SAMSUNG M392T5660FBA

Apr. 2010
DDR2 SDRAM Memory
Product Guide
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SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
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All brand names, trademarks and registered trademarks belong to their respective owners.
ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved.
-1-
Apr. 2010
Product Guide
DDR2 SDRAM Memory
1. DDR2 SDRAM MEMORY ORDERING INFORMATION
1
2
3
4
5
6
7
8
9
10
11
K 4 T X X X X X X X - X X X X
SAMSUNG Memory
Speed
DRAM
Temp & Power
DRAM Type
Package Type
Revision
Density
Bit Organization
Interface (VDD, VDDQ)
# of Internal Banks
1. SAMSUNG Memory : K
8. Revision
M
A
B
C
D
E
F
G
H
I
Q
R
2. DRAM : 4
3. DRAM Type
T : DDR2 SDRAM
4. Density
56 : 256Mb
51 : 512Mb
1G :
1Gb
2G :
2Gb
4G :
4Gb
9. Package Type
Z
J
H
M
T
B
5. Bit Organization
04
06
07
08
16
26
27
: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
: 6th Gen.
: 7th Gen.
: 8th Gen.
: 9th Gen.
: 10th Gen.
: 17th Gen.
: 18th Gen.
:x4
: x 4 Stack
: x 8 Stack
:x8
: x16
: x 4 Stack (JEDEC Standard)
: x 8 Stack (JEDEC Standard)
:
:
:
:
:
:
FBGA (Lead-free)
FBGA DDP (Lead-free)
FBGA (Lead-free & Halogen-free)
FBGA DDP (Lead-free & Halogen-free)
FBGA DSP (Lead-free & Halogen-free, Thin)
FBGA (Lead-free & Halogen-free, Flip Chip)
10. Temp & Power
C : Commercial Temp.( 0°C ~ 95°C) & Normal Power
L : Commercial Temp.( 0°C ~ 95°C) & Low Power
Y : Commercial Temp.( 0°C ~ 95°C) & Low Voltage
6. # of Internal Banks
3 : 4 Banks
4 : 8 Banks
7. Interface ( VDD, VDDQ)
Q : SSTL_18 (1.8V, 1.8V)
11. Speed
CC : DDR2-400
D5 : DDR2-533
E6 : DDR2-667
F7 : DDR2-800
E7 : DDR2-800
-2-
(200MHz @ CL=3, tRCD=3, tRP=3)
(266MHz @ CL=4, tRCD=4, tRP=4)
(333MHz @ CL=5, tRCD=5, tRP=5)
(400MHz @ CL=6, tRCD=6, tRP=6)
(400MHz @ CL=5, tRCD=5, tRP=5)
Apr. 2010
Product Guide
DDR2 SDRAM Memory
2. DDR2 SDRAM Component Product Guide
2.1 SDRAM
Density
512Mb I-die
1Gb Q-die
1Gb E-die
1Gb F-die
2Gb A-die
Banks
4Banks
8Banks
8Banks
8Banks
8Banks
Part Number
Package & Power, Temp. (-C/-L) & Speed
Org.
K4T51043QI
HCE7/F7/E6
128M x 4
K4T51083QI
HCE7/F7/E6
64M x 8
K4T51163QI
HCF8/E7/F7/E6
32M x 16
K4T1G044QQ
HC(L)E7/F7/E6
256M x 4
K4T1G084QQ
HC(L)E7/F7/E6
128M x 8
K4T1G164QQ
HC(L)E7/F7/E6
64M x 16
K4T1G044QE
HC(L)E7/F7/E6
256M x 4
K4T1G084QE
HC(L)E7/F7/E6
128M x 8
K4T1G164QE
HC(L)E7/F7/E6
K4T1G044QF
BCE7/F7/E6
256M x 4
K4T1G084QF
BCE7/F7/E6
128M x 8
K4T1G164QF
BCE7/F7/E6
K4T2G044QA
HC(L)F7/E6
512M x 4
K4T2G084QA
HC(L)F7/E6
256M x 8
64M x 16
64M x 16
-3-
PKG
60 ball
FBGA
Avail.
Now
84 ball
FBGA
60 ball
FBGA
Now
84 ball
FBGA
60 ball
FBGA
Now
84 ball
FBGA
Now
60 ball
FBGA
Jun. ’10
84 ball
FBGA
May. ’10
68 ball
FBGA
Now
Apr. 2010
Product Guide
DDR2 SDRAM Memory
3. DDR2 SDRAM Module Ordering Information
1
2
3
4
5
6
7
8
9
10
11
12
13
M X X X T X X X X X X X - X X X X
Memory Module
AMB Vendor
DIMM Type
Data bits
DRAM Component Type
Speed
Temp & Power
PCB Revision
Depth
# of Banks in Comp. & Interface
Package
Bit Organization
Component Revision
1. Memory Module : M
8. Component Revision
M
B
D
F
I
R
2. DIMM Type
3 : DIMM
4 : SODIMM
3. Data Bits
78 :
91 :
92 :
93 :
95 :
70 :
x64
x72
x72
x72
x72
x64
240pin Unbuffered DIMM
240pin ECC unbuffered DIMM
240pin VLP Registered DIMM
240pin Registered DIMM
240pin Fully Buffered DIMM
200pin Unbuffered SODIMM
Z
J
Q
H
M
E
B
T : DDR2 SDRAM
32 : 32M
64 : 64M
28 : 128M
56 : 256M
51 : 512M
1G : 1G
33
65
29
57
52
1K
: 32M (for 128Mb/512Mb)
: 64M (for 128Mb/512Mb)
: 128M (for 128Mb/512Mb)
: 256M (for 512Mb/2Gb)
: 512M (for 512Mb/2Gb)
: 1G (for 2Gb)
6. # of Banks in comp. & Interface
5 :
6 :
4Banks & SSTL-1.8V
8Banks & SSTL-1.8V
7. Bit Organization
0
3
4
6
7
8
9
:
:
:
:
:
:
:
x4
x8
x16
x 4 Stack (JEDEC Standard)
x 8 Stack (JEDEC Standard)
x 4 Stack
x 8 Stack
1st Gen.
3rd Gen.
5th Gen.
7th Gen.
10th Gen.
18th Gen.
A
C
E
G
Q
:
:
:
:
:
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
17th Gen.
9. Package
4. DRAM Component Type
5. Depth
:
:
:
:
:
:
:
:
:
:
:
:
:
FBGA(Lead-free)
FBGA DDP (Lead-free)
FBGA QDP (Lead-free)
FBGA (Lead-free & Halogen-free)
FBGA DDP (Lead-free & Halogen-free)
FBGA QDP (Lead-free & Halogen-free)
FBGA (Lead-free & Halogen-free, Flip Chip)
10. PCB Revision
0 : Mother PCB
2 : 2nd Rev.
4 : 4th Rev.
1
3
A
S
:
:
:
:
1st Rev.
3rd Rev.
Parity DIMM
Reduced PCB
11. Temp & Power
C : Commercial Temp.( 0°C ~ 95°C) & Normal Power
L : Commercial Temp.( 0°C ~ 95°C) & Low Power
Y : Commercial Temp.( 0°C ~ 95°C) & Low Voltage
12. Speed
CC : DDR2-400
D5 : DDR2-533
E6 : DDR2-667
F7 : DDR2-800
E7 : DDR2-800
(200MHz @ CL=3, tRCD=3, tRP=3)
(266MHz @ CL=4, tRCD=4, tRP=4)
(333MHz @ CL=5, tRCD=5, tRP=5)
(400MHz @ CL=6, tRCD=6, tRP=6)
(400MHz @ CL=5, tRCD=5, tRP=5)
13. AMB Vendor For FBDIMM
: Intel
5
6, 8 : IDT
3, 4 : Montage
NOTE : PC2-6400(DDR2-800), PC2-5300(DDR2-667)
PC2-4200(DDR2-533), PC2-3200(DDR2-400)
-4-
Apr. 2010
Product Guide
DDR2 SDRAM Memory
4. DDR2 SDRAM Module Product Guide
240Pin DDR2 Unbuffered DIMM
Org.
Density
64Mx 64
512MB
128Mx 64
1GB
128Mx 72
256Mx 64
2GB
256Mx 72
512Mx 64
512Mx 72
4GB
Part Number
Speed
Composition
Comp.
Version
M378T6464QZ(H)3
CE7/F7/E6
64M x 16 *
4pcs
1Gb
Q-die
M378T6464EHS
CE7/F7/E6
64M x 16 *
4pcs
1Gb
E-die
1Gb
Q-die
128M x 8 *
8pcs
1Gb
E-die
M378T2863QZ(H)S
CE7/F7/E6
M378T2863EHS
CE7/F7/E6
M378T2863FBS
CE7/F7/E6
1Gb
F-die
M391T2863QZ(H)3
CE7/F7/E6
1Gb
Q-die
M391T2863EH3
CE7/F7/E6
1Gb
E-die
128M x 8 *
9pcs
M391T2863FB3
CE7/F7/E6
1Gb
F-die
M378T5663QZ(H)3
CE7/F7/E6
1Gb
Q-die
M378T5663EH3
CE7/F7/E6
1Gb
E-die
128M x 8 * 16pcs
M378T5663FB3
CE7/F7/E6
1Gb
F-die
M391T5663QZ(H)3
CE7/F7/E6
1Gb
Q-die
M391T5663EH3
CE7/F7/E6
1Gb
E-die
M391T5663FB3
CE7/F7/E6
1Gb
F-die
128M x 8 * 18pcs
M378T5263AZ(H)3
CF7/E6
256M x 8 * 16pcs
2Gb
A-die
M391T5263AZ(H)3
CF7/E6
256M x 8 * 18pcs
2Gb
A-die
-5-
Internal
Banks
8
8
Rank
PKG
Height
Avail.
1
84 ball
FBGA
30mm
Now
1
Now
1
60 ball
FBGA
8
30mm
Jun. ’10
Now
1
Jun. ’10
Now
8
2
60 ball
FBGA
30mm
Jun. ’10
Now
Jun. ’10
8
2
68 ball
FBGA
30mm
Now
Apr. 2010
Product Guide
DDR2 SDRAM Memory
200Pin DDR2 SODIMM
Org.
Density
64Mx 64
512MB
128Mx 64
256Mx 64
512Mx 64
1GB
2GB
4GB
Part Number
Speed
M470T6464QZ(H)3
C(L)E7/F7/E6
M470T6464EHS
C(L)E7/F7/E6
M470T6554IH3
CE6
M470T2864QZ(H)3
C(L)E7/F7/E6
M470T2864EH3
C(L)E7/F7/E6
M470T2863EH3
C(L)E7/F7/E6
M470T2863FB3
CE7/F7/E6
M470T5663QZ(H)3
C(L)E7/F7/E6
M470T5663EH3
C(L)E7/F7/E6
M470T5663FB3
CE7/F7/E6
M470T5267AZ(H)3
C(L)F7/E6
Composition
64M x 16 *
4pcs
32M x 16 *
8pcs
64M x 16 *
8pcs
128M x 8
128M x 8
st.512M x 8
*
8pcs
* 16pcs
*
-6-
8pcs
Comp.
Version
1Gb
Q-die
1Gb
E-die
512Mb
I-die
1Gb
Q-die
1Gb
E-die
1Gb
F-die
1Gb
Q-die
1Gb
E-die
1Gb
F-die
2Gb
A-die
Internal
Banks
Rank
PKG
Height
Avail.
8
1
84 ball
FBGA
30mm
Now
4
2
2
84 ball
FBGA
1
60 ball
FBGA
8
8
30mm
2
60 ball
FBGA
Now
May. ’10
30mm
Now
May. ’10
8
2
83 ball
FBGA
30mm
Now
Apr. 2010
Product Guide
DDR2 SDRAM Memory
240Pin DDR2 Registered DIMM
Org.
Density
Part Number
M393T2863QZ(H)3
CD5/CC
128Mx 72
1GB
M393T2863QZ(H)A
CE7/F7/E6
256Mx 72
512Mx 72
1Gx 72
2GB
4GB
Speed
M393T2863FB3
CE7/F7/E6
M393T5663QZ3
CD5/CC
M393T5663QZ(H)A
CE7/F7/E6
M393T5660QZ3
CD5/CC
M393T5660QZ(H)A
CE7/F7/E6
M393T5660FB3
CE7/F7/E6
M393T5160QZ3
CD5/CC
M393T5160QZ(H)A
CE7/F7/E6
M393T5160FB3
CE7/F7/E6
Comp.
Version
Composition
128M x 8 * 9pcs
Internal
Banks
Rank
PKG
Height
60 ball
FBGA
30mm
1Gb
Q-die
8
1
1Gb
F-die
8
1
1Gb
Q-die
1Gb
F-die
1Gb
Q-die
1Gb
F-die
128M x 8 * 18pcs
CF7/E6
512M x 4 * 18pcs
2Gb
A-die
M393T1G60QJ(M)A
CE6/D5
DDP 512M x 4 * 36pcs
1Gb
Q-die
8GB
60 ball
FBGA
8
st.1G x 4 * 18pcs
-7-
30mm
Now
Jun. ’10
2
8
2Gb
A-die
60 ball
FBGA
1
68 ball
FBGA
4
63 ball
FBGA
2
83 ball
FBGA
8
CF7/E6
Jun. ’10
1
M393T5260AZ(H)A
M393T1K66AZ(H)A
Now
2
256M x 4 * 18pcs
256M x 4 * 36pcs
Avail.
Now
30mm
Jun. ’10
Now
30mm
Now
Apr. 2010
Product Guide
DDR2 SDRAM Memory
240Pin DDR2 VLP Registered DIMM
Org.
Density
Part Number
Speed
64Mx 72
512MB
M392T6553GZA
CF7/E6
128Mx 72
1GB
256Mx 72
2GB
M392T2863QZ(H)A
CF7/E6
M392T2863FBA
CE7/F7/E6
M392T5660QZ(H)A
CF7/E6
M392T5660FBA
CE7/F7/E6
M392T5663QZ(H)A
CF7/E6
M392T5663FBA
CE7/F7/E6
Comp.
Version
Composition
64M x 8 * 9pcs
512Mb
G-die
128M x 8 * 9pcs
256M x 4 * 18pcs
128M x 8 * 18pcs
1Gb
Q-die
1Gb
F-die
1Gb
Q-die
1Gb
F-die
1Gb
Q-die
1Gb
F-die
Internal
Banks
Rank
PKG
Height
Avail.
4
1
60 ball
FBGA
18.3mm
Now
8
1
60 ball
FBGA
18.3mm
Now
1
60 ball
FBGA
8
Now
Jun. ’10
18.3mm
2
Jun. ’10
Now
Jun. ’10
512Mx 72
4GB
M392T5160QJ(M)A
CF7/E6
DDP 512M x 4 * 18pcs
1Gb
Q-die
8
2
63 ball
FBGA
18.3mm
Now
1Gx 72
8GB
M392T1G60QQ(E)A
CE6/D5
QDP 1G x 4 * 18pcs
1Gb
Q-die
8
4
65 ball
FBGA
18.3mm
Now
-8-
Apr. 2010
Product Guide
DDR2 SDRAM Memory
240Pin DDR2 Fully Buffered DIMM(1.8V)
Org.
Density
Part Number
64Mx 72
512MB
M395T6553GZ4
M395T2863QZ(H)4
128Mx 72
1GB
M395T2863FB4
Speed
CE7/F7/E6
6 : IDT C1
CE6
5 : Intel D1
CE7/F7/E6
6 : IDT C1
CE7/F7/E6
8: IDT L4
CE6
5 : Intel D1
CE7/F7/E6
CE7/F7/E6
M395T5663QZ(H)4
256Mx 72
2GB
CE7/F7/E6
CE6
M395T5663FB4
CE7/F7/E6
CE7/F7/E6
M395T5160QZ(H)4
CE6
CE6
512Mx 72
4GB
M395T5160FB4
CE7/F7/E6
M395T5163QZ(H)4
CE7/F7/E6
M395T5163FB4
M395T5263AZ(H)4
M395T1G60QJ(M)4
1Gx 72
8GB
M395T1K66AZ(H)4
AMB
CE7/F7/E6
Composition
64M x 8 *
9pcs
128M x 8 *
9pcs
6 : IDT C1
8: IDT L4
Comp.
Internal
Version
Banks
512Mb
G-die
1Gb
Q-die
1Gb
F-die
1Gb
Q-die
Rank
4
1
8
1
PKG
60 ball
FBGA
60 ball
FBGA
Height
Avail.
30.35mm
Now
Now
30.35mm
Jun. ’10
6 : IDT C1
8: IDT L4
5 : Intel D1
3: Montage D3
128M x 8 * 18pcs
6 : IDT C1
8: IDT L4
8
1Gb
F-die
1Gb
Q-die
2
60 ball
FBGA
Now
30.35mm
Jun. ’10
6 : IDT C1
8: IDT L4
5 : Intel D1
3: Montage D3
8: IDT L4
8: IDT L4
128M x 8 * 36pcs
6 : IDT C1
CF7/E6
8: IDT L4
CE6/F7
8: IDT L4
CF7/E6/D5
6 : IDT C1
CF7/E6
8: IDT L4
1Gb
F-die
1Gb
Q-die
FBGA
8
256M x 8 * 18pcs
2Gb
A-die
2
DDP 512M x 4 * 36pcs
1Gb
Q-die
4
8
-9-
2Gb
A-die
Jun. ’10
Now
F-die
st.1G x 4 * 18pcs
30.35mm
4
1Gb
8: IDT L4
CF7/E6
2
60 ball
6 : IDT C1
6 : IDT C1
Now
256M x 4 * 36pcs
2
Jun. ’10
68 ball
Now
FBGA
63 ball
FBGA
83 ball
FBGA
30.35mm
Now
Apr. 2010
Product Guide
DDR2 SDRAM Memory
240Pin DDR2 Fully Buffered DIMM(1.55V)
Comp.
Internal
Banks
Density
Part Number
Speed
AMB
128Mx 72
1GB
M395T2863QZ(H)4
YE6
8: IDT L4
64M x 8 * 18pcs
1Gb
Q-die
8
1
256Mx 72
2GB
M395T5663QZ(H)4
YE6
8: IDT L4
128M x 8 * 18pcs
1Gb
Q-die
8
2
1Gb
Q-die
512Mx 72
1Gx 72
4GB
8GB
Composition
Version
Org.
M395T5160QZ(H)4
YE6
8: IDT L4
256M x 4 * 36pcs
M395T5163QZ(H)4
YE6
8: IDT L4
128M x 8 * 36pcs
YE6
8: IDT L4
256M x 8 * 18pcs
2Gb
A-die
M395T1K66AZ(H)4
YE6
8: IDT L4
st.1G x 4 * 18pcs
2Gb
A-die
- 10 -
2
8
M395T5263AZ(H)4
Rank
4
2
8
2
PKG
60 ball
FBGA
60 ball
FBGA
Height
Avail.
30.35mm
Now
30.35mm
Now
30.35mm
Now
30.35mm
Now
60 ball
FBGA
68 ball
FBGA
83 ball
FBGA
Apr. 2010
Product Guide
DDR2 SDRAM Memory
5. Package Dimension
0.10MAX
60Ball FBGA for 1Gb Q-die (x4/x8)
# A1 INDEX MARK
9.00 ± 0.10
A
0.80 x 8 = 6. 40
0.80
9
8
1.60
7
6
5
4
B
3
2
9.00 ± 0.10
#A1
1
A
B
C
H
0.50±0.05
0.80
G
11.00 ± 0.10
F
11.00 ± 0.10
E
0.80 x 10 = 8.00
D
1.60
J
K
L
0.35±0.05
(0.95)
(1.90)
1.10±0.10
Bottom
Top
0.10MAX
84Ball FBGA for 1Gb Q-die (x16)
# A1 INDEX MARK
9.00 ± 0.10
A
0.80 x 8 = 6. 40
0.80
9
8
7
9.00 ± 0.10
1.60
6
5
4
B
3
2
#A1
1
A
B
C
D
0.50±0.05
0.80
J
K
13.00 ± 0.10
H
13.00 ± 0.10
F
G
0.80 x 14 = 11.20
E
L
M
1.60
N
P
R
(0.95)
0.35±0.05
(1.90)
Bottom
Top
- 11 -
1.10±0.10
Apr. 2010
Product Guide
DDR2 SDRAM Memory
7.50 ± 0.10
A
0.80 x 8 = 6. 40
# A1 INDEX MARK
3.20
(Datum A)
0.80
9
8
7
0.10MAX
60Ball FBGA for 1Gb E-die (x4/x8)
1.60
6
5
4
B
3
2
7.50 ± 0.10
#A1
1
A
B
E
0.80
H
J
4.00
F
G
9.50 ± 0.10
D
9.50 ± 0.10
C
0.80 x 10 = 8.00
0.80
(Datum B)
K
L
(0.95)
0.35±0.05
MOLDING AREA
1.10±0.10
(1.90)
60-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
Bottom
0.2 M A B
Top
7.50 ± 0.10
A
0.80 x 8 = 6. 40
# A1 INDEX MARK
3.20
0.80
9
(Datum A)
8
7
0.10MAX
84Ball FBGA for 1Gb E-die (x16)
1.60
6
5
4
B
3
2
7.50 ± 0.10
#A1
1
A
B
C
D
G
H
0.80
J
K
4.00
L
12.50 ± 0.10
F
12.50 ± 0.10
E
0.80 x 14 = 11.20
0.80
(Datum B)
M
N
P
R
(0.95)
84-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
0.35±0.05
MOLDING AREA
(1.90)
1.10±0.10
0.2 M A B
Bottom
Top
- 12 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
7.50 ± 0.10
A
0.80 x 8 = 6. 40
# A1 INDEX MARK
3.20
(Datum A)
0.80
9
8
7
0.10MAX
60Ball FBGA for 1Gb F-die (x4/x8)
1.60
6
5
4
B
3
2
7.50 ± 0.10
#A1
1
A
E
F
H
4.00
0.80
G
J
9.50 ± 0.10
D
9.50 ± 0.10
C
0.80 x 10 = 8.00
0.80
B
(Datum B)
K
L
0.37±0.05
(0.30)
MOLDING AREA
1.10±0.10
60-∅0.48 Solder ball
(Post reflow 0.50 ± 0.05)
(0.60)
Bottom
0.2 M A B
Top
7.50 ± 0.10
A
0.80 x 8 = 6. 40
# A1 INDEX MARK
3.20
0.80
9
(Datum A)
8
7
0.10MAX
84Ball FBGA for 1Gb F-die (x16)
1.60
6
5
4
B
3
2
7.50 ± 0.10
#A1
1
A
B
C
D
H
0.80
J
K
5.60
L
12.50 ± 0.10
F
G
12.50 ± 0.10
E
0.80 x 14 = 11.20
0.80
(Datum B)
M
N
P
R
0.37±0.05
(0.30)
MOLDING AREA
84-∅0.48 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
1.10±0.10
(0.60)
Bottom
Top
- 13 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
68Ball FBGA for 2Gb A-die (x4/x8)
11.00 ± 0.10
#A1
0.80 x 8 = 6.40
3.20
11.00 ± 0.10
# A1 INDEX MARK
1.60
0.80
9
8
7
6
5
4
3
2
1
0.10MAX
(Datum A)
A
B
C
(Datum B)
D
7.20
E
F
L
0.80
M
N
18.00 ± 0.10
J
K
18.00 ± 0.10
8.00
H
0.80 x 18 = 14.40
G
P
R
T
U
V
W
(0.95)
68-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
(1.90)
0.35 ± 0.05
1.10 ± 0.10
MOLDING AREA
Bottom
Top
- 14 -