MICROCHIP 24LC014T-I/SN

24AA014/24LC014
1K I2C™ Serial EEPROM
Device Selection Table
Part
Number
VCC
Range
Package Types
Max
Clock
24AA014
1.8V - 5.5V 400 kHz
24LC014
2.5V - 5.5V
Temp.
Range
(1)
400 kHz
SOIC, TSSOP
PDIP, MSOP
A0
1
8
VCC
A0
1
8
VCC
I
A1
2
7
WP
A1
2
7
WP
I
A2
3
6
SCL
A2
3
6
SCL
VSS
4
5
SDA VSS
4
5
SDA
Note 1: 100 kHz for VCC < 2.5V
Features:
DFN
• Single-supply with operation down to 1.8V
• Low-power CMOS technology:
- 1 mA active current, typical
- 1 μA standby current, typical at 5.5V
• Organized as a single block of 128 bytes (128 x 8)
• Hardware write protection for entire array
• 2-wire serial interface bus, I2C™ compatible
• 100 kHz and 400 kHz clock compatibility
• Page write buffer for up to 16 bytes
• Self-timed write cycle (including auto-erase)
• 5 ms max. write cycle time
• Address lines allow up to eight devices on bus
• 1,000,000 erase/write cycles
• ESD protection > 4,000V
• Data retention > 200 years
• 8-pin PDIP, SOIC, TSSOP, DFN and MSOP
packages
• Available for extended temperature ranges:
- Industrial (I):
-40°C to
8 VCC
A1 2
7 WP
A2 3
VSS 4
6 SCL
5 SDA
Block Diagram
A0 A1 A2
I/O
Control
Logic
WP
HV Generator
Memory
Control
Logic
EEPROM
Array
XDEC
SDA SCL
Write-Protect
Circuitry
YDEC
VCC
VSS
Sense Amp.
R/W Control
+85°C
Description:
The Microchip Technology Inc. 24AA014/24LC014 is a
1 Kbit Serial Electrically Erasable PROM with operation down to 1.8V. The device is organized as a single
block of 128 x 8-bit memory with a 2-wire serial interface. Low-current design permits operation with typical
standby and active currents of only 1 μA and 1 mA,
respectively. The device has a page write capability for
up to 16 bytes of data. Functional address lines allow
the connection of up to eight 24AA014/24LC014
devices on the same bus for up to 8 Kbits of contiguous
EEPROM memory. The device is available in the
standard 8-pin PDIP, 8-pin SOIC (150 mil), TSSOP, 2x3
DFN and MSOP packages.
© 2005 Microchip Technology Inc.
A0 1
Pin Function Table
Name
VSS
Function
Ground
SDA
Serial Data
SCL
Serial Clock
VCC
Power Supply
A0, A1, A2
Chip Selects
WP
Hardware Write-Protect
DS21809C-page 1
24AA014/24LC014
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-65°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
All parameters apply across the
specified operating ranges unless
otherwise noted.
Parameter
VCC = +1.8V to +5.5V
Industrial (I): TA = -40°C to +85°C
Symbol
Min.
Max.
Units
Conditions
SCL and SDA pins:
High-level input voltage
VIH
0.7 VCC
—
V
Low-level input voltage
VIL
—
0.3 VCC
V
Hysteresis of Schmitt Trigger inputs
VHYS
0.05 VCC
—
V
(Note 1)
Low-level output voltage
VOL
—
0.40
V
IOL = 3.0 mA, VCC = 4.5V
IOL = 2.1 mA, VCC = 2.5V
Input leakage current
ILI
—
±1
μΑ
VIN = VSS or VCC, WP = Vss
Output leakage current
ILO
—
±1
μA
VOUT = VSS or VCC
Pin capacitance (all inputs/outputs)
CIN, COUT
—
10
pF
VCC = 5.0V (Note 1)
TA = 25°C, f = 1 MHz
Operating current
ICC Read
—
1
mA
VCC = 5.5V, SCL = 400 kHz
ICC Write
—
3
mA
VCC = 5.5V
ICCS
—
1
μA
VCC = 5.5V, SDA = SCL = VCC
WP = VSS, A0, A1, A2 = VSS
Standby current
Note 1: This parameter is periodically sampled and not 100% tested.
DS21809C-page 2
© 2005 Microchip Technology Inc.
24AA014/24LC014
TABLE 1-2:
AC CHARACTERISTICS
All parameters apply across the specified
operating ranges unless otherwise noted.
Vcc = 1.8V to 5.5V
Industrial (I): TA = -40°C to +85°C
Vcc = 1.8V - 5.5V Vcc = 2.5V - 5.5V
STD MODE
FAST MODE
Symbol
Parameter
Min.
Max.
Min.
Max.
Units
Clock frequency
Clock high time
Clock low time
SDA and SCL rise time
SDA and SCL fall time
Start condition hold time
FCLK
THIGH
TLOW
TR
TF
THD:STA
—
4000
4700
—
—
4000
100
—
—
1000
300
—
—
600
1300
—
—
600
400
—
—
300
300
—
kHz
ns
ns
ns
ns
ns
Start condition setup time
TSU:STA
4700
—
600
—
ns
Data input hold time
Data input setup time
Stop condition setup time
Output valid from clock
Bus free time
THD:DAT
TSU:DAT
TSU:STO
TAA
TBUF
0
250
4000
—
4700
—
—
—
3500
—
0
100
600
—
1300
—
—
—
900
—
ns
ns
ns
ns
ns
Remarks
(Note 1)
(Note 1)
After this period, the first
clock pulse is generated
Only relevant for repeated
Start condition
(Note 2)
(Note 2)
Time the bus must be free
before a new transmission
can start
(Note 1), CB ≤ 100 pF
TOF
—
250
20 +0.1
250
ns
Output fall time from VIH
minimum to VIL maximum
CB
—
50
—
50
ns
(Note 3)
Input filter spike suppression TSP
(SDA and SCL pins)
—
5
—
5
ms Byte or Page mode
Write cycle time
TWC
Endurance
1M
—
1M
—
cycles 25°C, (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be downloaded from Microchip’s web
site at www.microchip.com.
FIGURE 1-1:
BUS TIMING DATA
THIGH
TF
SCL
TR
TSU:STA
TLOW
SDA
IN
TSP
THD:DAT
TSU:DAT
TSU:STO
THD:STA
TAA
TBUF
SDA
OUT
© 2005 Microchip Technology Inc.
DS21809C-page 3
24AA014/24LC014
2.0
PIN DESCRIPTIONS
2.1
SDA Serial Data
This is a bidirectional pin used to transfer addresses
and data into and out of the device. It is an open drain
terminal. Therefore, the SDA bus requires a pull-up
resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for
400 kHz).
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
2.2
3.0
FUNCTIONAL DESCRIPTION
The 24AA014/24LC014 supports a bidirectional, 2-wire
bus and data transmission protocol. A device that
sends data onto the bus is defined as transmitter, and
a device receiving data as receiver. The bus has to be
controlled by a master device that generates the Serial
Clock (SCL), controls the bus access and generates
the Start and Stop conditions while the 24AA014/
24LC014 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
SCL Serial Clock
The SCL input is used to synchronize the data transfer
to and from the device.
2.3
A0, A1, A2
The levels on the inputs A0, A1 and A2 are compared
with the corresponding bits in the slave address. The
chip is selected if the compare is true.
Up to eight 24AA014/24LC014 devices may be
connected to the same bus by using different Chip
Select bit combinations. These inputs must be
connected to either VCC or VSS.
2.4
WP
WP is the hardware write-protect pin. It must be tied to
VCC or VSS. If tied to VCC, the hardware write protection
is enabled. If the WP pin is tied to VSS the hardware
write protection is disabled.
2.5
Noise Protection
The 24AA014/24LC014 employs a VCC threshold
detector circuit that disables the internal erase/write
logic if the VCC is below 1.5 volts at nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits that suppress noise spikes to assure
proper device operation even on a noisy bus.
DS21809C-page 4
© 2005 Microchip Technology Inc.
24AA014/24LC014
4.0
BUS CHARACTERISTICS
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is,
theoretically, unlimited, though only the last sixteen will
be stored when doing a write operation. When an overwrite does occur, it will replace data in a first-in first-out
fashion.
4.1
4.5
Bus Not Busy (A)
Each receiving device, when addressed, is required to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Both data and clock lines remain high.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3
Note:
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
FIGURE 4-1:
SCL
(A)
The 24AA014/24LC014 does not generate
any Acknowledge bits if an internal
programming cycle is in progress.
The device that acknowledges has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge-related clock pulse. Of
course, setup and hold times must be taken into
account. A master must signal an end of data to the
slave by not generating an Acknowledge bit on the last
byte that has been clocked out of the slave. In this case,
the slave must leave the data line high to enable the
master to generate the Stop condition (Figure 4-2).
Stop Data Transfer (C)
4.4
Acknowledge
DATA TRANSFER SEQUENCE ON THE SERIAL BUS CHARACTERISTICS
(B)
(C)
(D)
(C)
(A)
SDA
Start
Condition
FIGURE 4-2:
Address or
Acknowledge
Valid
Stop
Condition
Data
Allowed
to Change
ACKNOWLEDGE TIMING
Acknowledge
Bit
SCL
SDA
1
2
3
4
5
6
7
Data from transmitter
Transmitter must release the SDA line at this point allowing
the Receiver to pull the SDA line low to acknowledge the
previous eight bits of data.
© 2005 Microchip Technology Inc.
8
9
1
2
3
Data from transmitter
Receiver must release the SDA line at this
point so the Transmitter can continue
sending data.
DS21809C-page 5
24AA014/24LC014
5.0
DEVICE ADDRESSING
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four-bit control code; for
the 24AA014/24LC014 this is set as ‘1010’ binary for
read and write operations. The next three bits of the
control byte are the Chip Select bits (A2, A1, A0). The
Chip Select bits allow the use of up to eight 24AA014/
24LC014 devices on the same bus and are used to
select which device is accessed. The Chip Select bits
in the control byte must correspond to the logic levels
on the corresponding A2, A1 and A0 pins for the device
to respond. These bits are in effect the three Most
Significant bits of the word address.
The last bit of the control byte defines the operation to
be performed. When set to a ‘1’, a read operation is
selected. When set to a ‘0’, a write operation is
selected. Following the Start condition, the 24AA014/
24LC014 monitors the SDA bus, checking the control
byte being transmitted. Upon receiving a ‘1010’ code
and appropriate Chip Select bits, the slave device outputs an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24AA014/24LC014
will select a read or write operation.
DS21809C-page 6
FIGURE 5-1:
CONTROL BYTE FORMAT
Read/Write Bit
Chip Select
Bits
Control Code
S
1
0
1
0
A2
A1
A0 R/W ACK
Slave Address
Start Bit
5.1
Acknowledge Bit
Contiguous Addressing Across
Multiple Devices
The Chip Select bits A2, A1 and A0 can be used to
expand the contiguous address space for up to 8K bits
by adding up to eight 24AA014/24LC014 devices on
the same bus. In this case, software can use A0 of the
control byte as address bit A8, A1 as address bit A9,
and A2 as address bit A10. It is not possible to
sequentially read across device boundaries.
© 2005 Microchip Technology Inc.
24AA014/24LC014
6.0
WRITE OPERATIONS
6.1
Byte Write
The higher order four bits of the word address remain
constant. If the master should transmit more than 16
bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received, an internal write cycle will begin (Figure 6-2). If an attempt is
made to write to the protected portion of the array when
the hardware write protection has been enabled, the
device will acknowledge the command, but no data will
be written. The write cycle time must be observed even
if write protection is enabled.
Following the Start signal from the master, the device
code(4 bits), the Chip Select bits (3 bits) and the R/W
bit (which is a logic low) are placed onto the bus by the
master transmitter. The device will acknowledge this
control byte during the ninth clock pulse. The next byte
transmitted by the master is the word address and will
be written into the Address Pointer of the 24AA014/
24LC014. After receiving another Acknowledge signal
from the 24AA014/24LC014, the master device will
transmit the data word to be written into the addressed
memory location. The 24AA014/24LC014 acknowledges again and the master generates a Stop
condition. This initiates the internal write cycle and the
24AA014/24LC014 will not generate Acknowledge
signals during this time (Figure 6-1). If an attempt is
made to write to the protected portion of the array when
the hardware write protection has been enabled, the
device will acknowledge the command, but no data will
be written. The write cycle time must be observed even
if write protection is enabled.
6.2
Note:
Page Write
The write-control byte, word address and the first data
byte are transmitted to the 24AA014/24LC014 in the
same way as in a byte write. But instead of generating
a Stop condition, the master transmits up to 15 additional data bytes to the 24AA014/24LC014 that are
temporarily stored in the on-chip page buffer and will be
written into the memory once the master has transmitted a Stop condition. Upon receipt of each word, the
four lower order Address Pointer bits are internally
incremented by one.
FIGURE 6-1:
6.3
Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘page size’) and end at addresses that are
integer multiples of [page size – 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary that the
application software prevent page write
operations that would attempt to cross a
page boundary.
Write Protection
The WP pin must be tied to VCC or VSS. If tied to VCC,
the entire array will be write-protected. If the WP pin is
tied to VSS, write operations to all address locations are
allowed.
BYTE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
S
Control
Byte
Word
Address
S
T
O
P
Data
P
A
C
K
Bus Activity
FIGURE 6-2:
A
C
K
A
C
K
PAGE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
S
Control
Byte
Bus Activity
© 2005 Microchip Technology Inc.
Word
Address (n)
Data (n)
S
T
O
P
Data (n + 15)
Data (n +1)
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
DS21809C-page 7
24AA014/24LC014
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a write
command has been issued from the master, the device
initiates the internally-timed write cycle and ACK polling
can be initiated immediately. This involves the master
sending a Start condition followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycle, no ACK will be returned. If no
ACK is returned, the Start bit and control byte must be
re-sent. If the cycle is complete, the device will return
the ACK and the master can then proceed with the next
Read or Write command. See Figure 7-1 for a flow
diagram of this operation.
FIGURE 7-1:
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
DS21809C-page 8
© 2005 Microchip Technology Inc.
24AA014/24LC014
8.0
READ OPERATIONS
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1
Current Address Read
The 24AA014/24LC014 contains an address counter
that maintains the address of the last word accessed,
internally incremented by one. Therefore, if the
previous read access was to address n, the next
current address read operation would access data from
address n + 1. Upon receipt of the slave address with
the R/W bit set to ‘1’, the 24AA014/24LC014 issues an
acknowledge and transmits the 8-bit data word. The
master will not acknowledge the transfer, but does
generate a Stop condition and the 24AA014/24LC014
discontinues transmission (Figure 8-1).
8.2
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is done by sending the word address to the
24AA014/24LC014 as part of a write operation.
FIGURE 8-1:
Once the word address is sent, the master generates a
Start condition following the acknowledge. This
terminates the write operation, but not before the
internal Address Pointer is set. The master then issues
the control byte again but with the R/W bit set to a ‘1’.
The 24AA014/24LC014 will then issue an acknowledge and transmits the eight-bit data word. The master
will not acknowledge the transfer, but does generate a
Stop condition and the 24AA014/24LC014 discontinues transmission (Figure 8-2). After this command, the
internal address counter will point to the address
location following the one that was just read.
8.3
Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the 24AA014/24LC014
transmits the first data byte, the master issues an
acknowledge as opposed to a Stop condition in a
random read. This directs the 24AA014/24LC014 to
transmit the next sequentially addressed 8-bit word
(Figure 8-3).
To provide sequential reads the 24AA014/24LC014
contains an internal Address Pointer which is
incremented by one at the completion of each operation. This Address Pointer allows the entire memory
contents to be serially read during one operation. The
internal Address Pointer will automatically roll over
from address 0FFh to address 000h.
CURRENT ADDRESS READ
Bus Activity
Master
S
T
A
R
T
SDA Line
S
Bus Activity
© 2005 Microchip Technology Inc.
Control
Byte
S
T
O
P
Data
P
A
C
K
N
O
A
C
K
DS21809C-page 9
24AA014/24LC014
FIGURE 8-2:
Bus Activity
Master
SDA Line
RANDOM READ
S
T
A
R
T
Control
Byte
S
Bus Activity
Master
Control
Byte
S
T
O
P
Data (n)
P
S
A
C
K
A
C
K
Bus Activity
FIGURE 8-3:
S
T
A
R
T
Word
Address (n)
N
O
A
C
K
A
C
K
SEQUENTIAL READ
Control
Byte
Data (n)
Data (n + 1)
Data (n + 2)
S
T
O
P
Data (n + X)
P
SDA Line
Bus Activity
DS21809C-page 10
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
© 2005 Microchip Technology Inc.
24AA014/24LC014
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
8-Lead PDIP (300 mil)
Example:
24LC014
I/P e3 12F
0521
XXXXXXXX
T/XXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXT
XXXXYYWW
NNN
8-Lead TSSOP
Example:
24LC014I
SN e3 052I
12F
Example:
XXXX
4L14
TYWW
I521
NNN
12F
8-Lead MSOP
Example:
XXXXT
4L14I
YWWNNN
52112F
8-Lead 2x3 DFN
XXX
YWW
NN
© 2005 Microchip Technology Inc.
Example:
2N4
521
12
DS21809C-page 11
24AA014/24LC014
1st Line Marking Codes
Part Number
TSSOP
MSOP
24AA014
4A14
4A14T
2N1
24LC014
4L14
4L14T
2N4
Note:
DFN
T = Temperature grade (I, E)
Legend: XX...X
T
Y
YY
WW
NNN
e3
Note:
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note:
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21809C-page 12
© 2005 Microchip Technology Inc.
24AA014/24LC014
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB
α
β
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
© 2005 Microchip Technology Inc.
DS21809C-page 13
24AA014/24LC014
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21809C-page 14
© 2005 Microchip Technology Inc.
24AA014/24LC014
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
φ
β
A1
A2
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
φ
c
B
α
β
MIN
INCHES
NOM
MAX
8
.026
.033
.002
.246
.169
.114
.020
0
.004
.007
0
0
.035
.004
.251
.173
.118
.024
4
.006
.010
5
5
.043
.037
.006
.256
.177
.122
.028
8
.008
.012
10
10
MILLIMETERS*
NOM
MAX
8
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
2.90
3.00
3.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
© 2005 Microchip Technology Inc.
DS21809C-page 15
24AA014/24LC014
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
E1
p
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
n
p
MIN
INCHES
NOM
MAX
MILLIMETERS*
NOM
8
0.65 BSC
0.75
0.85
0.00
4.90 BSC
3.00 BSC
3.00 BSC
0.40
0.60
0.95 REF
0°
0.08
0.22
5°
5°
-
MIN
8
Number of Pins
Pitch
.026 BSC
A
.043
Overall Height
A2
Molded Package Thickness
.030
.033
.037
A1
.000
.006
Standoff
E
Overall Width
.193 TYP.
E1
.118 BSC
Molded Package Width
D
.118 BSC
Overall Length
L
.016
.024
.031
Foot Length
Footprint (Reference)
F
.037 REF
φ
0°
8°
Foot Angle
c
.003
.006
.009
Lead Thickness
B
.009
.012
.016
Lead Width
α
5°
15°
Mold Draft Angle Top
β
5°
15°
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
MAX
1.10
0.95
0.15
0.80
8°
0.23
0.40
15°
15°
JEDEC Equivalent: MO-187
Drawing No. C04-111
DS21809C-page 16
© 2005 Microchip Technology Inc.
24AA014/24LC014
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
p
D
b
n
L
E
PIN 1
ID INDEX
AREA
(NOTE 2)
E2
EXPOSED
METAL
PAD
2
1
D2
BOTTOM VIEW
TOP VIEW
A
A1
A3
EXPOSED
TIE BAR
(NOTE 1)
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Contact Width
Contact Length
Units
Dimension Limits
n
p
(Note 3)
(Note 3)
A
A1
A3
D
D2
E
E2
b
L
MIN
.031
.000
.055
.047
.008
.012
INCHES
NOM
8
.020 BSC
.035
.001
.008 REF.
.079 BSC
-.118 BSC
-.010
.016
MAX
MIN
.039
.002
0.80
0.00
.064
1.39
.071
.012
.020
1.20
0.20
0.30
MILLIMETERS*
NOM
8
0.50 BSC
0.90
0.02
0.20 REF.
2.00 BSC
-3.00 BSC
-0.25
0.40
MAX
1.00
0.05
1.62
1.80
0.30
0.50
*Controlling Parameter
Notes:
1. Package may have one or more exposed tie bars at ends.
2. Pin 1 visual index feature may vary, but must be located within the hatched area.
3. Exposed pad dimensions vary with paddle size.
4. JEDEC equivalent: MO-229
Drawing No. C04-123
© 2005 Microchip Technology Inc.
Revised 05/24/04
DS21809C-page 17
24AA014/24LC014
REVISION HISTORY
Revision B
Corrections to Section 1.0, Electrical Characteristics.
Revision C
Added DFN package.
DS21809C-page 18
© 2005 Microchip Technology Inc.
24AA014/24LC014
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
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information:
Users of Microchip products can receive assistance
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•
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Technical support is available through the web site
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In addition, there is a Development Systems
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The Development
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To register, access the Microchip web site at
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Notification and follow the registration instructions.
© 2005 Microchip Technology Inc.
DS21809C-page 19
24AA014/24LC014
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
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Application (optional):
Would you like a reply?
Y
Device: 24AA014/24LC014
N
Literature Number: DS21809C
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21809C-page 20
© 2005 Microchip Technology Inc.
24AA014/24LC014
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature
Range
Device:
Package
24AA014: 1.8V, 1 Kbit Addressable Serial EEPROM
24AA014T: 1.8V, 1 Kbit Addressable Serial EEPROM
(Tape and Reel)
24LC014: 2.5V, 1 Kbit Addressable Serial EEPROM
24LC014T: 2.5V, 1 Kbit Addressable Serial EEPROM
(Tape and Reel)
Examples:
a)
b)
c)
a)
b)
Temperature Range:
I
=
-40°C to +85°C
Package:
P
SN
ST
MS
MC
=
=
=
=
=
Plastic DIP, (300 mil Body), 8-lead
Plastic SOIC, (150 mil Body)
TSSOP, 8-lead
MSOP, 8-lead
2x3 DFN, 8-lead
c)
24AA014-I/P: Industrial Temperature,
1.8V, PDIP package.
24AA014-I/SN: Industrial Temperature,
1.8V, SOIC Package.
24AA014T-I/ST: Industrial Temperature,
1.8V, TSSOP Package, Tape and Reel
24LC014-I/P: Industrial Temperature,
2.5V, PDIP Package.
24LC014T-I/SN: Industrial Temperature,
2.5V, SOIC Package, Tape and Reel
24LC014T-I/MS: Industrial Temperature,
2.5V, MSOP Package, Tape and Reel.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
© 2005 Microchip Technology Inc.
DS21809C-page 21
24AA014/24LC014
NOTES:
DS21809C-page 22
© 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
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written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK,
MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail,
PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance and WiperLock are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2005 Microchip Technology Inc.
DS21808C-page 23
WORLDWIDE SALES AND SERVICE
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03/01/05
DS21809C-page 24
© 2005 Microchip Technology Inc.