MICROCHIP 24C02CI/SN

24C02C
2K 5.0V I2C™ Serial EEPROM
Features:
• Single-supply with operation from 4.5 to 5.5V
• Low-power CMOS technology:
- Read current 1 mA, typical
- Standby current 10 μA, typical
• 2-wire serial interface, I2C compatible
• Cascadable up to eight devices
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz and 400 kHz clock compatibility
• Fast Page or Byte write time 1 ms, typical
• Self-timed erase/write cycle
• 16-byte page write buffer
• Hardware write-protect for upper half of the array
(80h-FFh)
• ESD protection >4,000V
• More than 1 million erase/write cycles
• Data retention >200 years
• Factory programming available
• Packages include 8-lead PDIP, SOIC, TSSOP,
DFN and MSOP
• Pb-free and RoHS compliant
• Temperature ranges:
- Industrial (I):
-40°C to +85°C
- Automotive (E):
-40°C to +125°C
Package Types
A0
1
8
VCC
A0
1
8
VCC
A1
2
7
WP
A1
2
7
WP
A2
3
6
SCL
A2
3
6
SCL
VSS
4
5
SDA VSS
4
5
SDA
DFN
A0 1
A1 2
A2 3
VSS 4
The Microchip Technology Inc. 24C02C is a 2K bit
Serial Electrically Erasable PROM with a voltage range
of 4.5V to 5.5V. The device is organized as a single
block of 256 x 8-bit memory with a 2-wire serial
interface. Low-current design permits operation with
typical standby and active currents of only 10 μA and 1
mA, respectively. The device has a page write capability for up to 16 bytes of data and has fast write cycle
times of only 1 ms for both byte and page writes.
Functional address lines allow the connection of up to
eight 24C02C devices on the same bus for up to 16K
bits of contiguous EEPROM memory. The device is
available in the standard 8-pin PDIP, 8-pin SOIC (3.90
mm), 8-pin 2x3 DFN, 8-pin MSOP and TSSOP
packages.
8 VCC
7 WP
6 SCL
5 SDA
Block Diagram
A0 A1 A2
WP
HV Generator
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
SDA SCL
Vcc
Description:
SOIC, TSSOP
PDIP, MSOP
Vss
Write-Protect
Circuitry
YDEC
Sense Amp.
R/W Control
I2C is a trademark of Philips Corporation.
© 2007 Microchip Technology Inc.
DS21202G-page 1
24C02C
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
VCC .............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins ...................................................................................................................................... ≥ 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
All parameters apply across the
specified operating ranges unless
otherwise noted.
Parameter
VCC = +4.5V to +5.5V
Industrial (I):
TA = -40°C to +85°C
Automotive (E):
TA = -40°C to +125°C
Symbol
SCL and SDA pins:
High-level input voltage
VIH
Low-level input voltage
VIL
Hysteresis of Schmitt Trigger inputs
VHYS
Low-level output voltage
Min.
Max.
Units
0.7 VCC
—
V
Conditions
—
0.3 VCC
V
0.05 VCC
—
V
(Note)
VOL
—
0.40
V
IOL = 3.0 mA, VCC = 4.5V
Input leakage current
ILI
—
±1
μA
VIN = VSS or VCC, WP = Vss
Output leakage current
ILO
—
±1
μA
VOUT = VSS or VCC
Pin capacitance (all inputs/outputs)
CIN, COUT
—
10
pF
VCC = 5.0V (Note)
TA = 25°C, f = 1 MHz
Operating current
ICC Read
—
1
mA
VCC = 5.5V, SCL = 400 kHz
Standby current
Note:
ICC Write
—
3
mA
VCC = 5.5V
ICCS
—
50
μA
VCC = 5.5V, SDA = SCL = VCC
WP = VSS
This parameter is periodically sampled and not 100% tested.
DS21202G-page 2
© 2007 Microchip Technology Inc.
24C02C
TABLE 1-2:
AC CHARACTERISTICS
All parameters apply across the
specified operating ranges unless
otherwise noted.
Parameter
Symbol
VCC = +4.5V to +5.5V
Industrial (I):
TA = -40°C to +85°C
Automotive (E):
TA = -40°C to +125°C
TA > +85°C
-40°C ≤ TA ≤ +85°C
Min.
Max.
Min.
Max.
Units
Remarks
Clock frequency
Clock high time
Clock low time
SDA and SCL rise time
SDA and SCL fall time
Start condition hold time
FCLK
THIGH
TLOW
TR
TF
THD:STA
—
4000
4700
—
—
4000
100
—
—
1000
300
—
—
600
1300
—
—
600
400
—
—
300
300
—
kHz
ns
ns
ns
ns
ns
Start condition setup time
TSU:STA
4700
—
600
—
ns
Data input hold time
Data input setup time
Stop condition setup time
Output valid from clock
Bus free time
THD:DAT
TSU:DAT
TSU:STO
TAA
TBUF
0
250
4000
—
4700
—
—
—
3500
—
0
100
600
—
1300
—
—
—
900
—
ns
ns
ns
ns
ns
—
250
20 + 0.1 CB
250
ns
(Note 2)
Time the bus must be free
before a new transmission
can start
(Note 1), CB ≤ 100 pF
—
50
—
50
ns
(Note 3)
—
1M
1.5
—
—
1M
1
—
TOF
Output fall time from VIH
minimum to VIL maximum
Input filter spike suppression TSP
(SDA and SCL pins)
Write cycle time
TWR
Endurance
Note 1:
2:
3:
4:
BUS TIMING DATA
THIGH
TF
TR
TSU:STA
TLOW
SDA
IN
ms Byte or Page mode
cycles 25°C, VCC = 5.0V, Block
mode (Note 4)
Not 100% tested. CB = total capacitance of one bus line in pF.
As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
The combined TSP and VHYS specifications are due to Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site
at www.microchip.com.
FIGURE 1-1:
SCL
(Note 1)
(Note 1)
After this period the first
clock pulse is generated
Only relevant for repeated
Start condition
(Note 2)
TSP
THD:DAT
TSU:DAT
TSU:STO
THD:STA
TAA
TBUF
SDA
OUT
© 2007 Microchip Technology Inc.
DS21202G-page 3
24C02C
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Name
PIN FUNCTION TABLE
PDIP
SOIC
TSSOP
DFN
MSOP
Description
A0
1
1
1
1
1
Address Pin A0
A1
2
2
2
2
2
Address Pin A1
A2
3
3
3
3
3
Address Pin A2
VSS
4
4
4
4
4
Ground
SDA
5
5
5
5
5
Serial Address/Data I/O
SCL
6
6
6
6
6
Serial Clock
WP
7
7
7
7
7
Write-Protect Input
VCC
8
8
8
8
8
+4.5 to 5.5V Power Supply
2.1
SDA Serial Data
This is a bidirectional pin used to transfer addresses
and data into and data out of the device. It is an open
drain terminal, therefore the SDA bus requires a pull-up
resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for
400 kHz).
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
2.2
SCL Serial Clock
3.0
FUNCTIONAL DESCRIPTIONS
The 24C02C supports a bidirectional 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as transmitter, and a device
receiving data as receiver. The bus has to be controlled
by a master device which generates the Serial Clock
(SCL), controls the bus access, and generates the Start
and Stop conditions, while the 24C02C works as slave.
Both master and slave can operate as transmitter or
receiver but the master device determines which mode
is activated.
This input is used to synchronize the data transfer from
and to the device.
2.3
A0, A1, A2
The levels on these inputs are compared with the
corresponding bits in the slave address. The chip is
selected if the compare is true.
Up to eight 24C02C devices may be connected to the
same bus by using different Chip Select bit combinations. These inputs must be connected to either VCC or
VSS.
2.4
WP
This is the hardware write-protect pin. It must be tied to
VCC or VSS. If tied to Vcc, the hardware write protection
is enabled. If the WP pin is tied to Vss the hardware
write protection is disabled.
2.5
Noise Protection
The 24C02C employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 3.8 volts at nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation even on a noisy bus.
DS21202G-page 4
© 2007 Microchip Technology Inc.
24C02C
4.0
BUS CHARACTERISTICS
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is
theoretically unlimited, although only the last sixteen
will be stored when doing a write operation. When an
overwrite does occur it will replace data in a first-in firstout fashion.
4.1
4.5
Bus Not Busy (A)
Each receiving device, when addressed, is required to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Both data and clock lines remain high.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3
Note:
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All operations must be ended with a Stop condition.
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
FIGURE 4-1:
SCL
(A)
The 24C02C does not generate any
Acknowledge bits if an internal
programming cycle is in progress.
The device that acknowledges has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. A master must signal an end of data to the
slave by not generating an Acknowledge bit on the last
byte that has been clocked out of the slave. In this
case, the slave must leave the data line high to enable
the master to generate the Stop condition (Figure 4-2).
Stop Data Transfer (C)
4.4
Acknowledge
DATA TRANSFER SEQUENCE ON THE SERIAL BUS CHARACTERISTICS
(B)
(C)
Start
Condition
Address or
Acknowledge
Valid
(D)
(C)
(A)
SDA
FIGURE 4-2:
Stop
Condition
Data
Allowed
to Change
ACKNOWLEDGE TIMING
Acknowledge
Bit
SCL
1
2
SDA
3
4
5
6
7
Data from transmitter
Transmitter must release the SDA line at this point
allowing the Receiver to pull the SDA line low to
acknowledge the previous eight bits of data.
© 2007 Microchip Technology Inc.
8
9
1
2
3
Data from transmitter
Receiver must release the SDA line at this point
so the Transmitter can continue sending data.
DS21202G-page 5
24C02C
5.0
DEVICE ADDRESSING
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four bit control code; for
the 24C02C this is set as ‘1010’ binary for read and
write operations. The next three bits of the control byte
are the Chip Select bits (A2, A1, A0). The Chip Select
bits allow the use of up to eight 24C02C devices on the
same bus and are used to select which device is
accessed. The Chip Select bits in the control byte must
correspond to the logic levels on the corresponding A2,
A1 and A0 pins for the device to respond. These bits
are in effect the three Most Significant bits of the word
address.
The last bit of the control byte defines the operation to
be performed. When set to a ‘1’ a read operation is
selected, and when set to a ‘0’ a write operation is
selected. Following the Start condition, the 24C02C
monitors the SDA bus checking the control byte being
transmitted. Upon receiving a ‘1010’ code and appropriate Chip Select bits, the slave device outputs an
Acknowledge signal on the SDA line. Depending on the
state of the R/W bit, the 24C02C will select a read or
write operation.
DS21202G-page 6
FIGURE 5-1:
CONTROL BYTE FORMAT
Read/Write Bit
Chip Select
Bits
Control Code
S
1
0
1
0
A2
A1
A0 R/W ACK
Slave Address
Start Bit
5.1
Acknowledge Bit
Contiguous Addressing Across
Multiple Devices
The Chip Select bits A2, A1, A0 can be used to expand
the contiguous address space for up to 16K bits by
adding up to eight 24C02C devices on the same bus.
In this case, software can use A0 of the control byte
as address bit A8, A1 as address bit A9, and A2 as
address bit A10. It is not possible to write or read
across device boundaries.
© 2007 Microchip Technology Inc.
24C02C
6.0
WRITE OPERATIONS
6.1
Byte Write
As with the byte write operation, once the Stop
condition is received an internal write cycle will begin
(Figure 6-2). If an attempt is made to write to the
protected portion of the array when the hardware write
protection has been enabled, the device will acknowledge the command, but no data will be written. The
write cycle time must be observed even if the write
protection is enabled.
Following the Start signal from the master, the device
code(4 bits), the Chip Select bits (3 bits) and the R/W
bit, which is a logic low, is placed onto the bus by the
master transmitter. The device will acknowledge this
control byte during the ninth clock pulse. The next byte
transmitted by the master is the word address and will
be written into the Address Pointer of the 24C02C.
After receiving another Acknowledge signal from the
24C02C the master device will transmit the data word
to be written into the addressed memory location. The
24C02C acknowledges again and the master generates a Stop condition. This initiates the internal write
cycle, and during this time the 24C02C will not generate Acknowledge signals (Figure 6-1). If an attempt is
made to write to the protected portion of the array when
the hardware write protection has been enabled, the
device will acknowledge the command but no data will
be written. The write cycle time must be observed even
if the write protection is enabled.
6.2
Note:
Page Write
The write control byte, word address and the first data
byte are transmitted to the 24C02C in the same way as
in a byte write. But instead of generating a Stop
condition, the master transmits up to 15 additional data
bytes to the 24C02C which are temporarily stored in
the on-chip page buffer and will be written into the
memory after the master has transmitted a Stop
condition. After the receipt of each word, the four lower
order Address Pointer bits are internally incremented
by one. The higher order four bits of the word address
remains constant. If the master should transmit more
than 16 bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten.
FIGURE 6-1:
S
T
A
R
T
SDA Line
S
The WP pin must be tied to VCC or VSS. If tied to VCC,
the upper half of the array (080-0FF) will be writeprotected. If the WP pin is tied to VSS, then write
operations to all address locations are allowed.
Control
Byte
Word
Address
S
T
O
P
Data
P
A
C
K
Bus Activity
FIGURE 6-2:
SDA Line
Write Protection
BYTE WRITE
Bus Activity
Master
Bus Activity
Master
6.3
Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘page size’) and end at addresses that are
integer multiples of [page size – 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
A
C
K
A
C
K
PAGE WRITE
S
T
A
R
T
Control
Byte
Word
Address (n)
Data n
Data n +1
S
T
O
P
Data n + 15
S
Bus Activity
© 2007 Microchip Technology Inc.
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
DS21202G-page 7
24C02C
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally timed write cycle. ACK polling
can be initiated immediately. This involves the master
sending a Start condition followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If no ACK is returned, then the Start bit and control byte
must be re-sent. If the cycle is complete, then the
device will return the ACK and the master can then
proceed with the next Read or Write command. See
Figure 7-1 for flow diagram.
FIGURE 7-1:
ACKNOWLEDGE
POLLING FLOW
8.0
Read operations are initiated in the same way as write
operations with the exception that the R/W bit of the
slave address is set to one. There are three basic types
of read operations: current address read, random read,
and sequential read.
8.1
Send Start
Send Control Byte
with R/W = 0
Yes
Next
Operation
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, first the word address must
be set. This is done by sending the word address to the
24C02C as part of a write operation. After the word
address is sent, the master generates a Start condition
following the acknowledge. This terminates the write
operation, but not before the internal Address Pointer is
set. Then the master issues the control byte again but
with the R/W bit set to a one. The 24C02C will then
issue an acknowledge and transmits the eight bit data
word. The master will not acknowledge the transfer but
does generate a Stop condition and the 24C02C
discontinues transmission (Figure 8-2). After this
command, the internal address counter will point to the
address location following the one that was just read.
Send Stop
Condition to
Initiate Write Cycle
Did Device
Acknowledge
(ACK = 0)?
Current Address Read
The 24C02C contains an address counter that maintains the address of the last word accessed, internally
incremented by one. Therefore, if the previous read
access was to address n, the next current address read
operation would access data from address n + 1. Upon
receipt of the slave address with the R/W bit set to one,
the 24C02C issues an acknowledge and transmits the
eight bit data word. The master will not acknowledge
the transfer, but does generate a Stop condition and the
24C02C discontinues transmission (Figure 8-1).
8.2
Send
Write Command
READ OPERATIONS
No
8.3
Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the 24C02C transmits
the first data byte, the master issues an acknowledge
as opposed to a Stop condition in a random read. This
directs the 24C02C to transmit the next sequentially
addressed 8-bit word (Figure 8-3).
To provide sequential reads, the 24C02C contains an
internal Address Pointer which is incremented by one
at the completion of each operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation. The internal Address
Pointer will automatically roll over from address FF to
address 00.
DS21202G-page 8
© 2007 Microchip Technology Inc.
24C02C
FIGURE 8-1:
CURRENT READ ADDRESS
Bus Activity
Master
S
T
A
R
T
SDA line
S
Control
Byte
P
A
C
K
Bus Activity
FIGURE 8-2:
S
T
A
R
T
Control
Byte
S
T
A
R
T
Word
Address (n)
S
SDA line
Control
Byte
S
T
O
P
Data (n)
P
S
A
C
K
A
C
K
Bus Activity
Bus Activity
Master
N
O
A
C
K
RANDOM READ
Bus Activity
Master
FIGURE 8-3:
S
T
O
P
Data
A
C
K
N
O
A
C
K
SEQUENTIAL READ
Control
Byte
Data n
Data n + 1
Data n + 2
S
T
O
P
Data n + X
P
SDA line
Bus Activity
© 2007 Microchip Technology Inc.
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
DS21202G-page 9
24C02C
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
T/XXXNNN
YYWW
8-Lead SOIC (3.90 mm)
XXXXXXXT
XXXXYYWW
NNN
8-Lead TSSOP
Example:
24C02CI
SN e3 0527
13F
Example:
4C2C
TYWW
I527
NNN
13F
XXXXT
YWWNNN
8-Lead 2x3 DFN
DS21202G-page 10
24C02C
I/P e3 13F
0527
XXXX
8-Lead MSOP
XXX
YWW
NN
Example:
Example:
4C2CI
52713F
Example:
2P7
527
13
© 2007 Microchip Technology Inc.
24C02C
1st Line Marking Codes
Part Number
DFN
TSSOP
24C02C
Note:
MSOP
4C2C
4C2CT
I Temp.
E Temp.
2P7
2P8
T = Temperature grade (I, E)
Legend: XX...X
T
Y
YY
WW
NNN
e3
Note:
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note:
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
© 2007 Microchip Technology Inc.
DS21202G-page 11
24C02C
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
3
2
D
E
A2
A
L
A1
c
e
eB
b1
b
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
8
Pitch
e
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
b1
.040
.060
.070
b
.014
.018
.022
eB
–
–
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
DS21202G-page 12
© 2007 Microchip Technology Inc.
24C02C
8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
A2
A
c
φ
L
A1
L1
Units
Dimension Limits
Number of Pins
β
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
1.25
–
–
Standoff §
A1
0.10
–
0.25
Overall Width
E
Molded Package Width
E1
3.90 BSC
Overall Length
D
4.90 BSC
1.75
6.00 BSC
Chamfer (optional)
h
0.25
–
0.50
Foot Length
L
0.40
–
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.17
–
0.25
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
© 2007 Microchip Technology Inc.
DS21202G-page 13
24C02C
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
b
e
c
A
φ
A2
A1
L
L1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
0.65 BSC
–
Molded Package Thickness
A2
0.80
1.00
1.05
Standoff
A1
0.05
–
0.15
1.20
Overall Width
E
Molded Package Width
E1
4.30
6.40 BSC
4.40
Molded Package Length
D
2.90
3.00
3.10
Foot Length
L
0.45
0.60
0.75
Footprint
L1
4.50
1.00 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.19
–
0.30
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-086B
DS21202G-page 14
© 2007 Microchip Technology Inc.
24C02C
8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
e
b
A2
A
c
φ
L
L1
A1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
0.65 BSC
–
Molded Package Thickness
A2
0.75
0.85
0.95
Standoff
A1
0.00
–
0.15
Overall Width
E
Molded Package Width
E1
3.00 BSC
Overall Length
D
3.00 BSC
Foot Length
L
Footprint
L1
1.10
4.90 BSC
0.40
0.60
0.80
0.95 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.08
–
0.23
Lead Width
b
0.22
–
0.40
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-111B
© 2007 Microchip Technology Inc.
DS21202G-page 15
24C02C
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
2
1
NOTE 1
1
2
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
0.80
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Length
D
2.00 BSC
Overall Width
E
Exposed Pad Length
D2
1.30
–
Exposed Pad Width
E2
1.50
–
1.90
b
0.18
0.25
0.30
Contact Length
L
0.30
0.40
0.50
Contact-to-Exposed Pad
K
0.20
–
–
Contact Width
0.50 BSC
3.00 BSC
1.75
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B
DS21202G-page 16
© 2007 Microchip Technology Inc.
24C02C
APPENDIX A:
REVISION HISTORY
Revision D
Corrections to Section 1.0, Electrical Characteristics.
Revision E
Added DFN package.
Revision F (02/2007)
Revised Features section; Section 1.0 revised Ambient
temperature; Revised Tables 1-1, 1-2, (removed commercial temp); Revised Table 2-1; Replaced On-line
Support page; Replaced Package Drawings; Revised
Product ID section.
Revision G (03/2007)
Replaced Package Drawings (Rev. AM).
© 2007 Microchip Technology Inc.
DS21202G-page 17
24C02C
NOTES:
DS21202G-page 18
© 2007 Microchip Technology Inc.
24C02C
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
© 2007 Microchip Technology Inc.
DS21202G-page 19
24C02C
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
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RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Device: 24C02C
Y
N
Literature Number: DS21202G
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21202G-page 20
© 2007 Microchip Technology Inc.
24C02C
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device
Temperature
Range
Package
Device:
24C02C 2K I2C™ Serial EEPROM
24C02CT 2K I2C™ Serial EEPROM (Tape and Reel)
Temperature
Range:
I
E
= -40°C to +85°C
= -40°C to +125°C
Package:
P
SN
ST
MS
MC
=
=
=
=
=
Plastic DIP (300 mil Body), 8-lead
Plastic SOIC, (3.90 mm Body), 8-lead
TSSOP (4.4 mm Body), 8-lead
Plastic Micro Small Outline (MSOP), 8-lead
2x3 DFN, 8-lead
© 2007 Microchip Technology Inc.
DS21202G-page 21
24C02C
NOTES:
DS21202G-page 22
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS21202G-page 23
WORLDWIDE SALES AND SERVICE
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EUROPE
Corporate Office
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Technical Support:
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Web Address:
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12/08/06
DS21202G-page 24
© 2007 Microchip Technology Inc.