ETC 24LC02B/P

M
24AA01/24LC01B
1K I2C™ Serial EEPROM
Device Selection Table
Description
Part
Number
Vcc
Range
Max Clock
Frequency
Temp
Ranges
24AA01
1.8-5.5
400 kHz(1)
I
24LC01B
2.5-5.5
400 kHz
I, E
Note 1: 100 kHz for VCC <2.5V
Features
Package Types
PDIP/SOIC/TSSOP/MSOP
1
A1
2
A2
3
VSS
4
Note:
8
VCC
7
WP
6
SCL
5
SOT23-5
SCL
1
VSS
2
SDA SDA
3
24XX01
A0
24XX01
• Single supply with operation down to 1.8V
• Low power CMOS technology
- 1 mA active current typical
- 1 µA standby current typical (I-temp)
• Organized as 1block of 128 bytes (1 x 128 x 8)
• 2-wire serial interface bus, I2C™ compatible
• Schmitt trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (24AA01) and 400 kHz (24LC01B) compatibility
• Self-timed write cycle (including auto-erase)
• Page-write buffer for up to 8 bytes
• 2 ms typical write cycle time for page-write
• Hardware write protect for entire memory
• Can be operated as a serial ROM
• Factory programming (QTP) available
• ESD protection > 4,000V
• 1,000,000 erase/write cycles
• Data retention > 200 years
• 8-lead PDIP, SOIC, TSSOP, and MSOP package
• 5-lead SOT-23 package
• Available for extended temperature ranges:
- Industrial (I):
-40°C to +85°C
- Automotive (E):
-40°C to +125°C
The Microchip Technology Inc. 24AA01/24LC01B
(24XX01*) is a 1 Kbit Electrically Erasable PROM. The
device is organized as one block of 128 x 8-bit memory
with a 2-wire serial interface. Low voltage design permits operation down to 1.8V with standby and active
currents of only 1 µA and 1 mA respectively. The
24XX01 also has a page-write capability for up to 8
bytes of data. The 24XX01 is available in the standard
8-pin PDIP, surface mount SOIC, TSSOP and MSOP
packages and is also available in the 5-lead SOT-23
package.
5
WP
4
VCC
Pins A0, A1 and A2 are not used by the
24XX01. (No internal connections).
Block Diagram
WP
I/O
CONTROL
LOGIC
MEMORY
CONTROL
LOGIC
HV GENERATOR
XDEC
EEPROM
ARRAY
PAGE LATCHES
I/O
SCL
YDEC
SDA
VCC
VSS
SENSE AMP
R/W CONTROL
*24XX01 is used in this document as a generic part number for the 24AA01/24LC01B devices.
 2002 Microchip Technology Inc.
DS21711A-page 1
24AA01/24LC01B
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temp. with power applied ..........................................................................................................-40°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV
† NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
1.1
DC Characteristics
DC CHARACTERISTICS
VCC = +1.8V to +5.5V
Industrial (I):
TAMB = -40°C to +85°C
Automotive (E): TAMB = -40°C to +125°C
Param.
No.
Sym
Characteristic
Min
Typ
Max
Units
D1
VIH
WP, SCL and SDA pins
—
—
—
—
—
D2
—
High level input voltage
0.7 VCC
—
—
V
—
Low level input voltage
D3
VIL
D4
VHYS
D5
VOL
Conditions
—
—
0.3 VCC
V
—
0.05 VCC
—
—
V
(Note)
Low level output voltage
—
—
0.40
V
IOL = 3.0 mA, VCC = 2.5V
Hysteresis of Schmitt
trigger inputs
D6
ILI
Input leakage current
—
—
±10
µA
VIN =.1V to VCC
D7
ILO
Output leakage current
—
—
±10
µA
VOUT =.1V to VCC
D8
CIN,
COUT
Pin capacitance
(all inputs/outputs)
—
—
10
pF
VCC = 5.0V (Note)
TAMB = 25°C, FCLK = 1 MHz
D9
ICC write Operating current
—
0.1
3
mA
VCC = 5.5V, SCL = 400 kHz
D10
ICC read
—
0.05
1
mA
—
D11
ICCS
—
—
0.01
—
1
5
µΑ
µΑ
Industrial
Automotive
SDA = SCL = VCC
WP = VSS
Note:
Standby current
This parameter is periodically sampled and not 100% tested.
DS21711A-page 2
 2002 Microchip Technology Inc.
24AA01/24LC01B
1.2
AC Characteristics
AC CHARACTERISTICS
Param.
No.
Sym
1
FCLK
2
Characteristic
VCC = +1.8V to +5.5V
Industrial (I):
TAMB = -40°C to +85°C
Automotive (E):
TAMB = -40°C to +125°C
Min
Typ
Max
Units
Conditions
Clock frequency
—
—
—
—
400
100
kHz
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA01)
THIGH
Clock high time
600
4000
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC <2.5V (24AA01)
3
TLOW
Clock low time
1300
4700
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA01)
4
TR
SDA and SCL rise time
(Note 1)
—
—
—
—
300
1000
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA01)
5
TF
SDA and SCL fall time
—
—
—
300
ns
(Note 1)
6
THD:STA START condition hold
time
600
4000
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA01)
7
TSU:STA
600
4700
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA01)
8
THD:DAT Data input hold time
0
—
—
—
ns
(Note 2)
9
TSU:DAT
Data input setup time
100
250
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA01)
10
TSU:STO STOP condition setup
time
600
4000
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA01)
START condition setup
time
11
TAA
Output valid from clock
(Note 2)
—
—
—
—
900
3500
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA01)
12
TBUF
Bus free time: Time the
bus must be free before
a new transmission can
start
1300
4700
—
—
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA01)
13
TOF
Output fall time from VIH
minimum to VIL maximum
20+0.1C B
—
—
—
250
250
ns
2.5V ≤ VCC ≤ 5.5V
1.8V ≤ VCC < 2.5V (24AA01)
14
TSP
Input filter spike
suppression
(SDA and SCL pins)
—
—
50
ns
(Notes 1 and 3)
15
TWC
Write cycle time (byte or
page)
—
—
5
ms
—
16
—
Endurance
1M
—
—
cycles 25°C, VCC = 5.0V, Block
Mode (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
3: The combined TSP and V HYS specifications are due to new Schmitt trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance Model which can be obtained on Microchip’s website:
www.microchip.com.
 2002 Microchip Technology Inc.
DS21711A-page 3
24AA01/24LC01B
FIGURE 1-1:
BUS TIMING DATA
5
4
2
3
SCL
7
SDA
IN
8
9
10
6
14
12
11
SDA
OUT
FIGURE 1-2:
BUS TIMING START/STOP
D4
SCL
6
7
10
SDA
START
DS21711A-page 4
STOP
 2002 Microchip Technology Inc.
24AA01/24LC01B
2.0
FUNCTIONAL DESCRIPTION
The 24XX01 supports a bi-directional 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as transmitter, and a device
receiving data as receiver. The bus has to be controlled
by a master device which generates the serial clock
(SCL), controls the bus access and generates the
START and STOP conditions, while the 24XX01 works
as slave. Both master and slave can operate as transmitter or receiver, but the master device determines
which mode is activated.
3.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is HIGH. Changes
in the data line while the clock line is HIGH will be
interpreted as a START or STOP condition.
Accordingly, the following bus conditions have been
defined (Figure 3-1).
3.1
Start Data Transfer (B)
A HIGH to LOW transition of the SDA line while the
clock (SCL) is HIGH determines a START condition. All
commands must be preceded by a START condition.
3.3
Stop Data Transfer (C)
A LOW to HIGH transition of the SDA line while the
clock (SCL) is HIGH determines a STOP condition. All
operations must be ended with a STOP condition.
FIGURE 3-1:
(A)
Data Valid (D)
The state of the data line represents valid data when,
after a START condition, the data line is stable for the
duration of the HIGH period of the clock signal.
The data on the line must be changed during the LOW
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a START condition
and terminated with a STOP condition. The number of
the data bytes transferred between the START and
STOP conditions is determined by the master device
and is theoretically unlimited, although only the last sixteen will be stored when doing a write operation. When
an overwrite does occur it will replace data in a first-in
first-out (FIFO) fashion.
3.5
Acknowledge
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this acknowledge bit.
Note:
Bus not Busy (A)
Both data and clock lines remain HIGH.
3.2
3.4
The 24XX01 does not generate any
acknowledge bits if an internal programming cycle is in progress.
The device that acknowledges, has to pull down the
SDA line during the acknowledge clock pulse in such a
way that the SDA line is stable LOW during the HIGH
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX01) will leave the data line
HIGH to enable the master to generate the STOP condition.
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(B)
(D)
(D)
(C)
(A)
SCL
SDA
START
CONDITION
 2002 Microchip Technology Inc.
ADDRESS OR
DATA
ACKNOWLEDGE ALLOWED
VALID
TO CHANGE
STOP
CONDITION
DS21711A-page 5
24AA01/24LC01B
3.6
Device Addressing
FIGURE 3-2:
A control byte is the first byte received following the
start condition from the master device. The control byte
consists of a four bit control code, for the 24XX01 this
is set as 1010 binary for read and write operations.
The next three bits of the control byte are the block
select bits (B2, B1, B0). The block select bits are ‘don’t
care’s’ for the 24XX01.
The last bit of the control byte defines the operation to
be performed. When set to ‘1’ a read operation is
selected, when set to ‘0’ a write operation is selected.
Following the START condition, the 24XX01 monitors
the SDA bus checking the device type identifier being
transmitted, upon a 1010 code the slave device outputs an acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24XX01 will select a
read or write operation.
Operation
Control
Code
Block Select
R/W
Read
1010
Block Address
1
Write
1010
Block Address
0
DS21711A-page 6
CONTROL BYTE
ALLOCATION
START
READ/WRITE
SLAVE ADDRESS
1
0
1
0
X
R/W
X
A
X
X = ‘Don’t care’.
 2002 Microchip Technology Inc.
24AA01/24LC01B
4.0
WRITE OPERATION
4.2
4.1
Byte Write
The write control byte, word address and the first data
byte are transmitted to the 24XX01 in the same way as
in a byte write. But instead of generating a STOP condition the master transmits up to 8 data bytes to the
24XX01, which are temporarily stored in the on-chip
page buffer and will be written into the memory after the
master has transmitted a STOP condition. After the
receipt of each word, the four lower order address
pointer bits are internally incremented by ‘1’. The
higher order 7 bits of the word address remains constant. If the master should transmit more than 8 words
prior to generating the STOP condition, the address
counter will roll over and the previously received data
will be overwritten. As with the byte write operation,
once the STOP condition is received an internal write
cycle will begin (Figure 4-2).
Following the START condition from the master, the
device code (4 bits), the block address (3 bits, don’t
cares) and the R/W bit which is a logic LOW is placed
onto the bus by the master transmitter. This indicates to
the addressed slave receiver that a byte with a word
address will follow after it has generated an acknowledge bit during the ninth clock cycle. Therefore, the
next byte transmitted by the master is the word address
and will be written into the address pointer of the
24XX01. After receiving another acknowledge signal
from the 24XX01, the master device will transmit the
data word to be written into the addressed memory
location. The 24XX01 acknowledges again and the
master generates a STOP condition. This initiates the
internal write cycle, and during this time the 24XX01
will not generate acknowledge signals (Figure 4-1).
FIGURE 4-1:
Note:
Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes actually
being written. Physical page boundaries
start at addresses that are integer multiples of the page buffer size (or ‘page size’)
and end at addresses that are integer multiples of [page size - 1]. If a page write command attempts to write across a physical
page boundary, the result is that the data
wraps around to the beginning of the current page (overwriting data previously
stored there), instead of being written to
the next page as might be expected. It is
therefore necessary for the application
software to prevent page write operations
that would attempt to cross a page boundary.
BYTE WRITE
BUS ACTIVITY
MASTER
S
T
A
R
T
SDA LINE
S
CONTROL
BYTE
WORD
ADDRESS
S
T
O
P
DATA
P
A
C
K
BUS ACTIVITY
FIGURE 4-2:
Page Write
A
C
K
A
C
K
PAGE WRITE
BUS ACTIVITY
MASTER
S
T
A
R
T
SDA LINE
S
CONTROL
BYTE
BUS ACTIVITY
 2002 Microchip Technology Inc.
WORD
ADDRESS (n)
DATA (n)
S
T
O
P
DATA (n + 7)
DATA (n + 1)
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
DS21711A-page 7
24AA01/24LC01B
5.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the STOP condition for a write command has been issued from the master, the device initiates the internally timed write cycle. ACK polling can
be initiated immediately. This involves the master sending a start condition followed by the control byte for a
write command (R/W = 0). If the device is still busy with
the write cycle, then no ACK will be returned. If the
cycle is complete, then the device will return the ACK
and the master can then proceed with the next read or
write command. See Figure 5-1 for flow diagram.
FIGURE 5-1:
6.0
WRITE PROTECTION
The 24XX01 can be used as a serial ROM when the
WP pin is connected to VCC. Programming will be
inhibited and the entire memory will be write-protected.
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
DS21711A-page 8
 2002 Microchip Technology Inc.
24AA01/24LC01B
7.0
READ OPERATION
7.3
Read operations are initiated in the same way as write
operations with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
7.1
Current Address Read
The 24XX01 contains an address counter that maintains the address of the last word accessed, internally
incremented by ‘1’. Therefore, if the previous access
(either a read or write operation) was to address n, the
next current address read operation would access data
from address n + 1. Upon receipt of the slave address
with R/W bit set to ‘1’, the 24XX01 issues an acknowledge and transmits the 8-bit data word. The master will
not acknowledge the transfer but does generate a
STOP condition and the 24XX01 discontinues transmission (Figure 7-1).
7.2
Random Read
Sequential Read
Sequential reads are initiated in the same way as a random read except that after the 24XX01 transmits the
first data byte, the master issues an acknowledge as
opposed to a STOP condition in a random read. This
directs the 24XX01 to transmit the next sequentially
addressed 8-bit word (Figure 7-3).
To provide sequential reads the 24XX01 contains an
internal address pointer which is incremented by one at
the completion of each operation. This address pointer
allows the entire memory contents to be serially read
during one operation.
7.4
Noise Protection
The 24XX01 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.5V at nominal conditions.
The SCL and SDA inputs have Schmitt trigger and filter
circuits which suppress noise spikes to assure proper
device operation even on a noisy bus.
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, first the word address must
be set. This is done by sending the word address to the
24XX01 as part of a write operation. After the word
address is sent, the master generates a START condition following the acknowledge. This terminates the
write operation, but not before the internal address
pointer is set. Then the master issues the control byte
again but with the R/W bit set to a ‘1’. The 24XX01 will
then issue an acknowledge and transmits the 8-bit data
word. The master will not acknowledge the transfer but
does generate a STOP condition and the 24XX01 discontinues transmission (Figure 7-2).
FIGURE 7-1:
CURRENT ADDRESS READ
BUS ACTIVITY
MASTER
S
T
A
R
T
SDA LINE
S
BUS ACTIVITY
 2002 Microchip Technology Inc.
CONTROL
BYTE
S
T
O
P
DATA (n)
P
A
C
K
N
O
A
C
K
DS21711A-page 9
24AA01/24LC01B
FIGURE 7-2:
RANDOM READ
S
BUS ACTIVITY T
A
MASTER
R
T
SDA LINE
CONTROL
BYTE
S
CONTROL
BYTE
S
T
O
P
DATA (n)
P
S
A
C
K
BUS ACTIVITY
FIGURE 7-3:
S
T
A
R
T
WORD
ADDRESS (n)
A
C
K
A
C
K
N
O
A
C
K
SEQUENTIAL READ
BUS ACTIVITY
MASTER
CONTROL
BYTE
DATA (n)
DATA (n + 1)
DATA (n + 2)
S
T
O
P
DATA (n + X)
SDA LINE
BUS ACTIVITY
DS21711A-page 10
P
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
 2002 Microchip Technology Inc.
24AA01/24LC01B
8.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 8-1.
TABLE 8-1:
PIN FUNCTION TABLE
Name
PDIP
SOIC
TSSOP
MSOP SOT23
Description
A0
1
1
1
1
—
Not Connected
A1
2
2
2
2
—
Not Connected
A2
3
3
3
3
—
Not Connected
VSS
4
4
4
4
2
Ground
SDA
5
5
5
5
3
Serial Address/Data I/O
SCL
6
6
6
6
1
Serial Clock
WP
7
7
7
7
5
Write Protect Input
VCC
8
8
8
8
4
+1.8V to 5.5V Power Supply
8.1
A0, A1, A2
8.3
Serial Clock (SCL)
These pins are not used by the 24XX01. They may be
left floating or tied to either VSS or VCC.
This input is used to synchronize the data transfer from
and to the device.
8.2
8.4
Serial Address/Data Input/Output
(SDA)
This is a bi-directional pin used to transfer addresses
and data into and data out of the device. It is an open
drain terminal. Therefore, the SDA bus requires a pullup resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for
400 kHz).
For normal data transfer SDA is allowed to change only
during SCL LOW. Changes during SCL HIGH are
reserved for indicating the START and STOP conditions.
 2002 Microchip Technology Inc.
Write-Protect (WP)
This pin must be connected to either VSS or VCC.
If tied to VSS normal memory operation is enabled
(read/write the entire memory 00-7F).
If tied to VCC, WRITE operations are inhibited. The
entire memory will be write-protected. Read operations
are not affected.
This feature allows the user to use the 24XX01 as a
serial ROM when WP is enabled (tied to VCC).
DS21711A-page 11
24AA01/24LC01B
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
YYWW
24LC01B
I/PNNN
YYWW
8-Lead SOIC (150 mil)
Example:
24LC01B
I/SNYYWW
NNN
XXXXXXXX
XXXXYYWW
NNN
Example:
8-Lead TSSOP
XXXX
4L1B
YYWW
IYWW
NNN
NNN
Example:
8-Lead MSOP
XXXXX
YWWNNN
4L1BI
YWWNNN
Example:
5-Lead SOT-23
24AA01 = B1(I-Temp)
XXNN
Legend:
Note:
*
XX...X
YY
WW
NNN
24LC01B = M1(I-Temp)
24LC01B = N1(E-Temp)
M1NN
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21711A-page 12
 2002 Microchip Technology Inc.
24AA01/24LC01B
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB
α
β
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
 2002 Microchip Technology Inc.
DS21711A-page 13
24AA01/24LC01B
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45×
c
A2
A
f
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
f
c
B
α
β
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21711A-page 14
 2002 Microchip Technology Inc.
24AA01/24LC01B
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
A1
f
β
A2
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
f
c
B
α
β
MIN
INCHES
NOM
MAX
8
.026
.033
.002
.246
.169
.114
.020
0
.004
.007
0
0
.035
.004
.251
.173
.118
.024
4
.006
.010
5
5
.043
.037
.006
.256
.177
.122
.028
8
.008
.012
10
10
MILLIMETERS*
NOM
MAX
8
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
2.90
3.00
3.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
 2002 Microchip Technology Inc.
DS21711A-page 15
24AA01/24LC01B
8-Lead Plastic Micro Small Outline Package (MSOP)
E
E1
D
2
B
n
1
α
c
φ
(F)
L
β
Units
Number of Pins
Pitch
Dimension Limits
n
p
Overall Height
NOM
MAX
8
0.65
.026
A
.044
.030
Standoff
A1
.002
E
.184
Molded Package Width
MIN
8
A2
Overall Width
MAX
NOM
Molded Package Thickness
§
MILLIMETERS*
INCHES
MIN
1.18
.038
0.76
.006
0.05
.193
.200
.034
0.86
0.97
4.67
4.90
.5.08
0.15
E1
.114
.118
.122
2.90
3.00
3.10
Overall Length
D
.114
.118
.122
2.90
3.00
3.10
Foot Length
L
.016
.022
.028
0.40
0.55
0.70
Footprint (Reference)
.035
.037
.039
0.90
0.95
1.00
Foot Angle
F
φ
6
0
Lead Thickness
c
.004
.006
.008
0.10
0.15
0.20
Lead Width
B
α
.010
.012
.016
0.25
0.30
0.40
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
6
7
7
7
7
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Drawing No. C04-111
DS21711A-page 16
 2002 Microchip Technology Inc.
24AA01/24LC01B
5-Lead Plastic Small Outline Transistor (OT) (SOT23)
E
E1
p
B
p1
n
D
1
α
c
A
φ
L
β
Units
Dimension Limits
n
p
Number of Pins
Pitch
Outside lead pitch (basic)
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
MIN
p1
A
A2
A1
E
E1
D
L
φ
c
B
α
β
.035
.035
.000
.102
.059
.110
.014
0
.004
.014
0
0
A2
A1
INCHES*
NOM
5
.038
.075
.046
.043
.003
.110
.064
.116
.018
5
.006
.017
5
5
MAX
.057
.051
.006
.118
.069
.122
.022
10
.008
.020
10
10
MILLIMETERS
NOM
5
0.95
1.90
0.90
1.18
0.90
1.10
0.00
0.08
2.60
2.80
1.50
1.63
2.80
2.95
0.35
0.45
0
5
0.09
0.15
0.35
0.43
0
5
0
5
MIN
MAX
1.45
1.30
0.15
3.00
1.75
3.10
0.55
10
0.20
0.50
10
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091
 2002 Microchip Technology Inc.
DS21711A-page 17
24AA01/24LC01B
NOTES:
DS21711A-page 18
 2002 Microchip Technology Inc.
24AA01/24LC01B
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip
World Wide Web (WWW) site.
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape or Microsoft
Explorer. Files are also available for FTP download
from our FTP site.
Connecting to the Microchip Internet Web Site
Systems Information and Upgrade Hot Line
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive any currently available upgrade kits.The
Hot Line Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
013001
The Microchip web site is available by using your
favorite Internet browser to attach to:
www.microchip.com
The file transfer site is available by using an FTP service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
 2002 Microchip Technology Inc.
DS21711A-page 19
24AA01/24LC01B
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this Data Sheet.
To:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Device: 24AA01/24LC01B
Y
N
Literature Number: DS21711A
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this data sheet easy to follow? If not, why?
4. What additions to the data sheet do you think would enhance the structure and subject?
5. What deletions from the data sheet could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
8. How would you improve our software, systems, and silicon products?
DS21711A-page 20
 2002 Microchip Technology Inc.
24AA01/24LC01B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
X
PART NO.
Device
/XX
Temperature Package
Range
Examples:
a)
b)
Device:
= 1.8V, 1 Kbit I2C Serial EEPROM
= 1.8V, 1 Kbit I2C Serial EEPROM
(Tape and Reel)
24LC01B: = 2.5V, 1 Kbit I2C Serial EEPROM
24LC01BT: = 2.5V, 1 Kbit I2C Serial EEPROM
(Tape and Reel)
24AA01:
24AA01T:
Temperature I
Range:
E
= -40°C to +85°C
= -40°C to +125°C
Package:
=
=
=
=
=
P
SN
ST
MS
OT
c)
a)
b)
c)
24AA01-I/P: Industrial Temperature,
PDIP package
24AA01-I/SN: Industrial Temperature,
SOIC package
24AA01T-I/OT: Industrial Temperature,
SOT-23 package
24LC01B-I/P: Industrial Temperature,
PDIP package
24LC01B-E/SN: Extended Temperature,
SOIC package
24LC01BT-I/OT: Industrial Temperature,
SOT-23 package
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
Plastic Micro Small Outline (MSOP), 8-lead
SOT-23, 5-lead (Tape and Reel only)
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
DS21711A-page21
24AA01/24LC01B
NOTES:
DS21711A-page 22
 2002 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, MPLAB, PIC, PICmicro, PICMASTER, PICSTART,
PRO MATE, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microID,
microPort, Migratable Memory, MPASM, MPLIB, MPLINK,
MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Term Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999. The
Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro ® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs and microperipheral
products. In addition, Microchip’s quality
system for the design and manufacture of
development systems is ISO 9001 certified.
 2002 Microchip Technology Inc.
DS21711A - page 23
M
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Rocky Mountain
China - Beijing
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Atlanta
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-6766200 Fax: 86-28-6766599
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
San Jose
Hong Kong
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
New York
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-334-8870 Fax: 65-334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
01/18/02
*DS21711A*
DS21711A-page 24
 2002 Microchip Technology Inc.