pin for the Z-phase. These are timer B0 to timer B5 input pins. O VCC1 These are Three-phase motor control output pins. I VCC1 These are send control input pins. O VCC1 These are receive control output pins. I/O VCC1 These are transfer clock I/O pins. I VCC1 These are serial data input pins. I O VCC1 VCC1 O VCC1 These are serial data input pins. These are serial data output pins. (however, output of TXD2 for the N-channel open drain output.) These are serial data output pins. O VCC1 I/O VCC1 I/O VCC1 Timer B TA0OUT to TA4OUT TA0IN to TA4IN ZP TB0IN to TB5IN Three-phase U, U, V, V, motor control W, W output Serial interface CTS0 to CTS2 RTS0 to RTS2 CLK0 to CLK4 RXD0 to RXD2 SIN3, SIN4 TXD0 to TXD2 SOUT3, SOUT4 CLKS1 I2C mode I : Input SDA0 to SDA2 SCL0 to SCL2 O : Output Input pin for the NMI interrupt. Pin states can be read by the P8_5 bit in the P8 register. Input pins for the key input interrupt. This is output pin for transfer clock output from multiple pins function. These are serial data I/O pins. (however, output of SDA2 for the Nchannel open drain output.) These are transfer clock I/O pins. (however, output of SCL2 for the N-channel open drain output.) I/O : Input and output NOTES: 1. When use VCC1 > VCC2, contacts due to some points or restrictions to be checked. 2. This pin function in M16C/62PT cannot be used. 3. Ask the oscillator maker the oscillation characteristic. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 26 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.19 Signal Name Reference voltage input A/D converter Pin Description (100-pin and 128-pin Version) (3) Pin Name VREF AN0 to AN7, AN0_0 to AN0_7, AN2_0 to AN2_7 ADTRG ANEX0 D/A converter I/O port Input port I : Input 1. Overview ANEX1 DA0, DA1 P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7 (2), P13_0 to P13_7 (2) P6_0 to P6_7, P7_0 to P7_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7 (2) P8_0 to P8_4, P8_6, P8_7, P14_0, P14_1(2) P8_5 O : Output I/O Power Description Type Supply(1) I VCC1 Applies the reference voltage for the A/D converter and D/A converter. I VCC1 Analog input pins for the A/D converter. I VCC1 This is an A/D trigger input pin. I/O VCC1 I O I/O VCC1 VCC1 VCC2 This is the extended analog input pin for the A/D converter, and is the output in external op-amp connection mode. This is the extended analog input pin for the A/D converter. This is the output pin for the D/A converter. 8-bit I/O ports in CMOS, having a direction register to select an input or output. Each pin is set as an input port or output port. An input port can be set for a pull-up or for no pull-up in 4-bit unit by program. I/O VCC1 8-bit I/O ports having equivalent functions to P0. (however, output of P7_0 and P7_1 for the N-channel open drain output.) I/O VCC1 I/O ports having equivalent functions to P0. I VCC1 Input pin for the NMI interrupt. Pin states can be read by the P8_5 bit in the P8 register. I/O : Input and output NOTES: 1. When use VCC1 > VCC2, contacts due to some points or restrictions to be checked. 2. Ports P11 to P14 in M16C/62P (100-pin version) and M16C/62PT (100-pin version) cannot be used. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 27 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.20 Signal Name Power supply input Analog power supply input Reset input CNVSS Main clock input Main clock output Sub clock input Sub clock output Clock output 1. Overview Pin Description (80-pin Version) (1) (1) Pin Name I/O Type I Power Supply − AVCC AVSS I VCC1 Applies the power supply for the A/D converter. Connect the AVCC pin to VCC1. Connect the AVSS pin to VSS. RESET CNVSS (BYTE) I I VCC1 VCC1 XIN I VCC1 XOUT O VCC1 The microcomputer is in a reset state when applying “L” to the this pin. Switches processor mode. Connect this pin to VSS to when after a reset to start up in single-chip mode. Connect this pin to VCC1 to start up in microprocessor mode. As for the BYTE pin of the 80-pin versions, pull-up processing is performed within the microcomputer. I/O pins for the main clock generation circuit. Connect a ceramic resonator or crystal oscillator between XIN and XOUT (3). To use the external clock, input the clock from XIN and leave XOUT open. XCIN XCOUT I O VCC1 VCC1 I/O pins for a sub clock oscillation circuit. Connect a crystal oscillator between XCIN and XCOUT (3). To use the external clock, input the clock from XCIN and leave XCOUT open. CLKOUT VCC2 The clock of the same cycle as fC, f8, or f32 is outputted. VCC1 Input pins for the INT interrupt. VCC1, VSS Description Apply 2.7 to 5.5 V to the VCC1 pin and 0 V to the VSS pin. (1, 2) INT interrupt input INT0 to INT2 O I NMI interrupt input Key input interrupt input Timer A NMI I VCC1 Input pin for the NMI interrupt. KI0 to KI3 I VCC1 Input pins for the key input interrupt. I/O VCC1 These are Timer A0,Timer A3 and Timer A4 I/O pins. (however, output of TA0OUT for the N-channel open drain output.) I VCC1 These are Timer A0, Timer A3 and Timer A4 input pins. I I VCC1 VCC1 Input pin for the Z-phase. These are Timer B0, Timer B2 to Timer B5 input pins. Serial interface CTS0 to CTS1 I VCC1 These are send control input pins. RTS0 to RTS1 CLK0, CLK1, CLK3, CLK4 RXD0 to RXD2 SIN4 TXD0 to TXD2 O VCC1 These are receive control output pins. I/O VCC1 These are transfer clock I/O pins. I I O VCC1 VCC1 VCC1 These are serial data input pins. This is serial data input pin. These are serial data output pins. (however, output of TXD2 for the N-channel open drain output.) These are serial data output pins. Timer B I2C mode I : Input TA0OUT, TA3OUT, TA4OUT TA0IN, TA3IN, TA4IN ZP TB0IN, TB2IN to TB5IN SOUT3, SOUT4 CLKS1 O VCC1 O VCC1 SDA0 to SDA2 I/O VCC1 SCL0 to SCL2 I/O VCC1 O : Output This is output pin for transfer clock output from multiple pins function. These are serial data I/O pins. (however, output of SDA2 for the N-channel open drain output.) These are transfer clock I/O pins. (however, output of SCL2 for the N-channel open drain output.) I/O : Input and output NOTES: 1. In this manual, hereafter, VCC refers to VCC1 unless otherwise noted. 2. In M16C/62PT, apply 4.0 to 5.5 V to the VCC1 pin. 3. Ask the oscillator maker the oscillation characteristic. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 28 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 1.21 Signal Name Reference voltage input A/D converter Pin Description (80-pin Version) (2) Pin Name VREF AN0 to AN7, AN0_0 to AN0_7, AN2_0 to AN2_7 ADTRG ANEX0 D/A converter I/O port (1) Input port I : Input 1. Overview ANEX1 DA0, DA1 P0_0 to P0_7, P2_0 to P2_7, P3_0 to P3_7, P5_0 to P5_7, P6_0 to P6_7, P10_0 to P10_7 P8_0 to P8_4, P8_6, P8_7, P9_0, P9_2 to P9_7 P4_0 to P4_3, P7_0, P7_1, P7_6, P7_7 P8_5 O : Output I/O Power Description Type Supply(1) I VCC1 Applies the reference voltage for the A/D converter and D/A converter. I VCC1 Analog input pins for the A/D converter. I VCC1 This is an A/D trigger input pin. I/O VCC1 I O I/O VCC1 VCC1 VCC1 This is the extended analog input pin for the A/D converter, and is the output in external op-amp connection mode. This is the extended analog input pin for the A/D converter. This is the output pin for the D/A converter. 8-bit I/O ports in CMOS, having a direction register to select an input or output. Each pin is set as an input port or output port. An input port can be set for a pull-up or for no pull-up in 4-bit unit by program. I/O VCC1 I/O ports having equivalent functions to P0. I/O VCC1 I/O ports having equivalent functions to P0. (however, output of P7_0 and P7_1 for the N-channel open drain output.) I VCC1 Input pin for the NMI interrupt. Pin states can be read by the P8_5 bit in the P8 register. I/O : Input and output NOTES: 1. There is no external connections for port P1, P4_4 to P4_7, P7_2 to P7_5 and P9_1 in 80-pin version. Set the direction bits in these ports to “1” (output mode), and set the output data to “0” (“L”) using the program. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 29 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 2. 2. Central Processing Unit (CPU) Central Processing Unit (CPU) Figure 2.1 shows the CPU registers. The CPU has 13 registers. Of these, R0, R1, R2, R3, A0, A1 and FB comprise a register bank. There are two register banks. b31 b15 b8 b7 R2 R0H R3 R1H b0 R0L R1L Data Registers (1) R2 R3 A0 Address Registers (1) A1 FB b19 b15 Frame Base Registers (1) b0 INTBH Interrupt Table Register INTBL b19 b0 Program Counter PC b15 b0 USP User Stack Pointer ISP Interrupt Stack Pointer SB Static Base Register b15 b0 FLG b15 b8 IPL b7 U I Flag Register b0 O B S Z D C Carry Flag Debug Flag Zero Flag Sign Flag Register Bank Select Flag Overflow Flag Interrupt Enable Flag Stack Pointer Select Flag Reserved Area Processor Interrupt Priority Level Reserved Area NOTES: 1. These registers comprise a register bank. There are two register banks. Figure 2.1 2.1 Central Processing Unit Register Data Registers (R0, R1, R2 and R3) The R0 register consists of 16 bits, and is used mainly for transfers and arithmetic/logic operations. R1 to R3 are the same as R0. The R0 register can be separated between high (R0H) and low (R0L) for use as two 8-bit data registers. R1H and R1L are the same as R0H and R0L. Conversely, R2 and R0 can be combined for use as a 32-bit data register (R2R0). R3R1 is the same as R2R0. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 30 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 2.2 2. Central Processing Unit (CPU) Address Registers (A0 and A1) The register A0 consists of 16 bits, and is used for address register indirect addressing and address register relative addressing. They also are used for transfers and logic/logic operations. A1 is the same as A0. In some instructions, registers A1 and A0 can be combined for use as a 32-bit address register (A1A0). 2.3 Frame Base Register (FB) FB is configured with 16 bits, and is used for FB relative addressing. 2.4 Interrupt Table Register (INTB) INTB is configured with 20 bits, indicating the start address of an interrupt vector table. 2.5 Program Counter (PC) PC is configured with 20 bits, indicating the address of an instruction to be executed. 2.6 User Stack Pointer (USP) and Interrupt Stack Pointer (ISP) Stack pointer (SP) comes in two types: USP and ISP, each configured with 16 bits. Your desired type of stack pointer (USP or ISP) can be selected by the U flag of FLG. 2.7 Static Base Register (SB) SB is configured with 16 bits, and is used for SB relative addressing. 2.8 Flag Register (FLG) FLG consists of 11 bits, indicating the CPU status. 2.8.1 Carry Flag (C Flag) This flag retains a carry, borrow, or shift-out bit that has occurred in the arithmetic/logic unit. 2.8.2 Debug Flag (D Flag) The D flag is used exclusively for debugging purpose. During normal use, it must be set to “0”. 2.8.3 Zero Flag (Z Flag) This flag is set to “1” when an arithmetic operation resulted in 0; otherwise, it is “0”. 2.8.4 Sign Flag (S Flag) This flag is set to “1” when an arithmetic operation resulted in a negative value; otherwise, it is “0”. 2.8.5 Register Bank Select Flag (B Flag) Register bank 0 is selected when this flag is “0” ; register bank 1 is selected when this flag is “1”. 2.8.6 Overflow Flag (O Flag) This flag is set to “1” when the operation resulted in an overflow; otherwise, it is “0”. 2.8.7 Interrupt Enable Flag (I Flag) This flag enables a maskable interrupt. Maskable interrupts are disabled when the I flag is “0”, and are enabled when the I flag is “1”. The I flag is cleared to “0” when the interrupt request is accepted. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 31 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 2.8.8 2. Central Processing Unit (CPU) Stack Pointer Select Flag (U Flag) ISP is selected when the U flag is “0”; USP is selected when the U flag is “1”. The U flag is cleared to “0” when a hardware interrupt request is accepted or an INT instruction for software interrupt Nos. 0 to 31 is executed. 2.8.9 Processor Interrupt Priority Level (IPL) IPL is configured with three bits, for specification of up to eight processor interrupt priority levels from level 0 to level 7. If a requested interrupt has priority greater than IPL, the interrupt is enabled. 2.8.10 Reserved Area When write to this bit, write “0”. When read, its content is indeterminate. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 32 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 3. 3. Memory Memory Figure 3.1 is a Memory Map of the M16C/62P group. The address space extends the 1M bytes from address 00000h to FFFFFh. The internal ROM is allocated in a lower address direction beginning with address FFFFFh. For example, a 64-Kbyte internal ROM is allocated to the addresses from F0000h to FFFFFh. As for the flash memory version, 4-Kbyte space (block A) exists in 0F000h to 0FFFFh. 4-Kbyte space is mainly for storing data. In addition to storing data, 4-Kbyte space also can store programs. The fixed interrupt vector table is allocated to the addresses from FFFDCh to FFFFFh. Therefore, store the start address of each interrupt routine here. The internal RAM is allocated in an upper address direction beginning with address 00400h. For example, a 10-Kbyte internal RAM is allocated to the addresses from 00400h to 02BFFh. In addition to storing data, the internal RAM also stores the stack used when calling subroutines and when interrupts are generated. The SRF is allocated to the addresses from 00000h to 003FFh. Peripheral function control registers are located here. Of the SFR, any area which has no functions allocated is reserved for future use and cannot be used by users. The special page vector table is allocated to the addresses from FFE00h to FFFDBh. This vector is used by the JMPS or JSRS instruction. For details, refer to the M16C/60 and M16C/20 Series Software Manual. In memory expansion and microprocessor modes, some areas are reserved for future use and cannot be used by users. Use M16C/62P (80-pin version) and M16C/62PT in single-chip mode. The memory expansion and microprocessor modes cannot be used . 00000h SFR 00400h Internal RAM XXXXXh Reserved area (1) FFE00h 0F000h Internal ROM (data area) (3) 0FFFFh Special page vector table 10000h Internal RAM Internal ROM (3) Address XXXXXh Size Address YYYYYh 4 Kbytes 013FFh 48 Kbytes F4000h 5 Kbytes 017FFh 64 Kbytes F0000h 10 Kbytes 02BFFh 96 Kbytes E8000h 12 Kbytes 033FFh 128 Kbytes E0000h 16 Kbytes 043FFh 192 Kbytes D0000h 20 Kbytes 053FFh 256 Kbytes C0000h 24 Kbytes 063FFh 320 Kbytes B0000h 31 Kbytes 07FFFh 384 Kbytes A0000h 512 Kbytes 80000h Size External area 27000h Reserved area Memory Map Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 33 of 96 Overflow External area 80000h Reserved area (2) YYYYYh Internal ROM (program area) (5) FFFFFh NOTES: 1. During memory expansion and microprocessor modes, can be used. 2. In memory expansion mode, can be used. 3. As for the flash memory version, 4-Kbyte space (block A) exists. 4. Shown here is a memory map for the case where the PM10 bit in the PM1 register is “1” and the PM13 bit in the PM1 register is “1”. 5. When using the masked ROM version, write nothing to internal ROM area. Figure 3.1 FFFDCh Undefined instruction 28000h FFFFFh BRK instruction Address match Single step Watchdog timer DBC NMI Reset M16C/62P Group (M16C/62P, M16C/62PT) 4. 4. Special Function Register (SFR) Special Function Register (SFR) SFR(Special Function Register) is the control register of peripheral functions. Tables 4.1 to 4.6 list the SFR information. Table 4.1 SFR Information (1) (1) Address 0000h 0001h 0002h 0003h 0004h 0005h 0006h 0007h 0008h 0009h 000Ah 000Bh 000Ch 000Dh 000Eh 000Fh 0010h 0011h 0012h 0013h 0014h 0015h 0016h 0017h 0018h 0019h 001Ah 001Bh 001Ch 001Dh 001Eh 001Fh 0020h 0021h 0022h 0023h 0024h 0025h 0026h 0027h 0028h 0029h 002Ah 002Bh 002Ch 002Dh 002Eh 002Fh 0030h 0031h 0032h 0033h 0034h 0035h 0036h 0037h 0038h 0039h 003Ah 003Bh 003Ch 003Dh 003Eh 003Fh NOTES: 1. 2. 3. 4. 5. 6. Register Symbol After Reset Processor Mode Register 0 (2) PM0 00000000b(CNVSS pin is “L”) 00000011b(CNVSS pin is “H”) Processor Mode Register 1 System Clock Control Register 0 System Clock Control Register 1 Chip Select Control Register (6) Address Match Interrupt Enable Register Protect Register Data Bank Register (6) Oscillation Stop Detection Register (3) PM1 CM0 CM1 CSR AIER PRCR DBR CM2 00001000b 01001000b 00100000b 00000001b XXXXXX00b XX000000b 00h 0X000000b Watchdog Timer Start Register Watchdog Timer Control Register Address Match Interrupt Register 0 WDTS WDC RMAD0 XXh 00XXXXXXb (4) 00h 00h X0h Address Match Interrupt Register 1 RMAD1 00h 00h X0h Voltage Detection Register 1 (5, 6) Voltage Detection Register 2 (5, 6) Chip Select Expansion Control Register (6) PLL Control Register 0 VCR1 VCR2 CSE PLC0 00001000b 00h 00h 0001X010b Processor Mode Register 2 Low Voltage Detection Interrupt Register (6) DMA0 Source Pointer PM2 D4INT SAR0 XXX00000b 00h XXh XXh XXh DMA0 Destination Pointer DAR0 XXh XXh XXh DMA0 Transfer Counter TCR0 XXh XXh DMA0 Control Register DM0CON 00000X00b DMA1 Source Pointer SAR1 XXh XXh XXh DMA1 Destination Pointer DAR1 XXh XXh XXh DMA1 Transfer Counter TCR1 XXh XXh DMA1 Control Register DM1CON 00000X00b The blank areas are reserved and cannot be accessed by users. The PM00 and PM01 bits do not change at software reset, watchdog timer reset and oscillation stop detection reset. The CM20, CM21, and CM27 bits do not change at oscillation stop detection reset. The WDC5 bit is “0” (cold start) immediately after power-on. I t can only be set to “1” in a program. This register does not change at software reset, watchdog timer reset and oscillation stop detection reset. This register in M16C/62PT cannot be used. X : Nothing is mapped to this bit Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 34 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 4.2 Address 0040h 0041h 0042h 0043h 0044h 0045h 0046h 0047h 0048h 0049h 004Ah 004Bh 004Ch 004Dh 004Eh 004Fh 0050h 0051h 0052h 0053h 0054h 0055h 0056h 0057h 0058h 0059h 005Ah 005Bh 005Ch 005Dh 005Eh 005Fh 0060h 0061h 0062h 0063h 0064h 0065h 0066h 0067h 0068h 0069h 006Ah 006Bh 006Ch 006Dh 006Eh 006Fh 0070h 0071h 0072h 0073h 0074h 0075h 0076h 0077h 0078h 0079h 007Ah 007Bh 007Ch 007Dh 007Eh 007Fh 4. Special Function Register (SFR) SFR Information (2) (1) Register INT3 Interrupt Control Register Timer B5 Interrupt Control Register Timer B4 Interrupt Control Register, UART1 BUS Collision Detection Interrupt Control Register Timer B3 Interrupt Control Register, UART0 BUS Collision Detection Interrupt Control Register SI/O4 Interrupt Control Register, INT5 Interrupt Control Register SI/O3 Interrupt Control Register, INT4 Interrupt Control Register UART2 Bus Collision Detection Interrupt Control Register DMA0 Interrupt Control Register DMA1 Interrupt Control Register Key Input Interrupt Control Register A/D Conversion Interrupt Control Register UART2 Transmit Interrupt Control Register UART2 Receive Interrupt Control Register UART0 Transmit Interrupt Control Register UART0 Receive Interrupt Control Register UART1 Transmit Interrupt Control Register UART1 Receive Interrupt Control Register Timer A0 Interrupt Control Register Timer A1 Interrupt Control Register Timer A2 Interrupt Control Register Timer A3 Interrupt Control Register Timer A4 Interrupt Control Register Timer B0 Interrupt Control Register Timer B1 Interrupt Control Register Timer B2 Interrupt Control Register INT0 Interrupt Control Register INT1 Interrupt Control Register INT2 Interrupt Control Register NOTES: 1. The blank areas are reserved and cannot be accessed by users. X : Nothing is mapped to this bit Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 35 of 96 Symbol INT3IC TB5IC TB4IC, U1BCNIC TB3IC, U0BCNIC S4IC, INT5IC S3IC, INT4IC BCNIC DM0IC DM1IC KUPIC ADIC S2TIC S2RIC S0TIC S0RIC S1TIC S1RIC TA0IC TA1IC TA2IC TA3IC TA4IC TB0IC TB1IC TB2IC INT0IC INT1IC INT2IC After Reset XX00X000b XXXXX000b XXXXX000b XXXXX000b XX00X000b XX00X000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XX00X000b XX00X000b XX00X000b M16C/62P Group (M16C/62P, M16C/62PT) Table 4.3 Address 0080h 0081h 0082h 0083h 0084h 0085h 0086h 0087h to 01AFh 01B0h 01B1h 01B2h 01B3h 01B4h 01B5h 01B6h 01B7h 01B8h 01B9h 01BAh 01BBh 01BCh 01BDh 01BEh 01C0h to 024Fh 0250h 0251h 0252h 0253h 0254h 0255h 0256h 0257h 0258h 0259h 025Ah 025Bh 025Ch 025Dh 025Eh 025Fh 0260h to 032Fh 0330h 0331h 0332h 0333h 0334h 0335h 0336h 0337h 0338h 0339h 033Ah 033Bh 033Ch 033Dh 033Eh 033Fh 4. Special Function Register (SFR) SFR Information (3) (1) Register Symbol After Reset Flash Identification Register (2) Flash Memory Control Register 1 (2) FIDR FMR1 XXXXXX00b 0X00XX0Xb Flash Memory Control Register 0 (2) Address Match Interrupt Register 2 FMR0 RMAD2 Address Match Interrupt Enable Register 2 Address Match Interrupt Register 3 AIER2 RMAD3 00000001b 00h 00h XXh XXXXXX00b 00h 00h XXh Peripheral Clock Select Register PCLKR NOTES: 1. The blank areas are reserved and cannot be accessed by users. 2. This register is included in the flash memory version. X : Nothing is mapped to this bit Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 36 of 96 00000011b M16C/62P Group (M16C/62P, M16C/62PT) Table 4.4 Address 0340h 0341h 0342h 0343h 0344h 0345h 0346h 0347h 0348h 0349h 034Ah 034Bh 034Ch 034Dh 034Eh 034Fh 0350h 0351h 0352h 0353h 0354h 0355h 0356h 0357h 0358h 0359h 035Ah 035Bh 035Ch 035Dh 035Eh 035Fh 0360h 0361h 0362h 0363h 0364h 0365h 0366h 0367h 0368h 0369h 036Ah 036Bh 036Ch 036Dh 036Eh 036Fh 0370h 0371h 0372h 0373h 0374h 0375h 0376h 0377h 0378h 0379h 037Ah 037Bh 037Ch 037Dh 037Eh 037Fh 4. Special Function Register (SFR) SFR Information (4) (1) Register Symbol After Reset 000XXXXXb Timer B3, 4, 5 Count Start Flag TBSR Timer A1-1 Register TA11 Timer A2-1 Register TA21 Timer A4-1 Register TA41 Three-Phase PWM Control Register 0 Three-Phase PWM Control Register 1 Three-Phase Output Buffer Register 0 Three-Phase Output Buffer Register 1 Dead Time Timer Timer B2 Interrupt Occurrence Frequency Set Counter INVC0 INVC1 IDB0 IDB1 DTT ICTB2 Timer B3 Register TB3 Timer B4 Register TB4 Timer B5 Register TB5 Timer B3 Mode Register Timer B4 Mode Register Timer B5 Mode Register Interrupt Factor Select Register 2 Interrupt Factor Select Register SI/O3 Transmit/Receive Register TB3MR TB4MR TB5MR IFSR2A IFSR S3TRR 00XX0000b 00XX0000b 00XX0000b 00XXXXXXb 00h XXh SI/O3 Control Register SI/O3 Bit Rate Generator SI/O4 Transmit/Receive Register S3C S3BRG S4TRR 01000000b XXh XXh SI/O4 Control Register SI/O4 Bit Rate Generator S4C S4BRG 01000000b XXh UART0 Special Mode Register 4 UART0 Special Mode Register 3 UART0 Special Mode Register 2 UART0 Special Mode Register UART1 Special Mode Register 4 UART1 Special Mode Register 3 UART1 Special Mode Register 2 UART1 Special Mode Register UART2 Special Mode Register 4 UART2 Special Mode Register 3 UART2 Special Mode Register 2 UART2 Special Mode Register UART2 Transmit/Receive Mode Register UART2 Bit Rate Generator UART2 Transmit Buffer Register U0SMR4 U0SMR3 U0SMR2 U0SMR U1SMR4 U1SMR3 U1SMR2 U1SMR U2SMR4 U2SMR3 U2SMR2 U2SMR U2MR U2BRG U2TB UART2 Transmit/Receive Control Register 0 UART2 Transmit/Receive Control Register 1 UART2 Receive Buffer Register U2C0 U2C1 U2RB 00h 000X0X0Xb X0000000b X0000000b 00h 000X0X0Xb X0000000b X0000000b 00h 000X0X0Xb X0000000b X0000000b 00h XXh XXh XXh 00001000b 00000010b XXh XXh NOTES: 1. The blank areas are reserved and cannot be accessed by users. X : Nothing is mapped to this bit Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 37 of 96 XXh XXh XXh XXh XXh XXh 00h 00h 00h 00h XXh XXh XXh XXh XXh XXh XXh XXh M16C/62P Group (M16C/62P, M16C/62PT) Table 4.5 Address 0380h 0381h 0382h 0383h 0384h 0385h 0386h 0387h 0388h 0389h 038Ah 038Bh 038Ch 038Dh 038Eh 038Fh 0390h 0391h 0392h 0393h 0394h 0395h 0396h 0397h 0398h 0399h 039Ah 039Bh 039Ch 039Dh 039Eh 039Fh 03A0h 03A1h 03A2h 03A3h 03A4h 03A5h 03A6h 03A7h 03A8h 03A9h 03AAh 03ABh 03ACh 03ADh 03AEh 03AFh 03B0h 03B1h 03B2h 03B3h 03B4h 03B5h 03B6h 03B7h 03B8h 03B9h 03BAh 03BBh 03BCh 03BDh 03BEh 03BFh 4. Special Function Register (SFR) SFR Information (5) (1) Count Start Flag Clock Prescaler Reset Fag One-Shot Start Flag Trigger Select Register Up-Down Flag Register Symbol TABSR CPSRF ONSF TRGSR UDF After Reset 00h 0XXXXXXXb 00h 00h 00h (2) Timer A0 Register TA0 Timer A1 Register TA1 Timer A2 Register TA2 Timer A3 Register TA3 Timer A4 Register TA4 Timer B0 Register TB0 Timer B1 Register TB1 Timer B2 Register TB2 Timer A0 Mode Register Timer A1 Mode Register Timer A2 Mode Register Timer A3 Mode Register Timer A4 Mode Register Timer B0 Mode Register Timer B1 Mode Register Timer B2 Mode Register Timer B2 Special Mode Register TA0MR TA1MR TA2MR TA3MR TA4MR TB0MR TB1MR TB2MR TB2SC XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh 00h 00h 00h 00h 00h 00XX0000b 00XX0000b 00XX0000b XXXXXX00b UART0 Transmit/Receive Mode Register UART0 Bit Rate Generator UART0 Transmit Buffer Register U0MR U0BRG U0TB UART0 Transmit/Receive Control Register 0 UART0 Transmit/Receive Control Register 1 UART0 Receive Buffer Register U0C0 U0C1 U0RB UART1 Transmit/Receive Mode Register UART1 Bit Rate Generator UART1 Transmit Buffer Register U1MR U1BRG U1TB UART1 Transmit/Receive Control Register 0 UART1 Transmit/Receive Control Register 1 UART1 Receive Buffer Register U1C0 U1C1 U1RB UART Transmit/Receive Control Register 2 UCON 00h XXh XXh XXh 00001000b 00XX0010b XXh XXh 00h XXh XXh XXh 00001000b 00XX0010b XXh XXh X0000000b DMA0 Request Factor Select Register DM0SL 00h DMA1 Request Factor Select Register DM1SL 00h CRC Data Register CRCD CRC Input Register CRCIN XXh XXh XXh NOTES: 1. The blank areas are reserved and cannot be accessed by users. 2. Bit 5 in the Up-down flag is “0” by reset. However, The values in these bits when read are indeterminate. X : Nothing is mapped to this bit Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 38 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 4.6 Address 03C0h 03C1h 03C2h 03C3h 03C4h 03C5h 03C6h 03C7h 03C8h 03C9h 03CAh 03CBh 03CCh 03CDh 03CEh 03CFh 03D0h 03D1h 03D2h 03D3h 03D4h 03D5h 03D6h 03D7h 03D8h 03D9h 03DAh 03DBh 03DCh 03DDh 03DEh 03DFh 03E0h 03E1h 03E2h 03E3h 03E4h 03E5h 03E6h 03E7h 03E8h 03E9h 03EAh 03EBh 03ECh 03EDh 03EEh 03EFh 03F0h 03F1h 03F2h 03F3h 03F4h 03F5h 03F6h 03F7h 03F8h 03F9h 03FAh 03FBh 03FCh 03FDh 03FEh 03FFh 4. Special Function Register (SFR) SFR Information (6) (1) Register Symbol After Reset A/D Register 0 AD0 XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh XXh A/D Register 1 AD1 A/D Register 2 AD2 A/D Register 3 AD3 A/D Register 4 AD4 A/D Register 5 AD5 A/D Register 6 AD6 A/D Register 7 AD7 A/D Control Register 2 ADCON2 00h A/D Control Register 0 A/D Control Register 1 D/A Register 0 ADCON0 ADCON1 DA0 00000XXXb 00h 00h D/A Register 1 DA1 00h D/A Control Register DACON 00h Port P14 Control Register (3) Pull-Up Control Register 3 (3) Port P0 Register Port P1 Register Port P0 Direction Register Port P1 Direction Register Port P2 Register Port P3 Register Port P2 Direction Register Port P3 Direction Register Port P4 Register Port P5 Register Port P4 Direction Register Port P5 Direction Register Port P6 Register Port P7 Register Port P6 Direction Register Port P7 Direction Register Port P8 Register Port P9 Register Port P8 Direction Register Port P9 Direction Register Port P10 Register Port P11 Register (3) Port P10 Direction Register Port P11 Direction Register (3) Port P12 Register (3) Port P13 Register (3) Port P12 Direction Register (3) Port P13 Direction Register (3) Pull-Up Control Register 0 Pull-Up Control Register 1 PC14 PUR3 P0 P1 PD0 PD1 P2 P3 PD2 PD3 P4 P5 PD4 PD5 P6 P7 PD6 PD7 P8 P9 PD8 PD9 P10 P11 PD10 PD11 P12 P13 PD12 PD13 PUR0 PUR1 Pull-Up Control Register 2 Port Control Register PUR2 PCR XX00XXXXb 00h XXh XXh 00h 00h XXh XXh 00h 00h XXh XXh 00h 00h XXh XXh 00h 00h XXh XXh 00X00000b 00h XXh XXh 00h 00h XXh XXh 00h 00h 00h 00000000b (2) 00000010b (2) 00h 00h NOTES: 1. The blank areas are reserved and cannot be accessed by users. 2. At hardware reset 1 or hardware reset 2, the register is as follows: • “00000000b” where “L” is inputted to the CNVSS pin • “00000010b” where “H” is inputted to the CNVSS pin At software reset, watchdog timer reset and oscillation stop detection reset, the register is as follows: • “00000000b” where the PM01 to PM00 bits in the PM0 register are “00b” (single-chip mode). • “00000010b” where the PM01 to PM00 bits in the PM0 register are “01b” (memory expansion mode) or “11b” (microprocessor mode). 3. These registers do not exist in M16C/62P (80-pin version), and M16C/62PT (80-pin version). X : Nothing is mapped to this bit Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 39 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 5. 5. Electrical Characteristics Electrical Characteristics 5.1 Electrical Characteristics (M16C/62P) Table 5.1 Symbol VCC1, VCC2 VCC2 AVCC VI VO Pd Topr Tstg Absolute Maximum Ratings Parameter Supply Voltage Supply Voltage Analog Supply Voltage Input Voltage RESET, CNVSS, BYTE, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1, VREF, XIN P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 P7_0, P7_1 Output Voltage P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1, XOUT P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 P7_0, P7_1 Power Dissipation Operating When the Microcomputer is Operating Ambient Temperature Flash Program Erase Storage Temperature Condition VCC1=AVCC VCC2 VCC1=AVCC −40°C<Topr≤85°C Rated Value −0.3 to 6.5 −0.3 to VCC1+0.1 −0.3 to 6.5 −0.3 to VCC1+0.3 (1) Unit V V V V −0.3 to VCC2+0.3 (1) V −0.3 to 6.5 −0.3 to VCC1+0.3 (1) V V −0.3 to VCC2+0.3 (1) V −0.3 to 6.5 V mW °C 300 −20 to 85 / −40 to 85 0 to 60 −65 to 150 °C NOTES: 1. There is no external connections for port P1_0 to P1_7, P4_4 to P4_7, P7_2 to P7_5 and P9_1 in 80-pin version. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 40 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 5.2 Recommended Operating Conditions (1) (1) Symbol VCC1, VCC2 AVCC VSS AVSS VIH VIL 5. Electrical Characteristics Parameter Supply Voltage (VCC1 ≥ VCC2) Analog Supply Voltage Supply Voltage Analog Supply Voltage P3_1 to P3_7, P4_0 to P4_7, P5_0 to P5_7, HIGH Input P12_0 to P12_7, P13_0 to P13_7 Voltage LOW Input Voltage Min. 2.7 Standard Typ. 5.0 VCC1 0 0 Max. 5.5 Unit 0.8VCC2 VCC2 V V V V V P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 (during single-chip mode) 0.8VCC2 VCC2 V P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 (data input during memory expansion and microprocessor mode) 0.5VCC2 VCC2 V P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1, XIN, RESET, CNVSS, BYTE 0.8VCC1 VCC1 V P7_0, P7_1 0.8VCC1 0 6.5 0.2VCC2 V V P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 (during single-chip mode) 0 0.2VCC2 V P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 (data input during memory expansion and microprocessor mode) 0 0.16VCC2 V P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1, XIN, RESET, CNVSS, BYTE 0 0.2VCC V P3_1 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 IOH(peak) HIGH Peak Output Current P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 −10.0 mA IOH(avg) HIGH Average Output Current P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 −5.0 mA IOL(peak) LOW Peak Output Current P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 10.0 mA IOL(avg) LOW Average Output Current P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 5.0 mA NOTES: 1. Referenced to VCC1 = VCC2 = 2.7 to 5.5V at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified. 2. The Average Output Current is the mean value within 100ms. 3. The total IOL(peak) for ports P0, P1, P2, P8_6, P8_7, P9, P10, P11, P14_0, and P14_1 must be 80mA max. The total IOL(peak) for ports P3, P4, P5, P6, P7, P8_0 to P8_4, P12, and P13 must be 80mA max. The total IOH(peak) for ports P0, P1, and P2 must be −40mA max. The total IOH(peak) for ports P3, P4, P5, P12, and P13 must be −40mA max. The total IOH(peak) for ports P6, P7, and P8_0 to P8_4 must be −40mA max. The total IOH(peak) for ports P8_6, P8_7, P9, P10, P14_0, and P14_1 must be −40mA max. Set Average Output Current to 1/2 of peak. The total IOH(peak) for ports P8_6, P8_7, P9 , P10, P11, P14_0, and P14_1 must be −40mA max. As for 80-pin version, the total IOL(peak) for all ports and IOH(peak) must be 80mA. max. due to one VCC and one VSS. 4. There is no external connections for port P1_0 to P1_7, P4_4 to P4_7, P7_2 to P7_5 and P9_1 in 80-pin version. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 41 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics Recommended Operating Conditions (2) (1) Table 5.3 Symbol Parameter Main Clock Input Oscillation Frequency (2) f(XIN) Min. 0 0 VCC1=3.0V to 5.5V VCC1=2.7V to 3.0V f(XCIN) f(Ring) f(PLL) Sub-Clock Oscillation Frequency On-chip Oscillation Frequency PLL Clock Oscillation Frequency (2) 0.5 10 10 VCC1=3.0V to 5.5V VCC1=2.7V to 3.0V f(BCLK) tSU(PLL) CPU Operation Clock PLL Frequency Synthesizer Stabilization Wait Time Standard Typ. 32.768 1 0 VCC1=5.5V VCC1=3.0V Max. 16 20×VCC1 −44 50 2 24 46.67×VCC1 −116 24 20 50 NOTES: 1. Referenced to VCC1 = VCC2 = 2.7 to 5.5V at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified. 2. Relationship between main clock oscillation frequency, and supply voltage. PLL clock oscillation frequency f(PLL) operating maximum frequency [MHz] f(XIN) operating maximum frequency [MHz] Main clock input oscillation frequency 20 x VCC1-44MHz 16.0 10.0 0.0 2.7 3.0 VCC1[V] (main clock: no division) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 42 of 96 5.5 46.67 x VCC1-116MHz 24.0 10.0 0.0 2.7 3.0 VCC1[V] (PLL clock oscillation) 5.5 Unit MHz MHz kHz MHz MHz MHz MHz ms ms M16C/62P Group (M16C/62P, M16C/62PT) Table 5.4 A/D Conversion Characteristics (1) Symbol − INL − − DNL − − RLADDER tCONV tCONV tSAMP VREF VIA 5. Electrical Characteristics Parameter Resolution Integral Non-Linearity Error Absolute Accuracy 10bit 8bit 10bit 8bit Tolerance Level Impedance Differential Non-Linearity Error Offset Error Gain Error Ladder Resistance 10-bit Conversion Time, Sample & Hold Available 8-bit Conversion Time, Sample & Hold Available Sampling Time Reference Voltage Analog Input Voltage Measuring Condition Min. VREF=VCC1 VREF= AN0 to AN7 input, VCC1= AN0_0 to AN0_7 input, AN2_0 to AN2_7 input, 5V ANEX0, ANEX1 input External operation amp connection mode VREF= AN0 to AN7 input, VCC1= AN0_0 to AN0_7 input, 3.3V AN2_0 to AN2_7 input, ANEX0, ANEX1 input External operation amp connection mode VREF=VCC1=5V, 3.3V VREF= AN0 to AN7 input, VCC1= AN0_0 to AN0_7 input, 5V AN2_0 to AN2_7 input, ANEX0, ANEX1 input External operation amp connection mode VREF= AN0 to AN7 input, VCC1 AN0_0 to AN0_7 input, =3.3V AN2_0 to AN2_7 input, ANEX0, ANEX1 input External operation amp connection mode VREF=VCC1=5V, 3.3V Standard Typ. Max. 10 ±3 10 2.75 VREF=VCC1=5V, φAD=12MHz 2.33 0.25 2.0 0 Bits LSB ±7 LSB ±5 LSB ±7 LSB ±2 ±3 LSB LSB ±7 LSB ±5 LSB ±7 LSB ±2 LSB kΩ LSB LSB LSB kΩ µs 3 VREF=VCC1 VREF=VCC1=5V, φAD=12MHz Unit ±1 ±3 ±3 40 µs µs VCC1 VREF V V NOTES: 1. Referenced to VCC1=AVCC=VREF=3.3 to 5.5V, VSS=AVSS=0V at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified. 2. If VCC1 > VCC2, do not use AN0_0 to AN0_7 and AN2_0 to AN2_7 as analog input pins. 3. φAD frequency must be 12 MHz or less. And divide the fAD if VCC1 is less than 4.0V, and φAD frequency into 10 MHz or less. 4. When sample & hold is disabled, φAD frequency must be 250 kHz or more, in addition to the limitation in Note 3. When sample & hold is enabled, φAD frequency must be 1MHz or more, in addition to the limitation in Note 3. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 43 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 5.5 D/A Conversion Characteristics (1) Symbol − − tSU RO IVREF 5. Electrical Characteristics Parameter Resolution Absolute Accuracy Setup Time Output Resistance Reference Power Supply Input Current Measuring Condition Min. 4 (NOTE 2) Standard Typ. 10 Max. 8 1.0 3 20 1.5 Unit Bits % µs kΩ mA NOTES: 1. Referenced to VCC1=VREF=3.3 to 5.5V, VSS=AVSS=0V at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified. 2. This applies when using one D/A converter, with the D/A register for the unused D/A converter set to “00h”. The resistor ladder of the A/D converter is not included. Also, when D/A register contents are not “00h”, the IVREF will flow even if Vref id disconnected by the A/D control register. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 44 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 5.6 Flash Memory Version Electrical Characteristics (1) for 100 cycle products (D3, D5, U3, U5) Symbol − Parameter Program and Erase Endurance (3) Word Program Time (VCC1=5.0V) Lock Bit Program Time Block Erase Time (VCC1=5.0V) − − − − − − − 5. Electrical Characteristics Min. 100 Table 5.7 − − tPS − 200 200 4 4 4 4 4×n 15 10 Parameter Program and Erase Endurance (3, 8, 9) Word Program Time (VCC1=5.0V) Lock Bit Program Time Block Erase Time (VCC1=5.0V) Flash Memory Circuit Stabilization Wait Time Data Hold Time (5) − Max. Unit cycle µs µs s s s s s µs year Flash Memory Version Electrical Characteristics (6) for 10,000 cycle products (D7, D9, U7, U9) (Block A and Block 1 (7)) Symbol − 25 25 0.3 0.3 0.5 0.8 4-Kbyte block 8-Kbyte block 32-Kbyte block 64-Kbyte block Erase All Unlocked Blocks Time (2) Flash Memory Circuit Stabilization Wait Time Data Hold Time (5) tPS − Standard Typ. Min. 10,000 (4) Standard Typ. Max. cycle µs µs s 25 25 0.3 4-Kbyte block 15 10 Unit µs year NOTES: 1. Referenced to VCC1=4.5 to 5.5V, 3.0 to 3.6V at Topr = 0 to 60 °C (D3, D5, U3, U5) unless otherwise specified. 2. n denotes the number of block erases. 3. Program and Erase Endurance refers to the number of times a block erase can be performed. If the program and erase endurance is n (n=100, 1,000, or 10,000), each block can be erased n times. For example, if a 4 Kbytes block A is erased after writing 1 word data 2,048 times, each to a different address, this counts as one program and erase endurance. Data cannot be written to the same address more than once without erasing the block. (Rewrite prohibited) 4. Maximum number of E/W cycles for which operation is guaranteed. 5. Topr = -40 to 85 °C (D3, D7, U3, U7) / -20 to 85 °C (D5, D9, U5, U9). 6. Referenced to VCC1 = 4.5 to 5.5V, 3.0 to 3.6V at Topr = -40 to 85 °C (D7, U7) / -20 to 85 °C (D9, U9) unless otherwise specified. 7. Table 5.7 applies for block A or block 1 program and erase endurance > 1,000. Otherwise, use Table 5.6. 8. To reduce the number of program and erase endurance when working with systems requiring numerous rewrites, write to unused word addresses within the block instead of rewrite. Erase block only after all possible addresses are used. For example, an 8-word program can be written 256 times maximum before erase becomes necessary. Maintaining an equal number of erasure between block A and block 1 will also improve efficiency. It is important to track the total number of times erasure is used. 9. Should erase error occur during block erase, attempt to execute clear status register command, then block erase command at least three times until erase error disappears. 10. Set the PM17 bit in the PM1 register to “1” (wait state) when executing more than 100 times rewrites (D7, D9, U7 and U9). 11. Customers desiring E/W failure rate information should contact their Renesas technical support representative. Table 5.8 Flash Memory Version Program / Erase Voltage and Read Operation Voltage Characteristics (at Topr = 0 to 60 °C(D3, D5, U3, U5), Topr = -40 to 85 °C(D7, U7) / Topr = -20 to 85 °C(D9, U9)) Flash Program, Erase Voltage VCC1 = 3.3 V ± 0.3 V or 5.0 V ± 0.5 V Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 45 of 96 Flash Read Operation Voltage VCC1=2.7 to 5.5 V M16C/62P Group (M16C/62P, M16C/62PT) Table 5.9 Low Voltage Detection Circuit Electrical Characteristics Symbol Vdet4 Vdet3 Vdet4-Vdet3 Vdet3s Vdet3r 5. Electrical Characteristics Parameter Low Voltage Detection Voltage (1) Reset Level Detection Voltage (1, 2) Electric potential difference of Low Voltage Detection and Reset Level Detection Low Voltage Reset Retention Voltage Low Voltage Reset Release Voltage (3) Measuring Condition VCC1=0.8V to 5.5V Min. 3.3 2.2 0.3 2.2 Standard Typ. 3.8 2.8 Max. 4.4 3.6 2.9 0.8 4.0 Unit V V V V V NOTES: 1. Vdet4 > Vdet3. 2. Where reset level detection voltage is less than 2.7 V, if the supply power voltage is greater than the reset level detection voltage, the microcomputer operates with f(BCLK) ≤ 10MHz. 3. Vdet3r > Vdet3 is not guaranteed. 4. The voltage detection circuit is designed to use when VCC1 is set to 5V. Table 5.10 Power Supply Circuit Timing Characteristics Symbol td(P-R) td(R-S) td(W-S) td(S-R) td(E-A) Parameter Time for Internal Power Supply Stabilization During Powering-On STOP Release Time Low Power Dissipation Mode Wait Mode Release Time Brown-out Detection Reset (Hardware Reset 2) Release Wait Time Low Voltage Detection Circuit Operation Start Time NOTES: 1. When VCC1 = 5V. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 46 of 96 Measuring Condition Min. Standard Typ. VCC1=2.7V to 5.5V VCC1=Vdet3r to 5.5V VCC1=2.7V to 5.5V 6 (1) Max. 2 Unit ms 150 150 µs 20 ms 20 µs µs M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics Recommended operation voltage td(P-R) Time for Internal Power Supply Stabilization During Powering-On VCC1 td(P-R) CPU clock Interrupt for (a) Stop mode release or (b) Wait mode release td(R-S) STOP Release Time td(W-S) Low Power Dissipation Mode Wait Mode Release Time CPU clock (a) td(R-S) (b) td(W-S) td(S-R) Low Voltage Detection Reset (Hardware Reset 2) Release Wait Time Vdet3r VCC1 td(S-R) CPU clock td(E-A) VC26, VC27 Low Voltage Detection Circuit Operation Start Time Low Voltage Detection Circuit Stop Operate td(E-A) Figure 5.1 Power Supply Circuit Timing Diagram Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 47 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Table 5.11 Electrical Characteristics (1) Symbol VOH VOH (1) Parameter HIGH Output Voltage (3) HIGH Output Voltage (3) Measuring Condition P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 IOH=−5mA P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 IOH=−5mA (2) P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 VOH HIGH Output Voltage XOUT HIGH Output Voltage VOL VOL VOL LOW Output Voltage (3) LOW Output Voltage (3) XCOUT HIGHPOWER IOH=−1mA LOWPOWER IOH=−0.5mA HIGHPOWER With no load applied LOWPOWER With no load applied IOL=5mA P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 IOL=5mA (2) P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 IOL=200µA P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 IOL=200µA (2) LOW Output Voltage Hysteresis IOH=−200µA (2) P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 XOUT LOW Output Voltage VT+-VT- OH=−200µA XCOUT Min. Standard Typ. Max. VCC1−2.0 VCC1 VCC2−2.0 VCC2 VCC1−0.3 VCC1 Unit V V VCC2−0.3 VCC2 VCC1−2.0 VCC1−2.0 VCC1 VCC1 2.5 1.6 V V 2.0 V 2.0 0.45 V 0.45 HIGHPOWER IOL=1mA LOWPOWER IOL=0.5mA HIGHPOWER With no load applied LOWPOWER With no load applied 2.0 2.0 0 0 V V HOLD, RDY, TA0IN to TA4IN, TB0IN to TB5IN, INT0 to INT5, NMI, ADTRG, CTS0 to CTS2, CLK0 to CLK4, TA0OUT to TA4OUT, KI0 to KI3, RXD0 to RXD2, 0.2 1.0 V 0.2 2.5 V 5.0 µA −5.0 µA 170 kΩ SCL0 to SCL2, SDA0 to SDA2, SIN3, SIN4 VT+-VT- Hysteresis RESET IIH HIGH Input Current (3) P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, VI=5V P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1, XIN, RESET, CNVSS, BYTE IIL LOW Input Current (3) P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, VI=0V P11_0 to P11_7,P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1, XIN, RESET, CNVSS, BYTE RPULLUP Pull-Up Resistance (3) P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, VI=0V 30 50 P11_0 to P11_7,P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 RfXIN RfXCIN VRAM 1.5 15 Feedback Resistance XIN Feedback Resistance XCIN RAM Retention Voltage At stop mode 2.0 MΩ MΩ V NOTES: 1. Referenced to VCC1=VCC2=4.2 to 5.5V, VSS = 0V at Topr = −20 to 85°C / −40 to 85°C, f(BCLK)=24MHz unless otherwise specified. 2. Where the product is used at VCC1 = 5 V and VCC2 = 3 V, refer to the 3 V version value for the pin specified value on VCC2 port side. 3. There is no external connections for port P1_0 to P1_7, P4_4 to P4_7, P7_2 to P7_5 and P9_1 in 80-pin version. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 48 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 5.12 Electrical Characteristics (2) (1) Symbol ICC 5. Electrical Characteristics Parameter Measuring Condition Power Supply Current In single-chip (VCC1=VCC2=4.0V to 5.5V) mode, the output pins are open and other pins are VSS Mask ROM f(BCLK)=24MHz No division, PLL operation No division, On-chip oscillation Flash Memory Flash Memory Program Flash Memory Erase Mask ROM Flash Memory Idet4 Idet3 (4) Low Voltage Detection Dissipation Current Reset Area Detection Dissipation Current (4) Standard Typ. Max. 14 20 1 Page 49 of 96 mA mA 18 No division, On-chip oscillation 1.8 mA f(BCLK)=10MHz, VCC1=5.0V 15 mA f(BCLK)=10MHz, VCC1=5.0V 25 mA f(XCIN)=32kHz Low power dissipation mode, ROM (3) 25 µA f(BCLK)=32kHz Low power dissipation mode, RAM (3) 25 µA 420 µA On-chip oscillation, Wait mode 50 µA f(BCLK)=32kHz Wait mode (2), Oscillation capability High 7.5 µA f(BCLK)=32kHz Wait mode (2), Oscillation capability Low 2.0 µA Stop mode Topr =25°C 0.8 3.0 µA 0.7 1.2 4 8 µA 27 NOTES: 1. Referenced to VCC1=VCC2=4.2 to 5.5V, VSS = 0V at Topr = −20 to 85°C / −40 to 85°C, f(BCLK)=24MHz unless otherwise specified. 2. With one timer operated using fC32. 3. This indicates the memory in which the program to be executed exists. 4. Idet is dissipation current when the following bit is set to “1” (detection circuit enabled). Idet4: VC27 bit in the VCR2 register Idet3: VC26 bit in the VCR2 register Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Unit f(BCLK)=24MHz, No division, PLL operation f(BCLK)=32kHz Low power dissipation mode, Flash Memory (3) Mask ROM Flash Memory Min. mA µA M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Timing Requirements (VCC1 = VCC2 = 5V, VSS = 0V, at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified) Table 5.13 External Clock Input (XIN input) (1) Symbol Parameter External Clock Input Cycle Time External Clock Input HIGH Pulse Width External Clock Input LOW Pulse Width External Clock Rise Time External Clock Fall Time tc tw(H) tw(L) tr tf Standard Min. 62.5 25 25 Max. 15 15 Unit ns ns ns ns ns NOTES: 1. The condition is VCC1=VCC2=3.0 to 5.0V. Table 5.14 Memory Expansion Mode and Microprocessor Mode Symbol tac1(RD-DB) tac2(RD-DB) tac3(RD-DB) tsu(DB-RD) tsu(RDY-BCLK) tsu(HOLD-BCLK) th(RD-DB) th(BCLK-RDY) th(BCLK-HOLD) Parameter Data Input Access Time (for setting with no wait) Data Input Access Time (for setting with wait) Data Input Access Time (when accessing multiplex bus area) Data Input Setup Time RDY Input Setup Time HOLD Input Setup Time Data Input Hold Time RDY Input Hold Time HOLD Input Hold Time Standard Min. Max. (NOTE 1) (NOTE 2) (NOTE 3) 40 30 40 0 0 0 NOTES: 1. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 45 [ ns ] f ( BCLK ) 2. Calculated according to the BCLK frequency as follows: 9 ( n – 0.5 ) x 10 ------------------------------------- – 45 [ ns ] f ( BCLK ) n is ”2” for 1-wait setting, “3” for 2-wait setting and “4” for 3-wait setting. 3. Calculated according to the BCLK frequency as follows: 9 ( n – 0.5 ) x 10 ------------------------------------- – 45 [ ns ] f ( BCLK ) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 n is “2” for 2-wait setting, “3” for 3-wait setting. Page 50 of 96 Unit ns ns ns ns ns ns ns ns ns M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Timing Requirements (VCC1 = VCC2 = 5V, VSS = 0V, at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified) Table 5.15 Timer A Input (Counter Input in Event Counter Mode) Symbol tc(TA) tw(TAH) tw(TAL) Table 5.16 Parameter TAiIN Input Cycle Time TAiIN Input HIGH Pulse Width TAiIN Input LOW Pulse Width Table 5.17 Parameter TAiIN Input Cycle Time TAiIN Input HIGH Pulse Width TAiIN Input LOW Pulse Width Table 5.18 Parameter TAiIN Input Cycle Time TAiIN Input HIGH Pulse Width TAiIN Input LOW Pulse Width Table 5.19 Parameter TAiIN Input HIGH Pulse Width TAiIN Input LOW Pulse Width Standard Min. 400 200 200 Unit ns ns ns Standard Min. 200 100 100 Max. Unit ns ns ns Standard Min. 100 100 Parameter Max. Unit ns ns Standard tc(UP) TAiOUT Input Cycle Time Min. 2000 tw(UPH) tw(UPL) tsu(UP-TIN) th(TIN-UP) TAiOUT Input HIGH Pulse Width TAiOUT Input LOW Pulse Width TAiOUT Input Setup Time TAiOUT Input Hold Time 1000 1000 400 400 Max. Unit ns ns ns ns ns Timer A Input (Two-phase Pulse Input in Event Counter Mode) Symbol tc(TA) tsu(TAIN-TAOUT) tsu(TAOUT-TAIN) Max. Timer A Input (Counter Increment/Decrement Input in Event Counter Mode) Symbol Table 5.20 ns ns ns Timer A Input (External Trigger Input in Pulse Width Modulation Mode) Symbol tw(TAH) tw(TAL) Unit Timer A Input (External Trigger Input in One-shot Timer Mode) Symbol tc(TA) tw(TAH) tw(TAL) Max. Timer A Input (Gating Input in Timer Mode) Symbol tc(TA) tw(TAH) tw(TAL) Standard Min. 100 40 40 Parameter TAiIN Input Cycle Time TAiOUT Input Setup Time TAiIN Input Setup Time Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 51 of 96 Standard Min. 800 200 200 Max. Unit ns ns ns M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Timing Requirements (VCC1 = VCC2 = 5V, VSS = 0V, at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified) Table 5.21 Timer B Input (Counter Input in Event Counter Mode) Symbol tc(TB) tw(TBH) tw(TBL) tc(TB) tw(TBH) tw(TBL) Table 5.22 Parameter TBiIN Input Cycle Time (counted on one edge) TBiIN Input HIGH Pulse Width (counted on one edge) TBiIN Input LOW Pulse Width (counted on one edge) TBiIN Input Cycle Time (counted on both edges) TBiIN Input HIGH Pulse Width (counted on both edges) TBiIN Input LOW Pulse Width (counted on both edges) Table 5.23 Parameter TBiIN Input Cycle Time TBiIN Input HIGH Pulse Width TBiIN Input LOW Pulse Width Table 5.24 Parameter TBiIN Input Cycle Time TBiIN Input HIGH Pulse Width TBiIN Input LOW Pulse Width Standard Min. 400 200 200 Parameter tw(ADL) ADTRG input LOW Pulse Width 125 Unit ns ns ns Max. Unit ns ns Serial Interface Symbol Parameter CLKi Input Cycle Time CLKi Input HIGH Pulse Width CLKi Input LOW Pulse Width TXDi Output Delay Time TXDi Hold Time RXDi Input Setup Time RXDi Input Hold Time Standard Min. 200 100 100 Max. 80 0 70 90 Unit ns ns ns ns ns ns ns External Interrupt INTi Input Symbol tw(INL) Max. Standard ADTRG Input Cycle Time tw(INH) Unit ns ns ns Standard tc(AD) Table 5.26 Max. Min. 400 200 200 Min. 1000 tc(CK) tw(CKH) tw(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) ns ns ns ns ns ns A/D Trigger Input Symbol Table 5.25 Unit Timer B Input (Pulse Width Measurement Mode) Symbol tc(TB) tw(TBH) tw(TBL) Max. Timer B Input (Pulse Period Measurement Mode) Symbol tc(TB) tw(TBH) tw(TBL) Standard Min. 100 40 40 200 80 80 Parameter Standard INTi Input HIGH Pulse Width Min. 250 INTi Input LOW Pulse Width 250 Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 52 of 96 Max. Unit ns ns M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Switching Characteristics (VCC1 = VCC2 = 5V, VSS = 0V, at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified) Table 5.27 Memory Expansion and Microprocessor Modes (for setting with no wait) Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB) td(BCLK-HLDA) Parameter Address Output Delay Time Address Output Hold Time (in relation to BCLK) Address Output Hold Time (in relation to RD) Address Output Hold Time (in relation to WR) Chip Select Output Delay Time Chip Select Output Hold Time (in relation to BCLK) ALE Signal Output Delay Time ALE Signal Output Hold Time RD Signal Output Delay Time RD Signal Output Hold Time WR Signal Output Delay Time WR Signal Output Hold Time Data Output Delay Time (in relation to BCLK) Data Output Hold Time (in relation to BCLK) (3) Data Output Delay Time (in relation to WR) Data Output Hold Time (in relation to WR) (3) HLDA Output Delay Time See Figure 5.2 Standard Min. Max. 25 4 0 (NOTE 2) 25 4 15 −4 25 0 25 0 40 4 (NOTE 1) (NOTE 2) 40 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns NOTES: 1. Calculated according to the BCLK frequency as follows: 9 0.5x10 f(BCLK) is 12.5MHz or less. ------------------------ – 40 [ ns ] f ( BCLK ) 2. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 10 [ ns ] f ( BCLK ) 3. This standard value shows the timing when the output is off, and does not show hold time of data bus. Hold time of data bus varies with capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t = −CR X ln (1−VOL / VCC2) by a circuit of the right figure. For example, when VOL = 0.2VCC2, C = 30pF, R = 1kΩ, hold time of output ”L” level is t = −30pF X 1k Ω X In(1−0.2VCC2 / VCC2) = 6.7ns. P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 P14 Figure 5.2 Ports P0 to P14 Measurement Circuit Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 53 of 96 R DBi C 30pF M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Switching Characteristics (VCC1 = VCC2 = 5V, VSS = 0V, at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified) Table 5.28 Memory Expansion and Microprocessor Modes (for 1- to 3-wait setting and external area access) Symbol Standard Min. Max. 25 4 0 Parameter td(BCLK-AD) th(BCLK-AD) th(RD-AD) Address Output Delay Time Address Output Hold Time (in relation to BCLK) Address Output Hold Time (in relation to RD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB) td(BCLK-HLDA) Address Output Hold Time (in relation to WR) Chip Select Output Delay Time Chip Select Output Hold Time (in relation to BCLK) ALE Signal Output Delay Time ALE Signal Output Hold Time RD Signal Output Delay Time RD Signal Output Hold Time WR Signal Output Delay Time WR Signal Output Hold Time Data Output Delay Time (in relation to BCLK) Data Output Hold Time (in relation to BCLK) (3) Data Output Delay Time (in relation to WR) Data Output Hold Time (in relation to WR)(3) HLDA Output Delay Time Unit ns ns ns (NOTE 2) ns ns ns ns ns ns ns ns ns ns ns ns ns ns 25 4 15 See Figure 5.2 -4 25 0 25 0 40 4 (NOTE 1) (NOTE 2) 40 NOTES: 1. Calculated according to the BCLK frequency as follows: 9 ( n – 0.5 ) x10 ------------------------------------ – 40 [ ns ] f ( BCLK ) n is “1” for 1-wait setting, “2” for 2-wait setting and “3” for 3-wait setting. (BCLK) is 12.5MHz or less. 2. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 10 [ ns ] f ( BCLK ) 3. This standard value shows the timing when the output is off, and does not show hold time of data bus. Hold time of data bus varies with capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t = −CR X ln (1−VOL / VCC2) by a circuit of the right figure. For example, when VOL = 0.2VCC2, C = 30pF, R = 1kΩ, hold time of output ”L” level is t = −30pF X 1kΩ X In(1−0.2VCC2 / VCC2) = 6.7ns. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 54 of 96 R DBi C M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Switching Characteristics (VCC1 = VCC2 = 5V, VSS = 0V, at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified) Table 5.29 Memory Expansion and Microprocessor Modes (for 2- to 3-wait setting, external area access and multiplex bus selection) Symbol Standard Min. Max. 25 4 (NOTE 1) Parameter td(BCLK-AD) th(BCLK-AD) th(RD-AD) Address Output Delay Time Address Output Hold Time (in relation to BCLK) Address Output Hold Time (in relation to RD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) th(RD-CS) th(WR-CS) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB) td(BCLK-HLDA) td(BCLK-ALE) th(BCLK-ALE) td(AD-ALE) th(AD-ALE) td(AD-RD) td(AD-WR) tdz(RD-AD) Address Output Hold Time (in relation to WR) Chip Select Output Delay Time Chip Select Output Hold Time (in relation to BCLK) Chip Select Output Hold Time (in relation to RD) Chip Select Output Hold Time (in relation to WR) RD Signal Output Delay Time RD Signal Output Hold Time WR Signal Output Delay Time WR Signal Output Hold Time Data Output Delay Time (in relation to BCLK) Data Output Hold Time (in relation to BCLK) Data Output Delay Time (in relation to WR) Data Output Hold Time (in relation to WR) HLDA Output Delay Time ALE Signal Output Delay Time (in relation to BCLK) ALE Signal Output Hold Time (in relation to BCLK) ALE Signal Output Delay Time (in relation to Address) ALE Signal Output Hold Time (in relation to Address) RD Signal Output Delay From the End of Address WR Signal Output Delay From the End of Address Address Output Floating Start Time (NOTE 1) 25 4 (NOTE 1) (NOTE 1) 25 0 25 See Figure 5.2 NOTES: 1. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 10 [ ns ] f ( BCLK ) 2. Calculated according to the BCLK frequency as follows: 9 ( n – 0.5 ) x10 ------------------------------------ – 40 [ ns ] f ( BCLK ) n is “2” for 2-wait setting, “3” for 3-wait setting. 3. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 25 [ ns ] f ( BCLK ) 4. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 15 [ ns ] f ( BCLK ) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 55 of 96 0 40 4 (NOTE 2) (NOTE 1) 40 15 −4 (NOTE 3) (NOTE 4) 0 0 8 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V XIN input tw(H) tr tf tw(L) tc tc(TA) tw(TAH) TAiIN input tw(TAL) tc(UP) tw(UPH) TAiOUT input tw(UPL) TAiOUT input (Up/down input) During event counter mode TAiIN input (When count on falling edge is selected) TAiIN input (When count on rising edge is selected) th(TIN-UP) tsu(UP-TIN) Two-phase pulse input in event counter mode tc(TA) TAiIN input tsu(TAIN-TAOUT) tsu(TAIN-TAOUT) tsu(TAOUT-TAIN) TAiOUT input tsu(TAOUT-TAIN) tc(TB) tw(TBH) TBiIN input tw(TBL) tc(AD) tw(ADL) ADTRG input Figure 5.3 Timing Diagram (1) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 56 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V tc(CK) tw(CKH) CLKi tw(CKL) th(C-Q) TXDi tsu(D-C) td(C-Q) RXDi tw(INL) INTi input tw(INH) Figure 5.4 Timing Diagram (2) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 57 of 96 th(C-D) M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Memory Expansion Mode, Microprocessor Mode (Effective for setting with wait) BCLK RD (Separate bus) WR, WRL, WRH (Separate bus) RD (Multiplexed bus) WR, WRL, WRH (Multiplexed bus) RDY input tsu(RDY−BCLK) th(BCLK−RDY) (Common to setting with wait and setting without wait) BCLK th(BCLK−HOLD) tsu(HOLD−BCLK) HOLD input HLDA input td(BCLK−HLDA) P0, P1, P2, P3, P4, P5_0 to P5_2 td(BCLK−HLDA) Hi−Z (1) NOTES: 1. These pins are set to high-impedance regardless of the input level of the BYTE pin, PM06 bit in PM0 register and PM11 bit in PM1 register. · Measuring conditions : · VCC1=VCC2=5V · Input timing voltage : Determined with VIL=1.0V, VIH=4.0V · Output timing voltage : Determined with VOL=2.5V, VOH=2.5V Figure 5.5 Timing Diagram (3) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 58 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Memory Expansion Mode, Microprocessor Mode (For setting with no wait) Read timing BCLK td(BCLK-CS) th(BCLK-CS) 25ns.max 4ns.min CSi tcyc td(BCLK-AD) th(BCLK-AD) 25ns.max 4ns.min ADi BHE td(BCLK-ALE) th(BCLK-ALE) -4ns.min 25ns.max th(RD-AD) 0ns.min ALE td(BCLK-RD) 25ns.max th(BCLK-RD) 0ns.min RD tac1(RD-DB) (0.5 × tcyc-45)ns.max Hi-Z DBi tsu(DB-RD) th(RD-DB) 40ns.min 0ns.min Write timing BCLK td(BCLK-CS) th(BCLK-CS) 25ns.max 4ns.min CSi tcyc td(BCLK-AD) th(BCLK-AD) 25ns.max 4ns.min ADi BHE td(BCLK-ALE) th(BCLK-ALE) 25ns.max th(WR-AD) (0.5 × tcyc-10)ns.min -4ns.min ALE td(BCLK-WR) 25ns.max th(BCLK-WR) 0ns.min WR, WRL, WRH td(BCLK-DB) th(BCLK-DB) 40ns.max 4ns.min Hi-Z DBi tcyc= td(DB-WR) (0.5 × tcyc-40)ns.min 1 f(BCLK) Measuring conditions · VCC1=VCC2=5V · Input timing voltage : VIL=0.8V, VIH=2.0V · Output timing voltage : VOL=0.4V, VOH=2.4V Figure 5.6 Timing Diagram (4) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 59 of 96 th(WR-DB) (0.5 × tcyc-10)ns.min M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Memory Expansion Mode, Microprocessor Mode (for 1-wait setting and external area access) Read timing BCLK td(BCLK-CS) th(BCLK-CS) 25ns.max 4ns.min CSi tcyc td(BCLK-AD) th(BCLK-AD) 25ns.max 4ns.min ADi BHE td(BCLK-ALE) th(RD-AD) 0ns.min th(BCLK-ALE) 25ns.max -4ns.min ALE td(BCLK-RD) th(BCLK-RD) 25ns.max 0ns.min RD tac2(RD-DB) (1.5 × tcyc-45)ns.max Hi-Z DBi th(RD-DB) tsu(DB-RD) 0ns.min 40ns.min Write timing BCLK td(BCLK-CS) th(BCLK-CS) 25ns.max 4ns.min CSi tcyc td(BCLK-AD) th(BCLK-AD) 25ns.max 4ns.min ADi BHE td(BCLK-ALE) th(BCLK-ALE) 25ns.max th(WR-AD) (0.5 × tcyc-10)ns.min -4ns.min ALE td(BCLK-WR) 25ns.max th(BCLK-WR) 0ns.min WR, WRL, WRH td(BCLK-DB) th(BCLK-DB) 4ns.min 40ns.max Hi-Z DBi td(DB-WR) tcyc= (0.5 × tcyc-40)ns.min 1 f(BCLK) Measuring conditions · VCC1=VCC2=5V · Input timing voltage : VIL=0.8V, VIH=2.0V · Output timing voltage : VOL=0.4V, VOH=2.4V Figure 5.7 Timing Diagram (5) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 60 of 96 th(WR-DB) (0.5 × tcyc-10)ns.min M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Memory Expansion Mode, Microprocessor Mode (for 2-wait setting and external area access) Read timing tcyc BCLK th(BCLK-CS) 4ns.min td(BCLK-CS) 25ns.max CSi td(BCLK-AD) 25ns.max th(BCLK-AD) 4ns.min ADi BHE td(BCLK-ALE) 25ns.max th(RD-AD) th(BCLK-ALE) 0ns.min -4ns.min ALE th(BCLK-RD) 0ns.min td(BCLK-RD) 25ns.max RD tac2(RD-DB) (2.5×tcyc-45)ns.max DBi Hi-Z tsu(DB-RD) 40ns.min th(RD-DB) 0ns.min Write timing tcyc BCLK td(BCLK-CS) 25ns.max th(BCLK-CS) td(BCLK-AD) 25ns.max th(BCLK-AD) 4ns.min 4ns.min CSi ADi BHE td(BCLK-ALE) 25ns.max th(WR-AD) th(BCLK-ALE) (0.5×tcyc-10)ns.min -4ns.min ALE td(BCLK-WR) 25ns.max th(BCLK-WR) 0ns.min WR, WRL WRH td(BCLK-DB) 40ns.max Hi-Z DBi td(DB-WR) (1.5×tcyc-40)ns.min Tcyc= 1 f(BCLK) Measuring conditions · VCC1=VCC2=5V · Input timing voltage : V IL=0.8V, VIH=2.0V · Output timing voltage : V OL=0.4V, VOH=2.4V Figure 5.8 th(BCLK-DB) 4ns.min Timing Diagram (6) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 61 of 96 th(WR-DB) (0.5×tcyc-10)ns.min M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Memory Expansion Mode, Microprocessor Mode (for 3-wait setting and external area access) Read timing tcyc BCLK th(BCLK-CS) td(BCLK-CS) 25ns.max 4ns.min CSi th(BCLK-AD) 4ns.min td(BCLK-AD) 25ns.max ADi BHE td(BCLK-ALE) th(RD-AD) th(BCLK-ALE) 25ns.max 0ns.min -4ns.min ALE th(BCLK-RD) td(BCLK-RD) 25ns.max 0ns.min RD tac2(RD-DB) (3.5×tcyc-45)ns.max Hi-Z DBi tsu(DB-RD) th(RD-DB) 40ns.min 0ns.min Write timing tcyc BCLK td(BCLK-CS) 25ns.max th(BCLK-CS) td(BCLK-AD) th(BCLK-AD) 4ns.min CSi 4ns.min 25ns.max ADi BHE td(BCLK-ALE) 25ns.max th(WR-AD) th(BCLK-ALE) (0.5×tcyc-10)ns.min -4ns.min ALE td(BCLK-WR) 25ns.max th(BCLK-WR) 0ns.min WR, WRL WRH td(BCLK-DB) th(BCLK-DB) 4ns.min 40ns.max Hi-Z DBi td(DB-WR) (2.5×tcyc-40)ns.min tcyc= 1 f(BCLK) Measuring conditions · VCC1=VCC2=5V · Input timing voltage : V IL=0.8V, VIH=2.0V · Output timing voltage : V OL=0.4V, VOH=2.4V Figure 5.9 Timing Diagram (7) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 62 of 96 th(WR-DB) (0.5×tcyc-10)ns.min M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Memory Expansion Mode, Microprocessor Mode (For 1- or 2-wait setting, external area access and multiplex bus selection ) Read timing BCLK td(BCLK-CS) th(BCLK-CS) th(RD-CS) (0.5×tcyc-10)ns.min tcyc 25ns.max 4ns.min CSi td(AD-ALE) th(ALE-AD) (0.5×tcyc-25)ns.min (0.5×tcyc-15)ns.min ADi /DBi Address 8ns.max Address Data input tdZ(RD-AD) tac3(RD-DB) (1.5×tcyc-45)ns.max tsu(DB-RD) th(RD-DB) 0ns.min 40ns.min td(AD-RD) 0ns.min td(BCLK-AD) th(BCLK-AD) 4ns.min 25ns.max ADi BHE td(BCLK-ALE) th(RD-AD) (0.5×tcyc-10)ns.min th(BCLK-ALE) −4ns.min 25ns.max ALE td(BCLK-RD) th(BCLK-RD) 25ns.max 0ns.min RD Write timing BCLK th(BCLK-CS) th(WR-CS) tcyc td(BCLK-CS) 4ns.min (0.5×tcyc-10)ns.min 25ns.max CSi th(BCLK-DB) td(BCLK-DB) 4ns.min 40ns.max ADi /DBi Address Address Data output td(DB-WR) (1.5×tcyc-40)ns.min td(AD-ALE) (0.5×tcyc-25)ns.min th(WR-DB) (0.5×tcyc-10)ns.min td(BCLK-AD) th(BCLK-AD) 4ns.min 25ns.max ADi BHE td(BCLK-ALE) 25ns.max th(BCLK-ALE) td(AD-WR) −4ns.min 0ns.min th(WR-AD) (0.5×tcyc-10)ns.min ALE td(BCLK-WR) 25ns.max WR,WRL, WRH Measuring conditions · VCC1=VCC2=5V · Input timing voltage : V IL=0.8V, VIH=2.0V · Output timing voltage : V OL=0.4V, VOH=2.4V Figure 5.10 Timing Diagram (8) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 63 of 96 th(BCLK-WR) 0ns.min M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Memory Expansion Mode, Microprocessor Mode (For 3-wait setting, external area access and multiplex bus selection ) Read timing tcyc BCLK th(RD-CS) (0.5×tcyc-10)ns.min td(BCLK-CS) th(BCLK-CS) 4ns.min 25ns.max CSi td(AD-ALE) th(ALE-AD) (0.5×tcyc-25)ns.min ADi /DBi (0.5×tcyc-15)ns.min Address Data input th(RD-DB) tdZ(RD-AD) td(BCLK-AD) 8ns.max td(AD-RD) 25ns.max (2.5×tcyc-45)ns.max 0ns.min ADi BHE tac3(RD-DB) tsu(DB-RD) 0ns.min th(BCLK-AD) 4ns.min 40ns.min (no multiplex) td(BCLK-ALE) 25ns.max th(RD-AD) th(BCLK-ALE) (0.5×tcyc-10)ns.min -4ns.min ALE th(BCLK-RD) td(BCLK-RD) 0ns.min 25ns.max RD Write timing tcyc BCLK th(WR-CS) (0.5×tcyc-10)ns.min td(BCLK-CS) th(BCLK-CS) 4ns.min 25ns.max CSi ADi /DBi td(BCLK-DB) th(BCLK-DB) 40ns.max 4ns.min Address Data output td(AD-ALE) (0.5×tcyc-25)ns.min td(DB-WR) (2.5×tcyc-40)ns.min th(WR-DB) (0.5×tcyc-10)ns.min td(BCLK-AD) th(BCLK-AD) 25ns.max 4ns.min ADi BHE (no multiplex) td(BCLK-ALE) 25ns.max th(BCLK-ALE) th(WR-AD) -4ns.min td(AD-WR) (0.5×tcyc-10)ns.min 0ns.min ALE th(BCLK-WR) td(BCLK-WR) 25ns.max WR, WRL WRH tcyc= 1 f(BCLK) Measuring conditions · VCC1=VCC2=5V · Input timing voltage : V IL=0.8V, VIH=2.0V · Output timing voltage : V OL=0.4V, VOH=2.4V Figure 5.11 Timing Diagram (9) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 64 of 96 0ns.min M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V Table 5.30 Electrical Characteristics (1) Symbol VOH VOH Parameter HIGH Output Voltage (3) IOH=−1mA P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 IOH=−1mA (2) HIGH Output Voltage VOL LOW Output Voltage (3) XOUT XCOUT IOH=−0.1mA LOWPOWER IOH=−50µA HIGHPOWER With no load applied LOWPOWER With no load applied IOL=1mA P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 IOL=1mA (2) LOW Output Voltage Hysteresis HIGHPOWER P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 XOUT LOW Output Voltage VT+-VT- Measuring Condition P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 HIGH Output Voltage VOL (1) XCOUT HIGHPOWER IOL=0.1mA LOWPOWER IOL=50µA HIGHPOWER With no load applied LOWPOWER With no load applied HOLD, RDY, TA0IN to TA4IN, TB0IN to TB5IN, INT0 to INT5, NMI, ADTRG, CTS0 to CTS2, CLK0 to CLK4, TA0OUT to TA4OUT, KI0 to KI3, RXD0 to RXD2, SCL0 to SCL2, SDA0 to SDA2, SIN3, SIN4 RESET HIGH Input Current (3) P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1, XIN, RESET, CNVSS, BYTE VI=3V P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1, XIN, RESET, CNVSS, BYTE VI=0V Resistance (3) RfXIN RfXCIN VRAM VCC1−0.5 VCC1 VCC2−0.5 VCC2 VCC1−0.5 VCC1−0.5 VCC1 VCC1 2.5 1.6 V 0.5 0.5 0 0 50 (0.7) 100 Feedback Resistance XCIN At stop mode 0.8 V 1.8 V 4.0 µA −4.0 µA 500 kΩ 2.0 NOTES: 1. Referenced to VCC1 = VCC2 = 2.7 to 3.3V, VSS = 0V at Topr = −20 to 85°C / −40 to 85°C, f(XIN)=10MHz no wait unless otherwise specified. 2. VCC1 for the port P6 to P11 and P14, and VCC2 for the port P0 to P5 and P12 to P13 3. There is no external connections for port P1_0 to P1_7, P4_4 to P4_7, P7_2 to P7_5 and P9_1 in 80-pin version. Page 65 of 96 V V 3.0 25 Feedback Resistance XIN Rev.2.41 Jan 10, 2006 REJ03B0001-0241 V V 0.2 P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 VI=0V to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7,P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 RAM Retention Voltage Unit V 0.2 IIH RPULLUP Pull-Up Max. 0.5 Hysteresis LOW Input Current (3) Standard Typ. 0.5 VT+-VT- IIL Min. MΩ MΩ V M16C/62P Group (M16C/62P, M16C/62PT) Table 5.31 Electrical Characteristics (2) (1) Symbol ICC 5. Electrical Characteristics Parameter Measuring Condition Power Supply Current In single-chip (VCC1=VCC2=2.7V to 3.6V) mode, the output pins are open and other pins are VSS Mask ROM Flash Memory Flash Memory Program Flash Memory Erase Mask ROM Flash Memory Idet4 Idet3 (4) Low Voltage Detection Dissipation Current Reset Area Detection Dissipation Current (4) Standard Typ. Max. 8 No division, On-chip oscillation 1 f(BCLK)=10MHz, No division 8 No division, On-chip oscillation 1.8 mA f(BCLK)=10MHz, VCC1=3.0V 12 mA f(BCLK)=10MHz, VCC1=3.0V 22 mA f(XCIN)=32kHz Low power dissipation mode, ROM (3) 25 µA f(BCLK)=32kHz Low power dissipation mode, RAM (3) 25 µA 420 µA On-chip oscillation, Wait mode 45 µA f(BCLK)=32kHz Wait mode (2), Oscillation capability High 6.0 µA f(BCLK)=32kHz Wait mode (2), Oscillation capability Low 1.8 µA Stop mode Topr =25°C 0.7 3.0 µA 0.6 0.4 4 2 µA 11 Page 66 of 96 mA mA 13 NOTES: 1. Referenced to VCC1=VCC2=2.7 to 3.3V, VSS = 0V at Topr = −20 to 85°C / −40 to 85°C, f(BCLK)=10MHz unless otherwise specified. 2. With one timer operated using fC32. 3. This indicates the memory in which the program to be executed exists. 4. Idet is dissipation current when the following bit is set to “1” (detection circuit enabled). Idet4: VC27 bit in the VCR2 register Idet3: VC26 bit in the VCR2 register Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Unit f(BCLK)=10MHz No division f(BCLK)=32kHz Low power dissipation mode, Flash Memory (3) Mask ROM Flash Memory Min. mA µA M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V Timing Requirements (VCC1 = VCC2 = 3V, VSS = 0V, at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified) Table 5.32 External Clock Input (XIN input)(1) Symbol Parameter External Clock Input Cycle Time External Clock Input HIGH Pulse Width External Clock Input LOW Pulse Width External Clock Rise Time External Clock Fall Time tc tw(H) tw(L) tr tf Standard Min. Max. (NOTE 2) (NOTE 3) (NOTE 3) (NOTE 4) (NOTE 4) Unit ns ns ns ns ns NOTES: 1. The condition is VCC1=VCC2=2.7 to 3.0V. 2. Calculated according to the VCC1 voltage as follows: 10 –6 ---------------------------------------- [ns] 20 × V C C2 – 44 3. Calculated according to the VCC1 voltage as follows: –6 10 ---------------------------------------- × 0.4 [ns] 20 × V C C1 – 44 4. Calculated according to the VCC1 voltage as follows: – 10 × V C C1 + 45 [ns] Table 5.33 Memory Expansion Mode and Microprocessor Mode Symbol tac1(RD-DB) tac2(RD-DB) tac3(RD-DB) tsu(DB-RD) tsu(RDY-BCLK) tsu(HOLD-BCLK) th(RD-DB) th(BCLK-RDY) th(BCLK-HOLD) Parameter Data Input Access Time (for setting with no wait) Data Input Access Time (for setting with wait) Data Input Access Time (when accessing multiplex bus area) Data Input Setup Time RDY Input Setup Time HOLD Input Setup Time Data Input Hold Time RDY Input Hold Time HOLD Input Hold Time Standard Min. Max. (NOTE 1) (NOTE 2) (NOTE 3) 50 40 50 0 0 0 NOTES: 1. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 60 [ ns ] f ( BCLK ) 2. Calculated according to the BCLK frequency as follows: 9 ( n – 0.5 ) x10 ------------------------------------ – 60 [ ns ] f ( BCLK ) n is ”2” for 1-wait setting, “3” for 2-wait setting and “4” for 3-wait setting. 3. Calculated according to the BCLK frequency as follows: 9 ( n – 0.5 ) x10 ------------------------------------ – 60 [ ns ] f ( BCLK ) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 n is “2” for 2-wait setting, “3” for 3-wait setting. Page 67 of 96 Unit ns ns ns ns ns ns ns ns ns M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V Timing Requirements (VCC1 = VCC2 = 3V, VSS = 0V, at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified) Table 5.34 Timer A Input (Counter Input in Event Counter Mode) Symbol tc(TA) tw(TAH) tw(TAL) Table 5.35 Parameter TAiIN Input Cycle Time TAiIN Input HIGH Pulse Width TAiIN Input LOW Pulse Width Table 5.36 Parameter TAiIN Input Cycle Time TAiIN Input HIGH Pulse Width TAiIN Input LOW Pulse Width Table 5.37 Parameter TAiIN Input Cycle Time TAiIN Input HIGH Pulse Width TAiIN Input LOW Pulse Width Table 5.38 Parameter TAiIN Input HIGH Pulse Width TAiIN Input LOW Pulse Width Standard Min. 600 300 300 Unit ns ns ns Standard Min. 300 150 150 Max. Unit ns ns ns Standard Min. 150 150 Parameter Max. Unit ns ns Standard tc(UP) TAiOUT Input Cycle Time Min. 3000 tw(UPH) tw(UPL) tsu(UP-TIN) th(TIN-UP) TAiOUT Input HIGH Pulse Width TAiOUT Input LOW Pulse Width TAiOUT Input Setup Time TAiOUT Input Hold Time 1500 1500 600 600 Max. Unit ns ns ns ns ns Timer A Input (Two-phase Pulse Input in Event Counter Mode) Symbol tc(TA) tsu(TAIN-TAOUT) tsu(TAOUT-TAIN) Max. Timer A Input (Counter Increment/Decrement Input in Event Counter Mode) Symbol Table 5.39 ns ns ns Timer A Input (External Trigger Input in Pulse Width Modulation Mode) Symbol tw(TAH) tw(TAL) Unit Timer A Input (External Trigger Input in One-shot Timer Mode) Symbol tc(TA) tw(TAH) tw(TAL) Max. Timer A Input (Gating Input in Timer Mode) Symbol tc(TA) tw(TAH) tw(TAL) Standard Min. 150 60 60 Parameter TAiIN Input Cycle Time TAiOUT Input Setup Time TAiIN Input Setup Time Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 68 of 96 Standard Min. 2 500 500 Max. Unit µs ns ns M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V Timing Requirements (VCC1 = VCC2 = 3V, VSS = 0V, at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified) Table 5.40 Timer B Input (Counter Input in Event Counter Mode) Symbol Parameter Standard tc(TB) tw(TBH) tw(TBL) tc(TB) TBiIN Input Cycle Time (counted on one edge) TBiIN Input HIGH Pulse Width (counted on one edge) TBiIN Input LOW Pulse Width (counted on one edge) TBiIN Input Cycle Time (counted on both edges) Min. 150 60 60 300 tw(TBH) tw(TBL) TBiIN Input HIGH Pulse Width (counted on both edges) TBiIN Input LOW Pulse Width (counted on both edges) 120 120 Table 5.41 Table 5.42 Parameter TBiIN Input Cycle Time TBiIN Input HIGH Pulse Width TBiIN Input LOW Pulse Width Table 5.43 Parameter TBiIN Input Cycle Time TBiIN Input HIGH Pulse Width TBiIN Input LOW Pulse Width tc(AD) Table 5.44 Parameter Table 5.45 tw(INL) Max. Unit ns ns ns Standard Min. 600 300 300 Max. Unit ns ns ns Standard ADTRG Input Cycle Time ADTRG Input LOW Pulse Width 200 Max. Unit ns ns Serial Interface Parameter CLKi Input Cycle Time CLKi Input HIGH Pulse Width CLKi Input LOW Pulse Width TXDi Output Delay Time TXDi Hold Time RXDi Input Setup Time RXDi Input Hold Time Standard Min. 300 150 150 Max. 160 0 100 90 Unit ns ns ns ns ns ns ns External Interrupt INTi Input Symbol tw(INH) Standard Min. 600 300 300 Min. 1500 Symbol tc(CK) tw(CKH) tw(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) ns ns A/D Trigger Input Symbol tw(ADL) ns ns ns ns Timer B Input (Pulse Width Measurement Mode) Symbol tc(TB) tw(TBH) tw(TBL) Unit Timer B Input (Pulse Period Measurement Mode) Symbol tc(TB) tw(TBH) tw(TBL) Max. Parameter Standard INTi Input HIGH Pulse Width Min. 380 INTi Input LOW Pulse Width 380 Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 69 of 96 Max. Unit ns ns M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V Switching Characteristics (VCC1 = VCC2 = 3V, VSS = 0V, at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified) Table 5.46 Memory Expansion and Microprocessor Modes (for setting with no wait) Symbol td(BCLK-AD) th(BCLK-AD) th(RD-AD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB) td(BCLK-HLDA) Parameter Address Output Delay Time Address Output Hold Time (in relation to BCLK) Address Output Hold Time (in relation to RD) Address Output Hold Time (in relation to WR) Chip Select Output Delay Time Chip Select Output Hold Time (in relation to BCLK) ALE Signal Output Delay Time ALE Signal Output Hold Time RD Signal Output Delay Time RD Signal Output Hold Time WR Signal Output Delay Time WR Signal Output Hold Time Data Output Delay Time (in relation to BCLK) Data Output Hold Time (in relation to BCLK) (3) Data Output Delay Time (in relation to WR) Data Output Hold Time (in relation to WR) (3) HLDA Output Delay Time See Figure 5.12 Standard Min. Max. 30 4 0 (NOTE 2) 30 4 25 −4 30 0 30 0 40 4 (NOTE 1) (NOTE 2) 40 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns NOTES: 1. Calculated according to the BCLK frequency as follows: 9 0.5x10 f(BCLK) is 12.5MHz or less. ------------------------ – 40 [ ns ] f ( BCLK ) 2. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 10 [ ns ] f ( BCLK ) 3. This standard value shows the timing when the output is off, and does not show hold time of data bus. Hold time of data bus varies with capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t = −CR X ln (1−VOL / VCC2) by a circuit of the right figure. For example, when VOL = 0.2VCC2, C = 30pF, R = 1kΩ, hold time of output ”L” level is t = −30pF X 1k Ω X In(1−0.2VCC2 / VCC2) = 6.7ns. P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 P14 Figure 5.12 Ports P0 to P14 Measurement Circuit Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 70 of 96 R DBi C 30pF M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V Switching Characteristics (VCC1 = VCC2 = 5V, VSS = 0V, at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified) Table 5.47 Memory Expansion and Microprocessor Modes (for 1- to 3-wait setting and external area access) Symbol Standard Min. Max. 30 4 0 Parameter td(BCLK-AD) th(BCLK-AD) th(RD-AD) Address Output Delay Time Address Output Hold Time (in relation to BCLK) Address Output Hold Time (in relation to RD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) td(BCLK-ALE) th(BCLK-ALE) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB) td(BCLK-HLDA) Address Output Hold Time (in relation to WR) Chip Select Output Delay Time Chip Select Output Hold Time (in relation to BCLK) ALE Signal Output Delay Time ALE Signal Output Hold Time RD Signal Output Delay Time RD Signal Output Hold Time WR Signal Output Delay Time WR Signal Output Hold Time Data Output Delay Time (in relation to BCLK) Data Output Hold Time (in relation to BCLK) (3) Data Output Delay Time (in relation to WR) Data Output Hold Time (in relation to WR)(3) HLDA Output Delay Time Unit ns ns ns (NOTE 2) ns ns ns ns ns ns ns ns ns ns ns ns ns ns 30 4 25 See Figure 5.12 -4 30 0 30 0 40 4 (NOTE 1) (NOTE 2) 40 NOTES: 1. Calculated according to the BCLK frequency as follows: 9 ( n – 0.5 ) x10 ------------------------------------ – 40 [ ns ] f ( BCLK ) n is “1” for 1-wait setting, “2” for 2-wait setting and “3” for 3-wait setting. (BCLK) is 12.5MHz or less. 2. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 10 [ ns ] f ( BCLK ) 3. This standard value shows the timing when the output is off, and does not show hold time of data bus. Hold time of data bus varies with capacitor volume and pull-up (pull-down) resistance value. Hold time of data bus is expressed in t = −CR X ln (1−VOL / VCC2) by a circuit of the right figure. For example, when VOL = 0.2VCC2, C = 30pF, R = 1kΩ, hold time of output ”L” level is t = −30pF X 1kΩ X In(1−0.2VCC2 / VCC2) = 6.7ns. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 71 of 96 R DBi C M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V Switching Characteristics (VCC1 = VCC2 = 5V, VSS = 0V, at Topr = −20 to 85°C / −40 to 85°C unless otherwise specified) Table 5.48 Memory Expansion and Microprocessor Modes (for 2- to 3-wait setting, external area access and multiplex bus selection) Symbol Standard Min. Max. 50 4 (NOTE 1) Parameter td(BCLK-AD) th(BCLK-AD) th(RD-AD) Address Output Delay Time Address Output Hold Time (in relation to BCLK) Address Output Hold Time (in relation to RD) th(WR-AD) td(BCLK-CS) th(BCLK-CS) th(RD-CS) th(WR-CS) td(BCLK-RD) th(BCLK-RD) td(BCLK-WR) th(BCLK-WR) td(BCLK-DB) th(BCLK-DB) td(DB-WR) th(WR-DB) td(BCLK-HLDA) td(BCLK-ALE) th(BCLK-ALE) td(AD-ALE) th(AD-ALE) td(AD-RD) td(AD-WR) tdz(RD-AD) Address Output Hold Time (in relation to WR) Chip Select Output Delay Time Chip Select Output Hold Time (in relation to BCLK) Chip Select Output Hold Time (in relation to RD) Chip Select Output Hold Time (in relation to WR) RD Signal Output Delay Time RD Signal Output Hold Time WR Signal Output Delay Time WR Signal Output Hold Time Data Output Delay Time (in relation to BCLK) Data Output Hold Time (in relation to BCLK) Data Output Delay Time (in relation to WR) Data Output Hold Time (in relation to WR) HLDA Output Delay Time ALE Signal Output Delay Time (in relation to BCLK) ALE Signal Output Hold Time (in relation to BCLK) ALE Signal Output Delay Time (in relation to Address) ALE Signal Output Hold Time (in relation to Address) RD Signal Output Delay From the End of Address WR Signal Output Delay From the End of Address Address Output Floating Start Time (NOTE 1) 50 4 (NOTE 1) (NOTE 1) 40 0 40 See Figure 5.12 NOTES: 1. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 10 [ ns ] f ( BCLK ) 2. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 50 [ ns ] f ( BCLK ) n is “2” for 2-wait setting, “3” for 3-wait setting. 3. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 40 [ ns ] f ( BCLK ) 4. Calculated according to the BCLK frequency as follows: 9 0.5x10 ------------------------ – 15 [ ns ] f ( BCLK ) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 72 of 96 0 50 4 (NOTE 2) (NOTE 1) 40 25 −4 (NOTE 3) (NOTE 4) 0 0 8 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V XIN input tw(H) tr tf tw(L) tc tc(TA) tw(TAH) TAiIN input tw(TAL) tc(UP) tw(UPH) TAiOUT input tw(UPL) TAiOUT input (Up/down input) During Event Counter Mode TAiIN input (When count on falling edge is selected) th(TIN-UP) tsu(UP-TIN) TAiIN input (When count on rising edge is selected) Two-Phase Pulse Input in Event Counter Mode tc(TA) TAiIN input tsu(TAIN-TAOUT) tsu(TAIN-TAOUT) tsu(TAOUT-TAIN) TAiOUT input tsu(TAOUT-TAIN) tc(TB) tw(TBH) TBiIN input tw(TBL) tc(AD) tw(ADL) ADTRG input Figure 5.13 Timing Diagram (1) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 73 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V tc(CK) tw(CKH) CLKi tw(CKL) th(C-Q) TXDi tsu(D-C) td(C-Q) RXDi tw(INL) INTi input tw(INH) Figure 5.14 Timing Diagram (2) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 74 of 96 th(C-D) M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics Memory Expansion Mode, Microprocessor Mode VCC1=VCC2=3V (Effective for setting with wait) BCLK RD (Separate bus) WR, WRL, WRH (Separate bus) RD (Multiplexed bus) WR, WRL, WRH (Multiplexed bus) RDY input tsu(RDY−BCLK) th(BCLK−RDY) (Common to setting with wait and setting without wait) BCLK th(BCLK−HOLD) tsu(HOLD−BCLK) HOLD input HLDA output td(BCLK−HLDA) P0, P1, P2, P3, P4, P5_0 to P5_2 (1) td(BCLK−HLDA) Hi−Z NOTES: 1. These pins are set to high-impedance regardless of the input level of the BYTE pin, PM06 bit in PM0 register and PM11 bit in PM1 register. Measuring conditions : · VCC1=VCC2=3V · Input timing voltage : Determined with V IL=0.6V, VIH=2.4V · Output timing voltage : Determined with V OL=1.5V, VOH=1.5V Figure 5.15 Timing Diagram (3) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 75 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V Memory Expansion Mode, Microprocessor Mode (for setting with no wait) Read timing BCLK td(BCLK-CS) th(BCLK-CS) 30ns.max 4ns.min CSi tcyc td(BCLK-AD) th(BCLK-AD) 30ns.max 4ns.min ADi BHE td(BCLK-ALE) th(BCLK-ALE) -4ns.min 30ns.max th(RD-AD) 0ns.min ALE td(BCLK-RD) 30ns.max th(BCLK-RD) 0ns.min RD tac1(RD-DB) (0.5 × tcyc-60)ns.max Hi-Z DBi tsu(DB-RD) 50ns.min th(RD-DB) 0ns.min Write timing BCLK td(BCLK-CS) th(BCLK-CS) 30ns.max 4ns.min CSi tcyc td(BCLK-AD) th(BCLK-AD) 30ns.max 4ns.min ADi BHE td(BCLK-ALE) th(BCLK-ALE) th(WR-AD) (0.5 × tcyc-10)ns.min -4ns.min 30ns.max ALE td(BCLK-WR) 30ns.max th(BCLK-WR) 0ns.min WR, WRL, WRH td(BCLK-DB) th(BCLK-DB) 40ns.max 4ns.min Hi-Z DBi tcyc= td(DB-WR) (0.5 × tcyc-40)ns.min 1 f(BCLK) Measuring conditions · VCC1=VCC2=3V · Input timing voltage : V IL=0.6V, VIH=2.4V · Output timing voltage : V OL=1.5V, VOH=1.5V Figure 5.16 Timing Diagram (4) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 76 of 96 th(WR-DB) (0.5 × tcyc-10)ns.min M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V Memory Expansion Mode, Microprocessor Mode (for 1-wait setting and external area access) Read timing BCLK td(BCLK−CS) th(BCLK−CS) 30ns.max 4ns.min CSi tcyc td(BCLK−AD) th(BCLK−AD) 30ns.max 4ns.min ADi BHE td(BCLK−ALE) th(RD−AD) th(BCLK−ALE) 0ns.min −4ns.min 30ns.max ALE td(BCLK−RD) th(BCLK−RD) 30ns.max 0ns.min RD tac2(RD−DB) (1.5 × tcyc−60)ns.max Hi−Z DBi th(RD−DB) tsu(DB−RD) 0ns.min 50ns.min Write timing BCLK td(BCLK−CS) th(BCLK−CS) 30ns.max 4ns.min CSi tcyc td(BCLK−AD) th(BCLK−AD) 30ns.max 4ns.min ADi BHE td(BCLK−ALE) th(BCLK−ALE) th(WR−AD) (0.5 × tcyc−10)ns.min −4ns.min 30ns.max ALE td(BCLK−WR) 30ns.max th(BCLK−WR) 0ns.min WR,WRL, WRH td(BCLK−DB) th(BCLK−DB) 40ns.max 4ns.min Hi−Z DBi td(DB−WR) tcyc= (0.5 × tcyc−40)ns.min 1 f(BCLK) Measuring conditions · VCC1=VCC2=3V · Input timing voltage : V IL=0.6V, VIH=2.4V · Output timing voltage : V OL=1.5V, VOH=1.5V Figure 5.17 Timing Diagram (5) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 77 of 96 th(WR−DB) (0.5 × tcyc−10)ns.min M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V Memory Expansion Mode, Microprocessor Mode (for 2-wait setting and external area access) Read timing tcyc BCLK th(BCLK-CS) 4ns.min td(BCLK-CS) 30ns.max CSi th(BCLK-AD) 4ns.min td(BCLK-AD) 30ns.max ADi BHE td(BCLK-ALE) 30ns.max th(RD-AD) 0ns.min th(BCLK-ALE) -4ns.min ALE th(BCLK-RD) 0ns.min td(BCLK-RD) 30ns.max RD tac2(RD-DB) (2.5 × tcyc-60)ns.max Hi-Z DBi tsu(DB-RD) 50ns.min th(RD-DB) 0ns.min Write timing tcyc BCLK td(BCLK-CS) 30ns.max th(BCLK-CS) 4ns.min td(BCLK-AD) 30ns.max th(BCLK-AD) 4ns.min CSi ADi BHE td(BCLK-ALE) 30ns.max th(WR-AD) (0.5 × tcyc-10)ns.min th(BCLK-ALE) -4ns.min ALE td(BCLK-WR) 30ns.max th(BCLK-WR) 0ns.min WR, WRL WRH td(BCLK-DB) 40ns.max Hi-Z DBi td(DB-WR) (1.5 × tcyc-40)ns.min tcyc= 1 f(BCLK) Measuring conditions · VCC1=VCC2=3V · Input timing voltage : V IL=0.6V, VIH=2.4V · Output timing voltage : V OL=1.5V, VOH=1.5V Figure 5.18 th(BCLK-DB) 4ns.min Timing Diagram (6) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 78 of 96 th(WR-DB) (0.5 × tcyc-10)ns.min M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1 = VCC2 = 3V Memory Expansion Mode, Microprocessor Mode (for 3-wait setting and external area access) Read timing tcyc BCLK th(BCLK-CS) td(BCLK-CS) 4ns.min 30ns.max CSi th(BCLK-AD) td(BCLK-AD) 4ns.min 30ns.max ADi BHE td(BCLK-ALE) th(RD-AD) th(BCLK-ALE) 30ns.max 0ns.min -4ns.min ALE th(BCLK-RD) td(BCLK-RD) 0ns.min 30ns.max RD tac2(RD-DB) (3.5 × tcyc-60)ns.max Hi-Z DBi tsu(DB-RD) th(RD-DB) 50ns.min 0ns.min Write timing tcyc BCLK th(BCLK-CS) td(BCLK-CS) 4ns.min 30ns.max CSi th(BCLK-AD) td(BCLK-AD) 4ns.min 30ns.max ADi BHE td(BCLK-ALE) 30ns.max th(WR-AD) th(BCLK-ALE) (0.5 × tcyc-10)ns.min -4ns.min ALE th(BCLK-WR) td(BCLK-WR) 0ns.min 30ns.max WR, WRL WRH td(BCLK-DB) th(BCLK-DB) 40ns.max 4ns.min Hi-Z DBi td(DB-WR) (2.5 × tcyc-40)ns.min tcyc= 1 f(BCLK) Measuring conditions · VCC1=VCC2=3V · Input timing voltage : V IL=0.6V, VIH=2.4V · Output timing voltage : V OL=1.5V, VOH=1.5V Figure 5.19 Timing Diagram (7) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 79 of 96 th(WR-DB) (0.5 × tcyc-10)ns.min M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics Memory Expansion Mode, Microprocessor Mode VCC1=VCC2=3V (For 2-wait setting, external area access and multiplex bus selection) Read timing BCLK td(BCLK-CS) th(BCLK-CS) th(RD-CS) (0.5×tcyc-10)ns.min tcyc 40ns.max 4ns.min CSi td(AD-ALE) (0.5×tcyc-40)ns.min ADi /DBi th(ALE-AD) (0.5×tcyc-15)ns.min Address 8ns.max Address Data input tdZ(RD-AD) tac3(RD-DB) (1.5×tcyc-60)ns.max tsu(DB-RD) th(RD-DB) 0ns.min 50ns.min td(AD-RD) 0ns.min td(BCLK-AD) th(BCLK-AD) 4ns.min 40ns.max ADi BHE td(BCLK-ALE) th(BCLK-ALE) 40ns.max th(RD-AD) (0.5×tcyc-10)ns.min -4ns.min ALE td(BCLK-RD) th(BCLK-RD) 40ns.max 0ns.min RD Write timing BCLK tcyc td(BCLK-CS) th(BCLK-CS) th(WR-CS) (0.5×tcyc-10)ns.min 40ns.max 4ns.min CSi th(BCLK-DB) td(BCLK-DB) 4ns.min 50ns.max ADi /DBi Address Address Data output td(DB-WR) (1.5×tcyc-50)ns.min td(AD-ALE) (0.5×tcyc-40)ns.min th(WR-DB) (0.5×tcyc-10)ns.min td(BCLK-AD) th(BCLK-AD) 4ns.min 40ns.max ADi BHE td(BCLK-ALE) 40ns.max td(AD-WR) th(BCLK-ALE) -4ns.min 0ns.min th(WR-AD) (0.5×tcyc-10)ns.min ALE td(BCLK-WR) 40ns.max WR,WRL, WRH tcyc= 1 f(BCLK) Measuring conditions · VCC1=VCC2=3V · Input timing voltage : V IL=0.6V, VIH=2.4V · Output timing voltage : V OL=1.5V, VOH=1.5V Figure 5.20 Timing Diagram (8) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 80 of 96 th(BCLK-WR) 0ns.min M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=3V Memory Expansion Mode, Microprocessor Mode (For 3-wait setting, external area access and multiplex bus selection) Read timing tcyc BCLK th(RD-CS) (0.5×tcyc-10)ns.min td(BCLK-CS) th(BCLK-CS) 6ns.min 40ns.max CSi td(AD-ALE) (0.5×tcyc-40)ns.min th(ALE-AD) (0.5×tcyc-15)ns.min ADi /DBi Data input Address td(BCLK-AD) 40ns.max tac3(RD-DB) 8ns.max td(AD-RD) (2.5×tcyc-60)ns.max 0ns.min ADi BHE th(RD-DB) tdZ(RD-AD) tsu(DB-RD) 0ns.min th(BCLK-AD) 50ns.min 4ns.min (No multiplex) td(BCLK-ALE) 40ns.max th(RD-AD) th(BCLK-ALE) (0.5×tcyc-10)ns.min -4ns.min ALE th(BCLK-RD) td(BCLK-RD) 0ns.min 40ns.max RD Write timing tcyc BCLK th(WR-CS) (0.5×tcyc-10)ns.min td(BCLK-CS) th(BCLK-CS) 4ns.min 40ns.max CSi th(BCLK-DB) td(BCLK-DB) 4ns.min 50ns.max ADi /DBi Address Data output td(AD-ALE) (0.5×tcyc-40)ns.min td(DB-WR) (2.5×tcyc-50)ns.min th(WR-DB) (0.5×tcyc-10)ns.min td(BCLK-AD) th(BCLK-AD) 40ns.max 4ns.min ADi BHE (No multiplex) td(BCLK-ALE) th(BCLK-ALE) 40ns.max -4ns.min th(WR-AD) td(AD-WR) (0.5×tcyc-10)ns.min 0ns.min ALE th(BCLK-WR) td(BCLK-WR) 40ns.max WR, WRL WRH tcyc= 1 f(BCLK) Measuring conditions · VCC1=VCC2=3V · Input timing voltage : V IL=0.6V, VIH=2.4V · Output timing voltage : V OL=1.5V, VOH=1.5V Figure 5.21 Timing Diagram (9) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 81 of 96 0ns.min M16C/62P Group (M16C/62P, M16C/62PT) 5.2 5. Electrical Characteristics Electrical Characteristics (M16C/62PT) Table 5.49 Symbol VCC1, VCC2 AVCC VI VO Pd Absolute Maximum Ratings Parameter Supply Voltage Analog Supply Voltage Input Voltage RESET, CNVSS, BYTE, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1, VREF, XIN P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 P7_0, P7_1 Output Voltage P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1, XOUT P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 P7_0, P7_1 Power Dissipation Condition VCC1=VCC2=AVCC VCC1=VCC2=AVCC −40°C<Topr≤85°C 85°C<Topr≤125°C Topr Tstg Operating Ambient Temperature When the Microcomputer is Operating Rated Value −0.3 to 6.5 −0.3 to 6.5 Unit V V −0.3 to VCC1+0.3 (1) V −0.3 to VCC2+0.3 (1) V −0.3 to 6.5 V −0.3 to VCC1+0.3 (1) V −0.3 to VCC2+0.3 (1) V −0.3 to 6.5 V 300 200 −40 to 85 / −40 to 125 (2) Flash Program Erase Storage Temperature 0 to 60 −65 to 150 mW °C °C NOTES: 1. There is no external connections for port P1_0 to P1_7, P4_4 to P4_7, P7_2 to P7_5 and P9_1 in 80-pin version. 2. T version = −40 to 85 °C, V version= −40 to 125 °C. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 82 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Recommended Operating Conditions (1) (1) Table 5.50 Symbol VCC1, VCC2 AVCC VSS AVSS VIH VIL IOH(peak) Parameter Supply Voltage (VCC1 = VCC2) Analog Supply Voltage Supply Voltage Analog Supply Voltage P3_1 to P3_7, P4_0 to P4_7, P5_0 to P5_7, HIGH Input P12_0 to P12_7, P13_0 to P13_7 Voltage (4) LOW Input Voltage (4) HIGH Peak Output Current (4) IOH(avg) HIGH Average Output Current (4) IOL(peak) LOW Peak Output Current (4) IOL(avg) LOW Average Output Current (4) f(XIN) f(XCIN) f(Ring) f(PLL) f(BCLK) tSU(PLL) 5. Electrical Characteristics Min. 4.0 Standard Typ. 5.0 VCC1 0 0 Max. 5.5 Unit 0.8VCC2 VCC2 V V V V V P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 (during single-chip mode) 0.8VCC2 VCC2 V P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1, XIN, RESET, CNVSS, BYTE 0.8VCC1 VCC1 V P7_0, P7_1 0.8VCC1 0 6.5 0.2VCC2 V V P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 (during single-chip mode) 0 0.2VCC2 V P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1, XIN, RESET, CNVSS, BYTE 0 0.2VCC V P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 −10.0 mA P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 −5.0 mA P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 10.0 mA P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 5.0 mA 16 50 2 24 24 20 MHz kHz MHz MHz MHz ms P3_1 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 Main Clock Input Oscillation Frequency Sub-Clock Oscillation Frequency On-chip Oscillation Frequency PLL Clock Oscillation Frequency CPU Operation Clock PLL Frequency Synthesizer Stabilization Wait Time VCC1=4.0V to 5.5V VCC1=4.0V to 5.5V VCC1=5.5V 0 0.5 10 0 32.768 1 NOTES: 1. Referenced to VCC1 = VCC2 = 4.7 to 5.5V at Topr = −40 to 85°C / −40 to 125°C unless otherwise specified. T version = −40 to 85 °C, V version= −40 to 125 °C. 2. The Average Output Current is the mean value within 100ms. 3. The total IOL(peak) for ports P0, P1, P2, P8_6, P8_7, P9, P10 P1, P14_0 and P14_1 must be 80mA max. The total IOL(peak) for ports P3, P4, P5, P6, P7, P8_0 to P8_4, P12, and P13 must be 80mA max. The total IOH(peak) for ports P0, P1, and P2 must be −40mA max. The total IOH(peak) for ports P3, P4, P5, P12, and P13 must be −40mA max. The total IOH(peak) for ports P6, P7, and P8_0 to P8_4 must be −40mA max. The total IOH(peak) for ports P8_6, P8_7, P9 , P10, P11, P14_0, and P14_1 must be −40mA max. As for 80-pin version, the total IOL(peak) for all ports and IOH(peak) must be 80mA. max. due to one VCC and one VSS. 4. There is no external connections for port P1_0 to P1_7, P4_4 to P4_7, P7_2 to P7_5 and P9_1 in 80-pin version. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 83 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 5.51 A/D Conversion Characteristics (1) Symbol − INL − Parameter Resolution Integral Non-Linearity Error Absolute Accuracy − DNL − − RLADDER tCONV tCONV tSAMP VREF VIA 5. Electrical Characteristics 10bit 8bit 10bit 8bit Tolerance Level Impedance Differential Non-Linearity Error Offset Error Gain Error Ladder Resistance 10-bit Conversion Time, Sample & Hold Function Available 8-bit Conversion Time, Sample & Hold Function Available Sampling Time Reference Voltage Analog Input Voltage Measuring Condition Min. VREF=VCC1 VREF= AN0 to AN7 input, VCC1= AN0_0 to AN0_7 input, AN2_0 to AN2_7 input, 5V ANEX0, ANEX1 input External operation amp connection mode VREF=VCC1=5V VREF= AN0 to AN7 input, VCC1= AN0_0 to AN0_7 input, 5V AN2_0 to AN2_7 input, ANEX0, ANEX1 input External operation amp connection mode VREF=VCC1=5V Standard Typ. Max. 10 ±3 10 2.75 VREF=VCC1=5V, φAD=12MHz 2.33 Bits LSB ±7 LSB ±2 ±3 LSB LSB ±7 LSB ±2 LSB kΩ LSB LSB LSB kΩ µs 3 VREF=VCC1 VREF=VCC1=5V, φAD=12MHz Unit ±1 ±3 ±3 40 µs µs 0.25 2.0 0 VCC1 VREF V V NOTES: 1. Referenced to VCC1=AVCC=VREF=4.0 to 5.5V, VSS=AVSS=0V at Topr = −40 to 85°C / −40 to 125°C unless otherwise specified. T version = −40 to 85°C, V version =−40 to 125°C 2. φAD frequency must be 12 MHz or less. 3. When sample & hold is disabled, φAD frequency must be 250 kHz or more, in addition to the limitation in Note 2. When sample & hold is enabled, φAD frequency must be 1MHz or more, in addition to the limitation in Note 2. Table 5.52 D/A Conversion Characteristics (1) Symbol − − tSU RO IVREF Parameter Resolution Absolute Accuracy Setup Time Output Resistance Reference Power Supply Input Current Measuring Condition Min. 4 (NOTE 2) Standard Typ. 10 Max. 8 1.0 3 20 1.5 Unit Bits % µs kΩ mA NOTES: 1. Referenced to VCC1=VREF=4.0 to 5.5V, VSS=AVSS=0V at Topr = −40 to 85°C / −40 to 125°C unless otherwise specified. T version = −40 to 85°C, V version =−40 to 125°C 2. This applies when using one D/A converter, with the D/A register for the unused D/A converter set to “00h”. The resistor ladder of the A/D converter is not included. Also, when D/A register contents are not “00h”, the IVREF will flow even if Vref id disconnected by the A/D control register. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 84 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 5.53 5. Electrical Characteristics Flash Memory Version Electrical Characteristics (1) for 100 cycle products (B, U) Symbol Parameter − Program and Erase Endurance (3) Word Program Time (VCC1=5.0V) Lock Bit Program Time Block Erase Time (VCC1=5.0V) − − − − − − − tPS − Min. 100 4-Kbyte block 8-Kbyte block 32-Kbyte block 64-Kbyte block Erase All Unlocked Blocks Time (2) Flash Memory Circuit Stabilization Wait Time Data Hold Time (5) Table 5.54 Program and Erase Endurance (3, 8, 9) Word Program Time (VCC1=5.0V) Lock Bit Program Time Block Erase Time (VCC1=5.0V) Flash Memory Circuit Stabilization Wait Time Data Hold Time (5) − − tPS − 4 200 200 4 4 4 4 4×n 15 20 Parameter − 25 25 0.3 0.3 0.5 0.8 Max. Unit cycle µs µs s s s s s µs year Flash Memory Version Electrical Characteristics (6) for 10,000 cycle products (B7, U7) (Block A and Block 1 (7)) Symbol − Standard Typ. Min. 10,000 (4) 4-Kbyte block Standard Typ. 4 Max. cycle µs µs s 25 25 0.3 15 20 Unit µs year NOTES: 1. Referenced to VCC1=4.5 to 5.5V at Topr = 0 to 60 °C unless otherwise specified. 2. n denotes the number of block erases. 3. Program and Erase Endurance refers to the number of times a block erase can be performed. If the program and erase endurance is n (n=100, 1,000, or 10,000), each block can be erased n times. For example, if a 4 Kbytes block A is erased after writing 1 word data 2,048 times, each to a different address, this counts as one program and erase endurance. Data cannot be written to the same address more than once without erasing the block. (Rewrite prohibited) 4. Maximum number of E/W cycles for which operation is guaranteed. 5. Ta (ambient temperature)=55 °C. As to the data hold time except Ta=55 °C, please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor. 6. Referenced to VCC1 = 4.5 to 5.5V at Topr = −40 to 85 °C (B7, U7 (T version)) / −40 to 125 °C (B7, U7 (V version)) unless otherwise specified. 7. Table 5.54 applies for block A or block 1 program and erase endurance > 1,000. Otherwise, use Table 5.53. 8. To reduce the number of program and erase endurance when working with systems requiring numerous rewrites, write to unused word addresses within the block instead of rewrite. Erase block only after all possible addresses are used. For example, an 8-word program can be written 256 times maximum before erase becomes necessary. Maintaining an equal number of erasure between block A and block 1 will also improve efficiency. It is important to track the total number of times erasure is used. 9. Should erase error occur during block erase, attempt to execute clear status register command, then block erase command at least three times until erase error disappears. 10. Set the PM17 bit in the PM1 register to “1” (wait state) when executing more than 100 times rewrites (B7 and U7). 11. Customers desiring E/W failure rate information should contact their Renesas technical support representative. Table 5.55 Flash Memory Version Program/Erase Voltage and Read Operation Voltage Characteristics (at Topr = 0 to 60 °C(B, U), Topr = −40 to 85 °C (B7, U7 (T version)) / −40 to 125 °C (B7, U7 (V version)) Flash Program, Erase Voltage VCC1 = 5.0 V ± 0.5 V Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 85 of 96 Flash Read Operation Voltage VCC1=4.0 to 5.5 V M16C/62P Group (M16C/62P, M16C/62PT) Table 5.56 Power Supply Circuit Timing Characteristics Symbol td(P-R) td(R-S) td(W-S) 5. Electrical Characteristics Parameter Measuring Condition Time for Internal Power Supply Stabilization During Powering-On STOP Release Time Low Power Dissipation Mode Wait Mode Release Time Standard Typ. VCC1=4.0V to 5.5V Time for Internal Power Supply Stabilization During Powering-On VCC1 td(P-R) CPU clock Interrupt for (a) Stop mode release or (b)Wait mode release td(R-S) STOP Release Time td(W-S) Low Power Dissipation Mode Wait Mode Release Time CPU clock (a) (b) Power Supply Circuit Timing Diagram Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 86 of 96 Max. 2 150 150 Recommended operation voltage td(P-R) Figure 5.22 Min. td(R-S) td(W-S) Unit ms µs µs M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Table 5.57 Electrical Characteristics (1) Symbol VOH VOH VOH Parameter HIGH Output Voltage (2) HIGH Output Voltage (2) IOH=−5mA P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 IOH=−5mA P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 OH=−200µA P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 IOH=−200µA HIGH Output Voltage VOL VOL LOW Output Voltage (2) LOW Output Voltage (2) XOUT XCOUT IOH=−1mA IOH=−0.5mA HIGHPOWER With no load applied LOWPOWER With no load applied IOL=5mA P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 IOL=5mA P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 IOL=200µA P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P12_0 to P12_7, P13_0 to P13_7 IOL=200µA LOW Output Voltage Hysteresis HIGHPOWER LOWPOWER P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 XOUT LOW Output Voltage VT+-VT- Measuring Condition P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P14_0, P14_1 HIGH Output Voltage VOL (1) XCOUT HIGHPOWER IOL=1mA LOWPOWER IOL=0.5mA HIGHPOWER With no load applied LOWPOWER With no load applied HOLD, RDY, TA0IN to TA4IN, TB0IN to TB5IN, INT0 to INT5, NMI, ADTRG, CTS0 to CTS2, CLK0 to CLK4, TA0OUT to TA4OUT, KI0 to KI3, RXD0 to RXD2, SCL0 to SCL2, SDA0 to SDA2, SIN3, SIN4 RESET P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7, P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1, XIN, RESET, CNVSS, BYTE VI=5V P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7,P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1, XIN, RESET, CNVSS, BYTE VI=0V P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7, P11_0 to P11_7,P12_0 to P12_7, P13_0 to P13_7, P14_0, P14_1 VI=0V (2) RfXIN RfXCIN VRAM VCC1 VCC2−2.0 VCC2 VCC1−0.3 VCC1 V V VCC2−0.3 VCC2 VCC1−2.0 VCC1−2.0 VCC1 VCC1 2.5 1.6 V V V 2.0 2.0 V 0.2 1.0 V 0.2 2.5 V 5.0 µA −5.0 µA 170 kΩ 30 50 1.5 15 Feedback Resistance XCIN At stop mode V 0 0 Feedback Resistance XIN RAM Retention Voltage V 0.45 HIGH Input Current (2) Resistance VCC1−2.0 Unit 0.45 IIH RPULLUP Pull-Up Max. 2.0 Hysteresis LOW Input Current (2) Standard Typ. 2.0 VT+-VT- IIL Min. 2.0 MΩ MΩ V NOTES: 1. Referenced to VCC1=VCC2=4.0 to 5.5V, VSS = 0V at Topr = −40 to 85°C / −40 to 125°C, f(BCLK)=24MHz unless otherwise specified. T version = −40 to 85°C, V version =−40 to 125°C. 2. There is no external connections for port P1_0 to P1_7, P4_4 to P4_7, P7_2 to P7_5 and P9_1 in 80-pin version. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 87 of 96 M16C/62P Group (M16C/62P, M16C/62PT) Table 5.58 Electrical Characteristics (2) (1) Symbol ICC 5. Electrical Characteristics Parameter Power Supply Current In single-chip (VCC1=VCC2=4.0V to 5.5V) mode, the output pins are open and other pins are VSS Measuring Condition Mask ROM f(BCLK)=24MHz No division, PLL operation No division, On-chip oscillation Flash Memory Flash Memory Program Flash Memory Erase Mask ROM Flash Memory Standard Typ. Max. 14 20 1 Unit mA mA f(BCLK)=24MHz, No division, PLL operation 18 No division, On-chip oscillation 1.8 mA f(BCLK)=10MHz, VCC1=5.0V 15 mA f(BCLK)=10MHz, VCC1=5.0V 25 mA f(XCIN)=32kHz Low power dissipation mode, ROM (3) 25 µA f(BCLK)=32kHz Low power dissipation mode, RAM (3) 25 µA 420 µA On-chip oscillation, Wait mode 50 µA f(BCLK)=32kHz Wait mode (2), Oscillation capability High 7.5 µA f(BCLK)=32kHz Wait mode (2), Oscillation capability Low 2.0 µA Stop mode Topr =25°C 2.0 f(BCLK)=32kHz Low power dissipation mode, Flash Memory (3) Mask ROM Flash Memory Min. 27 mA 6.0 µA Stop mode Topr =85°C 20 µA Stop mode Topr =125°C TBD µA NOTES: 1. Referenced to VCC1=VCC2=4.0 to 5.5V, VSS = 0V at Topr = −40 to 85°C / −40 to 125°C, f(BCLK)=24MHz unless otherwise specified. T version = −40 to 85°C, V version =−40 to 125°C. 2. With one timer operated using fC32. 3. This indicates the memory in which the program to be executed exists. Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 88 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Timing Requirements (VCC1 = VCC2 = 5V, VSS = 0V, at Topr = −40 to 85°C (T version) / −40 to 125°C (V version) unless otherwise specified) Table 5.59 External Clock Input (XIN input) Symbol tc tw(H) tw(L) tr tf Parameter External Clock Input Cycle Time External Clock Input HIGH Pulse Width External Clock Input LOW Pulse Width External Clock Rise Time External Clock Fall Time Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 89 of 96 Standard Min. 62.5 25 25 Max. 15 15 Unit ns ns ns ns ns M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Timing Requirements (VCC1 = VCC2 = 5V, VSS = 0V, at Topr = −40 to 85°C (T version) / −40 to 125°C (V version) unless otherwise specified) Table 5.60 Timer A Input (Counter Input in Event Counter Mode) Symbol tc(TA) tw(TAH) tw(TAL) Table 5.61 Parameter TAiIN Input Cycle Time TAiIN Input HIGH Pulse Width TAiIN Input LOW Pulse Width Table 5.62 Parameter TAiIN Input Cycle Time TAiIN Input HIGH Pulse Width TAiIN Input LOW Pulse Width Table 5.63 Parameter TAiIN Input Cycle Time TAiIN Input HIGH Pulse Width TAiIN Input LOW Pulse Width Table 5.64 Parameter TAiIN Input HIGH Pulse Width TAiIN Input LOW Pulse Width Table 5.65 Parameter TAiOUT Input Cycle Time TAiOUT Input HIGH Pulse Width TAiOUT Input LOW Pulse Width TAiOUT Input Setup Time TAiOUT Input Hold Time Max. Unit ns ns ns Standard Min. 200 100 100 Max. Unit ns ns ns Standard Min. 100 100 Max. Unit ns ns Standard Min. Max. 2000 1000 1000 400 400 Unit ns ns ns ns ns Timer A Input (Two-phase Pulse Input in Event Counter Mode) Symbol tc(TA) tsu(TAIN-TAOUT) tsu(TAOUT-TAIN) Standard Min. 400 200 200 Timer A Input (Counter Increment/Decrement Input in Event Counter Mode) Symbol tc(UP) tw(UPH) tw(UPL) tsu(UP-TIN) th(TIN-UP) ns ns ns Timer A Input (External Trigger Input in Pulse Width Modulation Mode) Symbol tw(TAH) tw(TAL) Unit Timer A Input (External Trigger Input in One-shot Timer Mode) Symbol tc(TA) tw(TAH) tw(TAL) Max. Timer A Input (Gating Input in Timer Mode) Symbol tc(TA) tw(TAH) tw(TAL) Standard Min. 100 40 40 Parameter TAiIN Input Cycle Time TAiOUT Input Setup Time TAiIN Input Setup Time Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 90 of 96 Standard Min. 800 200 200 Max. Unit ns ns ns M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Timing Requirements (VCC1 = VCC2 = 5V, VSS = 0V, at Topr = −40 to 85°C (T version) / −40 to 125°C (V version) unless otherwise specified) Table 5.66 Timer B Input (Counter Input in Event Counter Mode) Symbol tc(TB) tw(TBH) tw(TBL) tc(TB) tw(TBH) tw(TBL) Table 5.67 Parameter TBiIN Input Cycle Time (counted on one edge) TBiIN Input HIGH Pulse Width (counted on one edge) TBiIN Input LOW Pulse Width (counted on one edge) TBiIN Input Cycle Time (counted on both edges) TBiIN Input HIGH Pulse Width (counted on both edges) TBiIN Input LOW Pulse Width (counted on both edges) Table 5.68 Parameter TBiIN Input Cycle Time TBiIN Input HIGH Pulse Width TBiIN Input LOW Pulse Width Table 5.69 Parameter TBiIN Input Cycle Time TBiIN Input HIGH Pulse Width TBiIN Input LOW Pulse Width Standard Min. 400 200 200 Parameter tw(ADL) ADTRG input LOW Pulse Width 125 Unit ns ns ns Max. Unit ns ns Serial Interface Symbol Parameter CLKi Input Cycle Time CLKi Input HIGH Pulse Width CLKi Input LOW Pulse Width TXDi Output Delay Time TXDi Hold Time RXDi Input Setup Time RXDi Input Hold Time Standard Min. 200 100 100 Max. 80 0 70 90 Unit ns ns ns ns ns ns ns External Interrupt INTi Input Symbol tw(INL) Max. Standard ADTRG Input Cycle Time tw(INH) Unit ns ns ns Standard tc(AD) Table 5.71 Max. Min. 400 200 200 Min. 1000 tc(CK) tw(CKH) tw(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) ns ns ns ns ns ns A/D Trigger Input Symbol Table 5.70 Unit Timer B Input (Pulse Width Measurement Mode) Symbol tc(TB) tw(TBH) tw(TBL) Max. Timer B Input (Pulse Period Measurement Mode) Symbol tc(TB) tw(TBH) tw(TBL) Standard Min. 100 40 40 200 80 80 Parameter Standard INTi Input HIGH Pulse Width Min. 250 INTi Input LOW Pulse Width 250 Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 91 of 96 Max. Unit ns ns M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V Switching Characteristics (VCC1 = VCC2 = 5V, VSS = 0V, at Topr = −40 to 85°C (T version) / −40 to 125°C (V version) unless otherwise specified) P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 Figure 5.23 Ports P0 to P10 Measurement Circuit Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 92 of 96 30pF M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V XIN input tw(H) tr tf tw(L) tc tc(TA) tw(TAH) TAiIN input tw(TAL) tc(UP) tw(UPH) TAiOUT input tw(UPL) TAiOUT input (Up/down input) During event counter mode TAiIN input (When count on falling edge is selected) TAiIN input (When count on rising edge is selected) th(TIN-UP) tsu(UP-TIN) Two-phase pulse input in event counter mode tc(TA) TAiIN input tsu(TAIN-TAOUT) tsu(TAIN-TAOUT) tsu(TAOUT-TAIN) TAiOUT input tsu(TAOUT-TAIN) tc(TB) tw(TBH) TBiIN input tw(TBL) tc(AD) tw(ADL) ADTRG input Figure 5.24 Timing Diagram (1) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 93 of 96 M16C/62P Group (M16C/62P, M16C/62PT) 5. Electrical Characteristics VCC1=VCC2=5V tc(CK) tw(CKH) CLKi tw(CKL) th(C-Q) TXDi tsu(D-C) td(C-Q) RXDi tw(INL) INTi input tw(INH) Figure 5.25 Timing Diagram (2) Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 94 of 96 th(C-D) M16C/62P Group (M16C/62P, M16C/62PT) Appendix 1. Package Dimensions Appendix 1.Package Dimensions JEITA Package Code RENESAS Code Previous Code MASS[Typ.] P-LQFP128-14x20-0.50 PLQP0128KB-A 128P6Q-A 0.9g HD *1 D 102 65 103 64 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. bp c *2 E HE c1 b1 Reference Symbol ZE Terminal cross section Dimension in Millimeters Min Nom Max D 19.9 20.0 20.1 E 13.9 14.0 14.1 A2 128 39 38 ZD HD 21.8 22.0 22.2 HE 15.8 16.0 16.2 A1 0.05 0.125 0.2 bp 0.17 0.22 0.27 A A A2 Index mark c 1 1.4 F 1.7 0.20 b1 A1 c *3 y e DetailF 8° 0.5 0.10 x y 0.10 ZD 0.75 ZE 0.75 L 0.35 JEITA Package Code RENESAS Code Previous Code MASS[Typ.] PRQP0100JB-A 100P6S-A 1.6g 0.5 0.65 1.0 L1 P-QFP100-14x20-0.65 0.20 0.125 e x 0.145 0° L1 bp 0.09 c1 L HD *1 D 80 51 81 50 HE *2 E NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. ZE Reference Symbol 100 31 Dimension in Millimeters Min Nom Max D 19.8 20.0 20.2 E 13.8 14.0 HD 22.5 22.8 23.1 30 Index mark ZD c F A2 1 HE 16.5 16.8 17.1 A1 0 0.1 0.2 bp 0.25 0.3 0.4 c 0.13 0.15 A1 A A L *3 e y 3.05 0° bp Detail F e 0.5 0.65 0.575 ZD Page 95 of 96 0.8 0.10 ZE Rev.2.41 Jan 10, 2006 REJ03B0001-0241 0.2 10° y L 14.2 2.8 A2 0.825 0.4 0.6 0.8 M16C/62P Group (M16C/62P, M16C/62PT) JEITA Package Code RENESAS Code P-LQFP100-14x14-0.50 PLQP0100KB-A Appendix 1. Package Dimensions Previous Code MASS[Typ.] 100P6Q-A / FP-100U / FP-100UV 0.6g HD *1 D 51 75 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 50 76 bp c1 Reference Symbol c E *2 HE b1 Terminal cross section 26 Nom 13.9 14.0 14.1 E 13.9 14.0 14.1 HD 15.8 16.0 16.2 HE 15.8 16.0 16.2 A1 0.05 0.1 0.15 bp 0.15 0.20 0.25 A2 ZE 100 Dimension in Millimeters Min D 1.4 A 1 25 Index mark ZD F 1.7 0.18 b1 0.09 c 0° *3 e bp A1 e y 0.08 0.08 1.0 ZD Detail F 1.0 ZE L 0.35 RENESAS Code Previous Code MASS[Typ.] PRQP0080JA-A 80P6S-A 1.1g 0.5 0.65 1.0 L1 P-QFP80-14x14-0.65 8° y L1 0.20 0.5 x L x JEITA Package Code 0.145 0.125 c1 A2 A c Max HD *1 D 60 41 61 40 HE ZE *2 E NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. Reference Symbol 80 1 20 ZD c Nom Max D 13.8 14.0 14.2 E 13.8 14.0 14.2 A2 A2 Index mark Dimension in Millimeters Min 21 F 2.8 HD 16.5 16.8 17.1 HE 16.5 16.8 17.1 A1 0 0.1 0.2 bp 0.25 0.3 0.4 c 0.13 0.15 A A1 A L Detail F *3 e y 3.05 0° bp e 0.5 0.65 y 0.825 ZD Rev.2.41 Jan 10, 2006 REJ03B0001-0241 Page 96 of 96 0.8 0.10 ZE L 0.2 10° 0.825 0.4 0.6 0.8 REVISION HISTORY Rev. Date 1.10 May 28, 2003 M16C/62P Group (M16C/62P, M16C/62PT) Hardware Manual Description Page Summary 1 Applications are partly revised. 2 Table 1.1.1 is partly revised. 4-5 Table 1.1.2 and 1.1.3 is partly revised. “Note 1” is partly revised. 22 23 Table 1.5.3 is partly revised. Table 1.5.5 is partly revised. Table 1.5.6 is added. 24 30 31 Table 1.5.9 is partly revised. Notes 1 and 2 in Table 1.5.26 is partly revised. Notes 1 in Table 1.5.27 is partly revised. 30-31 32 Note 3 is added to “Data output hold time (refers to BCLK)” in Table 1.5.26 and 1.5.27. Note 4 is added to “th(ALE-AD)” in Table 1.5.28. 30-32 Switching Characteristics is partly revised. 36-39 th(WR-AD) and th(WR-DB) in Figure 1.5.5 to 1.5.8 is partly revised. 40-41 th(ALE-AD), th(WR-CS), th(WR-DB) and th(WR-AD) in Figure 1.5.9 to 42 1.5.10 is partly revised. Note 2 is added to Table 1.5.29. Notes 1 and 2 in Table 1.5.45 is partly revised. 47 Notes 1 in Table 1.5.46 is partly revised. 48 47-48 Note 3 is added to “Data output hold time (refers to BCLK)” in Table 1.5.45 and 1.5.46. Note 4 is added to “th(ALE-AD)” in Table 1.5.47. 49 47-48 Switching Characteristics is partly revised. 53-56 th(WR-AD) and th(WR-DB) in Figure 1.5.15 to 1.5.18 is partly revised. 57-58 th(ALE-AD), th(WR-CS), th(WR-DB) and th(WR-AD) in Figure 1.5.19 to 1.5.20 is partly revised. 2.00 Oct 29, 2003 2-4 Since high reliability version is added, a group name is revised. M16C/62 Group (M16C/62P) → M16C/62 Group (M16C/62P, M16C/62PT) Table 1.1 to 1.3 are revised. Note 3 is partly revised. Table 1.1 to 1.3 are revised. Note 3 is partly revised. Figure 1.2 Note5 is deleted. 6 7-9 Table 1.4 to 1.7 Product List is partly revised. Table 1.8 and Figure 1.4 are added. 11 12-15 Figure 1.5 to 1.9 ZP is added. 17,19 Table 1.10 and 1.12 ZP is added to timer A. 18,20 Table 1.11 and 1.13 VCC1 is added to VREF. 30 Table 5.1 is revised. 31-32 Table 5.2 and 5.3 are revised. 2-4 C-1 REVISION HISTORY Rev. Date M16C/62P Group (M16C/62P, M16C/62PT) Hardware Manual Description Page Summary Table 5.4 A-D Conversion Characteristics is revised. Table 5.5 D-A Conversion Characteristics revised. 34,74 Table 5.6 to 5.7 and table 5.54 to 5.55 are revised. Table 5.11 is revised. 36 38,55 Table 5.14 and 5.33 HLDA output deley time is deleted. Figure 5.1 is partly revised. 41 41-43, Table 5.27 to 5.29 and table 5.46 to 48 HLDA output deley time is added. 58-60 Figure 5.2 Timing Diagram (1) XIN input is added. 44 33 47-48 49-50 52 53 58 61 64-65 66-67 69 70-85 2.10 2.11 Nov 07, 2003 Jan 06, 2004 8-9 23 Table 1.5 to 1.7 Product List is partly revised. Note 1 is deleted. Table 3.1 is revised. 71 72 Table 5.50 is revised. Table 5.51 is deleted. 16 Table 1.9 NOTE 3 VCC1 VCC2 → VCC1 > VCC2 17-18 Table 1.10 to 1.11 NOTE 1 VCC1 VCC2 → VCC1 > VCC2 31 2.30 Sep 01, 2004 Figure 5.5 to 5.6 Read timing DB → DBi Figure 5.7 to 5.8 Write timing DB → DBi Figure 5.10 DB → DBi Table 5.30 is revised. Figure 5.11 is partly revised. Figure 5.12 Timing Diagram (1) XIN input is added. Figure 5.15 to 5.16 Read timing DB → DBi Figure 5.17 to 5.18 Write timing DB → DBi Figure 5.20 DB → DBi Electrical Characteristics (M16C/62PT) is added. 12 18, 20 19,21 24 25 33 34 35 37 Table 5.2 Power Supply Ripple Allowable Frequency Unit MHz → kHz Table 1.9 and Figure 1.5 are added. Table 1.11 to 1.13 are revised. Table 1.12 to 1.14 are revised. Figure 3.1 is partly revised. Note 3 is added. Note 6 is added. Table 5.3 is revised. Note 2 in Table 5.4 is added. Table 5.5 to 5.6 is partly revised. Table 5.8 is revised. Table 5.9 is revised. Table 5.11 is revised. C-2 REVISION HISTORY Rev. Date Description Page 40 57 70 72 73 74 76 79 2.41 Jan 01, 2006 M16C/62P Group (M16C/62P, M16C/62PT) Hardware Manual 2-4 Summary Table 5.24 is partly revised. Table 5.43 is partly revised. Table 5.48 is partly revised. Table 5.50 is partly revised. Table 5.53 is partly revised. Table 5.55 is revised. Table 5.57 is partly revised. Table 5.69 is partly revised. voltage down detection reset -> brown-out detection Reset Tables 1.1 to 1.3 Performance outline of M16C/62P group are partly revised. 7 Table 1.4 Product List (1) is partly revised. Note 1 is added. 8 Table 1.5 Product List (2) is partly revised. Note 1, 2 and 3 are added. 9 Table 1.6 Product List (3) is partly revised. Note 1 and 2 are added. 10 Table 1.7 Product List (4) is partly revised. Note 1 and 2 are added. 11 Figure 1.3 Type No., Memory Size, Shows RAM capacity, and Package is partly revised 12 Table 1.8 Product Code of Flash Memory version and ROMless version for M16C/62P is partly revised. 13 Table 1.9 Product Code of Flash Memory version for M16C/62P is partly revised. 14 Figure 1.6 Pin Configuration (Top View) is partly revised. 15-17 Tables 1.10 to 1.12 Pin Characteristics for 128-Pin Package are added. 18-19 Figure 1.7 and 1.8 Pin Configuration (Top View) are partly revised. 20-21 Tables 1.13 to 1.14 Pin Characteristics for 100-Pin Package are added. 22 Figure 1.9 Pin Configuration (Top View) is partly revised. 23-24 Tables 1.15 to 1.16 Pin Characteristics for 80-Pin Package are added. 25-29 Tables 1.17 to 1.21 are partly revised. 34 Note 4 of Table 4.1 SFR Information is partly revised. 43 Table 5.4 A/D Conversion Characteristics is partly revised. 45 Table 5.6 Flash Memory Version Electrical Characteristics for 100 cycle products is partly revised. Table 5.7 Flash Memory Version Electrical Characteristics for 10,000 cycle products is partly revised. Table 5.8 Flash Memory Version Program / Erase Voltage and Read Operation Voltage Characteristics is partly revised. 46 Table 5.9 Low Voltage Detection Circuit Electrical Characteristics is partly revised. C-3 REVISION HISTORY Rev. Date M16C/62P Group (M16C/62P, M16C/62PT) Hardware Manual Description Page Summary 47 Figure 5.1 Power Supply Circuit Timing Diagram is partly revised. 48 Table 5.11 Electrical Characteristics (1) is partly deleted. 49 Table 5.12 Electrical Characteristics (2) is partly revised. 50 Note 1 of Table 5.13 External Clock Input (XIN input) is added. 67 Notes 1 to 4 of Table 5.32 External Clock Input (XIN input) are added. 85 Table 5.53 Flash Memory Version Electrical Characteristics for 100 cycle products is partly revised. Standard (Min.) is partly revised. Table 5.54 Flash Memory Version Electrical Characteristics for 10,000 cycle products is partly revised. Standard (Min.) is partly revised. Note 5 is revised. Table 23.55 Flash Memory Version Program / Erase Voltage and Read Operation Voltage Characteristics is partly revised. 87 Table 5.57 Electrical Characteristics (1) is partly deleted. 88 Table 5.58 Electrical Characteristics is partly revised. C-4 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. 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